CN103475983A - Mems microphone and electronic equipment - Google Patents
Mems microphone and electronic equipment Download PDFInfo
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- CN103475983A CN103475983A CN201310417196XA CN201310417196A CN103475983A CN 103475983 A CN103475983 A CN 103475983A CN 201310417196X A CN201310417196X A CN 201310417196XA CN 201310417196 A CN201310417196 A CN 201310417196A CN 103475983 A CN103475983 A CN 103475983A
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Abstract
The invention provides an MEMS microphone and electronic equipment. The MEMS microphone comprises an integrated circuit chip and an MEMS chip, wherein the integrated circuit chip is installed inside a cavity formed by connecting an outer shell, a first printed circuit board and a second printed circuit board in a sealed mode, wherein a vibrating membrane is arranged on the MEMS chip, the integrated circuit chip and the MEMS chip are fixed to the first printed circuit board, and the integrated circuit chip, the MEMS chip and the first printed circuit board are electrically connected through metal wires; the first printed circuit board is electrically connected with the second printed circuit board through a supporting connecting piece, a sound hole is formed in the first printed circuit board, and the external of the first printed circuit board and the external of the second printed circuit board are respectively provided with a bonding pad. According to the MEMS microphone, the two printed circuit boards are utilized, so not only can the MEMS microphone be glued with the applied electronic equipment in a two-sided mode, but also sensitivity and the signal to noise ratio a MEMS microphone where sound enters from the front are improved.
Description
Technical field
The present invention relates to the microphone techniques field, especially, relate to a kind of MEMS microphone and electronic equipment.
Background technology
The MEMS microphone is the Microphone that adopts MEMS (micro electro mechanical system) (Microelectromechanical Systems, MEMS) technique to make.This Novel microphone includes two chips: MEMS chip and application-specific integrated circuit (ASIC) (Application Specific Integrated Circuit, ASIC) chip, two pieces of chip packages are in a surface mount device package body.The MEMS chip comprises that a rigid perforated back electrode and a slice are used as the elasticity silicon fiml of capacitor.This elasticity silicon fiml is converted to capacitance variations by sound wave.Asic chip is for detection of capacitance variations, and is converted into signal of telecommunication output.
Existing MEMS microphone divides advance sound and two kinds of structures of zero elevation.Show the advance structural representation of sound MEMS microphone of prior art with reference to Fig. 1, comprising: printed circuit board (PCB) (Printed Circuit Board, PCB) 1, MEMS chip 2, asic chip 5, vibrating diaphragm 10, microphone case 8, sound hole 11.Wherein, microphone case 8 seals and forms cavity by fluid sealant 9 with printed circuit board (PCB) 1, and inside cavity arranges asic chip 5 and MEMS chip 2.Asic chip 5 is bonded on printed circuit board (PCB) 1 by fixing glue 6, and is encapsulated by packaging plastic 7.MEMS chip 2 is fixed on printed circuit board (PCB) 1 by MEMS sheet packaging plastic 3.Be provided with vibrating diaphragm 10 on MEMS chip 2, inside is provided with cavity 13.Asic chip 5, MEMS chip 2 and printed circuit board (PCB) 1 are realized three's electrical connection by gold thread 4, signal is delivered to then output on printed circuit board (PCB) 1.Sound inlet 11 is arranged on microphone case 8, and after microphone and application product laminating, with respect to the PCB of MEMS microphone, sound can only advance sound from the place ahead, so the sound MEMS microphone that is referred to as to advance.
Because the acoustic sensitivity of MEMS microphone is relevant with the size in ante-chamber, back of the body chamber, back of the body chamber is less, and the damping of sound is larger, and sensitivity is just less.On the contrary, back of the body chamber is larger, and the damping of sound is less, and sensitivity is higher.The existing sound inlet that advances sound MEMS microphone is opened on microphone case 8, the cavity 12 be communicated with sound inlet 11 is ante-chamber, the cavity 13 be sealed in the MEMS chip is less for the relative ante-chamber 12 in back of the body ，Bei chamber, chamber 13, and so the acoustic sensitivity of the sound MEMS microphone that advances existing is not high.
Fig. 2 shows the structural representation of prior art zero elevation MEMS microphone, with the sound MEMS microphone that advances shown in Fig. 1, compare, most of structure is all identical with parts, and unique difference is: the sound inlet 11 of zero elevation MEMS microphone is opened on printed circuit board (PCB) 1.
After the PCB of existing zero elevation MEMS microphone and the PCB of application product laminating, the cavity 13 of MEMS chip is communicated with sound inlet 11, is called ante-chamber.12 of residue seal chambers are larger for carrying on the back the relative ante-chamber 13 in ，Bei chamber, chamber 12, and sound dampening is less, so sensitivity is higher.Yet, although existing zero elevation MEMS microphone has higher sensitivity, when it is combined with product, can only fit by printed circuit board (PCB) 1 and the pcb board of product, advance sound from the rear of MEMS microphone PCB, the use flexibility ratio of product is not high.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of MEMS microphone, and the sound of can realizing advancing possesses again high sensitivity, high s/n ratio.
In order to address the above problem, the invention provides a kind of MEMS microphone, comprising: be built in shell and be connected integrated circuit (IC) chip, the MEMS chip in formed cavity with the first printed circuit board (PCB), the second printed circuit board seal; Above-mentioned MEMS chip is provided with vibrating diaphragm, and inside is provided with cavity; Said integrated circuit chip and MEMS chip are fixed on above-mentioned the first printed circuit board (PCB) and by metal wire and realize that the three is electrically connected to; Above-mentioned the first printed circuit board (PCB) is electrically connected to by support connecting piece with the second printed circuit board (PCB); Sound hole is arranged on above-mentioned the first printed circuit board (PCB).
Preferably, above-mentioned shell is the annular recess structure.
Preferably, above-mentioned support connecting piece is the insulated product that inside is embedded with electric conducting material.
Preferably, the sound inlet of above-mentioned the first printed circuit board (PCB) is arranged at the cavity position over against above-mentioned MEMS chip.
Preferably, above-mentioned MEMS microphone also comprises: cover the protective cover of above-mentioned MEMS chip top, the top of above-mentioned protective cover and above-mentioned vibrating diaphragm keep certain distance, and the bottom of above-mentioned protective cover is fixedly connected with above-mentioned the first printed circuit board (PCB).
Preferably, the top of above-mentioned protective cover offers a groove.
Preferably, be provided with the pad that comprises air-vent between above-mentioned MEMS chip and above-mentioned the first printed circuit board (PCB).
Preferably, be provided with protective wire above above-mentioned vibrating diaphragm.
Preferably, the sound inlet of above-mentioned the first printed circuit board (PCB) is arranged at the position of departing from above-mentioned MEMS chip, by a tunnel type slotted hole, with the cavity of above-mentioned MEMS chip, is communicated with.
On the other hand, also provide a kind of electronic equipment, comprised the electronic equipment body and be fitted in the microphone on the printed circuit board (PCB) of this electronic equipment body, above-mentioned microphone is above-mentioned arbitrary described MEMS microphone.
Compared with prior art, a technical scheme in technique scheme has the following advantages:
In MEMS microphone embodiment of the present invention, be provided with two printed circuit board, the user can utilize the first printed circuit board (PCB) and application product laminating, also can utilize the second printed circuit board (PCB) and application product laminating, for the application product of focusing on space provides MEMS microphone set-up mode more flexibly.Simultaneously, sound inlet is arranged on the first printed circuit board (PCB), utilize the PCB laminating of the second printed circuit board (PCB) and application product, can realize the sound that advances, possess again high s/n ratio, high sensitivity that zero elevation MEMS microphone has, possess the advance advantage of sound product and zero elevation product of prior art simultaneously.
The accompanying drawing explanation
Fig. 1 is the advance structural representation of sound MEMS microphone of prior art;
Fig. 2 is the structural representation of prior art zero elevation MEMS microphone;
Fig. 3 is the structural representation of MEMS microphone embodiment mono-of the present invention;
Fig. 4 is the vertical view of support connecting piece in MEMS microphone embodiment mono-of the present invention;
Fig. 5 is MEMS microphone embodiment of the present invention mono-vertical view;
Fig. 6 is the structural representation of MEMS microphone embodiment bis-of the present invention;
Fig. 7-1st, the cutaway view of the protective cover embodiment mono-of MEMS microphone embodiment bis-of the present invention;
Fig. 7-2nd, the vertical view of protective cover embodiment mono-shown in Fig. 7-1;
Fig. 8-1st, the cutaway view of the protective cover embodiment bis-of MEMS microphone embodiment bis-of the present invention;
Fig. 8-2nd, the vertical view of protective cover embodiment bis-shown in Fig. 8-1.
Embodiment
For above-mentioned purpose of the present invention, feature and advantage can be become apparent more, below in conjunction with the drawings and specific embodiments, the present invention is further detailed explanation.
With reference to the structural representation of the MEMS microphone embodiment mono-of the present invention shown in Fig. 3, MEMS microphone provided by the invention comprises: shell 22, the first printed circuit board (PCB) 1, the second printed circuit board (PCB) 20, MEMS chip 2, asic chip 5, vibrating diaphragm 10, sound inlet 11, pad 23, support part 21 in succession.
Wherein, shell 22 and the first printed circuit board (PCB) 1, the second printed circuit board (PCB) 20 formation cavity that is tightly connected, built-in asic chip 5 and MEMS chip 2.In above-mentioned inside cavity, asic chip 5 is bonded on the first printed circuit board (PCB) 1 by fixing glue 6, and is encapsulated by packaging plastic 7.MEMS chip 2 is fixed on the first printed circuit board (PCB) 1 by MEMS sheet packaging plastic 3.Be provided with vibrating diaphragm 10 on MEMS chip 2, inside is provided with cavity 13.Asic chip 5, MEMS chip 2 and the first printed circuit board (PCB) 1 are realized three's electrical connection by metal wire 4, signal is delivered to then output on the first printed circuit board (PCB) 1.Between the first printed circuit board (PCB) 1 and the second printed circuit board (PCB) 20, adopt support connecting piece 21 to be electrically connected to.Support connecting piece 21 also is positioned at above-mentioned inside cavity.Sound inlet 11 is arranged on the first printed circuit board (PCB) 1.
Be provided with pad 23 on the first printed circuit board (PCB) 1 and the second printed circuit board (PCB) 20.By pad 23, MEMS microphone embodiment mono-of the present invention can be combined with application product, embodiment is: by pad 23, the PCB of the printed circuit board (PCB) of MEMS microphone and application product is welded together.
In the present embodiment one, support two printed circuit board (PCB)s and realize that the support connecting piece 21 of the two electrical connection can adopt inside to be inlaid with the insulated product of electric conducting material, is inlaid with plastic products of metal etc. as inside.Fig. 4 shows the vertical view of the support connecting piece of MEMS microphone embodiment mono-of the present invention, and for easy to assembly, support connecting piece 21 can be designed to be inlaid with the ring-type insulated product of electric conducting material 210.
Preferably, shell 22 is the annular recess structure, can also, according to the shape need of MEMS microphone, be designed to square ring groove structure, circular ring-type groove structure or elliptical annular groove structure etc.MEMS microphone embodiment mono-vertical view as shown in Figure 5, the first printed circuit board (PCB) 1 is built in the groove of shell 22, and the edge of printed circuit board (PCB) 1 is sealed by shell 22.Printed circuit board (PCB) 1 can adopt fluid sealant to be sealed with the junction, edge of shell 22, also can adopt tin cream to be sealed.Equally, the second printed circuit board (PCB) 20 is also adopted in the same way and is connected with shell 20.Shell embodiment of the present invention adopts the annular recess structure, is more conducive to being tightly connected between two printed circuit board (PCB)s and shell.
MEMS microphone embodiment mono-of the present invention comprises two printed circuit board (PCB)s, between two printed circuit board (PCB)s, adopt support connecting piece to be electrically connected to, and be provided with pad on each printed circuit board (PCB), the printed circuit board (PCB) of the printed circuit board (PCB) of microphone and application product can be welded together by pad.Visible, adopt MEMS microphone of the present invention both the first printed circuit board (PCB) and application product can be welded together, also the printed circuit board (PCB) of the second printed circuit board (PCB) and application product can be welded together.
When the first printed circuit board (PCB) and application product weld together, this microphone is zero elevation MEMS microphone.Similar with zero elevation MEMS microphone of the prior art, can be arranged under application product PCB by the first printed circuit board (PCB).
When the second printed circuit board (PCB) and application product weld together, sound is to advance sound from the place ahead of application product PCB, is provided with the first printed circuit board (PCB) 1 of sound inlet 11 towards outside, has the characteristics of the sound MEMS microphone that advances.The cavity 13 of the MEMS chip internal now, be connected with sound inlet 11 is ante-chamber.Corresponding, two printed circuit board (PCB)s are connected formed cavity and remove asic chip 5, the MEMS chip 2 remaining airtight cavity 12 that takes up room and be referred to as to carry on the back chamber 12 with body seal.Back of the body chamber 12 is more much larger than the volume of ante-chamber 13, so the sensitivity of sound is higher, signal to noise ratio is higher, possesses the characteristics of zero elevation MEMS microphone.Thereby MEMS microphone embodiment mono-of the present invention not only possesses the characteristics of the sound that advances but also possess high sensitivity, the high s/n ratio that zero elevation MEMS microphone has advantages of, than the advance sensitivity of sound MEMS microphone of prior art, obviously improve.
In addition, the present invention also provides MEMS microphone preferred embodiment, with reference to the structural representation of the MEMS microphone embodiment bis-shown in Fig. 6.MEMS microphone embodiment bis-, on the basis of the MEMS microphone embodiment mono-shown in Fig. 3 to Fig. 5, has set up protective cover 24 above MEMES chip 2.
Particularly, protective cover 24 covers MEMS chip 2 tops, also covers the top of vibrating diaphragm 10 simultaneously, and the top of protective cover 24 and vibrating diaphragm 10 keep certain distance, and the bottom of protective cover 24 is fixedly connected with the first printed circuit board (PCB) 1.
Fig. 7 shows the structural representation of protective cover 24 embodiment mono-, wherein, and the cutaway view that Fig. 7-1 is protective cover embodiment mono-, the vertical view that Fig. 7-2 are protective cover embodiment mono-.Protective cover is the square groove structure, for the protection of vibrating diaphragm 10.
The purposes of protective cover embodiment of the present invention is: under larger acoustic pressure or air pressure; vibrating diaphragm 10 occurs than large deformation; the protective cover 24 that covers vibrating diaphragm 10 tops can prevent that vibrating diaphragm 10 from excessive deformation or damaged deformation occurring; be only deformation within the specific limits of vibrating diaphragm 10; if exceed top and the restriction of protected cover that this scope is touched protective cover, protect in this way vibrating diaphragm.
Fig. 8 shows the structural representation of protective cover 24 embodiment bis-, wherein, and the cutaway view that Fig. 8-1 is protective cover embodiment bis-, the vertical view that Fig. 8-2 are protective cover embodiment bis-.The protective cover that the present embodiment provides is provided with groove 240 in inside top, and when protective cover 24 is covered in MEMS chip 2 top, the position of this groove 240 is relative with the position of sound inlet 11.The shape of groove 240 can, for shapes such as square, arcs, can be also the network structure of some small holes.
In the present embodiment, the effect that increases groove 240 is: guarantee that vibrating diaphragm 10 can not touch the surface of protective cover 24 in vibration processes, guarantee vibrating diaphragm 10 normal operations.Simultaneously, being provided with of groove 240 is beneficial to the mobility that ensures vibrating diaphragm 10 top air, reduces acoustic resistance, thereby reduces the distorted signals of microphone.
In the above embodiment of the present invention, the vertical range of the top of protective cover 24 and vibrating diaphragm 10 is no more than 50 microns.Preferably, the vertical range of the top of protective cover 24 and vibrating diaphragm 10 remains between 10 ~ 30 microns.Protective cover 24 can adopt metal material to make, and also can adopt nonmetallic materials to make.
To sum up, the embodiment of the present invention adopts and is fixed on the protective cover on the first printed circuit board (PCB), covers MEMS chip top; can protect simply and effectively the MEMS chip; reduce the damaged risk of MEMS chip vibrating diaphragm, improve the reliability of MEMS microphone, extend the useful life of MEMS microphone.
In addition, the embodiment of the present invention also can adopt in the mode that the protection gold thread is set or be provided with the pad that comprises air-vent above vibrating diaphragm between MEMS chip and the first printed circuit board (PCB) and reach the purpose that prevents the vibrating diaphragm damage.Simultaneously, also can adopt the position of departing from the MEMS chip on the first printed circuit board (PCB) that sound inlet is set, by a tunnel type slotted hole, sound inlet is communicated with the cavity of MEMS chip, and then reach the purpose of protection vibrating diaphragm.
The present invention also provides a kind of electronic equipment of applying above-mentioned arbitrary MEMS microphone embodiment, comprises the electronic equipment body and is fitted in the arbitrary above-mentioned MEMS microphone embodiment on the PCB of this electronic equipment body.Above-mentioned electronic equipment body comprises: the hands-free message equipment on mobile phone, digital camera, notebook computer, personal digital assistant, MP3 player, earphone, hearing aids, automobile etc.
Visible, the MEMS microphone that the embodiment of the present invention provides has purposes very widely, both can be used for Smartphone, also can be used for consumer electronics product, notebook computer and Medical Devices, as hearing aids, also can be applicable to automobile industry, as hands-free message equipment.Or even be applied to industrial circle, for example, with the running of sonic sensor watch-dog.
Each embodiment in this specification all adopts the mode of going forward one by one to describe, and what each embodiment stressed is and the difference of other embodiment that between each embodiment, identical similar part is mutually referring to getting final product.
Above to a kind of MEMS microphone provided by the present invention and electronic equipment, be described in detail, applied specific case herein principle of the present invention and execution mode are set forth, the explanation of above embodiment is just for helping to understand method of the present invention and core concept thereof; , for one of ordinary skill in the art, according to thought of the present invention, all will change in specific embodiments and applications, in sum, this description should not be construed as limitation of the present invention simultaneously.
Claims (10)
1. a MEMS microphone, is characterized in that, comprising: be built in shell and be connected integrated circuit (IC) chip, the MEMS chip in formed cavity with the first printed circuit board (PCB), the second printed circuit board seal; Described MEMS chip is provided with vibrating diaphragm, and inside is provided with cavity; Described integrated circuit (IC) chip and MEMS chip are fixed on described the first printed circuit board (PCB) and by metal wire and realize that the three is electrically connected to; Described the first printed circuit board (PCB) is electrically connected to by support connecting piece with the second printed circuit board (PCB); Sound hole is arranged on described the first printed circuit board (PCB).
2. MEMS microphone according to claim 1, is characterized in that, described shell is the annular recess structure.
3. MEMS microphone according to claim 1, is characterized in that, described support connecting piece is the insulated product that inside is embedded with electric conducting material.
4. MEMS microphone according to claim 1, is characterized in that, the sound inlet of described the first printed circuit board (PCB) is arranged at the cavity position over against described MEMS chip.
5. MEMS microphone according to claim 4; it is characterized in that; also comprise: cover the protective cover of described MEMS chip top, the top of described protective cover and described vibrating diaphragm keep certain distance, and the bottom of described protective cover is fixedly connected with described the first printed circuit board (PCB).
6. MEMS microphone according to claim 5, is characterized in that, the top of described protective cover offers a groove.
7. MEMS microphone according to claim 4, is characterized in that, between described MEMS chip and described the first printed circuit board (PCB), is provided with the pad that comprises air-vent.
8. MEMS microphone according to claim 1, is characterized in that, is provided with protective wire above described vibrating diaphragm.
9. MEMS microphone according to claim 1, is characterized in that, the sound inlet of described the first printed circuit board (PCB) is arranged at the position of departing from described MEMS chip, by a tunnel type slotted hole, with the cavity of described MEMS chip, is communicated with.
10. an electronic equipment comprises the electronic equipment body and is fitted in the microphone on the printed circuit board (PCB) of described electronic equipment body that it is characterized in that, described microphone is the arbitrary described MEMS microphone of claim 1 to 9.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310417196XA CN103475983A (en) | 2013-09-13 | 2013-09-13 | Mems microphone and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310417196XA CN103475983A (en) | 2013-09-13 | 2013-09-13 | Mems microphone and electronic equipment |
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| CN103475983A true CN103475983A (en) | 2013-12-25 |
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| CN201310417196XA Pending CN103475983A (en) | 2013-09-13 | 2013-09-13 | Mems microphone and electronic equipment |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104023299A (en) * | 2014-06-24 | 2014-09-03 | 山东共达电声股份有限公司 | Top-port MEMS (micro-electromechanical system) microphone |
| CN104219612A (en) * | 2014-09-29 | 2014-12-17 | 山东共达电声股份有限公司 | Front sound entering MEMS (Micro Electro Mechanical Systems) microphone |
| CN107396269A (en) * | 2017-09-14 | 2017-11-24 | 歌尔科技有限公司 | A kind of MEMS condenser microphone and acoustic equipment |
| CN109040927A (en) * | 2018-10-26 | 2018-12-18 | 歌尔科技有限公司 | A kind of directional microphone and sound collection equipment |
| CN109660927A (en) * | 2018-12-29 | 2019-04-19 | 华景科技无锡有限公司 | A kind of microphone chip and microphone |
| CN110417967A (en) * | 2019-04-23 | 2019-11-05 | 深圳市趣创科技有限公司 | A kind of side goes out silicon micro-microphone patch, working method and its applicable terminal of sound |
| CN111510835A (en) * | 2020-06-01 | 2020-08-07 | 无锡韦尔半导体有限公司 | Packaging structure and manufacturing method of solid conduction MEMS microphone and mobile terminal |
| CN112118522A (en) * | 2020-09-29 | 2020-12-22 | 瑞声声学科技(深圳)有限公司 | MEMS microphone |
| CN112423839A (en) * | 2018-07-19 | 2021-02-26 | 科利耳有限公司 | Subsurface indicator illumination |
| WO2021237800A1 (en) * | 2020-05-29 | 2021-12-02 | 瑞声声学科技(深圳)有限公司 | Mems microphone |
| CN109660927B (en) * | 2018-12-29 | 2024-04-12 | 华景科技无锡有限公司 | Microphone chip and microphone |
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| CN104219612A (en) * | 2014-09-29 | 2014-12-17 | 山东共达电声股份有限公司 | Front sound entering MEMS (Micro Electro Mechanical Systems) microphone |
| CN107396269A (en) * | 2017-09-14 | 2017-11-24 | 歌尔科技有限公司 | A kind of MEMS condenser microphone and acoustic equipment |
| CN112423839A (en) * | 2018-07-19 | 2021-02-26 | 科利耳有限公司 | Subsurface indicator illumination |
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| CN109040927A (en) * | 2018-10-26 | 2018-12-18 | 歌尔科技有限公司 | A kind of directional microphone and sound collection equipment |
| CN109040927B (en) * | 2018-10-26 | 2024-02-06 | 歌尔科技有限公司 | Directional microphone and sound collection equipment |
| CN109660927A (en) * | 2018-12-29 | 2019-04-19 | 华景科技无锡有限公司 | A kind of microphone chip and microphone |
| CN109660927B (en) * | 2018-12-29 | 2024-04-12 | 华景科技无锡有限公司 | Microphone chip and microphone |
| CN110417967A (en) * | 2019-04-23 | 2019-11-05 | 深圳市趣创科技有限公司 | A kind of side goes out silicon micro-microphone patch, working method and its applicable terminal of sound |
| WO2021237800A1 (en) * | 2020-05-29 | 2021-12-02 | 瑞声声学科技(深圳)有限公司 | Mems microphone |
| CN111510835A (en) * | 2020-06-01 | 2020-08-07 | 无锡韦尔半导体有限公司 | Packaging structure and manufacturing method of solid conduction MEMS microphone and mobile terminal |
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Application publication date: 20131225 |