CN207637777U - A kind of semiconductor package, SAW filter and terminal device - Google Patents
A kind of semiconductor package, SAW filter and terminal device Download PDFInfo
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- CN207637777U CN207637777U CN201721738603.7U CN201721738603U CN207637777U CN 207637777 U CN207637777 U CN 207637777U CN 201721738603 U CN201721738603 U CN 201721738603U CN 207637777 U CN207637777 U CN 207637777U
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- substrate
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- semiconductor package
- packaging body
- sealing element
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 41
- 239000000758 substrate Substances 0.000 claims abstract description 54
- 238000004806 packaging method and process Methods 0.000 claims abstract description 41
- 238000007789 sealing Methods 0.000 claims abstract description 28
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 229920001187 thermosetting polymer Polymers 0.000 claims description 8
- 239000011241 protective layer Substances 0.000 claims description 6
- 238000005538 encapsulation Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 8
- 239000003822 epoxy resin Substances 0.000 abstract description 7
- 229920000647 polyepoxide Polymers 0.000 abstract description 7
- 238000001914 filtration Methods 0.000 description 12
- 238000005516 engineering process Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 210000002421 cell wall Anatomy 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002633 protecting effect Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000003319 supportive effect Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
The utility model discloses a kind of semiconductor package, SAW filter and terminal device, wherein semiconductor package includes：Substrate has opposite first side and second side；Chip is inverted in the first side of substrate and is arranged with first side interval；Packaging body is located at first side along the circumference ring of substrate, and packaging body is with chip chamber every setting；Sealing element, circumference are tightly connected with one side of the packaging body far from substrate, and cavity is formed between sealing element, chip, substrate and packaging body.It is molded epoxy resin encapsulating material by the circumference annular along substrate, and sealing element is set in the upper side of packaging body, overflow influences the performance of chip to chip functions area when can be molded to avoid epoxy resin encapsulating material, to improve the yield of semiconductor package.The size of the semiconductor package of the utility model is small, can meet the requirement of SAW filter miniaturization, adapt to the miniaturization trend of terminal device.
Description
Technical field
The utility model is related to semiconductor technologies, and in particular to a kind of semiconductor package and include the semiconductor packages
The SAW filter and terminal device of structure.
Background technology
SAW filter is widely used on mobile communication terminal device, is sent out with the miniaturization of terminal device
Exhibition, wherein the SAW filter encapsulating structure used needs to be designed as miniaturization structure.The filtering core of SAW filter
When piece encapsulates, it is desirable that a cavity structure must be designed below filtering chip, and ensure the positive functional areas of filtering chip not with
Any substance contact.
In existing SAW filter encapsulating structure, a groove typically is opened up in substrate front side, core will be filtered
Piece is arranged in groove, then feeds in substrate front side injection sealed, and the size of filtering chip is less than the size of groove, in order to pacify
Fill filtering chip.In addition, in order to adapt to the miniaturization requirement of SAW filter encapsulating structure, encapsulating compound and filtering core
Gap very little between piece is even directly contacted with filtering chip, but due to having between filtering chip and the cell wall of groove between
Gap, therefore encapsulating compound is easy to by overflow in the gap between filtering chip and the cell wall of groove in injection moulding process to filtering core
In cavity below piece, the performance failure of filtering chip is caused, the SAW filter encapsulating structure is caused to be scrapped.Therefore,
Existing SAW filter encapsulating structure has that yield is low.
Utility model content
The purpose of this utility model is to provide a kind of semiconductor packages, and size is small, and good in production process
Rate is high.
Another of the utility model is designed to provide a kind of SAW filter and terminal device of miniaturization.
For this purpose, the utility model uses following technical scheme：
On the one hand, the utility model provides a kind of semiconductor package, including：
Substrate, the substrate have opposite first side and second side；
Chip, the flip-chip the substrate first side and with the first side interval be arranged；
Packaging body, the packaging body are located at the first side along the circumference ring of the substrate, the packaging body with it is described
Chip chamber is every setting；
Sealing element, the circumference of the sealing element is tightly connected with one side of the packaging body far from the substrate, described
Cavity is formed between sealing element, the chip, the substrate and the packaging body.
As a kind of preferred embodiment of semiconductor package, one side of the packaging body far from the substrate with it is described
The distance between described first side of substrate is H, between the back side of the chip and the first side of the substrate
Distance is h, wherein range difference △=H-h=-25~25 μm.
As a kind of preferred embodiment of semiconductor package, the range difference △=H-h=0.
As a kind of preferred embodiment of semiconductor package, the madial wall of the lateral wall of the chip and the packaging body
The distance between be not less than 50 μm.
As a kind of preferred embodiment of semiconductor package, the sealing element includes diaphragm seal, the diaphragm seal and institute
Packaging body is stated to be adhesively fixed.
As a kind of preferred embodiment of semiconductor package, the diaphragm seal is thermosetting resin film.
As a kind of preferred embodiment of semiconductor package, the sealing element further includes protective layer, the protective layer position
In side of the thermosetting resin film far from the substrate.
As a kind of preferred embodiment of semiconductor package, wiring area, the circuit are provided on the substrate
Wiring region extends to the second side by the first side of the substrate, and the front of the chip passes through conductive part and institute
State the connection of wiring area.
On the other hand, the utility model provides a kind of SAW filter comprising the semiconductor package.
Another aspect, also a kind of terminal device of the utility model comprising the semiconductor package.
The beneficial effects of the utility model：It is molded epoxy resin encapsulating material by the circumference annular along substrate, and is being sealed
Fill body upper side be arranged sealing element, when can be molded to avoid epoxy resin encapsulating material overflow influence core to chip functions area
The performance of piece, to improve the yield of semiconductor package；It is tightly connected, is made close using the upper side of sealing element and packaging body
A closed cavity is formed between sealing, chip, substrate and packaging body.The size of the semiconductor package of the utility model
It is small, the requirement of SAW filter miniaturization can be met, adapt to the miniaturization trend of mobile terminal device.
Description of the drawings
Fig. 1 is the sectional view of the semiconductor package of one embodiment of the utility model.
Fig. 2 is the sectional view of the semiconductor package of another embodiment of the utility model.
In figure：
10, substrate；11, wiring area；20, chip；30, packaging body；40, sealing element；41, diaphragm seal；42, it protects
Layer；50, cavity；60, conductive part.
Specific implementation mode
Further illustrate the technical solution of the utility model below with reference to the accompanying drawings and specific embodiments.
In the description of the present invention, it should be understood that the orientation or positional relationship of the instructions such as term "inner", "outside"
To be based on the orientation or positional relationship shown in the drawings, it is merely for convenience of describing the present invention and simplifying the description, without referring to
Show or imply that signified device or element must have a particular orientation, with specific azimuth configuration and operation, therefore cannot manage
Solution is limitations of the present invention.
In the description of the present invention, unless otherwise clearly defined and limited, term " fixation " shall be understood in a broad sense,
For example, it may be being fixedly connected, it may be a detachable connection, or integral；It can be mechanical connection, can also be to be electrically connected
It connects；Can be directly connected, can also indirectly connected through an intermediary, can be two components interiors connection or two portions
The interaction relationship of part.For the ordinary skill in the art, above-mentioned term can be understood in this reality with concrete condition
With the concrete meaning in novel.
In the present invention unless specifically defined or limited otherwise, fisrt feature the "upper" of second feature or it
"lower" may include that the first and second features are in direct contact, and can also not be to be in direct contact but lead to including the first and second features
Cross the other characterisation contact between them.Moreover, fisrt feature includes that fisrt feature is special second in the "upper" of second feature
Right over sign and oblique upper, or be merely representative of fisrt feature level height and be higher than second feature.Fisrt feature second feature it
"lower" includes fisrt feature immediately below second feature and obliquely downward, or to be merely representative of fisrt feature level height special less than second
Sign.
In an embodiment of the utility model, as shown in Figure 1, semiconductor package includes：Substrate 10, substrate 10 have
There are opposite first side and second side；Chip 20, chip 20 are inverted in the first side of substrate 10 and between first sides
Every setting；Packaging body 30, packaging body 30 are located at first side along the circumference ring of substrate 10, and packaging body 30 is set with the interval of chip 20
It sets；Sealing element 40, circumference and one side of the packaging body 30 far from substrate 10 of sealing element 40 are tightly connected, sealing element 40, chip
20, cavity 50 is formed between substrate 10 and packaging body 30.Wherein, chip 20 is filtering chip, the technical solution of the present embodiment
The semiconductor package for designing cavity structure is needed to be equally applicable other；Packaging body 30 uses epoxy encapsulation material
Expect injection molding, epoxy resin encapsulating material is molded by the circumference annular along substrate 10, makes the inside of the packaging body to be formed 30
The sidewall spacers of wall and chip 20 are arranged, and overflow is to 20 functional areas of chip and shadow when can be molded to avoid epoxy resin encapsulating material
Ring the performance of chip 20.Be tightly connected using the upper surface of sealing element 40 and packaging body 30, to make sealing element 40, chip 20,
A closed cavity 50, sealing element 40 and packaging body 30 are formed between substrate 10 and packaging body 30 there is protection to make chip 20
With.
The semiconductor package of the present embodiment is that can be substantially reduced semiconductor packages knot without pin flat package on four sides
The size of structure adapts to the miniaturization trend of mobile terminal device to meet the requirement of SAW filter miniaturization.
Wherein, the distance between one side of the packaging body 30 far from substrate 10 and the first side of substrate 10 are H, chip 20
The distance between the first side of the back side and substrate 10 be h, wherein range difference △=H-h=-25~25 μm, in the distance
In poor range, chip 20 plays a supportive role to sealing element 40.
In one preferred embodiment of the utility model, range difference △=H-h=0 makes packaging body 30 far from substrate 10
One side is concordant with the first side of substrate 10, so that chip 20 is had good supporting role to sealing element 40, and do not influence close
Connective stability between sealing 40 and packaging body 30.
In the present embodiment, optionally, the distance between the lateral wall of chip 20 and the madial wall of packaging body 30 are not less than 50 μ
M, when being molded to avoid epoxy resin encapsulating material at overflow to chip 20.The madial wall of the lateral wall and packaging body 30 of chip 20
The distance between the upper limit according to semiconductor package size depending on.
In the present embodiment, sealing element 40 includes diaphragm seal 41, and diaphragm seal 41 is adhesively fixed with packaging body 30, using the structure
Design limits the distance between diaphragm seal 41 and 20 back side of chip without accurate, distance between the two is made to be maintained at -25~25
In μ m.
Further, diaphragm seal 41 is thermosetting resin film, is tightly connected convenient for itself and packaging body 30.
In the present embodiment, be provided with wiring area 11 on substrate 10, wiring area 11 by substrate 10 first side
Second side is extended to, the front of chip 20 is connect by conductive part 60 with wiring area 11.Wherein, wiring area 11 can
Can also be multilayer wiring to be single layer wiring, effect is the lower section that the electrode of chip 20 is led to substrate 10, after convenient
It is continuous to be welded with PCB (Printed Circuit Board, printed circuit board).
In another embodiment of the utility model, with above-described embodiment difference lies in：Sealing element 40 further includes protection
Layer 42, protective layer 42 is located at side of the thermosetting resin film far from substrate 10, in order to by hot-press arrangement by thermosetting resin
Film hot pressing is fixed on packaging body 30.Wherein, protective layer 42 is metal foil, and high temperature resistant, pressure resistance have thermosetting resin film
Good protecting effect.
The preparation process of the semiconductor package of the present embodiment is：Prepared substrate 10, core wire piece 20 on the substrate 10, so
Diaphragm seal 41 is covered afterwards, after diaphragm seal 41 cures, then is separated into single product.
The embodiments of the present invention also provide a kind of SAW filter comprising any of the above-described embodiment is partly led
Body encapsulating structure.
The embodiments of the present invention also provide a kind of terminal device comprising the semiconductor packages of any of the above-described embodiment
Structure.
It is to be understood that above-mentioned specific implementation mode is only the preferred embodiment and institute's application technology of the utility model
Principle, in technical scope disclosed in the utility model, what any one skilled in the art was readily apparent that
Change or replacement should all be covered within the protection scope of the present utility model.
The utility model is illustrated above by specific embodiment, but the utility model is not limited to these tools
The embodiment of body.It will be understood by those skilled in the art that various modifications, equivalent replacement, variation can also be done to the utility model
Etc..But these transformation should be all within the protection scope of the utility model without departing from the spirit of the utility model.
In addition, some terms used in present specification and claims are not limitation, it is only for convenient for description.
Claims (10)
1. a kind of semiconductor package, which is characterized in that including：
Substrate, the substrate have opposite first side and second side；
Chip, the flip-chip the substrate first side and with the first side interval be arranged；
Packaging body, the packaging body are located at the first side, the packaging body and the chip along the circumference ring of the substrate
Interval setting；
Sealing element, the circumference of the sealing element are tightly connected with one side of the packaging body far from the substrate, the sealing
Cavity is formed between part, the chip, the substrate and the packaging body.
2. semiconductor package according to claim 1, which is characterized in that the packaging body far from the substrate one
The distance between side and the first side of the substrate are H, the back side of the chip and described the first of the substrate
The distance between side is h, wherein range difference △=H-h=-25~25 μm.
3. semiconductor package according to claim 2, which is characterized in that the range difference △=H-h=0.
4. semiconductor package according to claim 1, which is characterized in that the lateral wall of the chip and the encapsulation
The distance between madial wall of body is not less than 50 μm.
5. semiconductor package according to claim 1, which is characterized in that the sealing element includes diaphragm seal, described
Diaphragm seal is adhesively fixed with the packaging body.
6. semiconductor package according to claim 5, which is characterized in that the diaphragm seal is thermosetting resin film.
7. semiconductor package according to claim 6, which is characterized in that the sealing element further includes protective layer, institute
It states protective layer and is located at side of the thermosetting resin film far from the substrate.
8. semiconductor package according to any one of claims 1 to 7, which is characterized in that be provided on the substrate
Wiring area, the wiring area extend to the second side, the chip by the first side of the substrate
Front connect with the wiring area by conductive part.
9. a kind of SAW filter, which is characterized in that including claim 1 to 8 any one of them semiconductor packages knot
Structure.
10. a kind of terminal device, which is characterized in that including claim 1 to 8 any one of them semiconductor package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721738603.7U CN207637777U (en) | 2017-12-12 | 2017-12-12 | A kind of semiconductor package, SAW filter and terminal device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721738603.7U CN207637777U (en) | 2017-12-12 | 2017-12-12 | A kind of semiconductor package, SAW filter and terminal device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207637777U true CN207637777U (en) | 2018-07-20 |
Family
ID=62863282
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721738603.7U Active CN207637777U (en) | 2017-12-12 | 2017-12-12 | A kind of semiconductor package, SAW filter and terminal device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207637777U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109037171A (en) * | 2018-08-28 | 2018-12-18 | 苏州日月新半导体有限公司 | Integrated circuit package body and its manufacturing method |
| WO2021146855A1 (en) * | 2020-01-20 | 2021-07-29 | 开元通信技术（厦门）有限公司 | Radio frequency filter |
| CN113300685A (en) * | 2021-06-28 | 2021-08-24 | 江苏卓胜微电子股份有限公司 | Chip packaging structure and packaging method |
-
2017
- 2017-12-12 CN CN201721738603.7U patent/CN207637777U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109037171A (en) * | 2018-08-28 | 2018-12-18 | 苏州日月新半导体有限公司 | Integrated circuit package body and its manufacturing method |
| WO2021146855A1 (en) * | 2020-01-20 | 2021-07-29 | 开元通信技术（厦门）有限公司 | Radio frequency filter |
| CN113300685A (en) * | 2021-06-28 | 2021-08-24 | 江苏卓胜微电子股份有限公司 | Chip packaging structure and packaging method |
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