CN216795280U

CN216795280U - MEMS device, microphone and electronic product

Info

Publication number: CN216795280U
Application number: CN202123241652.9U
Authority: CN
Inventors: 李颖
Original assignee: Goertek Microelectronics Inc
Current assignee: Goertek Microelectronics Inc
Priority date: 2021-12-21
Filing date: 2021-12-21
Publication date: 2022-06-21
Anticipated expiration: 2031-12-21

Abstract

The application discloses MEMS device, microphone and electronic product, the MEMS device includes: a circuit board; the shell is arranged on the circuit board, the shell and the circuit board are matched to define an accommodating cavity, the shell is provided with a top surface and four side surfaces, the four side surfaces are arranged on the circuit board, and one side surface is provided with an acoustic through hole communicated with the accommodating cavity; the MEMS chip is arranged on the shell and located in the accommodating cavity, and the position of the MEMS chip corresponds to that of the acoustic through hole. The MEMS device effectively reduces the influence of the noise of the MEMS chip caused by external light and electromagnetic radiation by opening the acoustic through hole on the side surface of the shell, and improves the anti-interference capability of the MEMS device. Meanwhile, the acoustic through hole is formed in the side face of the shell, foreign matters can be prevented from entering the accommodating cavity, the internal environment of the MEMS device is clean, the performance reliability of the MEMS device is improved, and the service life of the MEMS device is prolonged.

Description

MEMS device, microphone and electronic product

Technical Field

The present disclosure relates to the field of micro-electromechanical systems, and more particularly, to a MEMS device, a microphone, and an electronic product having the MEMS device.

Background

The existing microphone is usually provided with a sound hole on the top surface of the shell. For example, a TOP type microphone may be understood as a microphone in which the sound hole and the land are separately provided, and the arrangement is not on the same circuit board.

However, the existing design mode of forming the sound hole in the top of the housing is easily affected by external light noise and electromagnetic radiation, and meanwhile, the mode of forming the sound hole in the top of the housing also easily causes foreign matters to enter the housing, thereby affecting the performance of the MEMS device.

SUMMERY OF THE UTILITY MODEL

An object of this application is to provide a new technical scheme of MEMS device, can solve among the prior art at least that MEMS device is easy to reach external light and makes an uproar and electromagnetic radiation influence and foreign matter gets into the casing scheduling problem easily.

According to a first aspect of the present application, there is provided a MEMS device comprising: a circuit board; the shell is arranged on the circuit board, the shell and the circuit board are matched to define an accommodating cavity, the shell is provided with a top surface and four side surfaces, the four side surfaces are arranged on the circuit board, and one side surface is provided with an acoustic through hole communicated with the accommodating cavity; the MEMS chip is arranged on the shell and is positioned in the accommodating cavity, and the position of the MEMS chip corresponds to that of the acoustic through hole.

Optionally, the casing is the cuboid structure, the top surface of casing with the circuit board is arranged relatively, the side includes relative first side and the second side that sets up, first side with one of them long limit of top surface sharing of casing, the second side with another long limit of top surface sharing of casing, first side with one of the second side is provided with the acoustics through-hole.

Optionally, the acoustic through hole is formed in a center of the housing in the height direction, and the acoustic through hole is directly opposite to the MEMS chip.

Optionally, the diameter of the acoustic through-hole is 0.1-0.6 mm.

Optionally, the acoustic through-hole has a diameter of 0.2-0.25 mm.

Optionally, the MEMS device further comprises: the ASIC chip is arranged on the circuit board and is positioned in the accommodating cavity, and the MEMS chip is electrically connected with the ASIC chip through a metal lead.

According to a second aspect of the present application, there is provided a microphone comprising the MEMS device described in the above embodiments.

According to a third aspect of the present application, there is provided an electronic product comprising the MEMS device described in the above embodiments.

According to the MEMS device provided by the embodiment of the utility model, the acoustic through hole is formed in the side surface of the shell, so that the influence of external optical noise and electromagnetic radiation on the MEMS chip is effectively reduced, and the anti-interference capability of the MEMS device is improved. Meanwhile, the acoustic through holes are formed in the side face of the shell, foreign matters can be prevented from entering the accommodating cavity, the cleanness of the internal environment of the MEMS device is guaranteed, the performance reliability of the MEMS device is improved, and the service life of the MEMS device is prolonged. In addition, the design mode of side trompil can make things convenient for the customer to carry out the sound channel design, improves the flexibility of customer's sound channel design.

Further features of the present application and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which is to be read in connection with the accompanying drawings.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the application and together with the description, serve to explain the principles of the application.

Fig. 1 is a schematic structural diagram of a MEMS device according to an embodiment of the present invention.

Reference numerals:

a MEMS device 100;

a wiring board 10;

a housing 20; a top surface 21; a first side 22; an acoustic through hole 23;

a MEMS chip 30;

an ASIC chip 40;

a metal lead 50.

Detailed Description

Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present application unless specifically stated otherwise.

The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the application, its application, or uses.

Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.

In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

The MEMS device 100 according to an embodiment of the present invention is described in detail below with reference to the drawings.

As shown in fig. 1, a MEMS device 100 according to an embodiment of the present invention includes a wiring board 10, a case 20, and a MEMS chip 30.

Specifically, the casing 20 is disposed on the circuit board 10, and the casing 20 and the circuit board 10 cooperate to define a containing cavity, and the casing 20 has a top surface 21 and four side surfaces, the four side surfaces being disposed on the circuit board 10, and one of the side surfaces being provided with an acoustic through hole 23 communicating with the containing cavity. The MEMS chip 30 is disposed on the housing 20, and the MEMS chip 30 is located in the accommodating cavity, and the MEMS chip 30 corresponds to the position of the acoustic through hole 23.

In other words, the MEMS device 100 according to the embodiment of the present invention is mainly composed of the wiring board 10, the case 20, and the MEMS chip 30. The MEMS device 100(Micro-Electro-Mechanical System, Micro Electro-Mechanical System) has the characteristics of small volume, good frequency response, low noise, and the like, and is one of the essential devices of the mobile terminal. Referring to fig. 1, in a MEMS device 100 of the present invention, a case 20 is disposed on a circuit board 10, the case 20 covers the circuit board 10 as a case cover, and the case 20 and the circuit board 10 cooperate to form a receiving cavity. The wiring board 10 is called a Printed circuit board (Printed circuit boards), or a Printed circuit board.

The housing 20 has a top surface 21 and four side surfaces, wherein the four side surfaces are provided on the wiring board 10, and the top surface 21 is arranged opposite to the wiring board 10. An acoustic through hole 23 is formed in one side face, and the acoustic through hole 23 is communicated with the accommodating cavity. The sound of the external environment can be introduced into the case 20 from the acoustic through hole 23. The MEMS chip 30 is disposed on the case 20, and the MEMS chip 30 is located in the accommodation chamber. The MEMS chip 30 corresponds to the position of the acoustic via 23. The sound of the external environment is introduced into the accommodating cavity through the sound hole, and the MEMS chip 30 can sense the sound (or called sound pressure) introduced through the acoustic through hole 23 and convert it into an electrical signal.

Compared with the design mode that the acoustic through hole 23 is formed in the top surface 21 of the shell 20 in the prior art, the acoustic through hole 23 is formed in the side surface of the shell 20, so that the influence of external optical noise and electromagnetic radiation on the MEMS chip 30 can be effectively reduced, and the anti-interference capability of the MEMS device 100 is improved. Meanwhile, the prior art opens the acoustic through hole 23 on the top surface 21, and foreign matters such as dust are easy to enter the housing 20 from the top surface 21 of the housing 20. The acoustic through hole 23 is formed in the side face of the housing 20, so that foreign matters can be prevented from entering the accommodating cavity on the premise that structures such as a dust screen are not required to be arranged, the cleanness of the internal environment of the MEMS device 100 is guaranteed, the performance reliability of the MEMS device 100 is improved, and the service life of the MEMS device 100 is prolonged. Moreover, structures such as a dust screen do not need to be arranged in the housing 20, so that the weight of the MEMS device 100 and the occupied space of the internal structure are effectively reduced, and the overall processing difficulty of the MEMS device 100 is reduced. On the other hand, the design mode of the side opening hole does not need to make special structural requirements on the sound channel design for a customer, so that the customer can conveniently design the sound channel, and the flexibility of the sound channel design of the customer is improved.

Of course, it will be understood by those skilled in the art that the design of the acoustic vias 23 for the top surface 21 requires special structural requirements for the acoustic channel design by the customer and will not be described in detail in this application.

Therefore, according to the MEMS device 100 of the embodiment of the present invention, the acoustic through hole 23 is formed on the side surface of the housing 20, so that the influence of the external optical noise and the electromagnetic radiation on the MEMS chip 30 is effectively reduced, and the anti-interference capability of the MEMS device 100 is improved. Meanwhile, the acoustic through hole 23 is formed in the side face of the shell 20, foreign matters can be prevented from entering the accommodating cavity, the internal environment of the MEMS device 100 is clean, the performance reliability of the MEMS device 100 is improved, and the service life of the MEMS device 100 is prolonged. In addition, the design mode of side trompil can make things convenient for the customer to carry out the sound channel design, improves the flexibility of customer's sound channel design.

According to one embodiment of the present invention, the casing 20 is a rectangular parallelepiped structure, the top surface 21 of the casing 20 is arranged opposite to the circuit board 10, the side surfaces include a first side surface 22 and a second side surface which are oppositely arranged, the first side surface 22 shares one long side with the top surface 21 of the casing 20, the second side surface shares the other long side with the top surface 21 of the casing 20, and one of the first side surface 22 and the second side surface is provided with the acoustic through hole 23.

That is, as shown in fig. 1, the housing 20 may be designed in a rectangular structure, the top surface 21 of the housing 20 is disposed opposite to the circuit board 10, and the side surfaces of the housing 20 include a first side surface 22 and a second side surface disposed opposite to each other and a third side surface and a fourth side surface disposed opposite to each other. The top 21 of the housing 20 may be rectangular, the first side 22 shares one of the long sides with the top 21 of the housing 20, and the second side shares the other long side with the top 21 of the housing 20. The third and fourth sides are respectively common to the opposite short sides of the top surface 21. The first side 22 and the second side are long sides and the third side and the fourth side are short sides. The acoustic through hole 23 is provided on the first side 22 or the second side, i.e. the acoustic through hole 23 is provided in the long face of the housing 20. By arranging the acoustic through hole 23 on the first side surface 22 or the second side surface, the influence of external optical noise and electromagnetic radiation on the MEMS chip 30 can be effectively reduced, and the anti-interference capability of the MEMS device 100 is improved. Meanwhile, the acoustic through hole 23 is formed in the first side surface 22 or the second side surface of the shell 20, so that foreign matters can be prevented from entering the accommodating cavity, the internal environment of the MEMS device 100 is clean, the performance reliability of the MEMS device 100 is improved, and the service life of the MEMS device 100 is prolonged. In addition, the design mode of side trompil can make things convenient for the customer to carry out the sound channel design, improves the flexibility of customer's sound channel design.

According to an embodiment of the present invention, the acoustic through hole 23 is provided at a central position of the housing 20 in the height direction, and the acoustic through hole 23 is directly opposite to the MEMS chip 30.

In other words, as shown in fig. 1, the position of the acoustic through hole 23 on the side of the housing 20 is located at the midpoint of the vertical short side of the first side 22 or the second side, so as to ensure that the acoustic through hole 23 is directly opposite to the MEMS chip 30, improve the capability of the MEMS chip 30 to receive external environment sound, and further improve the sensitivity and the acoustic performance of the MEMS device 100.

In some embodiments of the utility model, the diameter of the acoustic through-hole 23 is 0.1-0.6 mm. Optionally, the diameter of the acoustic through-hole 23 is 0.2-0.25 mm.

That is, the aperture of the acoustic through-hole 23 is approximately in the range of 0.1-0.6 mm. Optionally, the aperture of the acoustic through-hole 23 is 0.2-0.25 mm. Through the aperture size of reasonable design acoustics through-hole 23, when guaranteeing sound transmission, interference such as optical noise and electromagnetic radiation can also further be reduced in the environment, effectively promote MEMS device 100's acoustic performance. Of course, the specific aperture size of the acoustic through hole 23 needs to be adjusted correspondingly according to the structural size of the MEMS chip 30, and is not described in detail in this application.

According to an embodiment of the utility model, the MEMS device 100 further comprises: the ASIC chip 40, the ASIC chip 40 is located on the circuit board 10, and the ASIC chip 40 is located and holds the intracavity, and MEMS chip 30 and ASIC chip 40 pass through the metal lead 50 electricity and connect.

In other words, referring to fig. 1, the MEMS device 100 further includes an ASIC chip 40 (ASIC), the capacitance of the MEMS chip 30 changes correspondingly with the change of the incoming sound, and the ASIC chip 40 processes and outputs the changed capacitance signal to pick up the sound. The ASIC chip 40 is disposed on the wiring board 10, and the ASIC chip 40 is located in the accommodation chamber, the ASIC chip 40 being disposed side by side with the MEMS chip 30. The MEMS chip 30 and the ASIC chip 40 are electrically connected by metal leads 50. The ASIC chip 40 and the circuit board are also electrically connected by leads. Ambient sound is introduced into the receiving chamber through the acoustic through-hole 23 in the side of the case 20, and the MEMS chip 30 induces sound waves in the receiving chamber and stably converts the induced sound waves into electrical signals. The capacitance of the MEMS chip 30 will change correspondingly with the difference of the input sound signal, and then the ASIC chip 40 is used to process the changed capacitance signal and output the processed capacitance signal to the circuit board 10, thereby realizing the sound pickup.

In summary, according to the MEMS device 100 of the embodiment of the present invention, the acoustic through hole 23 is formed on the side surface of the housing 20, so that the influence of the external optical noise and the electromagnetic radiation on the MEMS chip 30 is effectively reduced, and the anti-interference capability of the MEMS device 100 is improved. Meanwhile, the acoustic through hole 23 is formed in the side face of the shell 20, foreign matters can be prevented from entering the accommodating cavity, the internal environment of the MEMS device 100 is clean, the performance reliability of the MEMS device 100 is improved, and the service life of the MEMS device 100 is prolonged. In addition, the design mode of side trompil can make things convenient for the customer to carry out the sound channel design, improves the flexibility of customer's sound channel design.

According to a second aspect of the present application, a microphone is provided, comprising the MEMS device 100 of the above embodiments. Since the MEMS device 100 according to the embodiment of the present invention has the above technical effects, the microphone according to the embodiment of the present invention should also have corresponding technical effects, that is, the microphone according to the embodiment of the present invention adopts the MEMS device 100, which can effectively reduce the influence of the MEMS chip 30 by the external optical noise and the electromagnetic radiation, and improve the anti-interference capability of the microphone. Meanwhile, the acoustic through hole 23 is formed in the side face of the shell 20, foreign matters can be prevented from entering the accommodating cavity, the internal environment of the MEMS device 100 is clean, the performance reliability of the microphone is improved, and the service life of the microphone is prolonged. In addition, the design mode of side trompil can make things convenient for the customer to carry out the sound channel design, improves the flexibility of customer's sound channel design.

According to a third aspect of the present application, an electronic product is provided, comprising the MEMS device 100 of the above embodiments. The electronic product of the present application includes a complete machine housing and the MEMS device 100 of the above embodiment disposed in the complete machine housing. The electronic product may be a product with the MEMS device 100, such as a mobile phone, a tablet computer, or a headset.

Since the MEMS device 100 according to the embodiment of the present invention has the above technical effects, the electronic product according to the present invention should also have corresponding technical effects, that is, the electronic product according to the present application adopts the MEMS device 100 according to the embodiment, which can effectively reduce the influence of the MEMS chip 30 by the external optical noise and the electromagnetic radiation, and improve the anti-interference capability of the electronic product. Meanwhile, the acoustic through hole 23 is formed in the side face of the shell 20, so that foreign matters can be prevented from entering the accommodating cavity, the internal environment of the MEMS device 100 is clean, the performance reliability of an electronic product is improved, and the service life of the electronic product is prolonged. In addition, the design mode of side trompil can make things convenient for the customer to carry out the sound channel design, improves the flexibility of customer's sound channel design.

Of course, the working principles and other structures of the MEMS device 100, the microphone and the electronic product of the present application are understood and can be implemented by those skilled in the art, and will not be described in detail in the present application.

Although some specific embodiments of the present application have been described in detail by way of example, it should be understood by those skilled in the art that the above examples are for illustrative purposes only and are not intended to limit the scope of the present application. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the present application. The scope of the application is defined by the appended claims.

Claims

1. A MEMS device, comprising:

a circuit board;

the shell is arranged on the circuit board, the shell and the circuit board are matched to define an accommodating cavity, the shell is provided with a top surface and four side surfaces, the four side surfaces are arranged on the circuit board, and one side surface is provided with an acoustic through hole communicated with the accommodating cavity;

the MEMS chip is arranged on the shell and is positioned in the accommodating cavity, and the position of the MEMS chip corresponds to that of the acoustic through hole.

2. The MEMS device, as recited in claim 1, wherein the housing is a rectangular parallelepiped structure, the top surface of the housing is arranged opposite to the circuit board, the side surfaces include a first side surface and a second side surface that are arranged opposite to each other, the first side surface shares one of the long sides with the top surface of the housing, the second side surface shares the other long side with the top surface of the housing, and one of the first side surface and the second side surface is provided with the acoustic through hole.

3. The MEMS device, as recited in claim 1, wherein the acoustic via is provided at a central position of the case in a height direction, and the acoustic via is directly opposite to the MEMS chip.

4. The MEMS device, as recited in claim 1, wherein the acoustic vias have a diameter of 0.1-0.6 mm.

5. The MEMS device, as recited in claim 1, wherein the acoustic vias have a diameter of 0.2-0.25 mm.

6. The MEMS device, as recited in claim 1, further comprising: the ASIC chip is arranged on the circuit board and is positioned in the accommodating cavity, and the MEMS chip is electrically connected with the ASIC chip through a metal lead.

7. A microphone comprising a MEMS device as claimed in any one of claims 1 to 6.

8. An electronic product comprising a MEMS device according to any one of claims 1 to 6.