CN211656379U

CN211656379U - MEMS microphone

Info

Publication number: CN211656379U
Application number: CN202020264558.1U
Authority: CN
Inventors: 胡恒宾; 王天娇
Original assignee: AAC Acoustic Technologies Shenzhen Co Ltd
Current assignee: AAC Technologies Holdings Shenzhen Co Ltd
Priority date: 2020-03-05
Filing date: 2020-03-05
Publication date: 2020-10-09
Anticipated expiration: 2030-03-05
Also published as: WO2021174587A1

Abstract

The utility model provides a MEMS microphone. The utility model discloses a MEMS microphone, including the casing that has accommodating space and accept MEMS chip and ASIC chip in accommodating space, the casing is including the base plate that is used for installing MEMS chip and ASIC chip, enclose the first metal shell and the spacer sleeve that establish and form accommodating space with the base plate and locate the outer second metal shell of first metal shell, the second metal shell is fixed in on the base plate and forms first shell clearance with base plate and first metal shell, be equipped with the pickup hole with MEMS chip looks adaptation on the base plate, be equipped with the air vent in intercommunication accommodating space and first shell clearance on the first metal shell. Through set up the second metal casing outside first metal casing, can pass through the air vent with the inflation air in the shell clearance at the in-process of reflow soldering installation and transmit to accommodating space in to derive through the pickup hole, thereby avoided the second metal casing to receive the inflation and lead to the condition that drops.

Description

MEMS microphone

[ technical field ] A method for producing a semiconductor device

The utility model relates to an electroacoustic conversion technology field especially relates to a MEMS microphone.

[ background of the invention ]

The MEMS microphone is an electric transducer manufactured based on MEMS (micro electro mechanical system) technology, and has the characteristics of small volume, good frequency response characteristics, low noise, and the like. With the development of miniaturization and thinning of electronic devices, MEMS microphones are increasingly widely used in electronic devices.

In the prior art, the MEMS microphone is generally mounted by soldering on a circuit board in a high temperature reflow soldering manner, and the housing is likely to fall off due to the high temperature during the soldering process.

[ Utility model ] content

An object of the utility model is to provide a MEMS microphone aims at solving the problem that the shell drops easily among the MEMS microphone installation.

The technical scheme of the utility model as follows:

the utility model relates to a MEMS microphone, including the casing that has accommodating space and accept in MEMS chip and ASIC chip in the accommodating space, the casing is including being used for the installation the MEMS chip with the base plate of ASIC chip, with the base plate encloses and establishes formation accommodating space's first metal-back and spacer locate the outer second metal-back of first metal-back, the second metal-back is fixed in the base plate and with the base plate and first metal-back encloses and establishes the second metal-back that forms first shell clearance, be equipped with on the base plate with the pickup hole that the MEMS chip corresponds, be equipped with the intercommunication on the first metal-back accommodating space with the air vent in first shell clearance.

Preferably, the substrate is provided with a first positioning portion extending from a surface close to the first metal shell toward the first metal shell, and a surface of the first metal shell toward the substrate is fixed to the first positioning portion.

Preferably, the substrate is provided with a second positioning portion extending from a surface close to the second metal shell toward the second metal shell, and the surface of the second metal shell toward the substrate is fixed to the second positioning portion.

Preferably, the substrate is a circuit board, the ASIC chip is electrically connected to the circuit board, and the MEMS chip is electrically connected to the MEMS chip through a metal lead.

Preferably, the casing is still including being fixed in third metal casing on the base plate, the third metal casing is located in the first shell clearance and the spacer sleeve is located first metal casing with between the second metal casing, just enclose between third metal casing, first metal casing and the base plate and establish and form second shell clearance, enclose between third metal casing, second metal casing and the base plate and establish and form third shell clearance, be equipped with the intercommunication on the third metal casing second shell clearance and the perforating hole in third shell clearance.

Preferably, the third metal shell includes a plurality of, and a plurality of mutual interval cover is established between the third metal shell, all be equipped with on a plurality of the metal shell the perforating hole.

The beneficial effects of the utility model reside in that:

the utility model provides a MEMS microphone can pass through the air vent with the inflation air in the first shell clearance at the in-process of reflow soldering installation and transmit accommodating space to through the pickup hole through setting up the second metal casing outside first metal casing to derive, thereby avoided the second metal casing to receive the inflation and lead to the condition that drops.

[ description of the drawings ]

Fig. 1 is a schematic structural diagram of an MEMS microphone according to the present invention;

fig. 2 is an exploded schematic view of the MEMS microphone of the present invention;

fig. 3 is a schematic cross-sectional view of the MEMS microphone of the present invention along the direction a-a in fig. 1;

fig. 4 is a schematic cross-sectional view of another embodiment of the present invention.

[ detailed description ] embodiments

The present invention will be further described with reference to the accompanying drawings and embodiments.

Referring to fig. 1-3, the present invention relates to a MEMS microphone, including a housing 10 having an accommodating space 110, and a MEMS chip 15 and an ASIC chip 14 accommodated in the accommodating space 110, the housing 10 includes a substrate 13 for mounting the MEMS chip 15 and the ASIC chip 14, a first metal shell 11 and a second metal shell 12 surrounding the substrate 13 to form the accommodating space 110, the second metal shell 12 is fixed on the substrate 13 and surrounds the substrate 13 and the first metal shell 11 to form a first shell gap 120, a sound-collecting hole 131 is formed on the substrate 13, a communication hole 151 communicating the sound-collecting hole 131 with the accommodating space 110 is formed on the MEMS chip 15, and a vent hole 111 communicating the accommodating space 110 with the first shell gap 120 is formed on the first metal shell 11.

Compared with the prior art, the utility model provides a MEMS microphone can pass through air vent 111 with the inflation air in first shell clearance 120 in the in-process of reflow soldering installation and transmit to accommodating space 110 through air vent 111 through setting up second metal casing 12 outside first metal casing 11 to derive through intercommunicating pore 151 and pick up sound hole 131, thereby avoided second metal casing 12 to receive the inflation and lead to the condition that drops.

It should be noted that, the first metal shell 11 and the second metal shell 12 of the present invention are mainly configured to play a certain buffering role in the heating process through the first shell gap 120 between the first metal shell 11 and the second metal shell 12, so as to avoid the second metal shell 12 not to easily drop off when the external temperature rises.

The utility model provides a different injectures can be carried out according to actual conditions to air vent 111 shape, size, specific position and quantity.

In this embodiment, the substrate 13 is provided with a first positioning portion 132 extending from a surface close to the first metal shell 11 toward the first metal shell 11, and the surface of the first metal shell 11 toward the substrate 13 is fixed to the first positioning portion 132. The utility model provides a carry out the physics through glue between first metal casing 11 and the first location portion 132 and be connected, and first metal casing 11 is connected for full-sealed with the junction of first location portion 132 to accommodating space 110 and external environment's isolation has been guaranteed.

In this embodiment, the substrate 13 is provided with a second positioning portion 133 extending from a surface close to the second metal shell 12 toward the second metal shell 12, and a surface of the second metal shell 12 toward the substrate 13 is fixed to the second positioning portion 133. The utility model provides a carry out physical connection through glue between second metal casing 12 and the second location portion 133, and second metal casing 12 is connected for full sealing with the junction of second location portion 133 to first shell clearance 120's gas tightness has been guaranteed.

In this embodiment, the substrate 13 is a circuit board, the ASIC chip 14 is electrically connected to the circuit board, and the MEMS chip 15 is electrically connected to the MEMS chip 15 through a metal wire. Referring to fig. 4, in another embodiment of the present invention, different from the above embodiment, the housing 10 further includes a third metal shell 16 fixed on the substrate 13, the third metal shell 16 is disposed in the first shell gap 120 and disposed between the first metal shell 11 and the second metal shell 12 with a spacer, a second shell gap 121 is formed between the third metal shell 16, the first metal shell 11 and the substrate 13, a third shell gap 122 is formed between the third metal shell 16, the second metal shell 12 and the substrate 13, and a through hole 161 penetrating the second shell gap 121 and the third shell gap 122 is disposed on the third metal shell 16.

In this embodiment, the third metal shells 16 include a plurality of third metal shells 16, the plurality of third metal shells 16 are sleeved at intervals, and the plurality of third metal shells 16 are provided with through holes 161. That is, the utility model discloses not being restricted to and using two-layer or metal-back to carry out the buffering in shell clearance, also can increase the setting of metal-back according to specific demand to the demand that adapts to more the condition.

The above are only embodiments of the present invention, and it should be noted that, for those skilled in the art, modifications can be made without departing from the inventive concept, but these all fall into the protection scope of the present invention.

Claims

1. The utility model provides a MEMS microphone, including the casing that has accommodating space and accept in MEMS chip and ASIC chip in the accommodating space, its characterized in that, the casing is including being used for the installation the MEMS chip with the base plate of ASIC chip, with the base plate encloses to establish and forms accommodating space's first metal-back and spacer sleeve are located the outer second metal-back of first metal-back, the second metal-back is fixed in the base plate and with the base plate and first metal-back encloses to establish and forms first shell clearance, be equipped with on the base plate with the pickup hole that the MEMS chip corresponds, be equipped with the intercommunication on the first metal-back accommodating space with the air vent in first shell clearance.

2. The MEMS microphone of claim 1, wherein the substrate is provided with a first positioning portion extending from a surface close to the first metal shell toward the first metal shell, and a surface of the first metal shell facing the substrate is fixed to the first positioning portion.

3. The MEMS microphone of claim 1, wherein the substrate is provided with a second positioning portion extending from a surface close to the second metal shell toward the second metal shell, and a surface of the second metal shell toward the substrate is fixed to the second positioning portion.

4. The MEMS microphone of claim 1, wherein the substrate is a circuit board, the ASIC chip is electrically connected to the circuit board, and the MEMS chip is electrically connected to the MEMS chip by a metal wire.

5. The MEMS microphone of claim 1, wherein the housing further comprises a third metal shell fixed on the substrate, the third metal shell is disposed in the first shell gap and disposed between the first metal shell and the second metal shell, a second shell gap is defined between the third metal shell, the first metal shell and the substrate, a third shell gap is defined between the third metal shell, the second metal shell and the substrate, and a through hole is disposed on the third metal shell to connect the second shell gap and the third shell gap.

6. The MEMS microphone of claim 5, wherein the third metal shells comprise a plurality of third metal shells, the plurality of third metal shells are spaced from each other and sleeved with each other, and the plurality of third metal shells are provided with the through holes.