CN210273831U - Ceramic wafer type power converter - Google Patents
Ceramic wafer type power converter Download PDFInfo
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- CN210273831U CN210273831U CN201921525369.9U CN201921525369U CN210273831U CN 210273831 U CN210273831 U CN 210273831U CN 201921525369 U CN201921525369 U CN 201921525369U CN 210273831 U CN210273831 U CN 210273831U
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Abstract
The utility model relates to a power converter technical field discloses a potsherd formula power converter, include: a ceramic capacitor bank substrate having an external electrode; a ferrite ceramic substrate having an inductor and an external electrode arranged in layers; a resistor disposed on the ferrite ceramic substrate; the power supply chip is arranged on the ferrite ceramic substrate and is communicated with the inductor and the resistor of the ferrite ceramic substrate; the ceramic capacitor bank substrate and the ferrite ceramic substrate are bonded and connected into a whole, and the outer electrode of the ceramic capacitor bank substrate is communicated with the outer electrode of the ferrite ceramic substrate. The utility model discloses a LTCF (low temperature co-fired ferrite) multilayer circuit's ferrite ceramic substrate combines together with ceramic capacitor group base plate, integrated large capacity electric capacity group and power inductance to with power chip system package, form approximate monolithic packaging structure's firm appearance, need not any peripheral component, the volume has been reduced to very big degree.
Description
Technical Field
The utility model relates to a power converter technical field particularly, relates to a potsherd formula power converter.
Background
The current power converter is usually in a discrete form, contains a large number of peripheral elements and is large in size. Due to the development of integrated circuits, the size of electronic devices is gradually miniaturized, and the existing power converters cannot meet the miniaturization requirement of the electronic devices.
For example, a DC-DC converter is generally composed of a control chip and peripheral components such as an inductor, a diode, a transistor, and a capacitor, and is large in size, and its performance is related not only to the control chip but also to the characteristics of the peripheral circuit components and the wiring method of the substrate. The invention patent application with the publication number of CN108235672A entitled "shield, electronic circuit and DC-DC converter" discloses a DC-DC converter, which includes a substrate, a power inductor, a capacitor and a shielding component, and reduces the volume of the capacitor to a certain extent, but the power inductor and the capacitor of the utility model are exposed on the surface of the substrate and are easily damaged when being stressed.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a potsherd formula power converter encapsulates power converter's components and parts system in the potsherd, guarantees that power converter's performance satisfies the miniaturization demand simultaneously.
The technical scheme of the utility model is that:
a ceramic wafer-based power converter comprising:
a ceramic capacitor bank substrate having an external electrode;
a ferrite ceramic substrate having an inductor and an external electrode arranged in layers;
a resistor disposed on the ferrite ceramic substrate;
the power supply chip is arranged on the ferrite ceramic substrate and is communicated with the inductor and the resistor of the ferrite ceramic substrate;
the ceramic capacitor bank substrate and the ferrite ceramic substrate are bonded and connected into a whole, and the outer electrode of the ceramic capacitor bank substrate is communicated with the outer electrode of the ferrite ceramic substrate.
Furthermore, the inductor is a multilayer printed power inductor, and is formed by printing metal slurry in a ferrite medium layer by layer to form a multilayer circuit pattern in three-dimensional distribution and sintering at high temperature.
Furthermore, the resistor is a thin film resistor and is formed by printing resistor slurry on the surface of a ferrite medium and sintering the resistor slurry at a high temperature.
Furthermore, the resistor and the inductor are respectively connected with corresponding ports of the power supply chip through printed wires.
Further, the ceramic capacitor bank substrate includes more than two chip multilayer ceramic capacitors, and each chip multilayer ceramic capacitor is provided with a corresponding external electrode.
Furthermore, the ferrite ceramic substrate is provided with an accommodating cavity, and the power supply chip is in flip-chip bonding with the accommodating cavity.
Furthermore, resin is filled in a gap between the power supply chip and the accommodating cavity.
The utility model has the advantages that:
the utility model discloses a LTCF (low temperature co-fired ferrite) multilayer circuit's ferrite ceramic substrate combines together with ceramic capacitor group base plate, integrated large capacity electric capacity capacitance group and power inductance to form the encapsulation of system with power chip, form approximate monolithic packaging structure's firm appearance. The ceramic wafer type power converter of the utility model does not need any peripheral elements, and the volume is greatly reduced. Because chip multilayer ceramic capacitor itself has telluric electricity field, and the power inductance is directly connected with chip multilayer ceramic capacitor through printed conductor, compares in prior art's via connection, and the ground connection return circuit of electric capacity is short, and electromagnetic radiation is little, has reduced the clutter, makes power converter's output waveform smoother.
Drawings
Fig. 1 is a schematic perspective view of the present invention;
fig. 2 is a side view of the present invention;
fig. 3 is a schematic structural diagram of the ceramic capacitor bank substrate of the present invention;
FIG. 4 is a schematic structural view of a ferrite ceramic substrate according to the present invention;
FIG. 5 is a schematic view of the internal structure of the ferrite ceramic substrate of the present invention;
fig. 6 is a schematic circuit diagram according to an embodiment of the present invention.
Icon: 10-ceramic capacitor group substrate, 11A/11B/11C/11D-external electrode, 12-internal electrode, 20-ferrite ceramic substrate, 21A/21B/21C/21D-external electrode, 22-inductor, 23-printed conductor, 24-conductor column, 25-accommodating cavity, 30-resistor, 40-power chip and 41-power chip port.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the drawings in the embodiments of the present invention are combined below to clearly and completely describe the technical solutions in the embodiments of the present invention.
The present embodiment will be described in detail with reference to the schematic circuit diagram shown in fig. 6. Referring to fig. 1 and 2, a ceramic chip type power converter includes a ceramic capacitor bank substrate 10, a ferrite ceramic substrate 20, and a power chip 40. The ceramic capacitor bank substrate 10 includes two chip multilayer ceramic capacitors (one or more multilayer ceramic capacitors may be provided according to actual requirements, and in combination with a circuit diagram, the multilayer ceramic capacitor is provided as two in this embodiment), each chip multilayer ceramic capacitor includes a multilayer inner electrode 12, the inner electrode 12 of each layer is connected to an external electrode, and the external electrodes of the two chip multilayer ceramic capacitors form the external electrodes of the ceramic capacitor bank substrate 10. Referring to fig. 3, the external electrodes of the ceramic capacitor bank substrate 10 include a Vin input terminal 11A, Vout, an output terminal 11B, GND, a ground terminal 11C, and an EN port 11D.
Referring to fig. 1 and 5, the inductor 22 is layered inside the ferrite ceramic substrate 20, and a multilayer wiring pattern is formed by printing metal paste in layers inside a ferrite dielectric and sintering the multilayer wiring pattern at a high temperature. The inductor 22 thus formed is a thin film type power inductor 22, and the inductor 22 occupies a small space. The number of layers of the inductor 22 may be set according to the required coupling amount, in this embodiment, the inductor 22 is set to be two layers, and the power inductor 22 is formed by coupling two layers of inductors 22. In this embodiment, the surface of the ferrite ceramic substrate 20 opposite to the ceramic capacitor bank substrate 10 is defined as a mounting surface. The resistor 30 is provided on the mounting surface of the ferrite ceramic substrate 20, and the resistor 30 paste is printed on the mounting surface of the ferrite medium and sintered at a high temperature to form the thin film resistor 30.
Referring to fig. 4, a receiving cavity 25 is formed on the mounting surface of the ferrite ceramic substrate 20, a Flip-Chip power Chip 40 is Flip-Chip soldered in the receiving cavity 25, and the resistor 30 and the inductor 22 are respectively connected to corresponding ports of the power Chip 40 through printed wires 23 (the power Chip includes six ports of VIN, LX, EN, FB, GND and MODE). External electrodes are printed on the end faces of the ferrite ceramic substrate 20, and the external electrodes are connected to the resistor 30 and the inductor 22 via the printed wiring 23 and the wiring column 24. The external electrodes of the ferrite ceramic substrate 20 include a Vin input terminal 21A, Vout, an output terminal 21B, GND, a ground terminal 21C, and an EN port 21D.
Referring to fig. 1, a ceramic capacitor bank substrate 10 and a ferrite ceramic substrate 20 are integrally bonded to each other, and external electrodes of the ceramic capacitor bank substrate 10 and external electrodes of the ferrite ceramic substrate 20 are connected to each other. The bonding connection mode can adopt an eutectic bonding process, namely under stable temperature and pressure, the Vin input end and the Vout output end of the external electrode of the ceramic capacitor group substrate 10 are correspondingly contacted with the Vin input end and the Vout output end of the external electrode of the ferrite ceramic substrate 20, and the solid sealing connection is formed after the low-temperature melting and cooling.
In this embodiment, a gap between the power chip 40 and the accommodating cavity 25 is filled with resin (not shown in the drawings) for protecting and fixing the power chip 40.
The manufacturing method of the ceramic chip type power converter comprises the following steps:
s1, manufacturing a ceramic capacitor group substrate, specifically, manufacturing a ceramic medium by adopting an MLCC material, manufacturing an internal electrode of a ceramic capacitor by adopting a BME process, and manufacturing an external electrode by sealing the side surface of a ternary electroplating process;
s2, manufacturing a ferrite ceramic substrate, specifically, printing metal slurry in a ferrite medium in a layering mode to form a multilayer circuit pattern in three-dimensional distribution; then, printing resistance paste on the surface of the ferrite medium, and printing an external electrode; finally, sintering the ferrite medium in a high-temperature environment to form a ferrite ceramic substrate containing a power inductor and a film resistor;
s3, installing a power supply Chip, specifically, arranging an accommodating cavity on the installation surface of the ferrite ceramic substrate in the step S2, and Flip-Chip (Flip-Chip) welding the power supply Chip in the accommodating cavity;
s4, performing online test on the ferrite ceramic substrate provided with the power supply chip, debugging the resistor by laser, and coating resin on the surface of the power supply chip after debugging;
and S5, bonding and connecting the ceramic capacitor bank substrate in the step S1 and the ferrite ceramic substrate in the step S4 into a whole. Specifically, conductive metal solder is coated on the external electrodes of the ceramic capacitor bank substrate and the ferrite ceramic substrate, resin is coated on the region outside the external electrodes, and the grounding end 21C and the EN port 21D of the Vin input end 21A, Vout and the output end 21B, GND of the ceramic capacitor bank substrate correspond to the grounding end 21C and the EN port 21D of the output end 21B, GND of the Vin input end 21A, Vout of the ferrite ceramic substrate respectively; and melting the solder under a certain temperature condition, then attaching and pressing the ceramic capacitor bank substrate and the ferrite ceramic substrate, and bonding the ceramic capacitor bank substrate and the ferrite ceramic substrate into a whole after the solder and the resin are cooled to form the ceramic chip type power converter with an integral packaging structure.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. A ceramic wafer-type power converter, comprising:
a ceramic capacitor bank substrate having an external electrode;
a ferrite ceramic substrate having an inductor and an external electrode arranged in layers;
a resistor disposed on the ferrite ceramic substrate;
the power supply chip is arranged on the ferrite ceramic substrate and is communicated with the inductor and the resistor of the ferrite ceramic substrate;
the ceramic capacitor bank substrate and the ferrite ceramic substrate are bonded and connected into a whole, and the outer electrode of the ceramic capacitor bank substrate is communicated with the outer electrode of the ferrite ceramic substrate.
2. The ceramic chip type power converter as claimed in claim 1, wherein the inductor is a multilayer printed power inductor formed by printing metal paste layer by layer inside a ferrite medium to form a multilayer circuit pattern in three-dimensional distribution and sintering at high temperature.
3. The ceramic chip type power converter as claimed in claim 2, wherein the resistor is a thin film resistor formed by printing a resistor paste on the surface of a ferrite medium and sintering the printed resistor paste at a high temperature.
4. The ceramic chip type power converter according to claim 3, wherein the resistor and the inductor are connected to the corresponding ports of the power chip through printed wires, respectively.
5. The ceramic chip type power converter as claimed in claim 1, wherein the ceramic capacitor bank substrate includes two or more chip multilayer ceramic capacitors, each chip multilayer ceramic capacitor being provided with a corresponding external electrode.
6. The ceramic chip type power converter as claimed in claim 1, wherein the ferrite ceramic substrate is provided with a receiving cavity, and the power chip is flip-chip bonded to the receiving cavity.
7. The ceramic wafer type power converter as claimed in claim 6, wherein a gap between the power chip and the receiving cavity is filled with resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921525369.9U CN210273831U (en) | 2019-09-11 | 2019-09-11 | Ceramic wafer type power converter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921525369.9U CN210273831U (en) | 2019-09-11 | 2019-09-11 | Ceramic wafer type power converter |
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| Publication Number | Publication Date |
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| CN210273831U true CN210273831U (en) | 2020-04-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201921525369.9U Active CN210273831U (en) | 2019-09-11 | 2019-09-11 | Ceramic wafer type power converter |
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| CN (1) | CN210273831U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110492731A (en) * | 2019-09-11 | 2019-11-22 | 成都宏科电子科技有限公司 | A kind of ceramics water type power adapter and manufacturing method |
-
2019
- 2019-09-11 CN CN201921525369.9U patent/CN210273831U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110492731A (en) * | 2019-09-11 | 2019-11-22 | 成都宏科电子科技有限公司 | A kind of ceramics water type power adapter and manufacturing method |
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