CN2888785Y

CN2888785Y - A miniature silicon microphone

Info

Publication number: CN2888785Y
Application number: CN 200520038104
Authority: CN
Inventors: 王显彬; 王玉良
Original assignee: Weifang Goertek Electronics Co Ltd
Current assignee: Goertek Inc
Priority date: 2005-12-28
Filing date: 2005-12-28
Publication date: 2007-04-11
Anticipated expiration: 2015-12-28

Abstract

The utility model relates to a sound-electron converter used in mobile phone, blue tooth earphone, hearing aid and the like, in particular to a mini silicon microphone, which comprises a metal casing and a circuit board. The metal casing is welded to the circuit board, and a cavity is formed by the middle chamber; silicon microphone electronic components are welded on the circuit board which is equipped with a sound aperture; the sound aperture communicates the internal of the cavity with the external of the cavity through the circuit board. The utility model has the advantages of simple and practicable process, fewer process procedures, reduced cost, improved reliability and sound-electron performance.

Description

A kind of micro silicon microphone

Technical field

The utility model relates to a kind of acoustical-electrical transducer that is applied in fields such as mobile phone, bluetooth earphone, hearing aids, is a kind of micro silicon microphone specifically.

Background technology

Existing silicon microphone structure mainly partly is made of loam cake, cavity and wiring board etc., connect loam cake, connect the wiring board of bottom surface below by conducting resinl by conducting resinl above the cavity of square hollow, soldering of electronic components on the wiring board of bottom surface, the sound hole is arranged on loam cake or the base plate.Because being connected between cavity and loam cake and the bottom surface wiring board all is the plane connection, be subjected to the little restriction of volume simultaneously, and the sidewall thickness of cavity is limited, causes bonding strength not high, and anti-High-frequency Interference aspect performance produces be not as good as phenomenons such as electret capcitor microphone.In the present existing silicon microphone encapsulating structure, adopt multilayer circuit board to do base and lid (United States Patent (USP): No.2002/0102004 A1), or the lid and the multilayer circuit board (United States Patent (USP): No.6781231 B2 of employing sandwich construction,) finish encapsulation, its cost is higher, and technology is complicated.Open on lid the position in sound hole simultaneously, after silicon microphone is welded on the mobile phone support plate, can have influence on the height in mobile phone front, is unfavorable for the development trend of following design microminiaturization and ultra-thinization.

Summary of the invention

At defective that exists in the above-mentioned technology or deficiency, the utility model provides that a kind of rational in infrastructure, technology is simple, the micro silicon microphone of strong anti-interference performance.

For achieving the above object, the utility model adopts following technical scheme:

A kind of micro silicon microphone described in the utility model comprises metal shell and wiring board, metal shell welds in the circuit board, and middle cavity forms cavity, is welded with silicon Mike electronic devices and components on the wiring board, have hole in the circuit board, wiring board connected chamber inside and outside is passed in this hole.

The gum cover of tubular is enclosed within the outside of metal shell and wiring board, the stage casing in sound hole have one with the wiring board parallel portion, the one end is bent upwards and to the cavity inner opening, the other end is to the sidewall opening of wiring board, and the passage by being positioned at gum cover inside is under shed.

The sound hole that is arranged in wiring board has at least one section trend parallel with wiring board.

The sound hole opening part of wiring board below is welded with the pad of ring-type, and the centre bore of this pad is to hole opening at the sound, and has radial air drain on the pad.

The sound hole opening part of wiring board below is connected with netted elevated-temperature seal part by the adhesives of ring-type.

The silicon microphone that adopts the utility model to provide, it is simple for process, and manufacturing procedure is few, can also save cost, improves the reliability and the electroacoustic performance of product.On the other hand, can satisfy current demand preferably to product slimming and miniaturization.Simultaneously the position in sound hole is arranged on the bottom surface of wiring board, the demand that more and more approaches in the time that cell phone manufacturer's deisgn product can effectively being satisfied.

Description of drawings

Fig. 1 is the structural representation of an embodiment of the utility model;

Fig. 2 is the structural representation of another embodiment of the utility model;

Fig. 3 is the structural representation of the another embodiment of the utility model;

Fig. 4 is the pad configuration schematic diagram;

Fig. 5 is the another schematic diagram of pad configuration;

Fig. 6 is the adhesives of ring-type and the structural representation of netted elevated-temperature seal part;

Embodiment

Micro silicon microphone structure chart of the present utility model such as Fig. 1, Fig. 2, Fig. 3 is further elaborated embodiment of the present utility model below in conjunction with accompanying drawing.

A kind of micro silicon microphone, as Fig. 1, its structure is by metal shell 1, wiring board 2 compositions such as grade, metal shell 1 is welded on the wiring board 2, and middle cavity forms cavity, is welded with silicon Mike electronic devices and components on the wiring board 2.Side or bottom surface at wiring board 2 have hole 4, a gum cover 3 is placed in the outside, sound hole 4 the stage casing have one with wiring board 2 parallel portion, the one end is bent upwards and to the cavity inner opening, the other end is to the sidewall opening of wiring board 2, and the passage by being positioned at gum cover 3 inside is under shed, and this sound pore structure forwards the acceptance point of sound to the wiring board bottom surface, receive voice signal, realize the effect of pickup.Perhaps the sound hole is directly reached the bottom surface of wiring board, as Fig. 2, Fig. 3 receives voice signal.

The silicon microphone that provides in the utility model is welded on the mobile phone support plate, usually around the scheme that adopts has in the sound hole annular pad 6 is set, the center of pad 6 outwards is evenly distributed with radial air drain 5, air drain can have one, and three, or have a plurality of, as Fig. 4, Fig. 5 can reduce effectively that high-temperature gas enters the performance that influences MEMS in the MEMS chamber in the welding process, and avoids acoustical leakage.In the assembling process, solder(ing) paste is coated on the annular pad 6, then silicon microphone is welded on the reverse side of mobile phone carrier board by SMT, reach requirement more and more thinner in its mobile phones design.Fig. 4, among Fig. 5, the circle at sound place, hole and the circle at annular pad place are concentric circles.Another kind of scheme is to pass through adhesives 8 bonding netted elevated-temperature seal parts 7 of ring-type on the sound hole of silicon microphone, as Fig. 6, the adhesives of ring-type can reach the leakage effect that prevents sound, and the method for bonding netted elevated-temperature seal part, can effectively prevent dust, damp proof, moistureproof, also avoided adopting soldering paste to connect easily producing high-temperature gas and tin ball entering the defective that reduces properties of product, bonding Air Filter of while in MEMS the chamber in, simple for process, cost is low.

In the embodiment that the utility model provides, bonding netted elevated-temperature seal part comprises high-temp glue and high temperature resistant dustcloth two parts, and the height of netted elevated-temperature seal part is not higher than the height of solder(ing) paste.

The micro silicon microphone that provides in the utility model, its position with the sound hole is placed on the bottom surface of wiring board, can well satisfy the demand of ultra-thinization in the mobile phones design.Simultaneously, adopt netted elevated-temperature seal part in its application scheme, reach and prevent acoustical leakage, protection against the tide, damp proof, the dustproof effect, its processing technology is simple, and cost is low.Adopt the technical scheme of bonding netted elevated-temperature seal part simultaneously, it can satisfy in the deisgn products such as cell phone manufacturer the demand of more and more miniaturization and ultra-thinization development.

Claims

1, a kind of micro silicon microphone, comprise metal shell (1) and wiring board (2), metal shell (1) is welded on the wiring board (2), middle cavity forms cavity, be welded with silicon Mike electronic devices and components on the wiring board (2), it is characterized in that: have hole (4) on wiring board (2), this hole (4) pass wiring board (2) connected chamber inside and outside.

2, a kind of micro silicon microphone according to claim 1, it is characterized in that: the gum cover of tubular (3) is enclosed within the outside of metal shell (1) and wiring board (2), sound the hole (4) the stage casing have one with wiring board (2) parallel portion, the one end is bent upwards and to the cavity inner opening, the other end is to the sidewall opening of wiring board (2), and by being positioned at the inner passage of gum cover (3) under shed.

3, a kind of micro silicon microphone according to claim 1 is characterized in that: the sound hole (4) that is arranged in wiring board (2) has at least one section trend parallel with wiring board (2).

4, according to claim 1 or 2 or 3 described a kind of micro silicon microphones, it is characterized in that: sound hole (4) opening part of wiring board (2) below is welded with the pad (6) of ring-type, the centre bore of this pad (6) is to hole (4) opening at the sound, and has radial air drain (5) on the pad (6).

5, according to claim 1 or 2 or 3 described a kind of micro silicon microphones, it is characterized in that: sound hole (4) opening part of wiring board (2) below is connected with netted elevated-temperature seal part (7) by the adhesives (8) of ring-type.