CN112118522B - MEMS microphone - Google Patents
MEMS microphone Download PDFInfo
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- CN112118522B CN112118522B CN202011148838.7A CN202011148838A CN112118522B CN 112118522 B CN112118522 B CN 112118522B CN 202011148838 A CN202011148838 A CN 202011148838A CN 112118522 B CN112118522 B CN 112118522B
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/08—Mouthpieces; Microphones; Attachments therefor
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Pressure Sensors (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
- Micromachines (AREA)
Abstract
The invention provides an MEMS microphone, which comprises a circuit board, a shell, an ASIC chip and an MEMS chip, wherein the shell is connected with the circuit board cover to form a containing cavity, the ASIC chip and the MEMS chip are arranged in the containing cavity, the circuit board, the ASIC chip and the MEMS chip are electrically connected, the MEMS chip comprises a substrate with a back cavity, a back plate fixedly arranged on one side of the substrate and a vibrating diaphragm fixedly arranged on one side of the back plate far away from the substrate, the vibrating diaphragm comprises a vibrating part right facing the back cavity and a fixing part which is arranged around the vibrating part and fixed on the back plate, a vent hole penetrates through the vibrating part, at least one of the circuit board and the shell is provided with a substrate provided with a sound input hole, the substrate is arranged on one side of the vibrating diaphragm, which is far away from the substrate, a support is clamped between the fixing part and the substrate, the support and the ASIC chip are arranged at intervals, the support is provided with a front cavity communicated with the sound input hole and the vent hole, and the front cavity is communicated with the back cavity through the vent hole. Compared with the related art, the MEMS microphone has higher signal-to-noise ratio.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to the field of microphones, in particular to an MEMS (micro-electromechanical systems) microphone.
[ background of the invention ]
With the development of wireless communication, more and more mobile phone users are around the world, and the requirements of the users on the mobile phones are not only satisfied with the call but also capable of providing a high-quality call effect.
As shown in fig. 1 and fig. 2, a MEMS microphone in the related art includes a circuit board 1', a housing 3' covering and connected to the circuit board 1 'to form a receiving cavity 2', and an ASIC chip 4', a MEMS chip 5' disposed on the circuit board 1 'and located in the receiving cavity 2', the circuit board 1', the ASIC chip 4' and the MEMS chip 5 'are electrically connected by a wire, a sound input hole 6' is disposed on the circuit board 1 'or the housing 3', the MEMS chip 5 'includes a substrate having a back cavity and a capacitor system fixed on the substrate and covering the back cavity, and one end of the substrate away from the capacitor system is mounted on the circuit board 1'. However, such MEMS microphones have a low signal-to-noise ratio.
Therefore, there is a need to provide a new MEMS microphone to solve the above technical problems.
[ summary of the invention ]
The invention aims to provide a MEMS microphone to solve the problem of low signal-to-noise ratio of the MEMS microphone in the related art.
In order to achieve the above object, the present invention provides an MEMS microphone, including a circuit board, a housing covering the circuit board to form a receiving cavity, and an ASIC chip and an MEMS chip disposed in the receiving cavity, wherein the circuit board, the ASIC chip and the MEMS chip are electrically connected, the MEMS chip includes a substrate having a back cavity, a back plate fixedly disposed on one side of the substrate, and a diaphragm fixedly disposed on one side of the back plate away from the substrate, the diaphragm includes a vibrating portion facing the back cavity and a fixing portion disposed around the vibrating portion and fixed to the back plate, the vibrating portion is provided with a vent hole therethrough, at least one of the circuit board and the housing has a substrate provided with a sound input hole, the substrate is disposed on one side of the diaphragm facing away from the substrate, and a support is interposed between the fixing portion and the substrate, the support with ASIC chip interval sets up, just the support has the intercommunication sound input hole with the ante-chamber of air vent, the ante-chamber pass through the air vent with the back of the body chamber intercommunication.
Preferably, the wiring board has the substrate, the ASIC chip is fixed on the substrate, and the ASIC chip and the MEMS chip are electrically connected to each other through the wiring board.
Preferably, the bracket includes a ring-shaped first spacer made of a conductive material.
Preferably, the bracket comprises a ring-shaped first spacer made of an insulating material; the substrate has a conductive surface, and the MEMS chip is electrically connected with the ASIC chip through a wire bonded on the conductive surface.
Preferably, the first spacer includes a first wall adjacent to the diaphragm, a second wall adjacent to the base plate, and a pair of third walls connected between the first wall and the second wall, and the first wall, the second wall, and the pair of third walls together enclose the front cavity.
Preferably, a first hole penetrates through the first wall, a second hole penetrates through the second wall, the first hole is communicated with the vent hole, and the second hole is communicated with the front cavity and the sound input hole.
Preferably, the first hole has a larger aperture than the vent hole, and the second hole has a smaller aperture than the sound input hole.
Preferably, the holder includes a second spacer and a silicon wafer, the second spacer is sandwiched between the silicon wafer and the fixing portion, the silicon wafer is sandwiched between the second spacer and the substrate, the second spacer has a first hole, the silicon wafer has a second hole, and the front cavity is formed between the second spacer and the silicon wafer and communicates with the first hole and the second hole.
Preferably, the second hole has a smaller hole diameter than the first hole.
Preferably, the second spacer is made of an insulating material, the substrate has a conductive surface, the MEMS chip is electrically connected to the silicon chip by a wire bonded to the conductive surface, and the silicon chip is electrically connected to the ASIC chip by a wire.
Preferably, the second spacer is made of a conductive material, the MEMS chip is electrically connected to the silicon chip through the second spacer, and the silicon chip is electrically connected to the ASIC chip through a wire.
Preferably, the second spacer is made of a conductive material, the MEMS chip is electrically connected to the silicon chip through the second spacer, and the silicon chip is electrically connected to the ASIC chip through the circuit board.
Preferably, the second spacer is made of an insulating material, the substrate has a conductive surface, and the MEMS chip is electrically connected to the ASIC chip by a wire bonded to the conductive surface.
Compared with the prior art, the MEMS microphone is provided with the substrate with the sound input hole on one of the circuit board and the shell, the support which is arranged at intervals with the ASIC chip is arranged between the fixing part and the substrate, the support is provided with the front cavity which is communicated with the sound input hole and the vent hole, and the front cavity is communicated with the back cavity through the vent hole, so that the MEMS microphone has higher signal-to-noise ratio.
[ description of the drawings ]
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without inventive efforts, wherein:
fig. 1 is a sectional view of a MEMS microphone in the related art;
fig. 2 is a sectional view of another MEMS microphone in the related art;
fig. 3 and 4 are cross-sectional views of a MEMS microphone according to a first embodiment of the present invention;
fig. 5 to 8 are sectional views of a MEMS microphone according to a second embodiment of the present invention;
fig. 9 is a cross-sectional view of a third embodiment of a MEMS microphone in accordance with the present invention.
[ detailed description ] embodiments
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example one
As shown in fig. 3 and 4, the MEMS microphone 10 includes a circuit board 11, a housing 12 covering the circuit board 11 to form a housing cavity 100, and an ASIC chip 13 and a MEMS chip 14 disposed in the housing cavity 100, wherein the circuit board 11, the ASIC chip 13, and the MEMS chip 14 are electrically connected to each other.
The circuit board 11 has a substrate 111, and the substrate 111 has a sound input hole 110 formed therethrough.
As shown in fig. 3, the MEMS chip 14 includes a substrate 141 having a back cavity 140, a back plate 142 fixed on one side of the substrate 141, and a diaphragm 143 fixed on one side of the back plate 142 away from the substrate 141, and the substrate 111 is located on one side of the diaphragm 143 away from the substrate 141. The diaphragm 143 has a vent hole 1430, and the vent hole 1430 together with the housing chamber 100 and the sound input hole 110, thereby achieving static pressure equalization.
The diaphragm 143 includes a vibrating portion 1431 facing the back cavity 140 and a fixing portion 1432 disposed around the vibrating portion 1431 and fixed to the back plate 142, and the vent hole 1430 penetrates the vibrating portion 1431.
The MEMS microphone 10 further includes a support 15, the support 15 having a front cavity 150 communicating with the sound input hole 110 and a vent 1430, the front cavity 150 communicating with the back cavity 140 through the vent 1430.
The support 15 includes a ring-shaped first spacer 151, the first spacer 151 covers the sound input hole 110, and the first spacer 151 is sandwiched between the fixing portion 1432 of the diaphragm 143 and the substrate 111 and disposed spaced apart from the ASIC chip 13.
The first spacer 151 includes a first wall 1511 adjacent to the diaphragm 143, a second wall 1512 opposite to the first wall 1511 and adjacent to the base plate 111, and a pair of third walls 1513 connected between the first wall 1511 and the second wall 1512, wherein the first wall 1511, the second wall 1512, and the pair of third walls 1513 together enclose the front cavity 150.
A first hole 1514 is arranged on the first wall 1511 in a penetrating manner, a second hole 1515 is arranged on the second wall 1512 in a penetrating manner, the first hole 1514 is communicated with the vent hole 1430, and the second hole 1515 is communicated with the front cavity 150 and the sound input hole 110.
The first hole 1514 has a larger aperture than the vent hole 1430, and the second hole 1515 has a smaller aperture than the sound input hole 110. It is understood that in other embodiments, the aperture of the second hole 1515 may be set larger than the aperture of the sound input hole 110.
The first spacer 151 may be made of a conductive material or an insulating material.
As shown in fig. 3, the first spacer 151 is made of a conductive material, the ASIC chip 13 is mounted on the substrate 111, the diaphragm 143 is electrically connected to the first spacer 151, and the first spacer 151 is electrically connected to the ASIC chip 13 through the wiring board 11.
As shown in fig. 4, the first spacer 151 is made of an insulating material, the substrate 141 has a conductive surface 1411 on a side facing away from the backplate 142, and the conductive surface 1411 can be connected with the ASIC chip 13 via a wire 16. The conductive surface 1411 may be formed by depositing a conductive layer on the surface of the substrate 141.
Example two
As shown in fig. 5 to 8, the circuit board, the MEMS chip, the housing, and the ASIC chip are the same as those of the first embodiment, and the second embodiment differs from the first embodiment only in that:
the support 25 includes a second spacer 251 and a silicon wafer 253 forming a front cavity 250 with the second spacer 251.
The silicon chip 253 includes a first base 2531 and a first connection portion 2532 fixed to the first base 2531. The second spacer 251 includes a second base 2511 and a second connection portion 2512 fixed to the second base 2511. The first base 2531 is fixedly arranged on the second base 2511. The first connection portion 2532 is opposite to and spaced apart from the second connection portion 2512 to form the front cavity 250, the first hole 2514 is formed on the second connection portion 2512, and the second hole 2515 is formed on the first connection portion 2532.
The aperture of the second hole 2515 is not larger than that of the sound input hole 210,
The second base 2511 of the second spacer 251 is sandwiched between the diaphragm 243 and the silicon wafer 253. The first base 2531 of the silicon wafer 253 is disposed between the second base 2511 and the substrate 211. The second spacers 251 and the silicon die 253 may be connected to each other by wafer-to-wafer bonding, and the bracket 25 is mounted on the substrate 211 by glue or other bracket mounting techniques.
As shown in fig. 5, the substrate 241 of the MEMS chip 24 has a conductive surface 2411, the MEMS chip 24 is electrically connected with the ASIC chip 23 by a wire 26 bonded on the conductive surface 2411, and the second spacer 251 may be made of an insulating material.
As shown in fig. 6, the substrate 241 of the MEMS chip 24 has a conductive surface 2411, the MEMS chip 24 is electrically connected to the first base 2531 of the silicon chip 253 by a wire 27 bonded to the conductive surface 2411, and the first base 2531 of the silicon chip 253 is electrically connected to the ASIC chip 23 by a wire 28. The second spacers 251 may be made of an insulating material.
As shown in fig. 7, the second spacers 251 are made of a conductive material, the MEMS chip 24 is electrically connected to the silicon chip 253 through the second spacers 251, and the silicon chip 253 is electrically connected to the ASIC chip 23 through the wires 29.
As shown in fig. 8, the second spacers 251 are made of a conductive material, and the MEMS chip 24 is electrically connected to the silicon wafer 253 through the second spacers 251. The silicon chip 253 is electrically connected to the ASIC chip 23 via the wiring board 21.
EXAMPLE III
As shown in fig. 9, the housing 42 has a base plate 421, and the base plate 421 has a sound input hole 420. The ASIC chip 43 and the MEMS chip 44 are mounted on the substrate 421, and the holder 45 is sandwiched between the MEMS chip 44 and the substrate 421.
While the foregoing is directed to embodiments of the present invention, it will be understood by those skilled in the art that various changes may be made without departing from the spirit and scope of the invention.
Claims (12)
1. The utility model provides a MEMS microphone, including the circuit board, with circuit board lid connects the shell that forms and accept the chamber and locates accept ASIC chip and the MEMS chip of intracavity, the circuit board ASIC chip reaches electricity is connected between the MEMS chip, the MEMS chip including the basement that has the back of the body chamber, set firmly in backplate on basement one side and set firmly in the backplate is kept away from vibrating diaphragm on basement one side, the vibrating diaphragm is including just right the vibration portion in back of the body chamber and encircleing the vibration portion sets up and is fixed in the fixed part of backplate, run through in the vibration portion and be equipped with the air vent, its characterized in that: the circuit board with at least one of them side in the shell has the base plate of seting up the sound input hole, the base plate is located the vibrating diaphragm deviates from one side of basement, the fixed part with press from both sides between the base plate and be equipped with the support, the support with ASIC chip interval sets up, just the support has the ante-chamber, wherein, the support with it is equipped with first hole to run through on the wall body that the vibrating diaphragm is adjacent, the support with it is equipped with the second hole to run through on the wall body that the base plate is adjacent, first hole intercommunication the ante-chamber with the air vent intercommunication, the second hole intercommunication the ante-chamber with the sound input hole.
2. The MEMS microphone of claim 1, wherein the wiring board has the substrate, the ASIC chip is fixed on the substrate, and the ASIC chip and the MEMS chip are electrically connected to each other through the wiring board.
3. The MEMS microphone of claim 1, wherein the standoff comprises an annular first spacer, the first spacer being made of an electrically conductive material.
4. The MEMS microphone of claim 1, wherein the standoff comprises a ring-shaped first spacer made of an insulating material, the base having a conductive surface, the MEMS chip being electrically connected to the ASIC chip by a wire bonded on the conductive surface.
5. The MEMS microphone of claim 3 or 4, wherein the first spacer comprises a first wall adjacent to the diaphragm, a second wall adjacent to the substrate, and a pair of third walls connected between the first wall and the second wall, the first wall, the second wall, and the pair of third walls collectively enclosing the front cavity, the first aperture extending through the first wall, the second aperture extending through the second wall.
6. The MEMS microphone of claim 5, wherein an aperture of the first hole is larger than an aperture of the vent hole, and an aperture of the second hole is not larger than an aperture of the sound input hole.
7. The MEMS microphone of claim 1, wherein the support comprises a second spacer and a silicon wafer, the second spacer is sandwiched between the silicon wafer and the fixing portion, the silicon wafer is sandwiched between the second spacer and the substrate, the front cavity is formed between the second spacer and the silicon wafer, the first hole extends through the second spacer, and the second hole extends through the silicon wafer.
8. The MEMS microphone of claim 7, wherein the second hole has a smaller aperture than the first hole.
9. The MEMS microphone of claim 7, wherein the second spacer is made of an insulating material, the substrate has a conductive surface, the MEMS chip is electrically connected to the silicon chip by a wire bonded to the conductive surface, and the silicon chip is electrically connected to the ASIC chip by a wire.
10. The MEMS microphone of claim 7, wherein the second spacer is made of a conductive material, the MEMS chip is electrically connected to the silicon chip through the second spacer, and the silicon chip is electrically connected to the ASIC chip through a wire.
11. The MEMS microphone of claim 7, wherein the second spacer is made of a conductive material, the MEMS chip is electrically connected to the silicon chip through the second spacer, and the silicon chip is electrically connected to the ASIC chip through the wiring board.
12. The MEMS microphone of claim 7, wherein the second spacer is made of an insulating material, the substrate has a conductive surface, and the MEMS chip is electrically connected to the ASIC chip by a wire bonded to the conductive surface.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202017035780A | 2020-09-29 | 2020-09-29 | |
| US17/035,780 | 2020-09-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112118522A CN112118522A (en) | 2020-12-22 |
| CN112118522B true CN112118522B (en) | 2022-04-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011148838.7A Active CN112118522B (en) | 2020-09-29 | 2020-10-23 | MEMS microphone |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN112118522B (en) |
| WO (1) | WO2022067945A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112118522B (en) * | 2020-09-29 | 2022-04-29 | 瑞声声学科技(深圳)有限公司 | MEMS microphone |
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| KR101065292B1 (en) * | 2008-12-22 | 2011-09-19 | 한국전자통신연구원 | The mems microphone and manufacturing method thereof |
| US8199939B2 (en) * | 2009-01-21 | 2012-06-12 | Nokia Corporation | Microphone package |
| CN201467439U (en) * | 2009-07-16 | 2010-05-12 | 华英伦电子(宁波)有限公司 | Electret capacitance type microphone with improved integral vocal cavity component |
| JP4893860B1 (en) * | 2011-02-21 | 2012-03-07 | オムロン株式会社 | microphone |
| US8502329B2 (en) * | 2011-09-01 | 2013-08-06 | Solid State System Co., Ltd. | Micro-electro-mechanical systems (MEMS) device and method for fabricating the same |
| KR20130039504A (en) * | 2011-10-12 | 2013-04-22 | 한국전자통신연구원 | Mems microphone and manufacturing method thereof |
| CN103475983A (en) * | 2013-09-13 | 2013-12-25 | 山东共达电声股份有限公司 | Mems microphone and electronic equipment |
| CN104980858B (en) * | 2014-04-02 | 2019-03-29 | 中芯国际集成电路制造(上海)有限公司 | The forming method of MEMS microphone |
| CN204442689U (en) * | 2015-01-26 | 2015-07-01 | 歌尔声学股份有限公司 | Mems microphone |
| CN104754481A (en) * | 2015-03-13 | 2015-07-01 | 钰太芯微电子科技（上海）有限公司 | MEMS (Micro-Electro-Mechanical system) microphone monomer |
| CN104822118B (en) * | 2015-05-06 | 2018-11-30 | 歌尔股份有限公司 | A kind of encapsulating structure of MEMS microphone |
| CN106954164B (en) * | 2016-01-06 | 2020-05-08 | 中芯国际集成电路制造(上海)有限公司 | Microphone structure and manufacturing method thereof |
| CN205622875U (en) * | 2016-03-09 | 2016-10-05 | 歌尔股份有限公司 | MEMS microphone |
| KR101807040B1 (en) * | 2016-05-26 | 2017-12-08 | 현대자동차 주식회사 | Microphone |
| CN106658317A (en) * | 2016-11-21 | 2017-05-10 | 歌尔股份有限公司 | MEMS sound generating device and electronic equipment |
| TWM543239U (en) * | 2017-01-26 | 2017-06-11 | 日月光半導體製造股份有限公司 | MEMS package structure |
| CN108569672B (en) * | 2017-03-13 | 2020-08-25 | 中芯国际集成电路制造(上海)有限公司 | Microphone and method for manufacturing the same |
| CN207910960U (en) * | 2018-01-31 | 2018-09-25 | 瑞声声学科技(深圳)有限公司 | Microphone |
| JP6819634B2 (en) * | 2018-03-13 | 2021-01-27 | オムロン株式会社 | Acoustic sensor element and acoustic sensor package |
| CN108513241B (en) * | 2018-06-29 | 2024-04-19 | 潍坊歌尔微电子有限公司 | Vibration sensor and audio device |
| US11750983B2 (en) * | 2018-10-26 | 2023-09-05 | Knowles Electronics, Llc | Microphone assembly with standoffs for die bonding |
| CN208821084U (en) * | 2018-10-31 | 2019-05-03 | 歌尔股份有限公司 | A kind of MEMS microphone package structure |
| CN208940245U (en) * | 2018-11-02 | 2019-06-04 | 歌尔科技有限公司 | The encapsulating structure and electronic equipment of MEMS microphone |
| CN208940246U (en) * | 2018-11-16 | 2019-06-04 | 歌尔科技有限公司 | A kind of MEMS microphone |
| WO2020258171A1 (en) * | 2019-06-27 | 2020-12-30 | 瑞声声学科技(深圳)有限公司 | Vibration sensor and audio device |
| WO2020258172A1 (en) * | 2019-06-27 | 2020-12-30 | 瑞声声学科技(深圳)有限公司 | Vibration sensor, audio apparatus, and method for assembling vibration sensor |
| CN111263283A (en) * | 2020-02-17 | 2020-06-09 | 瑞声声学科技(深圳)有限公司 | Optical microphone |
| CN112118522B (en) * | 2020-09-29 | 2022-04-29 | 瑞声声学科技(深圳)有限公司 | MEMS microphone |
-
2020
- 2020-10-23 CN CN202011148838.7A patent/CN112118522B/en active Active
- 2020-11-01 WO PCT/CN2020/125734 patent/WO2022067945A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| CN112118522A (en) | 2020-12-22 |
| WO2022067945A1 (en) | 2022-04-07 |
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