CN101980589A - Method for manufacturing power module circuit board, power module and magnetic core of power module - Google Patents
Method for manufacturing power module circuit board, power module and magnetic core of power module Download PDFInfo
- Publication number
- CN101980589A CN101980589A CN2010105214691A CN201010521469A CN101980589A CN 101980589 A CN101980589 A CN 101980589A CN 2010105214691 A CN2010105214691 A CN 2010105214691A CN 201010521469 A CN201010521469 A CN 201010521469A CN 101980589 A CN101980589 A CN 101980589A
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- China
- Prior art keywords
- circuit board
- magnetic core
- power module
- described circuit
- top layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000000034 method Methods 0.000 title claims abstract description 31
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 238000004804 winding Methods 0.000 claims description 14
- 238000004026 adhesive bonding Methods 0.000 claims description 13
- 239000003292 glue Substances 0.000 abstract description 10
- 239000000853 adhesive Substances 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 abstract description 3
- 230000017525 heat dissipation Effects 0.000 abstract 1
- 239000011162 core material Substances 0.000 description 111
- 230000005855 radiation Effects 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 238000005553 drilling Methods 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F3/00—Cores, Yokes, or armatures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/08—Magnetic details
- H05K2201/083—Magnetic materials
- H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/061—Lamination of previously made multilayered subassemblies
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
- Coils Or Transformers For Communication (AREA)
- Dc-Dc Converters (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The embodiment of the invention discloses a method for manufacturing a power module circuit board, a power module and a magnetic core of the power module, which aim to save layout space of the circuit board and contribute to high-density miniaturization design of the power module and heat dissipation of the magnetic core. The method of the embodiment of the invention comprises the following steps of: embedding a part of the magnetic core of the power module into the circuit board to form a whole body with the circuit board and forming an adhesive surface on the surface of the circuit board; exposing the other part of the magnetic core of the power module outside the circuit board; and electrically connecting the two parts of the magnetic core of the power module with glue. The embodiment of the invention can be used in the power module; and the circuit board and the magnetic core of the power module are unnecessary components for the power module.
Description
Technical field
The present invention relates to power technique fields, particularly a kind of manufacture method of power module circuitry plate, power module and magnetic core thereof.
Background technology
Magnetic core is the requisite material of power module, be mainly used in the transformer and inductance of power module, and the layout area of transformer and the used magnetic core of inductance accounts for 30% of power module area.Be connected two class technology below the current existence what realize magnetic core and power module:
The first kind is conventional magnetic core adhesive technology, this technology comprises two kinds: a kind of is that common magnetic core is bonding, the winding of power module is made in circuit board inside, zone at the layout magnetic core, circuit board is done the fluting design, magnetic core is divided into magnetic core and following magnetic core two parts, and two parts all are to show in the circuit board outside, is connected with power module by bonding realization; Another kind is the individual devices welding of band magnetic core, and magnetic core is connected with power module by the mode of welding as the part of individual devices.
Second class is that planar magnetic core integral body is imbedded technology, and whole planar magnetic core is all imbedded circuit board inside, and the winding of power module is made of circuit board, but the circuit board at magnetic core place top layer other components and parts of layout all up and down, as resistance, electric capacity etc.This technology can be divided into horizontal magnetic and the vertical magnetic that buries of burying again according to the disposing way difference of imbedding the circuit board inner core.
The inventor finds in realizing process of the present invention, and conventional magnetic core adhesive technology takies the arrangement space of circuit board, is unfavorable for the highly dense miniaturization Design of power module; And planar magnetic core integral body is imbedded technology, because whole magnetic core is imbedded circuit board inside, can not directly dispel the heat by radiator, is unfavorable for the magnetic core heat radiation.
Summary of the invention
The embodiment of the invention provides a kind of manufacture method, power module and magnetic core thereof of circuit board, can save the arrangement space of printed circuit board, helps the highly dense miniaturization Design of power module, helps the magnetic core heat radiation simultaneously.
The embodiment of the invention adopts following technical scheme:
A kind of manufacture method of power module circuitry plate comprises:
The part of power module magnetic core is imbedded described circuit board inside, form an integral body with described circuit board, and form bonding plane at described circuit board surface;
Another part of power module magnetic core is exposed in described circuit board outside;
Two parts of described power module magnetic core are realized being electrically connected by the glue bonding way.
A kind of power module comprises magnetic core, and the part of described magnetic core is imbedded described circuit board inside, forms an integral body with described circuit board, and forms bonding plane at described circuit board surface; Another part of described magnetic core exposes in described circuit board outside; Two parts of described magnetic core realize being electrically connected by the glue bonding way.
A kind of magnetic core of power module comprises: following magnetic core and last magnetic core; Described magnetic core is down imbedded described circuit board inside, forms an integral body with described circuit board, and forms bonding plane at described circuit board surface; The described magnetic core of going up exposes in described circuit board outside; Described magnetic core down and the described magnetic core of going up are realized being electrically connected by the glue bonding way.
By the technique scheme of the embodiment of the invention as can be known, by the part of magnetic core is imbedded circuit board inside, another part exposes in the circuit board outside, and two parts of magnetic core realize being electrically connected by the glue bonding way; Thereby do not influence other components and parts of layout on the circuit board top layer at place, magnetic core zone on the one hand, can save the arrangement space of circuit board, the highly dense miniaturization Design that helps power module can solve the difficult problem of magnetic core heat radiation by radiator again on the other hand, helps the magnetic core heat radiation.
Description of drawings
In order to be illustrated more clearly in the technical scheme of the embodiment of the invention, the accompanying drawing of required use is done an introduction simply in will describing embodiment below.
The sectional view of the magnetic core of the power module that Fig. 1 provides for the embodiment of the invention;
The vertical view of the magnetic core of the power module that Fig. 2 provides for the embodiment of the invention;
The flow process chart of the first circuit board daughter board of the band winding that Fig. 3 provides for the embodiment of the invention;
The flow process chart of the second circuit board daughter board of the band winding that Fig. 4 provides for the embodiment of the invention;
The flow process chart of the circuit board panel that Fig. 5 provides for the embodiment of the invention;
The flow chart that Fig. 6 assembles for the circuit board that the embodiment of the invention provides;
The schematic flow sheet of the manufacture method of the power module circuitry plate that Fig. 7 provides for the embodiment of the invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the invention, the technical scheme in the embodiment of the invention is clearly and completely described.
Referring to Fig. 1 and Fig. 2, the vertical view of the magnetic core of the power module that the sectional view of the magnetic core of the power module that Fig. 1 provides for the embodiment of the invention, Fig. 2 provide for the embodiment of the invention.
The magnetic core of the power module that the embodiment of the invention provides comprises: following magnetic core and last magnetic core; Described magnetic core down at the power module circuitry plate (for example: PCB, Printed Circuit Board) imbeds described circuit board inside in the manufacturing process, form an integral body with described circuit board, and after described circuit board machines, form bonding plane at described circuit board surface; The described magnetic core of going up exposes in described circuit board outside; Described magnetic core down and the described magnetic core of going up are realized being electrically connected by the glue bonding way in described circuit board group process of assembling.
Hence one can see that, and the magnetic core of the power module that the embodiment of the invention provides is imbedded circuit board inside by descending magnetic core, and last magnetic core exposes in the circuit board outside, realizes magnetic core two-part being electrically connected up and down by the glue bonding way; Thereby do not influence other components and parts of layout on the circuit board top layer at place, magnetic core zone on the one hand, as shown in Figure 1, device 1 and device 2 just are mounted on top layer under the circuit board at place, magnetic core zone, can save the arrangement space of circuit board, for the highly dense miniaturization of power module provides good solution, the highly dense miniaturization Design that helps power module can solve the difficult problem of magnetic core heat radiation by radiator again on the other hand, helps the magnetic core heat radiation.
Preferably, the bonding plane that the described following magnetic core of imbedding circuit board inside forms at described circuit board surface is lower than described circuit board top layer or flushes with described circuit board top layer, can avoid like this damaging magnetic core in circuit board making process or circuit board group process of assembling.
In addition, when the power module circuitry plate is assembled, the bonding plane of following magnetic core is similar to the pad of circuit board, last magnetic core is similar to the surface mounting component of circuit board, by adopting seal glue or some glue on described pad, perhaps applies the mode of one deck glue on described pad like this, two parts up and down of magnetic core can be realized being electrically connected, thereby can realize the automatic Surface Mount of magnetic core, need manual bonding comparing, can reduce assembly cost with the installation of present magnetic core.
Referring to the making flow chart of the power module circuitry plate of Fig. 3 to Fig. 6, wherein, Fig. 3 is the flow process chart of the first circuit board daughter board of band winding; Fig. 4 is the flow process chart of the second circuit board daughter board of band winding; Fig. 5 is the flow process chart of circuit board panel; Fig. 6 is the flow chart of circuit board assembling.
As shown in Figure 3, the work flow of the first circuit board daughter board of band winding comprises:
S11 opens material (first daughter board comprises TOP face, winding etc.) → first daughter board internal layer circuit making → brown → pressing → drilling blind hole → blind hole metallization.
S12, fluting 1: needs are imbedded down the corresponding daughter board fluting in magnetic core zone, and magnetic core is put into slot area under being convenient to.
S13, the first daughter board outer-layer circuit is made: the circuit of only doing the daughter board one side.
S14, filling holes with resin: fill blind hole 1 with resin material, and guarantee that resin face and copper face keep smooth.
As shown in Figure 4, the work flow of the second circuit board daughter board of band winding comprises:
S21, open material: second daughter board comprises the PP sheet, core material and BOTTOM (end) face central layer etc.
S22, fluting 2: needs are imbedded down the corresponding core material in magnetic core zone, BOTTOM face central layer, PP sheet fluting, and the fluting size makes that magnetic core can be placed slot area smoothly down.
S23, the second daughter board internal layer circuit is made: make layer pattern in the circuit board except that first daughter board.
As shown in Figure 5, the work flow of circuit board panel comprises:
S31, lamination: first daughter board after the above-mentioned processing and second daughter board are stacked in order, and will descend magnetic core to put into corresponding slot area.
S32, pressing: will descend magnetic core, first daughter board and second daughter board to be pressed into an integral body.
S33 drills through hole → via metalization → making outer graphics.
S34, welding resistance plug through hole → control deep drilling blind hole 2 → circuit board top layer processing → circuit board panel machines.
As shown in Figure 6, circuit board assembling flow process comprises:
S41, Yin Xi, some glue: print solder paste on board pads, at bonding plane coating one deck glue of following magnetic core.
S42 pastes part, backflow: will go up magnetic core and other device is mounted on the circuit board, and through refluxing, finish assembling.
In sum, referring to Fig. 7, the manufacture method of the power module circuitry plate that the embodiment of the invention provides comprises:
S1 imbeds circuit board inside with the part of power module magnetic core, forms an integral body with described circuit board, and forms bonding plane at described circuit board surface;
S2 exposes another part of power module magnetic core in described circuit board outside;
S3 realizes two parts of described power module magnetic core to be electrically connected by the glue bonding way.
Need to prove:
A, because magnetic core is easily broken, therefore imbed bonding plane that the part of the power module magnetic core of circuit board inside forms at described circuit board surface and must be lower than the circuit board top layer or flush with the circuit board top layer at least.
B, when the power module circuitry plate is assembled, a part of imbedding the power module magnetic core of circuit board inside is similar to the pad of circuit board at the bonding plane of described circuit board surface formation, expose the surface mounting component that is similar to circuit board at another part of the power module magnetic core of described circuit board outside, realize being electrically connected by the bonding mode of glue between two parts of power module magnetic core.
The circuit board winding of c, power module is positioned at the zone of the power module magnetic core of imbedding circuit board inside, is realized by the circuit board coil, connects by blind hole or through hole between the winding.
D, do not influence other components and parts of layout, thereby can effectively utilize the arrangement space of circuit board on the circuit board top layer at place, power module magnetic core zone.
Hence one can see that, the manufacture method of the power module circuitry plate that the embodiment of the invention provides, and by the part of magnetic core is imbedded circuit board inside, another part exposes in the circuit board outside, and two parts of magnetic core realize being electrically connected by the glue bonding way; Thereby do not influence other components and parts of layout on the circuit board top layer at place, magnetic core zone on the one hand, can save the arrangement space of circuit board, the highly dense miniaturization Design that helps power module can solve the difficult problem of magnetic core heat radiation by radiator again on the other hand, helps the magnetic core heat radiation.
In addition, because a part of imbedding the power module magnetic core of circuit board inside is similar to the pad of circuit board at the bonding plane of circuit board surface formation, expose the surface mounting component that is similar to circuit board at another part of the power module magnetic core of circuit board outside, therefore can realize automatic Surface Mount, need manual bonding comparing with the installation of present magnetic core, can reduce assembly cost.
Still referring to Fig. 1 and Fig. 2, the power module that the embodiment of the invention provides, comprise magnetic core, the part of described magnetic core is imbedded described circuit board inside in the power module circuitry plate course of processing, form an integral body with described circuit board, and after described circuit board machines, form bonding plane at described circuit board surface; Another part of described magnetic core exposes in described circuit board outside; Two parts of described magnetic core realize being electrically connected by the glue bonding way in described circuit board group process of assembling.
Hence one can see that, the power module that the embodiment of the invention provides, and by the part of magnetic core is imbedded circuit board inside, another part exposes in the circuit board outside, and two parts of magnetic core realize being electrically connected by the glue bonding way; Thereby do not influence other components and parts of layout on the circuit board top layer at place, magnetic core zone on the one hand, can save the arrangement space of circuit board, for the highly dense miniaturization of power module provides good solution, can solve the problem of magnetic core heat radiation difficulty on the other hand again by radiator.
Preferably, the bonding plane that a described part of imbedding the magnetic core of circuit board inside forms at circuit board surface is lower than described circuit board top layer or flushes with described circuit board top layer, can avoid like this damaging magnetic core in circuit board making process or circuit board group process of assembling.
Be understandable that in addition, when the power module circuitry plate is assembled, a part of imbedding the magnetic core of circuit board inside is similar to the pad of circuit board at the bonding plane of circuit board surface formation, expose the surface mounting component that then is similar to circuit board at another part of the magnetic core of circuit board outside, like this by adopting seal glue or some glue on described pad, perhaps on described pad, apply the mode of one deck glue, two parts up and down of magnetic core can be realized being electrically connected.Therefore can realize the automatic Surface Mount of magnetic core, need manual bonding comparing, can reduce assembly cost with the installation of present magnetic core.
Above-mentioned specific embodiment is not in order to restriction the present invention; for those skilled in the art; all under the prerequisite that does not break away from the principle of the invention, any modification of being done, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. the manufacture method of a power module circuitry plate is characterized in that, comprising:
The part of power module magnetic core is imbedded circuit board inside, form an integral body with described circuit board, and form bonding plane at described circuit board surface;
Another part of power module magnetic core is exposed in described circuit board outside;
Two parts of described power module magnetic core are realized being electrically connected by the glue bonding way.
2. method according to claim 1 is characterized in that, the part of power module magnetic core is imbedded described circuit board inside, forms an integral body with described circuit board and comprises:
The first circuit board daughter board of difference processing belt winding and the second circuit board daughter board of band winding;
According to the shape of the part of the described power module magnetic core that is embedded into, slot respectively in the position of described first circuit board daughter board and described second circuit board daughter board correspondence;
Described first circuit board daughter board and described second circuit board daughter board behind the fluting are stacked in order, and the part of described power module magnetic core is put into corresponding slot area;
A part and described two circuit board daughter boards that are stacked together of described power module magnetic core are pressed into an integral body.
3. method according to claim 1 is characterized in that, the bonding plane that a described part of imbedding the power module magnetic core of circuit board inside forms at described circuit board surface is lower than described circuit board top layer or flushes with described circuit board top layer.
4. according to the arbitrary described method of claim 1-3, it is characterized in that described method also comprises:
At the circuit board top layer of power module magnetic core region layout components and parts.
5. a power module is characterized in that, comprises magnetic core, and the part of described magnetic core is imbedded described power module circuitry intralamellar part, forms an integral body with described circuit board, and forms bonding plane at described circuit board surface; Another part of described magnetic core exposes in described circuit board outside; Two parts of described magnetic core realize being electrically connected by the glue bonding way.
6. power module according to claim 5 is characterized in that, the bonding plane that a described part of imbedding the magnetic core of circuit board inside forms at described circuit board surface is lower than described circuit board top layer or flushes with described circuit board top layer.
7. according to claim 5 or 6 described power modules, it is characterized in that the winding of described power module is positioned at the zone of the part of the described magnetic core of imbedding circuit board inside.
8. power module according to claim 7 is characterized in that, layout has components and parts on the circuit board top layer of described magnetic core region.
9. the magnetic core of a power module is characterized in that, comprising: following magnetic core and last magnetic core; Described magnetic core is down imbedded described circuit board inside, forms an integral body with described circuit board, and forms bonding plane at described circuit board surface; The described magnetic core of going up exposes in described circuit board outside; Described magnetic core down and the described magnetic core of going up are realized being electrically connected by the glue bonding way.
10. the magnetic core of power module according to claim 9 is characterized in that, the bonding plane that described magnetic core down forms at described circuit board surface is lower than described circuit board top layer or flushes with described circuit board top layer.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010521469A CN101980589B (en) | 2010-10-27 | 2010-10-27 | Method for manufacturing power module circuit board, power module and magnetic core of power module |
| HU1200280A HU230993B1 (en) | 2010-10-27 | 2011-05-30 | Manufacturing method for power supply module circuit board, power supply module and megnetic core thereof |
| MX2011013414A MX2011013414A (en) | 2010-10-27 | 2011-05-30 | Manufacturing method for power supply module circuit board, power supply module and magnetic core thereof. |
| PCT/CN2011/074905 WO2011137845A1 (en) | 2010-10-27 | 2011-05-30 | Manufacturing method for power supply module circuit board, power supply module and magnetic core thereof |
| BRPI1106079A BRPI1106079B8 (en) | 2010-10-27 | 2011-05-30 | method of making a power module, power module, and magnetic core circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010521469A CN101980589B (en) | 2010-10-27 | 2010-10-27 | Method for manufacturing power module circuit board, power module and magnetic core of power module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101980589A true CN101980589A (en) | 2011-02-23 |
| CN101980589B CN101980589B (en) | 2012-10-17 |
Family
ID=43601065
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010521469A Active CN101980589B (en) | 2010-10-27 | 2010-10-27 | Method for manufacturing power module circuit board, power module and magnetic core of power module |
Country Status (5)
| Country | Link |
|---|---|
| CN (1) | CN101980589B (en) |
| BR (1) | BRPI1106079B8 (en) |
| HU (1) | HU230993B1 (en) |
| MX (1) | MX2011013414A (en) |
| WO (1) | WO2011137845A1 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011137845A1 (en) * | 2010-10-27 | 2011-11-10 | 华为技术有限公司 | Manufacturing method for power supply module circuit board, power supply module and magnetic core thereof |
| CN102325429A (en) * | 2011-08-15 | 2012-01-18 | 深圳市核达中远通电源技术有限公司 | Method for bonding upper and lower magnetic cores of module power supply |
| CN102686025A (en) * | 2012-05-07 | 2012-09-19 | 华为技术有限公司 | Printed circuit board (PCB) of power supply module, power supply module and manufacturing method thereof |
| CN104183358A (en) * | 2014-08-09 | 2014-12-03 | 乐清市华信电子有限公司 | Filtering module |
| CN108471670A (en) * | 2018-05-09 | 2018-08-31 | 无锡天芯互联科技有限公司 | A kind of flush type power module structure and preparation method thereof |
| CN113194630A (en) * | 2021-04-21 | 2021-07-30 | 深圳市汇川技术股份有限公司 | Planar magnetic member and method for manufacturing same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10308480B2 (en) | 2016-07-08 | 2019-06-04 | Otis Elevator Company | Embedded power module |
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2010
- 2010-10-27 CN CN201010521469A patent/CN101980589B/en active Active
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2011
- 2011-05-30 BR BRPI1106079A patent/BRPI1106079B8/en active IP Right Grant
- 2011-05-30 HU HU1200280A patent/HU230993B1/en unknown
- 2011-05-30 WO PCT/CN2011/074905 patent/WO2011137845A1/en active Application Filing
- 2011-05-30 MX MX2011013414A patent/MX2011013414A/en active IP Right Grant
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011137845A1 (en) * | 2010-10-27 | 2011-11-10 | 华为技术有限公司 | Manufacturing method for power supply module circuit board, power supply module and magnetic core thereof |
| CN102325429A (en) * | 2011-08-15 | 2012-01-18 | 深圳市核达中远通电源技术有限公司 | Method for bonding upper and lower magnetic cores of module power supply |
| CN102325429B (en) * | 2011-08-15 | 2016-09-14 | 深圳市核达中远通电源技术有限公司 | A kind of upper and lower magnetic core method of the modular power source that bonds |
| CN102686025A (en) * | 2012-05-07 | 2012-09-19 | 华为技术有限公司 | Printed circuit board (PCB) of power supply module, power supply module and manufacturing method thereof |
| CN102686025B (en) * | 2012-05-07 | 2016-03-30 | 华为技术有限公司 | The printed circuit board (PCB) of power module, power module and manufacture method thereof |
| CN104183358A (en) * | 2014-08-09 | 2014-12-03 | 乐清市华信电子有限公司 | Filtering module |
| CN108471670A (en) * | 2018-05-09 | 2018-08-31 | 无锡天芯互联科技有限公司 | A kind of flush type power module structure and preparation method thereof |
| CN113194630A (en) * | 2021-04-21 | 2021-07-30 | 深圳市汇川技术股份有限公司 | Planar magnetic member and method for manufacturing same |
| CN113194630B (en) * | 2021-04-21 | 2023-10-27 | 深圳市汇川技术股份有限公司 | Planar magnetic part and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| BRPI1106079B1 (en) | 2020-10-20 |
| HU230993B1 (en) | 2019-08-28 |
| CN101980589B (en) | 2012-10-17 |
| BRPI1106079A2 (en) | 2016-05-10 |
| HUP1200280A2 (en) | 2013-01-28 |
| WO2011137845A1 (en) | 2011-11-10 |
| BRPI1106079B8 (en) | 2021-02-02 |
| MX2011013414A (en) | 2012-02-21 |
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