JP2001085259A - Coil and its manufacture - Google Patents
Coil and its manufactureInfo
- Publication number
- JP2001085259A JP2001085259A JP25641899A JP25641899A JP2001085259A JP 2001085259 A JP2001085259 A JP 2001085259A JP 25641899 A JP25641899 A JP 25641899A JP 25641899 A JP25641899 A JP 25641899A JP 2001085259 A JP2001085259 A JP 2001085259A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- coil
- terminal plate
- magnetic core
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 238000004804 winding Methods 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims abstract description 7
- 239000002184 metal Substances 0.000 claims abstract 3
- 239000000853 adhesive Substances 0.000 claims description 12
- 230000001070 adhesive effect Effects 0.000 claims description 12
- 229910000859 α-Fe Inorganic materials 0.000 claims description 4
- 230000000750 progressive effect Effects 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims 2
- 239000011347 resin Substances 0.000 abstract description 21
- 229920005989 resin Polymers 0.000 abstract description 21
- 238000007789 sealing Methods 0.000 abstract description 6
- 238000000465 moulding Methods 0.000 abstract description 5
- 239000007767 bonding agent Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 description 9
- 239000000758 substrate Substances 0.000 description 6
- 239000010410 layer Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000012790 adhesive layer Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 101100008046 Caenorhabditis elegans cut-2 gene Proteins 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電子回路に用いる
コイルであって、特に電子機器において液晶表示装置を
照明するために設けてあるエレクトロルミネセンス（Ｅ
Ｌ）素子を発光させるためのＥＬドライバ用に好適のも
のに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a coil used in an electronic circuit, and more particularly to a coil provided for illuminating a liquid crystal display device in an electronic device.
L) The present invention relates to a device suitable for an EL driver for emitting light from an element.
【０００２】[0002]
【従来の技術】図６はＥＬドライバその他の電子回路に
用いられるコイルの一例であって、（Ａ）は正面図、
（Ｂ）は下面図である。１はフェライト材の磁心で両端
にフランジ１ａ、１ｂがあり、同図（Ａ）では磁心１の
右半分を断面で示してある。フランジ１ｂの下面に樹脂
５の層があり、樹脂５には２個の端子板４が埋設されて
いる。2. Description of the Related Art FIG. 6 shows an example of a coil used in an EL driver and other electronic circuits.
(B) is a bottom view. Numeral 1 is a magnetic core made of a ferrite material and has flanges 1a and 1b at both ends. In FIG. 1A, the right half of the magnetic core 1 is shown in cross section. There is a layer of resin 5 on the lower surface of the flange 1b, and two terminal plates 4 are embedded in the resin 5.
【０００３】このコイルを製作するには、磁心１と端子
板４をインサートして樹脂５を成形することにより、磁
心１と端子板４が一体化した部品を得て、これに巻線２
を施して端末を処理する。端末処理は巻線端末３を端子
板４の一端である枝部４ｂにからげ、この部分を半田デ
ィップして固定する。端子板４の他端は端子４ａであ
り、これを回路パターンに半田付けしてコイルを回路基
板に実装する。[0003] In order to manufacture this coil, the core 5 and the terminal plate 4 are inserted and a resin 5 is molded to obtain a part in which the core 1 and the terminal plate 4 are integrated.
To process the terminal. In the terminal processing, the winding terminal 3 is wrapped around the branch portion 4b, which is one end of the terminal plate 4, and this portion is solder-dipped and fixed. The other end of the terminal plate 4 is a terminal 4a, which is soldered to a circuit pattern to mount a coil on a circuit board.
【０００４】[0004]
【発明が解決しようとする課題】図６のコイルには次の
ような問題点がある。まず、磁心に樹脂部分を形成して
端子板を埋設するので、そのための金型やインサート成
形工程が必要であり製造費が増す。磁心、端子、樹脂層
を積層した構成なので高さ寸法が増える。また、端子を
回路基板に半田付けすることによってコイルを組み付け
るので、強度上、端子をある程度厚く、例えば厚さ０．
１５ｍｍ以上にしなければならず製品の薄型化が妨げら
れる、などである。本発明はこれらの問題を解決して、
小型で回路基板への表面実装に適するコイルを提供する
ものである。The coil shown in FIG. 6 has the following problems. First, since a resin portion is formed on the magnetic core and the terminal plate is buried, a mold and an insert molding process for that purpose are required, which increases the manufacturing cost. Since the magnetic core, the terminal, and the resin layer are laminated, the height dimension increases. Also, since the coil is assembled by soldering the terminal to the circuit board, the terminal is thick to a certain extent in terms of strength, for example, a thickness of 0.1 mm.
The thickness must be 15 mm or more, which prevents the product from being thinned. The present invention solves these problems,
An object of the present invention is to provide a small-sized coil suitable for surface mounting on a circuit board.
【０００５】[0005]
【課題を解決するための手段】本発明のコイルは、端子
を樹脂部分にインサートして固定するのでなく、磁心の
フランジに接着して固定する。従って従来のような樹脂
層は省かれる。そして、コイルを基板に実装した後、基
板上に封止樹脂を充填してコイルその他の部品を封入す
るので、部品の端子に格別の強度は必要なく、端子に薄
い材料を用いて全体を薄型化する。According to the coil of the present invention, the terminal is not fixed to the resin portion by inserting it into the resin portion, but is fixed to the flange of the magnetic core by bonding. Therefore, the conventional resin layer is omitted. Then, after mounting the coil on the board, the board is filled with sealing resin and the coil and other components are sealed, so no special strength is required for the terminals of the components, and the entire terminal is made thin using a thin material. Become
【０００６】本発明のコイルの製造には、順送プレス加
工により帯材に端子のつながったリードフレームを形成
する。そして接着剤を用いて端子に磁心を接着し、接着
剤を硬化させた後、端子をリードフレームから切断す
る。こうして磁心に端子の接着された部品を得るので、
これに巻線して端末処理し、基板への組み込みに適する
形に端子を曲げる。この方法により生産性よくコイルを
製造する。In manufacturing the coil of the present invention, a lead frame having terminals connected to a strip is formed by progressive press working. Then, the magnetic core is bonded to the terminal using an adhesive, and after the adhesive is cured, the terminal is cut from the lead frame. In this way, the parts with the terminals bonded to the magnetic core are obtained,
The terminal is wound and wound, and the terminal is bent into a form suitable for incorporation into a substrate. By this method, a coil is manufactured with high productivity.
【０００７】[0007]
【発明の実施の形態】以下、図面に基づいて本発明の実
施形態を説明する。図１は本発明のコイル１７で、
（Ａ）は上面図、（Ｂ）は正面図である。フェライト材
の磁心１１は両端にフランジ１１ａ、１１ｂを有し、巻
線２が巻かれている。磁心１１のフランジ１１ａの上面
に２個の端子板１４を嫌気性のＵＶ接着剤で接着してあ
る。図１（Ａ）で中央部に水平に帯状に見えるのは、２
個の端子板１４の間に溜まった接着剤１５であって、磁
心１１のフランジ１１ａ上面と端子板１４下面の間に、
厚さ数十ミクロン程度の接着剤層を生じて両部品を接着
している。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a coil 17 of the present invention.
(A) is a top view and (B) is a front view. The magnetic core 11 made of ferrite material has flanges 11a and 11b at both ends, and the winding 2 is wound. Two terminal plates 14 are bonded to the upper surface of the flange 11a of the magnetic core 11 with an anaerobic UV adhesive. In FIG. 1 (A), the horizontal band-like shape at the center is 2
The adhesive 15 accumulated between the terminal plates 14, and between the upper surface of the flange 11 a of the magnetic core 11 and the lower surface of the terminal plate 14,
An adhesive layer having a thickness of about several tens of microns is formed to bond both parts.
【０００８】端子板１４にはそれぞれ端子１４ａと枝部
１４ｂが形成されている。なお、明瞭のため、図１
（Ｂ）では同図（Ａ）のＢ−Ｂ線に沿って端子１４ａと
枝部１４ｂを見たところを描いてある。端子１４ａは図
（Ｂ）のように下方に２段曲げしてある。枝部１４ｂも
僅かの段差で２段曲げされており、これに巻線端末３を
からげて半田ディップで固定してある。端子板１４には
他に短い突起１４ｃがあり、これは下向きに曲がってい
て、枝部１４ｂの段差とともに磁心１１と端子板１４を
位置合わせするのに役立つ。A terminal 14a and a branch 14b are formed on the terminal plate 14, respectively. For clarity, FIG.
(B) shows the terminal 14a and the branch portion 14b as viewed along the line BB in FIG. The terminal 14a is bent downward in two steps as shown in FIG. The branch part 14b is also bent by two steps with a slight step, and the winding end 3 is tied to this and fixed with a solder dip. The terminal plate 14 also has a short protrusion 14c which is bent downward and serves to align the magnetic core 11 and the terminal plate 14 with the step of the branch portion 14b.
【０００９】図２は、図１に示したコイル１７を用いて
構成したＥＬドライバのモジュールである。基板６にコ
ンデンサ７とＩＣ（８）を実装してあり、ＩＣ（８）は
ワイヤボンドしてある。コイル１７は下部を基板６の穴
に入れて端子１４ａを回路パターンに当て、半田のリフ
ローで接続してある。そして基板６上に封止樹脂９を充
填して、回路部品全部を封入してある。このように、コ
イル１７はモジュール化されると封止樹脂９中に埋設さ
れるので、端子１４ａを厚さ０．１ｍｍ程度の薄手の材
料で作っても強度上の問題を生じない。FIG. 2 shows an EL driver module constructed using the coil 17 shown in FIG. A capacitor 7 and an IC (8) are mounted on a substrate 6, and the IC (8) is wire-bonded. The lower portion of the coil 17 is inserted into the hole of the substrate 6, the terminal 14a is applied to the circuit pattern, and the coil 17 is connected by solder reflow. Then, a sealing resin 9 is filled on the substrate 6 to encapsulate all the circuit components. As described above, since the coil 17 is embedded in the sealing resin 9 when it is modularized, there is no problem in strength even if the terminal 14a is made of a thin material having a thickness of about 0.1 mm.
【００１０】次に本発明のコイルの製造方法を説明す
る。図３（Ａ）に示すように、燐青銅などの帯材２１を
パイロット穴２２を基準に順送プレス加工して、帯材２
１に多くの端子板１４がつなぎ部２３でつながったリー
ドフレームを製作する。端子板１４は２個ずつ１組にな
っており、図１と見比べれば分かるように、完成コイル
になった時と同じ位置関係でつなぎ部２３につながって
いる。端子板１４には端子１４ａ、枝部１４ｂ、突起１
４ｃがあり、それぞれ単純曲げや２段曲げを施されてい
る。ただし、コイルの完成品と違って端子１４ａは先端
を曲げてあるだけで、根本はまだ曲げてない。同図
（Ｂ）はリードフレームの右側面図である。Next, a method of manufacturing a coil according to the present invention will be described. As shown in FIG. 3 (A), a strip 21 such as phosphor bronze is subjected to progressive press working with reference to the pilot hole 22 to form a strip 2.
First, a lead frame in which a number of terminal plates 14 are connected by a connecting portion 23 is manufactured. The terminal plate 14 is a set of two terminals, and is connected to the connecting portion 23 in the same positional relationship as when the finished coil is formed, as can be seen from comparison with FIG. The terminal plate 14 has terminals 14 a, branch portions 14 b, protrusions 1
4c, each of which is subjected to simple bending or two-step bending. However, unlike the finished coil, the terminal 14a has only a bent end, and the root has not yet been bent. FIG. 3B is a right side view of the lead frame.
【００１１】端子板１４とつなぎ部２３の境界に切り込
み２４が入れてあり、同図（Ｃ）はその部分の拡大側面
図である。切り込み２４を設けたのは端子板１４を帯材
２１から簡単に切断できるようするためである。また、
端子１４ａを根本から曲げやすくするために、端子１４
ａの根本に切り込み２５を設けることもでき、同じく図
（Ｃ）の下部に拡大側面図を示す。しかし、こちらは曲
げのためであって切断のためではないから、切り込み２
５は２４よりも浅くする。A notch 24 is formed at the boundary between the terminal plate 14 and the connecting portion 23, and FIG. 2C is an enlarged side view of that portion. The notches 24 are provided so that the terminal plate 14 can be easily cut from the band material 21. Also,
To make the terminal 14a easily bendable from the root,
A cut 25 can be provided at the root of a, and an enlarged side view is shown in the lower part of FIG. However, since this is for bending and not for cutting, cut 2
5 is shallower than 24.
【００１２】次に、リードフレームの端子板１４に嫌気
性のＵＶ接着剤１５を図３（Ａ）のように塗布する。そ
して図４（Ａ）、（Ｂ）のように、磁心１１のフランジ
１１ａを２個の端子板１４にまたがって押し当てる。フ
ランジ１１ａは端子板１４の枝部１４ｂと突起１４ｃの
作る段差によって横方向に位置決めされる。接着剤１５
は接着面間に広がって接着層を生じるとともに、そこか
らはみ出して、裏側から見ると、先の図１（Ａ）のよう
に２個の端子板１４の間にも溜まる。この状態で端子板
１４側から紫外線を照射して接着剤１５を硬化させる。Next, an anaerobic UV adhesive 15 is applied to the terminal plate 14 of the lead frame as shown in FIG. Then, as shown in FIGS. 4A and 4B, the flange 11 a of the magnetic core 11 is pressed across the two terminal plates 14. The flange 11a is positioned in the lateral direction by a step formed by the branch 14b of the terminal plate 14 and the projection 14c. Adhesive 15
Is spread between the adhesive surfaces to form an adhesive layer, protrudes from the adhesive layer, and accumulates between the two terminal boards 14 as shown in FIG. In this state, the adhesive 15 is cured by irradiating ultraviolet rays from the terminal plate 14 side.
【００１３】接着剤が硬化して磁心１１と端子板１４が
接合されたら、これを帯材２１から切り離すのである
が、前述のように端子板１４とつなぎ部２３の境界には
切り込み２４が入れてあって破断し易いから、磁心１１
と端子板１４が一体化した部品は、ちょっと押してやる
だけですぐリードフレームから離れて落ちる。When the adhesive is hardened and the magnetic core 11 and the terminal plate 14 are joined, they are separated from the band material 21. As described above, a cut 24 is made at the boundary between the terminal plate 14 and the connecting portion 23. Magnetic core 11
The part in which the terminal board 14 and the terminal board 14 are integrated can be separated from the lead frame immediately with a slight push.
【００１４】こうして磁心１１に端子板１４が接着され
た部品を得たら、図５に示すように巻線２を施し、巻線
端末３を端子板１４の枝部１４ｂにからげ、半田ディッ
プして固定する。そして図５では右方に伸びている端子
１４ａを、図の矢印のように根本から下向きに曲げる。
これで図１に示した本発明のコイルが完成する。このよ
うな本発明のコイルの製造方法は、従来のような磁心と
端子板をインサートする樹脂の成形を含まず、極めて生
産性がよい。After obtaining a component in which the terminal plate 14 is adhered to the magnetic core 11 in this way, the winding 2 is applied as shown in FIG. 5, the winding terminal 3 is wrapped around the branch portion 14b of the terminal plate 14, and solder dipping is performed. And fix it. In FIG. 5, the terminal 14a extending to the right is bent downward from the root as indicated by the arrow in the figure.
Thus, the coil of the present invention shown in FIG. 1 is completed. Such a method for manufacturing a coil according to the present invention does not include the conventional molding of a resin for inserting a magnetic core and a terminal plate, and thus has extremely high productivity.
【００１５】[0015]
【発明の効果】本発明のコイルは従来のような端子を埋
設する樹脂層が省かれ、また、端子にも従来より薄い材
料を用いることができて、厚さの薄い製品が得られる。
これは、コイルを用いる電子機器やモジュールを小型
化、薄型化する上で大いに有用なことである。また、本
発明のコイルの製造方法によれば、リードフレームによ
る端子板の製造工程で端子板に磁心を接着剤で接着する
だけでよく、従来のように樹脂層に磁心と端子板をイン
サートする成形を行わないから、そのための複雑で高価
な金型を必要とせず、製造工数も削減される。According to the coil of the present invention, the resin layer for embedding the terminal as in the conventional case is omitted, and the terminal can be made of a thinner material than the conventional one, so that a thin product can be obtained.
This is very useful for reducing the size and thickness of electronic devices and modules using coils. Further, according to the coil manufacturing method of the present invention, it is only necessary to bond the magnetic core to the terminal plate with an adhesive in the manufacturing process of the terminal plate using the lead frame, and insert the magnetic core and the terminal plate into the resin layer as in the related art. Since molding is not performed, complicated and expensive molds are not required, and the number of manufacturing steps is reduced.
【００１６】また、図６のような従来のコイルでは、端
子４ａに半田メッキなどを施すことが行われており、こ
れは半田の付きをよくするとともに、基板に組み込まれ
たコイルが空気に触れながら長期間使用された場合、端
子が酸化して錆を生じたりして強度や動作に支障を来す
のを防ぐためである。図２に示したように本発明のコイ
ル１７は、モジュールに組み込み後は封止樹脂９中に封
入されているので、空気に触れず、材料の酸化による劣
化の恐れがない。そこで端子１４ａのメッキを省くこと
ができて、この面でもコストが削減される。このように
本発明によって、廉価で薄型であり、かつ信頼性の高い
コイルが実現する。In the conventional coil as shown in FIG. 6, the terminal 4a is plated with solder or the like, so that the solder is improved and the coil incorporated in the substrate is exposed to air. However, if the terminals are used for a long period of time, the terminals are prevented from being oxidized and rusting, thereby preventing the strength and operation from being affected. As shown in FIG. 2, since the coil 17 of the present invention is sealed in the sealing resin 9 after being incorporated in the module, it does not come into contact with air and does not have a risk of deterioration due to oxidation of the material. Therefore, plating of the terminal 14a can be omitted, and the cost is reduced in this aspect as well. As described above, according to the present invention, an inexpensive, thin, and highly reliable coil is realized.
【図１】本発明のコイルであって、（Ａ）は上面図、
（Ｂ）は（Ａ）のＢ−Ｂ線に沿って見た正面図である。FIG. 1 shows a coil according to the present invention, wherein (A) is a top view,
(B) is the front view seen along the BB line of (A).
【図２】本発明のコイルを用いたＥＬドライバ・モジュ
ールの断面図である。FIG. 2 is a cross-sectional view of an EL driver module using the coil of the present invention.
【図３】本発明のコイルの製造工程におけるリードフレ
ームであって、（Ａ）は平面図、（Ｂ）は側面図、
（Ｃ）は拡大側面図である。3A and 3B are lead frames in a coil manufacturing process of the present invention, wherein FIG. 3A is a plan view, FIG.
(C) is an enlarged side view.
【図４】図３のリードフレームの端子板に磁心を接着し
たところであって、（Ａ）は平面図、（Ｂ）は側面図で
ある。4A and 4B are views in which a magnetic core is bonded to a terminal plate of the lead frame in FIG. 3, wherein FIG. 4A is a plan view and FIG. 4B is a side view.
【図５】本発明にて、端子板の接合された磁心に巻線し
たところである。FIG. 5 shows a state where the present invention is wound around a magnetic core joined to a terminal plate.
【図６】従来のコイルの一例であって、（Ａ）は正面
図、（Ｂ）は下面図である。FIG. 6 is an example of a conventional coil, in which (A) is a front view and (B) is a bottom view.
１、１１ 磁心 １ａ、１ｂ、１１ａ、１１ｂ フランジ ２ 巻線 ３ 巻先端末 ４、１４ 端子板 ４ａ、１４ａ 端子 ４ｂ、１４ｂ 枝部 ５ 樹脂 ６ 基板 ７ コンデンサ ８ ＩＣ ９ 封止樹脂 １５ 接着剤 １７ コイル ２１ 帯材 ２３ つなぎ部 ２４、２５ 切り込み DESCRIPTION OF SYMBOLS 1, 11 Magnetic core 1a, 1b, 11a, 11b Flange 2 Winding 3 Winding end 4, 14 Terminal plate 4a, 14a Terminal 4b, 14b Branch 5 Resin 6 Substrate 7 Capacitor 8 IC 9 Sealing resin 15 Adhesive 17 Coil 21 band material 23 joint 24, 25 cut
Claims (3)
の一方のフランジに、端子と枝部を有する金属の端子板
２個を接着剤によって固定し、 これに巻線して巻き線端末を該端子板の前記枝部にそれ
ぞれ接続したことを特徴とするコイル。1. A metal terminal plate having terminals and branches is fixed to one flange of a ferrite core having flanges at both ends by an adhesive, and wound around the terminal plate to form a winding terminal. A coil connected to each of the branches.
であって、 金属の帯材の順送プレス加工により、端子と枝部を有す
る端子板が２個を１組として帯材につながったリードフ
レームを製作し、 端子板に接着剤を塗布して両端にフランジを有するフェ
ライト磁心を前記２個の端子板にまたがるように接着
し、 端子板をリードフレームから切断して磁心に２個の端子
板が接合された部品とし、 この部品に巻線して巻線端末を前記２個の端子板の枝部
にそれぞれ接続し、 必要に応じて端子板の端子を曲げて完成することを特徴
とするコイルの製造方法。2. The method for manufacturing a coil according to claim 1, wherein two sets of terminal plates each having a terminal and a branch portion are connected to the strip by progressive pressing of a metal strip. A ferrite core having flanges at both ends is adhered so as to straddle the two terminal plates, and the terminal plate is cut from the lead frame to form two lead frames. The terminal plate is joined to the terminal plate, and the winding terminals are connected to the branch terminals of the two terminal plates, and the terminals of the terminal plate are bent as necessary to complete the connection. Characteristic method of manufacturing coils.
いて、 端子板がリードフレームにつながっている箇所に切り込
みを設け、端子板に磁心を接着した後、これを押すだけ
で端子板が簡単にリードフレームから分離するようにし
たことを特徴とするコイルの製造方法。3. The method of manufacturing a coil according to claim 2, wherein a notch is provided at a position where the terminal plate is connected to the lead frame, and a magnetic core is bonded to the terminal plate, and then the terminal plate is simply pressed by simply pressing the core. A method for manufacturing a coil, wherein the coil is separated from a lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25641899A JP2001085259A (en) | 1999-09-09 | 1999-09-09 | Coil and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25641899A JP2001085259A (en) | 1999-09-09 | 1999-09-09 | Coil and its manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001085259A true JP2001085259A (en) | 2001-03-30 |
Family
ID=17292403
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25641899A Pending JP2001085259A (en) | 1999-09-09 | 1999-09-09 | Coil and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001085259A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003234214A (en) * | 2002-02-08 | 2003-08-22 | Toko Inc | Electronic circuit module |
| JP2003347131A (en) * | 2002-05-23 | 2003-12-05 | Tdk Corp | Coil device and lead frame |
| JP2008311735A (en) * | 2007-06-12 | 2008-12-25 | Mitsumi Electric Co Ltd | Method of manufacturing ultrasonic sensor |
| JP2009009960A (en) * | 2007-06-26 | 2009-01-15 | Sumida Corporation | Conductor winding member having terminal, and magnetic element |
| WO2009011217A1 (en) * | 2007-07-19 | 2009-01-22 | Sumida Corporation | Surface mounting component |
| CN111977088A (en) * | 2020-08-28 | 2020-11-24 | 广州融尚贸易有限公司 | Box sealing device based on electromagnetic principle |
| JP7511679B2 (en) | 2021-01-15 | 2024-07-05 | 三菱電機株式会社 | Lead frame for wound inductor, method for manufacturing wound inductor, power generating element, rotation detection element, and encoder |
-
1999
- 1999-09-09 JP JP25641899A patent/JP2001085259A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003234214A (en) * | 2002-02-08 | 2003-08-22 | Toko Inc | Electronic circuit module |
| JP2003347131A (en) * | 2002-05-23 | 2003-12-05 | Tdk Corp | Coil device and lead frame |
| JP2008311735A (en) * | 2007-06-12 | 2008-12-25 | Mitsumi Electric Co Ltd | Method of manufacturing ultrasonic sensor |
| JP2009009960A (en) * | 2007-06-26 | 2009-01-15 | Sumida Corporation | Conductor winding member having terminal, and magnetic element |
| WO2009011217A1 (en) * | 2007-07-19 | 2009-01-22 | Sumida Corporation | Surface mounting component |
| JPWO2009011217A1 (en) * | 2007-07-19 | 2010-09-24 | スミダコーポレーション株式会社 | Surface mount parts |
| CN111977088A (en) * | 2020-08-28 | 2020-11-24 | 广州融尚贸易有限公司 | Box sealing device based on electromagnetic principle |
| JP7511679B2 (en) | 2021-01-15 | 2024-07-05 | 三菱電機株式会社 | Lead frame for wound inductor, method for manufacturing wound inductor, power generating element, rotation detection element, and encoder |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100908961B1 (en) | Lead frame and semiconductor package therefor | |
| US20060012015A1 (en) | Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof | |
| JPH0982741A (en) | Chip carrier structure and its manufacture | |
| JP2002223004A (en) | Package molding and light emitting device | |
| US5615476A (en) | Method for producing identity cards having electronic modules | |
| JP2001085259A (en) | Coil and its manufacture | |
| KR19990068199A (en) | Package for semiconductor device having frame-shaped mold part and fabricating method thereof | |
| JPH0537021A (en) | Optical semiconductor device | |
| US6410980B1 (en) | Electronic part with groove in lead | |
| CN112713090B (en) | Preparation method of QFN device and QFN device | |
| JPH11195533A (en) | Smd-type coil and its manufacture | |
| JPH1126648A (en) | Semiconductor device and lead frame thereof | |
| JPH0521230A (en) | Chip-like inductor and its manufacture | |
| JP2841784B2 (en) | Electronic device manufacturing method and electronic device | |
| JP2004266109A (en) | Circuit board for ic card, ic module and manufacturing method thereof | |
| EP1786004B1 (en) | Method of manufacturing an electronic component comprising an integrated circuit and a winding assembly | |
| KR20010038940A (en) | Stacked buttom leaded plastic package and manufacturing method thereof | |
| JP2826075B2 (en) | Structure and forming method of electronic component device | |
| JP2002223003A (en) | Package molding, its manufacturing method and light emitting device | |
| KR200321316Y1 (en) | A SMD inductor and a base for the SMD inductor | |
| JP2516394Y2 (en) | Semiconductor device | |
| US20080111251A1 (en) | Method of manufacturing an electronic component comprising an integrated circuit and a winding assembly | |
| JPH07307408A (en) | Ic package and its assembling method | |
| JPH0250404A (en) | Chip-type inductor | |
| JP2773707B2 (en) | Manufacturing method of hybrid integrated circuit device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20060811 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20081212 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20081224 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090130 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090227 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090416 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20090529 |