CN213455953U - Sensor packaging structure and differential pressure sensor - Google Patents
Sensor packaging structure and differential pressure sensor Download PDFInfo
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- CN213455953U CN213455953U CN202022827883.7U CN202022827883U CN213455953U CN 213455953 U CN213455953 U CN 213455953U CN 202022827883 U CN202022827883 U CN 202022827883U CN 213455953 U CN213455953 U CN 213455953U
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Abstract
The utility model discloses a sensor packaging structure and differential pressure sensor, wherein sensor packaging structure includes: the shell is provided with a first vent hole; the shell is arranged on the substrate and forms an accommodating space with the substrate in a surrounding way, the substrate is provided with a second vent hole, and the first vent hole and the second vent hole are both communicated with the accommodating space; the sensor chip and the signal processing chip are accommodated in the accommodating space, the sensor chip and the signal processing chip are electrically connected and are arranged on the substrate in a stacked mode, and the sensor chip is located on one side, away from the substrate, of the signal processing chip; the sensor chip is provided with a vibration cavity, the signal processing chip is provided with a third vent hole, and the vibration cavity is communicated with the second vent hole through the third vent hole. The sensor packaging structure enables the differential pressure sensor to integrate a temperature linear compensation function, and is convenient to apply. In addition, the sensor chip and the signal processing chip are designed in a laminated mode, so that the occupied size is saved, the packaging size is reduced, the structure is more compact and small, and the miniaturized design of a product is facilitated.
Description
Technical Field
The utility model relates to a sensor technical field, in particular to sensor packaging structure and differential pressure sensor.
Background
At present, in the first-level packaging market, a Transistor Outline (TO) type package is mostly adopted in a differential pressure sensor packaging structure, the packaging process is complex, the product volume is large, only one gage pressure Micro Electro Mechanical System (MEMS) is arranged in a packaging body, and the temperature linear compensation function is omitted. For the differential pressure sensor which needs to perform the temperature compensation function, the differential pressure sensor which is packaged in the first stage is usually required to be matched with an Application Specific Integrated Circuit (ASIC) chip and then packaged in the second stage to realize the temperature linear compensation, so the application is inconvenient. In addition, the existing differential pressure sensor occupies a larger volume due to the limitation of an encapsulation structure, and is not beneficial to the miniaturization design of products.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a sensor packaging structure and differential pressure sensor aims at solving current differential pressure sensor and uses inconvenient and be unfavorable for the technical problem of the miniaturized design of product.
In order to achieve the above object, the utility model provides a sensor packaging structure, include:
the shell is provided with a first vent hole;
the shell is arranged on the substrate and forms an accommodating space with the substrate in a surrounding mode, the substrate is provided with a second vent hole, and the first vent hole and the second vent hole are communicated with the accommodating space;
the sensor chip and the signal processing chip are accommodated in the accommodating space, the sensor chip and the signal processing chip are electrically connected and are arranged on the substrate in a stacked mode, and the sensor chip is located on one side, away from the substrate, of the signal processing chip; the sensor chip is provided with a vibration cavity, the signal processing chip is provided with a third vent hole, and the vibration cavity is communicated with the second vent hole through the third vent hole.
Preferably, the sensor chip is bonded to one side of the signal processing chip, which is deviated from the substrate, through a first sealing adhesive layer, and the first sealing adhesive layer is annularly surrounded on the periphery of the third vent hole.
Preferably, the signal processing chip is bonded to the substrate through a second sealant layer, and the second sealant layer is annularly surrounded on the periphery of the second vent hole.
Preferably, the shell includes horizontal board and vertical board, the horizontal board has seted up first air vent, the one end of vertical board with the end connection of horizontal board, the other end of vertical board with the base plate passes through conductive adhesive layer and bonds.
Preferably, the sensor chip is electrically connected to the signal processing chip through a metal wire.
Preferably, the first vent hole, the second vent hole and the third vent hole are arranged opposite to the vibration cavity.
Preferably, the signal processing chip is an ASIC chip, and the sensor chip is a MEMS chip.
Preferably, a plurality of pads are arranged on one side of the substrate, which is away from the accommodating space, and the pads are arranged at intervals.
Preferably, among the plurality of bonding pads, at least one bonding pad is an annular bonding pad, and the rest bonding pads are rectangular bonding pads, the annular bonding pad is surrounded on the periphery of the second vent hole, and the rectangular bonding pad is arranged close to the edge of the substrate.
The utility model discloses still provide a differential pressure sensor, include as above sensor packaging structure.
The utility model discloses sensor packaging structure is when using, the sensitive membrane of sensor chip produces deformation according to the pressure differential that first air vent and second air vent formed, thereby lead to the resistance value on the sensitive membrane to change, and will show pressure differential's physical quantity according to deformation and convert pressure signal to, and transmit to the signal processing chip, carry out signal processing to pressure signal by the signal processing chip, and carry out temperature compensation to pressure signal according to the temperature coefficient of prestore, final output compensation pressure signal, realize the linear compensation function of temperature, make the pressure differential sensor integration have the linear compensation function of temperature, and convenient for use. Additionally, the utility model discloses a sensor chip and signal processing chip adopt the design of lamination formula, and sensor chip and the range upon range of setting of signal processing chip, and the sensor chip and the signal processing chip of range upon range of setting have then saved and have taken the volume, reduce the encapsulation size, and the structure is more compact, small and exquisite, does benefit to the miniaturized design of product.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic cross-sectional view of a sensor package structure according to an embodiment of the present invention;
fig. 2 is a schematic partial top view of a sensor package structure according to an embodiment of the present invention;
fig. 3 is a schematic bottom view of a sensor package structure according to an embodiment of the present invention.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 100 | |
30 | |
| 10 | |
31 | |
| 11 | The |
40 | |
| 12 | |
41 | |
| 13 | |
50 | Accommodating |
| 20 | |
60 | |
| 21 | |
70 | |
| 22 | |
80 | Conductive |
| 22a | |
90 | |
| 22b | Rectangular bonding pad |
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit ly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
The utility model provides a sensor packaging structure.
As shown in fig. 1 and fig. 2, the sensor package structure 100 of the present embodiment includes a housing 10, a substrate 20, a sensor chip 30 and a signal processing chip 40, wherein the housing 10 is provided with a first vent hole 11, the housing 10 is disposed on the substrate 20 and encloses an accommodating space 50 with the substrate 20, the substrate 20 is provided with a second vent hole 21, and both the first vent hole 11 and the second vent hole 21 are communicated with the accommodating space 50; the sensor chip 30 and the signal processing chip 40 are accommodated in the accommodating space 50, the sensor chip 30 and the signal processing chip 40 are electrically connected and are arranged on the substrate 20 in a stacked manner, and the sensor chip 30 is positioned on one side of the signal processing chip 40, which is far away from the substrate 20; the sensor chip 30 has a vibration cavity 31, the signal processing chip 40 has a third vent hole 41, and the vibration cavity 31 is communicated with the second vent hole 21 through the third vent hole 41.
Specifically, as shown in fig. 1 and 2, the housing 10 is disposed over the substrate 20 and encloses an accommodating space 50 with the substrate 20, so as to accommodate the sensor chip 30 and the signal processing chip 40 therein, and the structure is compact. In addition, the sensor chip 30 and the signal processing chip 40 of the embodiment adopt a laminated design, the sensor chip 30 and the signal processing chip 40 are arranged in an up-down stacked manner, and the sensor chip 30 and the signal processing chip 40 arranged in a stacked manner save occupied volume, reduce packaging size, have a more compact and small structure, and are beneficial to the miniaturization design of products.
In addition, the housing 10 of the present embodiment is provided with a first vent hole 11, the first vent hole 11 is located above the sensor chip 30, the first vent hole 11 can be used as an upper sensing end of the sensor chip 30 for performing top air pressure detection, the substrate 20 is provided with a second vent hole 21, the second vent hole 21 is located below the sensor chip 30, and the second vent hole 21 can be used as a lower sensing end of the sensor chip 30 for performing bottom air pressure detection. In order to realize the air intake of the second vent hole 21 into the vibration cavity 31 of the sensor chip 30, the signal processing chip 40 is opened with a third vent hole 41 to communicate the second vent hole 21 with the vibration cavity 31.
When the sensor package structure 100 of this embodiment is used, the sensing film of the sensor chip 30 deforms according to the pressure difference formed between the upper sensing end and the lower sensing end, so that the resistance value on the sensing film changes, and the physical quantity representing the pressure difference is converted into a pressure signal according to the deformation and transmitted to the signal processing chip 40, the signal processing chip 40 performs signal processing on the pressure signal, performs temperature compensation on the pressure signal according to a pre-stored temperature coefficient, and finally outputs a compensated pressure signal, so as to implement a temperature linear compensation function, so that the pressure difference sensor is integrated with a temperature linear compensation function, and the application is convenient.
In this embodiment, the sensor chip 30 is adhered to the signal processing chip 40 through the first sealant layer 60 on a side away from the substrate 20, and the first sealant layer 60 is annularly surrounded on the periphery of the third vent hole 41. As shown in fig. 1, the bottom of the sensor chip 30 is bonded to the upper side of the signal processing chip 40 through the first sealant layer 60, and the first sealant layer 60 is in an annular closed structure and surrounds the third vent hole 41, so as to surround the third vent hole 41, thereby performing a sealing function, preventing the pressure leakage from the third vent hole 41, and improving the detection sensitivity and precision of the differential pressure sensor. The first sealant layer 60 of the present embodiment can be made of silica gel in the prior art, and the sensor chip 30 is bonded to the signal processing chip 40 through silica gel, so that the assembly is convenient and simple.
Further, the signal processing chip 40 is adhered to the substrate 20 through a second sealant layer 70, and the second sealant layer 70 is annularly disposed around the periphery of the second vent hole 21. As shown in fig. 1, the lower side of the signal processing chip 40 is bonded to the substrate 20 through the second sealant layer 70, and the second sealant layer 70 is in an annular closed structure and surrounds the second vent hole 21, so as to surround the second vent hole 21, thereby performing a sealing function, preventing pressure leakage from the second vent hole 21, and improving the detection sensitivity and precision of the differential pressure sensor. The second sealant layer 70 of the present embodiment can be made of silicone in the prior art, and the signal processing chip 40 is bonded to the substrate 20 through silicone, so that the assembly is simple and convenient.
The housing 10 of this embodiment includes a transverse plate 12 and a vertical plate 13, the transverse plate 12 has a first vent hole 11, one end of the vertical plate 13 is connected to an end of the transverse plate 12, and the other end of the vertical plate 13 is bonded to the substrate 20 through a conductive adhesive layer 80. As shown in fig. 1, the transverse plate 12 and the vertical plate 13 of the housing 10 are integrally formed, wherein the transverse plate 12 is horizontally disposed, the vertical plate 13 is vertically disposed, the transverse plate 12 is parallel to the base plate 20, and the transverse plate 12 is connected to the base plate 20 through the vertical plate 13, so as to enclose an accommodating space 50 through the transverse plate 12, the vertical plate 13 and the base plate 20. The housing 10 can protect the sensor chip 30 and the signal processing chip 40 accommodated in the accommodating space 50. The housing 10 of the present embodiment is a metal housing 10, and can be made of flavone, which has a good strength, and the surface can be plated with nickel or gold to prevent corrosion. The base plate 20 is the PCB board, and the lower extreme of vertical board 13 bonds through conducting resin layer 80 with base plate 20 in the shell 10, when realizing shell 10 and base plate 20 assembly for shell 10 and PCB board switch on, play signal shielding's effect, improve differential pressure sensor's detection sensitivity and precision.
The sensor chip 30 is electrically connected to the signal processing chip 40 through a metal wire 90. The metal wire 90 may be an existing gold wire, aluminum wire, or copper wire, and the like, so as to transmit signals between the sensor chip 30 and the signal processing chip 40. Further, in order to improve the reliability, corrosion resistance and conductivity of signal transmission, the metal wire 90 of the present embodiment is preferably a gold wire. It is understood that the signal processing chip 40 can be electrically connected to the substrate 20 through the metal wire 90, so as to facilitate signal transmission.
In this embodiment, the first vent hole 11, the second vent hole 21, and the third vent hole 41 are disposed opposite to the vibration chamber 31. As shown in fig. 1, the first vent hole 11 is located right above the sensor chip 30 and is opposite to the vibration cavity 31, so that the gas entering from the first vent hole 11 directly acts on the sensor chip 30, and the sensor chip 30 can directly sense the pressure at the upper sensing end. Meanwhile, the second vent hole 21 and the third vent hole 41 are located right below the sensor chip 30 and are arranged right opposite to the vibration cavity 31, so that gas entering from the second vent hole 21 can directly act on the sensor chip 30, the sensor can directly sense the pressure at the lower sensing end, the sensing effect of the sensor packaging structure 100 is improved, and the detection sensitivity and the detection precision of the differential pressure sensor are further improved.
The signal processing chip 40 is an asic (application Specific Integrated circuit) chip, and the sensor chip 30 is a MEMS chip. The ASIC chip provides external bias for the MEMS chip, and effective bias can keep stable acoustic and electric parameters of the MEMS chip in the whole operation temperature range and support the design of the MEMS chip with different sensitivities.
As shown in fig. 3, in the present embodiment, a plurality of pads 22 are disposed on a side of the substrate 20 away from the receiving space 50, and the plurality of pads 22 are arranged at intervals. As shown in fig. 1 and 3, the lower side of the substrate 20 is provided with a plurality of pads 22, and the plurality of pads 22 are arranged at intervals to facilitate signal connection between the substrate 20 and an external motherboard. Further, among the pads 22, at least one pad 22 is an annular pad 22a, and the rest of the pads 22 are rectangular pads 22b, the annular pad 22a is disposed around the periphery of the second ventilation hole 21, and the rectangular pads 22b are disposed near the edge of the substrate 20. As shown in fig. 3, the substrate 20 of this embodiment is a rectangular substrate 20, five pads 22 are disposed on the lower side of the substrate 20, one of the pads is an annular pad 22a, and the remaining four pads are rectangular pads 22b, the annular pad 22a is located at the geometric center of the rectangular substrate 20 and surrounds the periphery of the second vent hole 21 in an annular closed structure, so as to surround the second vent hole 21, so as to perform a sealing function while performing signal connection with an external motherboard, thereby improving the detection sensitivity and accuracy of the differential pressure sensor. The other four rectangular pads 22b are respectively arranged at four corners of the substrate 20, and the structural design is reasonable. The annular pad 22a of the present embodiment can be formed by reflow soldering of solder paste, which is simple and convenient. The pad 22 has a thin thickness and can be embedded in the substrate 20, so that the lower surface of the pad 22 is flush with the bottom surface of the substrate 20, and the structure is compact.
The utility model discloses still provide a differential pressure sensor, including foretell sensor packaging structure 100. Since the differential pressure sensor adopts all technical solutions of all the embodiments, at least all the beneficial effects brought by the technical solutions of the embodiments are achieved, and no further description is given here.
The above only is the preferred embodiment of the present invention, not so limiting the patent scope of the present invention, all under the concept of the present invention, the equivalent structure transformation made by the contents of the specification and the drawings is utilized, or the direct/indirect application is included in other related technical fields in the patent protection scope of the present invention.
Claims (10)
1. A sensor package structure, comprising:
the shell is provided with a first vent hole;
the shell is arranged on the substrate and forms an accommodating space with the substrate in a surrounding mode, the substrate is provided with a second vent hole, and the first vent hole and the second vent hole are communicated with the accommodating space;
the sensor chip and the signal processing chip are accommodated in the accommodating space, the sensor chip and the signal processing chip are electrically connected and are arranged on the substrate in a stacked mode, and the sensor chip is located on one side, away from the substrate, of the signal processing chip; the sensor chip is provided with a vibration cavity, the signal processing chip is provided with a third vent hole, and the vibration cavity is communicated with the second vent hole through the third vent hole.
2. The sensor package structure of claim 1, wherein the sensor chip is bonded to a side of the signal processing chip facing away from the substrate by a first sealant layer, and the first sealant layer is annularly disposed around the periphery of the third vent hole.
3. The sensor package structure of claim 2, wherein the signal processing chip is bonded to the substrate by a second sealant layer, and the second sealant layer is annularly disposed around the periphery of the second vent hole.
4. The sensor package structure of claim 3, wherein the housing comprises a transverse plate and a vertical plate, the transverse plate is opened with the first vent hole, one end of the vertical plate is connected with an end of the transverse plate, and the other end of the vertical plate is bonded with the substrate through a conductive adhesive layer.
5. The sensor package structure of any one of claims 1-4, wherein the sensor chip is electrically connected to the signal processing chip by a metal wire.
6. The sensor package of any one of claims 1-4, wherein the first vent, the second vent, and the third vent are disposed directly opposite the vibration cavity.
7. The sensor package structure of any one of claims 1-4, wherein the signal processing chip is an ASIC chip and the sensor chip is a MEMS chip.
8. The sensor package structure of any one of claims 1-4, wherein a side of the substrate facing away from the receiving space is provided with a plurality of pads, and the pads are spaced apart.
9. The sensor package structure of claim 8, wherein at least one of the pads is an annular pad and the remaining pads are rectangular pads, the annular pad being disposed around the periphery of the second vent, the rectangular pads being disposed near an edge of the substrate.
10. A differential pressure sensor comprising a sensor package according to any of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022827883.7U CN213455953U (en) | 2020-11-30 | 2020-11-30 | Sensor packaging structure and differential pressure sensor |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022827883.7U CN213455953U (en) | 2020-11-30 | 2020-11-30 | Sensor packaging structure and differential pressure sensor |
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| CN213455953U true CN213455953U (en) | 2021-06-15 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115278417A (en) * | 2022-05-26 | 2022-11-01 | 潍坊歌尔微电子有限公司 | Vibration sensor and sensor packaging process |
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- 2020-11-30 CN CN202022827883.7U patent/CN213455953U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115278417A (en) * | 2022-05-26 | 2022-11-01 | 潍坊歌尔微电子有限公司 | Vibration sensor and sensor packaging process |
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