JPH0863567A - Ic card module - Google Patents

Abstract

PURPOSE: To supply an IC card module at a low cost. CONSTITUTION: After a conductive adhesive is supplied on the leads 3 of a terminal substrate 4 and an insulating epoxy sealing resin 12 is supplied to the center of an IC mounting part, an IC chip 5 is mounted by positioning the leads 3 and the pad of the IC chip 5 and the resin being the same as the epoxy sealing resin 12 in the hardening processing condition of the conductive adhesive 11 is used so that process is constituted of a processing where the conductive adhesive 11 and the sealing resin 12 are hardened by fixed time heating in a low temp. furnace in a same state. The respective leads drawn from the respective terminal parts for connection with an external part and the connecting part of the IC chip 5 are arranged on a concentric circle. Thus, the IC card module with more strength can be provided at a low cost.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is for an IC card used for an IC card in which an IC chip for storing and processing information is mounted inside a card base made of a synthetic resin and an input / output terminal is exposed on the surface. Regarding modules.

[0002]

2. Description of the Related Art In recent years, the demand for IC cards is expanding as a substitute for magnetic stripe cards because of the need for security. Currently the thickness of the IC card is 0.76m
m to 0.84 mm is standardized, and the IC module mounted on this card is usually required to have a total thickness of 0.6 mm or less.

Conventionally, as shown in FIG. 8, a module used for an IC card has a terminal 2 formed by a conductor pattern on one side of a substrate 1 made of glass-epoxy, paper-epoxy, paper-phenol, polyimide or the like, and a conductor pattern on the other side. Leads 3 are formed, and the terminals 2 and the leads 3 are connected to each other by through holes. The IC chip 5 is bonded to the lead 3 formation surface of the terminal board 4 by the adhesive 6, and the bonding wire 10 such as Au wire is used. Pad part of IC chip 5 and lead 3
The structure is such that the outer peripheral surface side of the IC chip 5 is sealed with an insulating sealing resin 7 such as an epoxy resin after making a connection for electrical communication with. However, used in this structure,
Regarding the thickness of the terminal board 4, the base material having a thickness of 0.1 mm and the upper and lower conductor patterns having a thickness of 0.05 mm are the thinnest and are currently available. The adhesive thickness between the IC chip 5 and the base material is 0.05 mm, the bonding wire processing portion on the upper part of the IC chip 5 is 0.15 mm, and the remaining thickness is 0.2.
mm is the thickness given to the IC chip 5. It is difficult to manufacture the IC chip 5 with this thickness, and a large-sized (4 mm square to 6 mm square) IC chip having a large storage capacity has poor mechanical strength after mounting and is unusable. Therefore, as shown in FIG. 9, the IC chip 5 mounting portion of the terminal substrate 4 is seated to increase the thickness of the IC chip 5 to 0.3 mm.
However, this structure has a drawback that the strength of the terminal board 4 becomes weak and a cost becomes high. Therefore, as a method for making the thickness of the IC chip 5 thicker than in the past, a mounting method of mounting the circuit surface toward the terminal substrate side has been studied.

[0004]

However, in the mounting method of mounting with the circuit surface facing the terminal board side, there was a very difficult part in the manufacturing process, that is, the pad of the IC. After the step of joining the portion and the lead portion of the terminal substrate with the conductive adhesive or the solder bump, peeling of the joined portion occurs until the resin sealing step is completed. This is because in an IC for an IC card, the number of bump connecting parts is as small as 5 to 8 places compared to the chip shape, the total bonding area is only 0.1 mm 2, and the fixing strength is very weak. It is necessary to pay close attention to the transportation to the sealing step, and a sealing method is required in which mechanical stress is not applied to the IC even in the sealing step. For this reason, the product yield is low and the cost is high, and it has not been put to practical use as a module for an IC card.

The present invention has been made to solve such a problem, and proposes a low-cost IC card module with a good yield, and an object thereof is to supply the IC card module at a low cost. .

[0006]

SUMMARY OF THE INVENTION The present invention is a method of manufacturing an IC card module in which the IC chip is mounted with the circuit surface of the IC chip facing the terminal board. After a fixed amount of insulating epoxy sealing resin is supplied to the center of the IC mounting part, the IC chip is mounted by aligning the lead with the pad of the IC chip, and the epoxy sealing resin and the conductive adhesive are cured. By using the same processing conditions, there is a step of heating the conductive adhesive and the encapsulating resin at the same time for a fixed time while maintaining the same condition. By this, the terminals and the IC chip are electrically connected. At the same time, the substrate and the IC chip are mechanically joined with a sealing resin with sufficient strength. An energization joint between the lead and the IC chip, which is provided from each terminal 2 portion provided on the terminal board and connected to the outside, is arranged on the circumference centered on the center of the IC chip, and the central portion The sealing resin supplied in a fixed amount spreads in a circle by mounting the IC chip to the position immediately before the joint, which allows mechanical coupling near the joint for energization. The energizing joint will not come off during transportation.

[0007]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view of a first embodiment of an IC card module using the present invention. The terminal board 4 has terminals 2 for external power supply and signal input / output on the bottom surface, leads 3 formed on the top surface by a conductor pattern, and the terminals 2 and the leads 3 are connected by through holes 8. It is made of glass-epoxy, paper-epoxy, paper-phenol, polyimide or the like. There is an air gap under the terminal board 4
The chip is mounted, and the pad 9 of the IC chip 5 is arranged concentrically with the center of the IC chip 5 as shown in FIG. An electrically conductive adhesive 11 made of epoxy resin kneaded with silver or an aluminum ferrule is used for electrical connection, and a gap between the IC chip 5 and the terminal substrate 4 is filled with a sealing resin 12. FIG. 2 is a sectional view of a second embodiment of an IC card module using the present invention. The IC chip 5 is 0.03m with 9 pads removed.
It is covered with an insulating film 13 made of polyimide of about m. The pad 9 is directly electrically connected to the lead 3 by a conductive adhesive 11. According to these embodiments, the thickness of the IC chip 5 can be increased to 0.35 mm.

A method of manufacturing the IC card module according to the present invention will be described. The initial terminal board has a strip or reel shape, and the terminals 2 are arranged at a constant pitch. An initial strip-shaped terminal board 14 is shown in FIG.
Leads 3 for electrically connecting with the IC chip 5 are provided on the back surface so as to correspond to the terminals 2.
And the lead 3 are connected by a through hole 8. As shown in FIG. 4, the leads 3 are arranged on a concentric circle centered on the center of the IC chip mounting portion A. In the first step, the initial terminal board 14 is set on a flat plate base with the terminal 2 as the lower surface, and the conductive adhesive 11 is placed on the leads 3.
However, the insulating epoxy sealing resin 12 is quantitatively supplied to the center of the IC mounting portion. The shape at the end of the first step is shown in FIG. In the second step, the IC chip 5 is mounted with its position aligned. The supply amount of the epoxy sealing resin 12 in the first step is controlled by mounting the IC chip 5 so as to fill the gap between the IC and the initial terminal board 14 to the position just before the joint for electrical communication. As the third step, the conductive adhesive 11 and the sealing resin 12 are cured by heating in that state for a constant time of 100 to 200 degrees in that state. The epoxy-based sealing resin 12 and the conductive adhesive 11 are used under the same curing treatment conditions. The epoxy-based encapsulating resin 12 has a property of temporarily lowering the viscosity due to heating, and at the time when the viscosity decreases due to heating, the encapsulating resin 12 is applied to the circuit surface of the IC chip 5 and the terminal substrate, and the IC chip 5 becomes Uses a force that narrows the gap between the terminal boards. This allows the IC chip 5
While the bumps 10 are pressed against the leads 3 of the terminal board, the curing of the epoxy-based encapsulating resin and the conductive adhesive proceeds, and the bonding of the leads 3 and the bumps 10 is ensured, and the IC chip mounting board with a stable total thickness is obtained. Become. The shape at the end of the third step is shown in FIG. As the fourth step, the low-viscosity sealing resin 15 is poured into the gap between the IC chip 5 and the terminal board 14 from the side surface. In the fifth step, the sealing resin 15 poured from the side surface is cured. By the fourth and fifth steps, the electrical connection between the IC chip 5 and the terminal board 14 is more firmly connected to the external force than being covered with the sealing resin 15, and the circuit surface of the IC chip 5 and the electrical connection. Protection from the open air environment. The shape at the end of the fifth step is shown in FIG. In a sixth step, the terminal board 4 is die-cut from the initial terminal board 14 to remove the IC.
It becomes a module for cards.

[0009]

As is clear from the above description, by adopting the IC pad and lead arrangement and the sealing process according to the present invention, the surface mounting of the IC for the IC card having a small number of pads with respect to the size of the chip can be achieved. As a result, it is possible to use a thicker IC chip than the conventional wire bond manufacturing method, and it is possible to provide a module for an IC card that is low in cost and stronger.
In addition, since the mounting area is reduced, it is possible to mount a large area IC chip having a larger storage capacity.

[Brief description of drawings]

FIG. 1 is a first IC card module according to the present invention.
3 is a cross-sectional view of the embodiment of FIG.

FIG. 2 is a second IC card module according to the present invention.
3 is a cross-sectional view of the embodiment of FIG.

FIG. 3 is a plan view showing a strip-shaped initial terminal board used for manufacturing an IC card module according to the present invention.

FIG. 4 is a plan view showing a lead portion arrangement shape of an initial terminal board.

FIG. 5 is a cross-sectional view showing a cross-sectional shape at the end of the first step of the method for manufacturing an IC card module according to the present invention.

FIG. 6 is a sectional view showing a sectional shape at the end of the third step of the method for manufacturing an IC card module according to the present invention.

FIG. 7 is a cross-sectional view showing a cross-sectional shape at the end of the fifth step of the method for manufacturing an IC card module according to the present invention.

FIG. 8 is a sectional view of a conventional IC card module.

FIG. 9 is a sectional view of a conventional IC card module.

[Explanation of symbols]

 1 Base Material 2 Terminal 3 Lead 4 Terminal Board 5 IC Chip 6 Adhesive 7 Sealing Resin 8 Through Hole 9 Pad 10 Bump 11 Conductive Adhesive 12 Sealing Resin 13 Bonding Wire 14 Initial Terminal Board 15 Sealing Resin

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI technical display location H01L 23/04 B

Claims (2)

[Claims] 1. An IC card module housed in a recess provided in a card, which has a terminal portion for connecting the IC chip to the outside and a lead pattern for connecting the IC chip, In an IC card module in which a circuit surface of an IC chip is mounted toward a lead pattern of the terminal board, a conductive adhesive is applied on the lead pattern of the terminal board, and a terminal board surface on which the IC chip is mounted is A sealing resin having the same curing treatment condition as that of the conductive adhesive is applied, the pads of the IC chip are mounted on the conductive adhesive, and the circuit surface of the IC chip is mounted on the sealing resin. A module for an IC card, wherein the conductive adhesive and the sealing resin are heated and cured at the same time. 2. The joint between each lead and each pad of the IC chip, which are routed from each terminal portion provided on the terminal board for connecting to the outside, is near the circumference centered on the center of the IC chip. A module for an IC card, which is arranged in