CN104701009A - Small-sized chip type surface mounting (SMD) high-voltage and safety standard recognized ceramic capacitor - Google Patents
Small-sized chip type surface mounting (SMD) high-voltage and safety standard recognized ceramic capacitor Download PDFInfo
- Publication number
- CN104701009A CN104701009A CN201510070008.XA CN201510070008A CN104701009A CN 104701009 A CN104701009 A CN 104701009A CN 201510070008 A CN201510070008 A CN 201510070008A CN 104701009 A CN104701009 A CN 104701009A
- Authority
- CN
- China
- Prior art keywords
- capacitor
- steel band
- ceramic
- smd
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention relates to a small-sized hip type surface mounting (SMD) high-voltage and safety standard recognized ceramic capacitor and a manufacturing method thereof. The capacitor comprises holosymmetrical copper electrode ceramic chips, a copper belt pin and an encapsulating material, wherein the holosymmetrical copper electrode ceramic chips are cylindrical; a ceramic medium is positioned between upper and lower electrodes which are integral copper electrodes; the copper belt pin is welded and fixed with the upper and lower electrodes; the encapsulating material is used for encapsulating the copper electrode ceramic chips and one part of the copper belt pin together, and the tail end of the copper belt pin is exposed out of the encapsulating material. The manufacturing method for the capacitor comprises the following steps: inserting chips, welding, vacuum injection-molding and encapsulating epoxy resin, curing and molding at a high temperature, laser-printing product performance information and safety certification information, cutting a pin, performing full-automatic performance test, taping and packaging a reel. The capacitor has the characteristics of being stable in capacity, high in electric strength and small in size, effectively saves the surface space of a PCB (printed circuit board), and is suitable for existing small-sized and ultrathin requirements of a whole circuit of an electrical appliance product, so that the market needs are met.
Description
Technical field
The present invention relates to electric elements field, particularly one small-sized chip type surface attaching type (SMD) high pressure, safety ceramic capacitor and manufacture method thereof.
Background technology
Current, along with traditional element research and production progressively moves to maturity, electronic industry is stepping into the new period of the product renewing upgrading under driving with new material, new technology, new technology and deepening development, industry entirety presents to chip type, miniaturization development trend, and, along with electronics and information industry overall development, the development for electronic industry also proposes new demand.
Along with employing and perfect, light, thin, the little important symbol becoming measurement electronic system product of development of microelectronic circuit, surface mounting technology (SMT).And electronics miniaturization will be made, first will consider the miniaturization of electronic component.Chip, miniaturization are the Main way that electronic component developed in recent years, say to a certain degree, and chip type, miniaturization have become one of important symbol weighing electronic component technology development level.U.S., Europe, Deng developed country and the developing countries and regions such as Asia-Pacific, India, all existing corresponding chip type product of all kinds of electronic component.Wherein, the large passive component of sheet capacitor, plate resistor, chip inductor three, accounts for 85% ~ 90% of global chip component total output.
Along with improving constantly of various electronic system product progress of miniaturization, the small size of electronic devices and components and high-performance are had higher requirement, while ensureing properties of product, how to meet the new problem of the electronic components fabrication industry of will having hoped for success of complete machine miniaturization and challenge.
Existing ceramic safety capacitor is pin plug-in unit, is not suitable for present electric equipment products complete machine miniaturized, ultrathin requirement.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of small-sized chip type surface attaching type (SMD) high pressure, safety ceramic capacitor, has both achieved the miniaturization of capacitor, and has met requirement on electric performance simultaneously.
For achieving the above object, the present invention realizes by the following technical solutions:
A kind of small-sized chip type surface attaching type (SMD) high pressure, safety ceramic capacitor, comprise holohedral symmetry copper electrode ceramic chip, steel band pin and encapsulating material, copper electrode ceramic chip is cylinder, ceramic dielectric is positioned in the middle of upper/lower electrode, upper/lower electrode is overall copper electrode, top electrode and upper steel band pin are welded and fixed, bottom electrode and lower steel band pin are welded and fixed, a part for copper electrode ceramic chip and steel band pin is encapsulated in together by encapsulating material, and the end of steel band pin is exposed at the outside of encapsulating material.
Described encapsulating material is epoxy resin enclosed material.
The manufacture method of surface attaching type (SMD) high pressure, safety ceramic capacitor, adopts following steps to complete:
1) holohedral symmetry copper electrode ceramic chip is clamped on carrier steel band bar by inserted sheet, forms capacitor tape;
2) welding applies cleaning-free scaling powder on capacitor tape, realizes chip weld with the effective of steel band through high-temperature baking;
3) capacitor tape good for above-mentioned welding is put into injection mold by plastic packaging, keep mold temperature under the condition of 175 ± 5 DEG C, solid epoxy resin encapsulating material is added in hole for injecting glue, it is made at high temperature to change liquid into, make cavity body of mould internal pressure be down to 1 ~ 2MPa by vacuum pump simultaneously, make liquefied epoxy along injection channel trickling to enclosed capacitor in die cavity, and the bubble in emptying epoxy resin;
4) after solidification encapsulating, capacitor tape carries out baking-curing 2 hours in 160 ± 5 DEG C of baking ovens, forms fine and close encapsulating structure;
5) mark is printed through laser marking etching product specification, Safety Approval information;
6) steel band of capacitor tape is cut the frame be connected to each other by cutting test, forms the independently capacitor of band pin, carries out electric performance test, sorting;
7) vibrating bunker put into by the qualified capacitor of reel braid, and using after vibration, sequence enter material strip groove perms makes adhesive tape and material strip combine, and reel tape package completes.
Compared with prior art, the invention has the beneficial effects as follows:
Surface attaching type of the present invention (SMD) high pressure, safety ceramic capacitor body chip adopt overall holohedral symmetry copper electrode ceramic chip, have both achieved the miniaturization of chip, and have again saved the cost of raw material; Adopt epoxide resin vacuum injection molding to carry out insulating barrier application, the gas product porosity after solidification is low, solvent resistance good, effectively can improve encapsulated layer insulation, humidity resistance.
Miniaturization is achieved while the present invention meets requirement on electric performance, capacitor has capacity stablizes, electric strength is high, size is little feature, effective saving pcb board space surface, improve pcb board space availability ratio, be applicable to the miniaturization of present electric equipment products circuitry, ultrathin requirement, meet the need of market.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Fig. 2 is structure vertical view of the present invention.
Fig. 3 is inserted sheet schematic diagram during the present invention makes.
Fig. 4 is the rear schematic diagram of solidification during the present invention makes.
In figure: steel band pin on 1-ceramic dielectric 2-top electrode 3-bottom electrode 4.1-
Steel band pin 5-encapsulating material 6-carrier steel band bar 7-holohedral symmetry copper electrode ceramic chip under 4.2-
8-encapsulates
Embodiment
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is further illustrated:
As shown in Figure 1 and Figure 2, a kind of surface-mounting ceramic safety capacitor, comprise copper electrode ceramic chip, steel band pin 4 and epoxy resin enclosed material 5, copper electrode ceramic chip is cylinder, ceramic dielectric 1 is positioned in the middle of upper/lower electrode 2,3, upper/lower electrode 2,3 is overall copper electrode, top electrode 2 and upper steel band pin 4.1 are welded and fixed, bottom electrode 3 and lower steel band pin 4.2 are welded and fixed, a part for copper electrode ceramic chip and steel band pin 4 is encapsulated in together by epoxy resin enclosed material 5, and the end of steel band pin 4 is exposed at the outside of epoxy resin enclosed material 5.
The manufacture method of surface attaching type (SMD) high pressure, safety ceramic capacitor, adopts following steps to complete:
1) holohedral symmetry copper electrode ceramic chip 7 is clamped on carrier steel band bar 6 by inserted sheet, forms capacitor tape (see Fig. 3);
2) welding applies cleaning-free scaling powder on capacitor tape, realizes chip weld with the effective of steel band through high-temperature baking;
3) capacitor tape good for above-mentioned welding is put into injection mold by plastic packaging, keep mold temperature under the condition of 175 ± 5 DEG C, solid epoxy resin encapsulating material is added in hole for injecting glue, it is made at high temperature to change liquid into, make cavity body of mould internal pressure be down to 1 ~ 2MPa by vacuum pump simultaneously, make liquefied epoxy along injection channel trickling to enclosed capacitor in die cavity, and the bubble in emptying epoxy resin;
4) after solidification encapsulating, capacitor tape carries out baking-curing 2 hours in 160 ± 5 DEG C of baking ovens, forms fine and close encapsulating structure 8 (see Fig. 4);
5) mark is printed through laser marking etching product specification, Safety Approval information;
6) steel band of capacitor tape is cut the frame be connected to each other by cutting test, forms the independently capacitor of band pin, carries out electric performance test, sorting;
7) vibrating bunker put into by the qualified capacitor of reel braid, and using after vibration, sequence enter material strip groove perms makes adhesive tape and material strip combine, and reel tape package completes.
Above-mentioned capacitor adopts the full electrode chip of copper electrode, the capacitor chip adopting this technique to prepare is compared conventional silver electrode chip and is had that electric strength is high, the feature of good capacitance consistency, less by 10% than the silver electrode chip diameter of same specification, achieve the miniaturization of high pressure, safety electric capacity substrate.Realize the full-automatic inserted sheet of product on this basis, welding, epoxide resin vacuum injection molding packaging, hot setting is shaping, laser printing properties of product information and Safety Approval information, cutting, fully automatic electric performance test, reel tape package.Above-mentioned capacitor embodiment size is in table 1.
Table 1: surface attaching type (SMD) high pressure, safety ceramic capacitor size table
Embodiment capacitor 1#-16#, when room temperature 25 DEG C, utilizes Hp4278A, test capacitors capacity, dielectric loss under 1KHz, 1.0V (AC); Utilize YD9810A type dielectric voltage withstand tester test capacitors proof voltage; Utilize TH2683A Insulation Resistance Tester, apply 500V DC test voltage 1min, test insulation resistance; Properties of product test parameter is in table 2.
Table 2: surface attaching type (SMD) high pressure, safety ceramic capacitor electric performance test table
By table 1, table 2 visible surface pasting type (SMD) high pressure, safety ceramic capacitor, there is capacity stablizes, electric strength is high, size is little feature.
Be only general principle of the present invention above, not impose any restrictions the present invention, the present invention of every foundation carries out equivalent variations and modification to it, all within the category of the art of this patent protection scheme.
Claims (3)
1. small-sized chip type surface attaching type (SMD) high pressure, safety ceramic capacitor, it is characterized in that, comprise holohedral symmetry copper electrode ceramic chip, steel band pin and encapsulating material, copper electrode ceramic chip is cylinder, ceramic dielectric is positioned in the middle of upper/lower electrode, upper/lower electrode is overall copper electrode, top electrode and upper steel band pin are welded and fixed, bottom electrode and lower steel band pin are welded and fixed, a part for copper electrode ceramic chip and steel band pin is encapsulated in together by encapsulating material, and the end of steel band pin is exposed at the outside of encapsulating material.
2. one according to claim 1 small-sized chip type surface attaching type (SMD) high pressure, safety ceramic capacitor, is characterized in that, described encapsulating material is epoxy resin enclosed material.
3. the manufacture method of surface attaching type (SMD) high pressure, safety ceramic capacitor, is characterized in that, adopts following steps to complete:
1) holohedral symmetry copper electrode ceramic chip is clamped on carrier steel band bar by inserted sheet, forms capacitor tape;
2) welding applies cleaning-free scaling powder on capacitor tape, realizes chip weld with the effective of steel band through high-temperature baking;
3) capacitor tape good for above-mentioned welding is put into injection mold by plastic packaging, keep mold temperature under the condition of 175 ± 5 DEG C, solid epoxy resin encapsulating material is added in hole for injecting glue, it is made at high temperature to change liquid into, make cavity body of mould internal pressure be down to 1 ~ 2MPa by vacuum pump simultaneously, make liquefied epoxy along injection channel trickling to enclosed capacitor in die cavity, and the bubble in emptying epoxy resin;
4) after solidification encapsulating, capacitor tape carries out baking-curing 2 hours in 160 ± 5 DEG C of baking ovens, forms fine and close encapsulating structure;
5) mark is printed through laser marking etching product specification, Safety Approval information;
6) steel band of capacitor tape is cut the frame be connected to each other by cutting test, forms the independently capacitor of band pin, carries out electric performance test, sorting;
7) vibrating bunker put into by the qualified capacitor of reel braid, and using after vibration, sequence enter material strip groove perms makes adhesive tape and material strip combine, and reel tape package completes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510070008.XA CN104701009A (en) | 2015-02-10 | 2015-02-10 | Small-sized chip type surface mounting (SMD) high-voltage and safety standard recognized ceramic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510070008.XA CN104701009A (en) | 2015-02-10 | 2015-02-10 | Small-sized chip type surface mounting (SMD) high-voltage and safety standard recognized ceramic capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104701009A true CN104701009A (en) | 2015-06-10 |
Family
ID=53348032
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510070008.XA Pending CN104701009A (en) | 2015-02-10 | 2015-02-10 | Small-sized chip type surface mounting (SMD) high-voltage and safety standard recognized ceramic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104701009A (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106003382A (en) * | 2016-07-12 | 2016-10-12 | 苏州宏泉高压电容器有限公司 | Forming press of ceramic medium chip of high-pressure ceramic capacitor |
| CN106067774A (en) * | 2016-07-04 | 2016-11-02 | 鞍山厚德电子有限公司 | A kind of EMI coupled apparatus and manufacture method thereof |
| CN106910648A (en) * | 2015-12-21 | 2017-06-30 | 昆山万盛电子有限公司 | The preparation method of lightening capacitor |
| CN106910617A (en) * | 2015-12-22 | 2017-06-30 | 昆山万盛电子有限公司 | Chip capacitor |
| CN107578930A (en) * | 2017-09-26 | 2018-01-12 | 黄山申格电子科技有限公司 | A kind of capacitor fast packing method |
| CN108109796A (en) * | 2017-12-14 | 2018-06-01 | 贵州凯里经济开发区中昊电子有限公司 | The production method of SMD plastic-packaged electronic components and the metal tape of use |
| CN108962594A (en) * | 2018-06-28 | 2018-12-07 | 史宝林 | A kind of micromation high reliability patch-type safety ceramic capacitor and its processing method |
| CN111243874A (en) * | 2020-03-11 | 2020-06-05 | 福建火炬电子科技股份有限公司 | Soft multi-core-group ceramic capacitor and production method thereof |
| CN112820541A (en) * | 2020-12-29 | 2021-05-18 | 广东南方宏明电子科技股份有限公司 | Full-connection production process of ceramic capacitor |
| CN113555636A (en) * | 2020-04-02 | 2021-10-26 | 东电化电子元器件(珠海保税区)有限公司 | Assembly for protecting SMD components against environmental influences |
| CN117711815A (en) * | 2024-01-09 | 2024-03-15 | 泗阳群鑫电子有限公司 | Plastic package patch type multilayer ceramic capacitor and manufacturing method thereof |
| WO2024087247A1 (en) * | 2022-10-26 | 2024-05-02 | 珠海许继电气有限公司 | High-voltage vacuum ceramic capacitor assembly and pole-mounted switch comprising same |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB751942A (en) * | 1953-11-04 | 1956-07-04 | Erie Resistor Corp | Condensers and method of handling the same |
| CN1126360A (en) * | 1994-06-01 | 1996-07-10 | 株式会社村田制作所 | Ceramic capacitor |
| CN2593332Y (en) * | 2002-11-25 | 2003-12-17 | 张围豪 | Ceramic capacitor body electrode layer structure |
| CN1635594A (en) * | 2003-12-26 | 2005-07-06 | 广东南方宏明电子科技股份有限公司 | Technique for making laminated ceramic capacitor |
| CN1684210A (en) * | 2005-02-06 | 2005-10-19 | 史宝林 | Full electrode producing process by round sheet type high voltage ceramic capacitor splash metal chemical depositing method |
| CN2788324Y (en) * | 2005-02-06 | 2006-06-14 | 史宝林 | Circular high voltage ceramic capacitor base metal electrode |
| CN201425893Y (en) * | 2009-05-22 | 2010-03-17 | 广东风华高新科技股份有限公司 | Ceramic capacitor |
| CN201438421U (en) * | 2009-07-27 | 2010-04-14 | 东莞市道滘智伟电子有限公司 | ceramic capacitor |
| CN203351422U (en) * | 2013-05-23 | 2013-12-18 | 祥泰电子(深圳)有限公司 | Novel safety ceramic capacitor |
| CN104167290A (en) * | 2014-08-28 | 2014-11-26 | 鞍山奇发电子陶瓷科技有限公司 | Concave dual-electrode integrated chip high-voltage ceramic capacitor and manufacturing process thereof |
| CN204577251U (en) * | 2015-02-10 | 2015-08-19 | 鞍山奇发电子陶瓷科技有限公司 | A kind of small-sized chip type surface attaching type high pressure, safety ceramic capacitor |
-
2015
- 2015-02-10 CN CN201510070008.XA patent/CN104701009A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB751942A (en) * | 1953-11-04 | 1956-07-04 | Erie Resistor Corp | Condensers and method of handling the same |
| CN1126360A (en) * | 1994-06-01 | 1996-07-10 | 株式会社村田制作所 | Ceramic capacitor |
| CN2593332Y (en) * | 2002-11-25 | 2003-12-17 | 张围豪 | Ceramic capacitor body electrode layer structure |
| CN1635594A (en) * | 2003-12-26 | 2005-07-06 | 广东南方宏明电子科技股份有限公司 | Technique for making laminated ceramic capacitor |
| CN1684210A (en) * | 2005-02-06 | 2005-10-19 | 史宝林 | Full electrode producing process by round sheet type high voltage ceramic capacitor splash metal chemical depositing method |
| CN2788324Y (en) * | 2005-02-06 | 2006-06-14 | 史宝林 | Circular high voltage ceramic capacitor base metal electrode |
| CN201425893Y (en) * | 2009-05-22 | 2010-03-17 | 广东风华高新科技股份有限公司 | Ceramic capacitor |
| CN201438421U (en) * | 2009-07-27 | 2010-04-14 | 东莞市道滘智伟电子有限公司 | ceramic capacitor |
| CN203351422U (en) * | 2013-05-23 | 2013-12-18 | 祥泰电子(深圳)有限公司 | Novel safety ceramic capacitor |
| CN104167290A (en) * | 2014-08-28 | 2014-11-26 | 鞍山奇发电子陶瓷科技有限公司 | Concave dual-electrode integrated chip high-voltage ceramic capacitor and manufacturing process thereof |
| CN204577251U (en) * | 2015-02-10 | 2015-08-19 | 鞍山奇发电子陶瓷科技有限公司 | A kind of small-sized chip type surface attaching type high pressure, safety ceramic capacitor |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106910648A (en) * | 2015-12-21 | 2017-06-30 | 昆山万盛电子有限公司 | The preparation method of lightening capacitor |
| CN106910617A (en) * | 2015-12-22 | 2017-06-30 | 昆山万盛电子有限公司 | Chip capacitor |
| CN106067774A (en) * | 2016-07-04 | 2016-11-02 | 鞍山厚德电子有限公司 | A kind of EMI coupled apparatus and manufacture method thereof |
| CN106003382A (en) * | 2016-07-12 | 2016-10-12 | 苏州宏泉高压电容器有限公司 | Forming press of ceramic medium chip of high-pressure ceramic capacitor |
| CN107578930A (en) * | 2017-09-26 | 2018-01-12 | 黄山申格电子科技有限公司 | A kind of capacitor fast packing method |
| CN108109796A (en) * | 2017-12-14 | 2018-06-01 | 贵州凯里经济开发区中昊电子有限公司 | The production method of SMD plastic-packaged electronic components and the metal tape of use |
| CN108962594A (en) * | 2018-06-28 | 2018-12-07 | 史宝林 | A kind of micromation high reliability patch-type safety ceramic capacitor and its processing method |
| CN111243874A (en) * | 2020-03-11 | 2020-06-05 | 福建火炬电子科技股份有限公司 | Soft multi-core-group ceramic capacitor and production method thereof |
| CN113555636A (en) * | 2020-04-02 | 2021-10-26 | 东电化电子元器件(珠海保税区)有限公司 | Assembly for protecting SMD components against environmental influences |
| CN112820541A (en) * | 2020-12-29 | 2021-05-18 | 广东南方宏明电子科技股份有限公司 | Full-connection production process of ceramic capacitor |
| WO2024087247A1 (en) * | 2022-10-26 | 2024-05-02 | 珠海许继电气有限公司 | High-voltage vacuum ceramic capacitor assembly and pole-mounted switch comprising same |
| CN117711815A (en) * | 2024-01-09 | 2024-03-15 | 泗阳群鑫电子有限公司 | Plastic package patch type multilayer ceramic capacitor and manufacturing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104701009A (en) | Small-sized chip type surface mounting (SMD) high-voltage and safety standard recognized ceramic capacitor | |
| US7359181B2 (en) | Solid electrolytic capacitor | |
| CN108281283A (en) | The manufacturing process and its capacitor packages of vertical type ceramic patch capacitor | |
| US10186366B2 (en) | Electrode structure and the corresponding electrical component using the same and the fabrication merhod thereof | |
| CN104081885B (en) | Substrate having built-in components | |
| CN204577251U (en) | A kind of small-sized chip type surface attaching type high pressure, safety ceramic capacitor | |
| CN204792436U (en) | Multicore piece integrated form surface mounting type ann rule condenser | |
| US9679701B2 (en) | Tantalum capacitor | |
| US10080297B2 (en) | Power supply module | |
| US9711294B2 (en) | Tantalum capacitor and method of manufacturing the same | |
| US9330852B2 (en) | Tantalum capacitor and method of manufacturing the same | |
| JP2014036217A (en) | Tantalum capacitor and manufacturing method therefor | |
| CN207765439U (en) | A kind of more pin patch-type electronic devices | |
| EP3174088B1 (en) | Method of manufacturing a plastic packaged smd diode | |
| KR20150125406A (en) | Tantalum capacitor and method of preparing the same | |
| CN213183809U (en) | Power type leading-out thick film resistor | |
| US9336956B2 (en) | Tantalum capacitor and method of manufacturing the same | |
| CN207731288U (en) | Radio frequency identification module | |
| CN205845710U (en) | Chip high voltage ceramic capacitor | |
| CN106024385B (en) | A kind of chip high voltage ceramic capacitor | |
| US9384899B2 (en) | Tantalum capacitor and method of manufacturing the same | |
| CN202633056U (en) | -type ceramic capacitor | |
| CN207637845U (en) | A kind of simple semiconductor package, SAW filter and terminal device | |
| CN110492731A (en) | A kind of ceramics water type power adapter and manufacturing method | |
| CN114639548B (en) | Manufacturing method of MLPC (multilayer printed circuit) substrate type capacitor with electroplating terminal structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150610 |