CN210953183U - Waterproof pressure sensor - Google Patents
Waterproof pressure sensor Download PDFInfo
- Publication number
- CN210953183U CN210953183U CN201921832778.3U CN201921832778U CN210953183U CN 210953183 U CN210953183 U CN 210953183U CN 201921832778 U CN201921832778 U CN 201921832778U CN 210953183 U CN210953183 U CN 210953183U
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- pressure sensor
- pcb
- waterproof
- pressure
- pcb board
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- 238000004806 packaging method and process Methods 0.000 claims abstract description 20
- 239000000565 sealant Substances 0.000 claims abstract description 9
- 239000000499 gel Substances 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 239000011229 interlayer Substances 0.000 claims description 8
- 229920001296 polysiloxane Polymers 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 7
- 239000000741 silica gel Substances 0.000 claims description 7
- 229910002027 silica gel Inorganic materials 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 239000010410 layer Substances 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 2
- -1 wherein Substances 0.000 claims description 2
- 238000005538 encapsulation Methods 0.000 abstract description 4
- 230000008054 signal transmission Effects 0.000 description 7
- XOMKZKJEJBZBJJ-UHFFFAOYSA-N 1,2-dichloro-3-phenylbenzene Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1Cl XOMKZKJEJBZBJJ-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 239000006071 cream Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000007767 bonding agent Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920006335 epoxy glue Polymers 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
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- Measuring Fluid Pressure (AREA)
Abstract
The utility model provides a waterproof pressure sensor, including the packaging structure who is formed by shell and PCB board, wherein, be provided with pressure MEMS chip on the PCB board inside the packaging structure, wherein, bury the pressure ASIC chip underground in the PCB board, the pressure ASIC chip passes through the interlaminar circuit of PCB board and with PCB board electric connection; and the packaging structure is filled with a sealant, and the sealant covers the pressure MEMS chip. Utilize the utility model discloses, it is big to solve waterproof pressure sensor encapsulation back product size, unsatisfied product miniaturization demand's problem.
Description
Technical Field
The utility model relates to a sensor technical field, more specifically relates to a waterproof pressure sensor.
Background
Along with the rise of wearable products such as wrist-watch, bracelet, wearable product function is more and more, and product integration level is higher and more, and pressure sensor has become its indispensable mark and joins in marriage the device, also improves gradually chip size's requirement and waterproof requirement, but pressure sensor receives chip size and technology headspace restriction, and the encapsulation back product size is great, is unfavorable for the miniaturization of product.
In order to satisfy the miniaturized requirement of end user to waterproof pressure sensor, the utility model provides a new waterproof pressure sensor.
SUMMERY OF THE UTILITY MODEL
In view of the above problem, the utility model aims at providing a waterproof pressure sensor to solve waterproof pressure sensor and encapsulate back product size big, unsatisfied product miniaturization demand's problem.
The utility model provides a waterproof pressure sensor, including the packaging structure who is formed by shell and PCB board, wherein, be provided with pressure MEMS chip on the PCB board inside the packaging structure, wherein, bury the pressure ASIC chip underground in the PCB board, the pressure ASIC chip pass through the interlaminar circuit of PCB board with PCB board electric connection;
and the packaging structure is filled with a sealant, and the sealant covers the pressure MEMS chip.
In addition, the preferable structure is that the sealant is silicone gel.
In addition, the preferred structure is that the shell is fixed with the PCB board by bonding agent, wherein the bonding agent is solder paste or conductive adhesive.
In addition, the preferable structure is that a groove is arranged at one end of the shell which is not fixed with the PCB, and the groove is used for installing an O-shaped ring; wherein,
the shell is connected with the terminal equipment in a sealing mode through the groove and the O-shaped ring.
In addition, the preferable structure is that the packaging structure is a cavity formed by the shell and the PCB, and the cavity is electrically connected with GND to form an equipotential shielding layer.
In addition, the preferable structure is that the pressure MEMS chip is fixed with the PCB through silica gel.
Further, it is preferable that the housing has a convex structure.
In addition, it is preferable that the pressure MEMS chip is electrically connected to the PCB board through a metal wire.
In addition, the PCB board is preferably provided with a pad, and the PCB board is electrically connected with an external device through the pad.
According to the technical scheme, the utility model provides a waterproof pressure sensor through setting up pressure ASIC chip inside the PCB board, thereby effectively reduce the encapsulation size of waterproof pressure sensor product, and this kind of structural design mode can effectively reduce the light noise influence in addition, and reduces the inside complexity of packaging structure, can effectively reduce the bubble production rate of filling silica gel, reduces the influence that the bubble remains and cause the product property ability; in addition, the pressure ASIC chip is electrically connected with the PCB through an interlayer circuit of the PCB, and the signal connection mode has short signal transmission distance and can effectively reduce signal loss and power consumption.
Drawings
Other objects and results of the invention will be more apparent and readily appreciated by reference to the following description taken in conjunction with the accompanying drawings, and as the invention is more fully understood. In the drawings:
fig. 1 is a schematic cross-sectional structural view of a waterproof pressure sensor according to an embodiment of the present invention;
fig. 2 is a schematic top view of a waterproof pressure sensor according to an embodiment of the present invention;
fig. 3 is a schematic perspective view of a waterproof pressure sensor according to the embodiment of the present invention.
Wherein the reference numerals include: 1. pressure MEMS chip, 2, metal wire, 3, shell, 4, adhesive, 5, PCB board, 51, interlayer circuit of PCB board, 6, pressure ASIC chip, 7, silica gel, 8, silica gel, 9, groove.
The same reference numbers in all figures indicate similar or corresponding features or functions.
Detailed Description
Present waterproof pressure sensor encapsulation back product size to aforementioned proposition is big, the problem of unsatisfied product miniaturization demand, the utility model provides a new waterproof pressure sensor.
Specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
In order to illustrate the structure of the waterproof pressure sensor provided by the present invention, fig. 1 to fig. 3 exemplarily indicate the structure of the waterproof pressure sensor from different angles, respectively. Specifically, fig. 1 shows a cross-sectional structure of a waterproof pressure sensor according to an embodiment of the present invention; fig. 2 shows a waterproof pressure sensor in accordance with an embodiment of the present invention looking down on the structure; fig. 3 shows waterproof pressure sensor spatial structure according to the embodiment of the present invention.
As shown in fig. 1, fig. 2 and fig. 3 jointly, the utility model provides a waterproof pressure sensor, include the packaging structure who is formed by shell 3 and PCB board 5, wherein, be provided with pressure MEMS chip 1 on the inside PCB board 5 of packaging structure, wherein, buried pressure ASIC chip 6 underground inside PCB board 5, pressure ASIC chip 6 is connected with PCB board 2 electricity through the interlaminar circuit 51 of PCB board, and it has sealed glue to fill inside the packaging structure to sealed glue covers pressure MEMS chip 1.
The sealant is silicone gel 8, the pressure MEMS chip 1 is covered by the silicone gel 8, the silicone gel 8 protects the pressure MEMS chip 1 from water and corrosion, and when the external pressure changes, the silicone gel 8 is slightly deformed, so that the silicone gel acts on a sensitive membrane of the pressure MEMS chip 1.
In the embodiment shown in fig. 1, the pressure MEMS chip 1 is electrically connected to the PCB board (signal transmission) through the metal wire 2, and the pressure ASIC chip 6 is electrically connected to the PCB board 5 (signal transmission) through the interlayer circuit 51 of the PCB board, thereby achieving signal transmission between the pressure ASIC chip 6 and the pressure MEMS chip 1. The pressure ASIC chip is electrically connected with the PCB through an interlayer circuit of the PCB, and the signal connection mode has short signal transmission distance and can effectively reduce signal loss and power consumption.
The embodiment of the utility model provides an in, shell 3 bonds fixedly mutually with PCB board 5 through adhesive 4, and wherein, adhesive 4 is silver thick liquid or tin cream or conducting resin, and preferably, adhesive 4 is silver thick liquid, also can select tin cream or conducting resin, and in practical application, as required, select any one of silver thick liquid or tin cream or epoxy glue to bond fixedly together shell 3 and PCB board 5.
In the embodiment shown in fig. 1 and 2, the housing 3 is in the shape of a convex structure, wherein one end of the housing 3 is fixed to the PCB board 5, and the other end of the housing 3 is connected to the application terminal, that is: a groove 9 is formed in one end, not fixed to the PCB 5, of the shell 3, and the groove 9 is used for installing an O-shaped ring; wherein, the shell 3 is connected with the application terminal in a sealing way through the groove 9 and the O-shaped ring. The purpose of the O-ring placed in the groove 9 is to seal the connection of the housing 3 to the application terminal, preventing water from entering the pressure sensor in special circumstances.
The silicone gel 8 is filled into the shell through a port at one end of the shell 3 provided with the groove 9, and protects the internal chip (the MEMS chip 1) and the metal wire 2, so that the waterproof and anticorrosion effects are achieved.
In the embodiment of the utility model, in order to reduce the packaging stress of the pressure MEMS chip 1, the low modulus silica gel 7 is bonded with the PCB 5, in addition, the packaging structure is a cavity formed by the shell and the PCB, and the cavity is electrically connected with GND to form an equipotential shielding layer; that is to say, the shell 3 is adhered to the PCB board 5 through the adhesive 6 to form a protection cavity of the chip, and is in signal connection with the GND to form an equipotential shielding layer, so that external electromagnetic interference can be effectively reduced.
The utility model provides a waterproof pressure sensor that figure 1 is shown's theory of operation does:
the first step is as follows: the silicon gel 8 is filled in the packaging structure to carry out waterproof and anticorrosion protection on the pressure MEMS chip 1, and when the external pressure changes, the silicon gel 8 is subjected to micro deformation so as to act on a sensitive membrane of the pressure MEMS chip 1;
the second step is that: the pressure MEMS chip 1 converts the pressure signal into an analog signal and transmits the analog signal to the PCB 5 through a metal wire;
the third step: the analog signal is transmitted to the pressure ASIC chip 6 through the interlayer circuit 51 of the PCB, the pressure ASIC chip 6 converts the received analog signal into a digital signal, and performs signal amplification, calibration and other processing, and the processed digital signal is transmitted to the PCB 5 through the interlayer circuit 51 of the PCB;
the fourth step: since the PCB board 5 is provided with the pad, the pad is electrically connected to an external device, and the pressure signal is transmitted through the pad.
The aforesaid does the utility model provides a detailed theory of operation of waterproof pressure sensor comes out waterproof pressure sensor measuring pressure differential signal transmission through above-mentioned process.
According to the embodiment, the waterproof pressure sensor provided by the utility model has the advantages that the pressure ASIC chip is arranged inside the PCB, so that the packaging size of the waterproof pressure sensor product is effectively reduced, in addition, the structural design mode can effectively reduce the light noise influence and reduce the complexity inside the packaging structure, the bubble generation rate of filling silica gel can be effectively reduced, and the influence of bubble residues on the product performance is reduced; in addition, the pressure ASIC chip is electrically connected with the PCB through an interlayer circuit of the PCB, and the signal connection mode has short signal transmission distance and can effectively reduce signal loss and power consumption.
The waterproof pressure sensor according to the present invention is described above by way of example with reference to the accompanying drawings. However, it should be understood by those skilled in the art that various modifications can be made to the waterproof pressure sensor provided in the present invention without departing from the scope of the present invention. Therefore, the scope of the present invention should be determined by the content of the appended claims.
Claims (9)
1. A waterproof pressure sensor comprises a packaging structure formed by a shell and a PCB, wherein a pressure MEMS chip is arranged on the PCB inside the packaging structure,
a pressure ASIC chip is embedded in the PCB and is electrically connected with the PCB through an interlayer circuit of the PCB;
and the packaging structure is filled with a sealant, and the sealant covers the pressure MEMS chip.
2. The waterproof pressure sensor of claim 1,
the sealant is silicone gel.
3. The waterproof pressure sensor of claim 1,
the housing is adhesively fixed to the PCB board by an adhesive, wherein,
the adhesive is solder paste or conductive adhesive.
4. The waterproof pressure sensor of claim 3,
a groove is formed in one end, which is not fixed with the PCB, of the shell, and the groove is used for mounting an O-shaped ring; wherein,
the shell is connected with the terminal equipment in a sealing mode through the groove and the O-shaped ring.
5. The waterproof pressure sensor of claim 1,
the packaging structure is a cavity formed by the shell and the PCB, and the cavity is electrically connected with the GND to form an equipotential shielding layer.
6. The waterproof pressure sensor of claim 1,
the pressure MEMS chip is fixed with the PCB through silica gel.
7. The waterproof pressure sensor of claim 1,
the shell is of a convex structure.
8. The waterproof pressure sensor of claim 1,
the pressure MEMS chip is electrically connected with the PCB through a metal wire.
9. The waterproof pressure sensor of claim 1,
and the PCB is also provided with a bonding pad and is electrically connected with an external device through the bonding pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921832778.3U CN210953183U (en) | 2019-10-28 | 2019-10-28 | Waterproof pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921832778.3U CN210953183U (en) | 2019-10-28 | 2019-10-28 | Waterproof pressure sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210953183U true CN210953183U (en) | 2020-07-07 |
Family
ID=71383357
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921832778.3U Active CN210953183U (en) | 2019-10-28 | 2019-10-28 | Waterproof pressure sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210953183U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111816621A (en) * | 2020-07-22 | 2020-10-23 | 潍坊歌尔微电子有限公司 | Waterproof pressure sensor and packaging method |
| CN112577539A (en) * | 2020-12-07 | 2021-03-30 | 潍坊歌尔微电子有限公司 | Waterproof sensor and electronic device |
| CN113218567A (en) * | 2021-05-21 | 2021-08-06 | 深圳市伟烽恒科技有限公司 | Digital pressure sensor for measuring air pressure height and liquid level depth |
| WO2022022393A1 (en) * | 2020-07-29 | 2022-02-03 | 青岛歌尔智能传感器有限公司 | Packaging structure of navigation module, and electronic device |
| WO2022111132A1 (en) * | 2020-11-30 | 2022-06-02 | 潍坊歌尔微电子有限公司 | Sensor packaging structure, and differential pressure sensor |
| CN115325165A (en) * | 2022-10-17 | 2022-11-11 | 南京数智微传感科技有限公司 | Waterproof control system for underwater measurement force sensor |
-
2019
- 2019-10-28 CN CN201921832778.3U patent/CN210953183U/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111816621A (en) * | 2020-07-22 | 2020-10-23 | 潍坊歌尔微电子有限公司 | Waterproof pressure sensor and packaging method |
| WO2022022393A1 (en) * | 2020-07-29 | 2022-02-03 | 青岛歌尔智能传感器有限公司 | Packaging structure of navigation module, and electronic device |
| WO2022111132A1 (en) * | 2020-11-30 | 2022-06-02 | 潍坊歌尔微电子有限公司 | Sensor packaging structure, and differential pressure sensor |
| CN112577539A (en) * | 2020-12-07 | 2021-03-30 | 潍坊歌尔微电子有限公司 | Waterproof sensor and electronic device |
| CN113218567A (en) * | 2021-05-21 | 2021-08-06 | 深圳市伟烽恒科技有限公司 | Digital pressure sensor for measuring air pressure height and liquid level depth |
| CN115325165A (en) * | 2022-10-17 | 2022-11-11 | 南京数智微传感科技有限公司 | Waterproof control system for underwater measurement force sensor |
| CN115325165B (en) * | 2022-10-17 | 2023-01-24 | 南京数智微传感科技有限公司 | Waterproof control system for underwater measurement force sensor |
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