CN213280083U - Microphone packaging structure, microphone device and electronic equipment - Google Patents
Microphone packaging structure, microphone device and electronic equipment Download PDFInfo
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- CN213280083U CN213280083U CN202022415372.4U CN202022415372U CN213280083U CN 213280083 U CN213280083 U CN 213280083U CN 202022415372 U CN202022415372 U CN 202022415372U CN 213280083 U CN213280083 U CN 213280083U
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- 238000004806 packaging method and process Methods 0.000 title abstract description 17
- 239000000758 substrate Substances 0.000 claims abstract description 72
- 238000005192 partition Methods 0.000 claims abstract description 23
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 125000006850 spacer group Chemical group 0.000 claims description 2
- 238000010276 construction Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 5
- 230000003287 optical effect Effects 0.000 description 5
- 208000002925 dental caries Diseases 0.000 description 4
- 230000005236 sound signal Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
Abstract
The utility model discloses a microphone packaging structure, microphone device and electronic equipment. The microphone packaging structure comprises a substrate, a shell, an MEMS chip, an ASIC chip and a partition plate; the shell is covered on the substrate and encloses with the substrate to form an inner cavity; the MEMS chip is arranged on the substrate; the ASIC chip is arranged on the substrate; one end of the clapboard is connected with the shell, and the other end of the clapboard is connected with the substrate so as to divide the inner cavity into two independent cavities; the MEMS chip and the ASIC chip are respectively arranged in different cavities, and the cavity where the MEMS chip is arranged is communicated with the outside through the sound hole. The utility model discloses technical scheme avoids the ASIC chip to arouse the light to make an uproar, has improved the interference killing feature of ASIC chip, has further improved the SNR of microphone, has promoted the audio effect of microphone.
Description
Technical Field
The utility model relates to a microphone technical field, in particular to microphone packaging structure, microphone device and electronic equipment.
Background
With the wide application of portable electronic devices, the usage rate of products such as earphones, speakers, microphones and the like is higher and higher, wherein a Micro-Electro-Mechanical System (MEMS) microphone is a microphone manufactured based on the MEMS technology, and mainly includes a diaphragm, a back plate and other important components, the diaphragm and the back plate form a capacitor and are integrated on a silicon wafer, and the distance between the diaphragm and the back plate is changed by the vibration of the diaphragm, so that a sound signal is converted into an electrical signal.
In the related art, a package structure of a microphone generally packages a MEMS chip and an ASIC (Application Specific Integrated Circuit) chip into a cavity, where the MEMS chip is disposed corresponding to a sound hole, so that external light easily enters the cavity from the sound hole and reaches the ASIC chip through reflection, which causes optical noise and affects sound effects of the microphone.
SUMMERY OF THE UTILITY MODEL
The main objective of the present invention is to provide a microphone packaging structure, which aims to solve the problem that the microphone packaging structure easily generates optical noise and affects the sound effect.
In order to achieve the above object, the present invention provides a microphone package structure, which includes a substrate, a housing, a MEMS chip, an ASIC chip, and a partition plate; the shell is covered on the substrate and encloses with the substrate to form an inner cavity; the MEMS chip is arranged on the substrate; the ASIC chip is arranged on the substrate; one end of the partition board is connected with the shell, and the other end of the partition board is connected with the substrate so as to divide the inner cavity into two independent cavities; the MEMS chip and the ASIC chip are respectively arranged in different cavities, and the cavity where the MEMS chip is located is communicated with the outside through a sound hole.
In an embodiment of the present invention, the partition plate and the housing are of an integral structure.
In an embodiment of the present invention, the partition board is welded and fixed to the substrate.
In an embodiment of the present invention, the MEMS chip and the ASIC chip are electrically connected through a circuit inside the substrate.
In an embodiment of the present invention, the microphone package structure further includes a first wire and a second wire, the first wire is connected between the MEMS chip and the substrate, the second wire is connected between the substrate and the ASIC chip, and the first wire and the second wire are electrically connected through the circuit inside the substrate.
In an embodiment of the present invention, the first conductive wire is a gold wire; and/or the second lead is a gold wire.
In an embodiment of the present invention, the sound hole is formed in the substrate, and the sound hole corresponds to the MEMS chip.
In an embodiment of the present invention, the housing is a metal shell.
In an embodiment of the present invention, the housing has a top wall and a side wall connected to the top wall, the top wall is disposed opposite to the substrate, and the side wall is welded and fixed to the substrate; the partition extends from the top wall to connect with the base plate.
In order to achieve the above object, the present invention further provides a microphone device, including the above microphone package structure; the microphone packaging structure comprises a substrate, a shell, an MEMS chip, an ASIC chip and a partition plate; the shell is covered on the substrate and encloses with the substrate to form an inner cavity; the MEMS chip is arranged on the substrate; the ASIC chip is arranged on the substrate; one end of the partition board is connected with the shell, and the other end of the partition board is connected with the substrate so as to divide the inner cavity into two independent cavities; the MEMS chip and the ASIC chip are respectively arranged in different cavities, and the cavity where the MEMS chip is located is communicated with the outside through a sound hole.
In order to achieve the above object, the present invention further provides an electronic product, including the above microphone device; the microphone device comprises the microphone packaging structure; the microphone packaging structure comprises a substrate, a shell, an MEMS chip, an ASIC chip and a partition plate; the shell is covered on the substrate and encloses with the substrate to form an inner cavity; the MEMS chip is arranged on the substrate; the ASIC chip is arranged on the substrate; one end of the partition board is connected with the shell, and the other end of the partition board is connected with the substrate so as to divide the inner cavity into two independent cavities; the MEMS chip and the ASIC chip are respectively arranged in different cavities, and the cavity where the MEMS chip is located is communicated with the outside through a sound hole.
The utility model discloses among the technical scheme microphone packaging structure, locate the base plate through the casing cover, formed the inner chamber that is used for installing MEMS chip and ASIC chip, through setting up the baffle, the casing is connected to the one end of baffle, and other end connection base plate is in order to separate into two independent spaces with the inner chamber to hold MEMS chip and ASIC chip respectively, set up the phonate hole in the cavity that sets up MEMS chip place, thereby made things convenient for MEMS chip and external intercommunication. And furthermore, the function of isolating the MEMS chip and the ASIC chip can be realized through two independent cavities, so that the phenomenon that the light entering the cavity where the MEMS chip is positioned from the sound hole irradiates the ASIC chip is prevented, the optical noise caused by the ASIC chip is avoided, the anti-interference capacity of the ASIC chip is improved, the signal-to-noise ratio of the microphone is further improved, and the sound effect of the microphone is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an embodiment of a microphone package structure of the present invention.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 1 | |
2 | |
| 21 | |
22 | |
| 3 | |
4 | |
| 5 | |
6 | First conductive line |
| 7 | Second |
8 | Sound hole |
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that, if directional indications (such as upper, lower, left, right, front and rear … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
The utility model provides a microphone packaging structure.
In the embodiment of the present invention, as shown in fig. 1, the microphone package structure includes a substrate 1, a housing 2, a MEMS chip 4, an ASIC chip 5, and a partition plate 3; the shell 2 is covered on the substrate 1 and encloses with the substrate 1 to form an inner cavity; the MEMS chip 4 is arranged on the substrate 1; the ASIC chip 4 is arranged on the substrate 1; one end of the partition plate 3 is connected with the shell 2, and the other end of the partition plate is connected with the substrate 1 so as to divide the inner cavity into two independent cavities; the MEMS chip 4 and the ASIC chip 5 are respectively arranged in different cavities, and the cavity where the MEMS chip 4 is located is communicated with the outside through a sound hole 8.
Alternatively, the partition 3 and the housing 2 are of an integral structure, so that the processing process is simplified, and the partition can be directly formed through a stamping process.
The utility model discloses among the technical scheme microphone packaging structure, locate base plate 1 through 2 covers of casing, formed the inner chamber that is used for installing MEMS chip 4 and ASIC chip 5, through setting up baffle 3, casing 2 is connected to 3 one ends of this baffle, other end connecting substrate 1 is in order to separate into two independent spaces with the inner chamber, in order to hold MEMS chip 4 and ASIC chip 5 respectively, set up sound hole 8 in the cavity that sets up MEMS chip 4 place, thereby made things convenient for MEMS chip 4 and external intercommunication. And, further through two independent cavitys, can realize keeping apart MEMS chip 4 and ASIC chip 5's function, and then prevented to follow the phenomenon that the light that sound hole 8 got into MEMS chip 4 place cavity shines ASIC chip 5 to avoided ASIC chip 5 to arouse the optical noise, improved ASIC chip 5's interference killing feature, further improved the SNR of microphone, promoted the audio effect of microphone.
In an embodiment of the present invention, as shown in fig. 1, the partition board 3 is fixed to the substrate 1 by welding to ensure the stable installation of the partition board 3 and the substrate 1, and further ensure the separation of light. Alternatively, the spacer 3 and the substrate 1 may be soldered by solder paste.
In order to simplify the packaging structure of the microphone, as shown in fig. 1, in an embodiment of the present invention, the MEMS chip 4 and the ASIC chip 5 are electrically connected through a circuit inside the substrate 1. The MEMS chip 4 is electrically connected with the ASIC chip 5 to realize the function of converting the microphone sound signal into an electric signal. Because the MEMS chip 4 and the ASIC chip 5 are respectively positioned in two independent cavities, the MEMS chip and the ASIC chip can be directly communicated through a circuit in the substrate 1 during wiring, so that the space is saved, and the risk of wire collapse is avoided due to no wire connection.
Further, as shown in fig. 1, the microphone package structure further includes a first conducting wire 6 and a second conducting wire 7, the first conducting wire 6 is connected between the MEMS chip 4 and the substrate 1, the second conducting wire 7 is connected between the substrate 1 and the ASIC chip 5, and the first conducting wire 6 and the second conducting wire 7 are electrically connected through a line inside the substrate 1. The first wire 6 functions to electrically connect the MEMS chip 4 and the substrate 1. The second wire 7 functions to electrically connect the ASIC chip 5 and the substrate 1.
Alternatively, the first conductive line 6 and the second conductive line 7 are conductive lines, such as copper lines, gold lines, and the like. In order to ensure the stability of electric conduction, the first lead 6 is a gold wire; the second conductive line 7 is a gold wire.
In an embodiment of the present invention, as shown in fig. 1, the sound hole 8 is disposed on the substrate 1, and the sound hole 8 corresponds to the MEMS chip 4. The MEMS chip 4 is attached to the substrate 1, and the sound hole 8 is arranged corresponding to the MEMS chip 4, so that external sound can be smoothly conducted to the vibrating diaphragm of the MEMS chip 4 through the sound hole 8, and the change of an electric signal is realized through the vibration of the vibrating diaphragm. Optionally, the sound hole 8 is formed in the substrate 1, and then the diaphragm of the MEMS chip 4 is covered on the sound hole 8, so as to reduce the interference of sound during the transmission process.
In an embodiment of the present invention, as shown in fig. 1, the housing 2 is a metal shell to play a role of shielding and prevent the external interference to the MEMS chip 4 and the ASIC chip 5.
In an embodiment of the present invention, as shown in fig. 1, the housing 2 has a top wall 21 and a side wall 22 connected to the top wall 21, the top wall 21 is disposed opposite to the substrate 1, and the side wall 22 is welded and fixed to the substrate 1; the partition 3 extends from the top wall 21 to be connected to the base plate 1. The top wall 21, the side wall 22 and the substrate 1 enclose an inner cavity, and optionally, the side wall 22 and the substrate 1 are fixed by solder paste to ensure a sealed connection between the housing 2 and the substrate 1. Baffle 3 and casing 2 integrated into one piece extend to from roof 21 with base plate 1 fixed connection, guaranteed the leakproofness of two independent cavitys, further improved the interference killing feature of microphone.
The utility model discloses still provide a microphone device, this microphone device includes microphone packaging structure, and this microphone packaging structure's concrete structure refers to above-mentioned embodiment, because this microphone device has adopted the whole technical scheme of above-mentioned all embodiments, consequently has all beneficial effects that the technical scheme of above-mentioned embodiment brought at least, and the repeated description is no longer given here.
The utility model also provides an electronic equipment, this electronic equipment include microphone packaging structure, and this microphone device's concrete structure refers to above-mentioned embodiment, because this electronic equipment has adopted the whole technical scheme of above-mentioned all embodiments, consequently has all beneficial effects that the technical scheme of above-mentioned embodiment brought at least, and the repeated description is no longer given here. Optionally, the electronic device may be a wearable device such as a watch and an earphone, or may also be a mobile terminal device such as a mobile phone and a computer.
The above only is the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structure changes made by the contents of the specification and the drawings under the inventive concept of the present invention, or the direct/indirect application in other related technical fields are included in the patent protection scope of the present invention.
Claims (11)
1. A microphone package structure, comprising:
a substrate;
the shell is covered on the substrate and encloses with the substrate to form an inner cavity;
the MEMS chip is arranged on the substrate;
the ASIC chip is arranged on the substrate; and
one end of the clapboard is connected with the shell, and the other end of the clapboard is connected with the substrate so as to divide the inner cavity into two independent cavities; the MEMS chip and the ASIC chip are respectively arranged in different cavities, and the cavity where the MEMS chip is located is communicated with the outside through a sound hole.
2. The microphone package of claim 1, wherein the diaphragm is of unitary construction with the housing.
3. The microphone package structure of claim 1, wherein the spacer is soldered to the substrate.
4. The microphone package structure of claim 1, wherein the MEMS chip and the ASIC chip are electrically connected by a wire inside the substrate.
5. The microphone package of claim 4, further comprising a first wire and a second wire, the first wire connected between the MEMS chip and the substrate, the second wire connected between the substrate and the ASIC chip, the first wire and the second wire electrically connected by a line inside the substrate.
6. The microphone package structure of claim 5, wherein the first conductive line is a gold wire; and/or the second lead is a gold wire.
7. The microphone package structure of any one of claims 1 to 6, wherein the sound hole is disposed on the substrate, and the sound hole is disposed corresponding to the MEMS chip.
8. The microphone package structure of any of claims 1 to 6, wherein the housing is a metal shell.
9. The microphone package structure according to any one of claims 1 to 6, wherein the case has a top wall and a side wall connected to the top wall, the top wall is disposed opposite to the substrate, and the side wall is welded to the substrate; the partition extends from the top wall to connect with the base plate.
10. A microphone arrangement, characterized by comprising a microphone package according to any of claims 1 to 9.
11. An electronic device, characterized in that it comprises a microphone arrangement according to claim 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022415372.4U CN213280083U (en) | 2020-10-26 | 2020-10-26 | Microphone packaging structure, microphone device and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022415372.4U CN213280083U (en) | 2020-10-26 | 2020-10-26 | Microphone packaging structure, microphone device and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213280083U true CN213280083U (en) | 2021-05-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022415372.4U Active CN213280083U (en) | 2020-10-26 | 2020-10-26 | Microphone packaging structure, microphone device and electronic equipment |
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|---|---|
| CN (1) | CN213280083U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114339560A (en) * | 2021-12-23 | 2022-04-12 | 歌尔微电子股份有限公司 | Miniature microphone and electronic equipment |
-
2020
- 2020-10-26 CN CN202022415372.4U patent/CN213280083U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114339560A (en) * | 2021-12-23 | 2022-04-12 | 歌尔微电子股份有限公司 | Miniature microphone and electronic equipment |
| CN114339560B (en) * | 2021-12-23 | 2024-03-19 | 歌尔微电子股份有限公司 | Miniature microphone and electronic equipment |
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