CN112954559B

CN112954559B - Microphone structure and electronic equipment

Info

Publication number: CN112954559B
Application number: CN202110227010.9A
Authority: CN
Inventors: 刘诗婧; 张瑞霞
Original assignee: Weifang Goertek Microelectronics Co Ltd
Current assignee: Weifang Goertek Microelectronics Co Ltd
Priority date: 2021-03-01
Filing date: 2021-03-01
Publication date: 2022-09-20
Anticipated expiration: 2041-03-01
Also published as: CN112954559A

Abstract

The invention discloses a microphone structure and electronic equipment, wherein the microphone structure comprises a substrate, a shell and a sensing assembly, the shell is connected with the substrate and encloses to form a cavity, the shell is provided with a sound hole communicated with the cavity, one end of the shell, which is adjacent to the substrate, is provided with a first bonding pad, and the first bonding pad is electrically connected with the substrate; the sensing assembly is arranged in the containing cavity and connected with the shell, corresponds to the sound hole and is electrically connected with the first bonding pad through a first lead. The invention aims to provide a microphone structure capable of effectively reducing the thickness of the side wall of a shell, which is simple in structure, improves the anti-electromagnetic interference performance and effectively reduces the size of the microphone structure.

Description

Microphone structure and electronic equipment

Technical Field

The present invention relates to the field of microphone technologies, and in particular, to a microphone structure and an electronic device using the same.

Background

The MEMS (Micro-Electro-Mechanical System) technology is a high and new technology developed at a high speed in recent years, and it adopts an advanced semiconductor manufacturing process to implement the batch manufacturing of devices such as sensors and drivers, and compared with the corresponding conventional devices, the MEMS device has very obvious advantages in terms of volume, power consumption, weight and price. The microphone structure is also called MEMS microphone, which is a microphone manufactured based on MEMS technology. The microphone structure can convert sound pressure change into capacitance change, and then the ASIC chip converts the capacitance change into an electric signal, so that the sound-electricity conversion is realized.

In the related art, the Top type MEMS microphone is convenient for the structural design and assembly of the customer, but generally has low performance, and in order to achieve the high performance of the Top type MEMS microphone, the MEMS microphone is designed in an inverted manner. However, the MEMS microphone with the flip structure has the problems that the anti-electromagnetic interference performance is poor, and the side wall of the housing is thick, so that the size of the MEMS microphone is difficult to be reduced.

Disclosure of Invention

The invention mainly aims to provide a microphone structure and electronic equipment, and aims to provide a microphone structure capable of effectively reducing the thickness of the side wall of a shell.

In order to achieve the above object, the present invention provides a microphone structure, including:

a substrate;

the shell is connected with the substrate and encloses to form a cavity, the shell is provided with a sound hole communicated with the cavity, one end of the shell, which is adjacent to the substrate, is provided with a first bonding pad, and the first bonding pad is electrically connected with the substrate; and

the sensing assembly is arranged in the accommodating cavity and connected with the shell, corresponds to the sound hole and is electrically connected with the first bonding pad through a first lead.

In one embodiment, the housing comprises:

the top plate is provided with the sound hole, the top plate is arranged opposite to the substrate, and the sensing assembly is arranged on one side of the top plate facing the substrate; and

the side plate is arranged on the periphery of the top plate and surrounds the sensing assembly, one end, far away from the top plate, of the side plate is connected with the base plate, and the first bonding pad is arranged on the side plate, close to the base plate.

In an embodiment, a step surface is formed on one side, facing the accommodating cavity, of the side plate, the step surface is arranged adjacent to the substrate, and the first pad is arranged on the step surface.

In an embodiment, a second bonding pad is arranged on one side of the side plate facing the substrate, the first bonding pad is connected with the second bonding pad, a third bonding pad is arranged on the substrate corresponding to the second bonding pad, and the second bonding pad is connected with the third bonding pad through a conductive layer.

In one embodiment, a solder mask layer is arranged at the connection position of the first pad and the second pad.

In one embodiment, the first pad and the second pad are of an integrally molded structure;

and/or the conducting layer is solder paste or conducting adhesive;

and/or the top plate and the side plate are of an integrally formed structure;

and/or the substrate is a circuit board.

In one embodiment, the sensing assembly comprises:

the MEMS chip is connected with the shell and is arranged corresponding to the sound hole; and

the ASIC chip is arranged on the shell and is arranged at intervals with the MEMS chip, the ASIC chip is electrically connected with the MEMS chip through a second lead, and the ASIC chip is electrically connected with the first bonding pad through the first lead.

In one embodiment, a supporting block is further disposed on a side of the housing facing the substrate, and the ASIC chip is disposed on the supporting block.

In an embodiment, the MEMS chip includes a back plate and a diaphragm, the back plate surrounds the sound hole, and the diaphragm is disposed at an end of the back plate away from the housing and opposite to the sound hole.

The invention also provides electronic equipment which comprises an equipment shell and the microphone structure, wherein the microphone structure is arranged in the equipment shell.

According to the microphone structure, the sensing assembly is arranged in the cavity formed by the shell and the substrate, the first bonding pad is arranged at one end, close to the substrate, of the shell, the first bonding pad is electrically connected with the substrate, so that the sensing assembly is conveniently and electrically connected with the first bonding pad through the first lead wire, and the electrical connection with the substrate is realized. The microphone structure provided by the invention has the advantages that the structure is simple, the thickness of the side wall of the shell is effectively reduced, the anti-electromagnetic interference performance is improved, and the size of the microphone structure is effectively reduced.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a microphone structure according to an embodiment of the invention;

fig. 2 is a schematic structural diagram of a microphone structure according to another embodiment of the invention;

fig. 3 is a schematic structural diagram of a microphone structure according to another embodiment of the invention.

The reference numbers indicate:

reference numerals	Name (R)	Reference numerals	Name (R)
				100	Microphone structure	224	Solder mask
1	Substrate	3	Containing chamber
				11	Third bonding pad	4	Sensing assembly
2	Outer casing	41	MEMS chip
				21	Top board	411	Back electrode plate
211	Sound hole	412	Vibrating diaphragm
				212	Supporting block	42	ASIC chip
22	Side plate	5	A first lead wire
				221	First bonding pad	6	Second lead wire
222	Step surface	7	Conductive layer
				223	Second bonding pad

The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.

Also, the expression "and/or" and/or "as used throughout is meant to encompass three alternatives, exemplified by" A and/or B "including alternative A, alternative B, or both alternative A and alternative B.

In addition, the descriptions related to "first", "second", etc. in the present invention are only for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.

The MEMS (Micro-Electro-Mechanical System) technology is a high and new technology developed at a high speed in recent years, and it adopts an advanced semiconductor manufacturing process to implement the batch manufacturing of devices such as sensors and drivers, and compared with the corresponding conventional devices, the MEMS device has very obvious advantages in terms of volume, power consumption, weight and price. The microphone structure is also called MEMS microphone, which is a microphone manufactured based on MEMS technology. The microphone structure can convert sound pressure change into capacitance change, and then the capacitance change is reduced by the ASIC chip to be converted into an electric signal, so that the sound-electricity conversion is realized.

In the related art, the Top type MEMS microphone is convenient for the structural design and assembly of the customer, but generally has low performance, and in order to achieve the high performance of the Top type MEMS microphone, the MEMS microphone is designed in an inverted manner. Because the chip and the circuit surface of pasting in the MEMS microphone of flip-chip structure are not in one side, need make a plurality of long via holes on the lateral wall to fill conducting resin and realize the circuit connection of chip and circuit surface of pasting, make the lateral wall greatly to use PCB PP material to process and form. Therefore, circuit I/O signals are transmitted through the long through holes, and no shielding layer is arranged on the periphery of the through holes, so that the anti-electromagnetic interference performance of the MEMS microphone is poor, and meanwhile, due to the existence of the long through holes, the side wall is thick, the size of the MEMS microphone is difficult to be reduced, and the like.

Based on the above-mentioned concepts and problems, the present invention proposes a microphone structure 100. It will be appreciated that the microphone structure 100 applies to electronic devices. The electronic device may be a sound-producing electronic product such as a sound box, a mobile phone, a tablet computer, an earphone, and the like, which is not limited herein.

Referring to fig. 1 to fig. 3, in an embodiment of the present invention, the microphone structure 100 includes a substrate 1, a housing 2, and a sensing component 4, where the housing 2 is connected to the substrate 1 and encloses to form a cavity 3, the housing 2 is provided with a sound hole 211 communicated with the cavity 3, one end of the housing 2 adjacent to the substrate 1 is provided with a first pad 221, and the first pad 221 is electrically connected to the substrate 1; the sensing component 4 is arranged in the accommodating cavity 3 and connected with the shell 2, and the sensing component 4 is arranged corresponding to the sound hole 211 and electrically connected with the first bonding pad 221 through a first lead 5.

In the embodiment, the cavity 3 formed by enclosing the substrate 1 and the housing 2 can provide a shielding space for the sensing component 4, so that external elements and signals are effectively prevented from influencing the sensing component. The shell 2 is provided with the sound hole 211 communicated with the accommodating cavity 3, so that external sound can enter through the sound hole 211 and can be processed and amplified by acting on the sensing component 4, acoustic signals can be converted into electric signals, and then the sound receiving function is realized.

In other embodiments, the sound hole 211 may also be disposed on the substrate 1, that is, the sound hole 211 is disposed through the substrate 1 to communicate with the cavity 3. Optionally, the sound hole 211 is a through hole such that external sound air flows through the sound hole 211 into the cavity 3.

In this embodiment, the housing 2 has a concave configuration, the substrate 1 is a flat plate, and the housing 2 is fastened to the substrate 1 to form the cavity 3. In another embodiment, the substrate 1 has a concave configuration, the housing 2 is a cover plate, and the housing 2 covers the substrate 1 to form the cavity 3.

In the present embodiment, the substrate 1 may be selected as a circuit board. The substrate 1 is a PCB board, lines are printed on the PCB board, corresponding electrical functions are achieved, and the PCB board can be selectively designed according to actual needs. It is understood that the PCB board has a multi-layer structure, for example, including a substrate layer, one or more copper foil layers and one or more solder resist ink layers, which is selected according to the actual application.

It can be understood that the longitudinal section of the housing 2 is in a U-shaped configuration, the housing 2 can be an integrally formed metal housing (the metal material can be selected from stainless steel material, aluminum alloy material, copper alloy material, iron alloy material, etc.) or a non-metal housing coated with metal material, and the one end of the housing 2 in the opening direction and the substrate 1 enclose a closed cavity 3.

In this embodiment, the shell 2 and the substrate 1 can be connected through conductive adhesive or solder paste, so that the shell 2 and the substrate 1 can be electrically connected, a conductive shielding cavity is formed, the sensing component 4 is arranged in the accommodating cavity 3, external electromagnetic interference can be prevented, the protection effect on the shell and the substrate can be enhanced, and the conversion performance of the sensing component 4 can be ensured. Of course, the housing 2 and the substrate 1 may be connected by other conductive materials, and is not limited herein.

Alternatively, the shape of the structure formed by enclosing the housing 2 and the substrate 1 may be a cube, a cylinder, a sphere, or the like, and is not limited herein.

In order to fix the substrate 1 to the product or system to which it is applied and to transmit electrical signals, in an embodiment the surface of the substrate 1 facing away from the housing 2 is provided with pads. It will be appreciated that the pads may be solder joints or fillets that may facilitate soldering to the motherboard circuitry of a particular product by SMT or the like. Optionally, there may be 3 or 4 pads to improve the stability of the structural connection and data transfer.

In the present embodiment, in order to transmit signals of the sensing element 4 to the substrate 1 and to an external product or system through the substrate 1, as shown in fig. 1 to 3, one end of the housing 2 adjacent to the substrate 1 is provided with a first pad 221, the first pad 221 is electrically connected to the substrate 1, and the sensing element 4 is electrically connected to the first pad 221 through a first lead 5.

It can be understood that, by disposing the first bonding pad 221 outside the housing 2, a structure in which a via hole is formed in the sidewall of the housing 2 is effectively avoided, so that the sidewall thickness of the housing 2 is effectively reduced, and the anti-electromagnetic interference performance of the microphone structure 100 is also improved. Optionally, the first lead 5 may be a gold wire or a copper wire, which effectively improves the stability of the electrical connection.

According to the microphone structure 100, the sensing component 4 is arranged in the cavity 3 formed by the shell 2 and the substrate 1, and the first bonding pad 221 is arranged at one end, close to the substrate 1, of the shell 2, so that the first bonding pad 221 is electrically connected with the substrate 1, the sensing component 4 is conveniently and electrically connected with the first bonding pad 221 through the first lead 5, and the electrical connection with the substrate 1 is realized. The microphone structure 100 provided by the invention has the advantages that the structure is simple, the thickness of the side wall of the shell 2 is effectively reduced, the anti-electromagnetic interference performance is improved, and the size of the microphone structure 100 is effectively reduced.

In one embodiment, as shown in fig. 1 to 3, the housing 2 includes a top plate 21 and a side plate 22, wherein the top plate 21 is provided with the sound hole 211, the top plate 21 is disposed opposite to the substrate 1, and the sensing assembly 4 is disposed on a side of the top plate 21 facing the substrate 1; the side plate 22 is disposed on the periphery of the top plate 21 and surrounds the sensing assembly 4, one end of the side plate 22, which is far away from the top plate 21, is connected to the substrate 1, and the first bonding pad 221 is disposed on the side plate 22, which is close to the substrate 1.

In this embodiment, the top plate 21 and the side plate 22 of the housing 2 form a concave structure, so that the top plate 21 and the substrate 1 are disposed oppositely and in parallel, and the side plate 22 is located between the top plate 21 and the substrate 1 and surrounds the top plate 21 and the substrate 1 to form the cavity 3.

It is understood that when the housing 2 is a metal housing, the top plate 21 and the side plate 22 can be made of stainless steel, aluminum alloy, copper alloy, iron alloy, or the like, or can be made of non-metal plate coated with metal. The sensing component 4 can be wrapped in the cavity 3 by the shell 2, so that the short plate which effectively supplements the electromagnetic shielding capability of the substrate 1 in the related art is arranged, and the electromagnetic shielding capability of the microphone structure 100 can be improved. Optionally, the top plate 21 and the side plate 22 are of an integrally formed structure.

In this embodiment, the first pad 221 is disposed on a side of the side plate 22 facing the cavity 3 and is adjacent to the substrate 1. Of course, in other embodiments, the first bonding pad 221 may also be disposed at an end portion of the side plate 22 facing the substrate 1, at this time, a groove structure is formed at a connection portion of the side plate 22 and the substrate 1, and a notch of the groove structure faces the inside of the cavity 3 and is communicated with the cavity 3, so that the first lead 5 and the first bonding pad 221 are conveniently and stably connected.

In an embodiment, as shown in fig. 2, a step surface 222 is formed on a side of the side plate 22 facing the receiving cavity 3, the step surface 222 is disposed adjacent to the substrate 1, and the first pad 221 is disposed on the step surface 222.

In this embodiment, the step surface 222 is formed on one side of the side plate 22 facing the receiving cavity 3 and is disposed adjacent to the substrate 1, and the first pad 221 is disposed on the step surface 222, so that the first lead 5 and the first pad 221 can be conveniently and stably connected, the first pad 221 and the substrate 1 can be conveniently and electrically connected, and the thickness of the side plate 22 can be reduced.

In an embodiment, as shown in fig. 1 to 3, a second pad 223 is disposed on a side of the side plate 22 facing the substrate 1, the first pad 221 is connected to the second pad 223, a third pad 11 is disposed on the substrate 1 corresponding to the second pad 223, and the second pad 223 is connected to the third pad 11 through a conductive layer 7.

It can be understood that the second bonding pad 223 and the third bonding pad 11 are arranged, so that the side plate 22 of the housing 2 can be stably connected with the substrate 1 through the second bonding pad 223 and the third bonding pad 11, and the sealing performance of the cavity 3 is improved.

In this embodiment, the first pad 221 and the second pad 223 are integrally formed, so that the structural configuration of the housing 2 is simplified, and the first pad 221 is conveniently electrically connected to the substrate 1 through the second pad 223, the conductive layer 7 and the third pad 11. Of course, in other embodiments, the first pad 221 and the second pad 223 may also be disposed in a separate structure, and the first pad 221 may be electrically connected to the second pad 223 by using a conductive adhesive or a metal wire.

Optionally, the conductive layer 7 is formed by solder paste or conductive adhesive.

In one embodiment, as shown in fig. 1 to 3, a solder resist layer 224 is disposed at a connection between the first pad 221 and the second pad 223. It can be understood that, by providing the solder resist layer 224, when the second pad 223 and the third pad 11 are soldered, the first pad 221 and the first lead 5 are protected, and the conductive layer 7 is prevented from overflowing, so that the first pad 221 and the first lead 5 are prevented from being connected and shorted.

It can be understood that the solder mask layer 224 can be a multilayer structure, so that the stacked multilayer solder mask layer can be directly completed through one process, the assembly of other structures is not required to be increased, and the production efficiency is effectively improved. Alternatively, the solder resist layer 224 may be an ink layer.

In one embodiment, as shown in fig. 1 to 3, the sensing component 4 includes a MEMS chip 41 and an ASIC chip 42, wherein the MEMS is connected to the housing 2 and disposed corresponding to the sound hole 211; the ASIC chip 42 is disposed on the housing 2 and spaced apart from the MEMS chip 41, the ASIC chip 42 is electrically connected to the MEMS chip 41 through the second lead 6, and the ASIC chip 42 is electrically connected to the first pad 221 through the first lead 5.

In the present embodiment, the MEMS chip 41 is electrically connected to the ASIC chip 42 through the second lead 6, and the ASIC chip 42 is electrically connected to the substrate 1 through the first lead 5, the first pad 221, the second pad 223, the conductive layer 7 and the third pad 11. The MEMS chip 41 is disposed to cover the sound hole 211.

As can be understood, the MEMS chip 41 is used for sensing and detecting the sound signal flowing from the sound hole 211, and can convert the sound signal into an electrical signal for transmission, and transmit the electrical signal to the ASIC chip 42; the ASIC chip 42 is used for providing a voltage to the MEMS chip 41, and processing and amplifying a signal output by the MEMS chip 41, so that the microphone module 100 provides a sound receiving function for the electronic device.

In an embodiment, as shown in fig. 1 to fig. 3, the MEMS chip 41 includes a back plate 411 and a diaphragm 412, the back plate 411 is disposed around the sound hole 211, and the diaphragm 412 is disposed at an end of the back plate 411 away from the housing 2 and opposite to the sound hole 211.

In this embodiment, the back plate 411 of the MEMS chip 41 is generally made of monocrystalline silicon, polycrystalline silicon, or silicon nitride, the external shape of the back plate 411 is substantially square, the back plate 411 is disposed around the periphery of the acoustic hole 211 to form an acoustic cavity of the microphone module 100, so as to ensure the smoothness of sound transmission. The diaphragm 412 may be a piezoelectric structure or a capacitive structure, and is not limited herein. For example, when the diaphragm 412 is a piezoelectric structure, it includes the diaphragm 412 and piezoelectric materials disposed on two sides of the diaphragm 412, and the diaphragm 412 is excited by a sound signal to vibrate the diaphragm 412, so that the pressure of the piezoelectric materials changes, and a corresponding electrical signal is output.

It is understood that the back plate 411 of the MEMS chip 41 may be attached to the top plate 21 of the housing 2 by a glue layer, and the ASIC chip 42 may be attached to the top plate 21 of the housing 2 by a glue layer. The MEMS chip 41 is electrically connected to the ASIC chip 42, and is electrically connected to the ASIC chip 42 through the diaphragm 412, that is, the diaphragm 412 is electrically connected to the ASIC chip 42 through the second lead 6. Optionally, the second lead 6 may be a gold wire or a copper wire, which effectively improves the stability of the electrical connection.

In one embodiment, as shown in fig. 3, a supporting block 212 is further disposed on a side of the housing 2 facing the substrate 1, and the ASIC chip 42 is disposed on the supporting block 212.

It can be understood that by providing the supporting block 212 on the side of the top plate 21 of the housing 2 facing the substrate 1 and providing the ASIC chip 42 on the side of the supporting block 212 facing away from the top plate 21, the height difference between the ASIC chip 42 and the first bonding pad 221 is reduced, and the material of the first lead 5 is saved.

The microphone structure 100 of the present invention can reduce the size of flip-chip packaged products, so that the area or height of the microphone structure 100 is smaller, the application limit caused by the product size is reduced, and the application range is expanded. The design of arranging the via hole on the side plate 22 of the shell 2 is eliminated, and the first bonding pad 221, the second bonding pad 223 and the conducting layer 7 are arranged on the lower surface of the side plate 22 in a metal bonding mode, so that the I/O signals are transmitted to the substrate 1 through the first bonding pad 221 on the lower surface of the side plate 22 and the conducting layer 7. By providing the step-like step surface 222 on the lower surface of the side plate 22, the first land 221 is bonded via the step surface 222. In consideration of the height difference of the ASIC chip 42 to the first pads 221, a supporting block 212 may be mounted between the ASIC chip 42 and the top plate 21, reducing the height difference of the ASIC chip 42 to the first pads 221.

The invention further provides an electronic device, which includes a device housing and the microphone structure 100, where the microphone structure 100 is disposed in the device housing. The specific structure of the microphone module 100 refers to the above embodiments, and since the microphone module 100 of the electronic device adopts all the technical solutions of all the above embodiments, at least all the beneficial effects brought by the technical solutions of the above embodiments are achieved, and no further description is given here.

In this embodiment, the electronic device may be a wearable electronic device, such as a smart watch or a bracelet, or may be a mobile terminal, such as a mobile phone or a notebook computer, or other devices that need to have an audio-electrical conversion function, which is not limited herein.

The above description is only an alternative embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, which are within the spirit of the present invention, are included in the scope of the present invention.

Claims

1. A microphone structure, characterized in that the microphone structure comprises:

a substrate;

the shell comprises a top plate and a side plate, the top plate and the base plate are arranged oppositely, the side plate is arranged on the periphery of the top plate, one end, far away from the top plate, of the side plate is connected with the base plate, so that the top plate, the side plate and the base plate are enclosed to form a containing cavity, a first bonding pad is arranged on the side, close to the base plate, of the side plate, the first bonding pad is arranged on one side, facing the containing cavity, of the side plate and is arranged close to the base plate, a second bonding pad is further arranged on one side, facing the base plate, of the side plate, the first bonding pad is connected with the second bonding pad, a third bonding pad is arranged on the base plate, corresponding to the second bonding pad, the second bonding pad is connected with the third bonding pad through a conducting layer, so that the first bonding pad is electrically connected with the base plate, and the top plate is provided with a sound hole communicated with the containing cavity; and

the sensing assembly is arranged on one side, facing the substrate, of the top plate and located in the containing cavity, corresponds to the sound hole and is electrically connected with the first bonding pad through a first lead, so that the sensing assembly is electrically connected with the substrate through the first lead, the first bonding pad, the second bonding pad, the conducting layer and the third bonding pad.

2. The microphone structure of claim 1 wherein a stepped surface is formed on a side of the side plate facing the receiving cavity, the stepped surface being disposed adjacent to the substrate, and the first pad being disposed on the stepped surface.

3. The microphone structure of claim 1 wherein a junction of the first pad and the second pad is provided with a solder resist layer.

4. The microphone structure of claim 1 wherein the first pad and the second pad are an integrally molded structure;

and/or the conducting layer is solder paste or conducting adhesive;

and/or the top plate and the side plate are of an integrally formed structure;

and/or the substrate is a circuit board.

5. The microphone structure of any one of claims 1 to 4 wherein the sensing assembly comprises:

6. The microphone structure of claim 5 wherein the side of the housing facing the substrate is further provided with a support block, and the ASIC chip is provided on the support block.

7. The microphone structure of claim 5 wherein the MEMS chip comprises a back plate and a diaphragm, the back plate is disposed around the sound hole, and the diaphragm is disposed at an end of the back plate away from the housing and opposite to the sound hole.

8. An electronic device comprising a device housing and a microphone structure as claimed in any one of claims 1 to 7, the microphone structure being provided within the device housing.