CN210123288U

CN210123288U - Multifunctional integrated sensor

Info

Publication number: CN210123288U
Application number: CN201920781277.0U
Authority: CN
Inventors: 邱文瑞; 王德信; 潘新超; 杨军伟; 付亚林
Original assignee: Qingdao Goertek Intelligent Sensor Co Ltd
Current assignee: Qingdao Goertek Intelligent Sensor Co Ltd
Priority date: 2019-05-27
Filing date: 2019-05-27
Publication date: 2020-03-03
Anticipated expiration: 2029-05-27

Abstract

The utility model provides a multifunctional integrated sensor, which comprises a substrate, an air pressure sensor and an inertial sensor; the substrate comprises a first copper layer, a second copper layer and a dielectric layer positioned between the first copper layer and the second copper layer; the MEMS chip of the air pressure sensor is arranged on the first copper layer and is electrically connected with the first copper layer; the ASIC chip of the air pressure sensor, the MEMS chip of the inertial sensor and the ASIC chip are all embedded in the dielectric layer. Utilize above-mentioned utility model, can improve integrating of product when reducing the whole size of product.

Description

Multifunctional integrated sensor

Technical Field

The utility model relates to a sensor technical field, more specifically relates to a multi-functional integrated form sensor.

Background

With the gradual improvement of the waterproof performance of consumer electronic products such as mobile phones, watches, wristbands and earphones and the requirement of consumers on light, thin, short and small overall products, the core component of the products, namely the sensor, is developing towards miniaturization, integration and high waterproof level.

At present, an air pressure sensor and an inertial sensor are used as standard components of consumer electronic products such as mobile phones and watches, and the inertial sensor and a waterproof air pressure sensor are integrally packaged, so that the information acquisition of the products is facilitated, and the diversification of the functions of the sensors can be realized.

The existing sensor application scheme can only realize the waterproof function of the air pressure sensor, and the inertial sensor still adopts an independent packaging form. If on the premise of having the waterproof function, the inertial sensor and the air pressure sensor are sealed in the same space, electromagnetic interference is easily generated between the inertial sensor and the air pressure sensor, the performance is influenced mutually, and meanwhile, the size of the whole integrated sensor is large.

It can be known that the existing sensor application schemes cannot meet the requirements of high-performance integration and overall small size of the inertial sensor and the air pressure sensor.

SUMMERY OF THE UTILITY MODEL

In view of the above problem, the present invention is to provide a multifunctional integrated sensor to solve the problem that the current sensor product cannot meet the requirements of high performance integration and small size of the whole inertial sensor and the air pressure sensor.

The utility model provides a multifunctional integrated sensor, which comprises a substrate, an air pressure sensor and an inertial sensor; the substrate comprises a first copper layer, a second copper layer and a dielectric layer positioned between the first copper layer and the second copper layer; the MEMS chip of the air pressure sensor is arranged on the first copper layer and is electrically connected with the first copper layer; the ASIC chip of the air pressure sensor, the MEMS chip of the inertial sensor and the ASIC chip are all embedded in the dielectric layer.

In addition, it is preferable that the thicknesses of the dielectric layers are respectively greater than the thicknesses of the ASIC chip of the air pressure sensor and the thicknesses of the MEMS chip and the ASIC chip of the inertial sensor.

Further, it is preferable that the ASIC chip of the air pressure sensor, the MEMS chip of the inertial sensor, and the ASIC chip are electrically connected to the first copper layer through rewiring and through holes in the substrate, respectively.

In addition, the preferable structure is that a passivation layer is arranged on the first copper layer, and an MEMS chip of the air pressure sensor is attached to the passivation layer; the MEMS chip of the air pressure sensor is electrically connected with the first copper layer through a gold wire.

In addition, the passivation layer is preferably a conductive adhesive layer or a solder paste layer.

In addition, the preferable structure is that the packaging structure further comprises a shell forming a packaging structure with the substrate; the MEMS chip of the air pressure sensor is accommodated in the packaging structure.

In addition, it is preferable that the package structure is filled with a waterproof adhesive covering the first copper layer and the MEMS chip of the pressure sensor.

In addition, the housing is preferably fixedly connected to the substrate by solder paste.

In addition, the preferred construction is that the housing is solder-sealed to the first copper layer by means of solder paste.

Further, it is preferable that the MEMS chip and the ASIC chip of the air pressure sensor are in conduction with each other, and the MEMS chip and the ASIC chip of the inertial sensor are in conduction with each other.

According to the above technical scheme, the utility model discloses a multi-functional integrated form sensor, with baroceptor's ASIC chip, inertial sensor's MEMS chip and ASIC chip all bury underground in the base plate, not only can dodge the space for baroceptor's MEMS chip's subsides dress, reduce overall dimension, can also reduce the electromagnetic interference between baroceptor and the inertial sensor, improve and produce the property ability.

Drawings

Other objects and results of the invention will be more apparent and readily appreciated by reference to the following description taken in conjunction with the accompanying drawings, and as the invention is more fully understood. In the drawings:

fig. 1 is a schematic cross-sectional structure diagram of a multifunctional integrated sensor according to an embodiment of the present invention.

Wherein the reference numerals include: the sensor comprises a second copper layer 1, a dielectric layer 2, a first copper layer 3, a passivation layer 4, an air pressure sensor MEMS chip 5, a gold wire 6, an inertial sensor ASIC chip 7, an inertial sensor MEMS chip 8, an air pressure sensor ASIC chip 9, a substrate 10, a shell 11 and waterproof glue 12.

The same reference numbers in all figures indicate similar or corresponding features or functions.

Detailed Description

For describing the structure of the multifunctional speaker in detail, the following will describe the embodiments of the present invention in detail with reference to the accompanying drawings.

Fig. 1 shows a schematic cross-sectional structure of a multifunctional integrated sensor according to an embodiment of the present invention.

As shown in fig. 1, the multifunctional integrated sensor according to the embodiment of the present invention includes a substrate 10, an air pressure sensor, and an inertial sensor; the substrate 10 comprises a first copper layer 3, a second copper layer 1 and a dielectric layer 2 positioned between the first copper layer 3 and the second copper layer 1; the air pressure sensor comprises an air pressure sensor MEMS chip 5 and an air pressure sensor MEMS chip 5ASIC chip, the inertial sensor comprises an inertial sensor MEMS chip 8 and an inertial sensor ASIC chip 7, and the MEMS chip (namely the air pressure sensor MEMS chip 5, the same below) of the air pressure sensor is arranged on the first copper layer 3 and is electrically connected with the first copper layer 3; an ASIC chip of the air pressure sensor (i.e., an air pressure sensor ASIC chip 9, the same below), an MEMS chip of the inertial sensor (i.e., an inertial sensor MEMS chip 8, the same below) and an ASIC chip (i.e., an inertial sensor ASIC chip 7, the same below) are all embedded in the dielectric layer 2.

Specifically, the thickness of the dielectric layer 2 is set to be greater than the thickness of the ASIC chip of the air pressure sensor and the thickness of the MEMS chip and the ASIC chip of the inertial sensor, respectively, so that the dielectric material of the dielectric layer 2 can completely wrap the ASIC chip 7 of the inertial sensor, the MEMS chip 8 of the inertial sensor, and the ASIC chip 9 of the air pressure sensor. In addition, in the process of embedding the chips, the chips are kept horizontal and are separated by a certain distance to reduce the interference among the chips.

In the process of embedding the chip, a dielectric material can be pressed on the second copper layer 1 to form a dielectric layer 2, an inertial sensor ASIC chip 7, an inertial sensor MEMS chip 8 and a gas pressure sensor ASIC chip 9 are embedded in the dielectric material, and finally, a first copper layer 3 covers the dielectric material to form a substrate 10 structure wrapping the chip.

Further, the inertial sensor ASIC chip 7, the inertial sensor MEMS chip 8, and the pressure sensor ASIC chip 9 embedded in the dielectric layer 2 are electrically connected to the first copper layer 3 by rewiring RDL and VIA in the dielectric layer 2, respectively.

In addition, the MEMS chip and the ASIC chip of the air pressure sensor are in conduction with each other, and the MEMS chip and the ASIC chip of the inertial sensor are also in conduction with each other.

The utility model discloses an in the embodiment, still be provided with passivation layer 4 on first copper layer 3, baroceptor's MEMS chip pastes and establishes on passivation layer 4, and baroceptor's MEMS chip passes through gold thread 6 and first copper layer 3 electrical connection.

The passivation layer 4 may be a conductive adhesive layer or a solder paste layer, and the air pressure sensor MEMS chip 5 is fixedly connected to the first copper layer 3 through the conductive adhesive layer or the solder paste layer.

In addition, the multifunctional integrated sensor of the present invention further includes a housing 11 forming an encapsulation structure with the substrate 10; the MEMS chip of the air pressure sensor is accommodated in the packaging structure, and the inertial sensor ASIC chip 7, the inertial sensor MEMS chip 8 and the air pressure sensor ASIC chip 9 are respectively embedded in the medium layer 2 of the substrate 10, so that more space is avoided for mounting the air pressure sensor MEMS chip 5 on the surface of the substrate 10, and the integral size of the integrated sensor can be reduced.

Further, the package 11 may be fixedly connected to the substrate 10 by solder paste, in other words, the package 11 may be soldered and sealed to the first copper layer 3 by solder paste, so that the air pressure sensor MEMS chip 5 is accommodated in the space formed by the package 11 and the substrate 10.

The utility model discloses an in another embodiment, for the high waterproof performance who realizes the sensor, it has the waterproof glue 12 that covers first copper layer 3 and the MEMS chip of baroceptor to fill at the packaging structure intussuseption, and waterproof glue 12 not only can play waterproof dirt-proof effect to baroceptor MEMS chip 5, also can transmit external atmospheric pressure for baroceptor can in time gather external atmospheric pressure information.

According to the above embodiment, the utility model provides a multi-functional integrated form sensor buries part sensor chip underground in the medium layer of base plate, and part sensor chip pastes the dress in the base plate top, and this kind of structure not only can dodge sufficient space for the sensor chip subsides of base plate top, can also reduce the overall dimension of sensor, does benefit to frivolous and miniaturized development of sensor, finally realizes the miniaturization, integrates, electromagnetic interference is little, still possesses the multi-functional integrated form sensor of high waterproof grade simultaneously.

The multifunctional integrated sensor according to the present invention is described above by way of example with reference to the accompanying drawings. However, it will be appreciated by those skilled in the art that various modifications may be made to the multifunctional integrated sensor provided in the present invention without departing from the scope of the invention. Therefore, the scope of the present invention should be determined by the content of the appended claims.

Claims

1. A multifunctional integrated sensor comprises a substrate, a barometric sensor and an inertial sensor; it is characterized in that the preparation method is characterized in that,

the substrate comprises a first copper layer, a second copper layer and a dielectric layer positioned between the first copper layer and the second copper layer;

the MEMS chip of the air pressure sensor is arranged on the first copper layer and is electrically connected with the first copper layer;

the ASIC chip of the air pressure sensor, the MEMS chip of the inertial sensor and the ASIC chip are all embedded in the medium layer.

2. The multifunctional integrated sensor of claim 1,

the thicknesses of the dielectric layers are respectively greater than the thicknesses of the ASIC chip of the air pressure sensor and the thicknesses of the MEMS chip and the ASIC chip of the inertial sensor.

3. The multifunctional integrated sensor of claim 1,

the ASIC chip of the air pressure sensor, the MEMS chip of the inertial sensor and the ASIC chip are respectively and electrically connected with the first copper layer through rewiring and through holes in the substrate.

4. The multifunctional integrated sensor of claim 1,

a passivation layer is arranged on the first copper layer, and an MEMS chip of the air pressure sensor is attached to the passivation layer;

and the MEMS chip of the air pressure sensor is electrically connected with the first copper layer through a gold wire.

5. The multifunctional integrated sensor of claim 4,

the passivation layer is a conductive adhesive layer or a tin paste layer.

6. The multifunctional integrated sensor of claim 1, further comprising a housing forming an encapsulated structure with the substrate; wherein the content of the first and second substances,

the MEMS chip of the air pressure sensor is accommodated in the packaging structure.

7. The multifunctional integrated sensor of claim 6,

and waterproof glue which covers the first copper layer and the MEMS chip of the air pressure sensor is filled in the packaging structure.

8. The multifunctional integrated sensor of claim 6,

the shell is fixedly connected with the substrate through solder paste.

9. The multifunctional integrated sensor of claim 6,

the housing is solder sealed to the first copper layer by solder paste.

10. The multifunctional integrated sensor of claim 1,

the MEMS chip and the ASIC chip of the air pressure sensor are mutually conducted, and the MEMS chip and the ASIC chip of the inertial sensor are mutually conducted.