CN212324362U

CN212324362U - Vibration structure and microphone

Info

Publication number: CN212324362U
Application number: CN202020927896.9U
Authority: CN
Inventors: 张金宇; 王凯
Original assignee: AAC Acoustic Technologies Shenzhen Co Ltd
Current assignee: AAC Technologies Holdings Shenzhen Co Ltd
Priority date: 2020-05-27
Filing date: 2020-05-27
Publication date: 2021-01-08
Anticipated expiration: 2030-05-27

Abstract

The utility model provides a vibration structure, its includes bearing structure and is fixed in bearing structure's vibration subassembly, a serial communication port, the vibration subassembly is including being fixed in bearing structure's vibrating diaphragm and laminate in the quality piece of vibrating diaphragm, the vibrating diaphragm include with bearing structure fixed connection's fixed part, with the fixed portion of bearing and connection of quality piece the fixed part with the vibration region of bearing, the quality piece include with vibrating diaphragm fixed connection's first surface, with the relative second surface that sets up of first surface and certainly first surface edge is to being close to the depressed part that the second surface is sunken to form, vibration region along vibration direction at least part with the depressed part is just to setting up. The utility model discloses a set up one on the quality piece with the vibration region just right depressed part to keep great vibration region in the increase quality piece quality, thereby avoid the risk of vibrating diaphragm overstretching.

Description

Vibration structure and microphone

[ technical field ] A method for producing a semiconductor device

The utility model relates to a microphone technical field especially relates to a vibrating structure and microphone.

[ background of the invention ]

In recent years, mobile communication technology has been rapidly developed, and consumers increasingly use mobile communication devices, such as cellular phones, web-enabled cellular phones, personal digital assistants or other devices for communication in a private communication network, wherein a microphone is one of the important components, in particular a MEMS microphone. The existing MEMS microphone adopts a flat plate type quality piece, and the quality piece is attached to a vibrating diaphragm. However, the conventional flat-plate type mass piece has a small volume, which results in low sensitivity, and when the mass piece with a large volume is adopted to meet the sensitivity requirement, the contact area between the mass piece and the vibrating diaphragm is large, which results in a small area of the vibrating diaphragm, and the material stretching ratio under the same amplitude is too large, which easily causes plastic stretching after long-term operation, which results in the sounding change of the material property and the performance change.

Therefore, it is necessary to provide a vibration structure that increases the mass-securing sensitivity of the mass piece while avoiding excessive stretching of the diaphragm.

[ summary of the invention ]

An object of the utility model is to provide an avoid vibrating diaphragm overstretch vibrating structure when increase quality piece quality assurance sensitivity.

The technical scheme of the utility model as follows: the utility model provides a vibration structure, its includes bearing structure and is fixed in bearing structure's vibration subassembly, the vibration subassembly is including being fixed in bearing structure's vibrating diaphragm and laminate in the quality piece of vibrating diaphragm, the vibrating diaphragm include with bearing structure fixed connection's fixed part, with the fixed portion of bearing and connection of quality piece the fixed part with the vibration region of bearing, the quality piece include with vibrating diaphragm fixed connection's first surface, with the relative second surface that sets up of first surface reaches certainly first surface edge is to being close to the depressed part that the second surface is sunken to form, vibration region along vibration direction at least part with the depressed part is just to setting up.

Preferably, the mass plate includes a first step portion fixedly connected to the bearing portion and a second step portion spaced from the diaphragm, and the second step portion extends from one end of the first step portion, which is far away from the diaphragm, in a direction perpendicular to the vibration direction and far away from the first step portion.

Preferably, the second step portion includes a third surface opposite to the second surface and facing the vibration region, the first step portion includes a fourth surface connecting the first surface and the third surface, and the third surface and the fourth surface enclose the recess.

More preferably, a projection of the vibration region in the vibration direction overlaps with a projection of the second step portion in the vibration direction.

More preferably, a projection of the vibration region in the vibration direction completely overlaps a projection of the second step portion in the vibration direction.

Preferably, the second step portion extends to above the support structure.

A microphone comprises the vibration structure, and further comprises an MEMS chip with a back cavity, a base body with a first accommodating space and an upper cover fixed on one side of the first accommodating space, wherein the base body is far away from the upper cover, the upper cover is provided with a second accommodating space, the MEMS chip is accommodated in the first accommodating space and fixed on the base body, the vibration structure is accommodated in the second accommodating space, the supporting structure is fixed on the base body, the vibration diaphragm is fixed on one side of the supporting structure far away from the base body, a closed cavity is formed between the vibration diaphragm and the base body, and the base body is provided with a sound hole which is communicated with the closed cavity and the back cavity in a penetrating mode.

Preferably, the base includes an upper substrate provided with the sound hole, a lower substrate disposed opposite to the upper substrate, and a support member fixed between the upper substrate and the lower substrate, the support member, the upper substrate and the lower substrate enclose the first receiving space, and the support structure is fixed to one side of the upper substrate away from the lower substrate.

Preferably, the supporting structure is annular, the upper cover is fixed to one side of the supporting structure far away from the upper substrate, and the diaphragm clamp is fixed between the upper cover and the supporting structure.

Preferably, the upper substrate is a circuit board, the MEMS chip is fixed to the upper substrate, and the sound hole is opposite to the back cavity.

Preferably, the lower substrate is a circuit board, and the lower substrate is communicated with an external circuit.

Preferably, the lower substrate is a circuit board, and the MEMS chip is fixed to the lower substrate.

Preferably, the microphone further includes an ASIC chip fixed to the upper substrate.

The beneficial effects of the utility model reside in that: the utility model discloses a set up one on the quality piece with the vibration region just right depressed part to keep great vibration region in the increase quality piece quality, thereby avoid the risk of vibrating diaphragm overstretching.

[ description of the drawings ]

FIG. 1 is a schematic view of the vibration structure of the present invention;

FIG. 2 is an exploded view of the vibrating structure of the present invention;

FIG. 3 is a schematic view of the mass plate structure of the present invention

FIG. 4 is a schematic cross-sectional view taken along line A-A of FIG. 1;

fig. 5 is an exploded view of the microphone of the present invention;

fig. 6 is a schematic view of the three-dimensional structure of the microphone of the present invention;

fig. 7 is a schematic cross-sectional view taken along line B-B in fig. 6.

[ detailed description ] embodiments

The present invention will be further described with reference to the accompanying drawings and embodiments.

The present invention provides a vibrating structure 100, see fig. 1-3, comprising a support structure 10 and a vibrating assembly 20,

preferably, the support structure 10 is used for supporting the vibration assembly 20, and the form of the support structure 10 is not limited. In this embodiment, the supporting structure 10 is ring-shaped, and in other embodiments, the supporting structure may also be blocks arranged at intervals, as long as the supporting function can be performed on the vibration component 20; the support structure 10 includes at least an upper surface for supporting the vibration member 20 and a lower surface opposite to the upper surface.

Preferably, the vibration assembly 20 is fixed to the upper surface of the support structure 10.

Specifically, the vibration assembly 20 includes a diaphragm 21 and a mass plate 22, the diaphragm 21 is fixed on the upper surface of the support structure 10, and the mass plate 22 is attached to the diaphragm 21.

Specifically, the diaphragm 21 is configured to vibrate, the diaphragm 21 includes a fixing portion 211, a bearing portion 213, and a vibration region 212, the fixing portion 211 is fixedly connected to the upper surface of the support structure 10, the bearing portion 213 is configured to be fixedly connected to the mass plate 22, and the vibration region 212 is connected between the fixing portion 211 and the bearing portion 213.

Specifically, referring to fig. 4, the mass plate 22 includes a first surface 221, a second surface 222, a concave portion 223, a first step portion 224, and a second step portion 225, the first surface 221 is fixedly connected to the diaphragm 21, the second surface 222 is disposed opposite to the first surface 221, and the concave portion 223 is formed by being concave from an edge of the first surface 221 to a position close to the second surface 222. The vibration region 212 is at least partially disposed opposite to the recess 223 in the vibration direction of the diaphragm 21.

Specifically, referring to fig. 4, the first step portion 224 is fixedly connected to the bearing portion 213 of the diaphragm 21, the first surface 221, that is, one surface of the first step portion 224 close to the diaphragm 21, and the first step portion 224 extends from the first surface 221 to a direction away from the diaphragm 21 to form one end of the first step portion 224 away from the diaphragm 21. The second step portion 225 is disposed opposite to the diaphragm 21 at an interval, and the second step portion 225 extends from one end of the first step portion 224 away from the diaphragm 21 along a direction perpendicular to the vibration direction and away from the first step portion 224.

Specifically, the vibration region 212 may be only partially disposed opposite to the recess 223 along the vibration direction of the diaphragm 21, and it is understood that a projection of the vibration region 212 along the vibration direction overlaps with a projection of the second step portion 225 along the vibration direction; it is also possible to arrange the vibration area 212 completely opposite to the recess 223, and it is understood that the projection of the vibration area 212 in the vibration direction completely overlaps the projection of the second step part 225 in the vibration direction, depending on the size of the recess 223 of the mass sheet 22, and the size of the recess 223 is again determined by the distance that the second step part 225 extends away from the first step part 224. In this embodiment, the second step portion 225 of the mass plate 22 extends to above the fixing portion 211 of the diaphragm 21, which is equivalent to that the second step portion 225 and the fixing portion 211 are arranged opposite to each other at an interval, and it can also be understood that the second step portion 225 extends to above the supporting structure 10. Therefore, the second stepped part 225 completely covers the recess 223 corresponding to the vibration region 212, so that the vibration region 212 is disposed opposite to all of the recess 223. When the weight of the mass plate 22 needs to be increased, the weight of the second step portion 225 may be increased only, due to the existence of the depression portion 223, the second step portion 225 is spaced from the diaphragm 21, and the vibration region 212 is always a portion between the fixing portion 211 and the first surface 221, so that the weight of the mass plate 22 is increased, and the size of the vibration region 212 is maintained, thereby avoiding the risk of excessive stretching of the diaphragm 21.

Specifically, referring to fig. 3 and 4, the second step part 225 includes a third surface 2251, the third surface 2251 is disposed opposite to the second surface 222, and the third surface 2251 faces the vibration region 212,

specifically, the first step portion 224 includes a fourth surface 2241, the fourth surface 2241 connects the first surface 221 and the third surface 2251, and the recess 223 is defined by the third surface 2251 and the fourth surface 2241.

The present invention further provides a microphone 200 comprising the vibration structure 100, referring to fig. 5 to 7, wherein the microphone 200 further comprises a base 30, an upper cover 40, a MEMS chip 50 and an ASIC chip 60, the support structure 10 of the vibration structure 100 is fixed to the base 30,

preferably, referring to fig. 5 and 7, the base 30 includes an upper substrate 31, a lower substrate 32, a supporter 33, a first receiving space 34 and a sound hole 35, the upper substrate 31 penetrates through the sound hole 35, the lower substrate 32 is opposite to the upper substrate 31, the supporter 33 is disposed between the upper substrate 31 and the lower substrate 32, and the first receiving space 34 is surrounded by the upper substrate 31, the lower substrate 32 and the supporter 33. In this embodiment, the supporting structure 10 is fixed on a side of the upper substrate 31 away from the lower substrate 32. The upper cover 40 is fixed on the base 30 at a side away from the first receiving space 34, and the upper cover 40 includes a second receiving space 41. The supporting structure 10 is annular, the upper cover 40 is fixed to a side of the supporting structure 10 away from the upper substrate 31, and the diaphragm 21 is clamped and fixed between the upper cover 40 and the supporting structure 10. In other embodiments, the supporting structure 10 may also be completely accommodated in the second accommodating space 41 of the upper cover 40, in which case, the upper cover 40 is directly fixed to the surface of the upper substrate 31 away from the lower substrate 32.

Preferably, the MEMS chip 50 has a back cavity 51, the MEMS chip 50 is accommodated in the first accommodating space 34 and fixed to the substrate 30, the lower substrate 32 is a circuit board, and the lower substrate 32 is communicated with an external circuit. The MEMS chip 50 may be fixed to the upper substrate 31 in the base 30 or may be fixed to the lower substrate 32 in the base 30. In this embodiment, the upper substrate 31 is also a circuit board, the ASIC chip 60 and the MEMS chip 50 are fixed to the upper substrate 31, and the sound hole 35 is opposite to the back cavity 51 of the MEMS chip 50.

Preferably, the vibration structure 100 is accommodated in the second accommodating space 41, the diaphragm 21 is fixed to a side of the support structure 10 away from the base 30, a closed cavity is formed between the diaphragm 21 and the base 30, and the sound hole 35 penetrates through the upper substrate 31 of the base 30 to communicate the closed cavity with the back cavity 51.

Therefore, the utility model discloses a set up one on quality piece 22 with the just right depressed part 223 of vibration region 212 to keep great vibration region 212 in the time of increase quality piece 22 quality, thereby avoid vibrating diaphragm 21 overstretch risk.

The above embodiments of the present invention are only described, and it should be noted that, for those skilled in the art, modifications can be made without departing from the inventive concept, but these all fall into the protection scope of the present invention.

Claims

1. The utility model provides a vibration structure, its includes bearing structure and is fixed in bearing structure's vibration subassembly, a serial communication port, the vibration subassembly is including being fixed in bearing structure's vibrating diaphragm and laminate in the quality piece of vibrating diaphragm, the vibrating diaphragm include with bearing structure fixed connection's fixed part, with the fixed portion of bearing and connection of quality piece the fixed part with the vibration region of bearing, the quality piece include with vibrating diaphragm fixed connection's first surface, with the relative second surface that sets up of first surface and certainly first surface edge is to being close to the depressed part that the second surface is sunken to form, vibration region along vibration direction at least part with the depressed part is just to setting up.

2. The vibrating structure of claim 1, wherein: the mass piece comprises a first step part fixedly connected with the bearing part and a second step part oppositely spaced from the vibrating diaphragm, and the second step part extends from one end, far away from the vibrating diaphragm, of the first step part along the vertical vibration direction and the direction far away from the first step part.

3. The vibrating structure of claim 2, wherein: the second step portion comprises a third surface which is opposite to the second surface and faces the vibration area, the first step portion comprises a fourth surface which is connected with the first surface and the third surface, and the third surface and the fourth surface are arranged in an enclosing mode to form the recessed portion.

4. The vibrating structure of claim 2, wherein: the projection of the vibration region along the vibration direction is partially overlapped with the projection of the second step portion along the vibration direction.

5. The vibrating structure of claim 2, wherein: the projection of the vibration region in the vibration direction completely overlaps the projection of the second step portion in the vibration direction.

6. The vibrating structure of claim 2, wherein: the second step portion extends to above the support structure.

7. A microphone is characterized by comprising the vibration structure as claimed in any one of claims 1 to 6, the microphone further comprises an MEMS chip with a back cavity, a base body with a first accommodating space and an upper cover fixed on one side, far away from the first accommodating space, of the base body, the upper cover is provided with a second accommodating space, the MEMS chip is accommodated in the first accommodating space and fixed on the base body, the vibration structure is accommodated in the second accommodating space, the supporting structure is fixed on the base body, the vibrating diaphragm is fixed on one side, far away from the base body, of the supporting structure, a closed cavity is formed between the vibrating diaphragm and the base body, and a sound hole for communicating the closed cavity with the back cavity is arranged on the base body in a penetrating mode.

8. The microphone of claim 7, wherein: the base body comprises an upper substrate provided with the sound holes, a lower substrate arranged opposite to the upper substrate and a supporting piece fixed between the upper substrate and the lower substrate, the supporting piece, the upper substrate and the lower substrate are arranged in an enclosing mode to form the first accommodating space, and the supporting structure is fixed on one side, away from the lower substrate, of the upper substrate.

9. The microphone of claim 8, wherein: the supporting structure is annular, the upper cover is fixed on one side, far away from the upper substrate, of the supporting structure, and the vibrating diaphragm is clamped and fixed between the upper cover and the supporting structure.

10. The microphone of claim 8, wherein: the upper substrate is a circuit board, the MEMS chip is fixed on the upper substrate, and the sound hole is arranged opposite to the back cavity.

11. The microphone of claim 10, wherein: the lower substrate is a circuit board and is communicated with an external circuit.

12. The microphone of claim 8, wherein: the lower substrate is a circuit board, and the MEMS chip is fixed on the lower substrate.

13. The microphone of claim 10, wherein: the microphone also comprises an ASIC chip fixed on the upper substrate.