CN106604190A - MEMS microphone encapsulation structure - Google Patents
MEMS microphone encapsulation structure Download PDFInfo
- Publication number
- CN106604190A CN106604190A CN201710024401.4A CN201710024401A CN106604190A CN 106604190 A CN106604190 A CN 106604190A CN 201710024401 A CN201710024401 A CN 201710024401A CN 106604190 A CN106604190 A CN 106604190A
- Authority
- CN
- China
- Prior art keywords
- mems
- metal shell
- chip
- pcb board
- mems microphone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2400/00—Loudspeakers
- H04R2400/11—Aspects regarding the frame of loudspeaker transducers
Abstract
The invention provides an MEMS microphone encapsulation structure. With the structure adopted, the back cavity volume of MEMS microphones is increased, and the sensitivity and signal-to-noise ratio of MEMS microphones are increased. The MEMS microphone encapsulation structure comprises a PCB, and further comprises a metal shell, an MEMS chip, and an ASIC chip. The metal shell is arranged on the PCB, an inner cavity is formed between the metal shell and the PCB, and the metal shell has a through hole. The MEMS chip is arranged on the metal shell, the back cavity of the MEMS chip directly faces the through hole, and the back cavity of the MEMS chip is communicated with the inner cavity via the through hole. The ASIC chip is electrically connected with the MEMS chip and the PCB through wires.
Description
Technical field
The present invention relates to MEMS microphone technical field, specially a kind of MEMS microphone package structure.
Background technology
As the electronic products such as mobile phone, notebook, sonifer are less and less to the dimensional requirement of inner body, take measurements greatly
The preferable MEMS microphone of less, quality is employed.For MEMS microphone, its crucial technology is encapsulating structure.
The MEMS microphone package structure such as notification number of standard is for disclosed in the Chinese invention patent of CN203748006U
MEMS microphone, MEMS chip is set directly on pcb board, and the back of the body cavity volume of MEMS microphone is less than MEMS chip sheet
Body, and all of MEMS microphone barrier passivation layer is thicker, causes the back of the body cavity volume of MEMS microphone very limited, so as to more difficult
Improve sensitivity and the signal to noise ratio of MEMS microphone.
Also a kind of microcomputer motor system microphone is disclosed in having the Chinese invention patent that notification number is CN203368746U,
Which arranges external expansion cavity to increase the back of the body cavity volume of MEMS microphone at pcb board back, but such structure can affect PCB
The installation of plate.
The content of the invention
For the problems referred to above, the invention provides a kind of MEMS microphone package structure, increased the back of the body of MEMS microphone
Cavity volume, increases sensitivity and the signal to noise ratio of MEMS microphone, does not also interfere with the installation of pcb board.
Its technical scheme is such：A kind of MEMS microphone package structure, including pcb board, it is characterised in that also wrap
Include：
Metal shell, metal shell are arranged on the pcb board, constitute inner chamber body between the metal shell and the pcb board,
The metal shell is provided with through hole；
MEMS chip, the MEMS chip are arranged on the metal shell, and the back of the body chamber of the MEMS chip is just to the through hole
Arrange, the back of the body chamber of the MEMS chip connects the inner chamber body by the through hole；
Asic chip, the asic chip are electrically connected with the MEMS chip and the pcb board by wire respectively.
Further, also including the shell being arranged on the pcb board, constitute between the shell and the pcb board outer
Cavity, offers sound hole on the shell, the metal shell, the MEMS chip and the asic chip are correspondingly arranged at institute
State in exocoel body.
Further, the metal shell is hollow rectangular housing, and four sides of the metal shell connect respectively
The pcb board.
Further, the MEMS chip is bonded on the metal shell by binding agent.
Further, the asic chip is bonded on the metal shell by binding agent.
Further, the metal shell is Stainless Steel Shell.
Further, the wire is gold thread.
Further, described adhesive is silica gel.
Further, electric capacity is welded with the pcb board.
The MEMS microphone package structure of the present invention, by hollow metal-back is arranged between MEMS chip and pcb board
Body, and through hole is opened up on metal shell so that the back of the body chamber of MEMS chip connects structure between metal shell and pcb board by through hole
Into inner chamber body, significantly increase the back of the body cavity volume of MEMS chip, increase sensitivity and the signal to noise ratio of mike, its wide usage
It is good, and adapted to current electron trade miniaturization, the growth requirement of miniaturization.
Description of the drawings
Fig. 1 is the structural representation of the MEMS microphone package structure of the present invention.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than the embodiment of whole.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not made
Embodiment, belongs to the scope of protection of the invention.
See Fig. 1, a kind of MEMS microphone package structure of the present invention, including pcb board 1, on pcb board 1, be provided with metal-back
Body 2, constitutes inner chamber body 3 between metal shell 2 and pcb board 1, metal shell 2 is provided with through hole 4, and MEMS chip 5 passes through binding agent
It is bonded on metal shell 2, the back of the body chamber of MEMS chip 5 is just arranged to through hole 4, the back of the body chamber of MEMS chip 5 connects interior by through hole 4
Cavity 3, asic chip 6 are bonded on metal shell 2 by binding agent, and asic chip 6 is respectively by wire 7 and MEMS chip 5
And pcb board 2 is electrically connected, shell 8 on pcb board 2, is additionally provided with, on shell 8, offers sound hole 9, constituted between shell 8 and pcb board 2
Outer chamber 10, metal shell 2, MEMS chip 5 and asic chip 6 are correspondingly arranged in outer chamber 10, and electric capacity is welded with pcb board
11。
In the present embodiment, metal shell 2 is hollow rectangular housing, and connection PCBs are distinguished in four sides of metal shell 2
Plate 1, metal shell 2 are Stainless Steel Shell, and certainly, other shapes of metal shell can also be used, it is not limited to this enforcement
Species cited by example, and adopt Stainless Steel Shell low cost.
In addition, in the present embodiment, wire adopts gold thread, binding agent to adopt silica gel.
The MEMS microphone package structure of the present invention, by hollow rustless steel is arranged between MEMS chip and pcb board
Housing, only four sides contacted with pcb board so that inner chamber body is constituted between Stainless Steel Shell and pcb board, and in rustless steel
Through hole is opened up on housing so that the back of the body chamber of MEMS chip connects the inner chamber body constituted between metal shell and pcb board by through hole,
The back of the body cavity volume of MEMS chip is significantly increased, increases sensitivity and the signal to noise ratio of mike.
The advantage of the MEMS microphone package structure of the present invention：
1）After increasing hollow stainless steel substrates, the sensitivity of MEMS microphone and signal to noise ratio are obviously improved, in MEMS microphone
In the case that entire length and width are constant, after increasing hollow stainless steel substrates, 2 ~ 3dB sensitivity and 3 ~ 5dB signal to noise ratios can be lifted；
2）Cycle is short is thrown in low production cost, market, and each functional module can be separately designed in advance, and can be existing using market in a large number
General MEMS chip and asic chip, significantly reduce cost, design cycle and shorten, put on market very fast.
3）Function admirable, reliability are high, while the multinomial Technology such as microelectronics, solid electronic is fully utilized, fully
Polytechnic advantage is played, so as to improve the combination property of system.
4）Its simple structure, it easily realizes miniaturization, lightweight, high-performance and the high reliability of electronic system, especially
It is suitable for the occasion harsh to volume, weight and environmental requirement such as mobile phone, computer, portable electronic wearable device.
The above, the only present invention preferably specific embodiment, but protection scope of the present invention is not limited thereto,
Any people for being familiar with the technology disclosed herein technical scope in, the change or replacement that can be readily occurred in should all be covered
Within protection scope of the present invention.Therefore, protection scope of the present invention should be defined by scope of the claims.
Claims (9)
1. a kind of MEMS microphone package structure, including pcb board, it is characterised in that also include：
Metal shell, metal shell are arranged on the pcb board, constitute inner chamber body between the metal shell and the pcb board,
The metal shell is provided with through hole；
MEMS chip, the MEMS chip are arranged on the metal shell, and the back of the body chamber of the MEMS chip is just to the through hole
Arrange, the back of the body chamber of the MEMS chip connects the inner chamber body by the through hole；
Asic chip, the asic chip are electrically connected with the MEMS chip and the pcb board by wire respectively.
2. a kind of MEMS microphone package structure according to claim 1, it is characterised in that：It is also described including being arranged on
Shell on pcb board, constitutes outer chamber between the shell and the pcb board, sound hole, the metal are offered on the shell
Housing, the MEMS chip and the asic chip are correspondingly arranged in the exocoel body.
3. a kind of MEMS microphone package structure according to claim 1, it is characterised in that：The MEMS chip is by viscous
Mixture is bonded on the metal shell.
4. a kind of MEMS microphone package structure according to claim 3, it is characterised in that：The asic chip passes through institute
State binding agent to be bonded on the metal shell.
5. a kind of MEMS microphone package structure according to claim 1, it is characterised in that：The metal shell is hollow
Rectangular housing, four sides of the metal shell connect the pcb board respectively.
6. a kind of MEMS microphone package structure according to claim 1, it is characterised in that：The metal shell is stainless
Steel sheel.
7. a kind of MEMS microphone package structure according to claim 1, it is characterised in that：The wire is gold thread.
8. a kind of MEMS microphone package structure according to claim 4, it is characterised in that：Described adhesive is silica gel.
9. a kind of MEMS microphone package structure according to claim 1, it is characterised in that：It is welded with the pcb board
Electric capacity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710024401.4A CN106604190A (en) | 2017-01-13 | 2017-01-13 | MEMS microphone encapsulation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710024401.4A CN106604190A (en) | 2017-01-13 | 2017-01-13 | MEMS microphone encapsulation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106604190A true CN106604190A (en) | 2017-04-26 |
Family
ID=58584799
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710024401.4A Pending CN106604190A (en) | 2017-01-13 | 2017-01-13 | MEMS microphone encapsulation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106604190A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111314830A (en) * | 2019-12-07 | 2020-06-19 | 朝阳聚声泰（信丰）科技有限公司 | MEMS microphone with high signal-to-noise ratio and production method thereof |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1917720A (en) * | 2005-08-20 | 2007-02-21 | 宝星电子株式会社 | Silicon base capacitor microphone and its package method |
| CN101381069A (en) * | 2007-09-03 | 2009-03-11 | 宝星电子株式会社 | Condenser microphone using the ceramic package whose inside is encompassed by metal or conductive materials |
| US20110266641A1 (en) * | 2009-10-19 | 2011-11-03 | Bse Co., Ltd. | Silicon condenser microphone having an additional back chamber and a fabrication method therefor |
| CN102917303A (en) * | 2012-10-30 | 2013-02-06 | 无锡芯奥微传感技术有限公司 | Microphone packaged by plastic casing |
| CN102932722A (en) * | 2012-11-08 | 2013-02-13 | 山东共达电声股份有限公司 | Micro-electromechanical systems (MEMS) microphone |
| CN202949568U (en) * | 2012-11-06 | 2013-05-22 | 上海芯导电子科技有限公司 | High-power micro-electromechanical system (MEMS) microphone |
| US20130140655A1 (en) * | 2011-12-01 | 2013-06-06 | Industrial Technology Research Institute | Mems acoustic transducer and method for fabricating the same |
| CN103663352A (en) * | 2013-12-30 | 2014-03-26 | 上海集成电路研发中心有限公司 | MEMS microphone packaging structure and packaging method |
| CN103945314A (en) * | 2014-04-24 | 2014-07-23 | 歌尔声学股份有限公司 | Microphone |
| CN104219610A (en) * | 2013-05-29 | 2014-12-17 | 山东共达电声股份有限公司 | MEMS microphone |
| CN206490831U (en) * | 2017-01-13 | 2017-09-12 | 无锡红光微电子股份有限公司 | A kind of MEMS microphone package structure |
-
2017
- 2017-01-13 CN CN201710024401.4A patent/CN106604190A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1917720A (en) * | 2005-08-20 | 2007-02-21 | 宝星电子株式会社 | Silicon base capacitor microphone and its package method |
| CN101381069A (en) * | 2007-09-03 | 2009-03-11 | 宝星电子株式会社 | Condenser microphone using the ceramic package whose inside is encompassed by metal or conductive materials |
| US20110266641A1 (en) * | 2009-10-19 | 2011-11-03 | Bse Co., Ltd. | Silicon condenser microphone having an additional back chamber and a fabrication method therefor |
| US20130140655A1 (en) * | 2011-12-01 | 2013-06-06 | Industrial Technology Research Institute | Mems acoustic transducer and method for fabricating the same |
| CN102917303A (en) * | 2012-10-30 | 2013-02-06 | 无锡芯奥微传感技术有限公司 | Microphone packaged by plastic casing |
| CN202949568U (en) * | 2012-11-06 | 2013-05-22 | 上海芯导电子科技有限公司 | High-power micro-electromechanical system (MEMS) microphone |
| CN102932722A (en) * | 2012-11-08 | 2013-02-13 | 山东共达电声股份有限公司 | Micro-electromechanical systems (MEMS) microphone |
| CN104219610A (en) * | 2013-05-29 | 2014-12-17 | 山东共达电声股份有限公司 | MEMS microphone |
| CN103663352A (en) * | 2013-12-30 | 2014-03-26 | 上海集成电路研发中心有限公司 | MEMS microphone packaging structure and packaging method |
| CN103945314A (en) * | 2014-04-24 | 2014-07-23 | 歌尔声学股份有限公司 | Microphone |
| CN206490831U (en) * | 2017-01-13 | 2017-09-12 | 无锡红光微电子股份有限公司 | A kind of MEMS microphone package structure |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111314830A (en) * | 2019-12-07 | 2020-06-19 | 朝阳聚声泰（信丰）科技有限公司 | MEMS microphone with high signal-to-noise ratio and production method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103686568B (en) | Directional MEMS (Micro Electro Mechanical Systems) microphone and sound receiving device | |
| US8995694B2 (en) | Embedded circuit in a MEMS device | |
| CN204993854U (en) | MEMS (Micro -electromechanical system) microphone | |
| CN202334882U (en) | Mems microphone | |
| CN202799144U (en) | Micro-electromechanical systems (MEMS) microphone | |
| CN201563214U (en) | microphone | |
| CN116405857B (en) | Noise reduction type MEMS microphone and electronic equipment | |
| CN106604190A (en) | MEMS microphone encapsulation structure | |
| CN202353807U (en) | MEMS (Micro Electro Mechanical System) microphone | |
| CN202679629U (en) | MEMS (Micro-electromechanical System) microphone | |
| CN206490831U (en) | A kind of MEMS microphone package structure | |
| CN201260243Y (en) | Automatic adhesion microphone | |
| CN201450592U (en) | Miniature microphone with circuit board frame structure | |
| CN101257736B (en) | Miniature capacitor type microphone | |
| CN202310096U (en) | Micro-electromechanical system (MEMS) microphone | |
| CN209949424U (en) | MEMS microphone and electronic equipment | |
| WO2016011780A1 (en) | Mems microphone and top-port mems microphone | |
| CN205754730U (en) | A kind of encapsulating structure of mike | |
| CN210609704U (en) | MEMS microphone packaging structure | |
| CN202424982U (en) | Microphone | |
| CN2888785Y (en) | A miniature silicon microphone | |
| CN217240883U (en) | Microphone structure | |
| CN201639733U (en) | Mems microphone | |
| CN102655617B (en) | Microphone and assembly method thereof | |
| CN206313996U (en) | A kind of MEMS microphone package |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170426 |
|
| RJ01 | Rejection of invention patent application after publication |