CN213688772U - Sensor packaging structure and differential pressure sensor - Google Patents
Sensor packaging structure and differential pressure sensor Download PDFInfo
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- CN213688772U CN213688772U CN202022828036.2U CN202022828036U CN213688772U CN 213688772 U CN213688772 U CN 213688772U CN 202022828036 U CN202022828036 U CN 202022828036U CN 213688772 U CN213688772 U CN 213688772U
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L13/00—Devices or apparatus for measuring differences of two or more fluid pressure values
- G01L13/02—Devices or apparatus for measuring differences of two or more fluid pressure values using elastically-deformable members or pistons as sensing elements
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/04—Means for compensating for effects of changes of temperature, i.e. other than electric compensation
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
Abstract
The utility model discloses a sensor packaging structure and differential pressure sensor, include: a housing; the shell is arranged on the substrate and forms an accommodating space with the substrate in a surrounding way, and the first vent hole of the shell and the second vent hole of the substrate are communicated with the accommodating space; the sensor chip and the signal processing chip are accommodated in the accommodating space, electrically connected and arranged on the substrate in a stacked manner, and the sensor chip is positioned on one side of the signal processing chip, which is far away from the substrate; the sensor chip is provided with a vibration cavity, the signal processing chip is provided with a third vent hole, and the vibration cavity is communicated with the second vent hole through the third vent hole; and the waterproof glue is filled in the accommodating space and covers the sensor chip and the signal processing chip. The sensor packaging structure enables the differential pressure sensor to integrate a temperature linear compensation function, and is convenient to apply. The sensor chip and the signal processing chip in the sensor packaging structure are designed in a laminated mode, so that the occupied volume is saved, the miniaturized design of a product is facilitated, and meanwhile the sensor packaging structure has the advantage of good waterproof property.
Description
Technical Field
The utility model relates to a sensor technical field, in particular to sensor packaging structure and differential pressure sensor.
Background
At present, in the first-level packaging market, a Transistor Outline (TO) type packaging structure is adopted for a differential pressure sensor, the packaging process is complex, the product volume is large, the waterproof characteristic is poor, only one gage pressure Micro Electro Mechanical System (MEMS) is arranged in a packaging body, and the temperature linear compensation function is not realized. For the differential pressure sensor which needs to perform the temperature compensation function, the differential pressure sensor which is packaged in the first stage is usually required to be matched with an Application Specific Integrated Circuit (ASIC) chip and then packaged in the second stage to realize the temperature linear compensation, so the application is inconvenient. In addition, the existing differential pressure sensor occupies a larger volume due to the limitation of an encapsulation structure, and is not beneficial to the miniaturization design of products.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a sensor packaging structure and differential pressure sensor aims at solving differential pressure sensor waterproof characteristic poor, the inconvenient and technical problem who is unfavorable for the miniaturized design of product of application.
In order to achieve the above object, the utility model provides a sensor packaging structure, include:
the shell is provided with a first vent hole;
the shell is arranged on the substrate and forms an accommodating space with the substrate in a surrounding mode, the substrate is provided with a second vent hole, and the first vent hole and the second vent hole are communicated with the accommodating space;
the sensor chip and the signal processing chip are accommodated in the accommodating space, the sensor chip and the signal processing chip are electrically connected and are arranged on the substrate in a stacked mode, and the sensor chip is located on one side, away from the substrate, of the signal processing chip; the sensor chip is provided with a vibration cavity, the signal processing chip is provided with a third vent hole, and the vibration cavity is communicated with the second vent hole through the third vent hole;
and the waterproof glue is filled in the accommodating space and covers the sensor chip and the signal processing chip.
Preferably, the sensor chip is bonded to one side of the signal processing chip, which is deviated from the substrate, through a first sealing adhesive layer, and the first sealing adhesive layer is annularly surrounded on the periphery of the third vent hole.
Preferably, the signal processing chip is bonded to the substrate through a second sealant layer, and the second sealant layer is annularly surrounded on the periphery of the second vent hole.
Preferably, the housing includes a housing body and an installation portion, one end of the housing body is bonded to the substrate through a conductive adhesive layer, and the other end of the housing body is connected to the installation portion; the installation department is the tube-shape, just the installation department is kept away from the one end of casing body forms first air vent, the waterproof glue fill in the casing body and to extend in the installation department.
Preferably, the periphery of the mounting portion forms a sealing groove, and the sealing groove is annularly arranged and is recessed from outside to inside.
Preferably, the sensor chip is electrically connected to the signal processing chip through a metal wire.
Preferably, the first vent hole, the second vent hole and the third vent hole are arranged opposite to the vibration cavity.
Preferably, a plurality of pads are arranged on one side of the substrate, which is away from the accommodating space, and the pads are arranged at intervals.
Preferably, among the plurality of bonding pads, at least one bonding pad is an annular bonding pad, and the rest bonding pads are rectangular bonding pads, the annular bonding pad is surrounded on the periphery of the second vent hole, and the rectangular bonding pad is arranged close to the edge of the substrate.
The utility model discloses still provide a differential pressure sensor, include as above sensor packaging structure.
The utility model discloses the sensor is when using, the sensitive membrane of sensor chip produces deformation according to the pressure differential that waterproof glue and second vent formed, thereby lead to the resistance value on the sensitive membrane to change, and will show the physical quantity conversion of pressure differential to pressure signal according to deformation, and transmit to the signal processing chip, carry out signal processing to pressure signal by the signal processing chip, and carry out temperature compensation to pressure signal according to the temperature coefficient of prestore, final output compensation pressure signal, realize the linear compensation function of temperature, make the pressure differential sensor integration have the linear compensation function of temperature, and convenient for use. The sensor chip and the signal processing chip are covered by the waterproof glue, so that the functions of air pressure transmission, water resistance and corrosion resistance are achieved, the sealing performance and the waterproof effect are good, and the waterproof property of the differential pressure sensor is improved. Additionally, the utility model discloses a sensor chip and signal processing chip adopt the design of lamination formula, and sensor chip and the range upon range of setting of signal processing chip, and the sensor chip and the signal processing chip of range upon range of setting have then saved and have taken the volume, reduce the encapsulation size, and the structure is more compact, small and exquisite, does benefit to the miniaturized design of product.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic cross-sectional view of a sensor package structure according to an embodiment of the present invention;
fig. 2 is a schematic bottom view of a sensor package structure according to an embodiment of the present invention.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 100 | |
30 | |
| 10 | |
31 | |
| 11 | The |
40 | |
| 12 | |
41 | |
| 13 | |
50 | Accommodating |
| 131 | |
60 | |
| 20 | |
70 | |
| 21 | |
80 | |
| 22 | |
90 | Conductive |
| 22a | |
101 | |
| 22b | Rectangular bonding pad |
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit ly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
The utility model provides a sensor packaging structure.
As shown in fig. 1 and fig. 2, the sensor package structure 100 of the present embodiment includes a housing 10, a substrate 20, a sensor chip 30, a signal processing chip 40, and a waterproof adhesive 60, wherein the housing 10 is provided with a first vent hole 11, the housing 10 is disposed on the substrate 20 and encloses an accommodating space 50 with the substrate 20, the substrate 20 is provided with a second vent hole 21, and both the first vent hole 11 and the second vent hole 21 are communicated with the accommodating space 50; the sensor chip 30 and the signal processing chip 40 are accommodated in the accommodating space 50, the sensor chip 30 and the signal processing chip 40 are electrically connected and are arranged on the substrate 20 in a stacked manner, and the sensor chip 30 is positioned on one side of the signal processing chip 40, which is far away from the substrate 20; the sensor chip 30 has a vibration cavity 31, the signal processing chip 40 has a third vent hole 41, and the vibration cavity 31 is communicated with the second vent hole 21 through the third vent hole 41. The waterproof adhesive 60 is filled in the accommodating space 50 and covers the sensor chip 30 and the signal processing chip 40.
Specifically, as shown in fig. 1 and 2, the housing 10 is disposed over the substrate 20 and encloses an accommodating space 50 with the substrate 20, so as to accommodate the sensor chip 30 and the signal processing chip 40 therein, and the structure is compact. In addition, the sensor chip 30 and the signal processing chip 40 of the embodiment adopt a laminated design, the sensor chip 30 and the signal processing chip 40 are arranged in an up-down stacked manner, and the sensor chip 30 and the signal processing chip 40 arranged in a stacked manner save occupied volume, reduce packaging size, have a more compact and small structure, and are beneficial to the miniaturization design of products.
The waterproof adhesive 60 of the present embodiment is filled in the accommodating space 50, and covers the sensor chip 30 and the signal processing chip 40 in all directions. First air vent 11 has been seted up to shell 10, first air vent 11 is located the top of sensor chip 30 and waterproof glue 60, first air vent 11 can be used as the last induction end of sensor chip 30 to transmit to sensor chip 30 through waterproof glue 60, carry out top atmospheric pressure and detect, and seted up second air vent 21 on the base plate 20, second air vent 21 is located the below of sensor chip 30, second air vent 21 shell can be used as the lower induction end of sensor chip 30, can carry out bottom atmospheric pressure and detect. In order to realize the air intake of the second vent hole 21 into the vibration cavity 31 of the sensor chip 30, the signal processing chip 40 is opened with a third vent hole 41 to communicate the second vent hole 21 with the vibration cavity 31.
When the sensor package structure 100 of this embodiment is used, the sensing film of the sensor chip 30 deforms according to the pressure difference formed between the upper sensing end and the lower sensing end, so that the resistance value on the sensing film changes, and the physical quantity representing the pressure difference is converted into a pressure signal according to the deformation and transmitted to the signal processing chip 40, the signal processing chip 40 performs signal processing on the pressure signal, performs temperature compensation on the pressure signal according to a pre-stored temperature coefficient, and finally outputs a compensated pressure signal, so as to implement a temperature linear compensation function, so that the pressure difference sensor is integrated with a temperature linear compensation function, and the application is convenient. The waterproof glue 60 of the present embodiment may adopt a silicone gel in the prior art, which has physical properties of water resistance, corrosion resistance, low modulus, and high elasticity, and serves as an upper pressure sensing end, senses pressure changes, and converts the pressure changes into deformation quantities to be transmitted to the sensor chip 30. The waterproof glue 60 covers the sensor chip 30 and the signal processing chip 40, so that the functions of air pressure transmission, water resistance and corrosion resistance are achieved, the sealing performance and the waterproof effect are good, and the waterproof property of the differential pressure sensor is improved.
In this embodiment, the sensor chip 30 is adhered to the signal processing chip 40 through the first sealant layer 70 on a side away from the substrate 20, and the first sealant layer 70 is annularly surrounded on the periphery of the third vent hole 41. As shown in fig. 1, the bottom of the sensor chip 30 is bonded to the upper side of the signal processing chip 40 through the first sealant layer 70, and the first sealant layer 70 is in an annular closed structure and surrounds the third vent hole 41, so as to surround the third vent hole 41, thereby performing a sealing function, preventing the pressure leakage from the third vent hole 41, and improving the detection sensitivity and precision of the differential pressure sensor. The first sealant layer 70 of the present embodiment can be made of silica gel in the prior art, and the sensor chip 30 is bonded to the signal processing chip 40 through silica gel, so that the assembly is convenient and simple.
Further, the signal processing chip 40 is adhered to the substrate 20 through a second sealant layer 80, and the second sealant layer 80 is annularly disposed around the periphery of the second vent hole 21. As shown in fig. 1, the lower side of the signal processing chip 40 is bonded to the substrate 20 through the second sealant layer 80, and the second sealant layer 80 is in an annular closed structure and surrounds the second vent hole 21, so as to surround the second vent hole 21, thereby performing a sealing function, preventing pressure leakage from the second vent hole 21, and improving the detection sensitivity and precision of the differential pressure sensor. The second sealant layer 80 of the present embodiment can be made of silica gel in the prior art, and the signal processing chip 40 is bonded to the substrate 20 through silica gel, so that the assembly is simple and convenient.
The housing 10 of the embodiment includes a housing body 12 and a mounting portion 13, wherein one end of the housing body 12 is bonded to the substrate 20 through a conductive adhesive layer 90, and the other end of the housing body 12 is connected to the mounting portion 13; the mounting portion 13 is cylindrical, a first vent hole 11 is formed at one end of the mounting portion 13 away from the housing body 12, and the waterproof glue 60 is filled in the housing body 12 and extends into the mounting portion 13. As shown in fig. 1, the housing body 12 and the mounting portion 13 of the housing 10 are integrally formed, wherein the mounting portion 13 is connected to an upper portion of the housing body 12, the substrate 20 is connected to a lower portion of the housing body 12, and the mounting portion 13 is cylindrical, so that the mounting portion 13, the housing body 12 and the substrate 20 enclose an accommodating space 50. The housing 10 can protect the sensor chip 30 and the signal processing chip 40 accommodated in the accommodating space 50. The housing 10 of the present embodiment is a metal housing 10, and can be made of flavone, which has a good strength, and the surface can be plated with nickel or gold to prevent corrosion. The base plate 20 is the PCB board, and the lower extreme of shell body 12 bonds through conducting resin layer 90 with base plate 20 in the shell 10, when realizing shell 10 and the assembly of base plate 20 for shell 10 and PCB board switch on, play the effect of signal shielding, improve differential pressure sensor's detection sensitivity and precision.
In the case 10 of the present embodiment, the mounting portion 13 is disposed in a cylindrical shape, and can form an air inlet passage for communicating the first vent hole 11 with the accommodating space 50, and the waterproof adhesive 60 is filled in the case body 12 to cover the sensor chip 30 and the signal processing chip 40, so as to seal the sensor chip 30 and the signal processing chip 40 and perform a waterproof function. In order to improve the reliability of the waterproof effect, the waterproof glue 60 may extend upward into the mounting portion 13.
Further, a sealing groove 131 is formed on the outer periphery of the mounting portion 13, and the sealing groove 131 is annularly disposed and is recessed from the outside to the inside. As shown in fig. 1, a sealing groove 131 of a closed ring structure is formed on the outer periphery of the cylindrical mounting portion 13, and the sealing groove 131 is recessed from the outside to the inside for mounting an O-ring. The housing is sealingly connectable to the application terminal via the sealing groove 131, the O-ring. The purpose of installing the O-ring in the sealing groove 131 is to make the housing 10 be connected with an application terminal in a sealing manner, so as to prevent water from entering the differential pressure sensor under special circumstances, thereby achieving sealing and waterproof effects.
The sensor chip 30 is electrically connected to the signal processing chip 40 through a metal wire 101. The metal wire 101 may be an existing gold wire, aluminum wire, or copper wire, and the like, so as to transmit signals between the sensor chip 30 and the signal processing chip 40. Further, in order to improve reliability, corrosion resistance, and conductivity of signal transmission, the metal line 101 of the present embodiment is preferably a gold wire. It is understood that the signal processing chip 40 can be electrically connected to the substrate 20 through the metal wire 101, so as to facilitate signal transmission.
In this embodiment, the first vent hole 11, the second vent hole 21, and the third vent hole 41 are disposed opposite to the vibration chamber 31. As shown in fig. 1, the first vent hole 11 is located right above the sensor chip 30 and is opposite to the vibration cavity 31, so that the gas entering from the first vent hole 11 directly acts on the sensor chip 30, and the sensor chip 30 can directly sense the pressure at the upper sensing end. Meanwhile, the second vent hole 21 and the third vent hole 41 are located right below the sensor chip 30 and are arranged right opposite to the vibration cavity 31, so that gas entering from the second vent hole 21 can directly act on the sensor chip 30, the sensor can directly sense the pressure at the lower sensing end, the sensing effect of the sensor packaging structure 100 is improved, and the detection sensitivity and the detection precision of the differential pressure sensor are further improved.
The signal processing chip 40 is an asic (application Specific Integrated circuit) chip, and the sensor chip 30 is a MEMS chip. The ASIC chip provides external bias for the MEMS chip, and effective bias can keep stable acoustic and electric parameters of the MEMS chip in the whole operation temperature range and support the design of the MEMS chip with different sensitivities.
As shown in fig. 2, in the present embodiment, a plurality of pads 22 are disposed on a side of the substrate 20 away from the receiving space 50, and the plurality of pads 22 are arranged at intervals. As shown in fig. 1 and 2, the lower side of the substrate 20 is provided with a plurality of pads 22, and the plurality of pads 22 are arranged at intervals to facilitate signal connection between the substrate 20 and an external motherboard. Further, among the pads 22, at least one pad 22 is an annular pad 22a, and the rest of the pads 22 are rectangular pads 22b, the annular pad 22a is disposed around the periphery of the second ventilation hole 21, and the rectangular pads 22b are disposed near the edge of the substrate 20. As shown in fig. 2, the substrate 20 of this embodiment is a rectangular substrate 20, five bonding pads 22 are disposed on the lower side of the substrate 20, one of the bonding pads is an annular bonding pad 22a, and the remaining four bonding pads are rectangular bonding pads 22b, the annular bonding pad 22a is located at the geometric center of the rectangular substrate 20 and surrounds the second vent hole 21 in an annular closed structure, so as to surround the second vent hole 21, and perform a sealing function while performing signal connection with an external motherboard, thereby improving the detection sensitivity and precision of the differential pressure sensor. The other four rectangular pads 22b are respectively arranged at four corners of the substrate 20, and the structural design is reasonable. The annular pad 22a of the present embodiment can be formed by reflow soldering of solder paste, which is simple and convenient. The pad 22 has a thin thickness and can be embedded in the substrate 20, so that the lower surface of the pad 22 is flush with the bottom surface of the substrate 20, and the structure is compact.
The utility model discloses still provide a differential pressure sensor, including foretell sensor packaging structure 100. Since the differential pressure sensor adopts all technical solutions of all the embodiments, at least all the beneficial effects brought by the technical solutions of the embodiments are achieved, and no further description is given here.
The above only is the preferred embodiment of the present invention, not so limiting the patent scope of the present invention, all under the concept of the present invention, the equivalent structure transformation made by the contents of the specification and the drawings is utilized, or the direct/indirect application is included in other related technical fields in the patent protection scope of the present invention.
Claims (10)
1. A sensor package structure, comprising:
the shell is provided with a first vent hole;
the shell is arranged on the substrate and forms an accommodating space with the substrate in a surrounding mode, the substrate is provided with a second vent hole, and the first vent hole and the second vent hole are communicated with the accommodating space;
the sensor chip and the signal processing chip are accommodated in the accommodating space, the sensor chip and the signal processing chip are electrically connected and are arranged on the substrate in a stacked mode, and the sensor chip is located on one side, away from the substrate, of the signal processing chip; the sensor chip is provided with a vibration cavity, the signal processing chip is provided with a third vent hole, and the vibration cavity is communicated with the second vent hole through the third vent hole;
and the waterproof glue is filled in the accommodating space and covers the sensor chip and the signal processing chip.
2. The sensor package structure of claim 1, wherein the sensor chip is bonded to a side of the signal processing chip facing away from the substrate by a first sealant layer, and the first sealant layer is annularly disposed around the periphery of the third vent hole.
3. The sensor package structure of claim 2, wherein the signal processing chip is bonded to the substrate by a second sealant layer, and the second sealant layer is annularly disposed around the periphery of the second vent hole.
4. The sensor package structure of claim 1, wherein the housing comprises a housing body and a mounting portion, one end of the housing body is bonded to the substrate by a conductive adhesive layer, and the other end of the housing body is connected to the mounting portion; the installation department is the tube-shape, just the installation department is kept away from the one end of casing body forms first air vent, the waterproof glue fill in the casing body and to extend in the installation department.
5. The sensor package of claim 4, wherein the mounting portion defines a sealing groove at an outer periphery thereof, the sealing groove being annularly disposed and recessed from the outside to the inside.
6. The sensor package structure of any one of claims 1-5, wherein the sensor chip is electrically connected to the signal processing chip by a metal wire.
7. The sensor package of any one of claims 1-5, wherein the first vent, the second vent, and the third vent are disposed directly opposite the vibration cavity.
8. The sensor package structure of any one of claims 1-5, wherein a side of the substrate facing away from the receiving space is provided with a plurality of pads, and the pads are spaced apart.
9. The sensor package structure of claim 8, wherein at least one of the pads is an annular pad and the remaining pads are rectangular pads, the annular pad being disposed around the periphery of the second vent, the rectangular pads being disposed near an edge of the substrate.
10. A differential pressure sensor comprising a sensor package according to any of claims 1-9.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022828036.2U CN213688772U (en) | 2020-11-30 | 2020-11-30 | Sensor packaging structure and differential pressure sensor |
| PCT/CN2021/124544 WO2022111132A1 (en) | 2020-11-30 | 2021-10-19 | Sensor packaging structure, and differential pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022828036.2U CN213688772U (en) | 2020-11-30 | 2020-11-30 | Sensor packaging structure and differential pressure sensor |
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| CN213688772U true CN213688772U (en) | 2021-07-13 |
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| CN202022828036.2U Active CN213688772U (en) | 2020-11-30 | 2020-11-30 | Sensor packaging structure and differential pressure sensor |
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| CN (1) | CN213688772U (en) |
| WO (1) | WO2022111132A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113551707A (en) * | 2021-07-19 | 2021-10-26 | 歌尔微电子股份有限公司 | Combined sensor and electronic device |
| US20220026299A1 (en) * | 2019-04-09 | 2022-01-27 | Memsensing Microsystems (Suzhou, China) Co. Ltd. | Package structure for differential pressure sensor, and electronic device |
| CN114334885A (en) * | 2021-12-10 | 2022-04-12 | 苏州瞬通半导体科技有限公司 | Double-chip sensor packaging structure based on conductive adhesive, method and device thereof |
| WO2022111132A1 (en) * | 2020-11-30 | 2022-06-02 | 潍坊歌尔微电子有限公司 | Sensor packaging structure, and differential pressure sensor |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118431177A (en) * | 2024-07-04 | 2024-08-02 | 甬矽电子(宁波)股份有限公司 | Semiconductor packaging structure and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3154267B2 (en) * | 1994-05-19 | 2001-04-09 | 日立建機株式会社 | Differential pressure sensor |
| CN205754730U (en) * | 2016-05-17 | 2016-11-30 | 歌尔股份有限公司 | A kind of encapsulating structure of mike |
| CN208847393U (en) * | 2018-07-31 | 2019-05-10 | 苏州纳芯微电子股份有限公司 | A kind of encapsulating structure of pressure sensor |
| CN208704948U (en) * | 2018-09-19 | 2019-04-05 | 青岛歌尔微电子研究院有限公司 | A kind of differential pressure pick-up of integrated temperature compensation |
| CN111362227A (en) * | 2018-12-25 | 2020-07-03 | 无锡华润矽科微电子有限公司 | MEMS sensor packaging structure |
| CN209400128U (en) * | 2018-12-25 | 2019-09-17 | 歌尔科技有限公司 | Waterproof differential pressure pickup |
| CN210953183U (en) * | 2019-10-28 | 2020-07-07 | 歌尔微电子有限公司 | Waterproof pressure sensor |
| CN213688772U (en) * | 2020-11-30 | 2021-07-13 | 潍坊歌尔微电子有限公司 | Sensor packaging structure and differential pressure sensor |
-
2020
- 2020-11-30 CN CN202022828036.2U patent/CN213688772U/en active Active
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2021
- 2021-10-19 WO PCT/CN2021/124544 patent/WO2022111132A1/en active Application Filing
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20220026299A1 (en) * | 2019-04-09 | 2022-01-27 | Memsensing Microsystems (Suzhou, China) Co. Ltd. | Package structure for differential pressure sensor, and electronic device |
| US12092540B2 (en) * | 2019-04-09 | 2024-09-17 | Memsensing Microsystems (Suzhou, China) Co. Ltd. | Package structure for differential pressure sensor, and electronic device |
| WO2022111132A1 (en) * | 2020-11-30 | 2022-06-02 | 潍坊歌尔微电子有限公司 | Sensor packaging structure, and differential pressure sensor |
| CN113551707A (en) * | 2021-07-19 | 2021-10-26 | 歌尔微电子股份有限公司 | Combined sensor and electronic device |
| CN114334885A (en) * | 2021-12-10 | 2022-04-12 | 苏州瞬通半导体科技有限公司 | Double-chip sensor packaging structure based on conductive adhesive, method and device thereof |
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| WO2022111132A1 (en) | 2022-06-02 |
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