WO2021189963A1 - Combined sensor and manufacturing method therefor, and electronic device - Google Patents

Abstract

Disclosed are a combined sensor (100) and a manufacturing method therefor, and an electronic device. The combined sensor (100) comprises: a packaging body (10), the packaging body (10) comprising a substrate (12) and a cover plate (19), wherein the substrate (12) and the cover plate (19) are bonded and connected by means of a bonding structure, and an accommodating cavity (11) is formed by enclosure by the substrate and the cover plate; an environment sensor (30), the environment sensor (30) comprising an environment sensing chip (31), and a first integrated circuit chip (32) electrically connected to the environment sensing chip (31), and the environment sensing chip (31) and the first integrated circuit chip (32) both being arranged inside the accommodating cavity (11); and an acoustic sensor (40), the acoustic sensor (40) comprising a microphone chip (41) and a second integrated circuit chip (42) electrically connected to the microphone chip (41), and the microphone chip (41) and the second integrated circuit chip (42) both being arranged inside the accommodating cavity (11).

Description

Combined sensor, manufacturing method thereof, and electronic equipment

This application claims: the priority of the Chinese patent application filed on March 25, 2020, with application number 202010222767.4, titled "combined sensor and its manufacturing method, and electronic equipment", which is hereby incorporated by reference.

Technical field

This application relates to the field of sensor technology, and in particular to a combined sensor, a manufacturing method thereof, and electronic equipment.

Background technique

With the development trend of "light, thin, short, and small" consumer electronics products such as mobile phones, watches, earphones, etc., the development direction of its core component sensors is also moving towards miniaturization and integration. Among them, environmental sensors (such as air pressure sensors) and acoustic sensors (such as microphone sensors) are standard components of such electronic products. By integrating environmental sensors and acoustic sensors into a combined sensor, it is helpful to collect more information and achieve better Many functions. However, at present, this type of combined sensor usually adopts an independent shell packaging form, because the packaging solution of an independent shell is adopted, so the height of the shell is required to be greater than the sum of the thickness of the chip and the thickness of the packaging substrate. However, this will increase the overall thickness of the combined sensor, which is not conducive to its miniaturization.

The above content is only used to assist the understanding of the technical solution of the application, and does not mean that the above content is recognized as prior art.

Technical solutions

The main purpose of the present application is to provide a combined sensor, a manufacturing method thereof, and electronic equipment, aiming to effectively reduce the thickness of the combined sensor and realize the miniaturization of the combined sensor.

In order to achieve the above objective, the combined sensor proposed in the present application includes: a package body, the package body includes a substrate and a cover plate, the substrate and the cover plate are bonded and connected by a bonding structure, and are enclosed to form an accommodating cavity Environmental sensor, the environmental sensor includes an environmental sensor chip and a first integrated circuit chip electrically connected to the environmental sensor chip, the environmental sensor chip and the first integrated circuit chip are both set in the An accommodating cavity; and an acoustic sensor, the acoustic sensor including a microphone chip and a second integrated circuit chip electrically connected to the microphone chip, the microphone chip and the second integrated circuit chip are both provided in the container置内内。 In the cavity.

In one embodiment, the accommodating cavity includes a first sub-accommodating cavity, a second sub-accommodating cavity, a third sub-accommodating cavity, and a fourth sub-accommodating cavity that are independent of each other, and the environmental sensor chip is provided with In the first sub-accommodating cavity, the microphone chip is arranged in the second sub-accommodating cavity, the first integrated circuit chip is arranged in the third sub-accommodating cavity, and the second The integrated circuit chip is arranged in the fourth sub-accommodating cavity.

In an embodiment, the environmental sensor is an air pressure sensor, and the cover plate is further provided with a first through hole communicating with the first sub-accommodating cavity; and/or, the cover plate is also provided with a first through hole communicating with the The second through hole of the second sub-accommodating cavity.

In one embodiment, it is defined that the thickness direction of the substrate is the up-down direction, the direction facing the cover plate is the upward direction, the direction away from the cover plate is the downward direction, and the upper surface of the substrate is provided with a first An electrode layer, the upper surface of the first electrode layer is provided with a first bonding structure; the lower surface of the cover plate is provided with a second electrode layer, and the lower surface of the second electrode layer is provided with the first bonding structure; A second bonding structure corresponding to a bonding structure; the first bonding structure is bonded to the second bonding structure, and is enclosed with the substrate and the cover plate to form the accommodation Cavity.

In an embodiment, the upper surface of the first electrode layer is further provided with a first insulating layer, the upper surface of the first insulating layer is provided with a conductive layer, and the upper surface of the conductive layer is provided with a second insulating layer The combined sensor also includes a first metal trace, a second metal trace, a third metal trace, and a fourth metal trace, the first metal trace, the second metal trace, the first metal trace The three metal traces and the fourth metal trace both penetrate the upper and lower surfaces of the second insulating layer, and both electrically abut the conductive layer; the environmental sensor chip is mounted on the second insulating layer The upper surface of the layer is electrically connected to the first metal trace; the microphone chip is mounted on the upper surface of the second insulating layer and is electrically connected to the second metal trace; The first integrated circuit chip is mounted on the upper surface of the second insulating layer and is electrically connected to the third metal trace; the second integrated circuit chip is mounted on the upper surface of the second insulating layer , And electrically connected to the fourth metal trace.

In an embodiment, the upper surface of the substrate is further provided with a pad structure, the combined sensor further includes a fifth metal trace and a sixth metal trace, the fifth metal trace and the sixth metal trace The traces all penetrate the first insulating layer and the second insulation layer in sequence, and are electrically abutted with the pad structure, and the fifth metal trace is electrically away from the end of the pad structure. Connected to the first integrated circuit chip, the end of the sixth metal trace away from the pad structure is electrically connected to the second integrated circuit chip; the lower surface of the substrate corresponds to the pad structure Exposure holes are also opened to expose the pad structure.

In an embodiment, the pad structure is arranged corresponding to the first integrated circuit chip and the second integrated circuit chip.

This application also proposes a method for manufacturing a combined sensor, which includes the following steps:

Provide base plate and cover plate;

An environmental sensor and an acoustic sensor are fabricated on the upper surface of the substrate. The environmental sensor includes an environmental sensor chip and a first integrated circuit chip electrically connected to the environmental sensor chip. The acoustic sensor includes a microphone chip and A second integrated circuit chip electrically connected to the microphone chip;

The cover plate is connected to the substrate by bonding to form a package with a containing cavity, and the environmental sensor and the acoustic sensor are both located in the containing cavity.

In an embodiment, before the step of fabricating an environmental sensor and an acoustic sensor on the upper surface of the substrate, the method includes:

Fabricating a first electrode layer on the upper surface of the substrate;

Fabricating a first bonding structure on the upper surface of the first electrode layer;

Fabricating a second electrode layer on the bottom surface of the cover plate, and fabricating a second bonding structure on the bottom surface of the second electrode layer;

The step of bonding the cover plate to the substrate includes:

Aligning the first bonding structure of the substrate with the second bonding structure of the cover plate to perform bonding and packaging.

In an embodiment, after the step of fabricating the first electrode layer on the upper surface of the substrate, the method further includes:

Depositing a first insulating layer on the upper surface of the first electrode layer, and fabricating a conductive layer on the upper surface of the first insulating layer;

A second insulating layer is deposited on the upper surface of the conductive layer, and the second insulating layer is etched to obtain a first via hole, a second wire hole, a third wire hole, and a fourth wire hole that expose the conductive layer. Wire hole

The first metal trace, the second metal trace, and the third metal trace are electroplated in the first trace hole, the second trace hole, the third trace hole, and the fourth trace hole, respectively. Metal trace and the fourth metal trace;

The step of fabricating an environmental sensor and an acoustic sensor on the upper surface of the substrate includes:

Mount the environment sensor chip, the microphone chip, the first integrated circuit chip, and the second integrated circuit chip on the upper surface of the second insulating layer, and connect the environment sensor chip with The first metal trace is electrically connected through a wire, the microphone chip and the second metal trace are electrically connected through a wire, and the first integrated circuit chip is electrically connected to the third metal trace. Sexual connection; electrically connecting the second integrated circuit chip and the fourth metal trace.

In an embodiment, after the step of depositing a first insulating layer on the upper surface of the first electrode layer and forming a conductive layer on the upper surface of the first insulating layer, the method further includes:

An electroplating area exposing the first electrode layer is opened on the upper surface of the first insulating layer;

Fabricating a photoresist structure on the upper surface of the first insulating layer, the photoresist structure is provided with a photoetching hole, and the photoetching hole corresponds to and communicates with the electroplating area;

The step of fabricating a first bonding structure on the upper surface of the first electrode layer includes:

A first bonding structure is fabricated in the electroplating area and the photoetching hole, and the insulating glue layer inside the first bonding structure is removed.

In an embodiment, after the step of fabricating the first electrode layer on the upper surface of the substrate, the method further includes:

Fabricating a pad structure on the upper surface of the substrate;

Etching the bottom surface of the substrate corresponding to the pad structure to expose the pad structure;

A second insulating layer is deposited on the upper surface of the conductive layer, and the second insulating layer is etched to obtain a first via hole, a second wire hole, a third wire hole, and a fourth wire hole that expose the conductive layer. After the steps of routing holes, it also includes:

Etching the upper surface of the second insulating layer to obtain a fifth wiring hole and a sixth wiring hole that penetrate the first insulating layer and expose the pad structure;

Making a fifth metal wiring and a sixth metal wiring in the fifth wiring hole and the sixth wiring hole respectively;

The step of fabricating an environmental sensor and an acoustic sensor on the upper surface of the substrate further includes:

The first integrated circuit chip is electrically connected with the fifth metal trace; the second integrated circuit chip is electrically connected with the sixth metal trace.

In an embodiment, the accommodating cavity includes a first sub-accommodating cavity, a second sub-accommodating cavity, a third sub-accommodating cavity, and a fourth sub-accommodating cavity that are independent of each other;

The step of fabricating an environmental sensor and an acoustic sensor on the upper surface of the substrate includes:

Respectively in the surface mount environment where the substrate is located in the first sub-accommodating cavity, the second sub-accommodating cavity, the third sub-accommodating cavity, and the fourth sub-accommodating cavity Sensor chip, microphone chip, first integrated circuit chip and second integrated circuit chip.

In an embodiment, the environmental sensor is an air pressure sensor, and after the step of bonding and connecting the cover plate to the substrate, the method further includes:

A first through hole and a second through hole are opened on the surface of the cover plate, the first through hole communicates with the first sub-accommodating cavity, and the second through hole communicates with the second sub-accommodating cavity.

The application also proposes an electronic device. The electronic device includes a combined sensor. The combined sensor includes a package. The package includes a substrate and a cover. The substrate and the cover are bonded by a bonding structure. The environment sensor includes an environment sensor chip and a first integrated circuit chip electrically connected to the environment sensor chip, the environment sensor chip and the The first integrated circuit chips are all disposed in the accommodating cavity; and an acoustic sensor, the acoustic sensor includes a microphone chip and a second integrated circuit chip electrically connected to the microphone chip, the microphone chip and the first Both integrated circuit chips are arranged in the accommodating cavity.

The technical solution of the present application integrates the environmental sensor and the acoustic sensor on the chip, mounts the chip on the surface of the substrate, and realizes electrical connection in the chip. After the cover plate is bonded and connected to the substrate by a bonding structure, It is enclosed to form a package body with a containing cavity, and the integrated environmental sensor and acoustic sensor are both arranged in the containing cavity. Here, the packaging body is equivalent to the function of the shell, so that the setting of the shell can be omitted, which is beneficial to further reduce the thickness of the combined sensor and realize its miniaturization. At the same time, it also reduces the impact of external signals on environmental sensors and acoustic sensors, reduces noise introduction, and reduces power consumption.

Description of the drawings

In order to more clearly describe the technical solutions in the embodiments of the present application or related technologies, the following will briefly introduce the accompanying drawings that need to be used in the description of the embodiments or related technologies. Obviously, the accompanying drawings in the following description are merely present For some of the embodiments of the application, for those of ordinary skill in the art, without creative work, other drawings may be obtained based on the structure shown in these drawings.

FIG. 1 is a schematic diagram of the internal structure of an embodiment of a combined sensor according to the present application;

Figure 2 is a schematic sectional view of the combined sensor;

Figure 3 is a schematic view of the structure of the combined sensor from a perspective;

Figure 4 is a schematic view of the structure of the combined sensor from another perspective;

FIG. 5 is a schematic flowchart of steps of an embodiment of a method for manufacturing a combined sensor according to the present application;

FIG. 6 is a schematic diagram of the step flow of an embodiment of step S10 in FIG. 5;

FIG. 7 is a schematic flow chart of the steps of another embodiment of the manufacturing method of the combined sensor in FIG. 5; FIG.

FIG. 8 is a schematic diagram of the step flow of another embodiment of step S10 in FIG. 5;

FIG. 9 is a schematic flowchart of steps of another embodiment of the manufacturing method of the combined sensor in FIG. 5; FIG.

FIG. 10 is a schematic diagram of the structure after step S13 in FIG. 6;

FIG. 11 is a schematic diagram of an intermediate structure of step S11 in FIG. 7;

FIG. 12 is a schematic diagram of the structure after step S11 in FIG. 7;

FIG. 13 is a schematic diagram of the structure after step S111 in FIG. 7;

FIG. 14 is a schematic diagram of the structure after step S115 in FIG. 8;

Fig. 15 is a schematic diagram of the structure after step S12a in Fig. 8.

FIG. 16 is a schematic diagram of the structure after step S112a in FIG. 9;

FIG. 17 is a schematic diagram of the structure after step S113 and step S112b in FIG. 9;

FIG. 18 is a schematic diagram of the structure after step S22 in FIG. 9.

Attached icon number description:

Label name Label name 100 Combination sensor 1266 Sixth wire hole 10 Package body 127 Photoresist structure 11 Accommodating cavity 1271 Lithography hole 111 The first sub-accommodating cavity 13 The first metal trace 112 Second sub-accommodating cavity 14 Second metal trace 113 Third sub-accommodating cavity 15 The third metal trace 114 The fourth sub-accommodating cavity 16 The fourth metal trace 12 Substrate 17 The fifth metal trace 121 First electrode layer 18 The sixth metal trace 122 Pad structure 19 Cover 123 First bonding structure 191 First through hole 124 First insulating layer 192 Second through hole 1241 Electroplating area 193 Second electrode layer 125 Conductive layer 194 Second bonding structure 126 Second insulating layer 30 Environmental sensor 1261 The first wiring hole 31 Environmental sensor chip 1262 Second wiring hole 32 The first integrated circuit chip 1263 The third wiring hole 40 Acoustic sensor 1264 The fourth wiring hole 41 Microphone chip 1265 Fifth wire hole 42 Second integrated circuit chip

The realization, functional characteristics, and advantages of the purpose of this application will be further described in conjunction with the embodiments and with reference to the accompanying drawings.

Embodiments of the present invention

The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of this application.

It should be noted that all the directional indicators (such as up, down, left, right, front, back...) in the embodiments of this application are only used to explain the relationship between the components in a specific posture (as shown in the figure). If the relative position relationship, movement situation, etc. change, the directional indication will change accordingly.

In addition, the descriptions related to "first", "second", etc. in this application are only for descriptive purposes, and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present application, "a plurality of" means at least two, such as two, three, etc., unless specifically defined otherwise.

In this application, unless otherwise clearly specified and limited, the terms "connected", "fixed", etc. should be understood in a broad sense. For example, "fixed" can be a fixed connection, a detachable connection, or a whole; It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be an internal communication between two components or an interaction relationship between two components, unless specifically defined otherwise. For those of ordinary skill in the art, the specific meanings of the above-mentioned terms in this application can be understood according to specific circumstances.

In addition, the technical solutions between the various embodiments of the present application can be combined with each other, but they must be based on what can be achieved by a person of ordinary skill in the art. When the combination of technical solutions is contradictory or cannot be achieved, it should be considered that the combination of such technical solutions It does not exist and is not within the scope of protection required by this application.

This application proposes a combined sensor 100.

1 to 4, in an embodiment of the combined sensor 100 of the present application, the combined sensor 100 includes: a package body 10, the package body 10 includes a substrate 12 and a cover plate 19, the cover plate 19 and the substrate 12 are bonded by a bonding structure The environment sensor 30 includes an environment sensor chip 31 and a first integrated circuit chip 32 electrically connected to the environment sensor chip 31, and the environment sensor chip 31 and the first integrated circuit chip 32 are electrically connected to the environment sensor chip 31. An integrated circuit chip 32 is arranged in the accommodating cavity 11; and an acoustic sensor 40, which includes a microphone chip 41 and a second integrated circuit chip 42 electrically connected to the microphone chip 41, the microphone chip 41 and the second integrated circuit The chips 42 are all arranged in the accommodating cavity 11.

Specifically, the material of the substrate 12 and the cover plate 19 are generally insulating materials, such as silicon substrate 12; the two are connected by a bonding structure, wherein the bonding structure can be a gold-tin bonding structure, and the two are connected after bonding. The accommodating cavity 11 is formed together. The environmental sensor 30 and the acoustic sensor 40 are integrated on the chip and are electrically connected in the chip to reduce the influence of external signals on the environmental sensor 30 and the acoustic sensor 40, reduce the introduction of noise, and reduce the power consumption. And the integrated environmental sensor 30 and acoustic sensor 40 are mounted on the upper surface of the substrate 12, and they are both arranged in the accommodating cavity 11, so that the setting of the housing can be omitted, which is beneficial to further reduce the cost of the combined sensor 100 Thickness, so as to achieve its miniaturization. Here, the environmental sensor chip 31 and the microphone chip 41 are both MEMS chips, where the environmental sensor 30 can be an air pressure sensor, a temperature sensor, a humidity sensor or an optical sensor, and the corresponding environmental sensor chip 31 can be an air pressure sensor chip, a temperature sensor, or an optical sensor. The sensor chip, humidity sensor chip or optical sensor chip is used to sense changes in various parameters of the external environment. The first integrated circuit (ASIC) chip is used to process the signal output by the environmental sensor chip 31, so as to make the environment The sensor 30 has a function of detecting changes in the external environment. The microphone chip 41 of the acoustic sensor 40 is generally made of monocrystalline silicon, polycrystalline silicon or other silicon nitride materials, which are used to sense and detect sound sources, and can convert sound signals into electrical signals for transmission. The second integrated circuit chip 42 is used to The signal output by the microphone chip 41 is processed and provides a voltage for the microphone chip 41, so that the acoustic sensor 40 provides an acoustic function for the electronic device.

It should be noted that an insulating glue layer is provided on the periphery of the first bonding structure 123 and the second bonding structure 194 to shield external electromagnetic interference. In addition, the setting positions of the environment sensor chip 31, the microphone chip 41, the first integrated circuit chip 32, and the second integrated circuit chip 42 can be referred to as shown in FIG. , Are all within the protection scope of this application.

Therefore, it is understandable that the technical solution of the present application integrates the environmental sensor 30 and the acoustic sensor 40 on the chip, mounts the chip on the surface of the substrate 12, and realizes electrical connection in the chip, and uses a bonding structure to connect After the cover plate 19 is bonded and connected to the base plate 12, a package body 10 with a containing cavity 11 is enclosed and formed, and the integrated environmental sensor 30 and the acoustic sensor 40 are both arranged in the containing cavity 11. Here, the package body 10 functions as a shell, so that the setting of the shell can be omitted, which is beneficial to further reduce the thickness of the combined sensor 100 and realize its miniaturization. At the same time, the influence of external signals on the environmental sensor 30 and the acoustic sensor 40 is also reduced, the introduction of noise is reduced, and the power consumption is reduced.

It should be noted that the existing combined sensor 100 has a housing, and its thickness is generally above 1 mm. However, since the combined sensor 100 of the present application does not need to be provided with a housing, its overall thickness can be controlled within 0.8 mm. The thickness of the combined sensor 100 of the application is effectively reduced.

In an embodiment of the present application, the accommodating cavity 11 includes a accommodating cavity 111, a second sub-accommodating cavity 112, a third sub-accommodating cavity 113, and a fourth sub-accommodating cavity 114 that are independent of each other. The sensor chip 31 is arranged in the accommodating cavity 111, the microphone chip 41 is arranged in the second sub-accommodating cavity 112, and the first integrated circuit chip 32 is arranged in the third sub-accommodating cavity 113 Inside, the second integrated circuit chip 42 is disposed in the fourth sub-accommodating cavity 114.

Here, the environment sensor chip 31, the microphone chip 41, the first integrated circuit chip 32, and the second integrated circuit chip 42 are arranged in zones, and are respectively arranged in the independent accommodating cavity 11, so that the effect of isolation and shielding can be achieved, thereby reducing The electromagnetic interference between the environmental sensor 30 and the acoustic sensor 40 reduces the introduction of noise.

In an embodiment of the present application, the environment sensor 30 is an air pressure sensor, and the cover plate 19 is also provided with a first through hole 191 communicating with the accommodating cavity 111. Here, the environmental sensor 30 is an air pressure sensor. Correspondingly, the environmental sensor chip 31 is a MEMS air pressure chip. The following description mainly takes an air pressure sensor as an example. The first through hole 191 is mainly used to sense the air pressure change of the external environment.

In an embodiment, the cover plate 19 is further provided with a second through hole 192 communicating with the second sub-chamber. Here, the second through hole 192 is mainly used for sensing and detecting external sound sources.

Please refer to FIG. 2 again. The thickness direction of the substrate 12 is defined as the up-down direction, the direction facing the cover plate 19 is the upward direction, and the direction away from the cover plate 19 is the downward direction. The following description shall prevail.

In an embodiment of the present application, the upper surface of the substrate 12 is provided with a first electrode layer 121, the upper surface of the first electrode layer 121 is provided with a first bonding structure 123; the lower surface of the cover plate 19 is provided with a second electrode The lower surface of the second electrode layer 193 is provided with a second bonding structure 194 corresponding to the first bonding structure 123; the first bonding structure 123 is bonded to the second bonding structure 194, and is connected to the substrate 12 and the cover plate 19 enclose together to form the accommodating cavity 11.

Here, both the first electrode layer 121 and the second electrode layer 193 are made of metal layers, such as a copper layer, and the first electrode layer 121 and the second electrode layer 193 are arranged opposite to each other. The first bonding structure 123 and the second bonding structure 194 are arranged oppositely, and one of the two may be a gold bonding structure, and the other of the two may be a tin bonding structure. In this way, the cover plate 19 and the substrate 12 pass through the gold-tin bonding structure. The package body 10 can be obtained, and the first bonding structure 123, the second bonding structure 194, the substrate 12, and the cover 19 are enclosed to form an accommodating cavity 11 for accommodating the environmental sensor 30 and the acoustic sensor 40.

It should be noted that the thickness of the first bonding structure 123 is generally controlled within a range of 0.4 mm-0.6 mm, which can help reduce the overall thickness of the combined sensor 100.

In an embodiment, in an embodiment of the present application, the upper surface of the first electrode layer 121 is further provided with a first insulating layer 124, and the upper surface of the first insulating layer 124 is provided with a conductive layer 125. The upper surface is provided with a second insulating layer 126; the combined sensor 100 further includes a first metal wiring 13, a second metal wiring 14, a third metal wiring 15 and a fourth metal wiring 16, the first metal wiring 13, The second metal trace 14, the third metal trace 15 and the fourth metal trace 16 all penetrate the upper and lower surfaces of the second insulating layer 126, and all electrically abut the conductive layer 125; the environmental sensor chip 31 is mounted on The upper surface of the second insulating layer 126 is electrically connected to the first metal trace 13; the microphone chip 41 is mounted on the upper surface of the second insulating layer 126 and is electrically connected to the second metal trace 14; The integrated circuit chip 32 is mounted on the upper surface of the second insulating layer 126 and is electrically connected to the third metal trace 15; the second integrated circuit chip 42 is mounted on the upper surface of the second insulating layer 126 and is electrically connected Connected to the fourth metal trace 16.

Specifically, the first insulating layer 124 and the second insulating layer 126 can be made of silicon material, and the conductive layer 125 is usually a copper layer. The upper surface of the second insulating layer 126 is provided with a first wiring hole 1261, a second wiring hole 1262, a third wiring hole 1263, and a fourth wiring hole 1264 penetrating the lower surface and exposing the conductive layer 125, each Correspondingly, a first metal trace 13, a second metal trace 14, a third metal trace 15 and a fourth metal trace 16 are provided in the trace hole, so that the lower end of each metal trace is electrically connected to the conductive layer 125 Abutting, and the upper end of each metal trace is exposed on the upper surface of the second insulating layer 126. The environmental sensor chip 31 is mounted on the upper surface of the second insulating layer 126 through die glue, and is electrically connected to the first metal trace 13 through a wire; the microphone chip 41 is mounted on the second insulating layer 126 through die glue The first integrated circuit chip 32 is mounted on the upper surface of the second insulating layer 126, and the lead at the bottom is electrically connected to the third metal wiring 15; The second integrated circuit chip 42 is mounted on the upper surface of the second insulating layer 126, and the lead at the bottom thereof is electrically connected to the fourth metal trace 16. In this way, the assembly of the environmental sensor 30 and the acoustic sensor 40 can be completed. Since the chips in the combined sensor 100 are electrically connected through the metal wires below, this can make the wire arrangement more regular and avoid mutual interference. , To ensure its safety. In addition, since each chip is distributed independently, it is unnecessary to open through holes for wiring, effectively avoiding mutual electromagnetic interference.

It can be understood that two conductive layers 125 are generally provided. One conductive layer 125 is correspondingly provided under the environmental sensor chip 31 and the first integrated circuit chip 32, and is electrically connected to the environmental sensor chip 31 and the first integrated circuit chip 32 through metal traces. An integrated circuit chip 32; another conductive layer 125 is correspondingly disposed under the microphone chip 41 and the second integrated circuit chip 42, and is electrically connected to the microphone chip 41 and the second integrated circuit chip 42 through metal traces. In this way, the electrical connection can be realized more effectively, and the length of the connecting wire is shorter, and the setting operation of the metal wiring is more convenient.

In an embodiment, the upper surface of the substrate 12 is further provided with a pad structure 122, the combined sensor 100 further includes a fifth metal wiring 17 and a sixth metal wiring 18, and a fifth metal wiring 17 and a sixth metal wiring 18 all penetrate the first insulating layer 124 and the second insulating layer 126 in sequence, and both electrically abut the pad structure 122. The end of the fifth metal trace 17 away from the pad structure 122 is electrically connected to the first insulating layer 124 and the second insulating layer 126. The integrated circuit chip 32, the end of the sixth metal trace 18 away from the pad structure 122 is electrically connected to the second integrated circuit chip 42; the lower surface of the substrate 12 is also provided with exposure holes corresponding to the pad structure 122 to expose the pads Structure 122.

Specifically, the material of the pad structure 122 is generally copper, and the second insulating layer 126 is provided with a fifth wiring hole 1265 and a sixth wiring hole 1266 corresponding to the upper surface of the pad structure 122, and the fifth wiring hole 1265 and The sixth wiring holes 1266 all penetrate the first insulating layer 124 and all expose the pad structure 122. The fifth metal wiring 17 and the sixth metal wiring 18 are distributed in the fifth wiring hole 1265 and the sixth wiring hole 1266, and the lower ends of the fifth metal wiring 17 and the sixth metal wiring 18 are electrically equal The upper ends of the bonding pad structure 122 are exposed on the upper surface of the second insulating layer 126, and the leads electrically connected to the bottoms of the first integrated circuit chip 32 and the second integrated circuit chip 42 are distributed. Correspondingly, the bottom surface of the substrate 12 is provided with exposure holes corresponding to the structure of the pad structure 122, so that the pad structure 122 is exposed, so that the electrostatic charge carried by the pad structure 122 can be quickly conducted away, and the antistatic ability of the combined sensor 100 is effectively improved. .

In an embodiment, the pad structure 122 is arranged corresponding to the first integrated circuit chip 32 and the second integrated circuit chip 42.

Here, the bonding pad structure 122 is correspondingly arranged under the first integrated circuit chip 32 and the second integrated circuit chip 42, which can more quickly export the electrostatic charge to the outside, and more effectively improve the antistatic ability of the combined sensor 100; at the same time, the metal The length of the trace is short, and the setting operation of the metal trace is more convenient.

The present application also proposes a manufacturing method of the combined sensor 100. Please refer to FIG. 5. In an embodiment of the manufacturing method of the combined sensor 100 of the present application, the manufacturing method of the combined sensor 100 includes the following steps:

Step S10, providing the base plate 12 and the cover plate 19;

Step S20, an environment sensor 30 and an acoustic sensor 40 are fabricated on the upper surface of the substrate 12. The environment sensor 30 includes an environment sensor chip 31 and a first integrated circuit chip 32 electrically connected to the environment sensor chip 31, and the acoustic sensor 40 Including a microphone chip 41 and a second integrated circuit chip 42 electrically connected to the microphone chip 41;

Step S30, bonding the cover plate 19 to the base plate 12 to enclose and form an accommodating cavity 11, and the environmental sensor 30 and the acoustic sensor 40 are both located in the accommodating cavity 11.

Specifically, the package body 10 with the accommodating cavity 11 is first produced by the packaging method. The packaging method usually adopts the packaging method of gold-tin bonding. Of course, other reasonable and effective packaging methods can also be used. Afterwards, the environmental sensor 30 and the acoustic sensor 40 are manufactured in the accommodating cavity 11. During the manufacturing, the environmental sensor 30 and the acoustic sensor 40 are integrated on the chip, and electrical connections are realized in the chip, which can reduce the impact of external signals on the environmental sensor. The influence of 30 and the acoustic sensor 40 reduces the introduction of noise and reduces power consumption. Since the integrated environment sensor 30 and the acoustic sensor 40 are both located in the accommodating cavity 11 of the package body 10, the manufacture of the shell can be omitted, which is beneficial to further reduce the thickness of the combined sensor 100 and realize its miniaturization.

Please refer to FIG. 6, FIG. 2, and FIG. 10 to FIG. 15. In an embodiment of the present application, before step S20, the method further includes:

Step S11, forming a first electrode layer 121 on the upper surface of the substrate 12;

Step S12, forming a first bonding structure 123 on the upper surface of the first electrode layer 121;

Step S13, forming a second electrode layer 193 on the lower surface of the cover plate 19, and forming a second bonding structure 194 on the lower surface of the second electrode layer 193;

Correspondingly, step S30 includes

In step S30a, the first bonding structure 123 of the substrate 12 is aligned with the second bonding structure 194 of the cover 19 to perform bonding and packaging, and the package body 10 is obtained.

Specifically, here, both the substrate 12 and the cover plate 19 can adopt a silicon substrate 12, and both the first electrode layer 121 and the second electrode layer 193 can adopt a copper layer, and they are arranged opposite to each other. During production, a copper layer is first deposited on the upper surface of the substrate 12, and a dielectric material layer is pressed on the upper surface of the copper layer. The dielectric material layer is an insulating layer. Then, a light etching process is used to etch away part of the dielectric material layer and etched. The copper layer is etched, and then the dielectric material layer is removed to obtain the first electrode layer 121. The second electrode layer 193 is fabricated on the lower surface of the cover plate 19 in the same way. The first bonding structure 123 and the second bonding structure are arranged correspondingly, and one of the two is a gold bonding structure, and the other of the two is a tin bonding structure. Finally, the first bonding structure 123 is aligned with the second bonding structure 194, and the first bonding structure 123 and the second bonding structure 194 are adhesively bonded together by pressing and heating to obtain the package.体10。 Body 10. It can be understood that after the manufacturing is completed, the first bonding structure 123, the second bonding structure 194, the substrate 12 and the cover 19 are formed into the accommodating cavity 11 of the package body 10.

Please refer to Figure 7 and Figure 13, after step S11, it also includes:

Step S111, depositing a first insulating layer 124 on the upper surface of the first electrode layer 121, and forming a conductive layer 125 on the upper surface of the first insulating layer 124;

In step S112, a second insulating layer 126 is deposited on the upper surface of the conductive layer 125, and the second insulating layer 126 is etched to obtain a first via hole and a second wiring hole 1262 that expose the conductive layer 125. The third wiring hole 1263 and the fourth wiring hole 1264;

Step S113, electroplating the first metal wiring 13 and the fourth wiring hole 1264 in the first wiring hole 1261, the second wiring hole 1262, the third wiring hole 1263, and the fourth wiring hole 1264. The second metal trace 14, the third metal trace 15, and the fourth metal trace 16;

Correspondingly, please refer to FIG. 18. Step S20 includes:

Step S21: Mount the environmental sensor chip 31, the microphone chip 41, the first integrated circuit chip 32, and the second integrated circuit chip 42 on the upper surface of the second insulating layer 126, and The environment sensor chip 31 and the first metal wiring 13 are electrically connected through wires, the microphone chip 41 and the second metal wiring 14 are electrically connected through wires, and the first The integrated circuit chip 32 is electrically connected to the third metal trace 15; the second integrated circuit chip 42 is electrically connected to the fourth metal trace 16.

Here, both the first insulating layer 124 and the second insulating layer 126 can be made of silicon-based materials, and the conductive layer 125 can be a copper layer. The first via, the second via 1262, the third via 1263, and the fourth The holes 1264 are obtained by etching the second insulating layer 126 using a light etching process, and all expose the conductive layer 125 below. The first metal trace 13, the second metal trace 14, the third metal trace 15 and the fourth metal trace 16 can be made of copper or tin, and their lower ends are electrically contacted with the conductive layer below. 125. The upper ends are all exposed on the upper surface of the second insulating layer 126 for electrically connecting the air pressure sensor and the microphone sensor. When manufacturing the environmental sensor 30 and the acoustic sensor 40, the lower surfaces of the environmental sensor chip 31 and the microphone chip 41 are firstly dispensed to produce a chip glue, and then the upper surface of the second insulating layer 126 is pasted using a patch process. The environment sensor chip 31 is mounted, and the WB wire bonding process is performed, and the environment sensor chip 31 is electrically connected to the upper end of the first metal trace 13 through a wire; the same method is used to paste on the upper surface of the second insulating layer 126 Upper microphone chip 41, and electrically connect the microphone chip 41 to the upper end of the second metal trace 14 through a wire; then, perform the process on the upper surface of the second insulating layer 126 corresponding to the third metal trace 15 and the fourth metal trace 16 The first integrated circuit chip 32 and the second integrated circuit chip 42 are mounted and heated to realize the first integrated circuit chip 32, the second integrated circuit chip 42 and the third metal trace 15 and the fourth metal trace 16's electrical conduction. In this way, the mounting operation of the environmental sensor 30 and the acoustic sensor 40 can be completed. Since the chips in the combined sensor 100 are electrically connected through the metal wires below, this can make the wire arrangement more regular and avoid mutual interference. Interference occurs between them, ensuring its safety. In addition, since each chip is distributed independently, it is unnecessary to open through holes for wiring, effectively avoiding mutual electromagnetic interference.

In an embodiment, referring to FIG. 8 and FIG. 14, after step S111, the method further includes:

Step S114, an electroplating area 1241 exposing the first electrode layer 121 is opened on the upper surface of the first insulating layer 124;

In step S115, a photoresist structure 127 is fabricated on the upper surface of the first insulating layer 124. The photoresist structure 127 is provided with a photolithography hole 1271, and the photoresist hole 1271 corresponds to and is connected to the electroplating area 1241. Pass.

Correspondingly, step S12 includes:

In step S12a, a first bonding structure 123 is fabricated in the electroplating area 1241 and the photolithography hole 1271, and the insulating glue layer inside the first bonding structure 123 is removed.

Specifically, the first insulating layer 124 is etched by a light etching process to obtain the electroplating area 1241 where the first electrode layer 121 is exposed. The photoresist layer is leveled on the upper surface of the first insulating layer 124 to serve as the protective area of the non-electroplating first bonding structure 123 area, and the photoresist layer is photoetched by the overetching process to obtain a photoresist layer with photoetching holes 1271 The photoresist structure 127, wherein the photoetching hole 1271 corresponds to and communicates with the plating area 1241 below. After the photoetching hole 1271 and the electroplating area 1241 are electroplated with gold (or tin), and the inner photoresist structure 127 is removed, the first bonding structure 123 and the outer photoresist can be fabricated. The photoresist is mainly Play a role in shielding external interference.

It should be noted that the thickness of the photoresist structure 127 is generally controlled within a range of 0.5 mm-0.8 mm, which can help reduce the overall thickness of the combined sensor 100.

In an embodiment, please refer to FIG. 9 and FIG. 11 to FIG. 18. After step S11, the method further includes:

Step S11a, forming a pad structure 122 on the upper surface of the substrate 12.

In step S11b, etching is performed on the lower surface of the substrate 12 corresponding to the pad structure 122 to expose the pad structure 122.

Specifically, the manufacturing method of the pad structure 122 can refer to the manufacturing method of the first electrode layer 121 described above, that is, a copper layer is deposited on the upper surface of the substrate 12, and a dielectric material layer is pressed on the upper surface of the copper layer. It is an insulating layer. Afterwards, a part of the dielectric material layer is etched by a light etching process, and the copper layer is etched, and then the dielectric material layer is removed, and the first electrode layer 121 and the pad structure 122 can be obtained at the same time. Afterwards, the lower surface of the substrate 12 is etched by a light etching process to etch out the outer pad area of the exposed pad structure 122, which is used to connect external parts.

Correspondingly, please refer to FIG. 9 and FIG. 16 to FIG. 18. After step S112, the method further includes:

Step S112a, etching the upper surface of the second insulating layer 126 to obtain a fifth wiring hole 1265 and a sixth wiring hole 1266 that penetrate the first insulating layer 124 and expose the pad structure 122;

Step S112b, forming a fifth metal wiring 17 and a sixth metal wiring 18 in the fifth wiring hole 1265 and the sixth wiring hole 1266, respectively.

Specifically, the upper surface of the second insulating layer 126 is etched using a light etching process to obtain the fifth wiring hole 1265 and the sixth wiring hole 1266 that penetrate the first insulating layer 124 and expose the pad structure 122, and then The fifth wire hole 1265 and the sixth wire hole 1266 are electroplated to obtain the fifth metal wire 17 and the sixth metal wire 18 respectively. It can be understood that the fifth metal wiring 17 and the sixth metal wiring 18 are both provided corresponding to the first integrated circuit chip 32 and the second integrated circuit chip 42, and both penetrate the first insulating layer 124 and the second insulating layer 126. The lower ends are electrically contacted with the bonding pad structure 122, and the upper ends are exposed on the upper surface of the second insulating layer 126 for electrically connecting the first integrated circuit chip 32 and the second integrated circuit chip 42.

Correspondingly, after step S21, it further includes:

Step S22, electrically connecting the first integrated circuit chip 32 and the fifth metal wiring 17; electrically connecting the second integrated circuit chip 42 and the sixth metal wiring 18.

After the first integrated circuit chip 32 and the second integrated circuit chip 42 are mounted and heated, the upper ends of the fifth metal trace 17 and the sixth metal trace 18 are respectively connected to the first integrated circuit chip 32 and the second integrated circuit chip 32 and the second integrated circuit chip. The integrated circuit chip 42 is electrically conductive. In this way, the electric charge carried by static electricity can be quickly conducted away through the pad structure 122, and the antistatic ability of the combined sensor 100 can be effectively improved.

In an embodiment, in an embodiment of the present application, the accommodating cavity 11 includes a accommodating cavity 111, a second sub-accommodating cavity 112, a third sub-accommodating cavity 113, and a fourth sub-accommodating cavity that are independent of each other. Set cavity 114; Step S20 includes:

The environmental sensor chips 31, 31 are mounted in the accommodating cavity 111, the second sub accommodating cavity 112, the third sub accommodating cavity 113, and the fourth sub accommodating cavity 114, respectively. The microphone chip 41, the first integrated circuit chip 32, and the second integrated circuit chip 42.

When the package body 10 is manufactured, the first bonding structure 123, the second bonding structure 194, the substrate 12, and the cover 19 are jointly enclosed to form a mutually independent accommodating cavity 111, a second sub-accommodating cavity 112, and a third sub-accommodating cavity. The sub-accommodating cavity 113 and the fourth sub-accommodating cavity 114. The environment sensor chip 31, the microphone chip 41, the first integrated circuit chip 32 and the second integrated circuit chip 42 are arranged in partitions, and are respectively arranged in the independent accommodating cavity 11, so that the effect of isolation and shielding can be achieved, thereby reducing the environment. The electromagnetic interference between the sensor 30 and the acoustic sensor 40 reduces the introduction of noise.

In an embodiment, in an embodiment of the present application, the environmental sensor 30 is an air pressure sensor, and after step S20, the method further includes:

A first through hole 191 and a second through hole 192 are opened on the surface of the package body 10, the first through hole 191 communicates with the accommodating cavity 111, and the second through hole 192 communicates with the second sub-container.置cavity 112.

Here, the first through hole 191 is mainly opened on the top of the package body 10 and communicated with the accommodating cavity 111 for sensing the air pressure change of the external environment. The second through hole 192 is generally opened on the top of the package body 10 and communicated with the second sub-cavity for sensing and detecting external sound sources.

The present application also proposes an electronic device that includes the combined sensor 100 as described above, and the specific structure of the combined sensor 100 refers to the foregoing embodiment. Since all the technical solutions of all the foregoing embodiments are adopted, it has at least all the beneficial effects brought about by the technical solutions of the foregoing embodiments, which will not be repeated here.

It should be noted that the electronic devices are generally mobile phones, watches, earphones, bracelets, etc., and the combined sensor 100 is generally installed in the housing of the electronic device, so that the electronic device can achieve more functions.

The above are only the preferred embodiments of this application, and do not limit the scope of this application. Under the application concept of this application, equivalent structural transformations made by using the content of the specification and drawings of this application, or direct/indirect use Other related technical fields are included in the scope of patent protection of this application.

Claims (15)

A combined sensor, which includes: A package body, the package body includes a substrate and a cover plate, the substrate and the cover plate are bonded and connected by a bonding structure, and are enclosed to form a accommodating cavity; An environmental sensor, the environmental sensor includes an environmental sensor chip and a first integrated circuit chip electrically connected to the environmental sensor chip, the environmental sensor chip and the first integrated circuit chip are both provided in the container Placed in the cavity; and An acoustic sensor. The acoustic sensor includes a microphone chip and a second integrated circuit chip electrically connected to the microphone chip, and both the microphone chip and the second integrated circuit chip are arranged in the accommodating cavity. The combination sensor of claim 1, wherein the accommodating cavity includes a first sub-accommodating cavity, a second sub-accommodating cavity, a third sub-accommodating cavity, and a fourth sub-accommodating cavity that are independent of each other, so The environment sensor chip is disposed in the first sub-accommodating cavity, the microphone chip is disposed in the second sub-accommodating cavity, and the first integrated circuit chip is disposed in the third sub-accommodating cavity Inside, the second integrated circuit chip is arranged in the fourth sub-accommodating cavity. The combined sensor according to claim 2, wherein the environmental sensor is an air pressure sensor, and the cover plate is further provided with a first through hole communicating with the first sub-accommodating cavity; And/or, the cover plate is further provided with a second through hole communicating with the second sub-accommodating cavity. The combination sensor according to any one of claims 1 to 3, wherein the thickness direction of the substrate is defined as the up-down direction, the direction facing the cover plate is the upward direction, and the direction facing away from the cover plate is defined as In the downward direction, a first electrode layer is provided on the upper surface of the substrate, and a first bonding structure is provided on the upper surface of the first electrode layer; A second electrode layer is provided on the lower surface of the cover plate, and a second bonding structure corresponding to the first bonding structure is provided on the lower surface of the second electrode layer; The first bonding structure is bonded to the second bonding structure, and is enclosed with the substrate and the cover plate to form the accommodating cavity. The combination sensor according to claim 4, wherein the upper surface of the first electrode layer is further provided with a first insulating layer, the upper surface of the first insulating layer is provided with a conductive layer, and the upper surface of the conductive layer Provided with a second insulating layer; The combined sensor further includes a first metal trace, a second metal trace, a third metal trace, and a fourth metal trace. The first metal trace, the second metal trace, and the third metal trace The metal wiring and the fourth metal wiring both penetrate the upper and lower surfaces of the second insulating layer, and both electrically abut the conductive layer; The environmental sensor chip is mounted on the upper surface of the second insulating layer, and is electrically connected to the first metal trace; The microphone chip is mounted on the upper surface of the second insulating layer and is electrically connected to the second metal trace; The first integrated circuit chip is mounted on the upper surface of the second insulating layer and electrically connected to the third metal trace; The second integrated circuit chip is mounted on the upper surface of the second insulating layer and is electrically connected to the fourth metal trace. The combined sensor according to claim 5, wherein the upper surface of the substrate is further provided with a pad structure, the combined sensor further comprises a fifth metal trace and a sixth metal trace, the fifth metal trace Both the sixth metal trace and the sixth metal trace sequentially penetrate the first insulating layer and the second insulation layer, and both electrically abut the pad structure, and the fifth metal trace faces away from the pad The end of the structure is electrically connected to the first integrated circuit chip, and the end of the sixth metal trace away from the pad structure is electrically connected to the second integrated circuit chip; The bottom surface of the substrate is further provided with exposure holes corresponding to the pad structure to expose the pad structure. 7. The combined sensor of claim 6, wherein the pad structure is arranged corresponding to the first integrated circuit chip and the second integrated circuit chip. A manufacturing method of a combined sensor, wherein the manufacturing method of the combined sensor includes the following steps: Provide base plate and cover plate; An environmental sensor and an acoustic sensor are fabricated on the upper surface of the substrate. The environmental sensor includes an environmental sensor chip and a first integrated circuit chip electrically connected to the environmental sensor chip. The acoustic sensor includes a microphone chip and A second integrated circuit chip electrically connected to the microphone chip; The cover plate is connected to the substrate by bonding to form a package with a containing cavity, and the environmental sensor and the acoustic sensor are both located in the containing cavity. 8. The method for manufacturing a combined sensor according to claim 8, wherein before the step of manufacturing an environmental sensor and an acoustic sensor on the upper surface of the substrate, the method comprises: Fabricating a first electrode layer on the upper surface of the substrate; Fabricating a first bonding structure on the upper surface of the first electrode layer; Fabricating a second electrode layer on the bottom surface of the cover plate, and fabricating a second bonding structure on the bottom surface of the second electrode layer; The step of bonding the cover plate to the substrate includes: Aligning the first bonding structure of the substrate with the second bonding structure of the cover plate to perform bonding and packaging. 9. The manufacturing method of the combined sensor according to claim 9, wherein after the step of manufacturing the first electrode layer on the upper surface of the substrate, the method further comprises: Depositing a first insulating layer on the upper surface of the first electrode layer, and fabricating a conductive layer on the upper surface of the first insulating layer; A second insulating layer is deposited on the upper surface of the conductive layer, and the second insulating layer is etched to obtain a first via hole, a second wire hole, a third wire hole, and a fourth wire hole that expose the conductive layer. Wire hole The first metal trace, the second metal trace, and the third metal trace are electroplated in the first trace hole, the second trace hole, the third trace hole, and the fourth trace hole, respectively. Metal trace and the fourth metal trace; The step of fabricating an environmental sensor and an acoustic sensor on the upper surface of the substrate includes: Mount the environment sensor chip, the microphone chip, the first integrated circuit chip, and the second integrated circuit chip on the upper surface of the second insulating layer, and connect the environment sensor chip with The first metal trace is electrically connected through a wire, the microphone chip and the second metal trace are electrically connected through a wire, and the first integrated circuit chip is electrically connected to the third metal trace. Sexual connection; electrically connecting the second integrated circuit chip and the fourth metal trace. The method of manufacturing a composite sensor according to claim 10, wherein after the step of depositing a first insulating layer on the upper surface of the first electrode layer and forming a conductive layer on the upper surface of the first insulating layer, further include: An electroplating area exposing the first electrode layer is opened on the upper surface of the first insulating layer; Fabricating a photoresist structure on the upper surface of the first insulating layer, the photoresist structure is provided with a photoetching hole, and the photoetching hole corresponds to and communicates with the electroplating area; The step of fabricating a first bonding structure on the upper surface of the first electrode layer includes: A first bonding structure is fabricated in the electroplating area and the photoetching hole, and the insulating glue layer inside the first bonding structure is removed. 10. The method of manufacturing a combined sensor according to claim 10, wherein after the step of fabricating the first electrode layer on the upper surface of the substrate, the method further comprises: Fabricating a pad structure on the upper surface of the substrate; Etching the bottom surface of the substrate corresponding to the pad structure to expose the pad structure; A second insulating layer is deposited on the upper surface of the conductive layer, and the second insulating layer is etched to obtain a first via hole, a second wire hole, a third wire hole, and a fourth wire hole that expose the conductive layer. After the steps of routing holes, it also includes: Etching the upper surface of the second insulating layer to obtain a fifth wiring hole and a sixth wiring hole that penetrate the first insulating layer and expose the pad structure; Making a fifth metal wiring and a sixth metal wiring in the fifth wiring hole and the sixth wiring hole respectively; The step of fabricating an environmental sensor and an acoustic sensor on the upper surface of the substrate further includes: The first integrated circuit chip is electrically connected with the fifth metal trace; the second integrated circuit chip is electrically connected with the sixth metal trace. The method for manufacturing a combined sensor according to any one of claims 8 to 12, wherein the accommodating cavity includes a first sub-accommodating cavity, a second sub-accommodating cavity, and a third sub-accommodating cavity that are independent of each other And the fourth sub-accommodating cavity; The step of fabricating an environmental sensor and an acoustic sensor on the upper surface of the substrate includes: Respectively in the surface mount environment where the substrate is located in the first sub-accommodating cavity, the second sub-accommodating cavity, the third sub-accommodating cavity, and the fourth sub-accommodating cavity Sensor chip, microphone chip, first integrated circuit chip and second integrated circuit chip. The method for manufacturing a combined sensor according to claim 13, wherein the environmental sensor is an air pressure sensor, and after the step of bonding and connecting the cover plate to the substrate, the method further comprises: A first through hole and a second through hole are opened on the surface of the cover plate, the first through hole communicates with the first sub-accommodating cavity, and the second through hole communicates with the second sub-accommodating cavity. An electronic device, wherein the electronic device comprises the combined sensor according to any one of claims 1 to 7.