CN113218567A - Digital pressure sensor for measuring air pressure height and liquid level depth - Google Patents
Digital pressure sensor for measuring air pressure height and liquid level depth Download PDFInfo
- Publication number
- CN113218567A CN113218567A CN202110560602.2A CN202110560602A CN113218567A CN 113218567 A CN113218567 A CN 113218567A CN 202110560602 A CN202110560602 A CN 202110560602A CN 113218567 A CN113218567 A CN 113218567A
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- stainless steel
- liquid level
- steel ring
- pressure sensor
- measuring
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- 239000007788 liquid Substances 0.000 title claims abstract description 26
- 229910001220 stainless steel Inorganic materials 0.000 claims abstract description 38
- 239000010935 stainless steel Substances 0.000 claims abstract description 38
- 239000000758 substrate Substances 0.000 claims abstract description 29
- 239000003292 glue Substances 0.000 claims description 23
- 229910000679 solder Inorganic materials 0.000 claims description 10
- 238000005259 measurement Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 2
- 230000008569 process Effects 0.000 abstract description 2
- 230000009286 beneficial effect Effects 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000009189 diving Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The invention discloses a digital pressure sensor for measuring air pressure height and liquid level depth, which comprises a stainless steel ring, a substrate, an ASIC chip and an MEMS chip, wherein a through containing cavity is arranged in the stainless steel ring, the substrate is plugged at an open end of the stainless steel ring, the ASIC chip and the MEMS chip are both arranged in the stainless steel ring, the ASIC chip is fixed on the substrate, and the MEMS chip is fixed on the ASIC chip in an overlapping manner. The technical effects achieved are as follows: the digital pressure sensor for measuring the air pressure height and the liquid level depth is produced in a mass production mode with the lowest cost, the product is convenient to process, the production efficiency is improved, and the cost is reduced.
Description
Technical Field
The invention relates to the technical field of sensors, in particular to a digital pressure sensor for measuring air pressure height and liquid level depth.
Background
At present, as for a digital pressure sensor for measuring atmospheric pressure, altitude, diving depth and liquid level strength, a finished product is high and purchasing difficulty is high in the case of foreign technologies; the price of domestic products of the same year is reduced by a part compared with that of foreign products, so that the precision can be reduced very seriously, the cost and the quality can not reach the standard, the production capacity and the efficiency are low, the waste and the pollution are caused, and the products of enterprises can not form more technical innovations quickly.
Disclosure of Invention
Accordingly, the present invention is directed to a digital pressure sensor for measuring a pressure level and a liquid level depth, which solves the above-mentioned problems of the prior art.
In order to achieve the above purpose, the invention provides the following technical scheme:
according to a first aspect of the present invention, a digital pressure sensor for measuring an air pressure height and a liquid level depth includes a stainless steel ring, a substrate, an ASIC chip, and an MEMS chip, wherein a through receiving cavity is disposed in the stainless steel ring, the substrate is plugged at an open end of the stainless steel ring, the ASIC chip and the MEMS chip are both disposed in the stainless steel ring, the ASIC chip is fixed on the substrate, and the MEMS chip is fixed on the ASIC chip in an overlapping manner.
Furthermore, the ASIC chip and the MEMS chip are pasted on the substrate through glue.
Further, the substrate further comprises transparent waterproof glue, and the ASIC chip and the MEMS chip are coated on the substrate through the transparent waterproof glue.
Further, the MEMS chip comprises white anti-corrosion waterproof glue, wherein the white anti-corrosion waterproof glue is arranged on one side, deviating from the MEMS chip, of the transparent waterproof glue.
Furthermore, the stainless steel ring structure further comprises a solder PAD, and a plurality of solder PADs are fixed on the surface of the substrate, which is far away from the stainless steel ring.
Further, the substrate is of a rectangular sheet structure.
Furthermore, the four top corners of the substrate are respectively provided with the soldering tin PAD.
Furthermore, the stainless steel ring is of an integrally formed structure of a revolving body.
Further, the containing cavity in the stainless steel ring is a cylindrical cavity.
Furthermore, the outer side wall of the stainless steel ring is provided with a concave annular groove.
The invention has the following advantages: the digital pressure sensor for measuring the air pressure height and the liquid level depth is produced in a mass production mode with the lowest cost, the product is convenient to process, the production efficiency is improved, and the cost is reduced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It should be apparent that the drawings in the following description are merely exemplary, and that other embodiments can be derived from the drawings provided by those of ordinary skill in the art without inventive effort.
The structures, ratios, sizes, and the like shown in the present specification are only used for matching with the contents disclosed in the specification, so as to be understood and read by those skilled in the art, and are not used to limit the conditions that the present invention can be implemented, so that the present invention has no technical significance, and any structural modifications, changes in the ratio relationship, or adjustments of the sizes, without affecting the effects and the achievable by the present invention, should still fall within the range that the technical contents disclosed in the present invention can cover.
Fig. 1 is a cross-sectional view of a digital pressure sensor for measuring a gas pressure level and a liquid level depth according to some embodiments of the present invention.
Fig. 2 is a perspective view of a digital pressure sensor for measuring a gas pressure level and a liquid level depth according to some embodiments of the present invention.
Fig. 3 is a front view of a digital pressure sensor for measuring barometric pressure and liquid level depth according to some embodiments of the present invention.
Fig. 4 is a top view of a digital pressure sensor for measuring barometric pressure and liquid level depth according to some embodiments of the present invention.
Fig. 5 is a bottom view of a digital pressure sensor for measuring air pressure level and liquid level depth according to some embodiments of the present invention.
In the figure: 1. stainless steel ring, 2, base plate, 3, ASIC chip, 4, MEMS chip, 5, soldering tin PAD, 6, transparent waterproof glue.
Detailed Description
The present invention is described in terms of particular embodiments, other advantages and features of the invention will become apparent to those skilled in the art from the following disclosure, and it is to be understood that the described embodiments are merely exemplary of the invention and that it is not intended to limit the invention to the particular embodiments disclosed. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1 to 5, in an embodiment of the first aspect of the present invention, a digital pressure sensor for measuring an air pressure height and a liquid level depth includes a stainless steel ring 1, a substrate 2, an ASIC chip 3, and a MEMS chip 4, wherein a through accommodating cavity is disposed in the stainless steel ring 1, the substrate 2 is plugged at an open end of the stainless steel ring 1, the ASIC chip 3 and the MEMS chip 4 are both disposed in the stainless steel ring 1, the ASIC chip 3 is fixed on the substrate 2, and the MEMS chip 4 is fixed on the ASIC chip 3 in an overlapping manner.
In the above embodiments, it should be noted that the ASIC chip is an integrated circuit (ASIC) chip technology for special applications, and is considered as an integrated circuit designed for special purposes in the integrated circuit field; MEMS is an abbreviation of Micro-Electro-Mechanical System, known in Chinese as Micro-Electro-Mechanical systems. MEMS chips, in short, are semiconductor technologies used to fabricate electromechanical systems on silicon wafers.
The technical effects achieved by the above embodiment are as follows: the MEMS chip 4 and the ASIC chip 3 are stacked up and down, and are adhered to the substrate by using a glue technology, so that the problem of packaging size of a packaged product is solved; a plurality of single products are distributed on the whole product plate, so that special glue is favorably fixed, stable fixation can be ensured, and batch production is facilitated; through the digital pressure sensor of a measurement atmospheric pressure height and liquid level degree of depth of this embodiment, with minimum cost mode volume production, product processing is convenient, production efficiency improves, cost reduction.
Alternatively, as shown in fig. 1 to 5, in some embodiments, the ASIC chip 3 and the MEMS chip 4 are both adhered to the substrate 2 by glue.
In the above alternative embodiment, it should be noted that the ASIC chip 3 is attached to the substrate 2 by glue, and the MEMS chip 4 is attached to the ASIC chip 3 by glue.
The beneficial effects of the above alternative embodiment are: through adopting the mode that glue was pasted, the processing cost is low, and the steadiness is good.
Optionally, as shown in fig. 1 to 5, in some embodiments, a transparent waterproof adhesive 6 is further included, and the ASIC chip 3 and the MEMS chip 4 are coated on the substrate 2 by the transparent waterproof adhesive 6.
In the above optional embodiment, it should be noted that, in addition, the transparent waterproof glue 6 may also be replaced by other waterproof materials.
The beneficial effects of the above alternative embodiment are: by arranging the transparent waterproof glue 6, the waterproof effect of the ASIC chip 3 and the MEMS chip 4 is improved.
Optionally, as shown in fig. 1 to 5, in some embodiments, a white anti-corrosive waterproof adhesive is further included, and the white anti-corrosive waterproof adhesive is disposed on a side of the transparent waterproof adhesive 6 facing away from the MEMS chip 4.
In the above optional embodiments, it should be noted that the white anticorrosive and waterproof glue may also be replaced by other waterproof and anticorrosive materials.
The beneficial effects of the above alternative embodiment are: by arranging the white anti-corrosion waterproof glue, the waterproof and anti-corrosion effects of the ASIC chip 3 and the MEMS chip 4 are improved.
Optionally, as shown in fig. 1 to 5, in some embodiments, the stainless steel ring further includes solder PADs 5, and a plurality of solder PADs 5 are fixed on a surface of the substrate 2 facing away from the stainless steel ring 1.
The beneficial effects of the above alternative embodiment are: by providing the solder PAD5, transmission of electrical signals is achieved.
Alternatively, as shown in fig. 1 to 5, in some embodiments, the substrate 2 is a rectangular sheet structure.
In the above alternative embodiments, it should be noted that the substrate 2 may have other structural shapes.
The beneficial effects of the above alternative embodiment are: by using the substrate 2 of a rectangular sheet structure, the processing cost is significantly reduced.
Alternatively, as shown in fig. 1 to 5, in some embodiments, four corners of the substrate 2 are respectively provided with solder PADs 5.
In the above alternative embodiment, it should be noted that, in addition, the number of the solder PADs 5 on the substrate 2 can be set according to actual requirements.
Alternatively, as shown in fig. 1 to 5, in some embodiments, the stainless steel ring 1 is an integrally formed structure of a solid of revolution.
In the above alternative embodiment, it should be noted that the stainless steel ring 1 may have other structures.
The beneficial effects of the above alternative embodiment are: the machining difficulty of the stainless steel ring 1 is reduced by adopting the integral forming structure of the revolving body, and the stainless steel ring can be machined and formed only by a lathe.
Alternatively, as shown in fig. 1 to 5, in some embodiments, the accommodating cavity in the stainless steel ring 1 is a cylindrical chamber.
In the above alternative embodiment, it should be noted that the accommodating cavity in the stainless steel ring 1 may have other shapes.
The beneficial effects of the above alternative embodiment are: the cavity that holds through in the stainless steel ring 1 is cylindrical cavity, and the machine-shaping degree of difficulty is showing and is reducing.
Optionally, as shown in fig. 1 to 5, in some embodiments, the outer side wall of the stainless steel ring 1 is provided with a concave annular groove.
The beneficial effects of the above alternative embodiment are: the concave annular groove is formed in the outer side wall of the stainless steel ring 1, so that the weight of the stainless steel ring 1 is reduced, and the material cost is reduced.
Although the invention has been described in detail above with reference to a general description and specific examples, it will be apparent to one skilled in the art that modifications or improvements may be made thereto based on the invention. Accordingly, such modifications and improvements are intended to be within the scope of the invention as claimed.
In the present specification, the terms "upper", "lower", "left", "right", "middle", and the like are used for clarity of description, and are not intended to limit the scope of the present invention, and changes or modifications in the relative relationship may be made without substantial changes in the technical content.
Claims (10)
1. The utility model provides a digital pressure sensor of measurement atmospheric pressure height and liquid level degree of depth, its characterized in that, includes stainless steel ring (1), base plate (2), ASIC chip (3) and MEMS chip (4), be provided with the chamber that holds that runs through in stainless steel ring (1), base plate (2) shutoff is in an open end of stainless steel ring (1), ASIC chip (3) and MEMS chip (4) all set up in stainless steel ring (1), ASIC chip (3) are fixed on base plate (2), MEMS chip (4) stack is fixed on ASIC chip (3).
2. A digital pressure sensor for measuring barometric pressure and liquid level depth according to claim 1, wherein said ASIC chip (3) and said MEMS chip (4) are both glued on said substrate (2) by glue.
3. The digital pressure sensor for measuring the gas pressure and liquid level according to claim 1, further comprising a transparent waterproof glue (6), wherein the ASIC chip (3) and the MEMS chip (4) are coated on the substrate (2) by the transparent waterproof glue (6).
4. A digital pressure sensor for measuring barometric pressure and liquid level depth according to claim 3, further comprising a white anti-corrosive waterproof glue, wherein the white anti-corrosive waterproof glue is disposed on a side of the transparent waterproof glue (6) facing away from the MEMS chip (4).
5. The digital pressure sensor for measuring the gas pressure and liquid level according to claim 1, further comprising a solder PAD (5), wherein a plurality of solder PADs (5) are fixed on the surface of the substrate (2) facing away from the stainless steel ring (1).
6. A digital pressure sensor for measuring gas pressure and liquid level according to claim 5, characterized in that the base plate (2) is a rectangular sheet structure.
7. The digital pressure sensor for measuring gas pressure and liquid level according to claim 6, wherein four corners of the substrate (2) are respectively provided with the solder PADs (5).
8. The digital pressure sensor for measuring the air pressure height and the liquid level depth as claimed in claim 1, wherein the stainless steel ring (1) is an integral structure of a rotator.
9. Digital pressure transducer for measuring the level of air pressure and the level of liquid according to claim 8, characterized by the fact that the housing inside the stainless steel ring (1) is a cylindrical chamber.
10. The digital pressure sensor for measuring the air pressure height and the liquid level depth as claimed in claim 9, wherein the outer side wall of the stainless steel ring (1) is provided with a concave annular groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110560602.2A CN113218567A (en) | 2021-05-21 | 2021-05-21 | Digital pressure sensor for measuring air pressure height and liquid level depth |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110560602.2A CN113218567A (en) | 2021-05-21 | 2021-05-21 | Digital pressure sensor for measuring air pressure height and liquid level depth |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113218567A true CN113218567A (en) | 2021-08-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110560602.2A Pending CN113218567A (en) | 2021-05-21 | 2021-05-21 | Digital pressure sensor for measuring air pressure height and liquid level depth |
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| Country | Link |
|---|---|
| CN (1) | CN113218567A (en) |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105236343A (en) * | 2015-09-07 | 2016-01-13 | 苏州敏芯微电子技术有限公司 | Dielectric isolation type pressure sensor encapsulating structure |
| WO2018179997A1 (en) * | 2017-03-31 | 2018-10-04 | 株式会社村田製作所 | Pressure sensor |
| CN209400128U (en) * | 2018-12-25 | 2019-09-17 | 歌尔科技有限公司 | Waterproof differential pressure pickup |
| CN209513143U (en) * | 2018-12-27 | 2019-10-18 | 苏州众力仪表有限公司 | A kind of stainless steel casing of pressure gauge |
| CN210123288U (en) * | 2019-05-27 | 2020-03-03 | 青岛歌尔智能传感器有限公司 | Multifunctional integrated sensor |
| CN210953183U (en) * | 2019-10-28 | 2020-07-07 | 歌尔微电子有限公司 | Waterproof pressure sensor |
| CN211855674U (en) * | 2020-04-23 | 2020-11-03 | 歌尔微电子有限公司 | Air pressure sensor and electronic device |
| CN212721899U (en) * | 2020-08-28 | 2021-03-16 | 潍坊歌尔微电子有限公司 | Packaging shell, waterproof air pressure sensor and electronic equipment |
| CN212903703U (en) * | 2020-09-16 | 2021-04-06 | 深圳市华普微电子有限公司 | Gauge pressure sensor |
| CN212903704U (en) * | 2020-09-16 | 2021-04-06 | 深圳市华普微电子有限公司 | Digital chip composite packaging pressure meter sensor |
| CN212988680U (en) * | 2020-08-28 | 2021-04-16 | 荣成歌尔微电子有限公司 | Waterproof barometer and wearable equipment |
| CN213091059U (en) * | 2020-11-09 | 2021-04-30 | 南京航伽电子科技有限公司 | Compact explosion-proof pressure transmitter |
-
2021
- 2021-05-21 CN CN202110560602.2A patent/CN113218567A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105236343A (en) * | 2015-09-07 | 2016-01-13 | 苏州敏芯微电子技术有限公司 | Dielectric isolation type pressure sensor encapsulating structure |
| WO2018179997A1 (en) * | 2017-03-31 | 2018-10-04 | 株式会社村田製作所 | Pressure sensor |
| CN209400128U (en) * | 2018-12-25 | 2019-09-17 | 歌尔科技有限公司 | Waterproof differential pressure pickup |
| CN209513143U (en) * | 2018-12-27 | 2019-10-18 | 苏州众力仪表有限公司 | A kind of stainless steel casing of pressure gauge |
| CN210123288U (en) * | 2019-05-27 | 2020-03-03 | 青岛歌尔智能传感器有限公司 | Multifunctional integrated sensor |
| CN210953183U (en) * | 2019-10-28 | 2020-07-07 | 歌尔微电子有限公司 | Waterproof pressure sensor |
| CN211855674U (en) * | 2020-04-23 | 2020-11-03 | 歌尔微电子有限公司 | Air pressure sensor and electronic device |
| CN212721899U (en) * | 2020-08-28 | 2021-03-16 | 潍坊歌尔微电子有限公司 | Packaging shell, waterproof air pressure sensor and electronic equipment |
| CN212988680U (en) * | 2020-08-28 | 2021-04-16 | 荣成歌尔微电子有限公司 | Waterproof barometer and wearable equipment |
| CN212903703U (en) * | 2020-09-16 | 2021-04-06 | 深圳市华普微电子有限公司 | Gauge pressure sensor |
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| CN213091059U (en) * | 2020-11-09 | 2021-04-30 | 南京航伽电子科技有限公司 | Compact explosion-proof pressure transmitter |
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Application publication date: 20210806 |
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