CN212934614U

CN212934614U - Combined sensor and electronic device

Info

Publication number: CN212934614U
Application number: CN202022087269.1U
Authority: CN
Inventors: 朱恩成; 陈磊; 张强; 刘兵
Original assignee: Qingdao Goertek Intelligent Sensor Co Ltd
Current assignee: Qingdao Goertek Intelligent Sensor Co Ltd
Priority date: 2020-09-22
Filing date: 2020-09-22
Publication date: 2021-04-09
Anticipated expiration: 2030-09-22

Abstract

The utility model discloses a combined sensor and electronic equipment, combined sensor include first sensor, first sensor includes first packaging structure and first sensor chip, and first packaging structure includes first base plate, first support piece and the second base plate that components of a whole that can function independently set up, and first base plate, second base plate and first support piece enclose to close and form first cavity, and first sensor chip locates in the first cavity to be connected with first base plate electricity; the first supporting piece is a PCB board, the second sensor comprises a second sensor chip, the second sensor chip and the first sensor chip are correspondingly arranged in a direction perpendicular to the second substrate and are electrically connected with the first substrate through the second substrate and the first supporting piece. The utility model provides a modular sensor can realize batchization, low cost, uniformity processing, and can effectively save horizontal space.

Description

Combined sensor and electronic device

Technical Field

The utility model relates to an encapsulation technology field, in particular to modular sensor and electronic equipment.

Background

With the trend of intelligentization and miniaturization of the whole machine products, there is a continuous demand for multi-function, miniaturization, integration and small-volume design of chips and components, and thus sip (system in package) packaging technology for integrating a plurality of bare chips is becoming popular. At present, a system-in-package structure is usually formed by matching and packaging a substrate and a cover cap, only one substrate is required to be mounted, the efficiency is low, the product consistency is poor, and the production requirements of large batch and high consistency cannot be met.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a modular sensor aims at improving the technological efficiency of modular sensor low and the horizontal space occupies great problem.

In order to achieve the above object, the present invention provides a combined sensor including:

the sensor comprises a first sensor and a second sensor, wherein the first sensor comprises a first packaging structure and a first sensor chip, the first packaging structure comprises a first substrate, a first supporting piece and a second substrate which are arranged in a split mode, the first substrate, the second substrate and the first supporting piece are enclosed to form a first cavity, and the first sensor chip is arranged in the first cavity and is electrically connected with the first substrate; the first support member is a PCB board, an

And the second sensor comprises a second sensor chip, and the second sensor chip and the first sensor chip are correspondingly arranged in a direction vertical to the second substrate and are electrically connected with the first substrate through the second substrate and the first supporting piece.

Optionally, the second sensor further includes a second package structure, the second package structure includes a second supporting member and a cover plate, the second supporting member and the cover plate are separately disposed, the cover plate, the second substrate and the second supporting member enclose a second cavity, and the second sensor chip is disposed in the second cavity and electrically connected to the first substrate through the second substrate and the first supporting member.

Optionally, the first support member is provided with a first through hole penetrating through upper and lower surfaces thereof, the first substrate is provided with a second through hole communicated with the first through hole, the second substrate is provided with a third through hole communicated with the first through hole, a first conductive piece is arranged in the first through hole, a second conductive piece and a third conductive piece are respectively arranged in the second through hole and the third through hole, two ends of the first conductive piece are respectively abutted against the second conductive piece and the third conductive piece, and the second sensor chip is electrically connected with the third conductive piece.

Optionally, a plurality of first through holes are formed in the first support member, the plurality of first through holes are distributed at intervals on the periphery of the first support member, and a plurality of first conductive members are correspondingly formed; or the like, or, alternatively,

the first through hole is annularly arranged and is positioned on the periphery of the first supporting piece.

Optionally, at least one of the first conductive member, the second conductive member and the third conductive member is made of metal; and/or the presence of a gas in the gas,

and a gold layer is plated on the outer surface of at least one of the first conductive piece, the second conductive piece and the third conductive piece.

Optionally, a first solder foot is disposed on a surface of the second substrate facing the second sensor chip, the first solder foot is electrically connected to the third conductive member, and the second sensor chip is connected to the first solder foot through a metal wire; and/or the presence of a gas in the gas,

and a second welding leg is arranged on the surface of the first substrate, which is far away from the second substrate, and the second welding leg is electrically connected with the second conductive piece.

Optionally, the second support and the cover plate are both PCB boards.

Optionally, the first sensor is an MEMS microphone, and the first substrate is provided with an acoustic hole; and/or the presence of a gas in the gas,

the second sensor is an inertial sensor.

Optionally, the second cavity is filled with epoxy resin glue.

According to another aspect of the present invention, there is provided an electronic device, including a housing and a combined sensor disposed in the housing, wherein the combined sensor is the combined sensor as described above.

The utility model discloses technical scheme's combination formula sensor includes first sensor and second sensor, can have the function of handling multiple different signals simultaneously concurrently. This combination formula sensor is still including the first packaging structure who is used for encapsulating the chip, first packaging structure is including the first base plate that the components of a whole that can function independently set up, first support piece and second base plate, the three encloses to close and forms first cavity, compare in current integrative structure of shroud, this combination formula sensor can carry out batch production, make a plurality of first base plates on three templates respectively promptly, a plurality of first support pieces and a plurality of second base plate, correspond three templates and cut after the laminating again, can realize the preparation of a plurality of combination formula sensors, avoided the production mode of a shroud laminating base plate alone, and the production efficiency is effectively improved. And the first supporting piece is a PCB board, so that the material cost can be further saved. Simultaneously, the chip of two sensors corresponds the range setting in the direction of perpendicular to second base plate, under the condition that improves the product function, can reduce the occupation to product plane space to effectively provide space utilization, be favorable to the product miniaturization, and the second sensor chip is connected through second base plate, first support piece and first base plate electricity, has also reduced the setting of lead wire simultaneously, makes things convenient for wiring assembly processing.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

FIG. 1 is a cross-sectional view of one embodiment of the present invention;

FIG. 2 is a cross-sectional view of another embodiment of the present invention;

fig. 3 to fig. 6 are sectional views of the combined sensor of the present invention during the manufacturing process.

The reference numbers illustrate:

the objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.

In the present application, unless expressly stated or limited otherwise, the terms "connected" and "fixed" are to be construed broadly, e.g., "fixed" may be fixedly connected or detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In addition, descriptions in the present application as to "first", "second", and the like are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.

The utility model provides a modular sensor 100.

Referring to fig. 1 and fig. 2, in the embodiment of the present invention, for convenience of explanation, the MEMS microphone and the inertial sensor are taken as examples for explanation, and accordingly, the first sensor chip is a MEMS microphone chip, and the second sensor chip is an inertial sensor chip. Specifically, the combination sensor 100 includes:

the MEMS microphone 10 includes a first package structure 11 and a MEMS microphone chip 13, where the first package structure 11 includes a first substrate 111, a first supporting member 113 and a second substrate 115 that are separately arranged, the first substrate 111, the second substrate 115 and the first supporting member 113 enclose to form a first cavity 11a, and the MEMS microphone chip 13 is disposed in the first cavity 11a and electrically connected to the first substrate 111; the first support member 113 is a PCB board, an

The inertial sensor 30, the inertial sensor 30 includes an inertial sensor chip 31, the inertial sensor chip 31 and the MEMS microphone chip 13 are arranged in a direction perpendicular to the second substrate 115, and are electrically connected to the first substrate 111 through the second substrate 115 and the first support 113. It should be noted that, since the first substrate 111 and the second substrate 115 both extend along the horizontal direction, the direction perpendicular to the second substrate 115 defined herein is the vertical direction, and may be defined as the direction perpendicular to the first substrate 111.

In this embodiment, the combined sensor 100 includes the MEMS microphone 10 and the inertial sensor 30, and the MEMS microphone chip 13 may be an MEMS (Micro-Electro-Mechanical Systems) sensor chip for sensing and detecting an external sound signal, and when the sound signal enters, the MEMS microphone chip 13 converts the sound signal into an electrical signal for transmission, thereby implementing a sound receiving function. The inertial sensor chip 31 is a sensor for detecting and measuring acceleration and rotational motion, and is called an inertial sensor 30 because its principle is implemented by using the law of inertia. Here, the inertial sensor chip 31 may be an accelerometer sensor chip, a gyroscope, a geomagnetic sensor chip, or the like, and is not limited herein. Here, the inertial sensor chip 31 may be an accelerometer sensor chip, for example, which can detect the acceleration or rotation of the electronic device to which the inertial sensor chip is applied, so as to realize functions of automatic image flipping, compass calibration, hand shake prevention, pedometer, and the like, thereby improving user experience.

Meanwhile, the combined sensor 100 further includes a first package structure 11 for packaging two sensors, and the first package structure 11 includes a first substrate 111, a first support 113 and a second substrate 115 which are separately disposed, and the first substrate 111, the first support 113 and the second substrate 115 enclose to form a first cavity 11a, so that protection and a mounting base can be provided. The first substrate 111 is a PCB printed with various circuits and interfaces for connecting various chips and other electrical components to realize electrical transmission, and the MEMS microphone chip 13 is disposed on the first substrate 111, where the electrical connection between the two can be realized by using a mounting or wire bonding method, so that the converted electrical signal can be transmitted to the applied electronic device through the first substrate 111 for analysis processing. The first supporting member 113 is a PCB, and the first supporting member 113 is disposed around the periphery of the first substrate 111, that is, the first supporting member 113 is disposed in a hollow ring shape and connected to the periphery of the first substrate 111, where a cross section of the first supporting member 113 may be a circle, a square, or a polygon, which is not limited herein. The second substrate 115 covers one end of the first supporting member 113 away from the first substrate 111, and the connection between the two substrates may be formed by bonding through a glue, so as to achieve a stable connection structure. When the first substrate 111 and the second substrate 115 are both of a square plate structure, the cross section of the first supporting member 113 may be also square, so as to be adapted to the first substrate and the second substrate, thereby improving the space utilization.

It can be understood that the inertial sensor chip 31 is disposed on one side of the MEMS microphone chip 13 in the direction perpendicular to the first substrate 111, so that the occupation of the planar space can be reduced, and the space utilization of the combined sensor 100 can be further improved. Here, in an embodiment, the inertial sensor chip 31 may be disposed in the first cavity 11a, and a supporting portion extends from a peripheral wall of the first supporting member 113, so that the inertial sensor 30 is disposed on the supporting portion and electrically connected to the first substrate 111, thereby effectively improving the space utilization rate of the combinational sensor 100. Of course, in other embodiments, the inertial sensor 30 may also be disposed on the second substrate 115 and electrically connected to the first substrate 111 through the second substrate 115 and the first support 113.

In addition, the cavity wall of the first cavity 11a is provided with the sound hole 1111, so as to facilitate the inflow of the sound signal and the gas, for example, the first substrate 111 is provided with the sound hole 1111, and the MEMS microphone chip 13 is arranged opposite to the sound hole 1111, so that the external sound signal can directly act on the MEMS microphone chip 13 after entering the first cavity 11a from the sound hole 1111, thereby improving the sensitivity of sound receiving and detection.

The utility model discloses technical scheme's combined sensor 100 includes MEMS microphone 10 and inertial sensor 30 to have the function of receiving sound function and detecting acceleration and rotary motion simultaneously concurrently. This combined sensor 100 still includes the first packaging structure 11 that is used for encapsulating two kinds of sensor chips, first packaging structure 11 includes the first base plate 111 that the components of a whole that can function independently set up, first support piece 113 and second base plate 115, the three encloses to close and forms first cavity 11a, compare in the integrative structure of current shroud, this combined sensor 100 can carry out batch production, make a plurality of first base plates 111 on three templates respectively promptly, a plurality of first support pieces 113 and a plurality of second base plate 115, cut after corresponding the laminating with three templates, can realize a plurality of combined sensor 100's preparation, avoided the production mode of a base plate of a shroud laminating alone, production efficiency has effectively been improved. Meanwhile, the MEMS microphone chip 13 and the inertial sensor chip 31 are stacked in a direction perpendicular to the first substrate 111, so that the occupation of the planar space of the product can be reduced under the condition of improving the function of the product, thereby effectively providing a space utilization rate and being beneficial to the miniaturization of the product. In addition, the batch stacking of the combined sensor 100 can also improve the precision of the product, prevent the alignment error caused by single stacking, and improve the yield of the product. The inertial sensor chip 31 is electrically connected to the first substrate 111 through the second substrate 115 and the first support member 113, and the number of leads is reduced, thereby facilitating the assembly of wiring

In an optional embodiment, the inertial sensor 30 further includes a second package structure 33, the second package structure 33 includes a second support 331 and a cover 333, which are separately disposed, the second support 331 is disposed around a periphery of the surface of the second substrate 115 facing away from the first substrate 111, the cover 333 covers a side of the second support 331 away from the second substrate 115, and surrounds the second substrate 115 and the second support 331 to form a second cavity 33a, and the inertial sensor chip 31 is disposed in the second cavity 33a and is electrically connected to the first substrate 111 through the second substrate 115 and the first support 113.

In this embodiment, in order to ensure the operating stability of the two sensors, the inertial sensor 30 further includes a second package structure 33, the second package structure 33 includes a second support member 331 and a cover plate 333, the second support member 331 and the cover plate 333 are disposed in a split structure, and are sequentially stacked on the second substrate 115, so as to form a second cavity 33a in an enclosing manner, and the inertial sensor chip 31 is disposed in the second cavity 33a, so that the electromagnetic interference between the MEMS microphone chip 13 and the inertial sensor chip 31 can be reduced, and the conversion performance of the two can be ensured. The second supporting member 331 and the first supporting member 113 may be made of the same material, and here, the material of the second supporting member 331 and the material of the first supporting member 113 may be selected to be metal or PCB, so that the second substrate 115 and the first substrate 111 need to be electrically connected to each other while supporting the same.

Meanwhile, the second supporting members 331 and the cover plates 333 are separately arranged, or can be processed by a batch production process, the plurality of second supporting members 331 are correspondingly superposed on the plurality of second base plates 115 at the same time, and the plurality of cover plates 333 are correspondingly superposed on the plurality of second supporting members 331 at the same time, so that the production efficiency of the combined sensor 100 is further improved; and the batch overlapping of the combined sensor 100 can also improve the precision of products, prevent the alignment error from occurring when the overlapping processing of a single combined sensor 100 is carried out for multiple times, and improve the yield of the products. In addition, the inertial sensor 30 is disposed in a suspended structure, which is beneficial to reducing the influence and interference of the substrate stress on the inertial sensor chip 31, so that the accuracy of the acceleration data test can be improved.

In an optional embodiment, the first support member 113 is provided with a first through hole 1131 penetrating through upper and lower surfaces thereof, the first substrate 111 is provided with a second through hole 1113 communicating with the first through hole 1131, the second substrate 115 is provided with a third through hole 1151 communicating with the first through hole 1131, the first conductive member 15 is disposed in the first through hole 1131, the second conductive member 16 and the third conductive member 17 are disposed in the second through hole 1113 and the third through hole 1151, two ends of the first conductive member 15 are respectively abutted against the second conductive member 16 and the third conductive member 17, and the inertial sensor chip 31 is electrically connected to the third conductive member 17.

In this embodiment, the first substrate 111, the first supporting member 113, and the second substrate 115 are subjected to internal routing processing, so that the inertial sensor chip 31 is electrically connected to the first substrate 111 through the second substrate 115 and the first supporting member 113, and the electrical signal of the inertial sensor chip 31 is transmitted through the first substrate 111. Specifically, since the first supporting member 113 is annular, the periphery thereof is provided with a first through hole 1131 penetrating through the upper and lower surfaces thereof, and a first conductive member 15 is penetrated through the first through hole 1131, and the first conductive member 15 is adapted to the first through hole 1131, thereby realizing internal wiring of the first supporting member 113 and realizing electrical conduction between the two opposite surfaces thereof. Meanwhile, a second through hole 1113 and a third through hole 1151 are respectively formed in positions, corresponding to the first through hole 1131, of the first substrate 111 and the second substrate 115, a second conductive piece 16 is arranged in the second through hole 1113, so that internal wiring of the first substrate 111 is achieved, a third conductive piece 17 is arranged in the third through hole 1151, internal wiring of the second substrate 115 is completed, the three conductive pieces can be made of the same material, and therefore processing and assembling can be facilitated. When the two ends of the first conductive member 15 abut against the second conductive member 16 and the third conductive member 17, respectively, the second substrate 115 is electrically connected to the first substrate 111, and finally the inertial sensor chip 31 is electrically connected to the third conductive member 17 through a pin or a metal wire layer, so that the inertial sensor chip 31 is electrically connected to the first substrate 111 through the second substrate 115 and the first support member 113, and signal transmission is realized.

The combined sensor 100 with the structure can save the cost and space of independent wiring and greatly improve the space utilization rate. Meanwhile, the first packaging structure 11 is made of a PCB plate material, so that the weight of the combined sensor 100 can be reduced, the process steps can be reduced and optimized, the raw material cost and the working hour and working procedure cost can be greatly reduced, and the product yield can be improved.

Of course, in other embodiments, the inertial sensor chip 31 may be electrically connected to the first substrate 111 by means of a wire through a hole. In addition, the second support 331 and the cover 333 are PCB boards. Thus, the module weight of the combinational sensor 100 can be further reduced, the process steps can be reduced, and the production cost can be reduced.

In an alternative embodiment, a plurality of first through holes 1131 are provided, the first through holes 1131 are distributed at intervals on the periphery of the first support member 113, and a plurality of first conductive members 15 are correspondingly provided; or the like, or, alternatively,

the first through hole 1131 is disposed in a ring shape and is located at the periphery of the first support 113.

On the basis of the structure that the first support member 113 is provided with the first through holes 1131, in an embodiment, the first through holes 1131 are provided in plural numbers, the plural first through holes 1131 are distributed at intervals on the periphery of the first support member 113, the openings of the first through holes 1131 are circular, a first conductive member 15 is provided in each first through hole 1131, the first conductive member 15 is a cylinder, correspondingly, the second through holes 1113 and the second conductive members 16 are also provided in plural numbers, and the third through holes 1151 and the third conductive members 17 are also provided in plural numbers. Therefore, a plurality of pins can be led out from the inertial sensor chip 31 and respectively connected with the third conductive member 17, so that the stability of the electrical connection between the inertial sensor chip 31 and the first substrate 111 is improved, and the detection performance of the inertial sensor 30 is ensured.

In another embodiment, the first through hole 1131 may be configured as a ring shape and located at the periphery of the first supporting member 113, and correspondingly, the first conductive member 15 is also configured as a ring-shaped sheet shape and is inserted into the first through hole 1131, so that the electrical conduction between the first supporting member 113 and the first substrate 111 and the second substrate 115 is uniformly distributed at the periphery thereof, and the stability and uniformity of the electrical connection are further improved.

In an alternative embodiment, at least one of the first conductive member 15, the second conductive member 16 and the third conductive member 17 is made of metal, and/or,

at least one of the first, second and third

conductive members

15, 16 and 17 is coated with a protective film on its outer surface.

In this embodiment, the first conductive member 15, the second conductive member 16, and the third conductive member 17 are made of the same metal material, such as copper, which has a stable structure and good conductivity, and can be easily processed and assembled, thereby reducing the material cost. Meanwhile, the first conductive piece 15 made of metal is annularly arranged on the periphery of the first cavity 11a, and a closed electromagnetic shielding layer can be formed, so that the MEMS microphone chip 13 is electromagnetically protected, electromagnetic interference is effectively reduced, the acoustoelectric conversion performance of the MEMS microphone chip 13 is ensured, and the stability of detecting sound signals is improved. Further, a layer of protective film is plated on the outer surfaces of the first conductive piece 15, the second conductive piece 16 and the third conductive piece 17, the protective film is made of gold, and the thickness range of the gold layer can be set to be 0.3-1 μm, so that the contact reliability is improved, the conductivity of the three is improved, and the conductivity stability of the combined sensor 100 is realized. And, the property of gold is more stable, so that the oxidation of copper can be reduced, and the stability of the self-performance of the first conductive member 15, the second conductive member 16 and the third conductive member 17 can be improved.

Specifically, with reference to fig. 1, a first solder leg 311 is disposed on a surface of the second substrate 115 facing the inertial sensor chip 31, the first solder leg 311 is electrically connected to the third conductive member 17, and the inertial sensor chip 31 is connected to the first solder leg 311 through a metal wire; meanwhile, a second solder leg 1115 is disposed on a surface of the first substrate 111 facing away from the second substrate 115, and the second solder leg 1115 is electrically connected to the second conductive member 16.

In this embodiment, metal wires are routed on the surfaces of the second substrate 115 and the first substrate 111, so as to electrically connect the first solder leg 311 and the third conductive member 17, and electrically connect the second conductive member 16 and the second solder leg 1115 of the first substrate 111, thereby achieving electrical conduction between the inertial sensor chip 31 and the first substrate 111, and facilitating transmission of an electrical signal of the inertial sensor chip 31 to the outside through the first substrate 111.

In addition, in order to transmit the electrical signal of the MEMS microphone chip 31 through the first substrate 111, a third solder fillet is further disposed on the surface of the MEMS microphone chip 31 facing the first substrate 111, and the third solder fillet is also electrically connected to the second conductive member 16 through a metal wire, so that the internal routing of the first substrate 111 is completed, and the electrical signal of the MEMS microphone chip 31 can be stably transmitted to the outside.

When the inertial sensor chip 31 is disposed in the second cavity 33a formed by the second support 331 and the second substrate 115, optionally, the second cavity 33a is filled with epoxy resin.

In this embodiment, when the second supporting member 331 is disposed on the second substrate 115, the plastic package structure is formed by dropping the glue into the middle of the second supporting member 331, the glue is made of epoxy resin, so that the glue drying temperature can be reduced, and a large internal stress generated by the inertia sensor chip 31 due to different thermal expansion coefficients after the past plastic package material is cured can be avoided, so that the inertia sensor chip 31 is prevented from generating zero offset, and the measurement accuracy of the inertia sensor chip 31 can be greatly improved.

Referring to fig. 3 and 4 in combination, it can be understood that, in order to provide the MEMS microphone chip 13 with electric energy and process the electric signal thereof, the MEMS microphone 10 further includes an ASIC chip 19 electrically connected to the MEMS microphone chip 13, and the ASIC chip 19 is electrically connected to the first substrate 111 through a lead.

In the present embodiment, the ASIC chip 19 is also provided on the first substrate 111, and is electrically connected to the first substrate 111 and the MEMS microphone chip 13, respectively. The connection mode between the MEMS microphone chip 13 and the first substrate 111 may be a mounting or solder ball, and the MEMS microphone chip 13 is electrically connected to the metal wire, so as to provide a voltage to the MEMS microphone chip 13, and process and amplify the output signal, so that the MEMS microphone chip 13 provides a sound receiving function for the electronic device.

Specifically, the MEMS microphone chip 13 includes a substrate 131 and a back plate 133, the substrate 131 is disposed on the first substrate 111 and is provided with a first via hole communicated with the sound hole 1111, the back plate 133 is disposed at an end of the substrate 131 far away from the first substrate 111, and further includes a diaphragm (not labeled) disposed opposite to the back plate 133 and having a distance therefrom. Here, the substrate 131 provides a support for the diaphragm and the back plate 133, and the material of the substrate is generally monocrystalline silicon, polycrystalline silicon, or silicon nitride, etc., and the outer shape of the substrate 131 is substantially square, but the outer shape of the substrate 131 may also be a cylinder or other polygonal structure. The opening of the first via hole formed in the substrate 131 may be square, circular, or polygonal, and is not limited herein, so as to ensure that the gas can flow into the first via hole. The first via hole penetrates through both surfaces of the substrate 131, and the diaphragm is disposed at an end of the substrate 131 far from the first substrate 111 and covers the first via hole, so that the sound signal transmitted from the sound hole 1111 may directly act on the diaphragm after passing through the first via hole. The capacitive MEMS microphones are shown here, but they can also be designed as piezoelectric sensors, for example, in practice. The inertial sensor 30 also includes an ASIC chip 19 electrically connected to the inertial sensor chip 31, and the ASIC chip 19 of the inertial sensor 30 is provided on the second substrate 115 because of its large size, and the inertial sensor chip 31 is attached to the ASIC chip 19, thereby achieving electrical connection while further saving a planar space, and the ASIC chip 19 of the inertial sensor 30 is also electrically connected to the second substrate 115 through a metal wire.

The utility model discloses still provide an electronic equipment (not shown), include the casing and locate combination formula sensor 100 in the casing, above-mentioned embodiment is referred to the concrete structure of combination formula sensor 100, because this electronic equipment's combination formula sensor 100 has adopted the whole technical scheme of above-mentioned all embodiments, consequently has all beneficial effects that the technical scheme of above-mentioned embodiment brought at least, and the repeated description is no longer given here.

The electronic device may be a wearable electronic device, such as a smart watch or a bracelet, or may be a mobile terminal, such as a mobile phone or a notebook computer, or other devices that need to perform inertial motion detection or devices with an audio-to-electrical conversion function, which is not limited herein.

Referring to fig. 3 to fig. 6, the present invention relates to a method for manufacturing a combined sensor 100, and the structure of the combined sensor 100 also refers to the structure of the combined sensor 100 of the above embodiment, the method includes the following steps:

step S1: preparing a first substrate 111, mounting a MEMS microphone chip 13 on the first substrate 111, and electrically connecting the MEMS microphone chip 13 with the first substrate 111;

first, the bonding position of the MEMS microphone chip 13 and the bonding position of the ASIC chip 19 are scribed on the first substrate 111 by scribing. Optionally, the thickness of the glue is selected from 50 μm to 100 μm, for example, 50 μm, 70 μm or 90 μm, and the glue is firmly bonded without waste; then, bonding the MEMS microphone chip 13 and the ASIC chip 19; finally, the MEMS microphone chip 13 and the ASIC chip 19 are electrically connected by wire bonding, and the ASIC chip 19 is electrically connected to the first substrate 111. Here, the metal wire is made of gold, and has good conductivity, and the diameter of the gold wire is 25 μm to 50 μm, for example, 25 μm, 30 μm, 50 μm, and the like, so that the connection structure is stable and no material is wasted.

Step S2: hollowing out the middle position of a standard PCB to form a first supporting piece 113, and bonding the first supporting piece 113 to the periphery of the first substrate 111;

the PCB standard plate is provided with a hollow structure, a first supporting piece 113 with a hollow middle and a periphery supporting is formed, and optionally, the cross section of the first supporting piece 113 is square. Then, an adhesive glue is coated on the periphery of the first substrate 111, optionally, an epoxy resin glue is selected, and the glue is cured at a temperature of 150 ℃ for a time of 30min, so as to adhere the first support member 113 to the first substrate 111, thereby forming a frame surrounding the MEMS microphone chip 13.

Step S3: preparing a second substrate 115, adhering the second substrate 115 to the surface of the first support 113 away from the first substrate 111 to form a first package structure 11, wherein the first package structure 11 has a first cavity 11a, and a sound hole 1111 is formed by opening a hole on the wall of the first cavity 11 a;

here, the second substrate 115 is also a PCB, and a glue, which is also an epoxy glue, is also coated on the surface of the first support member 113 facing away from the first substrate 111, so as to adhere the second substrate 115 to the first support member 113, so that the first substrate 111, the second substrate 115 and the first support member 113 form the first package structure 11, and provide a protected first cavity 11a for the MEMS microphone chip 13. Specifically, the first substrate 111 is provided with the sound hole 1111, which can be disposed corresponding to the MEMS microphone chip 13, so that the detection of the sound signal is more direct and sensitive.

Step S41: attaching the inertial sensor chip 31 to the surface of the second substrate 115 away from the first support member 113, so that the inertial sensor chip 31 and the MEMS microphone chip 13 are correspondingly arranged in a direction perpendicular to the second substrate 115, and are electrically connected to the first substrate 111 through the second substrate 115; or the like, or, alternatively,

step S42: the inertial sensor chip 31 is mounted in the first cavity 11a, and is arranged in a direction perpendicular to the first substrate 111 with the MEMS microphone chip 13, and the inertial sensor chip 31 is electrically connected to the first substrate 111.

This step includes two embodiments, one of which is that the inertial sensor chip 31 is attached to the second substrate 115, so as not to be in the same cavity as the MEMS microphone chip 13, and thus it can be ensured that no interference occurs between the two. Specifically, the inertial sensor 30 further includes an ASIC chip 19 electrically connected to the inertial sensor chip 31, and the two chips are in signal communication through a bonding process in advance, and here, a glue is also used to mark the bonding position of the ASIC chip 19 on the second substrate 115, the thickness of the glue is selected from 50 μm to 100 μm, and the ASIC chip 19 is bonded to the second substrate 115 and is electrically connected to the second substrate 115 through a wire bonding method.

At this time, the inertial sensor chip 31 and the ASIC chip 19 cannot be directly electrically connected to the first substrate 111, and are electrically connected to the first substrate 111 by the transmission of the second substrate 115 and the first support 113, so that signals can be guided to the first substrate 111. Here, the second substrate 115 is electrically connected to the first substrate 111 through the first support 113, and may be implemented by forming a lead through an opening or by routing wires internally, which is not limited herein.

In another embodiment, the inertial sensor chip 31 is disposed in the first cavity 11a and is aligned with the MEMS microphone chip 13 in a direction perpendicular to the first substrate 111. Specifically, a support plate may extend from the inner side wall of the first support 113, glue may be applied to the support plate, the inertial sensor chip 31 may be bonded to the support plate, and the inertial sensor chip may be connected to the first substrate 111 by wire bonding. The height of the combined sensor 100 is further reduced, which is beneficial to miniaturization.

Referring to fig. 2, in an alternative embodiment, after the step of attaching the inertial sensor chip 31 to the surface of the second substrate 115 facing away from the first support 113 and electrically connecting the second substrate 115 and the first substrate 111 in step S41, the method further includes:

step S5: hollowing out the middle position of the standard PCB to form a second support 331, and adhering the second support 331 to the periphery of the surface of the second substrate 115 facing away from the first substrate 111;

the hollow structure is manufactured on the standard PCB to form a second support 331 with a hollow middle and a support at the periphery, and optionally, the cross section of the second support 331 is also square. Then, a bonding glue is applied to the periphery of the second substrate 115, optionally an epoxy glue, and the glue is cured at a temperature of 150 ℃ for a time of 30min, so as to bond the second support 331 to the second substrate 115, thereby forming a frame surrounding the inertial sensor chip 31.

Step S6: filling epoxy glue in the gap between the second support 331 and the inertial sensor chip 31;

here, the epoxy resin adhesive is filled between the inertial sensor chip 31 and the second support 331 by dripping, and is cured at a temperature of 150 ℃ for 30min, so as to protect the inertial sensor chip 31 and the gold wire, and prevent abnormal disturbance during measurement.

Step S7: preparing a cover plate 333, and adhering the cover plate 333 to a surface of the second support 331 away from the second substrate 115.

Here, the cover 333 is also made of a PCB, which can further reduce the weight of the combi sensor 100 and simplify the process. Similarly, glue is applied to the surface of the second support 331 away from the second substrate 115, and the cover plate 333 is bonded to the surface of the second support 331, so as to form the second package structure 33 protecting the inertial sensor chip 31.

In order to further save space, in an alternative embodiment, the step S41 of attaching the inertial sensor chip 31 to the surface of the second substrate 115 facing away from the first support 113 and electrically connecting the second substrate 115 and the first substrate 111 specifically includes:

s411: through holes are respectively formed at positions opposite to the peripheries of the second substrate 115, the first support 113 and the first substrate 111, and conductive members are disposed in the through holes so as to electrically connect the inertial sensor chip 31 and the first substrate 111.

Specifically, a first through hole 1131 is formed on the periphery of the first substrate 111, a second through hole 1113 is formed on the periphery of the first support member 113, a third through hole 1151 is formed on the periphery of the second substrate 115, and the projections of the formed holes on the first substrate 111 are overlapped, specifically, the holes may be laser drilled holes. Then, the holes are filled with metal conductor, first via 1131 is filled with first conductor 15, second via 1113 is filled with second conductor 16, and third via 1151 is filled with third conductor 17. Optionally, the first conductive member 15, the second conductive member 16, and the third conductive member 17 are made of copper, and gold is plated on the surfaces of the first conductive member 15, the second conductive member 16, and the third conductive member 17, wherein the thickness of the gold layer is 0.3-1um, so that the contact reliability and the conductive reliability are improved. Both ends of the second conductive member 16 abut against the first conductive member 15 and the third conductive member 17, respectively, and at the same time, the pins of the inertial sensor chip 31 are electrically connected to the third conductive members, thereby achieving the purpose of guiding the signal of the inertial sensor chip 31 to the first substrate 111.

In addition, in order to facilitate the conduction of the metal conductors, when the first substrate 111 is bonded to the first support 113, the conductive paste is applied to the edge where the first through hole 1131 and the second through hole 1113 are butted, and the second through hole 1113 and the third through hole 1151 are butted, the epoxy resin adhesive is applied to the rest of the edge, and the conductive paste is applied to the side of the first through hole 1131 away from the second substrate 115 to serve as the bonding of the lead-out structure.

The method for manufacturing the combinational sensor 100 can process a plurality of combinational sensors 100 at one time, that is, a plurality of first substrates 111, a plurality of first supporting members 113 and a plurality of second substrates 115 are manufactured on one template according to the steps, and two templates are overlapped, so that the whole overlapping and bonding process of the plurality of first substrates 111, the plurality of first supporting members 113 and the plurality of second substrates 115 can be realized, the combinational sensor 100 is produced in a batch manner, and the production efficiency is effectively improved.

The above only be the preferred embodiment of the utility model discloses a not consequently restriction the utility model discloses a patent range, all are in the utility model discloses a conceive, utilize the equivalent structure transform of what the content was done in the description and the attached drawing, or direct/indirect application all is included in other relevant technical field the utility model discloses a patent protection within range.

Claims

1. A combinational sensor, comprising:

2. The combination sensor of claim 1, wherein the second sensor further comprises a second package structure, the second package structure comprises a second supporting member and a cover plate, the second supporting member and the cover plate are separately disposed, the cover plate, the second substrate and the second supporting member enclose a second cavity, and the second sensor chip is disposed in the second cavity and electrically connected to the first substrate through the second substrate and the first supporting member.

3. The combination sensor according to claim 2, wherein the first supporting member has a first through hole penetrating through upper and lower surfaces thereof, the first substrate has a second through hole communicating with the first through hole, the second substrate has a third through hole communicating with the first through hole, the first through hole has a first conductive member disposed therein, the second through hole and the third through hole have a second conductive member and a third conductive member disposed therein, two ends of the first conductive member abut against the second conductive member and the third conductive member, respectively, and the second sensor chip is electrically connected to the third conductive member.

4. The combination sensor of claim 3, wherein a plurality of the first through holes are disposed at intervals around the periphery of the first supporting member, and a plurality of the first conductive members are correspondingly disposed; or the like, or, alternatively,

5. The combination sensor of claim 3, wherein at least one of the first, second, and third conductive members is a metal; and/or the presence of a gas in the gas,

6. The combination sensor according to any one of claims 3 to 5, wherein a surface of the second substrate facing the second sensor chip is provided with a first fillet, the first fillet being electrically connected to the third conductive member, the second sensor chip being connected to the first fillet by a metal wire; and/or the presence of a gas in the gas,

7. A combined sensor according to claim 3, characterised in that the second support and the cover are both PCB boards.

8. The combination sensor of claim 1, wherein the first sensor is a MEMS microphone, and the first substrate has an acoustic hole formed therein; and/or the presence of a gas in the gas,

the second sensor is an inertial sensor.

9. The combination sensor of claim 2, wherein the second cavity is filled with an epoxy resin glue.

10. An electronic device comprising a housing and a combination sensor disposed within the housing, the combination sensor being as claimed in any one of claims 1 to 8.