CN209659621U - Vibrating sensor and audio frequency apparatus - Google Patents
Vibrating sensor and audio frequency apparatus Download PDFInfo
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- CN209659621U CN209659621U CN201920405567.5U CN201920405567U CN209659621U CN 209659621 U CN209659621 U CN 209659621U CN 201920405567 U CN201920405567 U CN 201920405567U CN 209659621 U CN209659621 U CN 209659621U
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Abstract
It includes shell that the utility model, which discloses a kind of vibrating sensor and audio frequency apparatus, vibrating sensor, and the shell is formed with accommodating chamber, and the accommodating chamber is formed with opening；MEMS microphone, the MEMS microphone block the opening, and the acoustic aperture of the MEMS microphone is connected to the accommodating chamber；First vibrating diaphragm, first vibrating diaphragm are set to the accommodating chamber for vibration；And mass block, the mass block are fixedly installed on the surface of first vibrating diaphragm, the material of the mass block is nonferromagnetic material.Technical solutions of the utility model are intended to make the material setting of mass block rationally, avoid the Distribution of Magnetic Field for influencing vibrating sensor, guarantee the detection effect of vibrating sensor, user-friendly.
Description
Technical field
The utility model relates to sensor technical field, in particular to a kind of vibrating sensor and apply the vibrating sensor
Audio frequency apparatus.
Background technique
Current existing vibrating sensor includes vibration inductor and fills the vibration detection that vibration is converted into electric signal
It sets, vibration inductor has the vibrating diaphragm of induction vibration, which carries out resonance after receiving external vibration, to generate humorous
Shake wave, which converts, and export vibration signal by detection resonance wave, realize the function of vibrating sensing
Energy；And for the ease of diaphragm oscillations, it will usually mass block be arranged on the surface of vibrating diaphragm.But the material one of production quality block
As it is not reasonable, so that Distribution of Magnetic Field in vibrating sensor is uneven, in this way, be easy to influence the detection effect of vibrating sensor,
It is unfavorable for user's use.
Utility model content
The main purpose of the utility model is to provide a kind of vibrating sensor, it is intended to and the material of mass block is set rationally,
The Distribution of Magnetic Field for avoiding influencing vibrating sensor, guarantees the detection effect of vibrating sensor, user-friendly.
To achieve the above object, vibrating sensor provided by the utility model, comprising:
Shell, the shell are formed with accommodating chamber, and the accommodating chamber is formed with opening；
MEMS microphone, the MEMS microphone block the opening, the acoustic aperture of the MEMS microphone and the appearance
Chamber of receiving connection；
First vibrating diaphragm, first vibrating diaphragm are set to the accommodating chamber for vibration；And
Mass block, the mass block are fixedly installed on the surface of first vibrating diaphragm, and the material of the mass block is non-ferric
Magnetic material.
Optionally, the nonferromagnetic material includes in non-ferrous metal, rubber, glass, plastics, ceramics and wood materials
It is at least one.
Optionally, the outer profile of the mass block is enclosed by arc segment；
And/or the outer profile of first vibrating diaphragm is enclosed by arc segment.
Optionally, the mass block is in the outer profile of the projected area of first vibrating diaphragm and the outer profile of first vibrating diaphragm
It is ellipse or circle.
Optionally, the profile of the projected area of the mass block radially with the outer profile of first vibrating diaphragm is equidistant sets
It sets.
Optionally, the MEMS microphone includes circuit board assemblies, and the accommodating chamber is open and seals by the circuit board assemblies
It is stifled；The circuit board assemblies are additionally provided with asic chip and MEMS microphone chip, the asic chip and the MEMS microphone
Chip is electrically connected.
Optionally, the circuit board assemblies include first circuit board, and the first circuit board blocks the opening, the sound
Hole is the through hole being set on the first circuit board, through hole described in the first vibrating diaphragm the cover.
Optionally, the circuit board assemblies further include second circuit board, between the first circuit board and second circuit board
It is formed with resonant cavity, the shell is set to the surface that the first circuit board deviates from the resonant cavity, the through hole connection
The accommodating chamber and the resonant cavity, the asic chip and the MEMS microphone chip are set in the resonant cavity；
The MEMS microphone chip includes bracket and the second vibrating diaphragm, and the support ring is arranged around through hole, and described second
Vibrating diaphragm is fixed on the bracket, and through hole described in the cover is arranged.
Optionally, the shell is formed with venthole, and external environment is connected to by the venthole with the accommodating chamber；
And/or the vibrating sensor further includes the link block for connecting circuit board assemblies and the shell, the company
It connects block to be arranged around the opening, and between the circuit board assemblies and the shell, the outer edge of first vibrating diaphragm
It is fixed between the link block and the shell.
The utility model also proposes a kind of audio frequency apparatus, including vibrating sensor, which includes:
Shell, the shell are formed with accommodating chamber, and the accommodating chamber is formed with opening；
Circuit board assemblies, the circuit board assemblies are fixedly connected with the shell, and the opening is blocked；
MEMS microphone, the MEMS microphone be set to the circuit board assemblies a surface, and with the circuit board group
Part is electrically connected；
First vibrating diaphragm, first vibrating diaphragm are set to the accommodating chamber for vibration；And
Mass block, the mass block fitting are set to the surface of first vibrating diaphragm, and the material of the mass block is non-ferric
Magnetic material.
The technical solution of the utility model by the way that shell and microphone are fixed to each other, sealed by the accommodating chamber for forming shell
It is stifled, the first vibrating diaphragm and mass block are set within the receiving cavity, and use nonferromagnetic material production quality block.It shakes when needing to use
When dynamic sensor, deviate from the side inputted vibration signal or pressure signal of accommodating chamber in shell, the first vibrating diaphragm and mass block are by this
Vibration signal or pressure signal excitation, mass block and the first vibrating diaphragm generate vibration, so that the gas of accommodating chamber generates vibration, so that
Air pressure in accommodating chamber generates variation, and the air pressure change in accommodating chamber is passed in MEMS microphone by the acoustic aperture of MEMS microphone
So that MEMS microphone induction is accommodated the vibration that intracavity gas generates, and the information sensed is converted into the telecommunications that can detecte
Number.And due to being made mass block of nonferromagnetic material, when nonferromagnetic material is placed in external magnetic field, due to its magnetic susceptibility
It is normally near 1, magnetic efficiency is bad, and the ferromagnetic saturation magnetization of nonferromagnetic material is very low, acts in external magnetic field H
Under, will not have magnetic conductivity or diamagnetism, so will not impact to the magnetic field in vibrating sensor, and can be preferably
Drive the first diaphragm oscillations.In this way, the technical solution of the utility model can be such that the material of mass block is arranged rationally, avoid influencing
The Distribution of Magnetic Field of vibrating sensor guarantees the detection effect of vibrating sensor, user-friendly.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor
Under, the structure that can also be shown according to these attached drawings obtains other attached drawings.
Fig. 1 is the structural schematic diagram of one embodiment of the utility model vibrating sensor；
Fig. 2 is the structural schematic diagram of the lower embodiment of the utility model vibrating sensor overlooking state.
Drawing reference numeral explanation:
| Label | Title | Label | Title |
| 100 | Vibrating sensor | 1312 | Second vibrating diaphragm |
| 11 | Circuit board assemblies | 31 | Shell |
| 111 | First circuit board | 311 | Top plate |
| 1111 | Through hole | 312 | Side plate |
| 112 | Second circuit board | 313 | Accommodating chamber |
| 113 | Resonant cavity | 314 | Venthole |
| 114 | Supporting block | 332 | First vibrating diaphragm |
| 115 | Asic chip | 334 | Mass block |
| 13 | MEMS microphone chip | 50 | Link block |
| 1311 | First support |
The embodiments will be further described with reference to the accompanying drawings for the realization, functional characteristics and advantage of the utility model aim.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describing, it is clear that described embodiment is only a part of the embodiment of the utility model, rather than all
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are not making creative work premise
Under every other embodiment obtained, fall within the protection scope of the utility model.
It is to be appreciated that the directional instruction (such as up, down, left, right, before and after ...) of institute in the utility model embodiment
It is only used for explaining in relative positional relationship, the motion conditions etc. under a certain particular pose (as shown in the picture) between each component, such as
When the fruit particular pose changes, then directionality instruction also correspondingly changes correspondingly.
In addition, the description for being related to " first ", " second " etc. in the present invention is used for description purposes only, and cannot understand
For its relative importance of indication or suggestion or implicitly indicate the quantity of indicated technical characteristic.Define as a result, " first ",
The feature of " second " can explicitly or implicitly include at least one of the features.In addition, the technical side between each embodiment
Case can be combined with each other, but must be based on can be realized by those of ordinary skill in the art, when the combination of technical solution
Conflicting or cannot achieve when occur will be understood that the combination of this technical solution is not present, also not in the requires of the utility model
Protection scope within.
The utility model proposes a kind of vibrating sensors 100.
Referring to Fig.1, the vibrating sensor 100 of technical solutions of the utility model proposition includes:
Shell 31, the shell 31 are formed with accommodating chamber 313, and the accommodating chamber 313 is formed with opening；
MEMS microphone, MEMS microphone includes circuit board assemblies 11 and MEMS microphone chip 13 in the present embodiment；
Circuit board assemblies 11, the circuit board assemblies 11 are fixedly connected with the shell 31, and the opening is blocked；
MEMS microphone chip 13, the MEMS microphone chip 13 are set to a surface of the circuit board assemblies 11, and
It is electrically connected with the circuit board assemblies 11；
First vibrating diaphragm 332, first vibrating diaphragm 332 are set to the accommodating chamber 313 for vibration；And
Mass block 334, the mass block 334 are bonded the surface for being set to first vibrating diaphragm 332, the mass block 334
Material be nonferromagnetic material.
The technical solution of the utility model forms shell 31 by the way that shell 31 and circuit board assemblies 11 are fixed to each other
Accommodating chamber 313 is blocked, and the MEMS microphone chip being electrically connected with circuit board assemblies 11 is arranged in the accommodating chamber 313
13, and the first vibrating diaphragm 332 and mass block 334 are set in the accommodating chamber 313, and use nonferromagnetic material production quality block
334.When needing using vibrating sensor 100, in shell 31 away from side inputted vibration signal or the pressure letter of accommodating chamber 313
Number, the first vibrating diaphragm 332 and mass block 334 are motivated by the vibration signal or pressure signal, and mass block 334 and the first vibrating diaphragm 332 produce
Life vibration changes so that the gas of accommodating chamber 313 generates vibration so that the air pressure in accommodating chamber 313 generates, in accommodating chamber 313
Air pressure change be passed in MEMS microphone by the acoustic aperture 1111 of MEMS microphone and incude MEMS microphone in accommodating chamber 313
The vibration that gas generates, and the information sensed is converted into the electric signal that can detecte, it is transmitted to circuit board assemblies 11.And
Due to being made mass block 334 of nonferromagnetic material, when nonferromagnetic material is placed in external magnetic field, since its magnetic susceptibility is general
Near 1, magnetic efficiency is bad, and the ferromagnetic saturation magnetization of nonferromagnetic material is very low, under external magnetic field H effect,
Will not have magnetic conductivity or diamagnetism, so will not impact to the magnetic field in vibrating sensor 100, and can be preferably
The first vibrating diaphragm 332 is driven to vibrate.In this way, the technical solution of the utility model can be such that the material of mass block 334 is arranged rationally, keep away
Exempt from the Distribution of Magnetic Field of influence vibrating sensor 100, guarantees the detection effect of vibrating sensor 100, it is user-friendly.
In the embodiment of the application, MEMS microphone chip 13 can be realized and circuit board assemblies 11 by scolding tin
It is electrically connected Ei, shell 31 can be fixed by bonded part and circuit board assemblies 11, or passes through buckle or connector and circuit
Board group part 11 is fixed, as long as can preferably incude the vibration that gas generates in accommodating chamber 313 convenient for MEMS microphone chip 13
.
Further, the MEMS microphone chip 13 be MEMS (Microelectro Mechanical Systems,
MEMS) microphone, the circuit board assemblies 11 are additionally provided with asic chip 115, and the asic chip 115 is placed in described
In accommodating chamber 313, and it is electrically connected with the MEMS microphone chip 13.The property of MEMS microphone chip 13 at different temperatures
Can be all sufficiently stable, sensibility will not be influenced by temperature, vibration, humidity and time.Since heat resistance is strong, MEMS microphone
Chip 13 can bear 260 DEG C of high temperature reflux weldering, and performance does not have any variation.Very due to the variation of assembling context sensitive
It is small, the audio debugging cost in manufacturing process can also be saved.ASIC(Application Specific Integrated
Circuit) chip is that MEMS microphone chip 13 provides external bias, and effective biasing will make MEMS microphone chip 13 whole
Stable acoustics and electric parameter can be all kept in a operating temperature range, also the microphone with different sensibility is supported to set
Meter.
In the present embodiment, which is substantially arranged in the straight quadrangular shape that top is rectangle, the material of the shell 31
It can be using metal (material of metal optional stainless steel material, aluminum material, aluminum alloy materials, copper material, copper alloy material
Material, ferrous material, ferroalloy materials etc.), plastics (rigid plastics may be selected in plastics, as ABS, POM, PS, PMMA, PC, PET,
PBT, PPO etc.) and other alloy materials etc..In this way, being more conducive to promoting the setting stability of shell 31, thus effectively
Promote practicability, reliability and the durability of shell 31.
Setting mass block 334 can allow it after receiving vibration or pressure signal, drive the vibration of the first vibrating diaphragm 332, thus
Cause pressure change.Mass block 334 can make the inductive effects of vibration inductor 30 more preferable, can have under delicate variations
More sensitive response.The quality m of the mass block 334 can be 0.003mg≤m≤0.5mg, when the quality of mass block 334 is too small,
Or it crosses and is mostly unfavorable for the vibration that mass block 334 drives the first vibrating diaphragm 332.In order to make the sensitivity of vibration inductor 30 compared with
Height, the quality m of mass block 334 can be set to 0.004mg, 0.004mg, 0.005mg, 0.008mg, 0.009mg,
0.01mg, 0.03mg, 0.05mg, 0.08mg, 0.09mg, 0.1mg, 0.2mg, 0.3mg, 0.4mg etc..The mass block 334 can be with
Support is provided for the first vibrating diaphragm 332 when vibrating with the first vibrating diaphragm 332 for elastic slice, crossbeam or other structures.
In the embodiment of the application, the nonferromagnetic material include non-ferrous metal, rubber, glass, plastics, ceramics with
And at least one of wood materials.It is understood that since mass block 334 will be vibrated with the first vibrating diaphragm 332, institute
To need to take into account the standard density for considering unlike material, to guarantee under suitable volume, there is mass block 334 suitable
Quality guarantees the good vibration of the first vibrating diaphragm 332.
In the embodiment of the application, the outer profile of the mass block 334 is enclosed by arc segment；Due to rib
The outer profile at angle is easy to cause the weight transition of 334 part of mass block not smooth enough, so will lead to the part of mass block 334
Mass concentration is unfavorable for vibrating the first vibrating diaphragm 332 uniformly, thus the waveform when incuding subtle external vibration
It is chaotic, it has not been convenient to the detection of vibrating sensor 100, so the outer profile of mass block 334 is enclosed by arc segment, convenient for vibration
Dynamic sensor 100 detects external vibration and pressure.
In the embodiment of the application, the outer profile of first vibrating diaphragm 332 is enclosed by arc segment.Due to having
The outer profile of corner angle is easy to cause the shape transition of 332 part of the first vibrating diaphragm not smooth enough, is easy to be formed in the inside of accommodating cavity
Irregular wave is unfavorable for MEMS microphone chip 13 and is collected to the vibration of air, it has not been convenient to vibrating sensor 100
Detection detects external vibration convenient for vibrating sensor 100 so being enclosed the outer profile of the first vibrating diaphragm 332 by arc segment
Dynamic and pressure.
Referring to Fig. 2, in the embodiment of the application, the mass block 334 is in the projected area of first vibrating diaphragm 332
The outer profile of outer profile and first vibrating diaphragm 332 is ellipse or round.Ellipse or circle are set by outer profile, is made
Oscillating component outer profile it is round and smooth and have center, convenient for the first vibrating diaphragm 332 vibration when generate round and smooth complete waveform.
In the embodiment of the application, the profile of the projected area of the mass block 334 shakes with described first radially
The outer profile of film 332 is equidistantly positioned.Specifically, in the present embodiment, in the horizontal direction of the first vibrating diaphragm 332, mass block 334
The distance at both ends 332 edge of the first vibrating diaphragm of distance in the horizontal direction be respectively L1 and L2, the L1=L2, other same diameters
The distance of upward 334 outer profile of mass block and the outer peripheral distance of the first vibrating diaphragm 332 are same identical, to guarantee mass block
334 are located at the middle part of the first vibrating diaphragm 332.In this way, the Mass Distribution of mass block 334 and the first vibrating diaphragm 332 can be made uniform, thus
The wave amplitude generated when the two vibration is improved, is received and processed convenient for MEMS microphone chip 13.
Referring to Fig.1, in the embodiment of the application, the MEMS microphone includes circuit board assemblies 11, the circuit
Board group part 11 blocks the opening of the accommodating chamber 313, and the circuit board assemblies 11 are additionally provided with asic chip 115, the ASIC
Chip 115 and the MEMS microphone chip 13 are electrically connected；
The circuit board assemblies 11 include first circuit board 111, and the first circuit board 111 blocks the opening, described
Second buffer part is set to a surface of the first circuit board 111, and the first circuit board 111 is additionally provided with through hole 1111, institute
State through hole 1111 described in 332 the cover of the first vibrating diaphragm.
In the embodiment of the application, the circuit board assemblies 11 further include second circuit board 112, first circuit
Resonant cavity 113 is formed between plate 111 and second circuit board 112, the shell 31 is set to the first circuit board 111 and deviates from institute
A surface of resonant cavity 113 is stated, the through hole 1111 is connected to the accommodating chamber 313 and the resonant cavity 113, the ASIC core
Piece 115 and the MEMS microphone chip 13 are set in the resonant cavity 113；
The MEMS microphone chip 13 includes bracket 1311 and the second vibrating diaphragm 1312, and the bracket 1311 is around through hole
1111 settings, second vibrating diaphragm 1312 are fixed on the bracket 1311, and through hole 1111 described in the cover is arranged.
In the present embodiment, the manufacturing process of MEMS microphone chip 13 is that precipitation number layer is different first on wafer
Substance, then the useless substance of etching off, forms a chamber in base wafer, covers one layer of vibrating diaphragm that can be moved in chamber
(i.e. the second vibrating diaphragm 1312) and fixed backboard (i.e. bracket 1311) backboard have preferable rigidity, using through-hole structure.
Second vibrating diaphragm 1312 is relatively thin, flexible.When air pressure transformation, the second vibrating diaphragm 1312 can be bent with air pressure change, the second vibration
The capacitance that film 1312 is bent between Shi Qiyu bracket 1311 will change, so that asic chip 11515 can be by this capacitor
Signal is converted into electric signal.
When deviate from accommodating chamber 313 side inputted vibration signal or pressure signal (being defined herein as vibration source), thus
The gas of accommodating chamber 313 generates vibration, and the gas of vibration drives the second vibrating diaphragm 1312 to generate vibration, since the second vibrating diaphragm 1312 covers
Lid through hole 1111, and resonant cavity 113 is set in the other side of through hole 1111, the second vibrating diaphragm 1312 carries out delicate variations
When, it is easy to compress vibrating diaphragm far from the side of vibration source, thus reduce the vibration resistance of the second vibrating diaphragm 1312, it can
Vibratory response easily is generated under subtle air vibration, to keep the sensitivity of MEMS microphone chip 13 higher.It can be with
Understand, the volume of the resonant cavity 113 is the bigger the better, and bigger resonant cavity 113, air is more, is convenient for the second vibrating diaphragm
1312 vibration.In the embodiment of the application, the volume of resonant cavity 113 is 0.1-5mm3, being arranged such on the one hand can be with
Make the second preferably vibration of vibrating diaphragm 1312, on the other hand can reduce the volume of vibrating sensor 100, it is comprehensive higher.It can
With understanding, first circuit board 111 and second circuit board 112 can be by being arranged supporting block 114, to form resonant cavity
113。
In the embodiment of the application, shell 31 includes top plate 311 and the side plate 312 from the extension of top plate 311, the top plate
311 and side plate 312 be enclosed accommodating chamber 313 jointly, the edge of first vibrating diaphragm 332 is fixedly connected with top plate 311, be set to top
Plate 311 can be in order to transmit the pressure or vibration of top plate 311, so that the air pressure in accommodating chamber 313 be made to generate variation；
Or the edge of first vibrating diaphragm 332 is fixedly connected with side plate 312, it can be in order to transmitting side plate set on top plate 311
312 pressure or vibration, so that the air pressure in accommodating chamber 313 be made to generate variation.
First vibrating diaphragm 332 is set to the surface of 31 face MEMS microphone chip 13 of shell, is convenient for MEMS microphone chip
13 directly incude air pressure change caused by the first vibrating diaphragm 332, to improve the sensing effect of vibrating sensor 100.
In the embodiment of the application, the vibrating sensor 100 further includes for connecting circuit board assemblies 11 and institute
State the link block 50 of shell 31, the link block 50 is arranged around the opening, and positioned at circuit board assemblies 11 and described
Between shell 31, the outer edge of first vibrating diaphragm 332 is fixed between the link block 50 and the shell 31.Setting connection
Block 50 connect convenient for shell 31 with circuit board assemblies 11, and the vibration for the first vibrating diaphragm 332 provides vibratility adjustment, specifically,
Glue can be layed in the two sides of connector, then the two sides that circuit board assemblies 11 and shell 31 have glued glue with connector are consolidated
It is fixed.
In the embodiment of the application, the projected area of first vibrating diaphragm 332 in above-below direction is greater than described second
The projected area of vibrating diaphragm 1312 in above-below direction.The contact area of first vibrating diaphragm 332 and gas in accommodating chamber 313 is bigger, makes it
Can preferably vibration pneumatic, the area of the second vibrating diaphragm 1312 is smaller, makes MEMS microphone chip 13 can be to same by being mounted on
PCB noise caused by loudspeaker on PCB generates lower vibration coupling, is easy to use.
In the embodiment of the application, the thickness of the mass block 334 is gradually increased by edge to center, to make its vibration
Dynamic effect is more preferable.
In the embodiment of the application, the shell 31 is formed with venthole 314, and the venthole 314 is by external rings
Border is connected to the accommodating chamber 313, and in the vibration of the first vibrating diaphragm 332, closed space can generate the vibration of the first vibrating diaphragm 332
Vibration resistance is unfavorable for the first vibrating diaphragm 332 and drives the Gas Vibration in accommodating chamber 313 that ventilation is arranged so as to cause air pressure change
Hole 314 can be in order to be connected to, to reduce the resistance when vibration of the first vibrating diaphragm 332 with outside.The quantity of the venthole 314 and position
Set to be set according to actual needs, as long as convenient for reducing the vibration resistance of the first vibrating diaphragm 332.
The utility model also proposes a kind of audio frequency apparatus (not shown), which includes vibrating sensor 100, the vibration
Dynamic sensor 100 includes: shell 31, and the shell 31 is formed with accommodating chamber 313, and the accommodating chamber 313 is formed with opening；
MEMS microphone, the MEMS microphone block the opening, the acoustic aperture 1111 of the MEMS microphone and institute
State the connection of accommodating chamber 313；
First vibrating diaphragm 332, first vibrating diaphragm 332 are set to the accommodating chamber 313 for vibration；And
Mass block 334, the mass block 334 are fixedly installed on the surface of first vibrating diaphragm 332, the mass block 334
Material be nonferromagnetic material.
It is understood that the audio frequency apparatus can be bone-conduction microphone.The audio frequency apparatus further includes mounting hole, thus
Convenient for appearing 31 part of shell of vibrating sensor 100, consequently facilitating induction vibration.
Since this audio frequency apparatus uses whole technical solutions of above-mentioned all embodiments, at least there is above-mentioned implementation
All beneficial effects brought by the technical solution of example, this is no longer going to repeat them.
In practical applications, can be cooperated by the MEMS microphone and shell 31 of other packing forms, as long as guaranteeing
The acoustic aperture 1111 of MEMS microphone is connected to accommodating chamber 313, makes sound of the air pressure change in accommodating chamber 313 by MEMS microphone
Hole 1111 is passed in MEMS microphone, guarantees that MEMS microphone can pick up the pressure that Gas Vibration generates in induction accommodating chamber 313
Power variable signal.
The above is only the preferred embodiment of the present invention, and therefore it does not limit the scope of the patent of the utility model,
Under all utility models in the utility model are conceived, equivalent structure made based on the specification and figures of the utility model
Transformation, or directly/be used in other related technical areas indirectly and be included in the scope of patent protection of the utility model.
Claims (10)
1. a kind of vibrating sensor characterized by comprising
Shell, the shell are formed with accommodating chamber, and the accommodating chamber is formed with opening；
MEMS microphone, the MEMS microphone block the opening, the acoustic aperture of the MEMS microphone and the accommodating chamber
Connection；
First vibrating diaphragm, first vibrating diaphragm are set to the accommodating chamber for vibration；And
Mass block, the mass block are fixedly installed on the surface of first vibrating diaphragm, and the material of the mass block is non-ferromagnetic material
Material, the outer profile of the mass block are enclosed by arc segment.
2. vibrating sensor as described in claim 1, which is characterized in that the nonferromagnetic material include non-ferrous metal, rubber,
At least one of glass, plastics, ceramics and wood materials.
3. vibrating sensor as claimed in claim 2, which is characterized in that the outer profile of first vibrating diaphragm is enclosed by arc segment
It is formed.
4. vibrating sensor as claimed in claim 3, which is characterized in that the mass block is in the projected area of first vibrating diaphragm
Outer profile and the outer profile of first vibrating diaphragm be ellipse or round.
5. vibrating sensor as claimed in claim 4, which is characterized in that the profile of the projected area of the mass block is radially
It is equidistantly positioned with the outer profile of first vibrating diaphragm.
6. the vibrating sensor as described in any one of claims 1 to 5, which is characterized in that the MEMS microphone includes electricity
Road board group part, the circuit board assemblies block the opening of the accommodating chamber；The circuit board assemblies be additionally provided with asic chip and
MEMS microphone chip, the asic chip and the MEMS microphone chip are electrically connected.
7. vibrating sensor as claimed in claim 6, which is characterized in that the circuit board assemblies include first circuit board, institute
It states first circuit board and blocks the opening, the acoustic aperture is the through hole for being set to the first circuit board, first vibrating diaphragm
Through hole described in the cover.
8. vibrating sensor as claimed in claim 7, which is characterized in that the circuit board assemblies further include second circuit board,
Resonant cavity is formed between the first circuit board and second circuit board, the shell is set to the first circuit board away from described
One surface of resonant cavity, the through hole are connected to the accommodating chamber and the resonant cavity, the asic chip and the MEMS wheat
Gram wind chip is set in the resonant cavity；
The MEMS microphone chip includes bracket and the second vibrating diaphragm, and the support ring is arranged around through hole, second vibrating diaphragm
It is fixed on the bracket, and through hole described in the cover is arranged.
9. vibrating sensor as claimed in claim 8, which is characterized in that the shell is formed with venthole, the venthole
External environment is connected to the accommodating chamber；
And/or the vibrating sensor further includes the link block for connecting circuit board assemblies and the shell, the link block
It is arranged around the opening, and between the circuit board assemblies and the shell, the outer edge of first vibrating diaphragm is fixed
Between the link block and the shell.
10. a kind of audio frequency apparatus, which is characterized in that including vibrating sensor as claimed in any one of claims 1-9 wherein.
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| CN201920405567.5U CN209659621U (en) | 2019-03-27 | 2019-03-27 | Vibrating sensor and audio frequency apparatus |
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| CN201920405567.5U CN209659621U (en) | 2019-03-27 | 2019-03-27 | Vibrating sensor and audio frequency apparatus |
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| CN209659621U true CN209659621U (en) | 2019-11-19 |
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