CN108901168B

CN108901168B - Package, switching power supply module, PCB module and air conditioner

Info

Publication number: CN108901168B
Application number: CN201810887030.7A
Authority: CN
Inventors: 麦智炜
Original assignee: Midea Group Co Ltd; GD Midea Air Conditioning Equipment Co Ltd
Current assignee: Midea Group Co Ltd; GD Midea Air Conditioning Equipment Co Ltd
Priority date: 2018-08-06
Filing date: 2018-08-06
Publication date: 2024-03-26
Anticipated expiration: 2038-08-06
Also published as: CN108901168A

Abstract

The invention discloses a packaging body, a switching power supply module, a PCB module and an air conditioner. The packaging shell is provided with a containing cavity; the inner PCB is arranged in the accommodating cavity; the component is arranged in the accommodating cavity and is electrically connected to the internal PCB; the packaging body further comprises a potting material, the potting material is filled in the area where the inner PCB is located, and the potting material coats the inner PCB. According to the technical scheme, the encapsulating material is filled in the area where the inner PCB is located, the encapsulating material coats the inner PCB, the inner PCB can be fixed after the encapsulating material is solidified, and as the components are welded to the inner PCB, namely the components are fixed, the encapsulating material among the components is reduced, namely the distributed capacitance among the components is reduced, and therefore the electromagnetic compatibility effect is improved.

Description

Package, switching power supply module, PCB module and air conditioner

Technical Field

The invention relates to the technical field of electronic component packaging, in particular to a packaging body, a switching power supply module, a PCB module and an air conditioner.

Background

The package body modularly packages each discrete component, so that a module with smaller volume and higher power density is formed. For example, an internal PCB board is provided in the package, the components are soldered to the internal PCB board, and the internal PCB board is electrically connected to the external PCB board through pins, and electrically connected to an external circuit.

Generally, the package has two types, namely, a non-potting structure and a potting structure, and the potting structure is filled with potting material completely inside the package to fix and protect the internal components, but since the dielectric constant of the potting material is greater than that of air, the distributed capacitance between the components is increased, thereby reducing the electromagnetic compatibility effect.

Disclosure of Invention

The invention mainly aims to provide a packaging body, which aims to solve the problem of distributed capacitance increase caused by filling potting materials in the packaging body.

To achieve the above object, the present invention discloses a package comprising:

the packaging shell is provided with a containing cavity;

the inner PCB is arranged in the accommodating cavity;

the component is arranged in the accommodating cavity and is electrically connected to the internal PCB; the method comprises the steps of,

and the encapsulating material is filled in the area where the inner PCB is located, and the encapsulating material coats the inner PCB.

Optionally, the potting material is further filled in the area where the component is located, so as to cover a part of the component.

Optionally, the top surface of the component is exposed out of the potting material.

Optionally, the filling height of the potting material is 25% -65% of the depth of the cavity.

Optionally, the component comprises an electrolytic capacitor, an explosion-proof valve is arranged on the top surface of the electrolytic capacitor, and the explosion-proof valve is exposed out of the potting material.

Optionally, the package further includes a lead, one end of the lead is electrically connected to the internal PCB, and the other end of the lead is electrically connected to the external PCB; the encapsulating material also coats the part of the guide pin corresponding to the encapsulating material.

Optionally, the potting material comprises epoxy, polyurethane or silicone.

Optionally, the package further includes a lead, one end of the lead is electrically connected to the internal PCB, and the other end of the lead is electrically connected to the external PCB; the other end of the guide pin penetrates through the penetrating part of the packaging shell, and the guide pin and the penetrating part of the packaging shell are formed into an integrated structure.

Optionally, the packaging shell comprises an end plate and a cover body, the cavity is arranged in the cover body, the cover body is provided with an opening, the opening is communicated with the cavity, the end plate is arranged in the opening to block the cavity, and the end plate is a penetrating part of the packaging shell; the inner PCB board is arranged in the containing cavity, and the guide pin penetrates through the end plate and is integrally formed with the end plate and used for being electrically connected with the outer PCB board.

Optionally, an insulating layer is coated at the position of the guide pin corresponding to the accommodating cavity;

or, the part of the guide pin corresponding to the containing cavity is coated with an insulating layer, and the insulating layer and the guide pin are formed into an integrated structure;

or, the part of the guide pin corresponding to the containing cavity is coated with an insulating layer, and the insulating layer and the end plate are molded into an integrated structure;

or, the part of the guide pin corresponding to the containing cavity is coated with an insulating layer, and the insulating layer, the end plate and the guide pin are formed into an integrated structure.

The invention also discloses a switching power supply module which comprises the packaging body.

Optionally, the components include one or more of a transformer, an inductor, and an electrolytic capacitor.

The invention also discloses a PCB module, which comprises an external PCB and a switch power supply module electrically connected to the external PCB, wherein the switch power supply module is the switch power supply module.

The invention also discloses an air conditioner which comprises the PCB module.

According to the technical scheme, the encapsulating material is filled in the area where the inner PCB is located, the encapsulating material coats the inner PCB, the inner PCB can be fixed after the encapsulating material is solidified, and as the components are welded to the inner PCB, namely the components are fixed, the encapsulating material among the components is reduced, namely the distributed capacitance among the components is reduced, and therefore the electromagnetic compatibility effect is improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic view of a package mounted on an external PCB structure;

FIG. 2 is a perspective view of a package;

FIG. 3 is a perspective view of the package (another view);

FIG. 4 is a front view of the package;

FIG. 5 is a schematic diagram of a package structure;

FIG. 6 is an exploded view of the package;

FIG. 7 is an exploded view of the package;

FIG. 8 is a schematic diagram of encapsulation material encapsulation (encapsulation material encapsulates the inner PCB) according to an embodiment;

FIG. 9 is a schematic diagram of encapsulating material (encapsulating material encapsulates the bottom of the internal PCB and components, with one end of the component pins being the bottom);

FIG. 10 is a schematic diagram of encapsulation material encapsulation (encapsulation material encapsulates the inner PCB and components below the top surface);

FIG. 11 is a schematic view of the structure of the pins, insulating layer and end plates;

FIG. 12 is a perspective view of the cover;

fig. 13 is a front view of the housing.

Reference numerals illustrate:

the achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.

Detailed Description

The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present invention are merely used to explain the relative positional relationship, movement, etc. between the components in a particular posture (as shown in the drawings), and if the particular posture is changed, the directional indicator is changed accordingly.

In the present invention, unless specifically stated and limited otherwise, the terms "connected," "affixed," and the like are to be construed broadly, and for example, "affixed" may be a fixed connection, a removable connection, or an integral body; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.

Furthermore, descriptions such as those referred to as "first," "second," and the like, are provided for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implying an order of magnitude of the indicated technical features in the present disclosure. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present invention.

The invention provides a package.

As shown in fig. 1 to 8 and 11 to 13, in the present embodiment, the package 1 includes:

a package housing 100, wherein the package housing 100 is provided with a containing cavity 112;

an inner PCB220, wherein the inner PCB220 is disposed in the cavity 112;

the component 230 is disposed in the cavity 112, and is electrically connected to the internal PCB 220;

the package 1 further includes a potting material 3 (shown in phantom in fig. 8, 9 and 10), the potting material 3 is filled in the area where the inner PCB220 is located, and the potting material 3 encapsulates the inner PCB 220.

In this embodiment, the package body 1 encapsulates the inner PCB220 through the package housing 100, and the package housing 100 performs the functions of mounting, fixing, sealing, protecting, etc. The internal PCB220 is used for electrically connecting the components 230. Generally, the inner PCB220 may be electrically connected to the outer PCB2 through the pins 210, to achieve connection of the circuits inside the package 1 and the circuits outside.

The potting material 3 fills the region where the inner PCB220 is located, and the potting material 3 encapsulates the inner PCB 220. The area where the inner PCB220 is located, that is, the inner PCB220 occupies a certain space in the cavity 112, and the potting material 3 fills the space and encapsulates the inner PCB 220. The potting material 3 encapsulates the inner PCB220, i.e. fixes the inner PCB220 in the cavity 112, and improves the insulation of the inner PCB 220. When the internal PCB220 is electrically connected to the components 230, the potting material 3 also encapsulates the pins of the components 230, so as to ensure insulation between the components 230. The potting material 3 encapsulates the inner PCB220 and is fixed in the cavity 112, and the component 230 is electrically connected to the inner PCB220, i.e. the position of the component 230 is fixed. Therefore, in this embodiment, the encapsulating material 3 coats the inner PCB220, so that the encapsulating material between the components 230 is reduced or eliminated, thereby reducing the distributed capacitance between the components 230 and improving the electromagnetic compatibility effect. In addition, since the amount of the potting material 3 is reduced, the weight of the package 1 is reduced, and the cost of the package 1 can be reduced.

When the package 1 is in operation, heat is generated inside the package 1, so the material of the package housing 100 may be selected from insulating plastic, ceramic, etc. with high heat conductivity. The external PCB2 is a carrier of external components, and the package 1 may be electrically connected to the external PCB2 through the lead 210.

The electrical connection as described above is a fairly easy way for a person skilled in the art to solder by means of solder paste or other soldering material, as follows.

Further, as shown in fig. 9 or 10, the potting material 3 is further filled in the region where the component 230 is located, so as to cover a part of the component 230. Fig. 9 shows the potting material 3 covering the bottom of the component 230, and fig. 10 shows the potting material 3 covering a portion below the top surface of the component 230. Unlike the above embodiment, in the present embodiment, the potting material 3 is further filled in the region where the component 230 is located, so as to further fix the component 230, ensure insulation between the components 230, and improve resistance to external impact and vibration. The part of the components 230, that is, the potting material 3, is not fully coated on the components 230, so that the potting material 3 is only partially coated on the components 230 in comparison with the case that the potting material 3 is fully filled in the cavity 112, the distributed capacitance is reduced to a certain extent on the premise of ensuring the insulativity between the components 230 and improving the resistance to external impact and vibration even if the potting material 3 exists between the components 230. The part may be a part corresponding to the heights 1/3, 1/2, and 2/3 of the component 230, or a part below the top surface of the component 230.

Further, as shown in fig. 9 and 10, the top surface of the component 230 is exposed to the potting material 3. In this embodiment, the potting material 3 covers a part of the component 230, but no matter where the potting material covers the component 230, the top surface of the component 230 is exposed. This allows the top surface of the component 230 to be provided with some protective structures, avoiding the potting material 3 from affecting the protective structures.

Preferably, the filling height of the potting material 3 is 25% -65% of the depth of the cavity 112. In this embodiment, the filling height of the potting material 3 may be 25%,30%,45%,53%,60% or 65% of the depth of the cavity 112. The filling height of the potting material 3 is adjusted to ensure fixation and insulation between the components 230 and to achieve electromagnetic compatibility.

Further, the component 230 includes an electrolytic capacitor, and an explosion-proof valve is disposed on the top surface of the electrolytic capacitor and exposed out of the potting material 3. The electrolytic capacitor is provided with an explosion-proof valve to prevent severe explosion when the electrolytic capacitor fails. When the encapsulating material 3 coats the electrolytic capacitor, the encapsulating material 3 forms a window at the position of the electrolytic capacitor, so that the explosion-proof valve can be exposed, and the explosion-proof valve is prevented from being invalid due to the fact that the encapsulating material 3 completely covers the explosion-proof valve.

Further, as shown in fig. 8 to 9, the package 1 further includes a lead 210, one end of the lead 210 is electrically connected to the inner PCB220, and the other end is electrically connected to the outer PCB 2; the potting material 3 also coats the portion of the lead 210 corresponding to the potting material 3. The package 1 is soldered to the external PCB2 through the lead 210, and the electrical connection between the internal PCB220 and the external PC board 2 is achieved. Since one end of the lead 210 needs to be soldered to the inner PCB220, the lead 210 needs to be in contact with the potting material 3, i.e., the potting material 3 covers the corresponding portion of the lead 210.

Further, the potting material 3 comprises epoxy, polyurethane or silicone.

Further, the other end of the lead 210 penetrates through the penetration portion of the package 100, and the lead 210 and the penetration portion of the package 100 are formed as an integral structure. In this embodiment, the suspension distance from one end (the end electrically connected to the inner PCB 220) to the other end (the end electrically connected to the outer PCB 2) of the pins 210 is too long, and each pin 210 is easily touched to change the relative position, and when the package housing 100 is filled with only the partial potting material 3, the pins 210 cannot be aligned well to the soldering area of the outer PCB2 when the package body 1 is mounted to the outer PCB2, which results in difficulty in soldering. Therefore, in the embodiment, the pins 210 penetrate through the package housing 100, and the penetrating portions of the pins 210 and the package housing 100 are formed into an integral structure, so that the penetrating portions can fix the relative positions of the pins 210, and prevent the relative positions of the pins 210 from being changed due to the overlarge suspension distance, so as to facilitate the soldering of the package 1 to the external PCB 2. The penetrating part is a structure combined with the lead 220, and can be separated from the package housing 100 alone, so that the internal PCB220 can be placed in the cavity 112 conveniently, and the production is facilitated. The lead 210 and the penetration portion of the package housing 110 may be formed as an integral structure by injection molding or sintering.

Further, as shown in fig. 6 and 7, the package housing 100 includes an end plate 130 and a cover 110, the cavity 112 is disposed in the cover 110, the cover 110 is provided with an opening 111, the opening 111 is communicated with the cavity 112, the end plate 130 is disposed in the opening 111 to block the cavity 112, and the end plate 130 is a penetrating portion of the package housing 100; the inner PCB220 is disposed in the cavity 112, and the pins 210 penetrate through the end plate 130 and are integrally formed with the end plate 130, so as to be electrically connected with the outer PCB 2.

That is, the end plate 130 is a penetration portion. In this embodiment, the cover 110 forms an opening 111 to facilitate placement of the components, and the cover 110 and the end plate 130 in combination together form a protection for the components placed in the cavity 112. The end plate 130 is disposed at the opening 111, and since the pin 210 and the penetrating portion of the package housing 100 are formed into an integral structure, the pin 210 is welded on the inner PCB220, and when the potting material is poured into the cover 110, the inner PCB220 and the pin 210 are fixed, that is, the end plate 130 is also fixed; or the end plate 130 may be bonded to the cover 110 by an adhesive to seal the cavity 112.

Further, the portion of the lead 210 corresponding to the cavity 112 is covered with an insulating layer 140. When the package can 100 encapsulates the component 230, since the internal space of the package can 100 is limited, when the pins 210 are positioned too close to the component 230, the pins 210 easily touch the component 230 during the manufacturing process of the package body 1, thereby causing a short circuit. Therefore, as shown in fig. 5, 7 and 11, by coating the insulating layer 140 on the portion of the lead 210 corresponding to the cavity 112, even when the lead 210 contacts the component 230, the occurrence of short circuit is avoided due to the insulating layer 140, thereby improving the product yield. It should be understood that, as described above, the insulating layer 140 is disposed to avoid the pin 210 touching the component 230 to cause a short circuit, so the portion of the pin 210 corresponding to the cavity 112 is a portion that is easy to touch the component 230, and the insulating layer 140 is covered on the portion to prevent the short circuit.

The pins 210 and the insulating layer 140 may nest with each other. That is, the insulating layer 140 is prepared first, the insulating layer 140 has a cylindrical shape, and then the lead 210 is embedded in the insulating layer 140. In order to further improve the production efficiency, in one embodiment, the lead 210 and the insulating layer 140 are formed as a unitary structure. Through shaping structure as an organic whole to improve production efficiency. The integrated structure may refer to the molding technology in the prior art, for example, a molten insulating material (a material for preparing the insulating layer 140) is poured into a mold, the lead 210 is placed in the mold, and after cooling, the insulating layer 140 and the lead 210 are formed into an integrated structure; alternatively, the preform to be sintered is covered outside the lead 210, and is formed into an integral structure by sintering. The bonding strength of the lead 210 and the insulating layer 140 can be improved by forming the lead 210 and the insulating layer 140 into an integral structure, so that the lead 210 is prevented from falling out of the insulating layer 140.

In an embodiment, the portion of the lead 210 corresponding to the cavity 112 is covered with the insulating layer 140, and the insulating layer 140 and the end plate 130 are formed into an integral structure. The insulating layer 140 and the end plate 130 may be molded or sintered by a mold, as long as they are molded as an integral structure. The insulation layer 140 and the end plate 130 are formed as an integral structure, and the pins 210 protrude through the insulation layer 140 and the end plate 130 to be electrically connected with the external PCB board 2, or the pins 210 and the insulation layer 140 are formed as an integral structure, and the insulation layer 140 and the end plate 130 are formed as an integral structure. When the inner PCB220 and the components 230 are fixed by potting material filled in the case 110, the insulating layer 140 is fixed, thereby fixing the end plate 130. In addition, the insulation layer 140 and the end plate 130 are formed into an integral structure, so that the pins 210 can be further fixed, the distance between the pins 210 is ensured, and the pins 210 are prevented from being shifted.

In an embodiment, the portion of the lead 210 corresponding to the cavity 112 is covered with the insulating layer 140, and the insulating layer 140, the end plate 130 and the lead 210 are formed into an integral structure. In this embodiment, the insulating layer 140, the end plate 130 and the lead 210 are formed into an integral structure, so as to improve the production efficiency. Secondly, the three parts are formed into an integral structure, namely, the three parts are tightly combined, so that the joint of the guide pin 210 and the end plate 130 is prevented from being cracked and loosened, and the fixing effect is ensured.

Further, as shown in fig. 11, the insulating layer 140 includes a body portion 141 and a step portion 142 connected to the body portion 141, the body portion 141 and the step portion 142 are formed as a unitary structure and cover the lead 210, and the step portion 142 and the end plate 130 are formed as a unitary structure; the step portion 142 has a larger dimension in the radial direction of the lead 210 than the body portion 141 has in the radial direction of the lead 210.

In the present embodiment, by making the dimension of the stepped portion 142 in the radial direction of the lead 210 larger than the dimension of the body portion 141 in the radial direction of the lead 210, the bonding strength between the end plate 130 and the insulating layer 140 is enhanced, and the occurrence of breakage between the end plate 130 and the insulating layer 140 is prevented. As such, in producing the package body 1 of the present embodiment, the end plate 130, the insulating layer 140, and the pins 210 may be soldered as a whole into the internal PCB220 to improve production efficiency.

The above-described molded integral structure may be formed by sintering a ceramic raw material, or by injection molding a plastic raw material, or by rubber extrusion molding, or the like. In this embodiment, the integrated structure is formed by injection molding, so that the production efficiency is improved, and the weight of the product is reduced.

Further, the insulating layer 140 is made of an insulating material. The insulating material is a material that is not conductive at the allowable voltage. Such as common plastics, rubber, ceramics or insulating paint, etc. When an insulating paint is used, the insulating layer may be formed by coating.

Further, as shown in fig. 1 to 13, the package case 100 is provided with a protrusion 120, and the protrusion 120 is used to abut against the external PCB2, so that a space defined between the package case 100 and the external PCB2 is communicated with an external space.

In this embodiment, by providing the protrusion 120 on the package case 100, when the package body 1 is electrically connected to the external PCB2, the protrusion 120 is abutted against the external PCB2, and a space is commonly defined between the package case 100 and the external PCB2, and the space is communicated with the external space due to the presence of the protrusion 120, so that moist air is not easily collected between the package case 100 and the external PCB 2. When the environment is moist or the environment changes rapidly, air can flow between the space defined by the packaging shell 100 and the external PCB2 and the external space, so that condensation water is not easy to gather to form, the reduction of the insulation performance of the surface of the external PCB2 caused by the formation of the condensation water is prevented, and the failure of the circuit of the external PCB2 is avoided.

The external space means a space other than the space defined between the package case 100 and the external PCB board 2, and air of the external space and air of the defined space are circulated.

Further, the protrusion 120 is provided on the cover 110 or the end plate 130.

Further, as shown in fig. 3, the protruding portion 120 is disposed at a bottom edge of the cover 110 corresponding to the opening 111. In this embodiment, the protruding portion 120 is disposed at the bottom edge of the cover 110, so that a space is formed between the bottom of the package housing 100 and the external PCB2, and the occupation of the volume can be reduced in a limited space.

In one embodiment, the protrusion 120 is disposed on the end plate 130. The protrusion 120 may be provided on the end plate 130 according to different requirements. Further, the protrusion 120 is provided at an edge portion of the end plate 130. By providing the projection 120 at the edge portion of the end plate 130, the arrangement of the pins 210 is prevented from being affected.

Further, the protruding portion 120 may protrude from the package case 100 to a greater or lesser extent than the lead 210 protrudes from the package case 100. When the protruding degree of the protruding portion 120 is greater than that of the lead 210, the structure of the external PCB2 needs to be modified, for example, the corresponding portion of the external PCB2 is thickened, so that the connection between the lead 210 and the external PCB2 is ensured, and the attachment between the package housing 100 and the external PCB2 is prevented, but the cost is increased due to the modification of the structure of the external PCB 2. Therefore, in the present embodiment, as shown in fig. 4, the size of the protrusion 120 is smaller than the size of the portion of the lead 210 protruding from the end plate 130 in the direction of the lead 210. When the tip of the lead 210 is electrically connected to the external PCB2, the protruding portion 120 abuts against the external PCB2, which plays a role of positioning and bearing. When the protruding portion 120 abuts against the external PCB2, the end of the lead 130 is embedded into the corresponding soldering position of the external PCB2, so that the dummy solder is not caused by too much or too little embedding, and the protruding portion 120 plays a role of bearing the package housing 100 during soldering, so that soldering is easy to be performed.

Further, the protrusion 120 is formed as a unitary structure with the end plate 130 or the cover 130. In this embodiment, the protruding portion 120 and the end plate 130 or the cover body 110 are formed into an integral structure, which avoids the need to separately connect the protruding portion 120 to the end plate 130 or the cover body 110, and the protruding portion and the end plate 130 or the cover body 110 are formed at the same time during the manufacturing process, thereby improving the production efficiency. It is understood that forming the unitary structure includes being accomplished by an injection molding process or a sintering molding process.

Further, as shown in fig. 1 to 13, the cover 110 has a rectangular parallelepiped structure, and the protrusion 120 is disposed on the cover 110 and located at a corner of a bottom edge of the cover 110. In this embodiment, the cover 110 is configured as a cuboid structure to accommodate the structural requirement of the internal PCB board, and maximize the space enclosed by the cavity. In addition, the protruding portions 120 are disposed at the corners of the bottom edge of the cover 110, that is, in this embodiment, the number of the protruding portions 120 is four, and the protruding portions 120 are distributed at the corners of the bottom edge of the cover 110, so that a larger space is formed between adjacent protruding portions 120, so that air flows more easily, and aggregation of humid air is further avoided.

Further, in the present embodiment, the height of the protruding portion is 0.8 to 3.5mm. The height of the protrusion 120, which may be 0.8mm, 1.3mm, 1.9mm, 2.4mm, 2.7mm, 3.1mm or 3.5mm, is adjusted to ensure that formation of dew condensation water is prevented without taking up excessive volume.

Further, as shown in fig. 3, the protrusion 120 includes a first protrusion 121 and a second protrusion 122 connected to each other, and the first protrusion 121 and the second protrusion 122 are connected to corners of the bottom edge of the cover 110. In this embodiment, the protruding portion 120 is provided as the first protruding member 121 and the second protruding member 122, and the first protruding member 121 and the second protruding member 122 are intersected and arranged to be adapted to the corner of the bottom edge of the cover body 110, so when the package body 1 is mounted on the external PCB2, the existence of the protruding portion 120 can ensure that the distances between the four corners of the cover body 110 and the external PCB2 are consistent, that is, the distances between the package housing 100 and the external PCB2 are consistent, so as to avoid the skew of the local package body 1. In addition, the protrusion 120 ensures the supporting effect of the package case 100 and also allows air circulation between the space defined between the package case 100 and the external PCB board 2 and the external space.

Further, as shown in fig. 12, the inner supporting boss 113 of the cover 110 is in contact with the inner PCB220, so that the inner PCB220 is not closely attached to the inner wall of the cover 110 along the depth direction of the cavity 112. In this embodiment, the inner PCB220 is not tightly attached to the inner wall of the cover 110, so that a space is formed for filling the potting material 3, and the coating of the PCB220 is achieved. The production process of the package in this embodiment is as follows: the end plate 130, the sealing layer 140 and the lead 210 are formed into an integrated structure, welded to the inner PCB220, the component 230 is welded to the inner PCB220, then embedded into the cover 110 (the cover 110 is filled with the encapsulating material 3) as a whole, the encapsulating material 3 flows to cover the inner PCB220 or cover the inner PCB220 and part of the component 230, and the encapsulation body is obtained after the encapsulating material 3 is solidified.

The invention also discloses a switch power supply module which comprises the package body 1.

The switch power supply module is used for carrying out modularized packaging on discrete components on the switch power supply, so that a module power supply with smaller volume and higher power density is formed. Because the switching power supply module comprises all the technical schemes of all the embodiments, the switching power supply module at least has all the beneficial effects brought by the technical schemes of the embodiments, and the description is omitted herein.

Further, reference may be made to a switching power supply module in the prior art, where the components include one or more of a transformer, an inductor, and an electrolytic capacitor.

The invention also discloses a PCB module, which comprises an external PCB2 and a switch power supply module electrically connected to the external PCB2, wherein the switch power supply module is the switch power supply module.

Because the present PCB module includes all the technical solutions of all the embodiments described above, at least the technical solutions of the embodiments described above have all the beneficial effects brought by the technical solutions of the embodiments described above, and will not be described in detail herein.

The invention also discloses an air conditioner which comprises the PCB module. The present embodiment adopts all the technical solutions of all the above embodiments, so at least has all the beneficial effects brought by the technical solutions of the above embodiments, and will not be described in detail herein.

The foregoing description is only of the preferred embodiments of the present invention and is not intended to limit the scope of the invention, and all equivalent structural changes made by the description of the present invention and the accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the invention.

Claims

1. A package, the package comprising:

the packaging shell is provided with a containing cavity; the packaging shell comprises an end plate and a cover body, the containing cavity is arranged in the cover body, the cover body is provided with an opening, the opening is communicated with the containing cavity, and the end plate is arranged at the opening to seal the containing cavity;

the inner PCB is arranged in the accommodating cavity;

the encapsulating material is filled in the area where the inner PCB is located through the opening, and the encapsulating material coats the inner PCB;

the packaging shell is provided with a convex part at the opening, and the convex part is used for propping against an external PCB (printed circuit board) so as to enable a space defined between the packaging shell and the external PCB to be communicated with an external space;

the external PCB is used for being electrically connected with the internal PCB;

the convex part comprises a first convex part and a second convex part which are connected in an intersecting way, and the first convex part and the second convex part are connected at the corner of the bottom edge of the cover body;

the packaging body further comprises a guide pin, one end of the guide pin is electrically connected to the inner PCB, the other end of the guide pin penetrates through the end plate to be used for being electrically connected with the outer PCB, and the encapsulating material also coats the position, corresponding to the encapsulating material, of the guide pin.

2. The package of claim 1, wherein the potting material also fills the area where the component is located to encapsulate a portion of the component.

3. The package of claim 1 or 2, wherein a top surface of the component is exposed to the potting material.

4. A package according to claim 3, wherein the filling height of the potting material is 25% to 65% of the depth of the cavity.

5. The package of claim 1 or 2, wherein the component comprises an electrolytic capacitor, and an explosion-proof valve is disposed on a top surface of the electrolytic capacitor, and the explosion-proof valve is exposed from the potting material.

6. The package of claim 1, wherein the potting material comprises an epoxy, polyurethane, or silicone.

7. The package of claim 1, wherein the leads extend through the end plate and are integrally formed with the end plate.

8. The package of claim 7, wherein the portion of the lead corresponding to the cavity is covered with an insulating layer;

9. A switching power supply module comprising the package of any one of claims 1 to 8.

10. The switching power supply module of claim 9 wherein said components include one or more of transformers, inductors, electrolytic capacitors.

11. A PCB module, comprising an external PCB board and a switching power supply module electrically connected to the external PCB board, wherein the switching power supply module is a switching power supply module according to claim 9 or 10.

12. An air conditioner comprising the PCB module of claim 11.