CN216795279U

CN216795279U - MEMS device, microphone and electronic product

Info

Publication number: CN216795279U
Application number: CN202123235822.2U
Authority: CN
Inventors: 李颖
Original assignee: Goertek Microelectronics Inc
Current assignee: Goertek Microelectronics Inc
Priority date: 2021-12-21
Filing date: 2021-12-21
Publication date: 2022-06-21
Anticipated expiration: 2031-12-21

Abstract

The application discloses MEMS device, microphone and electronic product, the MEMS device includes: a first circuit board; the second circuit board and the first circuit board are oppositely arranged at intervals, the first circuit board is positioned above the second circuit board, and the first circuit board is provided with an acoustic through hole; the shell is arranged between the first circuit board and the second circuit board, the shell is matched with the first circuit board and the second circuit board to define an accommodating cavity, and the acoustic through hole is communicated with the accommodating cavity; the ASIC chip is arranged on the first circuit board; and the MEMS chip is arranged on the second circuit board, and the ASIC chip and the MEMS chip are both positioned in the accommodating cavity. The MEMS chip and the ASIC are respectively arranged on the second circuit board and the first circuit board, so that the overall size of the MEMS device is effectively reduced, and the small-size requirement of the MEMS device is met. Meanwhile, the acoustic through hole is formed in the first circuit board, the MEMS device is constructed into a small-size Top type device capable of being welded on two sides, and more welding requirements of a client side are met.

Description

MEMS device, microphone and electronic product

Technical Field

The present invention relates to the field of micro electro mechanical systems, and more particularly, to a MEMS device, a microphone, and an electronic product having the MEMS device.

Background

For a common Top type MEMS device in the prior art, the Top of the shell is provided with a sound hole, sound is input from the Top of the shell through the sound hole for receiving a sound signal, and the sound hole and the bonding pad are respectively arranged and are not on the same circuit board. The MEMS chip and the ASIC chip are arranged on the same circuit board side by side, so that the structural size of the MEMS device is increased, and the requirement of a small-size microphone at the whole terminal of a client cannot be met.

SUMMERY OF THE UTILITY MODEL

An object of the present application is to provide a new technical solution of a MEMS device, which can at least solve the problem of the prior art that the overall size of a common Top type MEMS device is large.

According to a first aspect of the present application, there is provided a MEMS device comprising: a first circuit board; the second circuit board and the first circuit board are oppositely arranged at intervals, the first circuit board is positioned above the second circuit board, and the first circuit board is provided with an acoustic through hole; the shell is arranged between the first circuit board and the second circuit board, the shell is matched with the first circuit board and the second circuit board to define an accommodating cavity, and the acoustic through hole is communicated with the accommodating cavity; the ASIC chip is arranged on the first circuit board; and the MEMS chip is arranged on the second circuit board, and the ASIC chip and the MEMS chip are both positioned in the accommodating cavity.

Optionally, the MEMS chip is disposed directly opposite the ASIC chip.

Optionally, the MEMS chip and the ASIC chip are electrically connected through a first metal lead, and the ASIC chip is electrically connected to the first circuit board through a second metal lead.

Optionally, the ASIC chip is attached to the first circuit board, and the MEMS chip is attached to the second circuit board.

Optionally, the acoustic vias are vertically staggered from the ASIC chip.

Optionally, the aperture of the acoustic through hole is 0.15-0.6 mm.

Optionally, the aperture of the acoustic through hole is 0.225-0.325 mm.

Optionally, the housing is respectively connected to the first circuit board and the second circuit board by welding.

According to a second aspect of the present application, there is provided a microphone comprising the MEMS device described in the above embodiments.

According to a third aspect of the present application, there is provided an electronic product comprising the MEMS device described in the above embodiments.

According to the MEMS device provided by the embodiment of the utility model, the first circuit board is arranged on the top surface of the shell, the second circuit board is arranged on the bottom surface of the shell, and the MEMS chip and the ASIC are respectively arranged on the second circuit board and the first circuit board, so that the overall size of the MEMS device is effectively reduced, and the small-size requirement of the MEMS device is met. Meanwhile, the acoustic through hole is formed in the first circuit board, the MEMS device is constructed into a small-size Top type device capable of being welded on two sides, and more welding requirements of a client side are met.

Further features of the present application and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which is to be read in connection with the accompanying drawings.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the application and together with the description, serve to explain the principles of the application.

Fig. 1 is a schematic structural diagram of a MEMS device according to an embodiment of the present invention.

Reference numerals:

a MEMS device 100;

a first wiring board 10;

a second wiring board 20;

a housing 30;

a MEMS chip 40;

an ASIC chip 50;

an acoustic via 60;

a first metal lead 70;

a second metal lead 80.

Detailed Description

Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present application unless specifically stated otherwise.

The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the application, its application, or uses.

Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.

In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

The MEMS device 100 according to an embodiment of the present invention is described in detail below with reference to the drawings.

As shown in fig. 1, a MEMS device 100 according to an embodiment of the present invention includes a first wiring board 10, a second wiring board 20, a case 30, an ASIC chip 50, and a MEMS chip 40.

Specifically, the second wiring board 20 and the first wiring board 10 are arranged in a spaced-apart opposing manner, the first wiring board 10 is located above the second wiring board 20, and the first wiring board 10 is provided with the acoustic through-hole 60. The casing 30 is arranged between the first circuit board 10 and the second circuit board 20, the casing 30 cooperates with the first circuit board 10 and the second circuit board 20 to define a containing cavity, and the acoustic through hole 60 is communicated with the containing cavity. The ASIC chip 50 is provided on the first wiring board 10. The MEMS chip 40 is disposed on the second circuit board 20, and the ASIC chip 50 and the MEMS chip 40 are both located in the receiving cavity.

In other words, the MEMS device 100 according to the embodiment of the present invention is mainly composed of the first wiring board 10, the second wiring board 20, the case 30, the ASIC chip 50, and the MEMS chip 40. The MEMS device 100(Micro-Electro-Mechanical System, Micro Electro-Mechanical System) has the characteristics of small volume, good frequency response, noise ground, and the like, and is one of the essential devices of the mobile terminal. Referring to fig. 1, the second circuit board 20 and the first circuit board 10 are arranged in a spaced-apart and opposing manner, and the first circuit board 10 is located above the second circuit board 20. The first wiring board 10 serves as the top of the MEMS device 100 and the second wiring board 20 serves as the bottom of the MEMS device 100. The acoustic through-hole 60 is opened on the first wiring board 10 at the top of the case 30. Ambient sound enters from the top of the MEMS device 100. The case 30 is disposed between the first wiring board 10 and the second wiring board 20. The case 30 defines a housing chamber in cooperation with the first wiring board 10 and the second wiring board 20, and the acoustic through-hole 60 communicates with the housing chamber.

The ASIC chip 50 is disposed on the first wiring board 10. The MEMS chip 40 is disposed on the second wiring board 20, and the ASIC chip 50 and the MEMS chip 40 are both located in the accommodation chamber. External environmental sounds are introduced into the MEMS device 100 through the acoustic through-hole 60 of the top first wiring board 10, and the MEMS chip 40 induces sound waves in the receiving cavity and stably converts the induced sound waves into electrical signals. The capacitance of the MEMS chip 40 will change correspondingly with the difference of the input sound signal, and then the ASIC chip 50 is used to process the changed capacitance signal and output it to the circuit board, thereby realizing the sound pickup.

The MEMS device 100 of the present Application is an improved Top-type device, and compared to the Top-type device of the prior art, as shown in fig. 1, the Top of the housing 30 is replaced by the first Circuit board 10, an ASIC chip 50 (ASIC) is disposed on the first Circuit board 10 at the Top of the MEMS device 100, and the MEMS chip 40 is disposed on the second Circuit board 20 at the bottom of the MEMS device 100, so that the MEMS chip 40 and the ASIC chip 50 are separately disposed, thereby effectively reducing the size of the MEMS device 100. Meanwhile, by arranging the first circuit board 10 and the second circuit board 20 which are oppositely arranged, more welding requirements of a client can be met.

Therefore, according to the MEMS device 100 of the embodiment of the present invention, the first circuit board 10 is disposed on the top surface of the housing 30, the second circuit board 20 is disposed on the bottom surface of the housing 30, and the MEMS chip 40 and the ASIC are disposed on the second circuit board 20 and the first circuit board 10, respectively, which effectively reduces the overall size of the MEMS device 100 and meets the small size requirement of the MEMS device 100. Meanwhile, the acoustic through hole 60 is arranged on the first circuit board 10, and the MEMS device 100 is configured as a small-sized Top-type device capable of being soldered on both sides, so as to meet more soldering requirements of clients.

According to one embodiment of the present invention, the MEMS chip 40 is disposed directly opposite the ASIC chip 50.

That is, as shown in fig. 1, the ASIC chip 50 on the first circuit board 10 and the MEMS chip 40 on the second circuit board 20 are disposed opposite to each other in the accommodating cavity, and the MEMS chip 40 and the ASIC chip 50 do not need to be disposed side by side on a circuit board at the same time, thereby effectively reducing the structural size of the MEMS device 100 and meeting the requirement of device miniaturization. Meanwhile, different welding requirements of the client terminal can be met by arranging the first circuit board 10 and the second circuit board 20 which are oppositely arranged.

In some embodiments of the present invention, the MEMS chip 40 and the ASIC chip 50 are electrically connected through a first metal wire 70, and the ASIC chip 50 is electrically connected to the first wiring board 10 through a second metal wire 80.

In other words, referring to fig. 1, in the double-side-solderable small-sized Top type MEMS device 100 of the present application, the MEMS chip 40 on the second wiring board 20 at the bottom of the case 30 is electrically connected to the ASIC chip 50 on the first wiring board 10 at the Top of the case 30 through the first metal lead 70, so that the MEMS chip 40 transmits the acoustic wave signal to the ASIC chip 50. The ASIC chip 50 on the first circuit board 10 on the top of the housing 30 is connected to the first circuit board 10 through the second metal lead 80, so that the ASIC chip 50 processes the signal transmitted by the MEMS chip 40 and outputs the signal to the first circuit board 10, thereby picking up sound.

Compared with a common Top device in which the acoustic through hole 60 is formed in the Top of the housing 30 and the ASIC chip 50 and the MEMS chip 40 are arranged side by side on the circuit board at the bottom of the housing 30, the acoustic through hole 60 is formed in the first circuit board 10 at the Top of the housing 30, and the ASIC chip 50 and the MEMS chip 40 are arranged oppositely, so that the acoustic through hole 60 is ensured to be closer to the MEMS chip 40 at the bottom of the housing 30, which is favorable for further improving the acoustic performance of the MEMS device 100.

Alternatively, as shown in fig. 1, the acoustic vias 60 are arranged offset from the ASIC chip 50 in the vertical direction. The acoustic vias 60 are spaced apart from the ASIC chip 50 on the first wiring board 10, further ensuring that the acoustic vias 60 are closer to the MEMS chip 40 at the bottom of the housing 30, which helps to further improve the acoustic performance of the MEMS device 100.

According to one embodiment of the present invention, the ASIC chip 50 is bonded to the first wiring board 10, and the MEMS chip 40 is bonded to the second wiring board 20. The case 30 is solder-connected to the first circuit board 10 and the second circuit board 20, respectively.

Specifically, as shown in fig. 1, the top surface of the housing 30 is replaced with a circuit board (the first circuit board 10), wherein the circuit board (the first circuit board 10) on the top surface of the housing 30 can mount the ASIC chip 50, and the circuit board (the second circuit board 20) on the bottom surface of the housing 30 mounts the MEMS chip 40. In the mounting process, the MEMS chip 40 and the ASIC chip 50 are electrically connected by a first metal wire 70, and the ASIC chip 50 and the first circuit board 10 are electrically connected by a second metal wire 80. Wherein, an acoustic through hole 60 arranged in a staggered manner with the ASIC chip 50 is formed on one circuit board on which the ASIC chip 50 is mounted, and the acoustic through hole 60 is closer to the MEMS chip 40 at the bottom of the housing 30, which is helpful for further improving the acoustic performance of the MEMS device 100.

Four sides of the housing 30 are located between the first circuit board 10 and the second circuit board 20, and the four sides are respectively connected with the first circuit board 10 and the second circuit board 20 by welding, so that the stability of the whole structure of the MEMS device 100 is improved. In the actual routing process, three sides of the housing 30 can be welded to four sides first, and the fourth side is welded after routing (for example, the first metal lead 70 and the second metal lead 80) is completed, so that the operation is simple and convenient, and the manufacturing is easy.

According to one embodiment of the utility model, the aperture of the acoustic through-hole 60 is 0.15-0.6 mm.

That is, the aperture of the acoustic through-hole 60 is approximately in the range of 0.15-0.6 mm. Optionally, the aperture of the acoustic vias 60 is 0.225-0.325 mm. Through the aperture size of reasonable design acoustics through-hole 60, when guaranteeing sound transmission, noise, dust and electromagnetic radiation etc. interference in can also further reducing the environment effectively promote MEMS device 100's acoustic performance. Of course, the specific aperture size of the acoustic through hole 60 needs to be adjusted accordingly according to the structural size of the MEMS chip 40, and is not described in detail in this application.

In summary, according to the MEMS device 100 of the embodiment of the present invention, the first wiring board 10 is disposed on the top surface of the housing 30, the second wiring board 20 is disposed on the bottom surface of the housing 30, and the MEMS chip 40 and the ASIC are disposed on the second wiring board 20 and the first wiring board 10, respectively, which effectively reduces the overall size of the MEMS device 100 and meets the small size requirement of the MEMS device 100. Meanwhile, the acoustic through hole 60 is arranged on the first circuit board 10, the MEMS device 100 is constructed into a small-size Top type device capable of being welded on two sides, the acoustic through hole 60 is ensured to be closer to the MEMS chip 40, the acoustic performance of the MEMS device 100 is improved, and meanwhile more welding requirements of a client side can be met.

According to a second aspect of the present application, a microphone is provided, comprising the MEMS device 100 of the above embodiments. Since the MEMS device 100 according to the embodiment of the present invention has the above technical effects, the microphone according to the embodiment of the present invention should also have corresponding technical effects, that is, the microphone of the present application adopts the MEMS device 100 according to the embodiment, so that the overall size of the MEMS device 100 can be effectively reduced, and the requirement of the MEMS device 100 for small size can be satisfied. Meanwhile, the acoustic through hole 60 is arranged on the first circuit board 10, and the MEMS device 100 is configured into a small-sized Top microphone capable of being welded on both sides, so that the acoustic through hole 60 is ensured to be closer to the MEMS chip 40, and the microphone can meet more welding requirements of a client while improving the acoustic performance.

According to a third aspect of the present application, an electronic product is provided, comprising the MEMS device 100 of the above embodiments. The electronic product of the present application includes a complete machine housing and the MEMS device 100 of the above embodiment disposed in the complete machine housing. The electronic product may be a product with the MEMS device 100, such as a mobile phone, a tablet computer, or a headset.

Since the MEMS device 100 according to the embodiment of the present invention has the above technical effects, the electronic product according to the present invention should also have corresponding technical effects, that is, the electronic product of the present application adopts the MEMS device 100 according to the embodiment, so that the overall size of the MEMS device 100 can be effectively reduced, and the requirement of the MEMS device 100 for small size can be satisfied. Meanwhile, the acoustic through hole 60 is arranged on the first circuit board 10, and the MEMS device 100 is configured into a small-sized Top microphone capable of being welded on both sides, so that the acoustic through hole 60 is ensured to be closer to the MEMS chip 40, and the microphone can meet more welding requirements of a client while improving the acoustic performance.

Of course, the working principles and other structures of the MEMS device 100, the microphone and the electronic product of the present application are understood and can be implemented by those skilled in the art, and will not be described in detail in the present application.

Although some specific embodiments of the present application have been described in detail by way of example, it should be understood by those skilled in the art that the above examples are for illustrative purposes only and are not intended to limit the scope of the present application. It will be appreciated by those skilled in the art that modifications can be made to the above embodiments without departing from the scope and spirit of the present application. The scope of the application is defined by the appended claims.

Claims

1. A MEMS device (100), comprising:

a first circuit board (10);

the second circuit board (20), the second circuit board (20) and the first circuit board (10) are arranged oppositely and spaced, the first circuit board (10) is located above the second circuit board (20), and the first circuit board (10) is provided with an acoustic through hole (60);

the shell (30) is arranged between the first circuit board (10) and the second circuit board (20), the shell (30) is matched with the first circuit board (10) and the second circuit board (20) to define a containing cavity, and the acoustic through hole (60) is communicated with the containing cavity;

an ASIC chip (50), the ASIC chip (50) being provided on the first wiring board (10);

the MEMS chip (40) is arranged on the second circuit board (20), and the ASIC chip (50) and the MEMS chip (40) are both positioned in the accommodating cavity.

2. The MEMS device (100) according to claim 1, wherein the MEMS chip (40) is arranged directly opposite the ASIC chip (50).

3. The MEMS device (100) according to claim 1, wherein the MEMS chip (40) and the ASIC chip (50) are electrically connected by a first metal lead (70), and the ASIC chip (50) is electrically connected to the first wiring board (10) by a second metal lead (80).

4. The MEMS device (100) according to claim 1, wherein the ASIC chip (50) is adhesively connected to the first wiring board (10) and the MEMS chip (40) is adhesively connected to the second wiring board (20).

5. The MEMS device (100) according to claim 1, wherein the acoustic vias (60) are vertically staggered from the ASIC chip (50).

6. The MEMS device (100) according to claim 1, wherein the aperture of the acoustic via (60) is 0.15-0.6 mm.

7. The MEMS device (100) according to claim 1, wherein the aperture of the acoustic via (60) is 0.225-0.325 mm.

8. A MEMS device (100) according to claim 1, wherein the housing (30) is soldered to the first and second circuit boards (10, 20), respectively.

9. A microphone, characterized by comprising a MEMS device (100) according to any one of claims 1-8.

10. An electronic product, characterized in that it comprises a MEMS device (100) according to any one of claims 1 to 8.