CN204100927U - A kind of containing getting angry medicament and ignition chip integrative packaging structure - Google Patents
A kind of containing getting angry medicament and ignition chip integrative packaging structure Download PDFInfo
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- CN204100927U CN204100927U CN201420287102.1U CN201420287102U CN204100927U CN 204100927 U CN204100927 U CN 204100927U CN 201420287102 U CN201420287102 U CN 201420287102U CN 204100927 U CN204100927 U CN 204100927U
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- angry
- chip
- medicament
- bonding line
- ignition
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Abstract
The utility model discloses a kind of containing getting angry medicament and ignition chip integrative packaging structure.Of the present utility model containing can get angry medicament with get angry chip integrative packaging structure and comprise: gets angry chip, contain and can get angry medicament, substrate, leadframe, bonding line and packaging body; Wherein, the lower surface of ignition chip is arranged on substrate; Bonding line connects ignition chip and leadframe; Packaging body will get angry chip, leadframe, bonding line and substrate package, and expose leadframe in the bottom surface of packaging body or side; Packaging body has through hole, and through hole faces the zone of action of ignition chip; Be filled in the through hole of packaging body containing getting angry medicament, contact with the zone of action.The utility model, by bonding line and containing getting angry medicament physical isolation, by reducing the harmful effect of medicament for bonding line, improves Fire Reliability; Structure is very applicable to large batch of production, has higher automated production ability; Volume is little, can be used for the self-destruction of electronic equipment key element.
Description
Technical field
The utility model relates to electric spark workpiece encapsulation technology, is specifically related to a kind of containing getting angry medicament and ignition chip integrative packaging structure.
Background technology
Modern electric spark workpiece mainly contains semiconductive bridge, metal film bridge, can react the structure such as bridge and Exploding Foil.Wherein Exploding Foil is due to the mode of action of uniqueness, inherently possesses encapsulating structure.And semiconductive bridge, metal film bridge and bridge can be reacted, be the ignition chip adopting MEMS or CMOS technology to make, itself is without any encapsulating structure.Actual when using, these electric spark workpieces can be positioned in the packaging bodies such as ceramic electrode plug usually, realize by the mode of wire bonding or coated with conductive glue the electric interconnects that the ignition electrode of electric spark workpiece and packaging body get angry between pin.Containing can get angry medicament with get angry the typical structure of chip integrative packaging, be ceramic electrode plug for carrying ignition chip, keep getting angry simultaneously chip with containing getting angry the contact of medicament.But there is following problem in such mode:
1, hand assembled, inefficiency: this packaged type needs manually to be placed by electric spark workpiece and is bonded in the inside grooves of ceramic electrode plug, and needs manually ignition medicament to be coated in electric spark workpiece surface;
2, go between exposed, easily and medicament react: due to needs electric spark workpiece is in place after just can carry out wire bonding, thus lead-in wire can be exposed to ceramic electrode plug outside.During actual use, electrode plug can contact with ignition medicament, and a lot of compatibility of getting angry between medicament and lead-in wire is poor, can cause the inefficacy of lead-in wire;
3, the volume of ceramic electrode plug is comparatively large, is difficult to meet some special ignition needs.
In addition, along with popularizing of electronic equipment, the information that electronic equipment stores gets more and more.From military equipment to consumer electronics, the value of these electronic equipments is also important all the more, some electronic equipment for consumption such as mobile phone has high personal information management authority, can manage and arrange Private Banking's account of user, electronic transaction account etc. relates to the individual key message of great property and safety.This kind equipment is once lose and may bring huge economy and emotional distress to user.And Military Electronic Equipment is once lose and do not destroy the information of its inside in time, then may bring huge hidden danger to national security.Need thus a kind of can with existing electronic equipment have better assemble compatible based on containing can get angry medicament with get angry the integrated encapsulating structure of exempting to assemble of chip.This encapsulating structure may be used for the self-destruction of electronic equipment key element as memory cell.
For this reason, need a kind ofly can be mass-produced and there is the encapsulating structure of the electric spark workpiece compared with high automation assemble ability, to ensure the lead-in wire between electric spark workpiece and packaging body pad to be coated on encapsulating material inside, and small volume, convenient and existing IC semiconductor integrated chip assembles.
Utility model content
For above problems of the prior art, the utility model provides a kind of containing getting angry medicament and ignition chip integrative packaging structure, containing can get angry medicament by the through hole in packaging body with get angry chip contact, reduce the harmful effect of medicament for bonding line, improve Fire Reliability, and small volume, can assemble with existing IC semiconductor integrated chip.
The purpose of this utility model is to provide a kind of containing getting angry medicament and ignition chip integrative packaging structure.
Of the present utility model containing can get angry medicament with get angry chip integrative packaging structure and comprise: gets angry chip, contain and can get angry medicament, substrate, leadframe, bonding line and packaging body; Wherein, chip of getting angry comprise substrate, two get angry electrodes and the zone of action, get angry electrode for two and lay respectively at two ends on substrate, get angry connection function region between electrodes for two; The lower surface of the substrate of ignition chip is arranged on substrate; One end of bonding line is connected to ignition electrode, and the other end is connected to leadframe; Packaging body will get angry chip, leadframe, bonding line and substrate package, and expose leadframe in the bottom surface of packaging body or side; Packaging body has through hole, and through hole faces the zone of action of ignition chip; Containing getting angry medicament filling in through-holes, and contact with the zone of action of ignition chip.
The lower surface of ignition chip is pasted onto on substrate by die bonding thing; Ignition chip is connected with leadframe by bonding line sticky object or bond technology by bonding line, for getting angry chip conductive.Bonding line sticky object comprises conductive silver paste or solder etc.
Get angry that chip is semiconductive bridge, metal film bridge and the one that can react in bridge.
The material of packaging body adopts epoxy resin.The size of the through hole that packaging body is offered is corresponding with the zone of action, and according to containing can get angry medicament need arrange, the shape of through hole is cuboid, the length of side between 0.1 ~ 2mm, height between 0.1 ~ 2mm.Or the shape of through hole is cylinder, diameter is between 0.1mm ~ 2mm, and height is between 0.1 ~ 2mm.
The utility model adopts packaging body will get angry chip, leadframe, bonding line and substrate package, the zone of action facing ignition chip at packaging body arranges through hole, containing getting angry medicament filling in through-holes, and contact with ignition chip, thus by bonding line and containing getting angry medicament physical isolation, by reducing the harmful effect of medicament for bonding line, improve Fire Reliability.
Bonding line is not close in the edge of through hole, and has certain safe distance between bonding line, distance between 50um ~ 1000um, to ensure that metal bonding line does not leak outside, in the protection of packaging body.Distance between through hole and bonding line is determined according to the concrete ignition size of chip and the material of packaging body.
Of the present utility model containing the method for packing of medicament with ignition chip integrative packaging structure can be got angry, comprise the following steps:
1) lower surface of ignition chip is pasted onto on substrate, by bonding line, ignition chip is connected with leadframe;
2) mould of the packaging body injection moulding comprising through hole is carried out in preparation;
3) carry out packaging body injection moulding, then cool, form the packaging body comprising through hole;
4) packaging body will get angry chip, leadframe, bonding line and substrate package, and the through hole of packaging body faces gets angry the zone of action of chip, exposes leadframe in the bottom surface of packaging body or side;
5) entered containing getting angry medicament filling in the through hole of packaging body by sub-milligram charge process, and with get angry the zone of action of chip and contact.
Advantage of the present utility model:
The utility model adopts packaging body will get angry chip, leadframe and substrate package, the zone of action facing ignition chip at packaging body arranges through hole, in through-holes fill containing can get angry medicament with get angry chip contact, thus by bonding line and containing getting angry medicament physical isolation, by reducing the harmful effect of medicament for bonding line, improve Fire Reliability.The ignition electrode of ignition chip and bonding line are coated in packaging body by this encapsulation simultaneously, improve mechanical strength and the sealing of whole encapsulating structure, improve the oxidation resistance of device.The structure that the utility model adopts very is applicable to large batch of production, has higher automated production ability.Meanwhile, the volume of this encapsulating structure is little, can assemble, realize the self-destruction of critical elements in electronic equipment with existing IC semiconductor integrated chip.During actual use, by the through-hole alignment critical elements of this encapsulating structure, make contacting with critical elements containing getting angry medicament in through hole, when this element self-destruction of needs, start of the present utility model containing getting angry medicament and ignition chip integrative packaging structure, containing medicament ignition can be got angry, critical elements is damaged.
Accompanying drawing explanation
Fig. 1 is of the present utility model containing getting angry the profile of medicament with an embodiment of ignition chip integrative packaging structure;
Fig. 2 is the stereogram of the ignition chip of an embodiment of the present utility model, substrate, bonding line and leadframe;
Fig. 3 (a) for of the present utility model containing can get angry medicament with get angry an embodiment of chip integrative packaging structure encapsulate after top view, Fig. 3 (b) for of the present utility model containing can get angry the embodiment of medicament with ignition chip integrative packaging structure encapsulate after upward view.
Detailed description of the invention
Below in conjunction with accompanying drawing, by embodiment, the utility model is described further.
As shown in Figure 1, the ignition chip-packaging structure of the present embodiment comprises: get angry chip 1, containing getting angry medicament 7, substrate 2, leadframe 3, bonding line 4 and packaging body 5; Wherein, chip 1 of getting angry comprises substrate 11, two and gets angry electrode 12 and 13, two, the zone of action and get angry electrode 12 and lay respectively at two ends on substrate 11, gets angry connection function region 13 between electrodes 12 for two; The lower surface of the substrate 11 of ignition chip is arranged on a substrate 2; One end of bonding line 4 is connected to ignition electrode 12, and the other end is connected to leadframe 3; Ignition chip 1, leadframe 3, bonding line 4 and substrate 2 encapsulate by packaging body 5, and expose leadframe 3 in the bottom surface of packaging body 5; Packaging body 5 has the through hole 6 of rectangle, and through hole 6 faces the zone of action 13 of ignition chip; Be filled in the through hole 6 of packaging body containing getting angry medicament, and with get angry the zone of action 13 of chip and contact.
Fig. 2 is the stereogram of the structural representation of the ignition chip of the present embodiment, substrate, bonding line and leadframe.
Fig. 3 (a) for packaging body 5 by get angry chip 1, leadframe 3, bonding line 4 and substrate 2 encapsulate after top view, wherein, be filled in the through hole of packaging body 5 containing getting angry medicament 7; Fig. 3 (b) is upward view, and leadframe 3 is exposed in the bottom surface of packaging body 5.
In the present embodiment, packaging body 5 adopts epoxy resin; Bonding line 4 and leadframe 3 are metal; Bonding line 4 is connected with leadframe 3 with ignition electrode 12 by conductive silver paste is bonding.Through hole 6 and bonding line 4 have certain safe distance.
It is finally noted that, the object publicizing and implementing mode is to help to understand the utility model further, but it will be appreciated by those skilled in the art that: in the spirit and scope not departing from the utility model and appended claim, various substitutions and modifications are all possible.Therefore, the utility model should not be limited to the content disclosed in embodiment, and the scope that the claimed scope of the utility model defines with claims is as the criterion.
Claims (7)
1. one kind containing can get angry medicament with get angry chip integrative packaging structure, it is characterized in that, described encapsulating structure comprises: get angry chip (1), containing getting angry medicament (7), substrate (2), leadframe (3), bonding line (4) and packaging body (5); Wherein, described ignition chip (1) comprises substrate (11), two ignitions electrode (12) and the zone of action (13), get angry electrode (12) for two and lay respectively at two ends on substrate (11), get angry connection function region (13) between electrode (12) for two; The lower surface of the substrate (11) of described ignition chip is arranged on substrate (2); One end of described bonding line (4) is connected to ignition electrode (12), and the other end is connected to leadframe (3); Described packaging body (5) will get angry the encapsulation of chip (1), leadframe (3), bonding line (4) and substrate (2), and expose leadframe (3) in the bottom surface of packaging body (5) or side; Described packaging body (5) has through hole (6), and through hole (6) faces the zone of action (13) of ignition chip; Describedly to be filled in through hole (6) containing getting angry medicament (7), and with get angry the zone of action (13) of chip and contact.
2. encapsulating structure as claimed in claim 1, is characterized in that, described ignition chip (1) is semiconductive bridge, metal film bridge and the one that can react in bridge.
3. encapsulating structure as claimed in claim 1, it is characterized in that, the shape of described through hole (6) is cuboid, and the length of side is between 0.1 ~ 2mm, and height is between 0.1 ~ 2mm.
4. encapsulating structure as claimed in claim 1, it is characterized in that, the shape of described through hole (6) is cylinder, and diameter is between 0.1mm ~ 2mm, and height is between 0.1 ~ 2mm
5. encapsulating structure as claimed in claim 1, it is characterized in that, bonding line (4) is not close at the edge of described through hole (7), and has safe distance between bonding line (4), and distance is between 50um ~ 1000um.
6. encapsulating structure as claimed in claim 1, it is characterized in that, ignition chip is connected with leadframe by bonding line sticky object or bond technology by described bonding line (4).
7. encapsulating structure as claimed in claim 6, it is characterized in that, described bonding line sticky object comprises conductive silver paste or solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420287102.1U CN204100927U (en) | 2014-05-30 | 2014-05-30 | A kind of containing getting angry medicament and ignition chip integrative packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420287102.1U CN204100927U (en) | 2014-05-30 | 2014-05-30 | A kind of containing getting angry medicament and ignition chip integrative packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204100927U true CN204100927U (en) | 2015-01-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420287102.1U Expired - Fee Related CN204100927U (en) | 2014-05-30 | 2014-05-30 | A kind of containing getting angry medicament and ignition chip integrative packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204100927U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108213036A (en) * | 2017-12-04 | 2018-06-29 | 中国电子科技集团公司第三十研究所 | A kind of circuit board emergent physical apparatus for destroying and implementation method |
| CN114001607A (en) * | 2021-11-17 | 2022-02-01 | 北京理工大学 | Integrated information self-destruction energetic microsystem with isolation safety system and implementation method |
| CN114220784A (en) * | 2022-01-19 | 2022-03-22 | 北京智芯传感科技有限公司 | High security electric primer is with encapsulation device |
| CN114267651A (en) * | 2021-12-21 | 2022-04-01 | 北京智芯传感科技有限公司 | Bridge diaphragm type energy conversion element packaging structure in reserved medicine loading chamber form |
-
2014
- 2014-05-30 CN CN201420287102.1U patent/CN204100927U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108213036A (en) * | 2017-12-04 | 2018-06-29 | 中国电子科技集团公司第三十研究所 | A kind of circuit board emergent physical apparatus for destroying and implementation method |
| CN114001607A (en) * | 2021-11-17 | 2022-02-01 | 北京理工大学 | Integrated information self-destruction energetic microsystem with isolation safety system and implementation method |
| CN114001607B (en) * | 2021-11-17 | 2023-01-13 | 北京理工大学 | Integrated information self-destruction energetic microsystem with isolation safety system and implementation method |
| CN114267651A (en) * | 2021-12-21 | 2022-04-01 | 北京智芯传感科技有限公司 | Bridge diaphragm type energy conversion element packaging structure in reserved medicine loading chamber form |
| CN114220784A (en) * | 2022-01-19 | 2022-03-22 | 北京智芯传感科技有限公司 | High security electric primer is with encapsulation device |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150114 Termination date: 20160530 |
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| CF01 | Termination of patent right due to non-payment of annual fee |