CN213183809U - Power type leading-out thick film resistor - Google Patents
Power type leading-out thick film resistor Download PDFInfo
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- CN213183809U CN213183809U CN202022307329.6U CN202022307329U CN213183809U CN 213183809 U CN213183809 U CN 213183809U CN 202022307329 U CN202022307329 U CN 202022307329U CN 213183809 U CN213183809 U CN 213183809U
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- thick film
- film resistor
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- power type
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Abstract
The utility model relates to a resistor technical field provides a formula thick film resistor is drawn forth to power type. The utility model discloses formula thick film resistor is drawn forth to power type carries out embedment fixed connection through using bi-component organosilicon casting glue between with packaging shell and thick film resistor core, avoids conventional injection moulding technology high temperature to make the solder joint drop rosin joint phenomenon, improves high reliability and the stability of resistor in the use.
Description
Technical Field
The utility model relates to a resistor technical field specifically relates to a formula thick film resistor is drawn forth to power type.
Background
At present, thick film resistor among the thick film resistor of prior art passes through high temperature printing sintering shaping, and at the in-process of the thick film resistor core of high temperature moulding plastics, the solder joint on the thick film resistor easily drops under this high temperature condition, causes the rosin joint phenomenon, can make the reliability reduction of resistor in the use.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model provides a formula thick film resistor is drawn forth to power type avoids the solder joint to appear droing rosin joint phenomenon under high temperature environment. The specific technical scheme is as follows:
the utility model discloses the first aspect provides formula thick film resistor is drawn forth to power type, including the enclosure, install in the inside thick film resistance core of enclosure, the embedment has high temperature resistant thermal-insulated electron pouring sealant between enclosure and the thick film resistance core.
Furthermore, thick film resistor core includes the porcelain base plate, install in extraction electrode on the porcelain base plate and printing sintering in the resistance rete on porcelain base plate surface, extraction electrode and resistance rete welded connection.
Further, the resistor also comprises a lead terminal fixedly arranged at the top of the packaging shell; the lead-out electrode is connected with the lead terminal in a welding mode.
Further, the resistor further comprises a ceramic framework, the ceramic framework is installed inside the packaging shell and located below the lead terminal, the top end of the ceramic framework is fixedly connected with the packaging shell, and the thick-film resistor core is fixed at the bottom end of the ceramic framework through high-temperature-resistant heat-insulation electronic potting adhesive.
Further, a potting cavity is formed among the packaging shell, the ceramic framework and the thick film resistor core, and high-temperature-resistant heat-insulating electronic potting adhesive is potted in the potting cavity.
Furthermore, the number of the leading-out terminals is the same as that of the leading-out electrodes, and the number of the leading-out terminals is at least two.
Furthermore, the high-temperature-resistant heat-insulating electronic pouring sealant is a two-component organic silicon pouring sealant.
The utility model discloses formula thick film resistor is drawn forth to power type carries out embedment fixed connection through using bi-component organosilicon casting glue between with packaging shell and thick film resistor core, avoids conventional injection moulding technology high temperature to make the solder joint drop rosin joint phenomenon, improves high reliability and the stability of resistor in the use.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
Fig. 1 is a perspective front view of a power type lead-out thick film resistor according to an embodiment of the present invention.
Fig. 2 is a perspective top view of a power type lead-out thick film resistor according to an embodiment of the present invention.
Wherein, 1, packaging shell; 2. a thick film resistive core; 3. a ceramic skeleton; 4. a lead terminal; 5. high-temperature-resistant heat-insulating electronic pouring sealant.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings.
As shown in fig. 1, the utility model discloses power type draws forth formula thick film resistor, including packaging shell 1, install in the inside thick film resistance core 2 of packaging shell 1, the embedment has high temperature resistant thermal-insulated electron pouring sealant 5 between packaging shell 1 and the thick film resistance core 2.
The thick film resistor core 2 comprises a ceramic substrate, an extraction electrode arranged on the ceramic substrate and a resistor film layer printed and sintered on the surface of the ceramic substrate, wherein the extraction electrode is electrically connected with the resistor film layer in a welding mode.
Wherein, the resistor also comprises a lead terminal 4 fixedly arranged on the top of the packaging shell 1; the lead-out electrode is electrically connected with the lead terminal 4 in a welding mode; the number of the lead terminals 4 is the same as that of the lead electrodes, and the number is at least two.
The resistor further comprises a ceramic framework 3, the ceramic framework 3 is installed inside the packaging shell 1 and located below the lead terminal 4, the top end of the ceramic framework 3 is fixedly connected with the packaging shell 1, and the thick film resistor core 2 is fixedly bonded to the bottom end of the ceramic framework 3 through high-temperature-resistant heat-insulation electronic pouring sealant.
Wherein, a potting cavity is formed among the packaging shell 1, the ceramic framework 3 and the thick film resistor core 2, and a high temperature resistant heat insulation electronic potting adhesive 5 is potted in the potting cavity.
The bottom end of the packaging shell 1 is provided with a fixed wing extending in the left-right direction, and the fixed wing is provided with a fixed hole for being fixedly connected with an external object; and a rib plate is arranged between the fixed wing and the packaging shell 1, so that the structure is stable.
Wherein, the package case 1 may be a plastic case.
Wherein, the high temperature resistant heat insulation electronic pouring sealant 5 is a bi-component organic silicon pouring sealant.
The power type leading-out thick film resistor of the embodiment can prevent the phenomenon of insufficient soldering in the process of high-temperature injection molding, and the principle is as follows: on one hand, the encapsulated colloid can buffer the structure from external physical impact, so that welding spots in the colloid are firm and are not easy to fall off due to impact; on the other hand, the process avoids that welding spots are easy to damage and fall off in a high-temperature environment, prevents the phenomenon of insufficient welding, and can improve the high reliability and stability of the resistor in the use process.
It should be understood that the mounting between the structures in the embodiments of the present invention may refer to welding, bolting, screwing, scarf joining, and bonding; the connection between the pipes may be referred to as communication; the connection between the appliances may refer to an electrical connection. The present invention is not limited to the precise arrangements described above and shown in the drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the present invention is limited only by the appended claims.
Claims (7)
1. The power type leading-out thick film resistor is characterized by comprising a packaging shell and a thick film resistor core arranged inside the packaging shell, wherein high-temperature-resistant heat-insulating electronic pouring sealant is poured and sealed between the packaging shell and the thick film resistor core.
2. The power type lead-out thick film resistor as claimed in claim 1, wherein the thick film resistor core comprises a ceramic substrate, lead-out electrodes mounted on the ceramic substrate, and a resistor film layer printed and sintered on the surface of the ceramic substrate, and the lead-out electrodes are connected with the resistor film layer in a welding manner.
3. A power type lead-out thick film resistor as claimed in claim 2, further comprising a lead terminal fixedly mounted on the top of said package; the lead-out electrode is electrically connected with the lead terminal.
4. The power type lead-out thick film resistor as claimed in claim 3, further comprising a ceramic frame, wherein the ceramic frame is mounted inside the package and below the lead terminal, the top end of the ceramic frame is fixedly connected with the package, and the thick film resistor core is fixed at the bottom end of the ceramic frame.
5. The power type lead-out thick film resistor of claim 4, wherein a potting chamber is formed among the package case, the ceramic skeleton and the thick film resistor core, and a high temperature resistant heat insulation electronic potting adhesive is potted in the potting chamber.
6. A power takeoff thick film resistor as claimed in any one of claims 3 to 5, wherein said lead terminals and said takeoff electrodes are the same in number, at least two in number.
7. The power type lead-out thick film resistor of any one of claims 1-5, wherein the high temperature resistant and heat insulating electronic potting adhesive is a two-component silicone potting adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022307329.6U CN213183809U (en) | 2020-10-16 | 2020-10-16 | Power type leading-out thick film resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022307329.6U CN213183809U (en) | 2020-10-16 | 2020-10-16 | Power type leading-out thick film resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213183809U true CN213183809U (en) | 2021-05-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022307329.6U Active CN213183809U (en) | 2020-10-16 | 2020-10-16 | Power type leading-out thick film resistor |
Country Status (1)
| Country | Link |
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| CN (1) | CN213183809U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112133511A (en) * | 2020-10-16 | 2020-12-25 | 陕西和盈信泰电子有限公司 | Power type lead-out thick film resistor and packaging method thereof |
-
2020
- 2020-10-16 CN CN202022307329.6U patent/CN213183809U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112133511A (en) * | 2020-10-16 | 2020-12-25 | 陕西和盈信泰电子有限公司 | Power type lead-out thick film resistor and packaging method thereof |
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