CN210986419U - MEMS microphone and electronic device - Google Patents
MEMS microphone and electronic device Download PDFInfo
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- CN210986419U CN210986419U CN201922429487.6U CN201922429487U CN210986419U CN 210986419 U CN210986419 U CN 210986419U CN 201922429487 U CN201922429487 U CN 201922429487U CN 210986419 U CN210986419 U CN 210986419U
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- 239000000758 substrate Substances 0.000 claims abstract description 33
- 230000006698 induction Effects 0.000 claims abstract description 11
- 239000003990 capacitor Substances 0.000 claims description 5
- 238000002360 preparation method Methods 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 abstract description 8
- 238000004806 packaging method and process Methods 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
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Abstract
The utility model provides a MEMS microphone and an electronic device, wherein, the MEMS microphone comprises a substrate with a back cavity and a vibrating diaphragm arranged on the substrate in an insulating way; the vibrating diaphragm comprises a supporting part fixed on the substrate and an induction part positioned in the supporting part and suspended in the back cavity; and a stress releasing part is arranged at the joint of the supporting part and the sensing part. Utilize above-mentioned utility model, can let out some encapsulation stress through stress, reduce the influence that the encapsulation caused to the vibrating diaphragm.
Description
Technical Field
The utility model relates to an acoustics technical field, more specifically relates to a MEMS microphone and be provided with electronic device of this MEMS microphone.
Background
With the progress of society and the development of technology, in recent years, the volume of electronic products such as mobile phones and notebook computers is continuously reduced, and people have higher and higher performance requirements on the portable electronic products, so that the volume of electronic parts matched with the portable electronic products is continuously reduced, and the performance and consistency are continuously improved. MEMS microphones integrated by MEMS (Micro-Electro-Mechanical-System, abbreviated as MEMS) technology are applied to electronic products such as mobile phones and notebook computers in batches, and the package volume of the MEMS microphones is smaller than that of the conventional MEMS microphones, so that the MEMS microphones are favored by most microphone manufacturers.
However, the existing MEMS microphone is sensitive to the packaging stress, and the diaphragm of the MEMS microphone is usually directly and fixedly connected to the substrate, so the packaging stress of the housing may cause the diaphragm to deform, which results in unstable microphone sensitivity; although the improvement on the packaging can play a certain role, the requirement on the packaging is higher, and the problem of deformation of the diaphragm cannot be fundamentally solved.
SUMMERY OF THE UTILITY MODEL
In view of the above problems, an object of the present invention is to provide a MEMS microphone and an electronic device, so as to solve the problem that the package stress of the present microphone easily causes the deformation of the diaphragm, which affects the performance of the product.
The utility model provides a MEMS microphone, which comprises a substrate with a back cavity and a vibrating diaphragm arranged on the substrate in an insulating way; the vibrating diaphragm comprises a supporting part fixed on the substrate and an induction part positioned in the supporting part and suspended in the back cavity; and a stress releasing part is arranged at the joint of the supporting part and the sensing part.
Further, it is preferable that the stress relieving portion is a rectangular groove/projection, a V-shaped groove/projection, or an arc-shaped groove/projection.
Further, it is preferable that the stress relieving portion is fixed on the substrate; or the stress releasing part is suspended in the back cavity; or the stress releasing part is partially fixed on the substrate and partially suspended in the back cavity.
Preferably, the support portion, the sensing portion, and the stress releasing portion are integrally formed.
In addition, the preferred structure is that the device further comprises a back pole; the back electrode is arranged on the upper side and/or the lower side of the vibrating diaphragm; the diaphragm and the back electrode form a parallel plate capacitor structure.
In addition, the preferable structure is that at least two diaphragms are arranged; a back pole is arranged between the two adjacent vibrating diaphragms.
In addition, it is preferable that a support layer is provided between the diaphragm and the back electrode, and an insulating layer is provided between the diaphragm and the substrate.
In addition, the preferable structure is that a pad which is conducted with the external circuit is arranged on the back pole; the bonding pad is conducted with the vibrating diaphragm through a connecting wire.
Preferably, the sensing portion is provided with a through hole and a corrugated pattern.
Furthermore, the present invention also provides an electronic device, comprising the MEMS microphone according to any one of the above embodiments.
According to the above technical scheme, the utility model discloses a MEMS microphone and electronic device sets up the stress portion of leaking at the supporting part of vibrating diaphragm and the combination department of response portion, leaks the encapsulation stress that the portion absorbed MEMS microphone equipment in-process through the stress, prevents that vibrating diaphragm induction zone from taking place deformation to ensure that product acoustic performance is stable.
Drawings
Other objects and results of the invention will be more apparent and readily appreciated by reference to the following description taken in conjunction with the accompanying drawings, and as the invention is more fully understood. In the drawings:
fig. 1 is a schematic structural diagram of a MEMS microphone according to a first embodiment of the present invention;
fig. 2 is a schematic structural diagram of a MEMS microphone according to a second embodiment of the present invention.
Wherein the reference numerals include: the device comprises a bonding pad 1, a back electrode 2, vibration lines 3, a sensing part 4, an anti-absorption film bump 5, a through hole 6, a supporting layer 7, a supporting part 8, an insulating layer 9, a stress releasing part 10 and a substrate 11.
The same reference numbers in all figures indicate similar or corresponding features or functions.
Detailed Description
For the detailed description of the structure of the MEMS microphone of the present invention, the following detailed description will be made on specific embodiments of the present invention with reference to the accompanying drawings.
Fig. 1 shows a schematic structure of a MEMS microphone according to a first embodiment of the present invention.
As shown in fig. 1, a MEMS microphone according to a first embodiment of the present invention includes a substrate 11 having a back cavity, and a diaphragm disposed on the substrate 11 in an insulating manner; the diaphragm comprises a supporting portion 8 fixed on the substrate 11 and a sensing portion 4 located in the supporting portion 8 and suspended in the back cavity, a stress releasing portion 10 is arranged at the joint of the supporting portion 8 and the sensing portion 4, and the stress releasing portion 10 is used for gathering packaging stress and preventing the packaging stress from bringing adverse effects to the sensing portion 4.
Wherein, this stress portion of releasing 10 can set up to rectangle recess/protruding structure, and it can be fixed on substrate 11 or hang and establish in the back of the body intracavity or local fixing on substrate 11, and local hang establishes in the back of the body intracavity, and in this embodiment one, stress portion of releasing 10 is rectangle recess structure, and rectangle recess structure is fixed on substrate 11, and in MEMS microphone encapsulation process, the encapsulation stress that the vibrating diaphragm received all concentrates on this rectangle recess in, can prevent that it from transmitting to induction part 4 to ensure the stable performance of vibrating diaphragm.
For the uniformity of guaranteeing the vibrating diaphragm, reduce the production of stress the utility model discloses an among the embodiment, supporting part 8, induction part 4 and stress portion of releasing 10 are the integrated into one piece structure, and the three adopts the shape with the material, forms through the preparation of technologies such as oxidation, sculpture.
The utility model discloses an in another embodiment, the vibrating diaphragm erects on substrate 11 through insulating layer 9, and one side of keeping away from substrate 11 at the vibrating diaphragm is provided with supporting layer 7, keeps away from vibrating diaphragm one side at supporting layer 7 and is provided with back of the body utmost point 2, and the vibrating diaphragm forms parallel plate capacitor structure with back of the body utmost point 2.
Fig. 2 shows a schematic structure of a MEMS microphone according to a second embodiment of the present invention.
As shown in fig. 2, a MEMS microphone according to a second embodiment of the present invention includes a substrate 11 having a back cavity, and a diaphragm disposed on the substrate 11 in an insulating manner; the diaphragm comprises a supporting portion 8 fixed on the substrate 11 and a sensing portion 4 located in the supporting portion 8 and suspended in the back cavity, a stress releasing portion 10 is arranged at the joint of the supporting portion 8 and the sensing portion 4, and the stress releasing portion 10 is used for gathering packaging stress and preventing the packaging stress from bringing adverse effects to the sensing portion 4.
Wherein, this stress portion of releasing 10 can set up to V-arrangement recess/protruding structure, and it can be fixed on substrate 11 or hang and establish in the back of the body intracavity or fix on substrate 11 locally, and local hangs and establishes in the back of the body intracavity, and in this embodiment one, stress portion of releasing 10 is V-arrangement recess structure, and V-arrangement recess structure is fixed on substrate 11, and in MEMS microphone encapsulation process, the encapsulation stress that the vibrating diaphragm received is all concentrated in this V-arrangement recess, can prevent that it from transmitting to induction part 4 to ensure the stable performance of vibrating diaphragm.
For the uniformity of guaranteeing the vibrating diaphragm, reduce the production of stress the utility model discloses an among the embodiment, supporting part 8, induction part 4 and stress portion of releasing 10 are the integrated into one piece structure, and the three adopts the shape with the material, forms through the preparation of technologies such as oxidation, sculpture.
The utility model discloses an in another embodiment, the vibrating diaphragm erects on substrate 11 through insulating layer 9, and one side of keeping away from substrate 11 at the vibrating diaphragm is provided with supporting layer 7, keeps away from vibrating diaphragm one side at supporting layer 7 and is provided with back of the body utmost point 2, and the vibrating diaphragm forms parallel plate capacitor structure with back of the body utmost point 2.
It should be noted that the structure of the diaphragm and the back electrode 2 of the MEMS microphone is not limited to the above two embodiments, and in another embodiment of the present invention, the back electrode may be disposed on the upper side and/or the lower side of the diaphragm; the vibrating diaphragm and the back electrode form a parallel plate capacitor structure; or the vibrating diaphragm comprises an upper vibrating diaphragm and a lower vibrating diaphragm; wherein, an intermediate back pole is arranged between the upper vibrating diaphragm and the lower vibrating diaphragm. Therefore, the utility model discloses a vibrating diaphragm structure can be applied to in the MEMS microphone of two back poles list vibrating diaphragms, two vibrating diaphragms list back poles, single vibrating diaphragm list back pole, the many back poles of vibrating diaphragms isotructure.
In addition, a bonding pad 1 which is communicated with an external circuit is also arranged on the back electrode, and the bonding pad 1 is communicated with the vibrating diaphragm through a connecting wire which passes through the supporting layer 7; in addition, the sensing part 4 of the vibrating diaphragm can be further provided with through holes 6 and concave-convex vibration lines 3, and the back electrode is provided with an anti-absorption film bulge 5 on one side close to the vibrating diaphragm so as to prevent the vibrating diaphragm from absorbing the film, and the specific structure of the vibrating diaphragm can be set according to the production requirement and is not limited to the specific structure shown in the attached drawing.
Corresponding with above-mentioned MEMS microphone, the utility model discloses still provide an electronic device, include as above the MEMS microphone, this electronic device can be multiple electronic product such as microphone, single function sensor or multi-functional sensor.
According to the above embodiment, the utility model provides a MEMS microphone and electronic device sets up the stress at the supporting part of vibrating diaphragm and the combination department of response portion and lets out the portion, and encapsulation stress is collected in this stress and is let out a region to effectively prevent that vibrating diaphragm induction zone from taking place deformation, product acoustic performance is stable, the good reliability.
The MEMS microphone and the electronic device according to the present invention have been described above by way of example with reference to the accompanying drawings. However, it will be appreciated by those skilled in the art that various modifications may be made to the MEMS microphone and electronic device provided in the present invention without departing from the scope of the invention. Therefore, the scope of the present invention should be determined by the content of the appended claims.
Claims (10)
1. A MEMS microphone comprises a substrate with a back cavity and a diaphragm arranged on the substrate in an insulating mode; it is characterized in that the preparation method is characterized in that,
the vibrating diaphragm comprises a supporting part fixed on the substrate and an induction part positioned in the supporting part and suspended in the back cavity; and the number of the first and second electrodes,
and a stress releasing part is arranged at the joint of the supporting part and the sensing part.
2. The MEMS microphone of claim 1,
the stress releasing part is a rectangular groove/bulge, a V-shaped groove/bulge or an arc-shaped groove/bulge.
3. The MEMS microphone of claim 1,
the stress releasing part is fixed on the substrate; or the stress releasing part is suspended in the back cavity; or the stress releasing part is partially fixed on the substrate and partially suspended in the back cavity.
4. The MEMS microphone of claim 1,
the supporting part, the induction part and the stress releasing part are of an integrally formed structure.
5. The MEMS microphone of claim 1, further comprising a back pole;
the back electrode is arranged on the upper side and/or the lower side of the diaphragm;
the diaphragm and the back electrode form a parallel plate capacitor structure.
6. The MEMS microphone of claim 1,
at least two vibrating diaphragms are arranged;
a back pole is arranged between the two adjacent vibrating diaphragms.
7. The MEMS microphone of claim 5 or 6,
a support layer is arranged between the diaphragm and the back electrode, and an insulating layer is arranged between the diaphragm and the substrate.
8. The MEMS microphone of claim 7,
a bonding pad which is conducted with an external circuit is arranged on the back electrode;
the bonding pad is conducted with the vibrating diaphragm through a connecting wire.
9. The MEMS microphone of claim 1,
the induction part is provided with a through hole and a concavo-convex vibration line.
10. An electronic device, comprising a MEMS microphone according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922429487.6U CN210986419U (en) | 2019-12-27 | 2019-12-27 | MEMS microphone and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922429487.6U CN210986419U (en) | 2019-12-27 | 2019-12-27 | MEMS microphone and electronic device |
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| Publication Number | Publication Date |
|---|---|
| CN210986419U true CN210986419U (en) | 2020-07-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201922429487.6U Active CN210986419U (en) | 2019-12-27 | 2019-12-27 | MEMS microphone and electronic device |
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| CN (1) | CN210986419U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112492486A (en) * | 2020-12-03 | 2021-03-12 | 青岛歌尔智能传感器有限公司 | Microphone chip, MEMS microphone and electronic device |
| CN112492487A (en) * | 2020-12-03 | 2021-03-12 | 青岛歌尔智能传感器有限公司 | Microphone chip, MEMS microphone and electronic device |
| CN112995869A (en) * | 2021-02-23 | 2021-06-18 | 歌尔微电子股份有限公司 | MEMS chip, manufacturing method thereof, MEMS microphone module and electronic equipment |
| WO2022110420A1 (en) * | 2020-11-30 | 2022-06-02 | 瑞声声学科技(深圳)有限公司 | Piezoelectric mems microphone, and array thereof and preparation method therefor |
| WO2022135004A1 (en) * | 2020-12-25 | 2022-06-30 | 歌尔微电子股份有限公司 | Capacitive sensor chip, sensor, and electronic device |
-
2019
- 2019-12-27 CN CN201922429487.6U patent/CN210986419U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022110420A1 (en) * | 2020-11-30 | 2022-06-02 | 瑞声声学科技(深圳)有限公司 | Piezoelectric mems microphone, and array thereof and preparation method therefor |
| CN112492486A (en) * | 2020-12-03 | 2021-03-12 | 青岛歌尔智能传感器有限公司 | Microphone chip, MEMS microphone and electronic device |
| CN112492487A (en) * | 2020-12-03 | 2021-03-12 | 青岛歌尔智能传感器有限公司 | Microphone chip, MEMS microphone and electronic device |
| CN112492486B (en) * | 2020-12-03 | 2022-03-25 | 青岛歌尔智能传感器有限公司 | Microphone chip, MEMS microphone and electronic device |
| WO2022135004A1 (en) * | 2020-12-25 | 2022-06-30 | 歌尔微电子股份有限公司 | Capacitive sensor chip, sensor, and electronic device |
| CN112995869A (en) * | 2021-02-23 | 2021-06-18 | 歌尔微电子股份有限公司 | MEMS chip, manufacturing method thereof, MEMS microphone module and electronic equipment |
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