WO2021237533A1

WO2021237533A1 - Vibration structure and microphone

Info

Publication number: WO2021237533A1
Application number: PCT/CN2020/092704
Authority: WO
Inventors: 张金宇; 王凯
Original assignee: 瑞声声学科技(深圳)有限公司
Priority date: 2020-05-27
Filing date: 2020-05-27
Publication date: 2021-12-02

Abstract

A vibration structure, comprising a supporting structure and a vibration assembly fixed to the supporting structure. The vibration structure is characterized in that the vibration assembly comprises a vibration diaphragm fixed to the supporting structure and a mass sheet attached to the vibration diaphragm, wherein the vibration diaphragm comprises a fixed part fixedly connected to the supporting structure, a bearing part fixed to the mass sheet and a vibration region connected to the fixed part and the bearing part, and the mass sheet comprises a first surface fixedly connected to the vibration diaphragm, a second surface arranged opposite to the first surface and a recess formed by recessing from the edge of the first surface towards the second surface, at least part of the vibration region being arranged right opposite to the recess in the vibration direction. According to the present utility model, the recess right opposite to the vibration region is arranged on the mass sheet, thereby increasing the mass of the mass sheet and maintaining a large vibration region, and avoiding the risk of excessive stretching of the vibration diaphragm.

Description

A kind of vibration structure and microphone technology field

[0001] The present invention relates to the technical field of microphones, and in particular to a vibration structure and a microphone. Background technique

[0002] In recent years, mobile communication technology has been rapidly developed. Consumers are increasingly using mobile communication devices, such as portable phones, portable phones that can access the Internet, personal digital assistants, or other devices for communication on a dedicated communication network, in which microphones It is one of the important components, especially the MEMS microphone. Existing MEMS microphones use a flat mass sheet, which is attached to the diaphragm. However, the existing flat mass plate is small in volume, resulting in lower sensitivity. When a larger mass plate is used to meet the sensitivity requirements, the contact area between the mass plate and the diaphragm is relatively large, resulting in vibration of the diaphragm. The area is small, and the stretching rate of the material under the same amplitude is too large. Long-term work is likely to cause plastic stretching, resulting in changes in material properties and performance.

[0003] Therefore, it is necessary to provide a vibration structure that increases the quality assurance sensitivity of the mass sheet while avoiding excessive stretching of the diaphragm. Summary of Invention Technical Problem

[0004] The purpose of the present invention is to provide a vibration structure that increases the quality assurance sensitivity of the mass sheet while avoiding excessive stretching of the diaphragm.

[0005] The technical solution of the present invention is as follows: A vibration structure, which includes a support structure and a vibration assembly fixed to the support structure, the vibration assembly includes a diaphragm fixed to the support structure and attached to the support structure The mass plate of the diaphragm, the diaphragm includes a fixing part fixedly connected to the supporting structure, a bearing part fixed to the mass plate, and a vibration area connecting the fixing part and the bearing part, the mass The sheet includes a first surface fixedly connected to the diaphragm, a second surface disposed opposite to the first surface, and a recess formed from the edge of the first surface toward the second surface. The vibration The area is at least partially arranged directly opposite to the recessed portion along the vibration direction.

[0006] More preferably, the mass sheet includes a first step portion fixedly connected to the carrying portion and a first step portion that is opposite to the diaphragm. For the spaced second stepped portions, the second stepped portion extends from an end of the first stepped portion away from the diaphragm in a direction perpendicular to the vibration direction and away from the first stepped portion.

[0007] More preferably, the second step portion includes a third surface disposed opposite to the second surface and facing the vibration area, and the first step portion includes connecting the first surface and the first surface. The fourth surface of the three surfaces, the third surface and the fourth surface are surrounded to form the recessed portion.

[0008] More preferably, the projection of the vibration area along the vibration direction partially overlaps with the projection of the second step portion along the vibration direction.

[0009] More preferably, the projection of the vibration area along the vibration direction and the projection of the second step portion along the vibration direction completely overlap.

[0010] More preferably, the second step portion extends above the support structure.

[0011] A microphone, comprising the vibration structure as described in any one of the above, the microphone further comprising a ME MS chip with a back cavity, a base with a first accommodating space, and a base fixed to the base away from the first accommodating space One side of the upper cover, the upper cover has a second accommodating space, the MEMS chip is accommodated in the first accommodating space and fixed to the base, the vibrating structure is accommodated in the second accommodating space, The supporting structure is fixed to the base, the diaphragm is fixed to a side of the supporting structure away from the base, a closed cavity is formed between the diaphragm and the base, and a communicating hole is formed through the base. The closed cavity and the sound hole of the back cavity.

[0012] More preferably, the base includes an upper substrate provided with the sound hole, a lower substrate disposed opposite to the upper substrate, and a support fixed between the upper substrate and the lower substrate, so The supporting member, the upper substrate and the lower substrate are surrounded to form the first accommodating space, and the supporting structure is fixed to a side of the upper substrate away from the lower substrate.

[0013] More preferably, the support structure is ring-shaped, the upper cover is fixed on a side of the support structure away from the upper substrate, and the diaphragm is fixed to the upper cover and the support structure by clamping between.

[0014] More preferably, the upper substrate is a circuit board, the MEMS chip is fixed on the upper substrate, and the sound hole is arranged directly opposite to the back cavity.

[0015] More preferably, the lower substrate is a circuit board, and the lower substrate is in communication with an external circuit.

[0016] More preferably, the lower substrate is a circuit board, and the MEMS chip is fixed to the lower substrate.

[0017] More preferably, the microphone further includes an ASIC chip fixed on the upper substrate. [0018] The beneficial effects of the present utility model are as follows: The present utility model provides a concave portion directly opposite to the vibration area on the mass plate, thereby increasing the mass of the mass plate while maintaining a larger vibration area, thereby avoiding excessive diaphragm The risk of stretching. Solution to the Problem Beneficial Effects of the Invention Brief Description of the Drawings Brief Description of the Drawings

[0019] FIG. 1 is a schematic diagram of the vibration structure of the utility model.

[0020] FIG. 2 is an exploded schematic diagram of the vibration structure of the present invention.

[0021] FIG. 3 is a schematic view of the structure of the mass sheet of the utility model.

[0022] FIG. 4 is a schematic cross-sectional view at A-A in FIG. 1.

[0023] FIG. 5 is an exploded schematic diagram of the microphone structure of the present invention.

[0024] FIG. 6 is a schematic diagram of the three-dimensional structure of the microphone of the present invention.

[0025] FIG. 7 is a schematic cross-sectional view at B-B in FIG. 6. The best embodiment for implementing the invention The best embodiment of the invention

[0026] The utility model is further described below in conjunction with the drawings and embodiments.

[0027] The present invention provides a vibrating structure 100, referring to FIGS. 1 to 3, which includes a supporting structure 10 and a vibrating component 20.

[0028] More preferably, the support structure 10 is used to support the vibration assembly 20, and the form of the support structure 10 is not limited. In this embodiment, the support structure 10 is ring-shaped. In other embodiments, it can also be blocks spaced apart from each other, as long as it can support the vibrating assembly 20; the support structure 10 at least includes It is used to support the upper surface of the vibrating assembly 20 and the lower surface opposite to the upper surface.

[0029] More preferably, the vibration assembly 20 is fixed to the upper surface of the support structure 10.

[0030] Specifically, the vibration assembly 20 includes a diaphragm 21 and a mass plate 22, the diaphragm 21 is fixed to the upper surface of the support structure 10, and the mass plate 22 is attached to the diaphragm 21.

[0031] Specifically, the diaphragm 21 is used for vibration, and the diaphragm 21 includes a fixing portion 211, a bearing portion 213, and a vibration In the moving area 212, the fixing portion 211 is fixedly connected to the upper surface of the supporting structure 10, the bearing portion 213 is used to be fixedly connected to the mass plate 22, and the vibration area 212 is connected to the fixing portion 211 And the carrying portion 213.

[0032] Specifically, referring to FIG. 4, the quality sheet 22 includes a first surface 221, a second surface 222, a recessed portion 223, a first stepped portion 224 and a second stepped portion 225, the first surface 221 and the The diaphragm 21 is fixedly connected, the second surface 222 is disposed opposite to the first surface 221, and the recessed portion 223 is recessed from the edge of the first surface 221 toward the second surface 222. The vibration area 212 is at least partially disposed directly opposite to the recess 223 along the vibration direction of the diaphragm 21.

[0033] Specifically, referring to FIG. 4, the first step portion 224 is fixedly connected to the bearing portion 213 of the diaphragm 21, and the first surface 221, that is, the first step portion 224 is close to the diaphragm 21 On one side, the first step portion 224 extends from the first surface 221 in a direction away from the diaphragm 21 to form an end of the first step portion 224 away from the diaphragm 21. The second step portion 225 is arranged at a relative interval from the diaphragm 21, and the second step portion 225 extends from an end of the first step portion 224 away from the diaphragm 21 along the vertical vibration direction and away from the first step portion 224. The stepped portion 224 is formed to extend in the direction.

[0034] Specifically, the vibration area 212 may be only partially arranged directly opposite to the recess 223 along the vibration direction of the diaphragm 21, which can be understood as the projection of the vibration area 212 along the vibration direction and the second The projection of the step portion 225 along the vibration direction partially overlaps; it can also be completely arranged directly opposite to the recess 223, which can be understood as the projection of the vibration region 212 along the vibration direction and the second step portion 225 along the vibration direction. The projections of are completely overlapped, which depends on the size of the concave portion 223 of the quality sheet 22, and the size of the concave portion 223 is taken from the distance that the second step portion 225 extends away from the first step portion 224. In this embodiment, the second stepped portion 225 of the mass sheet 22 extends to above the fixing portion 211 of the diaphragm 21, which corresponds to the portion of the second stepped portion 225 and the fixing portion 211 being arranged directly opposite to each other. It is understood that the second step portion 225 extends above the supporting structure 10. Therefore, the second step portion 225 completely covers the recessed portion 223 corresponding to the vibration area 212, so that all of the vibration area 212 and the recessed portion 223 are arranged directly opposite. When the weight of the mass piece 22 needs to be increased, the weight of the second step portion 225 can be increased only. Due to the existence of the recess 223, the second step portion 225 is spaced from the diaphragm 21, and the vibration area 212 is always the fixed portion 211 and the second step portion 225. The part between a surface 221 not only increases the weight of the mass sheet 22, but also maintains the size of the vibration area 212, thereby avoiding the risk of excessive stretching of the diaphragm 21. [0035] Specifically, referring to FIGS. 3 and 4, the second step portion 225 includes a third surface 2251, the third surface 2251 is disposed opposite to the second surface 222, and the third surface 2251 faces The vibration area 21 2.

[0036] Specifically, the first step portion 224 includes a fourth surface 2241, the fourth surface 2241 connects the first surface 221 and the third surface 2251, and the recessed portion 223 is formed by the third surface 2241. The surface 2251 and the fourth surface 2241 are surrounded and formed.

[0037] The present invention also provides a microphone 200 that includes the vibrating structure 100. Referring to FIGS. 5 to 7, the microphone 200 further includes a base 30, an upper cover 40, a MEMS chip 50, and an ASIC chip 60. The supporting structure 10 of the vibrating structure 100 is fixed to the base 30.

[0038] More preferably, referring to FIGS. 5 and 7, the base 30 includes an upper substrate 31, a lower substrate 32, a support 33, a first receiving space 34, and a sound hole 35, and the upper substrate 31 penetrates to form a sound hole 35. The lower substrate 32 is disposed opposite to the upper substrate 31, the support 33 is disposed between the upper substrate 31 and the lower substrate 32, and the first accommodating space 34 is formed by the upper substrate 31 , The lower substrate 32 and the supporting member 33 are surrounded and formed. In this embodiment, the supporting structure 10 is fixed to a side of the upper substrate 31 away from the lower substrate 32. The upper cover 40 is fixed on the side of the base body 30 away from the first receiving space 34, and the upper cover 40 includes a second receiving space 41. The supporting structure 10 has a ring shape, the upper cover 40 is fixed to a side of the supporting structure 10 away from the upper substrate 31, and the diaphragm 21 is sandwiched and fixed to the upper cover 40 and the supporting structure 10 between. In other embodiments, the supporting structure 10 may also be completely contained in the second receiving space 41 of the upper cover 40. At this time, the upper cover 40 is directly fixed to the upper substrate 31 away from the lower substrate 32. surface.

[0039] More preferably, the MEMS chip 50 has a back cavity 51, the MEMS chip 50 is accommodated in the first accommodating space 34 and fixed to the base 30, and the lower substrate 32 is a circuit board, The lower substrate 32 communicates with an external circuit. The MEMS chip 50 can be fixed to the upper substrate 31 in the base 30 or the lower substrate 32 in the base 30. In this embodiment, the upper substrate 31 is also a circuit board, the ASIC chip 60 and the MEMS chip 50 are fixed to the upper substrate 31, and the sound hole 35 is aligned with the back cavity 51 of the MEMS chip 50. Pair set.

[0040] More preferably, the vibrating structure 100 is accommodated in the second accommodating space 41, the diaphragm 21 is fixed on the side of the support structure 10 away from the base 30, and the diaphragm 21 is The base body 30 forms a closed The sound hole 35 penetrates the upper substrate 31 of the base body 30 to communicate with the closed cavity and the back cavity 51. [0041] In this way, the present invention provides a recess 223 on the mass plate 22 that is directly opposite to the vibration area 212, thereby increasing the mass of the mass plate 22 while maintaining a larger vibration area 212, thereby avoiding the diaphragm 21 Risk of excessive stretching.

[0042] What has been described above is only the implementation of the present invention. It should be pointed out that for those of ordinary skill in the art, improvements can be made without departing from the inventive concept of the present invention, but These all belong to the protection scope of the utility model.

Claims

[Claim 1] A vibration structure, comprising a support structure and a vibration component fixed to the support structure, characterized in that the vibration component includes a diaphragm fixed to the support structure and attached to the vibration The diaphragm includes a fixed part fixedly connected to the supporting structure, a bearing part fixed to the mass plate, and a vibration area connecting the fixed part and the bearing part, and the mass plate includes A first surface fixedly connected to the diaphragm, a second surface disposed opposite to the first surface, and a recess formed from the edge of the first surface toward the second surface, and the vibration area is along The vibration direction is at least partially arranged directly opposite to the recessed portion.

[Claim 2] The vibrating structure according to claim 1, characterized in that: the mass piece includes a first stepped portion fixedly connected to the carrying portion and a second stepped portion relatively spaced from the diaphragm, The second step portion extends from an end of the first step portion away from the diaphragm along a vertical vibration direction and a direction away from the first step portion.

[Claim 3] The vibration structure according to claim 2, characterized in that: the second step portion includes a third surface disposed opposite to the second surface and facing the vibrating area, and the first step The portion includes a fourth surface connecting the first surface and the third surface, and the third surface and the fourth surface surround the recessed portion.

[Claim 4] The vibration structure of claim 2, wherein the projection of the vibration region in the vibration direction partially overlaps the projection of the second step portion in the vibration direction.

[Claim 5] The vibration structure of claim 2, wherein the projection of the vibration region in the vibration direction completely overlaps the projection of the second step portion in the vibration direction.

[Claim 6] The vibration structure of claim 2, wherein the second step portion extends above the supporting structure.

[Claim 7] A microphone, characterized by comprising the vibration structure according to any one of claims 1 to 6, the microphone further comprising a MEMS chip with a back cavity, a base with a first housing space, and a base fixed at the The base is away from the upper cover on the side of the first housing space, the upper cover has a second housing space, the MEMS chip is housed in the first housing space and fixed to the base, and the vibration structure houses In the second accommodating space, the supporting structure is fixed On the base body, the diaphragm is fixed on the side of the support structure away from the base body, a closed cavity is formed between the diaphragm and the base body, and the base body is penetrated with the closed cavity and communicates with the base body. The sound hole of the back cavity.

[Claim 8] The microphone of claim 7, wherein: the base includes an upper substrate provided with the sound hole, a lower substrate disposed opposite to the upper substrate, and a lower substrate fixed to the upper substrate and The support between the lower substrates, the support, the upper substrate, and the lower substrate surround to form the first accommodating space, and the support structure is fixed on the upper substrate away from the lower substrate One side.

[Claim 9] The microphone of claim 8, wherein: the supporting structure is ring-shaped, the upper cover is fixed to a side of the supporting structure away from the upper substrate, and the diaphragm is sandwiched Fixed between the upper cover and the supporting structure.

[Claim 10] The microphone of claim 8, wherein the upper substrate is a circuit board, the MEMS chip is fixed on the upper substrate, and the sound hole is arranged directly opposite to the back cavity.

11. The microphone according to claim 10, characterized in that: the lower substrate is a circuit board, and the lower substrate is in communication with an external circuit.

12. The microphone of claim 8, wherein: the lower substrate is a circuit board, and the MEMS chip is fixed on the lower substrate.

13. The microphone according to claim 10, characterized in that: the microphone further comprises an ASIC chip fixed on the upper substrate.