CN110492731A - A kind of ceramics water type power adapter and manufacturing method - Google Patents
A kind of ceramics water type power adapter and manufacturing method Download PDFInfo
- Publication number
- CN110492731A CN110492731A CN201910859569.6A CN201910859569A CN110492731A CN 110492731 A CN110492731 A CN 110492731A CN 201910859569 A CN201910859569 A CN 201910859569A CN 110492731 A CN110492731 A CN 110492731A
- Authority
- CN
- China
- Prior art keywords
- ferrite
- substrate
- external electrode
- ceramics
- ceramics substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 112
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 20
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000000758 substrate Substances 0.000 claims abstract description 85
- 229910000859 α-Fe Inorganic materials 0.000 claims abstract description 71
- 239000003985 ceramic capacitor Substances 0.000 claims description 11
- 239000002002 slurry Substances 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 6
- 238000003854 Surface Print Methods 0.000 claims description 5
- 238000009826 distribution Methods 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 238000005516 engineering process Methods 0.000 claims description 4
- 238000005245 sintering Methods 0.000 claims description 4
- 238000009713 electroplating Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 2
- 238000004382 potting Methods 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 abstract description 4
- 239000004575 stone Substances 0.000 abstract description 2
- 239000003990 capacitor Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- -1 power inductor Substances 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of dc power input into dc power output
Abstract
The present invention relates to power adapter technical fields, disclose a kind of ceramics water type power adapter, comprising: ceramic condenser group substrate has external electrode；Ferrite ceramics substrate has the inductance and external electrode of layering setting；Resistance is set to ferrite ceramics substrate；Power supply chip is set to ferrite ceramics substrate, is interconnected with the inductance and resistance of ferrite ceramics substrate；The ceramic condenser group substrate and the ferrite ceramics substrate, which mutually bond, is connected as entirety, and the external electrode of the ceramic condenser group substrate is connected to the external electrode of the ferrite ceramics substrate.The present invention is combined using the ferrite ceramics substrate of LTCF (low temperature co-fired ferrite) multilayer circuit with ceramic condenser group substrate, integrated large bulk capacitance group and power inductance, and it is encapsulated with power supply chip system, form the firm shape of approximate solely stone encapsulating structure, without any peripheral cell, high degree reduces volume.
Description
Technical field
The present invention relates to power adapter technical fields, in particular to a kind of ceramics water type power adapter and system
Make method.
Background technique
Current power adapter is usually discrete form, and containing a large amount of peripheral cells, volume is larger.Due to integrated circuit
Development, the volume of electronic device gradually minimizes, and the miniaturization that existing power adapter has been unable to meet electronic device needs
It asks.
For example, DC-DC converter is generally by control chip and inductance coil, diode, triode, capacitor etc. is outside
Enclose element composition, volume is larger, performance not only with control chip it is related, but also with the part characteristic of peripheral circuit, substrate
Wire laying mode etc. have relationship.Publication No. CN108235672A, entitled " shield, electronic circuit and DC-DC turn
The application for a patent for invention of parallel operation " discloses a kind of DC-DC converter, including substrate, power inductor, capacitor and shielding
Component reduces the volume of capacitor to a certain extent, but the power inductor of the invention and the exposed setting of capacitor are in base
The surface of plate, when stress, are easy to damage.
Summary of the invention
The purpose of the present invention is to provide a kind of ceramics water type power adapter and manufacturing methods, by the member of power adapter
Device system is encapsulated in potsherd, is guaranteed the performance of power adapter while being met miniature requirement.
The technical solution of the present invention is as follows:
A kind of ceramics water type power adapter, comprising:
Ceramic condenser group substrate has external electrode；
Ferrite ceramics substrate has the inductance and external electrode of layering setting；
Resistance is set to ferrite ceramics substrate；
Power supply chip is set to ferrite ceramics substrate, is interconnected with the inductance and resistance of ferrite ceramics substrate；
The ceramic condenser group substrate and the ferrite ceramics substrate, which mutually bond, is connected as entirety, the ceramic condenser
The external electrode of group substrate is connected to the external electrode of the ferrite ceramics substrate.
Further, the inductance is multi-sheet printed type power inductance, is printed by being layered in ferrite media interior
Metal paste forms the multilayer line figure of three-dimensional distribution, forms through high temperature sintering.
Further, the resistance is film resistor, by the surface printing resistance slurry in ferrite medium, through height
Temperature is sintered.
Further, the resistance and inductance pass through printed conductor respectively and the corresponding ports of power supply chip connect.
Further, the ceramic condenser group substrate includes two or more chip multilayer ceramic capacitors, every chip
Multilayer ceramic capacitor is both provided with corresponding external electrode.
Further, the ferrite ceramics substrate is provided with an accommodating cavity, and the power supply chip upside-down mounting is welded in the appearance
Set chamber.
Further, the gap between the power supply chip and the accommodating cavity is filled with resin.
The manufacturing method of above-mentioned ceramics water type power adapter, comprising the following steps:
S1. ceramic condenser group substrate is made, ceramic dielectric is made using MLCC material, then makes the inside of ceramic condenser
Electrode makes external electrode finally by electroplating technology；
S2. ferrite ceramics substrate is made, forms three-dimensional point in ferrite media interior layering type metal slurry first
The multilayer line figure of cloth；Then in the surface printing resistance slurry of ferrite medium, external electrode is printed；Finally by ferrite
Medium is sintered under high temperature environment, and formation includes the ferrite ceramics substrate of power inductance and film resistor；
S3., power supply chip is installed, the mounting surface of ferrite ceramics substrate described in step S2 opens up accommodating cavity, is accommodating
Intracavitary flip chip bonding power supply chip；
S4. on-line testing is carried out to the ferrite ceramics substrate for being equipped with power supply chip, it is good later in power supply chip to debug
Gap potting resin between accommodating cavity；
S5. by the ferrite ceramics substrate mutually company of bonding described in ceramic condenser group substrate described in step S1 and step S4
It is connected in entirety.
The beneficial effects of the present invention are:
The present invention uses the ferrite ceramics substrate and ceramic condenser group base of LTCF (low temperature co-fired ferrite) multilayer circuit
Plate combines, and integrates large bulk capacitance group and power inductance, and form system encapsulation with power supply chip, forms approximate solely stone encapsulation
The firm shape of structure.Ceramics water type power adapter of the invention, is not necessarily to any peripheral cell, and high degree reduces body
Product.Since chip multilayer ceramic capacitor itself has a grounding electrode, power inductance by printed conductor directly and chip multilayer
Ceramic capacitor connection, via hole connection compared to the prior art, the earth-return circuit of capacitor is short, and electromagnetic radiation is small, reduces miscellaneous
Wave keeps the output waveform of power adapter smoother.
Detailed description of the invention
Fig. 1 is schematic perspective view of the invention；
Fig. 2 is side view of the invention；
Fig. 3 is the structural schematic diagram of ceramic condenser group substrate of the invention；
Fig. 4 is the structural schematic diagram of ferrite ceramics substrate of the invention；
Fig. 5 is the schematic diagram of internal structure of ferrite ceramics substrate of the invention；
Fig. 6 is the circuit diagram of the embodiment of the present invention.
Icon: 10- ceramic condenser group substrate, 11A/11B/11C/11D- external electrode, electrode in 12-, 20- ferrite pottery
Porcelain substrate, 21A/21B/21C/21D- external electrode, 22- inductance, 23- printed conductor, 24- wire column, 25- accommodating cavity, 30- electricity
Resistance, 40- power supply chip, 41- power supply chip port.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described.
The present embodiment combines circuit diagram as shown in FIG. 6, carries out to ceramics water type power adapter of the invention detailed
Thin description.Referring to Figures 1 and 2, a kind of ceramics water type power adapter, including ceramic condenser group substrate 10, ferrite ceramics base
Plate 20 and power supply chip 40.The ceramic condenser group substrate 10 include two chip multilayer ceramic capacitors (according to actual needs,
Multilayer ceramic capacitor settable one or more, combined circuit figure, multilayer ceramic capacitor is set as two in the present embodiment
Only), every chip multilayer ceramic capacitor includes electrode 12 in multilayer, and electrode 12 is connected with external electrode in every layer, and two
The external electrode of the external electrode composition ceramic condenser group substrate 10 of chip multilayer ceramic capacitor.Referring to Fig. 3, ceramic condenser group
The external electrode of substrate 10 includes Vin input terminal 11A, Vout output end 11B, GND ground terminal 11C and EN port 11D.
Referring to Fig.1 and Fig. 5, inductance 22 is arranged in the interior laminate layer of the ferrite ceramics substrate 20, by being situated between in ferrite
Matter interior laminate layer type metal slurry forms the multilayer line figure of three-dimensional distribution, forms through high temperature sintering.Therefore it is formed
Inductance 22 is film-type power inductance 22, and 22 line holding of inductance is small in size.The number of plies of inductance 22 can be according to required coupling amount
It is arranged, in the present embodiment, the inductance 22 is set as two layers, forms power inductance 22 by two layers of coupling of inductance 22.This reality
It applies in example, defining the surface opposite with ceramic condenser group substrate 10 of ferrite ceramics substrate 20 is mounting surface.Ferrite ceramics base
The mounting surface of plate 20 is provided with resistance 30, by 30 slurry of mounting surface printed resistor in ferrite medium, through high temperature sintering
At the film resistor 30 of formation.
Referring to Fig. 4, the mounting surface of ferrite ceramics substrate 20 is provided with an accommodating cavity 25, the flip chip bonding in accommodating cavity 25
(Flip-Chip) power supply chip 40, by printed conductor 23 by resistance 30 and inductance 22 corresponding end with power supply chip 40 respectively
Mouth connection (power supply chip includes six ports VIN, LX, EN, FB, GND, MODE).The end face of ferrite ceramics substrate 20 prints
Brushed with external electrode, external electrode and resistance 30, inductance 22 are correspondingly connected with by printed conductor 23 and wire column 24.Ferrite
The external electrode of ceramic substrate 20 includes Vin input terminal 21A, Vout output end 21B, GND ground terminal 21C and EN port 21D.
Referring to Fig.1, ceramic condenser group substrate 10 and the mutually bonding of ferrite ceramics substrate 20 are connected as entirety, and make ceramics
The external electrode of capacitor group substrate 10 is connected to the external electrode of ferrite ceramics substrate 20.Eutectic can be used in bonding connection type
Bonding technology exports the Vin input terminal of 10 external electrode of ceramic condenser group substrate, Vout that is, under stable temperature, pressure
End and the Vin input terminal of 20 external electrode of ferrite ceramics substrate and Vout output end is corresponding contacts, watery fusion, shape after cooling down
It is connected at sealed solid.
In the present embodiment, (attached drawing is not filled with resin for the gap between the power supply chip 40 and the accommodating cavity 25
Show), for protecting and fixed power source chip 40.
The manufacturing method of above-mentioned ceramics water type power adapter, comprising the following steps:
S1. ceramic condenser group substrate is made, specifically, making ceramic dielectric using MLCC material, is made of BME technique
The internal electrode of ceramic condenser blocks production external electrode by ternary electroplating technology side；
S2. ferrite ceramics substrate is made, specifically, being formed first in ferrite media interior layering type metal slurry
The multilayer line figure of solid distribution；Then in the surface printing resistance slurry of ferrite medium, external electrode is printed；Finally will
Ferrite medium is sintered under high temperature environment, and formation includes the ferrite ceramics substrate of power inductance and film resistor；
S3., power supply chip is installed, specifically, the mounting surface of ferrite ceramics substrate described in step S2 opens up accommodating
Chamber, flip chip bonding (Flip-Chip) power supply chip in accommodating cavity；
S4. on-line testing carried out to the ferrite ceramics substrate for being equipped with power supply chip, laser debugs resistance, debugging it is good with
Afterwards in power supply chip surface coated with resins；
S5. by the ferrite ceramics substrate mutually company of bonding described in ceramic condenser group substrate described in step S1 and step S4
It is connected in entirety.Specifically, conductive metal solder is applied in the external electrode of ceramic condenser group substrate and ferrite ceramics substrate, it is external
Region coating resin other than electrode, by Vin input terminal 21A, Vout output end 21B, GND ground terminal of ceramic condenser group substrate
Vin input terminal 21A, Vout output end 21B, GND ground terminal 21C of the port 21C and EN 21D and ferrite ceramics substrate and
The port EN 21D is respectively corresponded；Make melt solder under the conditions of certain temperature, then by ceramic condenser group substrate and ferrite ceramics
Substrate fitting compresses, and after solder and resin are cooling, ceramic condenser group substrate and the bonding of ferrite ceramics substrate are integrated, and is formed
The ceramics water type power adapter of overall package structure.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, made any to repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (8)
1. a kind of ceramics water type power adapter characterized by comprising
Ceramic condenser group substrate has external electrode；
Ferrite ceramics substrate has the inductance and external electrode of layering setting；
Resistance is set to ferrite ceramics substrate；
Power supply chip is set to ferrite ceramics substrate, is interconnected with the inductance and resistance of ferrite ceramics substrate；
The ceramic condenser group substrate and the ferrite ceramics substrate, which mutually bond, is connected as entirety, the ceramic condenser group base
The external electrode of plate is connected to the external electrode of the ferrite ceramics substrate.
2. ceramics water type power adapter according to claim 1, which is characterized in that the inductance is multi-sheet printed type function
Rate inductance, by being layered the multilayer line figure that type metal slurry forms three-dimensional distribution in ferrite media interior, through height
Temperature is sintered.
3. ceramics water type power adapter according to claim 2, which is characterized in that the resistance is film resistor,
By the surface printing resistance slurry in ferrite medium, formed through high temperature sintering.
4. ceramics water type power adapter according to claim 3, which is characterized in that the resistance and inductance pass through respectively
The connection of the corresponding ports of printed conductor and power supply chip.
5. ceramics water type power adapter according to claim 1, which is characterized in that the ceramic condenser group substrate includes
Two or more chip multilayer ceramic capacitors, every chip multilayer ceramic capacitor are both provided with corresponding external electrode.
6. ceramics water type power adapter according to claim 1, which is characterized in that the ferrite ceramics substrate setting
There is an accommodating cavity, the power supply chip upside-down mounting is welded in the accommodating cavity.
7. ceramics water type power adapter according to claim 6, which is characterized in that the power supply chip and the accommodating
Gap between chamber is filled with resin.
8. the manufacturing method of ceramics water type power adapter according to claim 1, comprising the following steps:
S1. ceramic condenser group substrate is made, ceramic dielectric is made using MLCC material, then makes the inside electricity of ceramic condenser
Pole makes external electrode finally by electroplating technology；
S2. ferrite ceramics substrate is made, forms three-dimensional distribution in ferrite media interior layering type metal slurry first
Multilayer line figure；Then in the surface printing resistance slurry of ferrite medium, external electrode is printed；Finally by ferrite medium
It is sintered under high temperature environment, formation includes the ferrite ceramics substrate of power inductance and film resistor；
S3., power supply chip is installed, the mounting surface of ferrite ceramics substrate described in step S2 opens up accommodating cavity, in accommodating cavity
Flip chip bonding power supply chip；
S4. the ferrite ceramics substrate progress on-line testing to power supply chip is equipped with, it is good later in power supply chip and appearance to debug
Set the gap potting resin between chamber；
S5. ceramic condenser group substrate described in step S1 is mutually bonded with ferrite ceramics substrate described in step S4 and is connected as
It is whole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910859569.6A CN110492731A (en) | 2019-09-11 | 2019-09-11 | A kind of ceramics water type power adapter and manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910859569.6A CN110492731A (en) | 2019-09-11 | 2019-09-11 | A kind of ceramics water type power adapter and manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110492731A true CN110492731A (en) | 2019-11-22 |
Family
ID=68557623
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910859569.6A Pending CN110492731A (en) | 2019-09-11 | 2019-09-11 | A kind of ceramics water type power adapter and manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110492731A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113829743A (en) * | 2021-09-17 | 2021-12-24 | 方飞鸿 | Power converter ferrite ceramic substrate production line group based on electric light source |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20050000688A (en) * | 2003-06-24 | 2005-01-06 | 삼성전기주식회사 | Dc to dc converter module |
| CN101951237A (en) * | 2010-07-23 | 2011-01-19 | 电子科技大学 | Laminated sheet type filter and preparation method thereof |
| CN102169872A (en) * | 2011-01-26 | 2011-08-31 | 上海腾怡半导体有限公司 | Power module of integrated inductor |
| CN102449710A (en) * | 2009-05-01 | 2012-05-09 | 株式会社昌星 | Stacked inductor using magnetic sheets, and method for manufacturing same |
| CN105790592A (en) * | 2016-05-13 | 2016-07-20 | 中国电子科技集团公司第五十八研究所 | High-performance miniaturized altimeter multi-output DC/DC power source module |
| CN107658270A (en) * | 2017-10-13 | 2018-02-02 | 中国电子科技集团公司第十三研究所 | Power supply changeover device ceramic package |
| CN210273831U (en) * | 2019-09-11 | 2020-04-07 | 成都宏科电子科技有限公司 | Ceramic wafer type power converter |
-
2019
- 2019-09-11 CN CN201910859569.6A patent/CN110492731A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20050000688A (en) * | 2003-06-24 | 2005-01-06 | 삼성전기주식회사 | Dc to dc converter module |
| CN102449710A (en) * | 2009-05-01 | 2012-05-09 | 株式会社昌星 | Stacked inductor using magnetic sheets, and method for manufacturing same |
| CN101951237A (en) * | 2010-07-23 | 2011-01-19 | 电子科技大学 | Laminated sheet type filter and preparation method thereof |
| CN102169872A (en) * | 2011-01-26 | 2011-08-31 | 上海腾怡半导体有限公司 | Power module of integrated inductor |
| CN105790592A (en) * | 2016-05-13 | 2016-07-20 | 中国电子科技集团公司第五十八研究所 | High-performance miniaturized altimeter multi-output DC/DC power source module |
| CN107658270A (en) * | 2017-10-13 | 2018-02-02 | 中国电子科技集团公司第十三研究所 | Power supply changeover device ceramic package |
| CN210273831U (en) * | 2019-09-11 | 2020-04-07 | 成都宏科电子科技有限公司 | Ceramic wafer type power converter |
Non-Patent Citations (1)
| Title |
|---|
| 彭龙 等: "低温共烧陶瓷铁氧体环行器的设计与分析", 《强激光与粒子束》, vol. 26, no. 11, pages 1 - 7 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113829743A (en) * | 2021-09-17 | 2021-12-24 | 方飞鸿 | Power converter ferrite ceramic substrate production line group based on electric light source |
| CN113829743B (en) * | 2021-09-17 | 2023-11-03 | 方飞鸿 | Ferrite ceramic substrate production line group of power converter based on electric light source |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7359181B2 (en) | Solid electrolytic capacitor | |
| CN108281283A (en) | The manufacturing process and its capacitor packages of vertical type ceramic patch capacitor | |
| CN105122443A (en) | High-frequency component and high-frequency module provided with same | |
| CN107251255A (en) | Conduction for capacitive structure wears polymer through hole | |
| CN104701009A (en) | Small-sized chip type surface mounting (SMD) high-voltage and safety standard recognized ceramic capacitor | |
| CN108369867A (en) | The capacitor and manufacturing method of object thickness control are packaged using film | |
| JP2001176728A (en) | Lc composite part and power-source element | |
| CN104485324A (en) | Lead-less ball foot surface adhesion type microwave film hybrid integrated circuit and integration method thereof | |
| CN107731696A (en) | A kind of power chip method for packing and structure | |
| CN110492731A (en) | A kind of ceramics water type power adapter and manufacturing method | |
| CN104113981B (en) | Multi-layer wire substrate and the module for possessing the multi-layer wire substrate | |
| CN103489655B (en) | A kind of Novel planar array multi-core series-parallel solid tantalum capacitor and manufacture method thereof | |
| CN206947320U (en) | A kind of electronic device package shell | |
| CN210273831U (en) | Ceramic wafer type power converter | |
| CN103280424A (en) | Integration method for thick film hybrid integrated circuit with high integration density power | |
| JP4472453B2 (en) | Ultra-compact power converter and magnetic device | |
| CN214956831U (en) | Feed-through filter without encapsulation | |
| CN101662270A (en) | Quartz-crystal resonator | |
| CN103107123B (en) | The integrated approach of three-dimensional integrated power thick film hybrid integrated circuit | |
| US20080094780A1 (en) | Solid Electrolytic Capacitor | |
| CN111863459B (en) | Preparation method and application of patch type micro filter capacitor | |
| CN201490984U (en) | Quartz crystal resonator | |
| CN207490879U (en) | A kind of passive filter device and passive filter module | |
| CN208078887U (en) | A kind of filter | |
| CN216288001U (en) | Feedthrough capacitor packaged by glass |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |