CN210958794U - Waterproof microphone - Google Patents
Waterproof microphone Download PDFInfo
- Publication number
- CN210958794U CN210958794U CN201922068610.6U CN201922068610U CN210958794U CN 210958794 U CN210958794 U CN 210958794U CN 201922068610 U CN201922068610 U CN 201922068610U CN 210958794 U CN210958794 U CN 210958794U
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- pcb
- waterproof
- microphone
- supporting
- waterproof microphone
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- 239000012528 membrane Substances 0.000 claims abstract description 44
- 239000000853 adhesive Substances 0.000 claims abstract description 23
- 230000001070 adhesive effect Effects 0.000 claims abstract description 23
- 229920000297 Rayon Polymers 0.000 claims abstract description 11
- 239000003292 glue Substances 0.000 claims abstract description 8
- 238000004806 packaging method and process Methods 0.000 claims abstract description 8
- 239000002184 metal Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000004078 waterproofing Methods 0.000 abstract description 11
- NMWSKOLWZZWHPL-UHFFFAOYSA-N 3-chlorobiphenyl Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1 NMWSKOLWZZWHPL-UHFFFAOYSA-N 0.000 description 20
- 101001082832 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) Pyruvate carboxylase 2 Proteins 0.000 description 19
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 238000004026 adhesive bonding Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 210000005069 ears Anatomy 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000005236 sound signal Effects 0.000 description 1
- 210000004243 sweat Anatomy 0.000 description 1
- 230000009182 swimming Effects 0.000 description 1
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- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The utility model provides a waterproof microphone, which comprises a packaging structure formed by a shell and a PCB (printed Circuit Board), wherein an MEMS (micro electro mechanical System) chip is arranged on the PCB inside the packaging structure, and the MEMS chip is fixed on the PCB; the edge of the waterproof membrane is provided with a supporting part, the supporting sheet is provided with a protruding part relative to the supporting part, the protruding part and the PCB are provided with an annular overlapping area in the vertical direction, and the supporting sheet is bonded with the PCB through viscose glue. Utilize the utility model discloses, can solve when the microphone falls, because the adhesive force of waterproofing membrane itself is poor, very easy fracture leads to the problem of product inefficacy.
Description
Technical Field
The utility model relates to an acoustoelectric technology field, more specifically relates to a waterproof microphone, especially relates to a novel waterproof microphone.
Background
With the progress of society and the development of technology, in recent years, the volume of electronic products such as mobile phones and notebook computers is continuously reduced, and people have higher and higher performance requirements on the portable electronic products, so that the volume of electronic parts matched with the portable electronic products is continuously reduced, and the performance and consistency are continuously improved. MEMS microphones integrated by MEMS (Micro-Electro-Mechanical-System, MEMS for short) technology are beginning to be applied to electronic products such as mobile phones and notebook computers in batches, and the package volume is smaller than that of the conventional electret microphone, so that the MEMS microphones are favored by most microphone manufacturers, and the soundly dribbling motion is accompanied by the dripping of sweat, which easily flows into ears, and the swimming scenes have higher requirements for water resistance, so that the earphones need to have stronger waterproof design and are firm and not easy to damage.
Fig. 1 illustrates a conventional waterproof microphone, which includes a package structure composed of a metal housing 1 ' and a PCB 2 ', an ASIC chip 4 ' and a MEMS chip 3 ' are disposed on the PCB 2 ' inside the package, a waterproof film 7 ' is further disposed on the PCB 2 ', the MEMS chip 3 ' is fixed to a support sheet 6 ' by an adhesive 10 ', the support sheet 6 ' is fixedly adhered to the waterproof film 7 ' up and down by an adhesive 9 ', the MEMS chip 3 ' is electrically connected to the ASIC chip 4 ' by a wire 8 ', and the ASIC chip 4 ' is electrically connected to the PCB 2 ' by a wire 5 '.
In the waterproof microphone shown in fig. 1, the PCB 2 'is provided with the waterproof membrane 7', the MEMS chip 3 'is fixed to the support sheet 6' by the adhesive 10 ', and the support sheet 6' is fixed to the waterproof membrane 7 'by the adhesive 9', so that when the product falls, the support sheet and the waterproof membrane in the waterproof microphone, and the waterproof membrane and the PCB are very easily cracked due to poor adhesion of the waterproof membrane itself, resulting in failure of the waterproof microphone.
In order to solve the above problems, a new waterproof microphone design is needed.
SUMMERY OF THE UTILITY MODEL
In view of the above problem, the present invention is to provide a novel waterproof microphone to solve the problem that the MEMS chip 3 'is fixed to the supporting sheet 6' by the adhesive 10 'due to the poor adhesion of the waterproof film itself, and the supporting sheet 6' is easily cracked when falling due to the structure fixed to the waterproof film 7 'by the adhesive 9', resulting in the failure of the product.
The utility model provides a waterproof microphone, which comprises a packaging structure formed by a shell and a PCB, wherein, the PCB inside the packaging structure is provided with an MEMS chip, and is characterized in that,
a supporting sheet and a waterproof membrane are sequentially arranged between the MEMS chip and the PCB;
the edge of the waterproof membrane is provided with a supporting part, the supporting sheet is provided with a protruding part relative to the supporting part, the protruding part and the PCB are provided with an annular overlapping area in the vertical direction, and the supporting sheet is adhered to the PCB through adhesive.
Preferably, the width of the annular overlapping area is 0.2-1 mm.
Preferably, the adhesive is a waterproof adhesive and/or a HAF adhesive.
Preferably, a sound hole communicated with the outside is provided on the PCB, the sound hole being communicated with the MEMS chip, wherein,
and the supporting sheet is also provided with a through hole corresponding to the sound hole.
Preferably, the periphery of the support component is fixed with the PCB board and the support sheet by gluing.
Preferably, the bottom of the support component is fixed to the PCB board by gluing.
Preferably, the support sheet is a support sheet.
Preferably, an ASIC chip is further provided on the PCB board, wherein,
the ASIC chip is fixed on the PCB.
Preferably, the MEMS chip and the ASIC chip are electrically connected by a wire, and the ASIC chip and the PCB board are electrically connected by a wire.
Preferably, the housing is fixed to the PCB by solder paste.
According to the technical scheme above, the utility model provides a waterproof microphone, through increaseing the area that supports the thin slice, directly will support thin slice and PCB board bonding with the viscose together, when preventing that waterproof earphone from falling, because the adhesive force of waterproofing membrane itself is poor, supports thin slice, PCB board and waterproofing membrane very easy fracture, leads to the product to become invalid, greatly improves the steadiness that supports thin slice, PCB board and waterproofing membrane.
Drawings
Other objects and results of the invention will be more apparent and readily appreciated by reference to the following specification taken in conjunction with the accompanying drawings, and as the invention is more fully understood. In the drawings:
fig. 1 is a schematic cross-sectional view of a conventional waterproof microphone;
fig. 2 is a schematic sectional view of a waterproof microphone according to an embodiment of the present invention;
fig. 3 is a schematic sectional view of a waterproof microphone according to another embodiment of the present invention.
Wherein the reference numerals include: 1. a housing, 2, a PCB, 3, a MEMS chip, 4, an ASIC chip, 5, a wire, 6, a support sheet, 7, a waterproof membrane, 8, a wire, 9, a glue, 10, a glue, 11, a sound hole, 1 ', a housing, 2 ', a PCB, 3 ', a MEMS chip, 4 ', a SAIC chip, 5 ', a wire, 6 ', a support sheet, 7 ', a waterproof membrane, 8 ', a wire, 9 ', a glue, 10 ', a glue, 11 ' a sound hole.
The same reference numbers in all figures indicate similar or corresponding features or functions.
Detailed Description
Among the present waterproof microphone, be provided with the MEMS chip on the PCB board, supporting sheet and water proof membrane, the MEMS chip passes through viscose and supporting sheet fixed bonding from top to bottom, the supporting sheet passes through viscose and water proof membrane fixed bonding from top to bottom, this kind through the simple structure bonding area who bonds each other from top to bottom of viscose is little, the fastness is poor, because the bonding force of water proof membrane itself is also poor, when the product falls, supporting sheet and water proof membrane in the waterproof microphone, water proof membrane and PCB plate structure fracture very easily, lead to waterproof microphone inefficacy, influence the durability of waterproof microphone.
To the above problem, the utility model provides a waterproof microphone design, through the area that increases the support thin slice, make the support thin slice have the bulge for the support component at waterproof membrane edge, and bulge and PCB board have the cyclic annular coincidence region of vertical direction, direct extension and the PCB board that will support the thin slice with the viscose bond together, also can be with the periphery and the support thin slice of waterproof membrane support component, the PCB board is direct to be bonded, in addition also can be through the viscose with waterproof membrane support component bottom bonding to the PCB board on, make the support thin slice, bonding part between PCB board and the waterproof membrane is more firm, improve waterproof microphone's stability and durability.
Specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
In order to illustrate the structure of the waterproof microphone provided by the present invention, fig. 2 and 3 are cross-sectional views of the waterproof microphone, which are respectively exemplarily marked according to different bonding modes. Specifically, fig. 2 shows an adhesion structure of a waterproof microphone according to an embodiment of the present invention; fig. 3 shows a bonding structure of a waterproof microphone according to another embodiment of the present invention.
As shown in fig. 2, the utility model provides a waterproof microphone, including the packaging structure who is formed by shell 1 and PCB board 2, wherein, be provided with MEMS chip 3 on the inside PCB board 2 of packaging structure.
In the embodiment shown in fig. 2, the housing 1 and the PCB 2 form an encapsulation structure, the housing 1 may be fixed to the PCB 2 by solder paste, the material of the housing 1 is not particularly limited, and a metal housing may be used.
In the embodiment shown in fig. 2, the PCB 2 is provided with a sound hole 11 communicating with the outside, the sound hole 11 communicates with the MEMS chip, the PCB 2 inside the package structure is provided with the MEMS chip 3, a support sheet 6 and a waterproof membrane 7 are sequentially disposed between the MEMS chip 3 and the PCB 2, and the waterproof membrane 7 penetrates through the bottom of the entire MEMS chip 3 and is inside the sound hole 11; at the edge of the waterproofing membrane 7 there is provided a support member (not shown) and at the edge of the waterproofing membrane 7 there is provided a support member (not shown) between the waterproofing membrane 7 and the PCB 2, and the support sheet 6 has a protruding portion in relation to the support member and the protruding portion has a vertically directed annular overlapping area with the PCB 2.
In the embodiment shown in fig. 2, the supporting sheet 6 is adhered to the PCB 2 and the waterproof membrane 7 by the adhesive 9, specifically, the adhesive 9 is provided between the supporting sheet 6 and the waterproof membrane 7, the adhesive 9 is provided in the overlapping area between the supporting sheet 6 and the PCB 2 in the vertical direction, and the adhesive 9 is also provided between the periphery of the supporting part at the edge of the waterproof membrane 7 and the PCB.
In the embodiment shown in fig. 2, the material of the support sheet 6 is not particularly limited, and a metal sheet may be used.
In addition, in the embodiment shown in fig. 2, an ASIC chip 4 is further disposed on the PCB 2 inside the package structure, wherein the ASIC chip 4 is fixed on the PCB 2, the ASIC chip 4 is electrically connected to the MEMS chip 3 through a conducting wire 8, and the ASIC chip 4 is electrically connected to the PCB 2 through a conducting wire 5.
In the embodiment shown in fig. 2, by increasing the area of the supporting sheet, not only the supporting sheet is bonded to the waterproof film, but also the supporting sheet is directly bonded to the PCB, and in this embodiment, the periphery of the supporting component at the edge of the waterproof film is also directly bonded to the PCB by the adhesive, so that the supporting sheet is more sufficiently bonded and fixed to the waterproof film and the PCB, thereby reducing the risk of product failure due to cracking of the product when the product falls, and greatly improving the stability of the supporting sheet, the PCB and the waterproof film.
The embodiment shown in fig. 3 is different from the embodiment shown in fig. 2 in that the supporting sheet 6 is adhered to the PCB 2 and the waterproof membrane 7 by an adhesive 9, specifically, the adhesive 9 is provided between the supporting sheet 6 and the waterproof membrane 7, the adhesive 9 is provided in the vertical annular overlapping area between the supporting sheet and the PCB, and the adhesive 9 is also provided between the bottom of the supporting part at the edge of the waterproof membrane 7 and the PCB.
In the embodiment shown in fig. 3 of the utility model, through increasing the area of supporting the thin slice, not only make supporting thin slice and waterproofing membrane bond mutually, also make supporting thin slice and PCB board direct bonding, and the support part bottom at waterproofing membrane edge also bonds from top to bottom through viscose and PCB board in this embodiment, consequently more fully will support thin slice and waterproofing membrane, the PCB board bonds fixedly, thereby reduce the product fracture when falling, lead to the risk of product inefficacy, greatly improve supporting thin slice, the steadiness of PCB board and waterproofing membrane.
In the embodiment of the present invention shown in fig. 2 and 3, sound is applied to the MEMS chip 3 through the sound hole 11; the MEMS chip 3 converts the received sound signal into an analog signal and transmits the analog signal to the ASIC chip 4 through a lead 8; the ASIC chip 4 converts the received analog signal into a digital signal, and performs signal amplification, calibration and other processing, and transmits the processed digital signal to the PCB 2 through the wire 5, and because the PCB 2 is provided with the outer bonding pad which is electrically connected with an external device, the signal is transmitted out through the outer bonding pad.
According to the above embodiment, the utility model provides a waterproof microphone, through the utility model discloses an in waterproof microphone's structure, through increasing the area of supporting the thin slice, not only make supporting the thin slice and bond with the water proof membrane mutually, also make supporting the thin slice and directly bond with the PCB board, and also directly bond with the PCB board through the viscose in the support component periphery or the bottom at water proof membrane edge, when the solution falls when the product, supporting thin slice and water proof membrane in the waterproof microphone, water proof membrane and PCB board structure fracture very easily, lead to waterproof microphone inefficacy, influence the problem of waterproof microphone's durability, effectively alleviate the transmission of stress, thereby the better bonding structure of guaranteeing waterproof microphone, improve waterproof microphone's durability.
The waterproof microphone according to the present invention is described above by way of example with reference to the accompanying drawings. However, it should be understood by those skilled in the art that various modifications can be made to the waterproof microphone provided by the present invention without departing from the scope of the present invention. Therefore, the scope of the present invention should be determined by the content of the appended claims.
Claims (10)
1. A waterproof microphone comprises a packaging structure formed by a shell and a PCB, wherein an MEMS chip is arranged on the PCB inside the packaging structure,
a supporting sheet and a waterproof membrane are sequentially arranged between the MEMS chip and the PCB;
the edge of the waterproof membrane is provided with a supporting part, the supporting sheet is provided with a protruding part relative to the supporting part, the protruding part and the PCB are provided with an annular overlapping area in the vertical direction, and the supporting sheet is adhered to the PCB through adhesive.
2. The waterproof microphone of claim 1,
the width of the annular overlapping area is 0.2-1 mm.
3. The waterproof microphone of claim 1,
the viscose is waterproof glue and/or HAF glue.
4. The waterproof microphone of claim 1,
the PCB board is provided with a sound hole communicated with the outside, the sound hole is communicated with the MEMS chip, wherein,
and the supporting sheet is also provided with a through hole corresponding to the sound hole.
5. The waterproof microphone of claim 1,
the periphery of the supporting part is fixedly bonded with the PCB and the supporting sheet through viscose glue.
6. The waterproof microphone of claim 1,
the bottom of the supporting part is fixedly bonded with the PCB through adhesive.
7. The waterproof microphone of claim 1,
the support sheet is a metal sheet.
8. The waterproof microphone of claim 1,
an ASIC chip is also arranged on the PCB board, wherein,
the ASIC chip is fixed on the PCB.
9. The waterproof microphone of claim 8,
the MEMS chip is electrically connected with the ASIC chip through a lead, and the ASIC chip is electrically connected with the PCB through a lead.
10. The waterproof microphone of claim 1,
the shell is fixed with the PCB through solder paste.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922068610.6U CN210958794U (en) | 2019-11-26 | 2019-11-26 | Waterproof microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922068610.6U CN210958794U (en) | 2019-11-26 | 2019-11-26 | Waterproof microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210958794U true CN210958794U (en) | 2020-07-07 |
Family
ID=71374827
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922068610.6U Active CN210958794U (en) | 2019-11-26 | 2019-11-26 | Waterproof microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210958794U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112492488A (en) * | 2020-12-07 | 2021-03-12 | 潍坊歌尔微电子有限公司 | Waterproof MEMS microphone |
| CN112492489A (en) * | 2020-12-07 | 2021-03-12 | 潍坊歌尔微电子有限公司 | Waterproof MEMS microphone |
-
2019
- 2019-11-26 CN CN201922068610.6U patent/CN210958794U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112492488A (en) * | 2020-12-07 | 2021-03-12 | 潍坊歌尔微电子有限公司 | Waterproof MEMS microphone |
| CN112492489A (en) * | 2020-12-07 | 2021-03-12 | 潍坊歌尔微电子有限公司 | Waterproof MEMS microphone |
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