CN204291390U - A kind of MEMS microphone - Google Patents
A kind of MEMS microphone Download PDFInfo
- Publication number
- CN204291390U CN204291390U CN201420739360.9U CN201420739360U CN204291390U CN 204291390 U CN204291390 U CN 204291390U CN 201420739360 U CN201420739360 U CN 201420739360U CN 204291390 U CN204291390 U CN 204291390U
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- China
- Prior art keywords
- mems microphone
- upper cover
- mems
- substrate
- line plate
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- 239000000758 substrate Substances 0.000 claims abstract description 28
- 239000002184 metal Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 238000007731 hot pressing Methods 0.000 claims description 5
- 230000004888 barrier function Effects 0.000 claims description 4
- 230000008901 benefit Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000005236 sound signal Effects 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
Abstract
The utility model discloses a kind of MEMS microphone, comprise the encapsulating structure of upper cover and substrate composition, described substrate in described encapsulating structure is provided with MEMS acoustics chip and asic chip, described upper cover is provided with groove, form the cavity holding described MEMS acoustics chip and asic chip, described encapsulating structure outside described on cover and be provided with pad, described substrate is provided with acoustic aperture, the cavity inner wall that the groove of described upper cover is formed is provided with boss, boss can be played a supporting role to the upper cover of MEMS microphone and substrate, avoid external force on the impact of MEMS microphone, improve the withstand voltage properties of MEMS microphone, ensure the stability of MEMS microphone properties of product.Therefore, the utility model MEMS microphone has the advantage of function admirable.
Description
Technical field
The utility model relates to acoustic-electric product technical field, especially relates to a kind of MEMS microphone.
Background technology
Along with the progress of society and the development of technology, in recent years, the electronic product such as mobile phone, notebook computer volume constantly reduces, and the performance requirement of people to these portable electronic products is also more and more higher, thus also requires that the volume of electronic component supporting with it and performance improve constantly.MEMS (Micro-Electro-Mechanical System, Micro Electro Mechanical System) microphone is energy converter voice signal being converted to the signal of telecommunication, it is the microphone manufactured based on MEMS technology, Surface Mount technique can be adopted to manufacture, and there is good noise removing performance and good radio frequency and electromagnetic interference rejection ability, MEMS microphone is widely used in portable with its above-mentioned many advantage just.
The encapsulating structure of MEMS microphone generally comprises upper cover, substrate, upper cover and substrate are welded together by techniques such as Reflow Solderings, constitute the encapsulating structure holding MEMS acoustics chip, asic chip, the structure that upper cover can be formed in one, also can form for circuit board structure pressing, the upper cover of circuit board structure is pressed together by top board and the circuit board frame with hollow cavity to make, this MEMS microphone is in assembling, use procedure, upper cover by voltage endurance capability poor, cause the bad problem of the performance of MEMS microphone.
Therefore be necessary to propose a kind of improvement, to overcome traditional structure MEMS microphone defect.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of MEMS microphone of function admirable.
To achieve these goals, the utility model is by the following technical solutions:
A kind of MEMS microphone, comprise the encapsulating structure of upper cover and substrate composition, described substrate in described encapsulating structure is provided with MEMS acoustics chip and asic chip, described upper cover is provided with groove, form the cavity holding described MEMS acoustics chip and asic chip, described encapsulating structure outside described on cover and be provided with pad, described substrate is provided with acoustic aperture, and: the cavity inner wall that the groove of described upper cover is formed is provided with boss.
As the preferred technical scheme of one, described upper cover comprises first line plate and the second wiring board, and described first line plate is the frame structure with hollow cavity, and described first line plate passes through prepreg hot pressing on the end face of the second wiring board.
As the preferred technical scheme of one, described boss is arranged on the inwall of described first line plate, supports described second wiring board and described substrate.
As the preferred technical scheme of one, the inwall of described first line plate is also provided with metal level, has insulating barrier in the arranged outside of described metal level.
As the preferred technical scheme of one, described boss is arranged on the centre position of described first line plate inwall.
The utility model MEMS microphone, upper cover comprises first line plate and the second wiring board, first line plate is the frame structure with hollow cavity, first line plate passes through prepreg hot pressing on the end face of the second wiring board, the cavity inner wall of first line plate is provided with boss, pad is arranged on and covers, acoustic aperture is arranged on substrate, in the processes such as MEMS microphone assembling use and pressure test, after external force is delivered to upper cover or substrate, boss on first line plate inwall serves the effect of support second wiring board and substrate, external force is avoided to cause upper cover or substrate deformation, MEMS microphone is had an impact, make MEMS microphone performance more stable.Therefore, the utility model MEMS microphone has the advantage of resistance to pressure and stable performance.
Accompanying drawing explanation
Fig. 1 shows the utility model MEMS microphone package structural representation.
Fig. 2 shows the explosive view of a kind of optimal way of the utility model MEMS microphone upper cover.
Fig. 3 shows the upward view of the utility model MEMS microphone superstructure.
Fig. 4 shows the structural representation of the another kind of optimal way of the utility model MEMS microphone upper cover.
Embodiment
The technical problem solved to make the utility model, the technical scheme of employing, the technique effect easy to understand obtained, below in conjunction with concrete accompanying drawing, be described further embodiment of the present utility model.
As shown in Figure 1, the present embodiment MEMS microphone comprises the encapsulating structure of upper cover 1 and substrate 2 composition, described substrate 2 in described encapsulating structure is provided with MEMS acoustics chip 3 and asic chip 4, be electrically connected by the mode of metal lead wire 5 by routing between MEMS acoustics chip 3 and asic chip 4, described upper cover 1 is provided with groove, form the cavity holding described MEMS acoustics chip 3 and asic chip 4, the described upper cover 1 of described encapsulating structure outside is provided with pad 7, described substrate 2 is provided with acoustic aperture 5, MEMS microphone inside chip is electrically connected with external electronic circuits by pad 7, voice signal enters MEMS microphone inside by acoustic aperture 5, the change of MEMS acoustics chip 3 collected sound signal is also converted into the signal of telecommunication, the signal that MEMS acoustics chip 3 gathers is carried out preliminary treatment and is passed to external electronic circuits through described pad 7 by asic chip 4.
Upper cover 1 structure that can be formed in one in the present embodiment, such as directly on FR-4 sheet material, offer inner chamber, the utility model one preferred embodiment in, described upper cover 1 comprises first line plate 11, second wiring board 12, and these two wiring boards can adopt FR-4 material to make.With reference to figure 2, described first line plate 11 is the frame structure of hollow, and described first line plate 11 passes through prepreg 13 hot pressing on the end face of the second wiring board 12.Such first line plate 11 and the second wiring board 12 composition have the cavity holding MEMS acoustics chip and asic chip.This upper cover 1 by prepreg 13 by first line plate 11 together with the second wiring board 12 hot pressing, optimize the manufacturing process of upper cover, solve the problems such as binding agent outflow that traditional handicraft adopts binding agent to cause, bonding be not firm.
As shown in Figure 3, the inwall of the cavity formed at the groove of upper cover 1 at the present embodiment microphone is provided with boss 15, preferably, boss 15 is arranged on the centre position of described first line plate inwall, boss serves the effect of support to substrate and the second wiring board, pad is arranged on upper cover 1, acoustic aperture is arranged on a substrate 2, in the processes such as MEMS microphone assembling use and pressure test, after external force is delivered to upper cover or substrate, boss on first line plate inwall serves the effect of support second wiring board and substrate, external force is avoided to cause upper cover or substrate deformation, MEMS microphone is had an impact, make MEMS microphone performance more stable.
As Fig. 4, in order to prevent the chip in external environmental interference MEMS package, also metal level can be set on the inwall of described first line plate 11, such as copper product.Metal level is formed on the inwall of first line plate 11 by techniques such as chemical vapour deposition (CVD), physical vapour deposition (PVD), plating, and this all belongs to the common practise of those skilled in the art.In the utility model, also be provided with insulating barrier 14 in the outside of described metal level, such as resin bed, arranging of this insulating barrier 14 can prevent when Reflow Soldering, the scolding tin of weld zone swashes along the inwall of first line plate 11, causes because weld zone scolding tin reduces the problem such as rosin joint, open circuit brought.
To sum up, in the utility model, in order to improve the compression resistance performance of MEMS microphone, the groove inner wall of upper cover formation cavity arranges boss, can play a supporting role to the upper cover of MEMS microphone and substrate, avoid external force on the impact of MEMS microphone, ensure the stability of MEMS microphone properties of product.
Range of application of the present utility model is not limited to specific embodiment described above, and those skilled in the art can adjust the size of boss, shape and position according to practical application.Principle of the present utility model is: utilize and arrange boss on MEMS microphone outer casing inner wall, plays a supporting role, avoid the impact of external force MEMS microphone to the upper cover of microphone package and substrate, ensures the stability of MEMS microphone properties of product.
The utility model is by preferred embodiment having carried out detailed explanation.But, by studying carefully above, concerning the change of each execution mode with to increase be apparent for one of ordinary skill in the art.Being intended that these changes all and increasing of applicant has all dropped in scope that the utility model claim protects.
Claims (5)
1. a MEMS microphone, comprise the encapsulating structure of upper cover and substrate composition, described substrate in described encapsulating structure is provided with MEMS acoustics chip and asic chip, described upper cover is provided with groove, form the cavity holding described MEMS acoustics chip and asic chip, described encapsulating structure outside described on cover and be provided with pad, described substrate is provided with acoustic aperture, it is characterized in that: the cavity inner wall that the groove of described upper cover is formed is provided with boss.
2. MEMS microphone according to claim 1, it is characterized in that: described upper cover comprises first line plate and the second wiring board, described first line plate is the frame structure with hollow cavity, and described first line plate passes through prepreg hot pressing on the end face of the second wiring board.
3. MEMS microphone according to claim 2, is characterized in that: described boss is arranged on the inwall of described first line plate, supports described second wiring board and described substrate.
4. MEMS microphone according to claim 3, is characterized in that: on the inwall of described first line plate, be also provided with metal level, have insulating barrier in the arranged outside of described metal level.
5. MEMS microphone according to claim 4, is characterized in that: described boss is arranged on the centre position of described first line plate inwall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420739360.9U CN204291390U (en) | 2014-11-28 | 2014-11-28 | A kind of MEMS microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420739360.9U CN204291390U (en) | 2014-11-28 | 2014-11-28 | A kind of MEMS microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204291390U true CN204291390U (en) | 2015-04-22 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420739360.9U Active CN204291390U (en) | 2014-11-28 | 2014-11-28 | A kind of MEMS microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204291390U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106303809A (en) * | 2015-06-09 | 2017-01-04 | 钰太芯微电子科技（上海）有限公司 | A kind of pcb board and water proof type mike and processing technology |
| WO2021128418A1 (en) * | 2019-12-26 | 2021-07-01 | 潍坊歌尔微电子有限公司 | Microphone packaging structure and electronic device |
| CN113132877A (en) * | 2021-06-17 | 2021-07-16 | 甬矽电子(宁波)股份有限公司 | Microphone packaging structure and preparation method thereof |
| WO2022104930A1 (en) * | 2020-11-17 | 2022-05-27 | 瑞声声学科技(深圳)有限公司 | Mems sensor |
-
2014
- 2014-11-28 CN CN201420739360.9U patent/CN204291390U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106303809A (en) * | 2015-06-09 | 2017-01-04 | 钰太芯微电子科技（上海）有限公司 | A kind of pcb board and water proof type mike and processing technology |
| WO2021128418A1 (en) * | 2019-12-26 | 2021-07-01 | 潍坊歌尔微电子有限公司 | Microphone packaging structure and electronic device |
| WO2022104930A1 (en) * | 2020-11-17 | 2022-05-27 | 瑞声声学科技(深圳)有限公司 | Mems sensor |
| CN113132877A (en) * | 2021-06-17 | 2021-07-16 | 甬矽电子(宁波)股份有限公司 | Microphone packaging structure and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200616 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |