CN206505715U

CN206505715U - A kind of active SMD electromagnetic buzzers of MEMS

Info

Publication number: CN206505715U
Application number: CN201720124366.9U
Authority: CN
Inventors: 周鸣放
Original assignee: Dongcun Electronics Co Ltd Changzhou
Current assignee: Dongcun Electronics Co Ltd Changzhou
Priority date: 2017-02-11
Filing date: 2017-02-11
Publication date: 2017-09-19
Anticipated expiration: 2027-02-11

Abstract

The utility model is related to a kind of active SMD electromagnetic buzzers of MEMS, including outer casing upper cover, vibrating diaphragm, package header and electromagnetic drive component, the outer casing upper cover cooperatively forms working chamber with package header, described vibrating diaphragm and electromagnetic drive component is arranged in working chamber, also include asic chip and lead frame, the dowel that the lead frame is electrically connected for several with asic chip pin and electromagnetic drive component formation；The asic chip and lead frame are as the integral compression molding of inserts inside the package header.The utility model is combined by asic chip and integrated antenna package technology with single line bag electromagnetic buzzer manufacturing process, by transboundary integrating, produces excellent performance, the buzzer being more miniaturized.

Description

A kind of active SMD electromagnetic buzzers of MEMS

Technical field

The utility model is related to the manufacturing field of electromagnetic buzzer, specifically discloses a kind of active SMD electromagnetism of MEMS Formula buzzer.

Background technology

Electromagnetic buzzer is by magnet coil to change magnetic field sounding the audio signal of alternation, so as to promote metal Diaphragm sends a kind of electro-acoustic element of buzz.It is widely used in various portable, portable instrument and meters, various electrical equipment, does Standby, automotive electronics, digital product, electronic lock, smart home and the Internet of Things field of postulating play prompting and warning function.With The raising of electronic product automatic assembling degree and electronic product more tend to be portable, miniaturization direction is developed, SMD surfaces The market demand for mounting electromagnetic buzzer is also increasing, and market prospects are very good.

It is that 8.5*8.5 is highly 4.0mm, 7.5*7.5 that current passive SMD electromagnetic buzzers, which have evolved to minimum dimension, It is only highly 2.0mm highly for 2.5mm, 5.0*5.0 and 4.0*4.0, technique and structure have reached its maturity.And active SMD electricity Magnetic-type buzzer be by electronic component or integrated circuit composition concussion drive circuit be welded on above pcb board, then again with branch Frame, magnet coil, annulus magnetic core, vibrating diaphragm, shell and pin are assembled；Another method is special referring to Chinese utility model The sharp patent No. 201610707726.8, being welded in electronic component or integrated circuit on metallic support by microdot described in it Face, then with thermosetting plastics injection molding integrated base, enters then at support coil, annulus magnetic core, vibrating diaphragm shell Row assembling, efficiency of assembling and reliability increase.But the common defects of two kinds of implementations are still unavoidable by many The limitation of individual electronic component or integrated circuit body appearance and size and wiring spacing, the volume of whole product can not be with existing nothing Source SMD electromagnetic buzzer size compatibilities, profile diameter is in 12mm and 9mm, highly in 5 more than mm；Also it is limited in electricity Source two pins of positive pole VDD and negative pole GND, which switch on power, to be sent out continuant the primary stage, it is impossible to realize new application function.And Although existing passive SMD electromagnetic buzzers size is very small, needed in products application it is additional it is some driving and Protection element, is also the increase in electronics applications cost and assembling space.So, existing SMD electromagnetic buzzers can not Further meet the small size of electronic product, miniaturization, intelligentized demand.

Utility model content

The purpose of this utility model is：A kind of active SMD electromagnetic buzzers of MEMS are provided to solve problem above, are The encapsulation technology of asic chip and SMD integrated circuits is combined with passive SMD electromagnetic buzzers manufacturing process, by across Section, transboundary integrate, produce the miniature integrated active SMD electromagnetic buzzers of excellent performance, volume.

One of technical scheme that the utility model is used is such：

A kind of active SMD electromagnetic buzzers of MEMS, including outer casing upper cover, vibrating diaphragm, package header and electromagnetic drive Component (including support, coil and magnet ring), the outer casing upper cover cooperatively forms working chamber, described vibrating diaphragm with package header Be arranged at electromagnetic drive component in working chamber, in addition to asic chip and lead frame, the lead frame for several with The dowel that asic chip pin and electromagnetic drive component formation are electrically connected；The asic chip and lead frame are used as inserts one Compression molding is inside the package header.

Further, the asic chip is bonded on the chip tray of lead frame by conducting resinl, with the lead Connected between framework by metal wire.

Further, ailhead metal salient point is formed on the asic chip, conduction is coated with the lead frame The position of glue carries out contraposition bonding, and formation is electrically connected.

Further, the dowel that the lead frame is connected with electromagnetic drive component is exposed in working chamber.

Further, the asic chip has four pins, respectively positive source, power cathode, output pin and enable Pin, wherein enable pin can be connected with single-chip microcomputer formation communication, (asic chip concrete structure principle is referring to Chinese utility model patent The patent No. 201520608561.9).

Further, the part dowel of the lead frame by mould punching into " L " or " J " type outside stitch.

In summary, due to using above-mentioned technical proposal, the beneficial effects of the utility model are：

1st, it is combined using the accessory of advanced integrated antenna package technology and existing passive SMD buzzers, manufacturing process, It is entirely capable of meeting the low requirement of scale, automation, high efficiency, cost；

2nd, the appearance and size of MEMS electromagnetic buzzers can almost accomplish as existing passive SMD electromagnetic buzzers It is ultimate attainment, further meet electronic product miniaturization, the assembling demand of automation；

3rd, peripheral control components are saved, directly communication interface can be set up with single-chip microcomputer, further reduce electronic product Assembling space, reduce product use cost；

4th, the asic chip used can be derived from the Chinese utility model patent patent No. 201520608561.9, the core Piece can make the pronouncing frequency control errors of MEMS electromagnetic buzzers ± 1, and lowest starting voltage reaches 1.2V.

Brief description of the drawings

Fig. 1 is a kind of example structure figure of the utility model；

Fig. 2 is another example structure figure of the utility model；

Fig. 3 is lead frame shown in Fig. 1 and chip connecting structure figure；

Fig. 4 is lead frame structure figure shown in Fig. 2；

Fig. 5 is utility model works mucosal structure top view；

Fig. 6 is the utility model chip and buzzer catenation principle figure.

Embodiment

The utility model is described in further detail with reference to the accompanying drawings and examples.

As shown in Figure 1-2, the active SMD electromagnetic buzzers of a kind of MEMS, including outer casing upper cover 1, vibrating diaphragm 2, shell Pedestal 3 and electromagnetic drive component 4, the outer casing upper cover 1 cooperatively form working chamber 5, described vibrating diaphragm 2 with package header 3 It is arranged at electromagnetic drive component 4 in working chamber 5,

Also include asic chip 6 and lead frame 7, the described asic chip 6 there are four pins (such as Fig. 6), respectively For positive source GND, power cathode VC, output pin OUT and enable pin EN, connect wherein enabling pin and can be communicated with single-chip microcomputer formation Connect.

The lead frame 7 is 5 dowels being electrically connected with the pin of asic chip 6 and the formation of electromagnetic drive component 4 (as schemed 3 or Fig. 4)；4 pins of wherein 4 dowel corresponding A SIC chips 6, the company of the output pin of this 4 middle corresponding A SIC chips 6 Muscle is connect as medium, being electrically connected between asic chip 6 and buzzer electromagnetic drive component 4 is formed；5th dowel and buzzer electricity The coil 41 of Magnetic driving component 4 is connected, and meets the external power supply VDD of buzzer.

The dowel that the lead frame 7 is connected with electromagnetic drive component 4 is exposed in working chamber 5 (such as Fig. 5), i.e., one Asic chip 6 and the dowel of buzzer electromagnetic drive component 4 are connected as medium and another connects buzzer external power supply Dowel is exposed in working chamber 5.

The part dowel of the lead frame 7 is by mould punching into the outside stitch 8 of " L " or " J " type, and part is connected Muscle is specifically wherein 4, including 3 respectively with the positive source pin of asic chip 6, power cathode pin and enabling pin and being connected And 1 connect buzzer external power supply dowel.

The asic chip 6 and lead frame 7 as the integral compression molding of inserts inside the package header 3, it is right Asic chip 6 and lead frame 7 play a protective role, integral forming.

There are two kinds of connected modes optional between asic chip 6 and lead frame 7：

First, the asic chip 6 is bonded in by conducting resinl on the chip tray of lead frame 7, with the lead frame Connected between frame 7 by metal wire, metal wire can be spun gold, copper wire or other B alloy wires.

Second, it is convex to form 4 ailhead metals using FC (Flip-Chip) controlled collapsible chip connec-tion, on the asic chip 6 Point, 4 pins of corresponding A SIC chips 6 carry out contraposition viscous with the position for being coated with conducting resinl of the lead frame 7 respectively Knot, formation is electrically connected.

A kind of production technology of the active SMD electromagnetic buzzers of above-mentioned MEMS, comprises the following steps：

(1) lead frame 7 is molded：Chemical etching or mould punching are passed through using the copper or Cu alloy material of 0.1mm thickness Formed leadframe 7, can be with the lead frame 7 of N number of pattern matrix of the one-shot forming with positioning hole and dowel；

(2) asic chip 6 is handled, including 200-220um is thinned to the grinding of ASIC wafers, pass through veneer sawing machine point Cut to form single asic chip 6；

(3) asic chip 6 is connected with lead frame 7：By automatic die Bonder the chip of lead frame 7 tray center Asic chip 6, is then placed on conducting resinl, heated solidify afterwards by conducting resinl on point automatically by suction nozzle, asic chip 6 just by In the middle of the pallet for being firmly fixed to lead frame 7；Further, by automatic bonding equipment by the weld pad and lead of asic chip 6 The pad of framework 7 is electrically connected by metal lead wire；

Or automatically and continuously processed on the weld pad of each asic chip 6 by high speed bonding wire ball attachment machine using spun gold or copper wire Into nail-head metal salient point；Further, then corresponding with the ailhead metal salient point image of asic chip 6 metal lead wire frame 7 Silk screen or stencil printing conducting resinl is used above in pad locations；Further, fallen using the FC (Flip-Chip) for thering is image to be aligned Fixing and welding machine, asic chip 6 is overturn, and the conduction by the ailhead metal salient point of asic chip 6 and lead frame 7 is aligned by image Glue position carries out contraposition bonding, and its aligning accuracy must be controlled in ± 5um, then heating cure, forms reliable Ohmic contact；

(4) package header is molded：Using SMD integrated antenna package technologies, with transfer molding process by EMC epoxy resin molds Material is heated, and becomes fluid, and EMC epoxy molding materials then are squeezed into die cavity and by ASIC cores therein by pressurizeing Piece 6, metal wire (or bonded part of ailhead metal salient point) and lead frame 7 are embedded and played a protective role, and are crosslinked simultaneously Curing molding, as the buzzer package header 3 with certain structure external form；

(5) outside stitch 8 is molded：Carry out overall plating, lead frame 7 is by mould rib cutting into the outside of " L " or " J " type Stitch 8；

(6) coil is fixed：With reference to existing passive SMD electromagnetic buzzers manufacturing process, the support of coil 41 will be wound It is fixed to silica gel on the buzzer package header 3 of compression molding (in working chamber 5)；Further by the lead of coil 5 with drawing The exposed part progress microdot of wire frame 7, which welds to be formed, to be electrically connected；

(7) general components are installed：Gluing fixes magnet ring, installs vibrating diaphragm 2；Further surveyed in advance before capping Examination, deletes substandard product, and then gluing installs lid 1 on the upper case with sound hole, tested, printed after cured, Tape package, storage.

Preferred embodiment of the present utility model is the foregoing is only, it is all at this not to limit the utility model Any modifications, equivalent substitutions and improvements made within the spirit and principle of utility model etc., should be included in the utility model Protection domain within.

Claims

1. a kind of active SMD electromagnetic buzzers of MEMS, including outer casing upper cover, vibrating diaphragm, package header and electromagnetic drive group Part, the outer casing upper cover cooperatively forms working chamber with package header, and described vibrating diaphragm and electromagnetic drive component is arranged at work Make intracavitary, it is characterised in that：Also include asic chip and lead frame, the lead frame is several and asic chip pin The dowel being electrically connected with electromagnetic drive component formation；The asic chip and lead frame are as the integral compression molding of inserts in institute State inside package header.

2. the active SMD electromagnetic buzzers of a kind of MEMS according to claim 1, it is characterised in that：The asic chip It is bonded on the chip tray of lead frame, is connected between the lead frame by metal wire by conducting resinl.

3. the active SMD electromagnetic buzzers of a kind of MEMS according to claim 1, it is characterised in that：The asic chip On form ailhead metal salient point, carry out contraposition bonding with the position for being coated with conducting resinl of the lead frame, formation is electrically connected.

4. the active SMD electromagnetic buzzers of a kind of MEMS according to claim 1, it is characterised in that：The lead frame The dowel being connected with electromagnetic drive component is exposed in working chamber.

5. the active SMD electromagnetic buzzers of a kind of MEMS according to claim 1, it is characterised in that：The asic chip There are four pins, respectively positive source, power cathode, output pin and pin is enabled, wherein enabling pin can form logical with single-chip microcomputer News connection.

6. the active SMD electromagnetic buzzers of a kind of MEMS according to claim 1, it is characterised in that：The lead frame Part dowel by mould punching into " L " or " J " type outside stitch.