JPH1126648A - Semiconductor device and lead frame thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To allow the package to be small and improve the stability and reliability by sealing it with protrusion end faces exposed from the surface of a seal resin, and mounting outer terminals on the exposed end faces. SOLUTION: Bumps 10 are provided on inner leads 4, the element surface of a chip 1 is adhered to the back sides of the leads 4 through adhesives 3, the leads 4 are electrically connected to electrodes of a chip 1 through Au or other wires, the chip and inner leads are sealed with a resin so as to expose one main surface of the bump 10, and solder balls 6 are mounted on the one main surface of the bump 10. As no Dp processing is applied to the leads 4, there is no variation of the steps between the leads 4 and lead terminals. Thus a more small size product can be obtained, than a small package using a lead frame and lead terminals can be stably exposed after resin sealing.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, and more particularly, to a resin-encapsulated semiconductor device in which solder balls serving as external terminals are arranged in a lattice on a bottom surface.

[0002]

2. Description of the Related Art A conventional resin-sealed semiconductor device of this type will be described with reference to FIG. FIG. 6A is a sectional view,
FIG. 6B is a plan view seen from the terminal surface side (back surface side). FIG. 6A is a cross-sectional view taken along line AA ′ of FIG. 6B.

Referring to FIG. 6, this semiconductor device uses a lead frame which has been subjected to a Dp (dimple) process, which is a process for lowering the tip of an internal lead 4 by one step. Then, the chip 1 is fixed to the back surface of the Dp-processed lead frame (also referred to as an “unland portion”) via an adhesive 3, and the lead for connecting the internal lead 4 and the pad 7 to the wire 7 is on the chip. LOC (Lead on Ch
The sealing is performed so that the terminal portion 14 is exposed from the resin 2.

In this case, since the lead frame is subjected to the Dp processing, a scar of the mold at the time of the processing is applied to the internal lead 4 in the vicinity of the Dp processing portion 13, so that it is necessary to lengthen the internal lead 4. In addition, due to the spring back of the Dp processing part 13, the terminal part 14 easily floats on the Dp processing part side with respect to the plane, and resin burrs easily emerge on the surface of the terminal part 14 during resin sealing.

Further, since the terminal portions 14 are arranged at the package end, the terminals can be arranged only in one line on one side. Therefore, the package length is determined by the number of terminals and the terminal pitch, and the package becomes large with respect to the chip size. was there.

In addition, when this conventional semiconductor device is mounted, the distance between the package and the mounting board is only the amount of solder paste at the time of mounting, and it is difficult to reduce the stress after mounting.
There is also a problem that cracks occur in the mounting portion and open defects occur.

Next, another conventional semiconductor device will be described with reference to FIG. FIG. 7 shows a semiconductor device which is miniaturized by performing resin sealing using a film carrier, and shows a configuration proposed in Japanese Patent Application Laid-Open No. 5-82586.

Referring to FIG. 7, in this semiconductor device, in order to reduce the size of a package, a chip 1 is connected to a film carrier 16 on which bumps 10 are formed, and a wiring 17 is provided on the film carrier 16. And is connected to the protruding pad 18 through the via hole 19.

In this case, paying attention to assembling materials, if a through hole such as a via hole is provided by using a film carrier, the cost is ten times or more as compared with a lead frame.

Next, regarding the assembly, the conventional SOP (Sm
Because the internal structure is different from resin-encapsulated semiconductor devices that use lead frames such as all outline packages, it is impossible to share existing equipment, special equipment must be introduced, and assembly costs are large. There was a problem that it becomes high. In addition, as the same, Japanese Patent Application Laid-Open No. 7-3
Japanese Patent Application No. 21157 proposes a semiconductor device using a film carrier having a chip size substantially equal to a package size.

[0011]

As described above,
The conventional semiconductor device has the following problems.

As a first problem, the conventional semiconductor device described with reference to FIGS. 6 and 7 has a large chip size and can assemble only a chip with a small number of pins. It is difficult to realize. In addition, it is difficult to stably expose the lead terminals during encapsulation.

[0013] The reason is that the lead frame is subjected to Dp processing, and the lead terminals extending outside the package can be arranged only in a single row. Further, the processing accuracy and stability of the Dp processing are required.

A second problem is that a tape (film carrier) type, such as the conventional semiconductor device described with reference to FIG. 8, has a high assembling cost.

The reason is that conventional assembly equipment cannot be shared. Also, the material and processing cost of the tape film carrier material itself is high.

Accordingly, the present invention has been made in view of the above problems, and an object of the present invention is to reduce the size of a package close to a chip size, and to improve stability and reliability. It is an object of the present invention to provide a resin-encapsulated semiconductor device which is improved, and which can preferably utilize a conventional assembly line as it is and which avoids an increase in cost.

[0017]

In order to achieve the above object, in a semiconductor device according to the present invention, a semiconductor element (hereinafter referred to as a "chip") is fixed to one surface of an internal lead of a lead frame via an adhesive. In a semiconductor device in which electrode terminals of the chip (hereinafter referred to as "pads") and the internal leads are electrically connected by wires and sealed with a resin, a surface of the internal leads fixed to the chip with the adhesive. A projection is provided on the opposite side to the projection, and the projection end face is sealed so as to be exposed from the surface of the sealing resin, and an external terminal is attached to the exposed projection end face.

Further, according to the present invention, a semiconductor element (hereinafter, referred to as "chip") is fixed to one surface of an internal lead of a lead frame via an adhesive, and an electrode terminal (hereinafter, referred to as "pad") of the chip is connected to the chip. In a lead frame used for a semiconductor device which is electrically connected to an internal lead with a wire and sealed with a resin, a metal foil is formed on a surface of the internal lead opposite to a surface fixed to the chip with the adhesive. A projection is provided by punching and punching the metal foil on the surface of the internal lead.

[Operation] The operation of the present invention will be described. In the present invention, a protrusion is provided on the upper surface of the internal lead of the lead frame, and the lead frame is subjected to Dp processing in order to seal the protrusion with a resin. No need for D
Since the margin for processing p is unnecessary and the protrusions can be arranged in a plurality of rows, the package is smaller than before.

In addition, a conventional LO is used by using a lead frame.
Since the C assembly line can be used, material costs and assembling costs are greatly reduced as compared with a small tape (film carrier) type package.

[0021]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a view showing the configuration of an embodiment of the present invention. FIG. 1 (a) is a sectional view, and FIG. 1 (b) is a plan view seen from the solder ball mounting surface side. (A) is FIG.
It is sectional drawing of the AA line of (b).

Referring to FIG. 1, in the embodiment of the present invention, a projection 5 is provided on an internal lead 4, and is bonded to the element surface of the chip 1 using an adhesive 3 on the back side of the projection. After the pad 20 and the internal lead 4 are electrically connected via the, the projection 5 is sealed so as to be exposed from the surface of the resin 2, and the solder ball 6 is attached to the exposed projection 5. .

Since the wire bonding is performed on the protrusion 5 side, the height of the protrusion 5 is set to be equal to or higher than the wire height in order to prevent wire exposure. Further, in order to perform stable bonding, the height of the projection is desirably 10 μm or more.

As shown in FIG. 1, in the embodiment of the present invention, terminals can be arranged in a plurality of rows on one side. For example, in the case of two rows on one side, if the terminal pitch is the same as compared to the single row arrangement, It can have twice the number of terminals, and if the number of terminals is the same, the total length of the package can be reduced to about half. Therefore, as compared with a conventional small package using a lead frame, a resin-sealed semiconductor device having a smaller size and more terminals can be realized.

In the case where the resin-sealed semiconductor device according to the embodiment of the present invention is mounted, the height of the solder paste and the solder ball is between the mounting substrate and the semiconductor device. There is an effect of reducing the stress applied to the later mounted portion, and it is also possible to prevent cracks from being generated in the mounted portion.

Next, since the resin-encapsulated semiconductor device according to the embodiment of the present invention employs a LOC structure using a lead frame, an assembly used in a conventional semiconductor device having a LOC structure or the like. Line equipment can be shared as it is. Therefore, there is no need to introduce special equipment such as a tape (film carrier) type, and assembly can be performed at an assembly cost equal to or less than that of a resin-encapsulated semiconductor device using a conventional lead frame. .

In the embodiment of the present invention, the number of steps for mounting the solder ball is increased as compared with the steps such as the SOP.
No lead forming step is required, and the number of steps is not different from the conventional one.

Next, a method of manufacturing the resin-sealed semiconductor device according to the embodiment of the present invention will be described.

A lead frame similar to that of a conventional resin-encapsulated semiconductor device having at least internal leads is prepared, and projections are formed at predetermined positions on the internal leads. As a method of forming the protrusion, a method of pressing a metal piece into a protrusion, a method of bonding a solder ball, and the like are performed.

Next, a three-layer tape in which a single layer of adhesive or an insulating tape is applied to both sides of an insulating tape is attached to the surface opposite to the surface on which the protrusions of the internal leads are formed. These adhesive layers can be the same as those used for a conventional LOC structure lead frame, and at this time, the lead frame according to the embodiment of the present invention is replaced with the conventional adhesive layer. It has almost the same structure as the attached LOC structure lead frame except that it has a protrusion on the surface opposite to the surface with the adhesive layer.

Next, as shown in FIG. 1, similarly to a conventional lead frame having a LOC structure, the element surface of the semiconductor chip 1 is applied to the inside of the lead frame via an adhesive 3 with respect to a lead frame provided with an adhesive layer. The electrodes 20 of the semiconductor chip 1 and the internal leads are bonded to the leads 4 by wires 7. The internal leads 4 are previously plated with Ag, Au, or the like in consideration of wire bonding.

Next, similarly to the conventional method of manufacturing a resin-encapsulated semiconductor device, the chip 1, the internal leads 4 and the like are resin-encapsulated with the epoxy resin 2 and the like at the same time as being formed on the lead frame by transfer molding. One main surface of the protrusion 5 is exposed from the resin 2.

Then, the resin surface is stamped, solder balls 6 are mounted on the exposed surfaces of the projections 5 by a reflow method or the like, and the outer shape of the semiconductor device is cut off with a mold or the like, separated from the lead frame, and separated from the lead frame. Is performed to complete the semiconductor device.

[0035]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a block diagram showing an embodiment of the present invention;

[First Embodiment] FIG. 2 is a diagram showing a configuration of a first embodiment of the present invention. With reference to FIG. 2, a first embodiment of the present invention
0 is provided, the element surface side of the chip 1 is adhered to the back surface side of the internal lead via an adhesive 3, and the electrode of the chip 1 and the internal lead 4 are electrically connected by a wire made of Au or the like. The chip, internal leads, and the like are sealed with resin so that one main surface of the bump 10 is exposed, and the solder ball 6 is attached to the one main surface of the exposed bump 10.

Here, the bump 10 is formed to have a thickness of 100 μm or more so that the wire 7 is not exposed from the back surface of the resin.
Au or Ag in consideration of bondability on the bonding surface with the internal lead
It is desirable to provide a metal layer such as Au or a solder on the mounting surface of the solder ball in consideration of solderability.

Next, a method of manufacturing the semiconductor device according to the first embodiment of the present invention will be described.

A lead frame having at least an internal lead provided with a bump as a projection on one surface and an adhesive layer on the opposite surface is prepared. Next, as shown in FIG.
Internal leads 4 are attached to the element surface of chip 1 via adhesive 3.
After bonding the electrodes of the chip 1 and the internal leads 4 with the wires 7, the bumps 10 are sealed with the resin 2 so that one main surface is exposed. Next, the semiconductor device is completed through a stamping process, a process of attaching the solder balls 6 to the exposed bumps 10, a process of cutting the outer shape of the semiconductor device to separate it from the lead frame, an electrical sorting process, and the like.

Here, the bump 10 is formed by a punched bump method in which a metal foil is punched out with a die punch and simultaneously pressed against a predetermined position of an internal lead. By selecting a metal foil, there is an advantage that a single material such as Cu or Au or a composite material such as Cu in which solder is formed on both surfaces can be freely selected. In this case, a single material such as Cu can be used, but the surface of the bump to be pressed against the internal lead surface is plated with Au, Ag or the like in consideration of the pressure resistance, and the solder ball 6 is pressed.
The surface of the bump 10 to which the solder is attached may be made of a composite material such as Cu or a 42 alloy plated with Au or solder in consideration of solderability. Further, only one of these platings may be used, and the plating may be formed by a method using a metal foil clad material other than the plating.

Further, in the first embodiment of the present invention, since the bump is formed by wiping the metal foil, the bump height can be freely selected by selecting the thickness of the metal foil. There is also an advantage that there is little variation in the thickness, and there is also an operational effect that there is little occurrence of resin burrs when one main surface of the bump is exposed during resin sealing.

In the first embodiment of the present invention, except for the projections, the same material as that of the conventional resin-encapsulated semiconductor device is used, and the adhesive for bonding the internal lead and the chip is formed of the conventional LOC structure. Using an adhesive based on the same thermosetting resin or thermoplastic resin as the lead frame,
A single layer of adhesive or a three-layer tape in which the above adhesive is applied to both sides of an insulating tape such as polyimide is used. Also,
The lead frame forming the internal leads can also be manufactured by a conventional etching method or press method without special processing.

Second Embodiment Next, a second embodiment of the present invention will be described. FIG. 3 is a sectional view showing the configuration of the second embodiment of the present invention.

Referring to FIG. 3, in a second embodiment of the present invention, a semiconductor device in which a projection on an internal lead 4 is formed of a core ball 8 made of a metal such as Cu as a core and the periphery of which is coated with solder or the like. FIG. Attachment of the core ball to the internal lead is performed via solder coated on the core. In consideration of solderability, it is desirable to apply a metal such as Au or solder to the core ball attachment portion on the internal lead by plating or the like.

In order to secure the height of the wire 7, it is desirable to use a core ball 8 having a diameter of 100 μm or more.

In this embodiment, there is an advantage that the core of the core ball 8 is made of a hard material, so that the height of the core ball as the projection is stable and the projection can be formed on all the projections at the same time. .

[Embodiment 3] FIG. 4 is a sectional view showing the structure of a third embodiment of the present invention. Referring to FIG. 4, in a third embodiment of the present invention, the protrusions are
1 is formed. Before bonding, a conductive paste such as a Cu paste or an Ag paste is printed on the internal leads 4 by screen printing or the like, and cured by reflow or the like to form protrusions.

[Embodiment 4] FIG. 5 is a sectional view showing the structure of a fourth embodiment of the present invention. Referring to FIG. 4, in the fourth embodiment of the present invention, the projection is formed by pressing the internal lead 4 and providing a projection. Pressing portions 12, such as bending and drawing, are provided with a press-formed portion 12 on a part of the internal lead 4 to form a projection. By performing it together with the press processing of the lead frame pattern,
An inexpensive lead frame with a projection can be provided.

[0049]

As described above, according to the present invention, the following effects can be obtained.

The first effect of the present invention is that, compared to a conventional small package using a lead frame, the size can be further reduced and the lead terminals can be stably exposed after encapsulating the resin.

The reason is that, in the present invention, since the internal leads are not subjected to Dp processing, there is no variation in the level difference between the internal leads and the lead terminals.

A second effect of the present invention is that material costs and assembly costs can be significantly reduced.

The reason is that, unlike the tape type, a lead frame is used in the present invention, and the conventional assembly equipment can be shared.

[Brief description of the drawings]

FIG. 1 is a diagram showing a configuration of an embodiment of the present invention;
(A) is a sectional view, and (b) is a plan view.

FIG. 2 is a sectional view showing a configuration of a first exemplary embodiment of the present invention.

FIG. 3 is a sectional view showing a configuration of a second exemplary embodiment of the present invention.

FIG. 4 is a sectional view showing a configuration of a third exemplary embodiment of the present invention.

FIG. 5 is a sectional view showing a configuration of a fourth embodiment of the present invention.

6A and 6B are diagrams showing a configuration of a conventional resin-sealed small semiconductor device, wherein FIG. 6A is a cross-sectional view and FIG. 6B is a plan view.

FIG. 7 is a cross-sectional view showing the configuration of another conventional small semiconductor device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Chip 2 Resin 3 Adhesive 4 Internal lead 5 Projection 6 Solder ball 7 Wire 8 Core ball 9 Conductive adhesive 10 Bump 11 Conductive paste 12 Press processing part 13 Dp processing part 14 Terminal part 15 Electrode 16 Film carrier 17 Wiring 18 Projecting pad 19 Via hole 20 Pad

Claims (9)

[Claims] A semiconductor element (hereinafter, referred to as "chip") is fixed to one surface of an internal lead of a lead frame via an adhesive, and electrode terminals of the chip (hereinafter, referred to as "pads").
And a resin device which is electrically connected to the internal lead with a wire and sealed with a resin. The semiconductor device further comprises a protrusion on a surface of the internal lead opposite to a surface fixed to the chip with the adhesive. A resin-encapsulated semiconductor device, wherein the protrusion end surface is sealed so as to be exposed from the surface of a sealing resin, and an external terminal is attached to the exposed protrusion end surface. 2. A semiconductor element (hereinafter, referred to as "chip") is fixed to one surface of an internal lead of a lead frame via an adhesive, and an electrode terminal of the chip (hereinafter, referred to as "pad").
And a lead frame used in a semiconductor device which is electrically connected to the internal lead with a wire and sealed with a resin, wherein the internal lead has a surface opposite to a surface fixed to the chip with the adhesive, A lead frame comprising a projection formed by punching a metal foil and pressing the metal foil onto the surface of the internal lead by a punching bump method. 3. A semiconductor element (hereinafter, referred to as "chip") is fixed to one surface of an internal lead of a lead frame via an adhesive, and an electrode terminal of the chip (hereinafter, referred to as "pad").
And a lead frame used in a semiconductor device which is electrically connected to the internal lead with a wire and sealed with a resin, wherein a surface of the internal lead opposite to a surface fixed to the chip with the adhesive is Cu A lead frame provided with a projection formed by attaching a core ball coated with solder or the like using a metal such as a core as a core. 4. A semiconductor element (hereinafter, referred to as "chip") is fixed to one surface of an internal lead of a lead frame via an adhesive, and an electrode terminal of the chip (hereinafter, referred to as "pad").
And a lead frame used in a semiconductor device formed by electrically connecting a resin to the internal lead with a wire and sealing with a resin. A screen is provided on a surface of the lead frame opposite to a surface fixed to the chip with the adhesive. C using printing
A lead frame comprising a projection formed by a metal paste such as a u paste. 5. A projection on the surface of the internal lead is formed by a punching bump method, and one surface of the projection is formed with a metal film of Au, Ag, or the like in consideration of the pressure bonding property with the internal lead. 3. The lead frame according to claim 2, wherein a metal film such as Au or solder is formed on the other surface in consideration of solderability. 6. A semiconductor element (hereinafter, referred to as "chip") is fixed to one surface of an internal lead of a lead frame via an adhesive, and an electrode terminal of the chip (hereinafter, referred to as "pad").
And a lead frame used in a semiconductor device which is electrically connected to the internal lead with a wire and sealed with a resin. The lead frame has a convex shape in a direction opposite to a side of the internal lead fixed to the chip with the adhesive. A lead frame, comprising: a projection formed by using a press working technique such as drawing and bending. 7. A resin-sealed semiconductor device using the lead frame according to any one of claims 2 to 6. 8. The resin-encapsulated semiconductor according to claim 1, wherein the protrusion is made of one of a bump, a core ball joined to the internal lead by a conductive resin, and a conductive pace. apparatus. 9. The resin-encapsulated semiconductor device according to claim 1, wherein said projection is formed by mechanically processing said internal lead.