CN113194630A - Planar magnetic member and method for manufacturing same - Google Patents
Planar magnetic member and method for manufacturing same Download PDFInfo
- Publication number
- CN113194630A CN113194630A CN202110433271.6A CN202110433271A CN113194630A CN 113194630 A CN113194630 A CN 113194630A CN 202110433271 A CN202110433271 A CN 202110433271A CN 113194630 A CN113194630 A CN 113194630A
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- circuit board
- printed circuit
- limiting
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- 238000000034 method Methods 0.000 title claims abstract description 46
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 37
- 239000003292 glue Substances 0.000 claims abstract description 29
- 238000005476 soldering Methods 0.000 claims abstract description 20
- 239000011265 semifinished product Substances 0.000 claims abstract description 9
- 239000000047 product Substances 0.000 claims abstract description 8
- 238000004804 winding Methods 0.000 claims description 31
- 238000003825 pressing Methods 0.000 claims description 13
- 239000010410 layer Substances 0.000 claims description 11
- 239000012790 adhesive layer Substances 0.000 claims description 10
- 239000000084 colloidal system Substances 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 230000008569 process Effects 0.000 abstract description 23
- 229920006335 epoxy glue Polymers 0.000 description 18
- 230000009471 action Effects 0.000 description 8
- 238000004026 adhesive bonding Methods 0.000 description 8
- 238000007711 solidification Methods 0.000 description 6
- 230000008023 solidification Effects 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 5
- 229920006332 epoxy adhesive Polymers 0.000 description 5
- 230000005389 magnetism Effects 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 230000006978 adaptation Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
The invention discloses a planar magnetic piece and a manufacturing method thereof, wherein the manufacturing method of the planar magnetic piece comprises the following steps: dispensing glue on the first surface of the printed circuit board, wherein the printed circuit board is provided with a limiting through hole; embedding the first magnetic core into the limiting through hole from the first surface of the printed circuit board so as to enable the first magnetic core to be tightly attached to the printed circuit board; performing reflow soldering on the attached first magnetic core and the printed circuit board; dispensing at least on the first contact surface of the first magnetic core, and embedding the second magnetic core into the limiting through hole from the second surface of the printed circuit board so that the first contact surface of the first magnetic core and the second contact surface of the second magnetic core are tightly attached in the limiting through hole to obtain a semi-finished product of the planar magnetic piece, wherein the second surface is arranged opposite to the first surface; and carrying out secondary reflow soldering on the semi-finished product of the planar magnetic piece to obtain a finished product of the planar magnetic piece. The manufacturing method of the planar magnetic piece can solve the technical problems of low production efficiency and poor universality of the existing planar magnetic piece mounting process.
Description
Technical Field
The invention belongs to the technical field of electronic component production, and particularly relates to a planar magnetic piece and a manufacturing method thereof.
Background
The two magnetic cores of the planar magnetic part are respectively attached to different surfaces of a printed circuit board, which is an important process in the circuit board attaching process flow, the surface of the planar magnetic part is pressed with a groove matched with a metal buckle of a standard size in a buckle form, and the two magnetic cores are fixed through the matching of the buckle and the groove. This kind of mounting means is manual installation, and not only production efficiency is low, and because the buckle of different models need be matchd to the magnetism spare of different models moreover, therefore the commonality is poor, is unfavorable for automated production's popularization.
Disclosure of Invention
In order to overcome the above disadvantages of the prior art, the present invention provides a method for manufacturing a planar magnetic member, which aims to solve the technical problems of low production efficiency and poor versatility of the conventional planar magnetic member mounting process.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
a method for manufacturing a planar magnetic member, the planar magnetic member comprising a printed circuit board, a first magnetic core and a second magnetic core; the method comprises the following steps:
dispensing glue on the first surface of the printed circuit board, wherein the printed circuit board is provided with a limiting through hole;
embedding the first magnetic core into the limiting through hole from the first surface of the printed circuit board so as to enable the first magnetic core to be tightly attached to the printed circuit board;
performing reflow soldering on the attached first magnetic core and the printed circuit board once so as to solidify the colloid between the first magnetic core and the first surface of the printed circuit board;
dispensing at least on the first contact surface of the first magnetic core, and embedding the second magnetic core into the limiting through hole from the second surface of the printed circuit board, so that the first contact surface of the first magnetic core and the second contact surface of the second magnetic core are tightly attached in the limiting through hole, and a semi-finished product of the planar magnetic part is obtained; wherein the second surface is disposed opposite the first surface;
and carrying out secondary reflow soldering on the semi-finished product of the planar magnetic piece so as to solidify the colloid between the first contact surface of the first magnetic core and the second contact surface of the second magnetic core, thereby obtaining a finished product of the planar magnetic piece.
Further, the first magnetic core is provided with a first positioning column matched with the limiting through hole; the embedding the first magnetic core into the limiting through hole from the first surface of the printed circuit board comprises:
and embedding the first positioning column into the limiting through hole from the first surface of the printed circuit board, and pressing or grinding the first magnetic core.
Further, the second magnetic core is provided with a second positioning column matched with the limiting through hole, the first positioning column is provided with the first contact surface, and the second positioning column is provided with the second contact surface; the embedding the second magnetic core into the limiting through hole from the second surface of the printed circuit board comprises:
and embedding the second positioning column into the limiting through hole from the second surface of the printed circuit board, and pressing or grinding the second magnetic core so as to enable the first contact surface of the first positioning column and the second contact surface of the second positioning column to be tightly attached in the limiting through hole.
Further, the first positioning column comprises a first positioning part, a second positioning part and a third positioning part, and the second positioning part is positioned between the first positioning part and the third positioning part; the second positioning column comprises a fourth positioning part, a fifth positioning part and a sixth positioning part, the fifth positioning part is positioned between the fourth positioning part and the sixth positioning part, the first positioning part and the fourth positioning part are jointed in the limiting through hole, the third positioning part and the sixth positioning part are jointed in the limiting through hole, and the second positioning part and the fifth positioning part are oppositely arranged in the limiting through hole; before the step of dispensing on the first surface of the printed circuit board, the method further comprises:
and grinding the end face of the second positioning part and/or the fifth positioning part by a preset thickness.
Furthermore, the planar magnetic part also comprises a winding plate, and a through hole is formed in the winding plate; the dispensing at least on the first contact surface of the first magnetic core and embedding the second magnetic core into the limiting through hole from the second surface of the printed circuit board comprises:
dispensing glue on the first contact surface of the first magnetic core and the second surface of the printed circuit board;
attaching the winding board to the second surface of the printed circuit board so that the through hole corresponds to the limiting through hole;
and embedding the second magnetic core into the through hole and the limiting through hole from the surface of the winding board opposite to the printed circuit board.
Further, the first magnetic core is provided with a first positioning column matched with the limiting through hole, the second magnetic core is provided with a second positioning column matched with the limiting through hole, the first positioning column is located in the limiting through hole, the first positioning column is provided with the first contact surface, and the second positioning column is provided with the second contact surface; the step of inserting the second magnetic core into the through hole and the limiting through hole from the surface of the winding board facing away from the printed circuit board includes:
and embedding the second positioning column into the through hole and the limiting through hole from the surface of the winding board back to the printed circuit board, and pressing or grinding the second magnetic core so as to enable the first contact surface of the first positioning column and the second contact surface of the second positioning column to be tightly attached in the limiting through hole.
Correspondingly, the invention also provides a planar magnetic piece which is manufactured by the manufacturing method of the planar magnetic piece.
Correspondingly, the invention further provides a planar magnetic part, which comprises a printed circuit board, a first magnetic core, a second magnetic core, a first spot gluing layer and a second spot gluing layer, wherein a limiting through hole is formed in the printed circuit board, the first magnetic core is provided with a first contact surface, the second magnetic core is provided with a second contact surface, the first magnetic core is embedded on the first surface of the printed circuit board, the first contact surface of the first magnetic core is positioned in the limiting through hole, and the first magnetic core is attached to the first surface of the printed circuit board through the first spot gluing layer; the second magnetic core is embedded on the second surface of the printed circuit board, the second contact surface of the second magnetic core is positioned in the limiting through hole, and the first contact surface of the first magnetic core is attached to the second contact surface of the second magnetic core through the second adhesive dispensing layer; wherein the second surface is disposed opposite the first surface.
Further, the first magnetic core is provided with a first positioning column matched with the limiting through hole, and the first positioning column is provided with the first contact surface; the second magnetic core is provided with a second positioning column matched with the limiting through hole, and the second positioning column is provided with the second contact surface.
Furthermore, the planar magnetic part further comprises a winding plate and a third point adhesive layer, a through hole is formed in the winding plate, the winding plate is attached to the second surface of the printed circuit board through the third point adhesive layer, the through hole is arranged corresponding to the limiting through hole, and the second positioning column penetrates through the through hole and is arranged in the limiting through hole.
Compared with the prior art, the invention has the beneficial effects that:
the manufacturing method of the planar magnetic piece comprises the steps of firstly dispensing glue on the first surface of a printed circuit board provided with a limiting through hole, and then embedding a first magnetic core into the limiting through hole from the first surface of the printed circuit board, so that the first magnetic core is tightly attached to the printed circuit board; performing reflow soldering on the attached first magnetic core and the printed circuit board once to solidify the colloid between the first magnetic core and the first surface of the printed circuit board so as to attach the first magnetic core to the first surface of the printed circuit board; dispensing glue on at least the first contact surface of the first magnetic core, and embedding the second magnetic core into the limiting through hole from the second surface of the printed circuit board, so that the first contact surface of the first magnetic core and the second contact surface of the second magnetic core are tightly attached in the limiting through hole, and a semi-finished product of the planar magnetic piece is obtained; finally, performing secondary reflow soldering on the semi-finished product of the planar magnetic part, so that the glue between the first contact surface of the first magnetic core and the second contact surface of the second magnetic core is solidified to realize the mounting of the second magnetic core, thereby preparing a finished product of the planar magnetic part; so, compare in the tradition and utilize buckle and recess matched with fixed mode, the fixed mode of laminating is glued to the point through this kind is adorned first magnetic core, second magnetic core subsides on printed circuit board, and not only the commonality is good, applicable in the plane magnetism spare of different models, and whole manufacture process accessible equipment is accomplished moreover, and need not manual operation, has improved the production efficiency of product effectively, has reduced the manufacturing cost of product.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic flow chart illustrating a method for manufacturing a planar magnetic member according to an embodiment of the present invention;
FIG. 2 is a schematic flow chart of a method for manufacturing a planar magnetic member according to another embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a planar magnetic member according to an embodiment of the present invention;
FIG. 4 is an exploded view of a planar magnetic member according to an embodiment of the present invention;
FIG. 5 is a schematic structural diagram of a planar magnetic member according to another embodiment of the present invention;
FIG. 6 is an exploded view of a planar magnetic member according to another embodiment of the present invention.
Description of reference numerals:
1-printed circuit board, 11-first surface, 12-second surface, 13-limit through hole, 131-first limit hole, 132-second limit hole, 133-third limit hole, 2-first magnetic core, 21-first positioning column, 211-first positioning part, 212-second positioning part, 213-third positioning part, 22-first contact surface, 3-second magnetic core, 31-second positioning column, 311-fourth positioning part, 312-fifth positioning part, 313-sixth positioning part, 32-second contact surface, 4-winding plate, 41-through hole, 5-first adhesive layer, 6-second adhesive layer and 7-third adhesive layer.
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, an embodiment of the present invention provides a method for manufacturing a planar magnetic component, where the planar magnetic component may be an electronic component such as a planar transformer or a planar inductor, and the planar magnetic component includes a printed circuit board, a first magnetic core, and a second magnetic core; the manufacturing method of the planar magnetic piece comprises the following steps:
step S1, dispensing on the first surface 11 of the printed circuit board 1, wherein the printed circuit board 1 is provided with a limit through hole 13;
step S2, embedding the first magnetic core 2 into the limiting through hole 13 from the first surface 11 of the printed circuit board 1, so that the first magnetic core 2 and the printed circuit board 1 are mutually attached;
step S3, performing a reflow soldering process on the first magnetic core 2 and the printed circuit board 1 after the bonding process, so as to solidify the glue between the first magnetic core 2 and the first surface 11 of the printed circuit board 1;
step S4, dispensing at least on the first contact surface 22 of the first magnetic core 2, and embedding the second magnetic core 3 into the limiting through hole 13 from the second surface 12 of the printed circuit board 1, so that the first contact surface 22 of the first magnetic core 2 and the second contact surface 32 of the second magnetic core 3 are tightly attached in the limiting through hole 13, and a plane magnetic piece semi-finished product is obtained; wherein the second surface 12 is arranged opposite to the first surface 11;
step S5, performing a second reflow soldering on the semi-finished planar magnetic member to solidify the colloid between the first contact surface 22 of the first magnetic core 2 and the second contact surface 32 of the second magnetic core 3, so as to obtain a finished planar magnetic member.
In the above step S1, the first surface 11 of the printed circuit board 1 is the upper surface of the printed circuit board 1; the dispensing operation is completed by an automatic dispenser arranged in the process of mounting, the dispensed glue is epoxy glue or other glue which can be used for fixing the magnetic core, the dispensing shape is determined according to the size and the shape of two contact surfaces to be bonded, and the dispensed glue cannot overflow the dispensing surface.
In the above step S2, the operation of fitting the first core 2 into the through-hole 13 is performed by an automated die bonding apparatus.
In the step S3, the reflow soldering operation is completed by a reflow soldering machine disposed in the mounting process, the epoxy glue deposited on the planar magnetic member enters the reflow soldering machine along with the planar magnetic member, the epoxy glue is cured by the high temperature in the reflow soldering machine, and the cured epoxy glue has a certain thickness and can firmly adhere the first magnetic core 2 and the first surface 11 together; the glue dispensing and high-temperature curing process can be combined into the automatic surface mounting process of other components on the printed circuit board 1, the process flow is simplified, the automatic surface mounting mode using epoxy glue replaces the existing groove matched with a metal buckle with a standard size in surface pressing of the planar magnetic piece, and the manual installation mode of fixing the two magnetic cores through the matching of the buckle and the groove greatly improves the production efficiency of the planar magnetic piece.
In the above step S4, the second surface 12 of the printed circuit board 1 is the lower surface of the printed circuit board 1; before dispensing, the printed circuit board 1 needs to be turned over up and down to enable the second surface 12 to face upwards, so that the second magnetic core 3 cannot fall off from the second surface 12 due to the action of gravity; the dispensing operation is completed by an automatic dispenser arranged in the process of pasting, the dispensed glue is epoxy glue or other glue which can be used for fixing the magnetic core, the dispensing shape is determined according to the size and the shape of two contact surfaces to be bonded, and the dispensed glue cannot overflow the dispensing surface; the operation of inserting the second magnetic core 3 into the limiting through hole 13 is completed by an automatic chip mounting device.
In the step S5, the reflow soldering operation is completed by a reflow soldering machine disposed in the mounting process, the epoxy glue deposited on the planar magnetic member enters the reflow soldering machine along with the planar magnetic member, the epoxy glue is cured by the high temperature in the reflow soldering machine, and the cured epoxy glue has a certain thickness and can firmly adhere the first contact surface 22 and the second contact surface 32 together; the glue dispensing and high-temperature curing process can be combined into the automatic surface mounting process of other components on the printed circuit board 1, the process flow is simplified, the automatic surface mounting mode using epoxy glue replaces the existing groove matched with a metal buckle with a standard size in surface pressing of the planar magnetic piece, and the manual installation mode of fixing the two magnetic cores through the matching of the buckle and the groove greatly improves the production efficiency of the planar magnetic piece.
The manufacturing method of the planar magnetic part provided by the embodiment is based on the steps, and compared with the traditional fixing mode of utilizing the buckle and the groove to match, the fixing mode of gluing and attaching the first magnetic core 2 and the second magnetic core 3 on the printed circuit board 1, so that the manufacturing method is good in universality, applicable to planar magnetic parts of different models, and capable of completing the whole manufacturing process through equipment without manual operation, effectively improves the production efficiency of products, and reduces the production cost of products.
Further, in an exemplary embodiment, the first magnetic core 2 has a first positioning post 21 fitted with the position-limiting through hole 13; the above-mentioned embedding of first magnetic core 2 from first surface 11 of printed circuit board 1 includes limiting through-hole 13:
in step S21, the first positioning posts 21 are inserted into the limiting through holes 13 from the first surface 11 of the printed circuit board 1, and the first magnetic core 2 is pressed or ground.
In the step S21, the first magnetic core 2 is limited by the limiting through hole 13 through the matching of the first positioning column 21 and the limiting through hole 13, so that the first magnetic core 2 is prevented from shifting relative to the printed circuit board 1 due to the action of external force when the first magnetic core 2 embedded in the printed circuit board 1 is ground, the traditional method of fixing the ground magnetic core by using a clamp in the grinding stage is replaced, and meanwhile, the design requirements on the positioning precision and the pressure sensing precision of the grinding equipment are reduced, so that the equipment cost is reduced; the pressing or grinding is completed through automatic equipment, and the purpose is to ensure that the colloid fully extends between the first magnetic core 2 and the first surface 11 of the printed circuit board 1 by applying pressure from the outside to ensure that the first magnetic core 2 is tightly attached to the first surface 11, wherein the grinding operation reduces the height of the first magnetic core 2 while ensuring the tight attachment, so that the height of the first magnetic core 2 meets the design requirement of the planar magnetic piece; the height of first locating column 21 is less than printed circuit board 1's thickness to after guaranteeing to imbed first magnetic core 2 spacing through-hole 13, still leave the space that supplies second magnetic core 3 to install in the spacing through-hole 13.
Further, in an exemplary embodiment, the second magnetic core 3 has a second positioning post 31 fitted with the limiting through hole 13, the first positioning post 21 has a first contact surface 22, and the second positioning post 31 has a second contact surface 32; the above-mentioned embedding of second magnetic core 3 from second surface 12 of printed circuit board 1 includes limiting through-hole 13:
step S4A, the second positioning post 31 is inserted into the limiting through hole 13 from the second surface 12 of the printed circuit board 1, and the second magnetic core 3 is pressed or ground, so that the first contact surface 22 of the first positioning post 21 and the second contact surface 32 of the second positioning post 31 are tightly attached to each other in the limiting through hole 13.
In the step S4A, the limit of the limit through hole 13 on the second magnetic core 3 is realized through the matching of the second positioning column 31 and the limit through hole 13, so that the second magnetic core 3 is prevented from shifting relative to the printed circuit board 1 due to the action of external force when the second magnetic core 3 embedded in the printed circuit board 1 is ground, the traditional method of fixing the ground magnetic core by using a clamp in the grinding stage is replaced, and meanwhile, the design requirements on the positioning precision and the pressure sensing precision of the grinding equipment are reduced, so that the equipment cost is reduced; the pressing or grinding is completed by automatic equipment, and the purpose is to fully extend the colloid between the second contact surface 32 of the second positioning column 31 and the first contact surface 22 of the first positioning column 21 by applying external pressure, so as to ensure that the second contact surface 32 and the first contact surface 22 are tightly attached, wherein the grinding operation reduces the height of the second magnetic core 3 while ensuring that the second magnetic core is tightly attached, so that the height of the second magnetic core 3 meets the design requirement of the planar magnetic piece.
Further, in an exemplary embodiment, the through hole 13 includes a first position-limiting hole 131, a second position-limiting hole 132 and a third position-limiting hole 133, the first positioning column 21 includes a first positioning portion 211, a second positioning portion 212 and a third positioning portion 213, the second positioning portion 212 is located between the first positioning portion 211 and the third positioning portion 213, the second positioning column 31 includes a fourth positioning portion 311, a fifth positioning portion 312 and a sixth positioning portion 313, the fifth positioning portion 312 is located between the fourth positioning portion 311 and the sixth positioning portion 313, the first positioning portion 211 and the fourth positioning portion 311 are respectively fitted with the first position-limiting hole 131, the first positioning portion 211 and the fourth positioning portion 311 are respectively fitted in the first position-limiting hole 131, the third positioning portion 213 and the sixth positioning portion 313 are respectively fitted with the third position-limiting hole 133, the third positioning portion 213 and the sixth positioning portion 313 are respectively fitted in the third position-limiting hole 133, the second positioning portion 212, the third positioning portion 212, and the third positioning portion 313 are respectively fitted in the third positioning portion 133, The fifth positioning portions 312 are all adapted to the second position-limiting holes 132, and the second positioning portions 212 and the fifth positioning portions 312 are oppositely disposed in the second position-limiting holes 132; before the step of dispensing on the first surface 11 of the printed circuit board 1, the method further comprises:
in step S01, the end faces of the second positioning portions 212 and/or the fifth positioning portions 312 are ground by a predetermined thickness.
In step S01, the predetermined thickness is ground to leave a gap between the end surfaces of the second positioning portion 212 and the fifth positioning portion 312, where the distance of the gap is the height of the air gap of the magnetic core, and for a planar transformer, the purpose of reserving the air gap is to prevent saturation of the transformer, and at the same time, keep the inductance of the exciting inductance within a certain range, and the height to be reserved for the air gap can be determined by calculation in the design stage of the magnetic core, specifically, the height added after the epoxy glue thickness is equivalently overlapped when the height of the reserved air gap is calculated is included in the calculation range, so as to eliminate the influence of the glue thickness on the actual air gap height; taking the planar transformer as an example, on the premise that the first magnetic core 2 and the second magnetic core 3 are made of uniform materials, if the cross-sectional areas of the first positioning portion 211, the third positioning portion 213, the fourth positioning portion 311 and the sixth positioning portion 313 are the same and are all 1/n of the cross-sectional areas of the second positioning portion 212 and the fifth positioning portion 312, assuming that the theoretical air gap height is h1, the performance of the planar transformer is optimal at the air gap height, if the grinding height of the end face of the second positioning portion 212 and/or the fifth positioning portion 312 is determined directly by the theoretical air gap height h1, after the planar transformer is mounted, since the epoxy adhesive between the first contact surface 22 of the first positioning column 21 and the second contact surface 32 of the second positioning column 31 has a certain thickness h2 after being cured, the actual equivalent air gap height is h1+ n × h2, which is greater than the theoretical air gap height h1, and the performance of the planar transformer cannot reach the optimum under the air gap height; therefore, in order to eliminate the influence of the thickness of the epoxy adhesive, the thickness of the epoxy adhesive should be calculated in the core design stage, specifically, the designed air gap height taking the thickness of the epoxy adhesive into consideration is h3, h3 ═ h1-n × h2, the grinding thickness of the end surfaces of the second positioning portion 212 and the fifth positioning portion 312 is determined according to the designed air gap height h3, after the planar transformer is mounted, the actual equivalent air gap height is h3+ n × h2 ═ h1-n × h2+ n × h2 ═ h1 due to the influence of the thickness of the epoxy adhesive, the actual equivalent air gap height is consistent with the theoretical air gap height, and the performance of the planar transformer is optimal at the air gap height.
It should be noted that, in some specific application scenarios, when the air gap height required by the planar magnetic member is small, the air gap height may be directly replaced by the epoxy glue thickness, so that the process of grinding the end face of the second positioning portion 212 and/or the fifth positioning portion 312 by a predetermined thickness may be omitted (i.e., step S01 is omitted).
Further, referring to fig. 2, in another exemplary embodiment, the planar magnetic member further includes a winding plate 4, and a through hole 41 is formed on the winding plate 4; the dispensing at least on the first contact surface 22 of the first magnetic core 2 and the embedding of the second magnetic core 3 from the second surface 12 of the printed circuit board 1 into the limiting through hole 13 comprises:
step S41, dispensing on the first contact surface 22 of the first magnetic core 2 and the second surface 12 of the printed circuit board 1;
step S42, attaching the winding board 4 to the second surface 12 of the printed circuit board 1 so that the through hole 41 corresponds to the limiting through hole 13;
in step S43, the second core 3 is fitted into the through-hole 41 and the stopper through-hole 13 from the surface of the winding plate 4 facing away from the printed circuit board 1.
In the step S41, the dispensing operation is performed by an automatic dispenser disposed in the tape-attaching process, the dispensed glue is epoxy glue or other glue that can be used to fix the winding board 4, the dispensing shape depends on the size and shape of the two contact surfaces to be bonded, and the dispensed glue should not overflow the dispensing surface.
In the above step S42, the operation of attaching the winding board 4 to the second surface 12 is completed by an automated tape attaching device; the through holes 41 are equal in number and correspond to the limiting through holes 13 in position.
In the above step S43, the operation of inserting the second magnetic core 3 into the through-hole 41 and the restriction through-hole 13 from the surface of the winding plate 4 facing away from the printed circuit board 1 is performed by an automated die bonding apparatus.
Further, in an exemplary embodiment, the first magnetic core 2 has a first positioning post 21 fitted with the limiting through hole 13, the second magnetic core 3 has a second positioning post 31 fitted with the limiting through hole 13, the first positioning post 21 is located in the limiting through hole 13, the first positioning post 21 has a first contact surface 22, and the second positioning post 31 has a second contact surface 32; the step of inserting the second magnetic core 3 into the through hole 41 and the limiting through hole 13 from the surface of the winding plate 4 opposite to the printed circuit board 1 includes:
step S431, the second positioning column 31 is inserted into the through hole 41 and the limiting through hole 13 from the surface of the winding plate 4 opposite to the printed circuit board 1, and the second magnetic core 3 is pressed or ground, so that the first contact surface 22 of the first positioning column 21 and the second contact surface 32 of the second positioning column 31 are tightly attached in the limiting through hole 13.
In the step S431, the limit of the second magnetic core 3 by the limit through hole 13 is realized through the matching of the second positioning column 31 and the limit through hole 13, so that the second magnetic core 3 is prevented from shifting relative to the printed circuit board 1 due to the action of external force when the second magnetic core 3 embedded in the printed circuit board 1 is ground, the traditional way of fixing the ground magnetic core by using a clamp in the grinding stage is replaced, and meanwhile, the design requirements on the positioning precision and the pressure sensing precision of the grinding equipment are reduced, so that the equipment cost is reduced; the pressing or grinding is completed by automatic equipment, and the purpose is to fully extend the colloid between the second contact surface 32 of the second positioning column 31 and the first contact surface 22 of the first positioning column 21 by applying external pressure, so as to ensure that the second contact surface 32 and the first contact surface 22 are tightly attached, wherein the grinding operation reduces the height of the second magnetic core 3 while ensuring that the second magnetic core is tightly attached, so that the height of the second magnetic core 3 meets the design requirement of the planar magnetic piece.
Further, in an exemplary embodiment, before dispensing the glue on the first surface 11 of the printed circuit board 1, the method further includes mounting components such as a resistor and a capacitor on the first surface 11 of the printed circuit board 1, and specifically, the components such as the resistor and the capacitor may be mounted on corresponding positions on the first surface 11 of the printed circuit board 1 by a dispensing and bonding method.
Further, in an exemplary embodiment, before dispensing the glue on the first contact surface 22 of the first magnetic core 2, the method further includes mounting a resistor, a capacitor, and other components on the second surface 12 of the printed circuit board 1, and specifically, the resistor, the capacitor, and other components may be mounted on corresponding positions on the second surface 12 of the printed circuit board 1 by means of dispensing and gluing.
Correspondingly, the embodiment of the invention also provides a planar magnetic member which is manufactured by the manufacturing method of the planar magnetic member in any embodiment.
In this embodiment, the planar magnetic member obtained by the above improvement of the method for manufacturing a planar magnetic member has the advantage of low cost.
Correspondingly, referring to fig. 3 and 4, an embodiment of the present invention further provides a planar magnetic member, including a printed circuit board 1, a first magnetic core 2, a second magnetic core 3, a first adhesive layer 5 and a second adhesive layer 6, wherein the printed circuit board 1 is provided with a limiting through hole 13, the first magnetic core 2 has a first contact surface 22, the second magnetic core 3 has a second contact surface 32, the first magnetic core 2 is embedded on the first surface 11 of the printed circuit board 1, the first contact surface 22 of the first magnetic core 2 is located in the limiting through hole 13, and the first magnetic core 2 and the first surface 11 of the printed circuit board 1 are attached to each other through the first adhesive layer 5; the second magnetic core 3 is inlaid on the second surface 12 of the printed circuit board 1, the second contact surface 32 of the second magnetic core 3 is positioned in the limiting through hole 13, and the first contact surface 22 of the first magnetic core 2 is attached to the second contact surface 32 of the second magnetic core 3 through the second spot gluing layer 6; wherein the second surface 12 is arranged facing away from the first surface 11.
In this embodiment, first point glue film 5 and second point glue film 6 are epoxy, the point of epoxy is glued the operation accessible and is accomplished by the automatic point gum machine, the epoxy that is got ready is glued and is got into the high temperature solidification in the reflow soldering machine along with plane magnetism spare, epoxy after the solidification can firmly bond two contact surface together, above-mentioned point is glued and the high temperature solidification process all can merge in the automatic paster flow of other components and parts on printed circuit board 1, process flow has been simplified, the recess of present surface pressing and standard size's metal buckle looks adaptation at plane magnetism spare has been replaced through the automatic subsides dress mode that uses epoxy, the manual installation mode of fixing two magnetic cores through the cooperation of buckle and recess, make the production efficiency of plane magnetism spare improve by a wide margin.
Further, with reference to fig. 3 and 4, in an exemplary embodiment, the first magnetic core 2 has a first positioning post 21 fitted with the position-limiting through hole 13, and the first positioning post 21 has a first contact surface 22; the second magnetic core 3 has a second positioning column 31 matching with the limiting through hole 13, and the second positioning column 31 has a second contact surface 32.
In the embodiment, the first positioning column 21 and the limiting through hole 13 are matched to limit the first magnetic core 2, so that the first magnetic core 2 is prevented from deviating relative to the printed circuit board 1 due to the action of external force; the second positioning column 31 and the limiting through hole 13 are matched to limit the second magnetic core 3, so that the second magnetic core 3 is prevented from shifting relative to the printed circuit board 1 due to the action of external force.
Further, referring to fig. 5 and 6, in another exemplary embodiment, the planar magnetic member further includes a winding board 4 and a third adhesive bonding layer 7, a through hole 41 is formed in the winding board 4, the winding board 4 is attached to the second surface 12 of the printed circuit board 1 through the third adhesive bonding layer 7, the through hole 41 is disposed corresponding to the limiting through hole 13, and the second positioning post 31 passes through the through hole 41 and is disposed in the limiting through hole 13.
In the embodiment, the first positioning column 21 and the limiting through hole 13 are matched to limit the first magnetic core 2, so that the first magnetic core 2 is prevented from deviating relative to the printed circuit board 1 due to the action of external force; the second positioning column 31 and the limiting through hole 13 are matched to limit the second magnetic core 3, so that the second magnetic core 3 is prevented from shifting relative to the printed circuit board 1 due to the action of external force.
Further, third point glue film 7 is the epoxy glue body, the point of epoxy glue is glued the operation and is accomplished through automatic point gum machine, the epoxy glue of institute of some is glued and is got into the high temperature solidification in the reflow soldering machine along with the plane magnetic part, the epoxy glue body after the solidification can be firmly bonded two contact surfaces together, above-mentioned point is glued and the high temperature solidification process all can merge in the automatic paster flow of other components and parts on printed circuit board 1, the process flow has been simplified, the recess of the surface suppression and the metal buckle looks adaptation of standard size at the plane magnetic part at present has been replaced through the automatic subsides dress mode that uses the epoxy glue, fix the artifical mounting means of two magnetic cores through the cooperation of buckle and recess, make the production efficiency of plane magnetic part improve by a wide margin.
It should be noted that other contents of the planar magnetic member and the manufacturing method thereof disclosed in the present invention can be referred to in the prior art, and are not described herein again.
It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the motion situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, it should be noted that the descriptions related to "first", "second", etc. in the present invention are only used for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The above description is only an alternative embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. The manufacturing method of the planar magnetic member is characterized in that the planar magnetic member comprises a printed circuit board, a first magnetic core and a second magnetic core; the method comprises the following steps:
dispensing glue on the first surface of the printed circuit board, wherein the printed circuit board is provided with a limiting through hole;
embedding the first magnetic core into the limiting through hole from the first surface of the printed circuit board so as to enable the first magnetic core to be tightly attached to the printed circuit board;
performing reflow soldering on the attached first magnetic core and the printed circuit board once so as to solidify the colloid between the first magnetic core and the first surface of the printed circuit board;
dispensing at least on the first contact surface of the first magnetic core, and embedding the second magnetic core into the limiting through hole from the second surface of the printed circuit board, so that the first contact surface of the first magnetic core and the second contact surface of the second magnetic core are tightly attached in the limiting through hole, and a semi-finished product of the planar magnetic part is obtained; wherein the second surface is disposed opposite the first surface;
and carrying out secondary reflow soldering on the semi-finished product of the planar magnetic piece so as to solidify the colloid between the first contact surface of the first magnetic core and the second contact surface of the second magnetic core, thereby obtaining a finished product of the planar magnetic piece.
2. The method of claim 1, wherein the first core has a first positioning post adapted to the through hole; the embedding the first magnetic core into the limiting through hole from the first surface of the printed circuit board comprises:
and embedding the first positioning column into the limiting through hole from the first surface of the printed circuit board, and pressing or grinding the first magnetic core.
3. The method of claim 2, wherein the second core has a second positioning post adapted to the through hole, the first positioning post has the first contact surface, and the second positioning post has the second contact surface; the embedding the second magnetic core into the limiting through hole from the second surface of the printed circuit board comprises:
and embedding the second positioning column into the limiting through hole from the second surface of the printed circuit board, and pressing or grinding the second magnetic core so as to enable the first contact surface of the first positioning column and the second contact surface of the second positioning column to be tightly attached in the limiting through hole.
4. The method of claim 3, wherein the first positioning post comprises a first positioning portion, a second positioning portion and a third positioning portion, and the second positioning portion is located between the first positioning portion and the third positioning portion; the second positioning column comprises a fourth positioning part, a fifth positioning part and a sixth positioning part, the fifth positioning part is positioned between the fourth positioning part and the sixth positioning part, the first positioning part and the fourth positioning part are jointed in the limiting through hole, the third positioning part and the sixth positioning part are jointed in the limiting through hole, and the second positioning part and the fifth positioning part are oppositely arranged in the limiting through hole; before the step of dispensing on the first surface of the printed circuit board, the method further comprises:
and grinding the end face of the second positioning part and/or the fifth positioning part by a preset thickness.
5. The method for manufacturing the planar magnetic member as claimed in claim 1, wherein the planar magnetic member further comprises a winding plate, and the winding plate is provided with a through hole; the dispensing at least on the first contact surface of the first magnetic core and embedding the second magnetic core into the limiting through hole from the second surface of the printed circuit board comprises:
dispensing glue on the first contact surface of the first magnetic core and the second surface of the printed circuit board;
attaching the winding board to the second surface of the printed circuit board so that the through hole corresponds to the limiting through hole;
and embedding the second magnetic core into the through hole and the limiting through hole from the surface of the winding board opposite to the printed circuit board.
6. The method of claim 5, wherein the first magnetic core has a first positioning post adapted to the through hole, the second magnetic core has a second positioning post adapted to the through hole, the first positioning post is located in the through hole, the first positioning post has the first contact surface, and the second positioning post has the second contact surface; the step of inserting the second magnetic core into the through hole and the limiting through hole from the surface of the winding board facing away from the printed circuit board includes:
and embedding the second positioning column into the through hole and the limiting through hole from the surface of the winding board back to the printed circuit board, and pressing or grinding the second magnetic core so as to enable the first contact surface of the first positioning column and the second contact surface of the second positioning column to be tightly attached in the limiting through hole.
7. A planar magnetic member produced by the method for producing a planar magnetic member according to any one of claims 1 to 6.
8. A planar magnetic part is characterized by comprising a printed circuit board, a first magnetic core, a second magnetic core, a first spot glue layer and a second spot glue layer, wherein a limiting through hole is formed in the printed circuit board, the first magnetic core is provided with a first contact surface, the second magnetic core is provided with a second contact surface, the first magnetic core is embedded on the first surface of the printed circuit board, the first contact surface of the first magnetic core is positioned in the limiting through hole, and the first magnetic core is attached to the first surface of the printed circuit board through the first spot glue layer; the second magnetic core is embedded on the second surface of the printed circuit board, the second contact surface of the second magnetic core is positioned in the limiting through hole, and the first contact surface of the first magnetic core is attached to the second contact surface of the second magnetic core through the second adhesive dispensing layer; wherein the second surface is disposed opposite the first surface.
9. The planar magnetic member as claimed in claim 8, wherein the first magnetic core has a first positioning post fitted with the through hole, and the first positioning post has the first contact surface; the second magnetic core is provided with a second positioning column matched with the limiting through hole, and the second positioning column is provided with the second contact surface.
10. The planar magnetic member as claimed in claim 9, further comprising a wire winding plate and a third adhesive layer, wherein the wire winding plate has a through hole, the wire winding plate is attached to the second surface of the printed circuit board through the third adhesive layer, the through hole is disposed corresponding to the limiting through hole, and the second positioning post passes through the through hole and is disposed in the limiting through hole.
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| CN202110433271.6A CN113194630B (en) | 2021-04-21 | 2021-04-21 | Planar magnetic part and manufacturing method thereof |
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| CN202110433271.6A CN113194630B (en) | 2021-04-21 | 2021-04-21 | Planar magnetic part and manufacturing method thereof |
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Also Published As
| Publication number | Publication date |
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| CN113194630B (en) | 2023-10-27 |
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