CN211504517U - Combined sensor and electronic device - Google Patents

Abstract

The utility model discloses a combination sensor and electronic equipment. Wherein the combination sensor includes: the packaging body comprises a substrate and a cover plate, wherein the substrate and the cover plate are in bonding connection through a bonding structure and enclose to form an accommodating cavity; the environment sensor comprises an environment sensing chip and a first integrated circuit chip which is electrically connected with the environment sensing chip, and the environment sensing chip and the first integrated circuit chip are both arranged in the accommodating cavity; and the acoustic sensor comprises a microphone chip and a second integrated circuit chip electrically connected with the microphone chip, and the microphone chip and the second integrated circuit chip are arranged in the accommodating cavity. The technical scheme of the utility model can effectively reduce the thickness of combination sensor, realize combination sensor's miniaturization.

Description

Combined sensor and electronic device

Technical Field

The utility model relates to a sensor technical field, in particular to combination sensor and electronic equipment.

Background

With the trend of "light, thin, short, and small" of consumer electronics products such as mobile phones, watches, and earphones, the development direction of the core component sensor is also toward miniaturization and integration. The environment sensor (such as an air pressure sensor) and the acoustic sensor (such as a microphone sensor) are standard matching devices of such electronic products, and the environment sensor and the acoustic sensor are integrated and packaged into a combined sensor, so that more information can be collected, and more functions can be realized. However, at present, this kind of combined sensor usually adopts an independent housing package form, because the package scheme that adopts an independent housing therefore needs the height of the housing to be greater than the sum of the thickness of the chip and the thickness of the package substrate, but this increases the overall thickness of the combined sensor, which is not favorable for realizing its miniaturization.

The above is only for the purpose of assisting understanding of the technical solutions of the present invention, and does not represent an admission that the above is the prior art.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a combination sensor and electronic equipment aims at effectively reducing combination sensor's thickness, realizes combination sensor's miniaturization.

In order to achieve the above object, the present invention provides a combination sensor, including: the packaging body comprises a substrate and a cover plate, wherein the substrate and the cover plate are in bonding connection through a bonding structure and enclose to form an accommodating cavity; the environment sensor comprises an environment sensing chip and a first integrated circuit chip which is electrically connected with the environment sensing chip, and the environment sensing chip and the first integrated circuit chip are both arranged in the accommodating cavity; and the acoustic sensor comprises a microphone chip and a second integrated circuit chip electrically connected with the microphone chip, and the microphone chip and the second integrated circuit chip are arranged in the accommodating cavity.

Optionally, the accommodating cavity includes a first sub-accommodating cavity, a second sub-accommodating cavity, a third sub-accommodating cavity and a fourth sub-accommodating cavity that are independent of each other, the environment sensing chip is disposed in the first sub-accommodating cavity, the microphone chip is disposed in the second sub-accommodating cavity, the first integrated circuit chip is disposed in the third sub-accommodating cavity, and the second integrated circuit chip is disposed in the fourth sub-accommodating cavity.

Optionally, the environmental sensor is an air pressure sensor, and the cover plate is further provided with a first through hole communicated with the first sub-accommodating cavity; and/or the cover plate is also provided with a second through hole communicated with the second sub-accommodating cavity.

Optionally, defining a thickness direction of the substrate as an up-down direction, a direction toward the cover plate as an up direction, and a direction away from the cover plate as a down direction, where an upper surface of the substrate is provided with a first electrode layer, and an upper surface of the first electrode layer is provided with a first bonding structure; a second electrode layer is arranged on the lower surface of the cover plate, and a second bonding structure corresponding to the first bonding structure is arranged on the lower surface of the second electrode layer; the first bonding structure is bonded with the second bonding structure and surrounds the substrate and the cover plate together to form the accommodating cavity.

Optionally, the first bonding structure has a thickness in a range of 0.4mm to 0.6 mm.

One of the first bonding structure and the second bonding structure is a gold bonding structure, and the other is a tin bonding structure.

Optionally, a first insulating layer is further disposed on an upper surface of the first electrode layer, a conductive layer is disposed on an upper surface of the first insulating layer, and a second insulating layer is disposed on an upper surface of the conductive layer; the combined sensor also comprises a first metal wire, a second metal wire, a third metal wire and a fourth metal wire, wherein the first metal wire, the second metal wire, the third metal wire and the fourth metal wire penetrate through the upper surface and the lower surface of the second insulating layer and are electrically abutted with the conductive layer; the environment sensing chip is attached to the upper surface of the second insulating layer and is electrically connected to the first metal wiring; the microphone chip is attached to the upper surface of the second insulating layer and is electrically connected to the second metal wire; the first integrated circuit chip is attached to the upper surface of the second insulating layer and is electrically connected to the third metal routing; the second integrated circuit chip is attached to the upper surface of the second insulating layer and is electrically connected to the fourth metal routing.

Optionally, a pad structure is further disposed on the upper surface of the substrate, the combination sensor further includes a fifth metal trace and a sixth metal trace, the fifth metal trace and the sixth metal trace both sequentially penetrate through the first insulating layer and the second insulating layer and are electrically abutted to the pad structure, an end of the fifth metal trace departing from the pad structure is electrically connected to the first integrated circuit chip, and an end of the sixth metal trace departing from the pad structure is electrically connected to the second integrated circuit chip; the lower surface of the substrate is also provided with exposure holes corresponding to the pad structures so as to expose the pad structures.

Optionally, the pad structure is disposed corresponding to the first integrated circuit chip and the second integrated circuit chip.

The utility model also provides an electronic equipment, electronic equipment includes the combination sensor, the combination sensor includes: the packaging body comprises a substrate and a cover plate, wherein the substrate and the cover plate are in bonding connection through a bonding structure and enclose to form an accommodating cavity; the environment sensor comprises an environment sensing chip and a first integrated circuit chip which is electrically connected with the environment sensing chip, and the environment sensing chip and the first integrated circuit chip are both arranged in the accommodating cavity; and the acoustic sensor comprises a microphone chip and a second integrated circuit chip electrically connected with the microphone chip, and the microphone chip and the second integrated circuit chip are arranged in the accommodating cavity.

The technical scheme of the utility model, through integrated on the chip with environmental sensor and acoustic sensor, paste the dress with the chip on the surface of base plate to realize electric connection in the chip, adopt the bonded structure to lap the bonded connection behind the base plate, just enclosed and closed the packaging body that has the holding chamber, environmental sensor and acoustic sensor after the integration all set up in this holding intracavity. The packaging body is equivalent to the shell, so that the shell can be omitted, the thickness of the combined sensor can be further reduced, and the miniaturization of the combined sensor can be realized. Meanwhile, the influence of external signals on the environment sensor and the acoustic sensor is reduced, the introduction of noise is reduced, and the power consumption is reduced.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

FIG. 1 is a schematic diagram of an internal structure of an embodiment of the composite sensor of the present invention;

FIG. 2 is a schematic cross-sectional view of a combi sensor;

FIG. 3 is a schematic view of a perspective structure of the combinational sensor;

FIG. 4 is a schematic view of a combined sensor from another perspective;

FIG. 5 is a schematic flow chart illustrating steps of a method for manufacturing a combo sensor according to an embodiment of the present invention;

FIG. 6 is a flowchart illustrating an embodiment of step S10 in FIG. 5;

FIG. 7 is a schematic flow chart illustrating steps of another embodiment of a method for fabricating the combi sensor of FIG. 5;

FIG. 8 is a flowchart illustrating another embodiment of step S10 in FIG. 5;

FIG. 9 is a schematic flow chart illustrating steps of another embodiment of a method for fabricating the combi sensor of FIG. 5;

fig. 10 is a schematic structural diagram after step S13 in fig. 6;

FIG. 11 is a schematic diagram of the middle structure of step S11 in FIG. 7;

fig. 12 is a schematic structural diagram after step S11 in fig. 7;

fig. 13 is a schematic structural diagram after step S111 in fig. 7;

fig. 14 is a schematic structural diagram after step S115 in fig. 8;

fig. 15 is a schematic structural diagram after step S12a in fig. 8.

Fig. 16 is a schematic structural diagram after step S112a in fig. 9;

fig. 17 is a schematic structural diagram after step S113 and step S112b in fig. 9;

fig. 18 is a schematic structural diagram after step S22 in fig. 9.

The reference numbers illustrate:

the objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.

In addition, descriptions in the present application as to "first", "second", and the like are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present application, unless expressly stated or limited otherwise, the terms "connected" and "fixed" are to be construed broadly, e.g., "fixed" may be fixedly connected or detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In addition, the technical solutions between the embodiments of the present invention can be combined with each other, but it is necessary to be able to be realized by a person having ordinary skill in the art as a basis, and when the technical solutions are contradictory or cannot be realized, the combination of such technical solutions should be considered to be absent, and is not within the protection scope of the present invention.

The utility model provides a combined sensor 100.

Referring to fig. 1 to 4, in an embodiment of the combination sensor 100 of the present invention, the combination sensor 100 includes: the packaging structure comprises a packaging body 10, wherein the packaging body 10 comprises a substrate 12 and a cover plate 19, and the cover plate 19 is in bonding connection with the substrate 12 through a bonding structure and encloses to form an accommodating cavity 11; the environment sensor 30, the environment sensor 30 includes an environment sensing chip 31 and a first integrated circuit chip 32 electrically connected to the environment sensing chip 31, and the environment sensing chip 31 and the first integrated circuit chip 32 are both disposed in the accommodating cavity 11; and the acoustic sensor 40, the acoustic sensor 40 includes a microphone chip 41 and a second integrated circuit chip 42 electrically connected to the microphone chip 41, and the microphone chip 41 and the second integrated circuit chip 42 are both disposed in the accommodating cavity 11.

Specifically, the substrate 12 and the cover plate 19 are made of an insulating material, such as the silicon substrate 12; the two are connected in a bonding structure, wherein the bonding structure can be a gold-tin bonding structure, and the two are bonded and connected to form the accommodating cavity 11. The environmental sensor 30 and the acoustic sensor 40 are integrated on a chip, and are electrically connected in the chip, so that the influence of external signals on the environmental sensor 30 and the acoustic sensor 40 is reduced, the introduction of noise is reduced, and the power consumption is reduced. And the integrated environmental sensor 30 and acoustic sensor 40 are attached to the upper surface of the substrate 12 and are both disposed in the accommodating cavity 11, so that the arrangement of the housing can be omitted, which is beneficial to further reducing the thickness of the combined sensor 100, thereby realizing miniaturization thereof. Here, the environment sensing chip 31 and the microphone chip 41 are MEMS chips, wherein the environment sensor 30 may be an air pressure sensor, a temperature sensor, a humidity sensor or an optical sensor, the corresponding environment sensing chip 31 may be an air pressure sensing chip, a temperature sensing chip, a humidity sensing chip or an optical sensing chip for sensing various parameter changes of the external environment, and a first integrated circuit (ASIC) chip is used for processing a signal output by the environment sensing chip 31, so that the environment sensor 30 has a function of detecting changes of the external environment. The microphone chip 41 of the acoustic sensor 40 is typically made of monocrystalline silicon, polycrystalline silicon, or other silicon nitride materials, and is used for sensing and detecting a sound source, and converting a sound signal into an electrical signal for transmission, and the second integrated circuit chip 42 is used for processing a signal output by the microphone chip 41 and providing a voltage for the microphone chip 41, so that the acoustic sensor 40 provides an acoustic function for the electronic device.

It should be noted that an insulating glue layer is disposed on the periphery of the first bonding structure 123 and the second bonding structure 194 to shield external electromagnetic interference. The installation positions of the environment sensing chip 31, the microphone chip 41, the first integrated circuit chip 32 and the second integrated circuit chip 42 can be as shown in fig. 1, and naturally, the installation positions can be interchanged or other installation modes are all within the protection scope of the present invention.

Therefore, can understand, the technical scheme of the utility model, through integrating environmental sensor 30 and acoustic sensor 40 on the chip, paste the chip on the surface of base plate 12 to realize electric connection in the chip, adopt the bonded structure to connect apron 19 bonding in base plate 12 back, just enclosed and closed the packaging body 10 that has holding chamber 11, environmental sensor 30 and acoustic sensor 40 after the integration all set up in this holding chamber 11. Here, the package 10 functions as a housing, so that the provision of the housing can be omitted, which is advantageous for further reducing the thickness of the combination sensor 100 and realizing miniaturization thereof. Meanwhile, the influence of external signals on the environmental sensor 30 and the acoustic sensor 40 is reduced, noise introduction is reduced, and power consumption is reduced.

It should be noted that, the thickness of the existing combinational sensor 100 is generally above 1mm due to the existence of the housing, and the utility model discloses a combinational sensor 100, owing to need not set up the housing, then its whole thickness can be controlled within 0.8mm, so the utility model discloses a thickness of combinational sensor 100 has been reduced effectively.

In an embodiment of the present invention, the accommodating chamber 11 includes an accommodating chamber 111, a second sub-accommodating chamber 112, a third sub-accommodating chamber 113 and a fourth sub-accommodating chamber 114 that are independent of each other, the environment sensing chip 31 is disposed in the accommodating chamber 111, the microphone chip 41 is disposed in the second sub-accommodating chamber 112, the first integrated circuit chip 32 is disposed in the third sub-accommodating chamber 113, and the second integrated circuit chip 42 is disposed in the fourth sub-accommodating chamber 114.

Here, the environmental sensor chip 31, the microphone chip 41, the first integrated circuit chip 32 and the second integrated circuit chip 42 are arranged in a partitioned manner and are respectively arranged in the independent accommodating cavities 11, so that the effects of isolation and shielding can be achieved, the electromagnetic interference between the environmental sensor 30 and the acoustic sensor 40 is reduced, and the introduction of noise is reduced.

In an embodiment of the present invention, the environmental sensor 30 is an air pressure sensor, and the cover plate 19 further has a first through hole 191 communicating with the accommodating cavity 111. Here, the environmental sensor 30 is an air pressure sensor, and correspondingly, the environmental sensor chip 31 is an MEMS air pressure chip, and the air pressure sensor is mainly described as an example below. The first through hole 191 is mainly used to sense the air pressure change of the external environment.

Further, the cover plate 19 is further opened with a second through hole 192 communicating with the second sub-cavity. Here, the second through hole 192 is mainly used to sense and detect an external sound source.

Referring to fig. 2 again, the thickness direction of the substrate 12 is defined as the up-down direction, the direction toward the cover plate 19 is the up direction, and the direction away from the cover plate 19 is the down direction.

In an embodiment of the present invention, the upper surface of the substrate 12 is provided with a first electrode layer 121, and the upper surface of the first electrode layer 121 is provided with a first bonding structure 123; the lower surface of the cover plate 19 is provided with a second electrode layer 193, and the lower surface of the second electrode layer 193 is provided with a second bonding structure 194 corresponding to the first bonding structure 123; the first bonding structure 123 is bonded to the second bonding structure 194, and encloses the accommodating cavity 11 together with the substrate 12 and the cover plate 19.

Here, the first electrode layer 121 and the second electrode layer 193 are both made of a metal layer, such as a copper layer, and the first electrode layer 121 and the second electrode layer 193 are disposed opposite to each other. The first bonding structure 123 and the second bonding structure 194 are disposed opposite to each other, one of the two bonding structures may be a gold bonding structure, and the other bonding structure is a tin bonding structure, so that the package 10 can be obtained by the cover plate 19 and the substrate 12 through the gold-tin bonding structure, and the first bonding structure 123, the second bonding structure 194, the substrate 12 and the cover plate 19 enclose to form an accommodating cavity 11 for accommodating the environmental sensor 30 and the acoustic sensor 40.

Optionally, the thickness of the first bonding structure 123 ranges from 0.4mm to 0.6 mm. The thickness of the first bonding structure 123 is generally controlled to be in the range of 0.4mm-0.6mm, for example, the thickness of the first bonding structure 123 is 0.4mm, 0.5mm or 0.6mm, which can be beneficial to reduce the overall thickness of the combinational sensor 100.

Further, in an embodiment of the present invention, the upper surface of the first electrode layer 121 is further provided with a first insulating layer 124, the upper surface of the first insulating layer 124 is provided with a conductive layer 125, and the upper surface of the conductive layer 125 is provided with a second insulating layer 126; the combined sensor 100 further includes a first metal trace 13, a second metal trace 14, a third metal trace 15 and a fourth metal trace 16, where the first metal trace 13, the second metal trace 14, the third metal trace 15 and the fourth metal trace 16 all penetrate through the upper and lower surfaces of the second insulating layer 126 and are all electrically connected to the conductive layer 125; the environmental sensing chip 31 is attached to the upper surface of the second insulating layer 126 and electrically connected to the first metal trace 13; the microphone chip 41 is attached to the upper surface of the second insulating layer 126 and electrically connected to the second metal trace 14; the first ic chip 32 is attached to the upper surface of the second insulating layer 126 and electrically connected to the third metal trace 15; the second ic chip 42 is attached to the upper surface of the second insulating layer 126 and electrically connected to the fourth metal trace 16.

Specifically, the first insulating layer 124 and the second insulating layer 126 can be made of silicon material, and the conductive layer 125 is usually made of copper layer. The upper surface of the second insulating layer 126 is provided with a first wire running hole 1261, a second wire running hole 1262, a third wire running hole 1263 and a fourth wire running hole 1264 which run through the lower surface and expose the conductive layer 125, each wire running hole is correspondingly provided with a first metal wire 13, a second metal wire 14, a third metal wire 15 and a fourth metal wire 16, so that the lower end of each metal wire is electrically abutted to the conductive layer 125, and the upper end of each metal wire is exposed on the upper surface of the second insulating layer 126. The environmental sensing chip 31 is mounted on the upper surface of the second insulating layer 126 by chip glue, and is electrically connected to the first metal trace 13 by a wire; the microphone chip 41 is mounted on the upper surface of the second insulating layer 126 by chip adhesive, and is electrically connected to the second metal trace 14 by a wire; the first ic chip 32 is attached to the upper surface of the second insulating layer 126, and the lead at the bottom thereof is electrically connected to the third metal trace 15; the second ic chip 42 is attached to the upper surface of the second insulating layer 126, and the bottom lead thereof is electrically connected to the fourth metal trace 16. Therefore, the environmental sensor 30 and the acoustic sensor 40 can be assembled, and the chips in the combined sensor 100 are electrically connected through the metal wires below, so that the wires are regularly arranged, the mutual interference is avoided, and the safety is ensured. In addition, each chip is separately distributed in a subarea way, so that through holes do not need to be arranged for wiring, and the electromagnetic interference between the chips is effectively avoided.

It is understood that there are generally two conductive layers 125, one conductive layer 125 is correspondingly disposed below the environment sensing chip 31 and the first integrated circuit chip 32, and is electrically connected to the environment sensing chip 31 and the first integrated circuit chip 32 through metal traces; the other conductive layer 125 is correspondingly disposed below the microphone chip 41 and the second integrated circuit chip 42, and is electrically connected to the microphone chip 41 and the second integrated circuit chip 42 through metal traces. Therefore, the electrical connection can be more effectively realized, the length of the connecting wire is shorter, and the setting operation of the metal wiring is more convenient.

Further, the upper surface of the substrate 12 is further provided with a pad structure 122, the combinational sensor 100 further includes a fifth metal trace 17 and a sixth metal trace 18, the fifth metal trace 17 and the sixth metal trace 18 sequentially penetrate through the first insulating layer 124 and the second insulating layer 126 and are electrically abutted to the pad structure 122, an end of the fifth metal trace 17 away from the pad structure 122 is electrically connected to the first integrated circuit chip 32, and an end of the sixth metal trace 18 away from the pad structure 122 is electrically connected to the second integrated circuit chip 42; the lower surface of the substrate 12 corresponding to the pad structure 122 is further opened with an exposing hole to expose the pad structure 122.

Specifically, the pad structure 122 is generally made of a copper material, the second insulating layer 126 has a fifth wire hole 1265 and a sixth wire hole 1266 corresponding to the upper surface of the pad structure 122, and the fifth wire hole 1265 and the sixth wire hole 1266 both penetrate through the first insulating layer 124 and both expose the pad structure 122. The fifth metal trace 17 and the sixth metal trace 18 are disposed in the fifth wire hole 1265 and the sixth wire hole 1266, lower ends of the fifth metal trace 17 and the sixth metal trace 18 are electrically connected to the pad structure 122, upper ends of the fifth metal trace 17 and the sixth metal trace 18 are exposed on an upper surface of the second insulating layer 126, and leads electrically connected to bottoms of the first integrated circuit chip 32 and the second integrated circuit chip 42 are disposed in a distributed manner. Correspondingly, the lower surface of the substrate 12 is provided with exposure holes corresponding to the pad structure 122 structure, so that the pad structure 122 is exposed, charges carried by static electricity can be quickly conducted away through the pad structure 122, and the antistatic capability of the combination sensor 100 is effectively improved.

Optionally, the pad structure 122 is disposed corresponding to the first integrated circuit chip 32 and the second integrated circuit chip 42.

Here, the pad structure 122 is correspondingly disposed below the first integrated circuit chip 32 and the second integrated circuit chip 42, so that the charges carried by static electricity can be more quickly led out of the outside, and the antistatic capability of the combinational sensor 100 is more effectively improved; meanwhile, the length of the metal wiring is short, and the setting operation of the metal wiring is convenient.

The present invention further provides a manufacturing method of the combination sensor 100, please refer to fig. 5, in an embodiment of the manufacturing method of the combination sensor 100, the manufacturing method of the combination sensor 100 includes the following steps:

step S10, providing the base plate 12 and the cover plate 19;

step S20, fabricating an environmental sensor 30 and an acoustic sensor 40 on the upper surface of the substrate 12, where the environmental sensor 30 includes an environmental sensor chip 31 and a first integrated circuit chip 32 electrically connected to the environmental sensor chip 31, and the acoustic sensor 40 includes a microphone chip 41 and a second integrated circuit chip 42 electrically connected to the microphone chip 41;

step S30, bonding the cover plate 19 to the base plate 12 to form a receiving cavity 11, where the environmental sensor 30 and the acoustic sensor 40 are both located in the receiving cavity 11.

Specifically, the package 10 having the accommodating cavity 11 is first manufactured by a packaging method, which generally adopts a gold-tin bonding packaging method, but of course, other reasonable and effective packaging methods may also be adopted. And then the environment sensor 30 and the acoustic sensor 40 are manufactured in the accommodating cavity 11, when the environment sensor 30 and the acoustic sensor 40 are manufactured, the environment sensor 30 and the acoustic sensor 40 are integrated on a chip, and the chip is electrically connected, so that the influence of external signals on the environment sensor 30 and the acoustic sensor 40 can be reduced, the introduction of noise is reduced, and the power consumption is reduced. Since the integrated environmental sensor 30 and the acoustic sensor 40 are both located in the accommodating cavity 11 of the package 10, the fabrication of the housing can be omitted, which is beneficial to further reducing the thickness of the combined sensor 100 and realizing the miniaturization thereof.

Referring to fig. 6, fig. 2, and fig. 10 to fig. 15, in an embodiment of the present invention, before the step S20, the method further includes:

step S11, forming a first electrode layer 121 on the upper surface of the substrate 12;

step S12, forming a first bonding structure 123 on the upper surface of the first electrode layer 121;

step S13, forming a second electrode layer 193 on the lower surface of the cover plate 19, and forming a second bonding structure 194 on the lower surface of the second electrode layer 193;

accordingly, step S30 includes

Step S30a, aligning the first bonding structure 123 of the substrate 12 with the second bonding structure 194 of the cover plate 19, and performing bonding packaging to obtain the package 10.

Specifically, the substrate 12 and the cover plate 19 may be formed of the silicon substrate 12, and the first electrode layer 121 and the second electrode layer 193 may be formed of copper layers opposite to each other. During manufacturing, a copper layer is deposited on the upper surface of the substrate 12, a dielectric material layer is pressed on the upper surface of the copper layer, the dielectric material layer is an insulating layer, then, a part of the dielectric material layer is removed by etching through a light etching process, the copper layer is etched, and then, the dielectric material layer is removed, so that the first electrode layer 121 is obtained. A second electrode layer 193 is formed on the lower surface of the cover plate 19 in the same manner. The first bonding structure 123 and the second bonding structure are disposed correspondingly, one of the two bonding structures is a gold bonding structure, and the other of the two bonding structures is a tin bonding structure. Finally, aligning the first bonding structure 123 with the second bonding structure 194, and adhesively bonding the first bonding structure 123 and the second bonding structure 194 together by pressing and heating, thereby obtaining the package 10. It is understood that, after the fabrication, the first bonding structure 123, the second bonding structure 194, the substrate 12 and the cover plate 19 are enclosed to form the receiving cavity 11 of the package 10.

Referring to fig. 7 and 13, after step S11, the method further includes:

step S111, depositing a first insulating layer 124 on the upper surface of the first electrode layer 121, and forming a conductive layer 125 on the upper surface of the first insulating layer 124;

step S112, depositing a second insulating layer 126 on the upper surface of the conductive layer 125, and etching the second insulating layer 126 to obtain a first wire hole, a second wire hole 1262, a third wire hole 1263, and a fourth wire hole 1264 exposing the conductive layer 125;

step S113, respectively electroplating a first metal wire 13, a second metal wire 14, a third metal wire 15 and a fourth metal wire 16 in the first wire hole 1261, the second wire hole 1262, the third wire hole 1263 and the fourth wire hole 1264;

accordingly, referring to fig. 18, step S20 includes:

step S21, respectively attaching the environment sensing chip 31, the microphone chip 41, the first integrated circuit chip 32, and the second integrated circuit chip 42 to the upper surface of the second insulating layer 126, electrically connecting the environment sensing chip 31 and the first metal trace 13 through a wire, electrically connecting the microphone chip 41 and the second metal trace 14 through a wire, and electrically connecting the first integrated circuit chip 32 and the third metal trace 15; electrically connecting the second integrated circuit chip 42 and the fourth metal trace 16.

Here, the first insulating layer 124 and the second insulating layer 126 may be made of silicon-based materials, the conductive layer 125 may be made of copper, and the first wire hole, the second wire hole 1262, the third wire hole 1263 and the fourth wire hole 1264 are formed by etching the second insulating layer 126 by using a photo etching process, and the underlying conductive layer 125 is exposed. The first metal trace 13, the second metal trace 14, the third metal trace 15 and the fourth metal trace 16 may be made of copper or tin, and the lower ends thereof are electrically abutted to the lower conductive layer 125, and the upper ends thereof are exposed on the upper surface of the second insulating layer 126 for electrically connecting the air pressure sensor and the microphone sensor. When the environmental sensor 30 and the acoustic sensor 40 are manufactured, the lower surfaces of the environmental sensor chip 31 and the microphone chip 41 are subjected to dispensing operation to manufacture chip glue, then the environmental sensor chip 31 is attached to the upper surface of the second insulating layer 126 by adopting a mounting process, a WB wire bonding process is performed, and the environmental sensor chip 31 is electrically connected to the upper end of the first metal wire 13 through a wire; attaching the microphone chip 41 to the upper surface of the second insulating layer 126 by the same method, and electrically connecting the microphone chip 41 to the upper end of the second metal trace 14 through a wire; then, the first integrated circuit chip 32 and the second integrated circuit chip 42 are mounted on the upper surface of the second insulating layer 126 corresponding to the third metal trace 15 and the fourth metal trace 16, and heat treatment is performed, so that the electrical conduction between the first integrated circuit chip 32 and the second integrated circuit chip 42 and the third metal trace 15 and the fourth metal trace 16 can be realized. Therefore, the mounting operation of the environmental sensor 30 and the acoustic sensor 40 can be completed, and the chips in the combined sensor 100 are electrically connected through the following metal wires, so that the wires are regularly arranged, the interference between the wires is avoided, and the safety of the combined sensor is ensured. In addition, each chip is separately distributed in a subarea way, so that through holes do not need to be arranged for wiring, and the electromagnetic interference between the chips is effectively avoided.

Further, referring to fig. 8 and 14, after step S111, the method further includes:

step S114, forming a plating region 1241 exposing the first electrode layer 121 on the upper surface of the first insulating layer 124;

in step S115, a photoresist structure 127 is formed on the upper surface of the first insulating layer 124, wherein the photoresist structure 127 is provided with a photolithography hole 1271, and the photolithography hole 1271 corresponds to and communicates with the plating region 1241.

Accordingly, step S12 includes:

step S12a, a first bonding structure 123 is formed in the plating region 1241 and the photolithography aperture 1271, and the insulating layer on the inner side of the first bonding structure 123 is removed.

Specifically, the first insulating layer 124 is etched by a photolithography process, so as to obtain a plating region 1241 exposing the first electrode layer 121. And (3) uniformly coating a photoresist layer on the upper surface of the first insulating layer 124 to serve as a protection region of the non-electroplating first bonding structure 123 region, and photoetching the photoresist layer by adopting an alignment process to obtain a photoresist structure 127 with a photoetching hole 1271, wherein the photoetching hole 1271 corresponds to and is communicated with the electroplating region 1241 below. After the gold (or tin) is electroplated in the photo-etching hole 1271 and the electroplating region 1241, and the photoresist structure 127 on the inner side is removed, the first bonding structure 123 and the photoresist on the outer side can be manufactured, and the photoresist mainly plays a role in shielding external interference.

It should be noted that the thickness of the photoresist structure 127 is generally controlled within a range of 0.5mm to 0.8mm, which can be beneficial to reduce the overall thickness of the combi sensor 100.

Further, referring to fig. 9, 11 to 18, after step S11, the method further includes:

in step S11a, a pad structure 122 is formed on the upper surface of the substrate 12.

In step S11b, etching is performed on the lower surface of the substrate 12 corresponding to the pad structure 122 to expose the pad structure 122.

Specifically, the manufacturing method of the pad structure 122 may refer to the manufacturing method of the first electrode layer 121, that is, a copper layer is deposited on the upper surface of the substrate 12, a dielectric material layer is pressed on the upper surface of the copper layer, the dielectric material layer is an insulating layer, then, a portion of the dielectric material layer is removed by etching through a light etching process, the copper layer is etched, and then, the dielectric material layer is removed, so that the first electrode layer 121 and the pad structure 122 can be obtained at the same time. Then, the lower surface of the substrate 12 is etched by using a photolithography process, and an external bonding pad region exposing the bonding pad structure 122 is etched for connecting external parts.

Correspondingly, referring to fig. 9, fig. 16 to fig. 18, after step S112, the method further includes:

step S112a, etching the upper surface of the second insulating layer 126 to obtain a fifth wire hole 1265 and a sixth wire hole 1266 penetrating through the first insulating layer 124 and exposing the pad structure 122;

in step S112b, a fifth metal wire 17 and a sixth metal wire 18 are respectively manufactured in the fifth wire hole 1265 and the sixth wire hole 1266.

Specifically, the upper surface of the second insulating layer 126 is etched by using a photolithography process, so as to obtain a fifth wire hole 1265 and a sixth wire hole 1266 penetrating through the first insulating layer 124 and exposing the pad structure 122, and then metal is plated in the fifth wire hole 1265 and the sixth wire hole 1266, so as to obtain a fifth metal wire 17 and a sixth metal wire 18, respectively. It can be understood that the fifth metal trace 17 and the sixth metal trace 18 are disposed corresponding to the first integrated circuit chip 32 and the second integrated circuit chip 42, and both penetrate through the first insulating layer 124 and the second insulating layer 126, and both lower ends thereof electrically abut against the pad structure 122, and upper ends thereof are exposed on the upper surface of the second insulating layer 126 for electrically connecting the first integrated circuit chip 32 and the second integrated circuit chip 42.

Correspondingly, after step S21, the method further includes:

step S22, electrically connecting the first ic chip 32 and the fifth metal trace 17; electrically connecting the second integrated circuit chip 42 and the sixth metal trace 18.

After the first ic chip 32 and the second ic chip 42 are mounted and heat treatment is performed, the upper ends of the fifth metal trace 17 and the sixth metal trace 18 are electrically connected to the first ic chip 32 and the second ic chip 42, respectively. Thus, the charges carried by the static electricity can be quickly conducted away through the pad structure 122, and the antistatic capability of the combinational sensor 100 is effectively improved.

Further, in an embodiment of the present invention, the accommodating cavity 11 includes an accommodating cavity 111, a second sub-accommodating cavity 112, a third sub-accommodating cavity 113 and a fourth sub-accommodating cavity 114 that are independent of each other; step S20 includes:

the environment sensing chip 31, the microphone chip 41, the first integrated circuit chip 32 and the second integrated circuit chip 42 are respectively attached to the accommodating cavity 111, the second sub-accommodating cavity 112, the third sub-accommodating cavity 113 and the fourth sub-accommodating cavity 114.

When the package 10 is manufactured, the first bonding structure 123, the second bonding structure 194, the substrate 12 and the cover plate 19 together enclose to form an accommodating cavity 111, a second sub-accommodating cavity 112, a third sub-accommodating cavity 113 and a fourth sub-accommodating cavity 114, which are independent of each other. The environment sensing chip 31, the microphone chip 41, the first integrated circuit chip 32 and the second integrated circuit chip 42 are arranged in a partitioning mode and are respectively arranged in the independent accommodating cavities 11, so that the effects of isolation and shielding can be achieved, electromagnetic interference between the environment sensor 30 and the acoustic sensor 40 is reduced, and introduction of noise is reduced.

Further, in an embodiment of the present invention, the environmental sensor 30 is an air pressure sensor, and after step S20, the method further includes:

a first through hole 191 and a second through hole 192 are formed in the surface of the package body 10, the first through hole 191 is communicated with the accommodating cavity 111, and the second through hole 192 is communicated with the second sub-accommodating cavity 112.

The first through hole 191 is mainly formed at the top of the package body 10 and is communicated with the accommodating cavity 111 for sensing the air pressure change of the external environment. The second through hole 192 is generally opened at the top of the package body 10 and is communicated with the second sub-cavity for sensing and detecting an external sound source.

The utility model also provides an electronic equipment, electronic equipment includes as before the combined sensor 100, and the concrete structure of this combined sensor 100 refers to aforementioned embodiment. Since all technical solutions of all the foregoing embodiments are adopted, at least all beneficial effects brought by the technical solutions of the foregoing embodiments are achieved, and no further description is given here.

It should be noted that the electronic device is generally a mobile phone, a watch, an earphone, a bracelet, and the like, and the combination sensor 100 is generally installed in a housing of the electronic device, so that the electronic device can realize more functions.

The above only is the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structure changes made by the contents of the specification and the drawings under the inventive concept of the present invention, or the direct/indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims (10)

1. A combination sensor, comprising:

the packaging body comprises a substrate and a cover plate, wherein the substrate and the cover plate are in bonding connection through a bonding structure and enclose to form an accommodating cavity;

the environment sensor comprises an environment sensing chip and a first integrated circuit chip which is electrically connected with the environment sensing chip, and the environment sensing chip and the first integrated circuit chip are both arranged in the accommodating cavity; and

the acoustic sensor comprises a microphone chip and a second integrated circuit chip electrically connected with the microphone chip, and the microphone chip and the second integrated circuit chip are arranged in the accommodating cavity.

2. The combination sensor of claim 1, wherein the receiving cavity comprises a first sub-receiving cavity, a second sub-receiving cavity, a third sub-receiving cavity and a fourth sub-receiving cavity, the environment sensing chip is disposed in the first sub-receiving cavity, the microphone chip is disposed in the second sub-receiving cavity, the first ic chip is disposed in the third sub-receiving cavity, and the second ic chip is disposed in the fourth sub-receiving cavity.

3. The combination sensor of claim 2, wherein the environmental sensor is an air pressure sensor, and the cover plate further defines a first through hole communicating with the first sub-receiving cavity;

and/or the cover plate is also provided with a second through hole communicated with the second sub-accommodating cavity.

4. A combination sensor according to any one of claims 1 to 3, wherein the thickness direction of the substrate is defined as an up-down direction, the direction toward the cover plate is an up direction, the direction away from the cover plate is a down direction, the upper surface of the substrate is provided with a first electrode layer, and the upper surface of the first electrode layer is provided with a first bonding structure;

a second electrode layer is arranged on the lower surface of the cover plate, and a second bonding structure corresponding to the first bonding structure is arranged on the lower surface of the second electrode layer;

the first bonding structure is bonded with the second bonding structure and surrounds the substrate and the cover plate together to form the accommodating cavity.

5. The combinational sensor of claim 4, wherein the thickness of the first bond structure ranges from 0.4mm to 0.6 mm.

6. The combination sensor of claim 4, wherein one of the first and second bond structures is a gold bond structure and the other is a tin bond structure.

7. The combination sensor according to claim 4, wherein an upper surface of the first electrode layer is further provided with a first insulating layer, an upper surface of the first insulating layer is provided with a conductive layer, and an upper surface of the conductive layer is provided with a second insulating layer;

the combined sensor also comprises a first metal wire, a second metal wire, a third metal wire and a fourth metal wire, wherein the first metal wire, the second metal wire, the third metal wire and the fourth metal wire penetrate through the upper surface and the lower surface of the second insulating layer and are electrically abutted with the conductive layer;

the environment sensing chip is attached to the upper surface of the second insulating layer and is electrically connected to the first metal wiring;

the microphone chip is attached to the upper surface of the second insulating layer and is electrically connected to the second metal wire;

the first integrated circuit chip is attached to the upper surface of the second insulating layer and is electrically connected to the third metal routing;

the second integrated circuit chip is attached to the upper surface of the second insulating layer and is electrically connected to the fourth metal routing.

8. The combination sensor of claim 7, wherein the upper surface of the substrate is further provided with a pad structure, the combination sensor further comprises a fifth metal trace and a sixth metal trace, the fifth metal trace and the sixth metal trace both sequentially penetrate through the first insulating layer and the second insulating layer and are both electrically abutted to the pad structure, an end of the fifth metal trace away from the pad structure is electrically connected to the first integrated circuit chip, and an end of the sixth metal trace away from the pad structure is electrically connected to the second integrated circuit chip;

the lower surface of the substrate is also provided with exposure holes corresponding to the pad structures so as to expose the pad structures.

9. The combinational sensor of claim 8, wherein the pad structures are disposed corresponding to the first integrated circuit chip and the second integrated circuit chip.

10. An electronic device characterized in that it comprises a combi-sensor according to any of claims 1 to 9.

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