CN102917303B - Microphone packaged by plastic casing - Google Patents
Microphone packaged by plastic casing Download PDFInfo
- Publication number
- CN102917303B CN102917303B CN201210424495.1A CN201210424495A CN102917303B CN 102917303 B CN102917303 B CN 102917303B CN 201210424495 A CN201210424495 A CN 201210424495A CN 102917303 B CN102917303 B CN 102917303B
- Authority
- CN
- China
- Prior art keywords
- terminal
- plastic housing
- mems
- pcb board
- microphone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 31
- 229910052802 copper Inorganic materials 0.000 claims abstract description 31
- 239000010949 copper Substances 0.000 claims abstract description 31
- 229910000679 solder Inorganic materials 0.000 claims description 26
- 241000218202 Coptis Species 0.000 claims description 12
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 12
- 238000007747 plating Methods 0.000 claims description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 claims description 6
- 238000007493 shaping process Methods 0.000 claims description 6
- 238000005192 partition Methods 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 238000002955 isolation Methods 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 abstract description 3
- 238000003466 welding Methods 0.000 abstract description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 2
- 230000004907 flux Effects 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 238000004891 communication Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000010009 beating Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 241001657258 Pachycare flavogriseum Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Abstract
The invention provides a microphone packaged by a plastic casing, which comprises a PCB (Printed Circuit Board), the plastic casing, an MEMS (Micro Electro Mechanical System) device, an ASIC (Application Specific Integrated Circuit) chip and a copper casing, wherein the MEMS device and the application specific integrated circuit chip are mounted in the plastic casing and connected by a gold wire; a terminal is arranged at the edge of the plastic casing; the ASIC chip is communicated with the terminal by a gold wire; the plastic casing is pressed and fitted into the copper casing to form an assembly body, and then the whole assembly body is mounted on the PCB to form an acoustic cavity; a sound hole of the plastic casing is over against a sound hole in the copper casing; the MEMS device is over against the sound holes; the terminal of the plastic casing is connected with a welding spot on the PCB; and the end face of the copper casing is connected with a welding flux on the PCB. The microphone has the advantages that the signal-to-noise ratio of the microphone is increased by allowing an acoustic signal to enter an acoustic cavity body from an MEMS back cavity, an SMT (Surface Mount Technology) face-to-face sound (front sound inlet) can be realized, and the whole back sound inlet can be turned to the whole front sound inlet of the microphone.
Description
Technical field
The present invention relates to a kind of encapsulating structure of silicon microphone, be limited to the encapsulation field of semiconductor MEMS microphone;
Background technology
MEMS microphone more and more obtains accreditation and the attention in electroacoustics field due to the electric property of excellence and minimum volume.Compare with traditional E CM microphone, it is stable, consistent that MEMS microphone has electrical functionality, and encapsulation volume is little, is convenient to SMT(surface mount) etc. many merits, MEMS microphone is inherently more and more extensive in the application of field of acoustics.The encapsulation of microphone is identical concept with the encapsulation of traditional sense IC, but because MEMS microphone is due to the particularity of MEMS, its encapsulating structure must meet the protection of MEMS mechanism on the one hand, the Functional Requirement of MEMS must be met on the other hand, and it is in use to the shielding requirements that must meet RF signal, such MEMS microphone package has again certain particularity relative to the encapsulation of traditional IC, simultaneously for field of acoustics, the change of encapsulating structure directly has influence on the overall acoustical behavior of device, very profound significance is had to the research of MEMS microphone package structure.
Common microphone has two kinds of packaged types, the most a kind of is the packaged type of direct COB, MEMS(MEMS (micro electro mechanical system)) and ASIC(dedicated IC chip) by DIE BONDING(paster) be fixed on pcb board, by WIRE BONDING(gold thread bonding) realize the conducting of ASIC and MEMS, ASIC and external communication, outside adds crown cap and realizes electromagnetic shielding, this method for packing by beating acoustic holes or beating the method for acoustic holes at PCB on crown cap, and what realize MEMS enters sound.Form two different series products according to the difference entering method for acoustic: advance sound product with carry on the back into sound product, two series products acoustic characteristics are different, and usage is different; Another takes the mode of three layers of pcb board overlap, and three layers of pcb board become cavity by three stacked swagings, and second layer pcb board plates out metal covering and form shielding cavity, this encapsulation shield effectiveness is poor, and assembling difficulty is large, and PCB difficulty of processing is large, and cost is high.Equally press in sound position with metal cap method different, be also divided into advance sound and carry on the back into the different product of the different acoustic characteristic of sound two class.Because microphone applications occasion is different, sometimes need sound and carry on the back from MEMS the acoustic characteristic that chamber is transmitted to the operatic tunes, need again SMT paster face and acoustic aperture at offside, so derive MEMS or ASIC on top plate time, by the similar encapsulating structure of the metallic vias conducting on the PCB in intermediate layer, this proposes to be strict with to volume production packaging technology: the uncontrollable solder joint distich of simple grain device of matrix arrangement, pcb board bond strength interconnected is in planar fashion difficult to proof strength, causes device PSR to decay serious because PCB cabling is long simultaneously.
Summary of the invention
The present invention is directed to above deficiency, the attachment face that solves is with sound hole at offside, and sound enters to encapsulate the problem of body cavity from MEMS bottom conductive, provides a kind of plastic housing packaged microphone, solves electromagnetic shielding problem in encapsulation simultaneously.
According to technical scheme provided by the invention, described plastic housing packaged microphone, comprise pcb board, plastic housing, MEMS, dedicated IC chip ASIC, copper shell, described plastic shell attachment MEMS and dedicated IC chip, be connected by gold thread, plastic housing edge has terminal, and dedicated IC chip is by gold thread and terminal UNICOM; Plastic housing is press-fitted in copper shell after composition assembly, and whole assembly is mounted on pcb board and forms acoustic cavity; Acoustic aperture on described plastic housing and copper shell is just right, and MEMS is just to described acoustic aperture; The terminal of plastic housing is connected with the solder joint on pcb board, and the end face of copper shell is connected with the solder on pcb board.
The described pcb board back side has pad, and the solder and the pad that are positioned at pcb board outer ring are connected.
Described terminal employing whole piece copper strips is die-cut to be formed, and the terminal after shaping comprises: the first terminal face, the second terminal surface, the 3rd terminal surface, and described the first terminal face adopts the plating of nickel gold, with the gold thread UNICOM of the pad on dedicated IC chip; 3rd terminal surface also adopts the plating of nickel gold, as the UNICOM's carrier with the solder joint on pcb board; Second terminal surface only makes Nickel Plating Treatment, as isolation strip.
Described plastic housing is reserved with partition grooves at terminal tip portions place, and the terminal of the plastic housing after shaping cuts off from partition grooves, and the inwall of terminal tip portions and the copper shell after assembling leaves gap.
Described plastic housing is coated with layer of silica gel when loading copper shell around acoustic aperture.
Advantage of the present invention is: present invention accomplishes acoustic signal and enter acoustics cavity to improve the requirement of microphone to-noise ratio raising from MEMS back of the body chamber, and the requirement of sound from SMT face-to-face (what is called just enters sound) can be met, achieve whole back of the body and turn into sound (MEMS carries on the back chamber) requirement that whole microphone is just entering sound (application PCB support plate is without the need to perforate).Solve electromagnetic shielding problem in encapsulation, ensure packaging body intensity, the accurate connection of more convenient PCB solder joint and MEMS input/output signal, also reduces packaging cost, increasing amount finished product rate simultaneously.
Accompanying drawing explanation
Fig. 1 is plastic housing encapsulating structure generalized section.
Fig. 2 is plastic housing structural representation.
Fig. 3 is PCB solder joint connection diagram.
Fig. 4 is metal shell schematic diagram.
Embodiment
Below in conjunction with drawings and Examples, the invention will be further described.
The present invention is with simple and reliable plastic packaging body carrying microphone ASIC and MEMS, the communication of ASIC and MEMS signal is realized by gold thread bonding, the constrained input of the signal of telecommunication passes through solder reflow UNICOM by the golden finger on terminal and specific PCB, realizes the function of product.
As shown in Figure 1, the present invention includes: pcb board 1, plastic housing 2, MEMS 3, dedicated IC chip 6, copper shell 7; Be press-fitted into copper shell 7 after plastic housing 2 and terminal 10 adopt the method forming of insert-molding (insert molding) and form assembly, assembly is mounted on pcb board 1 and forms acoustic cavity 9; Assembly adopts traditional paster and gold thread bonding technology in acoustic cavity 9, mount MEMS 3 and dedicated IC chip 6 before sticking pcb board 1, be connected by gold thread 5, realize the UNICOM of dedicated IC chip 6 and MEMS 3 signal, dedicated IC chip 6 signal is by gold thread 5 and terminal 10 UNICOM; The copper face of copper shell 7 is mounted on the solder 14 of pcb board 1, forms sealing by backflow; The corresponding UNICOM realizing signal of 6 golden fingers of 6 solder joints 15 and plastic housing upper terminal 10 on pcb board 1.
As shown in Figure 2, plastic housing 2 terminal 10 adopts that whole piece copper strips is die-cut to be formed, terminal 10 after shaping adopts pre-molding(preforming) method, cast acoustic cavity, and fixing golden finger, terminal 10 is made up of three parts: the first terminal face 11, second terminal surface 16, the 3rd terminal surface 12, and every part has difference in functionality.The first terminal face 11, electroplate and adopt the plating of nickel gold, form wire bonging pad, the pad on ASIC 6 passes through mode gold thread and the first terminal face 11 UNICOM of Heat Ultrasonic Bonding, input and output electrical signal; 3rd terminal surface 12 also adopts the plating of nickel gold, as the UNICOM's carrier with PCB solder joint 15; Second terminal surface 16 part only makes Nickel Plating Treatment, utilize the characteristic that scolding tin shrinks along golden face, in this, as isolation strip, solder when avoiding the effect of SMT pressure on the second terminal surface 16 can overflow on the first terminal face 11 when refluxing, and causes the solder joint that the brittle wire bonging of scolding tin is formed.
As shown in Figure 3, pcb board 1 is printed with the gold-plated copper face of a lap welding material 14() and PCB solder joint 15(6 golden finger), solder 14 is for being connected with copper shell 7, and PCB solder joint 15 is for being connected with the 3rd terminal surface 12 of plastic housing 2 terminal 10.
Plastic housing 2 of the present invention forms encapsulation cavity has enough spaces to form acoustic cavity 9, the back of the body cavity volume formed after plastic housing 2 mounts MEMS 3 and ASIC 6 in acoustic cavity 9 can meet good acoustic efficiency, plastic housing 2 has an acoustic aperture 4 simultaneously, extraneous acoustic signal can be transmitted to MEMS 3 from the external world through acoustic aperture 4 and carry on the back chamber, to drive the diaphragm oscillations in MEMS 3 front, produce electroacoustic letter.Plastic housing 2 is reserved with partition grooves 13 at terminal 10 top place, the terminal 10 of the plastic housing after shaping can cut off from here, the inwall of the copper shell 7 of terminal 10 behind top with assembling has larger gap, solder bridge during anti-backflow on the 3rd terminal surface 12, on the solder 14 of pcb board 1, causes short circuit.
Plastic-sealed body 2 of the present invention is placed in copper shell 7 chamber as shown in Figure 4, to reach the shielding action of electromagnetism interference.Copper shell 7 has acoustic aperture 4, just right with the acoustic aperture on plastic housing 2, so that sound wave transmission enters MEMS 3 carry on the back chamber, when plastic housing 2 loads copper shell 7, around acoustic aperture 4, apply 50um silica gel, to reach the effect of acoustical seal.Copper shell 7 adopts that the brass of 0.2mm is die-cut to be formed, and as Fig. 4, its copper face adopts method district corresponding to pcb board 1 solder 14 of SMT to be connected conducting, and one side plays acoustic seal effect, and solder 14 and the PCB backside pads 8 of pcb board outer ring are connected and communicate with GND in addition.
Solder joint on pcb board 1 of the present invention 15 signal communication, electroacoustics signal can be attached to PCB front solder joint 15 by the 3rd terminal surface 12 on plastic housing terminal 10, by pcb board 1 inner portion wiring, electroacoustic signal biography is received PCB back pad 8 again, PCB back pad 8 disposable mode of silk screen printing of taking when SMT brushes out, and realizes the UNICOM of electroacoustics signal and the communication of mainboard.
Present invention accomplishes acoustic signal from MEMS 3 carry on the back chamber enter acoustics cavity with improve microphone to-noise ratio improve requirement, and the requirement of sound from SMT face-to-face (what is called just enters sound) can be met, achieve whole back of the body and turn into sound (MEMS carries on the back chamber) requirement that whole microphone is just entering sound.
Claims (2)
1. plastic housing packaged microphone, comprise pcb board (1), plastic housing (2), MEMS (3), dedicated IC chip (6), copper shell (7), it is characterized in that: described plastic housing (2) inside attachment MEMS (3) and dedicated IC chip (6), be connected by gold thread (5), plastic housing (2) edge has terminal (10), and dedicated IC chip (6) is by gold thread (5) and terminal (10) UNICOM; Plastic housing (2) is press-fitted in copper shell (7) after composition assembly, and whole assembly is mounted on pcb board (1) and forms acoustic cavity (9); Acoustic aperture (4) on described plastic housing (2) and copper shell (7) is just right, and MEMS (3) is just to described acoustic aperture (4); The terminal (10) of plastic housing (2) is connected with the solder joint (15) on pcb board (1), and the end face of copper shell (7) is connected with the solder (14) on pcb board (1);
Described pcb board (1) back side has pad (8), and the solder (14) being positioned at pcb board (1) outer ring is connected with pad (8);
Described terminal (10) employing whole piece copper strips is die-cut to be formed, terminal (10) after shaping comprising: the first terminal face (11), the second terminal surface (16), the 3rd terminal surface (12), described the first terminal face (11) adopts the plating of nickel gold, with the pad gold thread UNICOM on dedicated IC chip (6); 3rd terminal surface (12) also adopts the plating of nickel gold, as the UNICOM's carrier with the solder joint (15) on pcb board (1); Second terminal surface (16) only makes Nickel Plating Treatment, as isolation strip;
Described plastic housing (2) is reserved with partition grooves (13) at terminal (10) top place, and the terminal (10) of the plastic housing after shaping cuts off from partition grooves (13), and the inwall of terminal (10) top and the copper shell (7) after assembling leaves gap.
2. plastic housing packaged microphone as claimed in claim 1, is characterized in that, is coated with layer of silica gel when described plastic housing (2) loads copper shell (7) around acoustic aperture (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210424495.1A CN102917303B (en) | 2012-10-30 | 2012-10-30 | Microphone packaged by plastic casing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210424495.1A CN102917303B (en) | 2012-10-30 | 2012-10-30 | Microphone packaged by plastic casing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102917303A CN102917303A (en) | 2013-02-06 |
| CN102917303B true CN102917303B (en) | 2015-03-18 |
Family
ID=47615503
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210424495.1A Active CN102917303B (en) | 2012-10-30 | 2012-10-30 | Microphone packaged by plastic casing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102917303B (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102014118214B4 (en) | 2014-12-09 | 2024-02-22 | Snaptrack, Inc. | Easily manufactured electrical component and method for producing an electrical component |
| CN105163256B (en) * | 2015-09-29 | 2019-08-20 | 歌尔股份有限公司 | MEMS device with flexible conducting structure |
| US10351419B2 (en) * | 2016-05-20 | 2019-07-16 | Invensense, Inc. | Integrated package containing MEMS acoustic sensor and pressure sensor |
| CN106604190A (en) * | 2017-01-13 | 2017-04-26 | 无锡红光微电子股份有限公司 | MEMS microphone encapsulation structure |
| US10544040B2 (en) * | 2017-05-05 | 2020-01-28 | Dunan Microstaq, Inc. | Method and structure for preventing solder flow into a MEMS pressure port during MEMS die attachment |
| CN108336044B (en) * | 2018-01-25 | 2019-10-08 | 山西宇翔信息技术有限公司 | A kind of bipolar integrated circuit chip based on channel medium isolation |
| CN109379650B (en) * | 2018-10-18 | 2020-04-14 | 深圳康佳电子科技有限公司 | Microphone shock-absorbing structure and microphone equipment |
| CN109704270B (en) * | 2018-12-29 | 2021-09-24 | 无锡韦尔半导体有限公司 | Hardware, MEMS sensor packaging structure and manufacturing method |
| US20200385263A1 (en) * | 2019-06-06 | 2020-12-10 | Solid State System Co., Ltd. | Package structure of micro-electro-mechanical-system (mems) microphone package and packaging method thereof |
| CN110769357A (en) * | 2019-10-30 | 2020-02-07 | 通用微(深圳)科技有限公司 | Microphone packaging structure adopting lead frame plastic shell |
| CN113891198A (en) * | 2020-07-03 | 2022-01-04 | 加高电子股份有限公司 | Microphone structure |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101132655A (en) * | 2006-08-24 | 2008-02-27 | 美律实业股份有限公司 | Micro-electromechanical microphone packaging structure and method thereof |
| CN201165468Y (en) * | 2008-03-03 | 2008-12-17 | 歌尔声学股份有限公司 | MEMS microphone encapsulation structure |
| CN101415138A (en) * | 2008-11-14 | 2009-04-22 | 瑞声声学科技(深圳)有限公司 | Encapsulation structure for MEMS transducer |
| CN201550275U (en) * | 2009-09-28 | 2010-08-11 | 瑞声声学科技(常州)有限公司 | Mems microphone |
-
2012
- 2012-10-30 CN CN201210424495.1A patent/CN102917303B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101132655A (en) * | 2006-08-24 | 2008-02-27 | 美律实业股份有限公司 | Micro-electromechanical microphone packaging structure and method thereof |
| CN201165468Y (en) * | 2008-03-03 | 2008-12-17 | 歌尔声学股份有限公司 | MEMS microphone encapsulation structure |
| CN101415138A (en) * | 2008-11-14 | 2009-04-22 | 瑞声声学科技(深圳)有限公司 | Encapsulation structure for MEMS transducer |
| CN201550275U (en) * | 2009-09-28 | 2010-08-11 | 瑞声声学科技(常州)有限公司 | Mems microphone |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102917303A (en) | 2013-02-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102917303B (en) | Microphone packaged by plastic casing | |
| US9485560B2 (en) | Embedded circuit in a MEMS device | |
| US20160100256A1 (en) | Acoustic Assembly and Method of Manufacturing The Same | |
| CN108366330A (en) | Micro-electromechanical packaging structure | |
| CN203788459U (en) | Mems microphone | |
| CN102223593A (en) | Packaged acoustic transducer device with shielding from electromagnetic interference | |
| US8155366B2 (en) | Transducer package with interior support frame | |
| JP2015532548A (en) | Embedded circuit in a MEMS device | |
| CN201138866Y (en) | Silicon microphone with improved structure | |
| WO2012122868A1 (en) | Micro-electro-mechanical system microphone packaging structure and forming method therefor | |
| CN110769357A (en) | Microphone packaging structure adopting lead frame plastic shell | |
| CN109495831B (en) | Packaging structure of MEMS microphone and manufacturing method thereof | |
| CN102595293B (en) | Micro-electromechanical system (MEMS) microphone and packaging method thereof | |
| CN210958794U (en) | Waterproof microphone | |
| WO2016011780A1 (en) | Mems microphone and top-port mems microphone | |
| CN211089966U (en) | MEMS microphone and electronic equipment | |
| CN203788460U (en) | Mems microphone | |
| CN103139694B (en) | Microphone package technology and package structure according to technology | |
| CN103646879B (en) | A kind of manufacture method of detachable, assemblnig SIP encapsulating structure | |
| CN201947418U (en) | Micro Electro Mechanical Systems (MEMS) microphone | |
| CN215835560U (en) | MEMS microphone | |
| CN210641072U (en) | Sensor packaging structure and electronic equipment | |
| CN201846474U (en) | Silicon microphone | |
| CN112004180B (en) | Manufacturing method of integrated packaging module, integrated packaging module and electronic equipment | |
| CN113582128A (en) | Silicon wheat stacked WB packaging process |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C53 | Correction of patent of invention or patent application | ||
| CB03 | Change of inventor or designer information |
Inventor after: Wang Yunlong Inventor after: Wu Guanghua Inventor after: Liu Jinfeng Inventor after: Zhu Cuifang Inventor before: Wang Yunlong Inventor before: Liu Jinfeng Inventor before: Zhu Cuifang |
|
| COR | Change of bibliographic data |
Free format text: CORRECT: INVENTOR; FROM: WANG YUNLONG LIU JINFENG ZHU CUIFANG TO: WANG YUNLONG WU GUANGHUA LIU JINFENG ZHU CUIFANG |
|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Microphone packaged by plastic casing Effective date of registration: 20160526 Granted publication date: 20150318 Pledgee: Wuxi Industrial Development Group Pledgor: Wuxi Xinao Micro Sensor Technology Co.,Ltd. Registration number: 2016320000007 |
|
| PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20231226 Address after: 214000 No. 15, Xinzhou Road, Xinwu District, Wuxi City, Jiangsu Province Patentee after: Jinri Technology (Wuxi) Co.,Ltd. Address before: No.1 YONGGU Road, Binhu District, Wuxi City, Jiangsu Province Patentee before: Wuxi Xinao Micro Sensor Technology Co.,Ltd. |