CN203788460U - Mems microphone - Google Patents
Mems microphone Download PDFInfo
- Publication number
- CN203788460U CN203788460U CN201420161078.7U CN201420161078U CN203788460U CN 203788460 U CN203788460 U CN 203788460U CN 201420161078 U CN201420161078 U CN 201420161078U CN 203788460 U CN203788460 U CN 203788460U
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- Prior art keywords
- chip
- hole
- mems
- conductive
- wiring board
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- Expired - Fee Related
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- 239000000084 colloidal system Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 13
- 238000005516 engineering process Methods 0.000 abstract description 5
- 238000003466 welding Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 9
- 241000218202 Coptis Species 0.000 description 8
- 235000002991 Coptis groenlandica Nutrition 0.000 description 8
- 230000000694 effects Effects 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 208000002925 dental caries Diseases 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- VIKNJXKGJWUCNN-XGXHKTLJSA-N norethisterone Chemical compound O=C1CC[C@@H]2[C@H]3CC[C@](C)([C@](CC4)(O)C#C)[C@@H]4[C@@H]3CCC2=C1 VIKNJXKGJWUCNN-XGXHKTLJSA-N 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Landscapes
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The utility model discloses an MEMS microphone and relates to the electroacoustic technology field. The MEMS microphone comprises a circuit board and a casing which are packaged into one body, wherein a space formed through enclosure of the circuit board and the casing is internally accommodated with an MEMS chip and an ASIC chip, the MEMS chip and the ASIC chip are overlapped and fixed on the circuit board, the ASIC chip is arranged between the MEMS chip and the circuit board, a film of the MEMS chip is far away from the ASIC chip, the MEMS chip is provided with a first conductive through hole, the ASIC chip is provided with a second conductive through hole corresponding to the first conductive through hole in positions, and a welding disc of the MEMS chip is electrically connected with the circuit board through the first conductive through hole and the second conductive through hole. The MEMS microphone has advantages of small size, simple assembly operation, high production efficiency and low production cost.
Description
Technical field
The utility model relates to acoustic-electric technical field, particularly a kind of MEMS microphone.
Background technology
MEMS(Micro-Electro-Mechanical System, Micro Electro Mechanical System) microphone is the energy converter that voice signal is converted to the signal of telecommunication, it is the microphone of manufacturing based on MEMS technology, can adopt Surface Mount technique to manufacture, can bear very high Reflow Soldering temperature, and there is good noise removing performance and good radio frequency and electromagnetic interference and suppress ability, MEMS microphone is widely used in portable electric appts with its above-mentioned many advantage just.
Existing MEMS microphone comprises the wiring board and the shell that are packaged as a whole mostly, in the space that wiring board and shell surround, contain MEMS chip and ASIC(Application Specific Integrated Circuit, application-specific integrated circuit (ASIC)) chip, MEMS chip and asic chip are fixed in the circuit board side by side, between MEMS chip and asic chip, and be all electrically connected by gold thread between asic chip and wiring board.The MEMS microphone volume of this kind of structure is larger; Because of between chip and chip, all need gold thread to be electrically connected between chip and wiring board again, therefore need the operation of gold thread bonding in the time of assembling microphone, operation is more loaded down with trivial details, and production efficiency is low; And the cost of gold thread is higher, thereby make the production cost of MEMS microphone also higher.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of MEMS microphone, and this MEMS microphone volume is small and exquisite; Assembling procedure is easy, and production efficiency is high; And production cost is low.
For solving the problems of the technologies described above, the technical solution of the utility model is:
A kind of MEMS microphone, comprise the wiring board and the shell that are packaged as a whole, in the space that described wiring board and described shell surround, contain MEMS chip and asic chip, described MEMS chip and described asic chip are overlapping to be fixed on described wiring board, described asic chip is between described MEMS chip and described wiring board, and the diaphragm of described MEMS chip is away from described asic chip; Described MEMS chip is provided with the first conductive through hole, on described asic chip, the position of corresponding described the first conductive through hole is provided with the second conductive through hole, and the pad on described MEMS chip is electrically connected with described wiring board by described the first conductive through hole and described the second conductive through hole.
Wherein, the two ends of described the second conductive through hole are respectively equipped with for being electrically connected described the first conductive through hole and described the second conductive through hole, and the electrical connector of described the second conductive through hole and described wiring board.
Wherein, described MEMS chip and described asic chip are sealed and are fixed on described wiring board by colloid.
As a kind of execution mode, described shell is provided with sound hole.
As another kind of execution mode, on described asic chip, the position of the cavity of corresponding described MEMS chip is provided with through hole.
As another execution mode, described wiring board is provided with sound hole, and described asic chip is provided with cavity for being communicated with described MEMS chip and the through hole in described sound hole.
Wherein, described pad is groove structure.
Adopted after technique scheme, the beneficial effects of the utility model are:
Due to the MEMS chip of the utility model MEMS microphone and asic chip overlapping fixing in the circuit board, MEMS chip is provided with the first conductive through hole, on asic chip, the position of corresponding the first conductive through hole is provided with the second conductive through hole, and the pad on MEMS chip is electrically connected with wiring board by the first conductive through hole and the second conductive through hole.MEMS chip and asic chip are overlapping to be fixed on circuit board, has saved the area occupied of a chip, can effectively reduce the volume of MEMS microphone.Pad on MEMS chip is electrically connected with wiring board by the second conductive through hole that is arranged on the first conductive through hole on MEMS chip and be arranged on asic chip, having substituted gold thread of the prior art connects, thereby save the assembling procedure of bonding gold thread, simplify the assembling procedure of MEMS microphone, improve production efficiency, also saved the cost of gold thread, reduced the production cost of MEMS microphone simultaneously.
Brief description of the drawings
Fig. 1 is the structural representation of the utility model MEMS microphone embodiment mono-;
Fig. 2 is the structural representation of the utility model MEMS microphone embodiment bis-;
Fig. 3 is the structural representation of the utility model MEMS microphone embodiment tri-;
Wherein: 10a, wiring board, 10b, wiring board, 20a, shell, 20b, shell, 30, MEMS chip, 32, diaphragm, 34, pad, 36, the first conductive through hole, 40a, asic chip, 40b, asic chip, 42, through hole, 44, the second conductive through hole, 50, colloid, 60, electrical connector, 70, sound hole.
Embodiment
Below in conjunction with drawings and Examples, further set forth the utility model.
Embodiment mono-:
As shown in Figure 1, a kind of MEMS microphone, comprises wiring board 10a and a shell 20a that one end is uncovered, and the opening end of shell 20a is combined and is packaged as a whole with wiring board 10a.The side that definition wiring board 10a is positioned at package interior is inner side, and a side that is positioned at packaging body outside is outside; The side that shell 20a is positioned at package interior is inner side, and a side that is positioned at packaging body outside is outside.The inner side of wiring board 10a is fixed with MEMS chip 30 and asic chip 40a, and MEMS chip 30 is fixed on wiring board 10a with asic chip 40a is overlapping.Asic chip 40a is between MEMS chip 30 and wiring board 10a, the diaphragm 32 of MEMS chip 30 arranges away from asic chip 40a, be that asic chip 40a is fixed on wiring board 10a, MEMS chip 30 formal dress are fixed on asic chip 40a, MEMS chip 30 and asic chip 40a are fixed on wiring board 10a by colloid 50 sealings, colloid 50 sprays glue by the point gum machine of four statures at four faces of chip simultaneously forms, colloid 50 has wrapped asic chip 40a and MEMS chip 30 part near asic chip 40a, when being fixed on wiring board 10a, MEMS chip 30 and asic chip 40a also play before sealing, the effect of the rear operatic tunes.
As shown in Figure 1, MEMS chip 30 is provided with two the first conductive through holes 36, and the position of upper corresponding two the first conductive through holes 36 of asic chip 40a is respectively equipped with two the second conductive through holes 44.Two the first conductive through holes 36 and two the second conductive through holes 44 are all the silicon perforation that first form on chip by etch process, then in silicon perforation, inject metal, make it have the effect of conduction.Pad 34 on MEMS chip 30 is electrically connected with wiring board 10a by the first conductive through hole 36 and the second conductive through hole 44.The two ends of two the second conductive through holes 44 are respectively equipped with electrical connector 60, between the first conductive through hole 36 and the second conductive through hole 44, be electrically connected by the electrical connector 60 of second conductive through hole 44 one end, between the second conductive through hole 44 and wiring board 10a, be electrically connected by the electrical connector 60 of second conductive through hole 44 other ends, electrical connector 60 is combinations of copper and tin, be that copper post adds the salient point forming after tin ball etching backflow, can play the effect of electrical connection.
As shown in Figure 1, the pad 34 on MEMS chip 30 is groove structure, and the pad 34 of groove structure can prevent that tin cream from flowing to MEMS chip 30 or asic chip 40a surface and causing short circuit.
As shown in Figure 1, shell 20a is provided with sound hole 70.
Embodiment bis-:
As shown in Figure 2, present embodiment and embodiment mono-are basic identical, and its difference is:
The position of upper corresponding MEMS chip 30 cavitys of asic chip 40b is provided with through hole 42, and through hole 42 is made by etch process, and it can be circular hole, can be also square hole, mainly plays the effect of logical sound and ventilation.Through hole 42 has increased the rear operatic tunes of MEMS microphone, the sensitivity that is conducive to improve MEMS microphone in the present embodiment.
Embodiment tri-:
As shown in Figure 3, present embodiment and embodiment bis-are basic identical, and its difference is:
Sound hole 70 is not arranged on shell 20b, and be arranged on wiring board 10b, through hole 42 on asic chip 40b plays and is communicated with the cavity of MEMS chip 30 and the effect in sound hole 70, can make on the diaphragm 32 of the unobstructed MEMS of the acting on chip 30 of voice signal milli being entered by sound hole 70.
Operation principle of the present utility model is as follows:
Voice signal enters into the inner chamber of MEMS microphone by sound hole and is applied on the diaphragm of MEMS chip, the voice signal sensing is converted to signal of telecommunication output by MEMS chip, the signal of telecommunication of MEMS chip output process by asic chip after through being given to terminal equipment by wiring board.The utility model overlaps MEMS chip and asic chip, has effectively reduced the volume of MEMS microphone; Substitute and had now the gold thread in technology with conductive through hole again, thereby simplified the assembling procedure of MEMS microphone, improved production efficiency, also reduced production cost simultaneously.
Pad and the first conductive through hole on the above-mentioned MEMS chip relating to, and the second conductive through hole and through hole on asic chip all completes in wafer fabrication.
The first conductive through hole relating in the utility model and the second conductive through hole are only in order to distinguish technical characterictic, do not represent processing, the assembling sequence of the two, also do not represent the job order of the two etc.
The utility model is not limited to above-mentioned concrete execution mode, and those of ordinary skill in the art is from above-mentioned design, and without performing creative labour, all conversion of having done, within all dropping on protection range of the present utility model.
Claims (7)
1.MEMS microphone, comprise the wiring board and the shell that are packaged as a whole, in the space that described wiring board and described shell surround, contain MEMS chip and asic chip, it is characterized in that, described MEMS chip and described asic chip are overlapping to be fixed on described wiring board, described asic chip is between described MEMS chip and described wiring board, and the diaphragm of described MEMS chip is away from described asic chip; Described MEMS chip is provided with the first conductive through hole, on described asic chip, the position of corresponding described the first conductive through hole is provided with the second conductive through hole, and the pad on described MEMS chip is electrically connected with described wiring board by described the first conductive through hole and described the second conductive through hole.
2. MEMS microphone according to claim 1, it is characterized in that, the two ends of described the second conductive through hole are respectively equipped with for being electrically connected described the first conductive through hole and described the second conductive through hole, and the electrical connector of described the second conductive through hole and described wiring board.
3. MEMS microphone according to claim 2, is characterized in that, described MEMS chip and described asic chip are sealed and are fixed on described wiring board by colloid.
4. according to the MEMS microphone described in the arbitrary claim of claims 1 to 3, it is characterized in that, described shell is provided with sound hole.
5. MEMS microphone according to claim 4, is characterized in that, on described asic chip, the position of the cavity of corresponding described MEMS chip is provided with through hole.
6. according to the MEMS microphone described in the arbitrary claim of claims 1 to 3, it is characterized in that, described wiring board is provided with sound hole, and described asic chip is provided with cavity for being communicated with described MEMS chip and the through hole in described sound hole.
7. MEMS microphone according to claim 1, is characterized in that, described pad is groove structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420161078.7U CN203788460U (en) | 2014-04-03 | 2014-04-03 | Mems microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420161078.7U CN203788460U (en) | 2014-04-03 | 2014-04-03 | Mems microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203788460U true CN203788460U (en) | 2014-08-20 |
Family
ID=51324608
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420161078.7U Expired - Fee Related CN203788460U (en) | 2014-04-03 | 2014-04-03 | Mems microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203788460U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104780490A (en) * | 2015-04-20 | 2015-07-15 | 歌尔声学股份有限公司 | MEMS microphone packaging structure and manufacturing method thereof |
| CN105067013A (en) * | 2015-07-21 | 2015-11-18 | 歌尔声学股份有限公司 | Environmental sensor |
| CN113891200A (en) * | 2021-09-24 | 2022-01-04 | 青岛歌尔智能传感器有限公司 | Packaging structure of microphone |
-
2014
- 2014-04-03 CN CN201420161078.7U patent/CN203788460U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104780490A (en) * | 2015-04-20 | 2015-07-15 | 歌尔声学股份有限公司 | MEMS microphone packaging structure and manufacturing method thereof |
| CN105067013A (en) * | 2015-07-21 | 2015-11-18 | 歌尔声学股份有限公司 | Environmental sensor |
| CN113891200A (en) * | 2021-09-24 | 2022-01-04 | 青岛歌尔智能传感器有限公司 | Packaging structure of microphone |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20200608 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140820 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |