CN110417967A - A kind of side goes out silicon micro-microphone patch, working method and its applicable terminal of sound - Google Patents
A kind of side goes out silicon micro-microphone patch, working method and its applicable terminal of sound Download PDFInfo
- Publication number
- CN110417967A CN110417967A CN201910329701.2A CN201910329701A CN110417967A CN 110417967 A CN110417967 A CN 110417967A CN 201910329701 A CN201910329701 A CN 201910329701A CN 110417967 A CN110417967 A CN 110417967A
- Authority
- CN
- China
- Prior art keywords
- sound
- microphone
- material shell
- goes out
- patch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 50
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 50
- 239000010703 silicon Substances 0.000 title claims abstract description 50
- 238000000034 method Methods 0.000 title claims description 8
- 239000000463 material Substances 0.000 claims abstract description 31
- 239000002184 metal Substances 0.000 claims abstract description 8
- 229910052751 metal Inorganic materials 0.000 claims abstract description 8
- 239000007769 metal material Substances 0.000 claims description 24
- 239000003990 capacitor Substances 0.000 claims description 9
- 238000006073 displacement reaction Methods 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 4
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 230000001629 suppression Effects 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 abstract description 12
- 238000001914 filtration Methods 0.000 abstract description 3
- 241000209140 Triticum Species 0.000 description 4
- 235000021307 Triticum Nutrition 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 238000005097 cold rolling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 229910001566 austenite Inorganic materials 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/03—Constructional features of telephone transmitters or receivers, e.g. telephone hand-sets
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/03—Constructional features of telephone transmitters or receivers, e.g. telephone hand-sets
- H04M1/035—Improving the acoustic characteristics by means of constructional features of the housing, e.g. ribs, walls, resonating chambers or cavities
Abstract
The invention discloses the silicon micro-microphone patch that a kind of side goes out sound, including RF circuit board, the circuit board is rectangular circuit board, and lower surface quadrangle is pasted with PCB patch；Lower material shell, middle part are equipped with the cavity for accommodating internal component, and a side surface is provided with sound inlet, and the lower material shell is assemblied in the RF circuit board；Upper material shell is coated on the lower material shell upper surface, and the upper material shell lower surface is set there are four fixed angles, and the fixed angles lower surface is parallel with RF circuit board lower surface.A kind of side provided by the invention goes out the silicon micro-microphone patch of sound, based on the technical characteristic that elastic slice is attached to RF circuit board by SMT, it is easily installed in super thin metal casing internal, go out sound silicon micro-microphone patch by side and realizes that microphone side goes out sound, shorten sound transmission channel, so that transmission voice is natural and tripping, the good reduction degree of fidelity is high；Sound transmission channel, filtering noise interference are formed by sealed silicon gum cover between microphone patch and sound outlet hole.
Description
Technical field
The present invention relates to mobile digital products, and in particular, to a kind of side goes out the silicon micro-microphone patch of sound, working method
And its applicable terminal.
Background technique
Make rapid progress with science and technology and develops, the digital products such as mobile phone its shape under the premise of meeting powerful use function
It designs also increasingly frivolous.The digital product of the mobile terminals such as mobile phone uses super thin metal fuselage, with control mainboard connection type master
Have bonding wire connect or patch just go out sound, bring adverse effect be because channel it is too long often make aphthenxia it is clear,
It is unnatural, be not easy to identification, anti-RF interference it is poor.But since ultra-thin overall design makes complete machine radian and side wall construction space not
It is enough, cause Mike's transmission channel too long, the sound of transmission has noise, and sound stable is poor.
Summary of the invention
It is an object of the invention to overcome the deficiencies of existing technologies, a kind of side is provided and the silicon micro-microphone patch of sound, work
Make method and its applicable terminal.
To achieve the above object, the invention adopts the following technical scheme:
A kind of side goes out the silicon micro-microphone patch of sound, comprising:
One RF circuit board, the circuit board are rectangular circuit board, and lower surface quadrangle is pasted with PCB patch；
Material shell once, middle part are equipped with the cavity for accommodating internal component, and a side surface is provided with sound inlet, the blanking
Shell is assemblied in the RF circuit board；
Material shell on one, is coated on the lower material shell upper surface, and the upper material shell lower surface sets that there are four fixed angles, described
Fixed angles lower surface is parallel with RF circuit board lower surface.
Its further technical solution are as follows: the internal component includes MEMS microphone, asic chip；Internal first device
Part is laid in the RF suppression circuit plate upper surface, and is placed in the lower material shell cavity.
Its further technical solution are as follows: the lower material shell is 301 metal material shells, and the upper material shell is 301 metal material shells.
Its further technical solution are as follows: the asic chip surface is coated with black glue.
A kind of side goes out the working method of the silicon micro-microphone patch of sound, is suitable for aforementioned silicon micro-microphone patch, including with
Lower step:
S1: external sound pressure acts on the vibrating diaphragm of silicon micro-microphone patch, generates the thrust for keeping vibrating diaphragm mobile；
S2: thrust is converted itself displacement by vibrating diaphragm；
S3: vibrating diaphragm and MEMS microphone constitute micro- capacitor, and vibrating diaphragm itself displacement leads to the capacitance variation of micro- capacitor；
Micro- capacitor after variation is realized " sound --- sound " conversion by S4:ASIC chip.
A kind of side goes out the terminal of sound, comprising:
One metal material shell；One cover board, the cover board are coated on metal material shell lower surface；In the metal material shell
The PCB main board in portion；Built-in loudspeaker set on the cover board upper surface；And the LED set on metal material shell upper surface is shown
Screen；Metal material shell side end face is equipped with sound outlet hole；
Microphone patch is pasted with inside the metal material shell at nearly sound outlet hole, the microphone patch is that silicon above-mentioned is micro-
Microphone patch.
Its further technical solution are as follows: the LED display is OM-LED screen.
Its further technical solution are as follows: the cover board is 5D glass cover-plate.
Its further technical solution are as follows: the built-in loudspeaker are BOX loudspeaker.
Its further technical solution are as follows: the terminal that the side goes out sound further includes being connected to the silicon micro-microphone patch and institute
State the sealed silicon gum cover between sound outlet hole.
Compared with prior art the utility model has the advantages that
A kind of side provided by the invention goes out the silicon micro-microphone patch of sound, based on elastic slice is attached to RF circuit board by SMT
Technical characteristic, be easily installed in super thin metal casing internal, by side go out sound silicon micro-microphone patch realize microphone side go out
Sound shortens sound transmission channel, so that transmission voice is natural and tripping, the good reduction degree of fidelity is high；Based on silicon micro-microphone patch
It is attached at the technical characteristic of the nearly sound outlet hole of terminal inner, sound is formed by sealed silicon gum cover between microphone patch and sound outlet hole
Transmission channel, filtering noise interference；Side provided by the invention goes out the silicon micro-microphone patch of sound, and overall volume is small, convenient for peace
Practical good inside mobile terminal loaded on any conventional, applied widely, high reliablity low in cost has wide
Prospect of the application.
It is with reference to the accompanying drawing and specific real in order to be more clearly understood that above-mentioned purpose of the invention, characteristics and advantages
Applying mode, the present invention is described in further detail.
Detailed description of the invention
Fig. 1 is silicon micro-microphone paster structure schematic cross-section of the invention；
Fig. 2 is 3-D view at the top of silicon micro-microphone paster structure of the invention；
Fig. 3 is the bottom 3-D view of structure shown in Fig. 2；
Fig. 4 is the internal structure sectional view that silicon micro-microphone patch of the invention is applicable in terminal；
Fig. 5 is the working principle formula schematic diagram of silicon micro-microphone patch of the invention.
Appended drawing reference:
1 silicon micro-microphone patch
The lower material shell of 11 RF circuit boards 12
14 MEMS microphone of material shell on 13
15 asic chip, 16 sound inlet
17 PCB patches
21 metal material shell, 22 cover board
24 sound outlet hole of loudspeaker built in 23
25 PCB main board, 26 LED display
27 sealed silicon gum covers
Specific embodiment
Many details are elaborated in following specific descriptions to facilitate a thorough understanding of the present invention, still the present invention is gone back
It can be different from the other modes of this description using other to realize, therefore, protection scope of the present invention is not by described below
Specific embodiment limitation.
As shown in Figure 1-3, in specific embodiment 1,
A kind of side provided by the invention goes out the silicon micro-microphone patch 1 of sound, comprising:
One RF circuit board 11, circuit board are rectangular circuit board, and lower surface quadrangle is pasted with PCB patch 17；
Material shell 12 once, middle part are equipped with the cavity for accommodating internal component, and a side surface is provided with sound inlet, lower material shell
12 are assemblied in 11 top of RF circuit board；
Material shell 13 on one, are coated on lower 12 upper surface of material shell, and 13 lower surface of upper material shell sets that there are four fixed angles, fixed angles
Lower surface is parallel with 11 lower surface of RF circuit board.
Internal component includes MEMS microphone 14, asic chip 15；Internal component is laid on RF suppression circuit plate
Surface, and be placed in lower 12 cavity of material shell.Wherein descending material shell 12 is 301 metal material shells 21, and upper material shell 13 is 301 metal material shells
21.As stainless steel material, 301 metal of austenite is lower compared with Cr the and Ni content of 304 metals (nickel plating), so corrosion resistance
It can also be greatly lowered.But tensile strength can be improved after cold rolling is processed, while 301 metals are originally no magnetic, but
Meeting band is magnetic after cold rolling is processed, and meets the requirement of technical solution of the present invention.
15 surface of asic chip is coated with black glue, and by black glue fixed chip, high temperature resistant ageing-resistant performance is improved.
A kind of side goes out the working method of the silicon micro-microphone patch of sound, is suitable for aforementioned silicon micro-microphone patch, including with
Lower step:
S1: external sound pressure acts on the vibrating diaphragm of silicon micro-microphone patch, generates the thrust for keeping vibrating diaphragm mobile；
S2: thrust is converted itself displacement by vibrating diaphragm；
S3: vibrating diaphragm and MEMS microphone constitute micro- capacitor, and vibrating diaphragm itself displacement leads to the capacitance variation of micro- capacitor；
Micro- capacitor after variation is realized " sound --- sound " conversion by S4:ASIC chip.
As shown in figure 5, showing the concrete operating principle of silicon micro-microphone patch work step in figure.
As shown in figure 4, in specific embodiment 2,
A kind of side provided by the invention goes out the terminal of sound, and terminal includes:
One metal material shell 21；One cover board 22, cover board 22 are coated on 21 lower surface of metal material shell；Set on 21 middle part of metal material shell
PCB main board 25；Built-in loudspeaker 23 set on 22 upper surface of cover board；And the LED display set on 21 upper surface of metal material shell
26；21 1 side end face of metal material shell is equipped with sound outlet hole 24.
21 inside of metal material shell is pasted with microphone patch at sound outlet hole 24, and microphone patch is the micro- wheat of silicon above-mentioned
Gram wind patch.
Wherein, LED display 26 is OM-LED screen, and OM-LED display screen can eliminate moire fringes.Cover board 22 is 5D glass
Glass cover board, three-dimensional sense is good, good decorating effect.Built-in loudspeaker 23 are BOX loudspeaker.The terminal that side goes out sound further includes being connected to the micro- wheat of silicon
Sealed silicon gum cover 27 gram between wind patch and sound outlet hole 24, the sound transmission channel that sealed silicon gum cover 27 is formed, can effectively every
Exhausted external noises.
In conclusion a kind of side provided by the invention goes out the silicon micro-microphone patch of sound, based on elastic slice is attached to by SMT
The technical characteristic of RF circuit board is easily installed in super thin metal casing internal, goes out sound silicon micro-microphone patch by side and realizes wheat
Gram wind side goes out sound, shortens sound transmission channel, so that transmission voice is natural and tripping, the good reduction degree of fidelity is high；Based on the micro- wheat of silicon
Gram wind patch is attached at the technical characteristic of the nearly sound outlet hole of terminal inner, passes through sealed silicon gum cover between microphone patch and sound outlet hole
Form sound transmission channel, filtering noise interference；Side provided by the invention goes out the silicon micro-microphone patch of sound, and overall volume is micro-
It is small, it is easily installed inside the mobile terminal of any conventional, practical good, applied widely, high reliablity low in cost, has
There is wide prospect of the application.
It is above-mentioned that technology contents of the invention are only further illustrated with embodiment, in order to understand, but do not represent the present invention
Embodiment be only limitted to this, it is any to extend according to the technology done of the present invention or recreation, by protection of the invention.This hair
Bright protection scope is subject to claims.
Claims (10)
1. the silicon micro-microphone patch that a kind of side goes out sound characterized by comprising
One RF circuit board, the circuit board are rectangular circuit board, and lower surface quadrangle is pasted with PCB patch；
Material shell once, middle part are equipped with the cavity for accommodating internal component, and a side surface is provided with sound inlet, the lower material shell dress
Assigned in the RF circuit board；
Material shell on one, is coated on the lower material shell upper surface, and the upper material shell lower surface sets that there are four fixed angles, the fixations
Angle lower surface is parallel with RF circuit board lower surface.
2. the silicon micro-microphone that side according to claim 1 goes out sound, which is characterized in that the internal component includes MEMS
Microphone, asic chip；The internal component is laid in the RF suppression circuit plate upper surface, and is placed in the lower material shell
In cavity.
3. the silicon micro-microphone that side according to claim 1 goes out sound, which is characterized in that the lower material shell is 301 metal charges
Shell, the upper material shell are 301 metal material shells.
4. the silicon micro-microphone that side according to claim 1 goes out sound, which is characterized in that the asic chip surface is coated with
Black glue.
5. a kind of side goes out the working method of the silicon micro-microphone patch of sound, it is micro- to be suitable for the described in any item silicon of claim 1-4
Microphone patch, which comprises the following steps:
S1: external sound pressure acts on the vibrating diaphragm of silicon micro-microphone patch, generates the thrust for keeping vibrating diaphragm mobile；
S2: thrust is converted itself displacement by vibrating diaphragm；
S3: vibrating diaphragm and MEMS microphone constitute micro- capacitor, and vibrating diaphragm itself displacement leads to the capacitance variation of micro- capacitor；
Micro- capacitor after variation is realized " sound --- sound " conversion by S4:ASIC chip.
6. the terminal that a kind of side goes out sound, which is characterized in that the terminal includes:
One metal material shell；One cover board, the cover board are coated on metal material shell lower surface；In the middle part of the metal material shell
PCB main board；Built-in loudspeaker set on the cover board upper surface；And the LED display set on metal material shell upper surface；Institute
Metal material shell side end face is stated equipped with sound outlet hole；
Microphone patch is pasted with inside the metal material shell at nearly sound outlet hole, the microphone patch is appointed for claim 1-4
Silicon micro-microphone patch described in one.
7. the terminal that side according to claim 6 goes out sound, which is characterized in that the LED display is OM-LED screen.
8. the terminal that side according to claim 6 goes out sound, which is characterized in that the cover board is 5D glass cover-plate.
9. the terminal that side according to claim 6 goes out sound, which is characterized in that the built-in loudspeaker are BOX loudspeaker.
10. the terminal that side according to claim 6 goes out sound, which is characterized in that the terminal that the side goes out sound further includes connection
Sealed silicon gum cover between the silicon micro-microphone patch and the sound outlet hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910329701.2A CN110417967A (en) | 2019-04-23 | 2019-04-23 | A kind of side goes out silicon micro-microphone patch, working method and its applicable terminal of sound |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910329701.2A CN110417967A (en) | 2019-04-23 | 2019-04-23 | A kind of side goes out silicon micro-microphone patch, working method and its applicable terminal of sound |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110417967A true CN110417967A (en) | 2019-11-05 |
Family
ID=68357647
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910329701.2A Pending CN110417967A (en) | 2019-04-23 | 2019-04-23 | A kind of side goes out silicon micro-microphone patch, working method and its applicable terminal of sound |
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| Country | Link |
|---|---|
| CN (1) | CN110417967A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202663538U (en) * | 2012-04-28 | 2013-01-09 | 歌尔声学股份有限公司 | Mems microphone |
| CN103475983A (en) * | 2013-09-13 | 2013-12-25 | 山东共达电声股份有限公司 | Mems microphone and electronic equipment |
| CN203748007U (en) * | 2014-04-01 | 2014-07-30 | 山东共达电声股份有限公司 | MEMS microphone and electronic device |
| CN104254047A (en) * | 2013-06-26 | 2014-12-31 | 英飞凌科技股份有限公司 | Electronic device with large back volume for electromechanical transducer |
| CN208402122U (en) * | 2018-06-22 | 2019-01-18 | Oppo广东移动通信有限公司 | A kind of terminal of microphone device and integrated microphone device |
| CN209805886U (en) * | 2019-04-23 | 2019-12-17 | 深圳市趣创科技有限公司 | Side-sounding silicon microphone patch and applicable terminal thereof |
-
2019
- 2019-04-23 CN CN201910329701.2A patent/CN110417967A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202663538U (en) * | 2012-04-28 | 2013-01-09 | 歌尔声学股份有限公司 | Mems microphone |
| CN104254047A (en) * | 2013-06-26 | 2014-12-31 | 英飞凌科技股份有限公司 | Electronic device with large back volume for electromechanical transducer |
| CN103475983A (en) * | 2013-09-13 | 2013-12-25 | 山东共达电声股份有限公司 | Mems microphone and electronic equipment |
| CN203748007U (en) * | 2014-04-01 | 2014-07-30 | 山东共达电声股份有限公司 | MEMS microphone and electronic device |
| CN208402122U (en) * | 2018-06-22 | 2019-01-18 | Oppo广东移动通信有限公司 | A kind of terminal of microphone device and integrated microphone device |
| CN209805886U (en) * | 2019-04-23 | 2019-12-17 | 深圳市趣创科技有限公司 | Side-sounding silicon microphone patch and applicable terminal thereof |
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