CN204131729U - A kind of MEMS microphone - Google Patents
A kind of MEMS microphone Download PDFInfo
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- CN204131729U CN204131729U CN201420566745.XU CN201420566745U CN204131729U CN 204131729 U CN204131729 U CN 204131729U CN 201420566745 U CN201420566745 U CN 201420566745U CN 204131729 U CN204131729 U CN 204131729U
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Abstract
The utility model provides a kind of MEMS microphone, it comprises: MEMS chip and asic chip are built between the cavity of shell and circuit board formation, and asic chip is fixing on circuit boards, and metal wire connects asic chip and circuit board, supporting plate is fixing on circuit boards, and supporting plate is provided with two through holes; MEMS chip is fixed on supporting plate, and the inwall of MEMS chip is relative with supporting plate through hole, and MEMS chip is connected by metal wire with asic chip; Sealing ring is fixed between shell and supporting plate, and the top of sealing ring is fixed on outer casing inner wall, and bottom is fixed on supporting plate, and another through hole of supporting plate is inner relative with sealing ring, and supporting plate is communicated with MEMS chip and sealing ring; Sound hole is opened on the right shell of described sealing ring inwall, and what sound hole was relative is ante-chamber by the cavity formed inside sealing ring, supporting plate and MEMS chip; By outside MEMS chip, the cavity that forms of shell and circuit board is back of the body chamber.
Description
Technical field
The utility model relates to microphone field, specifically, relates to a kind of MEMS microphone that can produce relative high s/n ratio.
Background technology
MEMS microphone is the microphone manufactured based on Micro Electro Mechanical System (Microelectromechanical Systems, is abbreviated as MEMS) technology.In prior art, advance sound MEMS microphone is a kind of conventional microphone.Fig. 1 is the structural representation of advance sound MEMS microphone of the prior art.
As shown in Figure 1, advance sound MEMS microphone comprises MEMS chip 2 ' and ASIC(Application Specific Integrated Circuit, be abbreviated as ASIC) chip 3 ', and be provided with on the circuit board 1 ' of pad 7 ' bottom being all positioned at, three is connected by plain conductor 4 '; Sound hole 5 ' is arranged on shell 6 ', and the space between the outside and shell 6 ' of MEMS chip 2 ', printed circuit board (PCB) 1 ' is considered to ante-chamber 11 ', and the cavity of MEMS chip 2 ' bottom is considered to carry on the back chamber 21 '.The structures shape of the advance sound MEMS microphone size of its signal to noise ratio.The ratio of the power that signal to noise ratio refers to the output signal of amplifier and the noise power simultaneously exported, the higher noise showing that it produces of the signal to noise ratio of equipment is fewer.Signal to noise ratio is larger, and illustrate that the noise be mixed in signal is less, the sound quality of acoustic playback is higher.
Signal to noise ratio is relevant to back of the body chamber size, and back of the body chamber is larger, and the signal to noise ratio that can accomplish is higher.And the back of the body chamber of sound MEMS microphone of advancing is only limitted to the cavity of MEMS chip 2 ' bottom, ante-chamber much larger than back of the body chamber, so advance sound MEMS microphone is difficult to produce high signal to noise ratio relatively.
Therefore, need a kind of novel MEMS microphone, increase the back of the body cavity volume of existing MEMS microphone, to improve the signal to noise ratio of advance sound MEMS microphone.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of MEMS microphone, and back of the body cavity volume increases relatively, and can produce the MEMS microphone of relative high s/n ratio.
For achieving the above object, the utility model provides a kind of MEMS microphone, it comprises: MEMS chip and asic chip are built between the cavity of shell and circuit board formation, described asic chip is fixed on described circuit board, metal wire connects described asic chip and described circuit board, supporting plate is fixed on described circuit board, and described supporting plate is provided with two through holes; Described MEMS chip is fixed on described supporting plate, and the inwall of described MEMS chip is relative with a through hole of described supporting plate, and described MEMS chip is connected by metal wire with described asic chip; Sealing ring is fixed between described shell and described supporting plate, the top of described sealing ring is fixed on described outer casing inner wall, bottom is fixed on described supporting plate, and another through hole of described supporting plate is inner relative with described sealing ring, and described supporting plate is communicated with described MEMS chip and described sealing ring; Sound hole is opened on the right described shell of described sealing ring inwall, and what described sound hole was relative is ante-chamber by the cavity formed inside described sealing ring, described supporting plate and described MEMS chip; By outside described MEMS chip, the cavity that forms of described shell and described circuit board is back of the body chamber.
Preferably, described supporting plate is provided with two through holes, a described through hole is positioned at below described sealing ring, and it is relative with described sound hole, through hole described in another is positioned at below described MEMS chip, and relative with inside described MEMS chip, be interconnected between the bottom of two described through holes, described supporting plate is communicated with described MEMS chip and described sealing ring.
Preferably, described supporting plate is provided with two through holes, a described through hole is positioned at below described sealing ring, and it is relative with described sound hole, through hole described in another is positioned at below described MEMS chip, and relative with inside described MEMS chip, the described circuit board below two described through holes is provided with the groove of connection two described through holes, and described groove is communicated with described MEMS chip and described sealing ring with two through holes of described supporting plate.
Preferably, described groove comprises the first groove and the second groove, described first groove and the second groove are relative with two through holes of described supporting plate respectively, and be interconnected between the bottom of described first groove and described second groove, described first groove, the second groove are communicated with described MEMS chip and described sealing ring with two through holes of described supporting plate.
Preferably, the edge of described supporting plate passes through fluid sealant adhering and sealing on described circuit board.
Preferably, described shell and described circuit board are sealed by fluid sealant or tin cream and form cavity.
Preferably, described asic chip is coated with fluid sealant to encapsulate.
Preferably, bonding by fixing glue with described supporting plate bottom described MEMS chip, bonding by fixing glue with described circuit board bottom described asic chip.
In addition, preferably, described sealing ring top is bonding by fixing glue with inside described shell, bottom and described supporting plate pass through fixing glue or tin cream bonding.
From above-mentioned description with put into practice, the MEMS microphone that the utility model provides, one, supporting plate fixed by circuit board, MEMS chip and sealing ring is fixed above supporting plate, the through hole of supporting plate can realize MEMS chip and be communicated with sealing ring, the inside of sealing ring is relative with sound hole, the sealing ring that then sound hole is relative, the cavity formed inside supporting plate and MEMS chip is ante-chamber, and outside MEMS chip and shell, the cavity that circuit board is formed is back of the body chamber, the volume in back of the body chamber obviously increases relative to the volume of MEMS microphone of the prior art, so, signal to noise ratio will improve relatively, form the MEMS microphone with high s/n ratio, its two, the mode of communicating between MEMS chip and sealing ring is various, can be realized, and two through holes is communicated with sealing ring with MEMS chip respectively by connection between the through hole of two on supporting plate, so, connection can be realized, also can be realized by the groove on the circuit board below through hole, can not be communicated with between two through holes, but two through holes be communicated with groove respectively, and be communicated with sealing ring with MEMS chip respectively, so, can realize being communicated with, can also be realized by the first groove and the second groove circuit board being arranged bottom connection, can not be communicated with between two through holes, but the first groove and the second groove are communicated with two through holes respectively, and be communicated with sealing ring with MEMS chip respectively, so, can realize being communicated with, and increase the intensity of circuit.
Accompanying drawing explanation
By below in conjunction with the description of accompanying drawing to embodiment, above-mentioned characteristic sum technological merit of the present utility model will become apparent and easy understand.In the accompanying drawings,
Fig. 1 is the structural representation of advance sound MEMS microphone of the prior art;
Fig. 2 is the schematic diagram of the MEMS microphone described in the utility model one embodiment;
Fig. 3 is the supporting plate schematic diagram of the MEMS microphone shown in Fig. 2;
Fig. 4 is the cutaway view of the supporting plate shown in Fig. 3;
Fig. 5 is the schematic diagram of the MEMS microphone described in the another embodiment of the utility model;
Fig. 6 is the cutaway view of the supporting plate shown in Fig. 5;
Fig. 7 is the schematic diagram of the MEMS microphone described in the utility model the 3rd embodiment.
MEMS microphone 100 '
1 ': printed circuit board (PCB); 2 ': MEMS chip; 3 ': asic chip; 4 ': gold thread;
5 ': sound hole; 6 ': shell; 11 ': ante-chamber; 21: back of the body chamber ':
MEMS microphone 100
1: circuit board; 11: groove; 111: the first grooves; 112: the second grooves;
2:MEMS chip; 3:ASIC chip; 4: metal wire;
5: sound hole; 6: shell; 7: supporting plate; 71: through hole; 8: fixing glue; 9: fluid sealant;
10: seal; 20: ante-chamber; 30: back of the body chamber.
Embodiment
For enabling above-mentioned purpose of the present utility model, feature and advantage become apparent more, are described in further detail the utility model below in conjunction with the drawings and specific embodiments.
Fig. 2 is the schematic diagram of the MEMS microphone described in the utility model one embodiment.Fig. 3 is the supporting plate schematic diagram of the MEMS microphone shown in Fig. 2.Fig. 4 is the cutaway view of the supporting plate shown in Fig. 3.As shown in Figure 2, Figure 3 and Figure 4, MEMS microphone 100 comprises circuit board 1, MEMS chip 2, asic chip 3, metal wire 4, sound hole 5, shell 6, supporting plate 7 and seal 10.
MEMS chip 2 and asic chip 3 are built between the cavity of shell 6 and circuit board 1 formation.Preferably, shell 6 and circuit board 1 are sealed by fluid sealant 9 or soldering paste and form cavity.Asic chip 3 is fixing on the circuit card 1.Preferably, bonding by fixing glue 8 with circuit board 1 bottom asic chip 3.Metal wire 4 connects asic chip 3 and circuit board 1, by asic chip 3 and circuit board 1 conducting.In the present embodiment, gold thread is adopted to connect between asic chip 3 and circuit board 1.Preferably, asic chip 3 is coated with fluid sealant 9 to encapsulate.
Supporting plate 7 is fixing on the circuit card 1, and supporting plate 7 is provided with two through holes 71; As shown in Figure 3 and Figure 4, in the present embodiment, supporting plate 7 is surface plate, two through holes 71 on supporting plate 7 are spaced apart, but the bottom of two through holes 71 is interconnected, be seal between supporting plate 7 and circuit board 1, the edge of supporting plate 7 by fluid sealant 9 adhering and sealing on the circuit card 1, is avoided hindering the connection between through hole 71.
MEMS chip 2 is fixed on supporting plate 7, preferably, bonding by fixing glue 8 with supporting plate 7 bottom MEMS chip 2.The inwall of MEMS chip 2 is relative with a through hole 71 of supporting plate 7, and MEMS chip 2 is connected by metal wire 4 with asic chip 3.
Sealing ring 10 is fixed between shell 6 and supporting plate 7, the top of sealing ring 10 is fixed on shell 6 inwall, and bottom is fixed on supporting plate 7, preferably, sealing ring 10 top is bonding by fixing glue 8 with inside shell 6, bottom and supporting plate 7 pass through fixing glue 8 or tin cream bonding.Another through hole 71 of supporting plate 7 is relative with the inside of sealing ring 6, and a through hole 71 of supporting plate 7 is communicated with MEMS chip 2, and another through hole 71 is communicated with sealing ring 10, is also interconnected between through hole 71, so supporting plate 7 is communicated with MEMS chip 2 and sealing ring 10.
Sound hole 5 is opened on the right shell 6 of sealing ring 10 inwall, and what sound hole 5 was relative is ante-chamber 20 by the cavity formed inside sealing ring 10, supporting plate 7 and MEMS chip 2; By outside MEMS chip 2, the cavity that forms of shell 6 and circuit board 1 is back of the body chamber 30.
In the present embodiment, supporting plate 7 is surface plate, it is spaced apart that supporting plate 7 is provided with two through holes 71, a through hole 71 is positioned at below sealing ring 10, and relative with sound hole 5, and another through hole 71 is positioned at below MEMS chip 2, and it is relative with inside MEMS chip 2, be interconnected between the bottom of two through holes 71, form a cavity be communicated with, then supporting plate 7 is communicated with MEMS chip 2 and sealing ring 10; Sound hole 5 is opened on the right shell 6 of sealing ring 10 inwall, and what sound hole 5 was relative is ante-chamber 20 by the cavity formed inside sealing ring 10, supporting plate 7 and MEMS chip 2; By outside MEMS chip 2, the cavity that forms of shell 6 and circuit board 1 is back of the body chamber 30, the volume in back of the body chamber 30 increases relatively, then signal to noise ratio improves relatively.
Fig. 5 is the schematic diagram of the MEMS microphone described in the another embodiment of the utility model.Fig. 6 is the cutaway view of the supporting plate shown in Fig. 5.MEMS microphone shown in Fig. 5 is from the main distinction of the MEMS microphone shown in Fig. 2: the supporting plate of the two is different with the structure of terminal block.As shown in Figure 6, supporting plate 7 is surface plate, and two through holes 71 on supporting plate 7 are spaced apart, and the bottom of two through holes 71 is not also interconnected.But circuit board 1 is provided with groove 11, groove 11 is communicated with two through holes 71 of supporting plate 7 respectively, then through hole 71 is interconnected by groove 11.And two through holes 71 are communicated with sealing ring 10 with MEMS chip 2 respectively, so groove 11 is communicated with MEMS chip 2 and sealing ring 10 with two through holes 71 of supporting plate 7; And sound hole 5 is opened on the right shell 6 of sealing ring 10 inwall, what sound hole 5 was relative is ante-chamber 20 by the cavity formed inside sealing ring 10, supporting plate 7 and MEMS chip 2; By outside MEMS chip 2, the cavity that forms of shell 6 and circuit board 1 is back of the body chamber 30, the volume in back of the body chamber 30 increases relatively, then signal to noise ratio improves relatively.
Fig. 7 is the schematic diagram of the MEMS microphone described in the utility model the 3rd embodiment.MEMS microphone shown in Fig. 7 is from the main distinction of the MEMS microphone shown in Fig. 5: the structure of the terminal block of the two is different, and this structure contributes to the intensity increasing circuit board.As shown in Figure 7, supporting plate 7 is surface plate, and two through holes 71 on supporting plate 7 are spaced apart, and the bottom of two through holes 71 is not also interconnected.But, circuit board 1 is provided with groove 11, groove 11 comprises the first groove 111 and the second groove 112, and first is interconnected between groove 111 and the bottom of the second groove 112, form a cavity be communicated with, first groove 111 and the second groove 112 are relative with the through hole 71 of two on supporting plate 7 respectively, and two through holes 71 of supporting plate 7 are communicated with MEMS chip 2 and sealing ring 10 respectively; Then the first groove 111, second groove 112 is communicated with MEMS chip 2 and sealing ring 10 with two through holes 71 of supporting plate 7.And sound hole 5 is opened on the right shell 6 of sealing ring 10 inwall, what sound hole 5 was relative is ante-chamber 20 by the cavity formed inside sealing ring 10, supporting plate 7 and MEMS chip 2; By outside MEMS chip 2, the cavity that forms of shell 6 and circuit board 1 is back of the body chamber 30, the volume in back of the body chamber 30 increases relatively, then signal to noise ratio improves relatively.
The MEMS microphone that the embodiment provided by above-mentioned the utility model is provided, one, supporting plate fixed by circuit board, MEMS chip and sealing ring is fixed above supporting plate, the through hole of supporting plate can realize MEMS chip and be communicated with sealing ring, the inside of sealing ring is relative with sound hole, the sealing ring that then sound hole is relative, the cavity formed inside supporting plate and MEMS chip is ante-chamber, and outside MEMS chip and shell, the cavity that circuit board is formed is back of the body chamber, the volume in back of the body chamber obviously increases relative to the volume of MEMS microphone of the prior art, so, signal to noise ratio will improve relatively, form the MEMS microphone with high s/n ratio, its two, the mode of communicating between MEMS chip and sealing ring is various, can be realized, and two through holes is communicated with sealing ring with MEMS chip respectively by connection between the through hole of two on supporting plate, so, connection can be realized, also can be realized by the groove on the circuit board below through hole, can not be communicated with between two through holes, but two through holes be communicated with groove respectively, and be communicated with sealing ring with MEMS chip respectively, so, can realize being communicated with, can also be realized by the first groove and the second groove circuit board being arranged bottom connection, can not be communicated with between two through holes, but the first groove and the second groove are communicated with two through holes respectively, and be communicated with sealing ring with MEMS chip respectively, so, can realize being communicated with, and increase the intensity of circuit.
The above; be only the utility model preferably embodiment; but protection range of the present utility model is not limited thereto; any people being familiar with this technology is in the technical scope disclosed by the utility model; the change that can expect easily or replacement, all should be encompassed within protection range of the present utility model.Therefore, protection range of the present utility model should be as the criterion with the protection range of claim.
Claims (9)
1. a MEMS microphone, it comprises: MEMS chip and asic chip are built between the cavity of shell and circuit board formation, and described asic chip is fixed on described circuit board, and metal wire connects described asic chip and described circuit board, it is characterized in that,
Supporting plate is fixed on described circuit board, and described supporting plate is provided with two through holes;
Described MEMS chip is fixed on described supporting plate, and the inwall of described MEMS chip is relative with a through hole of described supporting plate, and described MEMS chip is connected by metal wire with described asic chip;
Sealing ring is fixed between described shell and described supporting plate, the top of described sealing ring is fixed on described outer casing inner wall, bottom is fixed on described supporting plate, and another through hole of described supporting plate is inner relative with described sealing ring, and described supporting plate is communicated with described MEMS chip and described sealing ring;
Sound hole is opened on the right described shell of described sealing ring inwall, and what described sound hole was relative is ante-chamber by the cavity formed inside described sealing ring, described supporting plate and described MEMS chip; By outside described MEMS chip, the cavity that forms of described shell and described circuit board is back of the body chamber.
2. MEMS microphone as claimed in claim 1, it is characterized in that, described supporting plate is provided with two through holes, a described through hole is positioned at below described sealing ring, and relative with described sound hole, through hole described in another is positioned at below described MEMS chip, and relative with inside described MEMS chip, be interconnected between the bottom of two described through holes, described supporting plate is communicated with described MEMS chip and described sealing ring.
3. MEMS microphone as claimed in claim 1, it is characterized in that, described supporting plate is provided with two through holes, a described through hole is positioned at below described sealing ring, and relative with described sound hole, through hole described in another is positioned at below described MEMS chip, and relative with inside described MEMS chip, described circuit board below two described through holes is provided with the groove of connection two described through holes, and described groove is communicated with described MEMS chip and described sealing ring with two through holes of described supporting plate.
4. MEMS microphone as claimed in claim 3, it is characterized in that, described groove comprises the first groove and the second groove, described first groove and the second groove are relative with two through holes of described supporting plate respectively, and be interconnected between the bottom of described first groove and described second groove, described first groove, the second groove are communicated with described MEMS chip and described sealing ring with two through holes of described supporting plate.
5. the MEMS microphone as described in claim as arbitrary in claim 1-4, is characterized in that, the edge of described supporting plate passes through fluid sealant adhering and sealing on described circuit board.
6. MEMS microphone as claimed in claim 1, is characterized in that, described shell and described circuit board are sealed by fluid sealant or tin cream and form cavity.
7. MEMS microphone as claimed in claim 1, is characterized in that, described asic chip is coated with fluid sealant and encapsulates.
8. MEMS microphone as claimed in claim 1, is characterized in that, bonding by fixing glue with described supporting plate bottom described MEMS chip, bonding by fixing glue with described circuit board bottom described asic chip.
9. MEMS microphone as claimed in claim 1, is characterized in that, described sealing ring top is bonding by fixing glue with inside described shell, bottom pass through fixing glue with described supporting plate or tin cream bonding.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420566745.XU CN204131729U (en) | 2014-09-29 | 2014-09-29 | A kind of MEMS microphone |
| PCT/CN2014/095523 WO2016011780A1 (en) | 2014-07-25 | 2014-12-30 | Mems microphone and top-port mems microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420566745.XU CN204131729U (en) | 2014-09-29 | 2014-09-29 | A kind of MEMS microphone |
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| Publication Number | Publication Date |
|---|---|
| CN204131729U true CN204131729U (en) | 2015-01-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420566745.XU Active CN204131729U (en) | 2014-07-25 | 2014-09-29 | A kind of MEMS microphone |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016179896A1 (en) * | 2015-05-08 | 2016-11-17 | 中兴通讯股份有限公司 | Seal structure of microphone and electronic device |
| WO2017059898A1 (en) * | 2015-10-07 | 2017-04-13 | Tdk Corporation | Top port microphone with enlarged back volume |
| CN111031462A (en) * | 2019-11-12 | 2020-04-17 | 山东新港电子科技有限公司 | Preposition back sound cavity MEMS MIC |
| CN111314830A (en) * | 2019-12-07 | 2020-06-19 | 朝阳聚声泰（信丰）科技有限公司 | MEMS microphone with high signal-to-noise ratio and production method thereof |
-
2014
- 2014-09-29 CN CN201420566745.XU patent/CN204131729U/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016179896A1 (en) * | 2015-05-08 | 2016-11-17 | 中兴通讯股份有限公司 | Seal structure of microphone and electronic device |
| WO2017059898A1 (en) * | 2015-10-07 | 2017-04-13 | Tdk Corporation | Top port microphone with enlarged back volume |
| CN108391463A (en) * | 2015-10-07 | 2018-08-10 | Tdk株式会社 | Top port microphone with widened rear volume |
| US10194251B2 (en) | 2015-10-07 | 2019-01-29 | Tdk Corporation | Top port microphone with enlarged back volume |
| CN108391463B (en) * | 2015-10-07 | 2020-05-29 | Tdk株式会社 | Top port microphone package with enlarged back volume |
| CN111031462A (en) * | 2019-11-12 | 2020-04-17 | 山东新港电子科技有限公司 | Preposition back sound cavity MEMS MIC |
| CN111314830A (en) * | 2019-12-07 | 2020-06-19 | 朝阳聚声泰（信丰）科技有限公司 | MEMS microphone with high signal-to-noise ratio and production method thereof |
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Address after: 261200 No. 68 Fengshan Road, Fangzi District, Weifang City, Shandong Province Patentee after: Gongda Electroacoustics Co., Ltd. Address before: 261200 No. 68 Fengshan Road, Fangzi District, Weifang City, Shandong Province Patentee before: Shandong Gettop Acoustic Co.,Ltd. |