CN205160485U

CN205160485U - Surface acoustic wave filter packaging structure

Info

Publication number: CN205160485U
Application number: CN201520879601.4U
Authority: CN
Inventors: 吴现伟; 柳燕华; 张超
Original assignee: Jiangsu Changjiang Electronics Technology Co Ltd
Current assignee: JCET Group Co Ltd
Priority date: 2015-11-06
Filing date: 2015-11-06
Publication date: 2016-04-13
Anticipated expiration: 2025-11-06

Abstract

The utility model relates to a surface acoustic wave filter packaging structure belongs to the semiconductor packaging technology field. The structure includes base plate (1), base plate (1) back is provided with recess (8), recess (8) interior formal dress or flip -chip have filtering chip (3), base plate (1) openly is provided with one deck plastic envelope material (6), form a protection cavity between the plastic envelope material (6) and recess (8), chip functional areas (3a) the contactless of plastic envelope material (6) and filtering chip (3). The utility model relates to a surface acoustic wave filter packaging structure, its uses the sealed protection cavity of plastic envelope material, has prevented effectively that the plastic envelope from gluing to overflow to filtering chip surface's function region, can solve the problem of the disabler that the protection of traditional crown cap led to the fact.

Description

A kind of Surface Acoustic Wave Filter encapsulating structure

Technical field

The utility model relates to a kind of Surface Acoustic Wave Filter encapsulating structure, belongs to technical field of semiconductor encapsulation.

Background technology

Because of Surface Acoustic Wave Filter properties of product and design function demand, need to ensure that filtering chip functional area can not contact any material, i.e. cavity structure design.Existing Surface Acoustic Wave Filter encapsulating structure is as Fig. 1, and filtering chip to be connected with ceramic substrate by conductive projection flip chip bonding and to be embedded in base material cavity completely, and substrate surface adds crown cap protection.

There is following shortcoming in above-mentioned existing structure:

1, crown cap cost is higher;

2, to ceramic substrate and crown cap flatness requirement harsh, easily cause layering, crown cap surface smoothness abnormal;

3, metal material and ceramic substrate adhesion poor, easily cause lamination problem, and crown cap needs special management and control before using, prevents surface tear, impaired, avoid because problem of appearance is scrapped;

4, intermediate materials is needed to combine before gland: one is a glue; Another kind is zinc-plated.When crown cap use some glue, before solidification also can following current in groove, cause line short, or overflow to functional area.When upside-down mounting uses tin, crown cap also uses zinc-plated, and when Reflow Soldering, crown cap surface tin melts meeting following current in groove, and the remelting of filtering chip soldered ball, easily cause line short, or overflow to functional area.Below either way easily overflow to cavity and cause filtering chip performance failure.

Utility model content

Technical problem to be solved in the utility model provides a kind of Surface Acoustic Wave Filter encapsulating structure for above-mentioned prior art; it uses capsulation material seal protection cavity; effectively prevent plastic packaging glue to overflow on the functional area on filtering chip surface, the problem of the disabler that the protection of conventional metals lid is caused can be solved.

The technical scheme in the invention for solving the above technical problem is: a kind of Surface Acoustic Wave Filter encapsulating structure; it comprises substrate; described substrate back is provided with groove; in described groove, formal dress or upside-down mounting have filtering chip; described substrate front side is provided with one deck plastic packaging material; form one between described plastic packaging material and groove and protect cavity, described plastic packaging material does not contact with the chip functions district of filtering chip.

Compared with prior art, the utility model has the advantage of:

1, compare and existingly add crown cap encapsulating structure, the utility model cost is lower;

2, to the not requirement of substrate surface evenness, liquid encapsulating material can covering substrates be surperficial completely;

3, base material and encapsulating material produce common used material in batches for encapsulating industry, and adhesion, sealing are strong, by reliability demonstrations such as preliminary treatment, high temperature storage, temperature cycles, humitures;

4, encapsulating material is stored in low temperature and low humidity environment, and storage mode is simple and easy to control, does not need as other special management and control of crown cap before not encapsulating;

5, encapsulate operating type simple, easy to control, can in available protecting cavity filtering chip surface not by excessive glue.

Accompanying drawing explanation

Fig. 1 is existing upside-down mounting filtering chip Surface Acoustic Wave Filter encapsulating structure schematic diagram.

Fig. 2 a ~ 2d is each operation schematic diagram of manufacture method of a kind of Surface Acoustic Wave Filter of the utility model encapsulating structure embodiment 1.

Fig. 3 is the structural representation of a kind of Surface Acoustic Wave Filter encapsulating structure of the utility model embodiment 1.

Fig. 4 is the structural representation of a kind of Surface Acoustic Wave Filter encapsulating structure of the utility model embodiment 2

Fig. 5 is the structural representation of a kind of Surface Acoustic Wave Filter encapsulating structure of the utility model embodiment 3.

Wherein:

Substrate 1

Pad 2

Filtering chip 3

Chip functions district 3a

Conductive projection 4

Patrix 5

Plastic packaging material 6

Counterdie 7

Groove 8

Vacuum hole 9.

Embodiment

Below in conjunction with accompanying drawing embodiment, the utility model is described in further detail.

Embodiment 1:

As shown in Figure 3; a kind of Surface Acoustic Wave Filter encapsulating structure in the present embodiment; it comprises substrate 1; described substrate 1 front is provided with groove 8; be provided with pad 2 in described groove 8, described pad 2 has filtering chip 3 by conductive projection 4 upside-down mounting, described substrate 1 front is provided with one deck plastic packaging material 6; form one between described plastic packaging material 6 and groove 8 and protect cavity, described plastic packaging material 6 does not contact with the chip functions district 3a of filtering chip 3.

Described plastic packaging material 6 is thermosets, and being Powdered in normal temperature state, is liquid form in fusing point state, and plastic packaging material is filled into thermoset forming after substrate recess part certain altitude in liquid form under high temperature action.

Its manufacture method is as follows:

Step one: see Fig. 2 a, provides a front tool reeded substrate;

Step 2: see Fig. 2 b, by filtering chip upside-down mounting in substrate recess, is electrically connected on the weld pad on substrate by conductive projection;

Step 3: see Fig. 2 c, encapsulating, first by substrate back vacuum suction on plastic packaging patrix, substrate is inverted, then upper die and lower die matched moulds, by patrix, part substrate is pressed in the liquid plastic packaging material of melting under high temperature in counterdie, and the upper horizontal plane of plastic packaging material is lower than the horizontal plane at place, filtering chip functional areas;

Step 4: see Fig. 2 d, forms a package body structure around a chip functions district with cavity after solidification.

Embodiment 2:

As shown in Figure 4; a kind of Surface Acoustic Wave Filter encapsulating structure in the present embodiment; it comprises substrate 1; described substrate 1 front is provided with groove 8; pad 2 is provided with in described groove 8; described pad 2 inside region is just being equipped with filtering chip 3 by conduction or non-conductive adhesive; described filtering chip 3 front is connected with pad 2 by metal wire; described substrate 1 front is provided with one deck plastic packaging material 6; form one between described plastic packaging material 6 and groove 8 and protect cavity, described plastic packaging material 6 does not contact with the chip functions district 3a of filtering chip 3.

Embodiment 3:

As shown in Figure 5, embodiment 3 is with the difference of embodiment 1: described filtering chip 3 is TSV filtering chip, described filtering chip 3 is provided with through hole, and its front and the back side all need to ensure cavity structure, and described plastic packaging material 6 does not contact with the chip functions district 3a of filtering chip 3.

In addition to the implementation, the utility model also includes other execution modes, the technical scheme that all employing equivalents or equivalent substitute mode are formed, within the protection range that all should fall into the utility model claim.

Claims

1. a Surface Acoustic Wave Filter encapsulating structure; it is characterized in that: it comprises substrate (1); described substrate (1) back side is provided with groove (8); described groove (8) interior formal dress or upside-down mounting have filtering chip (3); described substrate (1) front is provided with one deck plastic packaging material (6); form one between described plastic packaging material (6) and groove (8) and protect cavity, described plastic packaging material (6) does not contact with the chip functions district (3a) of filtering chip (3).