CN206490831U - A kind of MEMS microphone package structure - Google Patents
A kind of MEMS microphone package structure Download PDFInfo
- Publication number
- CN206490831U CN206490831U CN201720039020.9U CN201720039020U CN206490831U CN 206490831 U CN206490831 U CN 206490831U CN 201720039020 U CN201720039020 U CN 201720039020U CN 206490831 U CN206490831 U CN 206490831U
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- metal shell
- mems
- pcb board
- package structure
- chip
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Abstract
The utility model provides a kind of MEMS microphone package structure, adds the back of the body cavity volume of MEMS microphone, increases sensitivity and the signal to noise ratio of MEMS microphone, including pcb board, in addition to：Metal shell, metal shell is arranged on the pcb board, and inner chamber body is constituted between the metal shell and the pcb board, and the metal shell is provided with through hole；MEMS chip, the MEMS chip is arranged on the metal shell, and the back of the body chamber of the MEMS chip is just set to the through hole, and the back of the body chamber of the MEMS chip connects the inner chamber body by the through hole；Asic chip, the asic chip is electrically connected by wire with the MEMS chip and the pcb board respectively.
Description
Technical field
The utility model is related to MEMS microphone technical field, specially a kind of MEMS microphone package structure.
Background technology
As the electronic products such as mobile phone, notebook, audiphone require less and less to the size of inner body, take measurements greatly
The preferable MEMS microphone of smaller, quality is employed.For MEMS microphone, its crucial technology is encapsulating structure.
The MEMS microphone package structure such as notification number of standard is in CN203748006U Chinese utility model patent
Disclosed MEMS microphone, MEMS chip is set directly on pcb board, and the back of the body cavity volume of MEMS microphone is less than MEMS cores
In itself, and all MEMS microphone barrier passivation layers are thicker, cause the back of the body cavity volume of MEMS microphone very limited for piece, so that
The more difficult sensitivity for improving MEMS microphone and signal to noise ratio.
Also have in the Chinese utility model patent that notification number is CN203368746U and disclose a kind of microcomputer electric system wheat
Gram wind, it sets external expansion cavity at pcb board back to increase the back of the body cavity volume of MEMS microphone, but such structure can shadow
Ring the installation of pcb board.
Utility model content
In view of the above-mentioned problems, the utility model provides a kind of MEMS microphone package structure, MEMS microphone is added
Back of the body cavity volume, increase MEMS microphone sensitivity and signal to noise ratio, do not interfere with the installation of pcb board yet.
Its technical scheme is such：A kind of MEMS microphone package structure, including pcb board, it is characterised in that also wrap
Include：
Metal shell, metal shell is arranged on the pcb board, is constituted between the metal shell and the pcb board interior
Cavity, the metal shell is provided with through hole；
MEMS chip, the MEMS chip is arranged on the metal shell, and the back of the body chamber of the MEMS chip is just to described
Through hole is set, and the back of the body chamber of the MEMS chip connects the inner chamber body by the through hole；
Asic chip, the asic chip is electrically connected by wire with the MEMS chip and the pcb board respectively.
Further, in addition to the shell that is arranged on the pcb board, constituted between the shell and the pcb board outer
Sound hole is offered on cavity, the shell, the metal shell, the MEMS chip and the asic chip are correspondingly arranged at institute
State in outer chamber.
Further, the metal shell is hollow rectangular housing, and four sides of the metal shell are connected respectively
The pcb board.
Further, the MEMS chip is bonded on the metal shell by adhesive.
Further, the asic chip is bonded on the metal shell by adhesive.
Further, the metal shell is Stainless Steel Shell.
Further, the wire is gold thread.
Further, described adhesive is silica gel.
Further, it is welded with electric capacity on the pcb board.
MEMS microphone package structure of the present utility model, by setting hollow gold between MEMS chip and pcb board
Belong to housing, and open up on metal shell through hole so that the back of the body chamber of MEMS chip by through hole connect metal shell and pcb board it
Between the inner chamber body that constitutes, significantly increase the back of the body cavity volume of MEMS chip, increase sensitivity and the signal to noise ratio of microphone, its is general
It is good with property, and adapted to current electronics industry miniaturization, the growth requirement of miniaturization.
Brief description of the drawings
Fig. 1 is the structural representation of MEMS microphone package structure of the present utility model.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is carried out
Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of the utility model, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment obtained, belongs to the scope of the utility model protection.
See on Fig. 1, a kind of MEMS microphone package structure of the present utility model, including pcb board 1, pcb board 1 and be provided with gold
Belong to housing 2, inner chamber body 3 is constituted between metal shell 2 and pcb board 1, metal shell 2 is provided with through hole 4, and MEMS chip 5 passes through viscous
Mixture is bonded on metal shell 2, and the back of the body chamber of MEMS chip 5 is just set to through hole 4, and the back of the body chamber of MEMS chip 5 is connected by through hole 4
Logical inner chamber body 3, asic chip 6 is bonded on metal shell 2 by adhesive, and asic chip 6 passes through wire 7 and MEMS cores respectively
Piece 5 and pcb board 2 are electrically connected, and are additionally provided with pcb board 2 on shell 8, shell 8 and are offered sound hole 9, between shell 8 and pcb board 2
Outer chamber 10 is constituted, metal shell 2, MEMS chip 5 and asic chip 6 are correspondingly arranged in outer chamber 10, be welded with pcb board
Electric capacity 11.
In the present embodiment, metal shell 2 is hollow rectangular housing, four sides difference connection PCB of metal shell 2
Plate 1, metal shell 2 is Stainless Steel Shell, and certainly, other shapes of metal shell can also be used, it is not limited to this implementation
Species cited by example, and it is low using Stainless Steel Shell cost.
In addition, in the present embodiment, wire uses gold thread, adhesive uses silica gel.
MEMS microphone package structure of the present utility model, by set between MEMS chip and pcb board it is hollow not
Become rusty steel sheel, only four sides contacted with pcb board so that inner chamber body is constituted between Stainless Steel Shell and pcb board, and not
Rust steel sheel on open up through hole so that the back of the body chamber of MEMS chip by through hole connection metal shell and pcb board between constitute in
Cavity, significantly increases the back of the body cavity volume of MEMS chip, increases sensitivity and the signal to noise ratio of microphone.
The advantage of MEMS microphone package structure of the present utility model：
1）Increase the sensitivity of MEMS microphone and signal to noise ratio after hollow stainless steel substrates to be obviously improved, in MEMS Mikes
In the case that the entire length and width of wind are constant, 2 ~ 3dB sensitivity and 3 ~ 5dB noises can be lifted after increasing hollow stainless steel substrates
Than；
2）Production cost is low, the market dispensing cycle is short, and each functional module can be separately designed in advance, and can largely use market
Existing general MEMS chip and asic chip, significantly reduce cost, design cycle and shorten, and put on market very fast.
3）Function admirable, reliability is high, while fully utilizing the multinomial technology such as microelectronics, solid electronic, fully
Polytechnic advantage is played, so as to improve the combination property of system.
4）Its is simple in construction, and it easily realizes miniaturization, lightweight, high-performance and the high reliability of electronic system, especially
It is suitable for the occasion harsh to volume, weight and environmental requirement such as mobile phone, computer, portable electronic wearable device.
It is described above, only the utility model preferably embodiment, but protection domain of the present utility model is not
Be confined to this, it is any to be familiar with the people of the technology in the technical scope disclosed by the utility model, the change that can readily occur in or
Replace, should all cover within protection domain of the present utility model.Therefore, protection domain of the present utility model should be wanted with right
The protection domain asked is defined.
Claims (9)
1. a kind of MEMS microphone package structure, including pcb board, it is characterised in that also include：
Metal shell, metal shell is arranged on the pcb board, and inner chamber body is constituted between the metal shell and the pcb board,
The metal shell is provided with through hole；
MEMS chip, the MEMS chip is arranged on the metal shell, and the back of the body chamber of the MEMS chip is just to the through hole
Set, the back of the body chamber of the MEMS chip connects the inner chamber body by the through hole；
Asic chip, the asic chip is electrically connected by wire with the MEMS chip and the pcb board respectively.
2. a kind of MEMS microphone package structure according to claim 1, it is characterised in that：It is also described including being arranged on
Shell on pcb board, constitutes between the shell and the pcb board and sound hole, the metal is offered on outer chamber, the shell
Housing, the MEMS chip and the asic chip are correspondingly arranged in the outer chamber.
3. a kind of MEMS microphone package structure according to claim 1, it is characterised in that：The MEMS chip passes through viscous
Mixture is bonded on the metal shell.
4. a kind of MEMS microphone package structure according to claim 3, it is characterised in that：The asic chip passes through institute
Adhesive is stated to be bonded on the metal shell.
5. a kind of MEMS microphone package structure according to claim 1, it is characterised in that：The metal shell is hollow
Rectangular housing, four sides of the metal shell connect the pcb board respectively.
6. a kind of MEMS microphone package structure according to claim 1, it is characterised in that：The metal shell is stainless
Steel sheel.
7. a kind of MEMS microphone package structure according to claim 1, it is characterised in that：The wire is gold thread.
8. a kind of MEMS microphone package structure according to claim 4, it is characterised in that：Described adhesive is silica gel.
9. a kind of MEMS microphone package structure according to claim 1, it is characterised in that：It is welded with the pcb board
Electric capacity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720039020.9U CN206490831U (en) | 2017-01-13 | 2017-01-13 | A kind of MEMS microphone package structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720039020.9U CN206490831U (en) | 2017-01-13 | 2017-01-13 | A kind of MEMS microphone package structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206490831U true CN206490831U (en) | 2017-09-12 |
Family
ID=59766947
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720039020.9U Active CN206490831U (en) | 2017-01-13 | 2017-01-13 | A kind of MEMS microphone package structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206490831U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106604190A (en) * | 2017-01-13 | 2017-04-26 | 无锡红光微电子股份有限公司 | MEMS microphone encapsulation structure |
-
2017
- 2017-01-13 CN CN201720039020.9U patent/CN206490831U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106604190A (en) * | 2017-01-13 | 2017-04-26 | 无锡红光微电子股份有限公司 | MEMS microphone encapsulation structure |
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