RU2801712C1 - Vibration sensor - Google Patents

Abstract

FIELD: measuring technology; vibration sensors.

SUBSTANCE: vibration sensor contains an acoustic transducer; a vibration assembly connected to the acoustic transducer, the vibration assembly being configured to transmit an external vibration signal to the acoustic transducer to generate an electrical signal, the vibration assembly including one or more groups of vibration diaphragms and weight blocks, and the weight blocks being physically connected to the vibration diaphragms. At the same time, the vibration unit is designed so that the degree of sensitivity of the vibration sensor is greater than the degree of sensitivity of the acoustic transducer in one or more target frequency ranges. Each group of the specified one or more groups of vibrating diaphragms and weight blocks corresponds to one of the specified one or more different target frequency ranges, so that the degree of sensitivity of the vibration sensor is greater than the degree of sensitivity of the acoustic transducer in the corresponding target range and the resonant frequencies of at least two groups of said one or more groups of vibrating diaphragms and weight blocks are different.

EFFECT: increase in the degree of sensitivity to vibrations.

8 cl, 6 dwg

Description

The technical field to which the invention belongs

The present disclosure relates generally to the field of sensors, and in particular to a vibration sensor including a vibration assembly.

State of the art

The vibration sensor is an energy conversion device that converts vibration signals into electrical signals. It can be used as a microphone (such as an air conduction microphone, a bone conduction microphone, etc.) or a test device, etc. The vibration sensor can receive data such as amplitudes and directions of vibrations and convert them into electrical signals or other forms necessary for further analysis and processing.

The present disclosure provides a vibration sensor whose sensitivity can be increased without any transducer.

Disclosure of the essence of the invention

One embodiment of the present disclosure provides a vibration sensor including: an acoustic transducer and a vibration assembly connected to the acoustic transducer. The vibration assembly may be configured to transmit an external vibration signal to an acoustic transducer to generate an electrical signal, the vibration assembly includes one or more groups of vibration diaphragms and weight blocks, wherein the weight blocks may be physically connected to the vibration diaphragms. The vibration assembly may be configured such that the degree of sensitivity of the vibration sensor is greater than the degree of sensitivity of the acoustic transducer in one or more target frequency ranges.

In some embodiments, the implementation of the specified one or more groups of vibrating diaphragms and weight blocks can be arranged in order in the direction of vibration of the vibrating diaphragms. The distance between adjacent vibration diaphragms in the vibration assembly is not less than the maximum amplitude of neighboring vibration diaphragms.

In some embodiments, the projection area of the weight blocks may be located within the projection area of the vibration diaphragms in the vibration direction of the vibration diaphragms.

In some embodiments, each group of said one or more groups of vibrating diaphragms and weight blocks corresponds to one of said one or more different target frequency ranges such that the sensitivity of the vibration sensor may be greater than the sensitivity of the acoustic transducer in the respective target range.

In some embodiments, the resonant frequency of said one or more sets of vibrating diaphragms and weight blocks may be less than the resonant frequency of the vibration sensor, such that the degree of sensitivity of the vibration sensor may be greater than the degree of sensitivity of the acoustic transducer in said one or more target frequency ranges.

In some embodiments, the difference between the resonant frequency of the specified one or more groups of vibrating diaphragms and weight blocks and the resonant frequency of the acoustic transducer may be from 1 kHz to 10 kHz.

In some embodiments, the implementation of the resonant frequencies of at least two groups of the specified one or more groups of vibrating diaphragms and weight blocks may be different.

In some embodiments, among the resonant frequencies of the vibrating diaphragm groups and weight blocks, the difference between two adjacent resonant frequencies may be less than 2 kHz.

In some embodiments, among the resonant frequencies of the vibrating diaphragm groups and weight blocks, the difference between two adjacent resonant frequencies may be no greater than 1 kHz.

In some embodiments, the implementation of the resonant frequencies of the specified one or more groups of vibrating diaphragms and weight blocks may be in the range from 1 kHz to 10 kHz.

In some embodiments, the resonant frequencies of said one or more groups of vibrating diaphragms and weight blocks may be in the range of 1 kHz to 5 kHz.

In some embodiments, the resonant frequencies of the specified one or more groups of vibrating diaphragms and weight blocks can be associated with the parameters of the vibrating diaphragms and/or weight blocks, and the parameters include the elastic modulus of the vibrating diaphragm, the volume of the cavity formed between the acoustic transducer and the vibrating diaphragm, the radius of the weight block, at least one of the height or density of the weight block.

In some embodiments, the implementation of the modulus of elasticity of the vibrating diaphragm may be in the range from 1 GPa to 10 GPa.

In some embodiments, the weight block radius may be in the range of 500 µm to 3 mm.

In some embodiments, the implementation of the amplitude-frequency response of the vibration sensor under the specified one or more groups of vibrating diaphragms and weight blocks may have many resonant peaks.

In some embodiments, the vibration assembly further includes a support structure configured to support said one or more groups of vibrating diaphragms and weight blocks, wherein the support structure may be physically coupled to the acoustic transducer, said one or more groups of vibrating diaphragms and weight blocks may be connected to the supporting structure.

In some embodiments, the implementation of the support structure may be made of airtight material.

In some embodiments, in a direction perpendicular to the surface of the vibratory diaphragm connected to the weight block, the projection area of the weight block does not overlap with the projection area of the support structure.

In some embodiments, the weight blocks may be centered on the vibrating diaphragms.

In some embodiments, the diaphragms are designed to allow air to pass through.

In some embodiments, among vibrating diaphragms, the vibrating diaphragm furthest from the acoustic transducer may be designed such that no air can pass through. In some embodiments, vibratory diaphragms may be provided with a through hole.

In some embodiments, vibrating diaphragms include a breathable diaphragm.

In some embodiments, the vibration diaphragms include at least one of polytetrafluoroethylene, expanded polytetrafluoroethylene, polyethersulfone, polyvinylidene fluoride, polypropylene, polyethylene terephthalate, nylon, pyroxylin, or blended cellulose.

In some embodiments, the implementation of the vibration node further includes a restrictive structure; the bounding structure can be configured such that the distance between adjacent vibration diaphragms in the vibration assembly is not less than the maximum amplitude of adjacent vibration diaphragms.

In some embodiments, the acoustic transducer may be an air conduction microphone; the resonant frequencies of said one or more target frequency bands may be tuned 1-10 kHz lower than the resonant frequency of the air conduction microphone.

In some embodiments, the air conduction microphone includes a sound receiving opening, wherein said one or more sets of vibrating diaphragms and weight blocks may be located in the sound receiving opening parallel to a radial section of the sound receiving opening; or outside the sound opening.

In some embodiments, the weight blocks are not in contact with the inner wall of the sound receiving opening.

One embodiment of the present disclosure provides an audio input device including a vibration sensor according to any of the above embodiments.

Brief description of the drawings

The present disclosure is further described in terms of exemplary embodiments. These exemplary embodiments are described in detail with reference to the drawings. These embodiments are non-limiting exemplary embodiments in which like reference numerals represent like structures in several of the drawings, in which:

fig. 1 is a schematic diagram illustrating a vibration sensor according to some embodiments of the present disclosure;

fig. 2 is a schematic diagram illustrating the structure of a vibration sensor according to some embodiments of the present disclosure;

fig. 3 is a schematic diagram illustrating the structure of a vibration sensor according to some embodiments of the present disclosure;

fig. 4 is a schematic diagram illustrating a vibration assembly according to some embodiments of the present disclosure;

fig. 5 - amplitude-frequency characteristics of vibration according to some embodiments of the present disclosure; And

fig. 6 is a schematic diagram illustrating the structure of a vibration sensor according to some embodiments of the present disclosure.

Implementation of the invention

In order to illustrate the technical solutions of the embodiments of the present disclosure, a brief introduction is provided below with reference to the drawings used to describe the embodiments. Obviously, the drawings described below are only some examples or embodiments of the present disclosure. Those of ordinary skill in the art can apply the present disclosure to other similar scenarios in accordance with these drawings without further creative effort. It should be understood that the illustrative embodiments are provided only for the better understanding and application of the present disclosure by those skilled in the art and are not intended to limit the scope of the present disclosure. Unless it is obvious from the context or specifically shown, the same reference numeral in the drawings refers to the same structure or operation.

As used herein, the singular forms may also mean the inclusion of plural forms, unless the context clearly indicates otherwise. In addition, it should be understood that as used in this description, the terms "comprise", "comprises" and/or "comprising", "include", "includes" and/or "including" indicate the presence of the claimed features, integers, steps, operations, elements and/or nodes, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, nodes and/or groups thereof. The term "based on" means "at least partially based on". The term "embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one other embodiment". Appropriate definitions of other terms may be given in the following description.

In some embodiments, when a vibration sensor is used as a microphone (eg, air conduction microphone, bone conduction microphone, etc.), the device used to convert the vibration into electrical signals may include an acoustic transducer. As a rule, one acoustic transducer can have only one resonant peak, and the acoustic transducer has a higher degree of sensitivity only near the frequency of the resonant peak. In some embodiments, to increase the sensitivity of the vibration sensor, a plurality of acoustic transducers with different resonant peaks may be provided to increase the frequency reception range and the degree of sensitivity. However, an increase in the number of acoustic transducers can lead to an increase in the volume and cost of manufacturing a vibration sensor.

Based on this, the present disclosure includes a vibration sensor. Due to the vibration unit connected to the acoustic transducer, the degree of sensitivity of the vibration sensor in the target frequency range can be higher than that of the acoustic transducer. A vibration sensor may be used to receive an external vibration signal and convert the vibration signal into an electrical signal that can reflect sound information. The external signal may include a mechanical vibration signal or an acoustic signal. Vibrating assemblies may include one or more groups of vibrating diaphragms and weight blocks that are physically connected to each other. The vibration assemblies can be tuned to one or more target frequency ranges so that the sensitivity of the vibration sensor is greater than that of the acoustic transducer.

As shown in FIG. 1, vibration sensor 100 may include an acoustic transducer 120 and a vibration assembly 130. In some embodiments, acoustic transducer 120 may be coupled to vibration assembly 130, and vibration assembly 130 may be configured to transmit external vibration signals to the acoustic transducer to generate electrical signals. When vibration occurs in the environment, the vibration assembly 130 can respond to the vibration and transmit the vibration signal to the acoustic transducer 120, and then the vibration signal can be converted by the acoustic transducer 120 into an electrical signal. The vibration sensor 100 can be applied to mobile devices, wearable devices, virtual reality devices, augmented reality devices, and so on. or any combination thereof. In some embodiments, mobile devices may include smartphones, tablet computers, personal digital assistants (PDAs, PDAs), gaming devices, navigation devices, and so on. or any combination of them. In some embodiments, wearable devices may include smart bracelets, headphones, hearing aids, smart helmets, smart watches, smart clothes, smart backpacks, smart accessories, and so on. or any combination of them. In some embodiments, virtual reality devices and/or augmented reality devices may include virtual reality headsets, virtual reality goggles, virtual reality patches, augmented reality helmets, augmented reality glasses, augmented reality patches, or any combinations thereof. For example, virtual reality devices and/or augmented reality devices may include Google Glass, Oculus Rift, HoloLens, Gear VR, etc.

As shown in FIG. 1, the vibration assembly 130 may include a vibration diaphragm 131 and a weight block 132. The weight block 132 may be physically coupled to the vibration diaphragm 131. The vibration assembly 130 may be configured such that the sensitivity levels of the vibration sensor 100 are higher than the sensitivity degree acoustic transducer 120 in one or more target frequency bands.

In some embodiments, one or more groups of vibration diaphragms 131 and weight blocks 132 may be arranged in order along the direction of vibration of the vibration diaphragms 131; and the distance between adjacent vibration diaphragms 131 in vibration assembly 130 may be no less than the maximum amplitude of adjacent vibration diaphragms 131. In some embodiments, diaphragms 131 may be air-permeable.

In some embodiments, each of the groups of vibration diaphragms 131 and weight blocks 132 may correspond to one of one or more different target frequency ranges, so the degree of sensitivity of the vibration sensor 100 in the corresponding specified frequency range may be greater than the degree of sensitivity of the acoustic transducer 120. In some embodiments, with one or more groups of weight blocks 132 and vibrating diaphragms 131, the sensitivity of the vibration sensor 100 in the target frequency ranges can be increased by 2 dB to 30 dB compared to the sensitivity of the acoustic transducer 120. It should be noted that in some embodiments, after By adding one or more groups of weight blocks 132 and vibrating diaphragms 131, the degree of sensitivity of the vibration sensor 100 can increase by more than 30 dB compared to the degree of sensitivity of the acoustic transducer 120, if the groups of weight blocks 132 and vibrating diaphragms 131 have the same resonant peak.

In some embodiments, the measurement mode of the sensitivity values of the vibration sensor 100 and the acoustic transducer 120 may include the following: under the influence of a fixed acceleration (for example, 1g, g is the acceleration of gravity) and with a selected electrical signal (for example, -30 dBV), the degree sensitivity can be -30 dBV/g. In some embodiments, if the acoustic transducer 120 is an air conduction microphone, the above excitation source can be replaced by sound pressure when measuring the degree of sensitivity, i.e. sound pressure in a given frequency range can be entered as an excitation, and the electrical signal of the capturing device can be measured. .

In some implementations, the frequency response of vibration sensor 100 may have multiple resonant peaks influenced by one or more groups of weight blocks 132 and vibration diaphragms 131.

In some embodiments, the resonant frequencies of one or more groups of weight blocks 132 and vibrating diaphragms 131 may be in the range of 1~10 kHz. In some embodiments, the resonant frequencies of one or more groups of weight blocks 132 and vibrating diaphragms 131 may be in the range of 1~5 kHz. In some embodiments, the resonant frequencies of at least two groups of weight blocks 132 and vibrating diaphragms 131 in a plurality of groups of weight blocks 132 and vibrating diaphragms 131 may be different. In some embodiments, the difference between two adjacent resonant frequencies among the resonant frequencies of the plurality of groups of weight blocks 132 and vibrating diaphragms 131 may be less than 2 kHz. Two adjacent vibration frequencies refer to two resonant frequencies with adjacent dimensions. Since the degree of sensitivity corresponding to the frequency of the vibration sensor 100 beyond the resonant frequency will quickly decrease, by controlling the difference of the resonant frequencies, the vibration sensor 100 can have a relatively high degree of sensitivity over a wider frequency range, while the degree of sensitivity will not change much. . In some embodiments, the difference between two adjacent resonant frequencies among the resonant frequencies of the groups of weight blocks 132 and vibrating diaphragms 131 may be no more than 1.5 kHz. In some embodiments, the difference between two adjacent resonant frequencies among the resonant frequencies of weight block groups 132 and vibrating diaphragms 131 may be no more than 1 kHz, such as 500 Hz, 700 Hz, or 800 Hz, etc. In some embodiments, the difference between two adjacent resonant frequencies among the resonant frequencies of the groups of weight blocks 132 and vibrating diaphragms 131 may be no more than 500 Hz.

In some embodiments, vibratory diaphragm 131 may include a breathable diaphragm. A further description of the vibration assembly can be found in FIG. 2-6.

In FIG. 2 is a schematic representation of a vibration sensor according to some embodiments of the present disclosure.

The vibration sensor 200 described in FIG. 2 may be an embodiment of the vibration sensor 100 shown in FIG. 1. In some embodiments, vibration sensor 200 may include an acoustic transducer 220 and a vibration assembly 230. Acoustic transducer 220 may include an air conduction microphone. The air conduction microphone can detect a change in sound pressure in a sound receiving area (eg, in the sound receiving hole 211) and convert the change in sound pressure into an electrical signal. For ease of description, in the following description, the acoustic transducer may be described as an air conduction microphone. It should be noted that in some other embodiments, the implementation of the acoustic transducer may be in another form, such as a liquid microphone and a laser microphone.

Referring to FIG. 2, in some embodiments, the air conduction microphone may include a shell structure 210 and a sound pickup 211. In some embodiments, the sound pickup 211 may include a capacitive type transducer, a piezoelectric type transducer, and so on. according to the principle of transduction, which is not limited to the present disclosure.

In some embodiments, the shape of the shell structure 210 may be rectangular, approximately rectangular, cylindrical, spherical, or any other shape. The shell structure 210 may include an accommodation cavity, and a sound receiver 211 may be located in the accommodation cavity. In some embodiments, the sound receiver 211 and the shell structure 210 may be physically connected. In particular, the method of physical connection may include welding, clamping, connection or integrated formation, etc., which is not limited to the present description. In some embodiments, the shell structure 210 may be made of a material with a certain hardness, so that the shell structure 210 may protect the sound receiver 211 and internals. In some embodiments, the shell structure material 210 may include, but is not limited to, one or more of: metal, an alloy based material (such as aluminum alloy, chromium molybdenum steel, cashmere alloy, magnesium alloy, titanium alloy, magnesium lithium alloy , nickel alloy, etc.), glass fiber or carbon fiber, polymeric material (for example, acrylonitrile butadiene styrene cluster, polyvinyl chloride, polycarbonate, polypropylene, etc.).

In some embodiments, the shell structure 210 may be provided with a sound receiving opening 211. In some embodiments, the vibration assembly 230 may be located adjacent the sound receiving opening 211 of the shell structure 210. In some embodiments, one or more sets of vibrating diaphragms and weight blocks may be located outside sound receiving hole. In some embodiments, vibration assembly 230 may be physically coupled to the shell structure. In particular, physical connection methods may include welding, clamping, gluing or integral molding, etc., and no limitation is made herein. It should be noted that in some embodiments, one or more groups of vibrating diaphragms and second generation weight blocks may be located in the sound receiving hole parallel to the radial section of the sound receiving hole. For specific information, reference is made to FIG. 5 and the corresponding description below.

In some embodiments, when the vibration sensor 200 is used for an air conduction sound head, when the external environment creates vibration (e.g., sound waves), one or more groups of vibrating diaphragms and weight blocks located on the vibrating diaphragms may vibrate in response to vibrations of the external environment. Because the vibrating diaphragms are air permeable, the vibrations generated by the vibrating diaphragms and weight blocks, together with external vibration signals (such as sound waves), can cause a change in the internal pressure (or air vibration) in the sound receptor 211, so that the vibration signals can be transmitted to the sound receiver. 221 through the sound receiving hole 211, and the vibration signals can be converted into electrical signals to realize the process of converting the vibration signals into electrical signals after being amplified in one or more target frequency bands. The target frequency range may be a frequency range of a resonant frequency corresponding to the group of the vibrating diaphragm and the weight block. For example, when the vibration sensor 200 is used as a microphone, the target frequency range may be 200Hz~2kHz. In particular, in some embodiments, if the resonant frequency of the acoustic transducer is 2 kHz, the resonant frequency of the vibration assembly 230 may be set to 1 kHz.

In some embodiments, when the vibration transducer 200 is used for a bone conduction sound head, a conductive sheath may be located on the outside of the sound receiving opening 211, the acoustic transducer 220 and the conductive sheath may comprise an accommodative cavity, and one or more sets of vibrating diaphragms and weights. blocks can be located in the accommodation cavity. In some embodiments, a vibrating assembly (eg, vibrating parts) may be physically connected to the shell. When the vibration is generated in the external environment, the vibration can be transmitted through the conductive sheath and cause the vibration assembly to vibrate. The vibration of the vibration assembly may cause the air in the accommodation cavity to vibrate, and the vibration of the vibration diaphragms and weight blocks, together with the vibration signals in the accommodation cavity, may be transmitted to the sound receiver 211 through the sound receiving hole 211.

As shown in FIG. 2, in some embodiments, vibration sensor 200 may include three groups of vibration diaphragms and weight blocks. In particular, the three groups of vibrating diaphragms and weight blocks may have different resonant frequencies. Each group of vibrating diaphragm and weight block can resonate at different vibration frequencies in external vibration signals, therefore, in the audio signals received by the vibration sensor 200, the degree of sensitivity of the acoustic transducer 220 in the three target frequency bands can be higher than the degree of sensitivity of the acoustic transducer 220. It should be noted that in some embodiments, multiple groups of vibrating diaphragms and weight blocks may have the same resonant frequency in order to significantly increase the degree of sensitivity in the target frequency range. For example, when the vibration sensor 200 is used to test mechanical vibrations in the range of 5 kHz to 5.5 kHz, the resonant frequencies of multiple groups of vibrating diaphragms and weight blocks can be represented as values within the test range (for example, 5.3 kHz), so the vibration sensor 200 can have a higher degree of sensitivity over the test range as compared to a situation where only one group of vibration diaphragms and weight blocks is placed in the vibration sensor. It should be noted that the number of groups of vibrating diaphragms and weight blocks shown in FIG. 2 is for purposes of illustration only, which is not to limit the scope of the present disclosure. For example, the number of groups of vibrating diaphragms and weight blocks can be one, two, four, etc.

In some embodiments, when vibrating assembly 230 has a plurality of vibrating diaphragms, the vibrating diaphragm furthest from acoustic transducer 220 may be airtight. As shown in FIG. 2, the third vibratory diaphragm 2313 may not be air-permeable. With this arrangement method, the third vibration diaphragm 2313 and the acoustic transducer 220 can form an enclosed space that can better respond to vibration information. It should be noted that in some embodiments, the vibrating diaphragm furthest from the acoustic transducer 220 may be air permeable. For example, by arranging the conductive sheath outside the sound receiving opening 211, the conductive sheath and the acoustic transducer 220 can enclose an accommodation cavity, and the air in the space can ideally respond to vibration information.

In FIG. 3 is a schematic diagram illustrating a vibration sensor according to some embodiments of the present disclosure.

As shown in FIG. 3, in some embodiments, the vibration assembly 330 in the vibration sensor 300 may consist of a single group of vibration diaphragm 331 and a weight block 132 that are connected to the sound sensor 320 via a support structure 333. In particular, the weight block 332 may be physically connected to the vibration diaphragm. 331, and the weight block 332 may be positioned outside the vibration diaphragm 331. In some embodiments, the weight block 332 may resonate simultaneously with the vibration of the external environment. The resonance generated by the vibration diaphragm 331 and the weight block 332 and the external vibration signal can be transmitted to the acoustic transducer 320, thereby increasing the degree of sensitivity near the resonant frequency of the vibration assembly 330 and realizing the process of converting the vibration signal after amplification within the target frequency range into an electrical signal.

In some embodiments, since the vibration sensor 300 includes only one group of the vibration diaphragm 331 and the weight block 132 to provide a better sound perception effect, in some embodiments, the vibration diaphragm 331 may be impermeable.

In some embodiments, the resonant frequency of each group of vibrating diaphragm and weight block may be associated with parameters of the vibrating diaphragm and/or weight block. The parameters may include modulus of elasticity of the vibrating diaphragm, the volume of the cavity formed between the acoustic transducer and the vibrating diaphragm, the radius of the weight block, the height of the weight block, the density of the weight block, etc. or any combination of them. In particular, the mathematical relationship between the resonant frequency and the parameters can be specified in the corresponding description of Equation 1 in the present disclosure.

Referring to FIG. 2, in an embodiment, the vibration assembly 230 may include a first vibration diaphragm 2311, a second vibration diaphragm 2312, and a third vibration diaphragm 2313 arranged in order along the vibration direction. The weight block may include a first weight block 2321, a second weight block 2322, and a third weight block 2323 which are arranged in order along the vibration direction, the first vibration diaphragm 2311 may be connected to the first weight block 2321, the second vibration diaphragm 2312 may be connected to the second weight block 2322, the third vibration diaphragm 2313 may be connected to the third weight block 2323, and the third vibrator 2313 may not be less than the maximum amplitude of two adjacent vibration diaphragms, so that the vibration diaphragm does not interfere with the neighboring vibration diaphragm during vibration, which affects vibration signal transmission effect. In some embodiments, when vibrating assembly 230 includes a plurality of vibrating diaphragm groups and weight blocks, the vibrating diaphragms may be perpendicular to the direction of vibration of the vibrating diaphragms. In some embodiments, the distances between adjacent vibration diaphragms may be the same or different. In some embodiments, the vibratory diaphragm may form a plurality of cavities with adjacent vibratory diaphragms, the plurality of cavities and the vibratory diaphragm may contain air and allow the vibratory diaphragm to vibrate within the plurality of cavities.

In some embodiments, vibration assembly 230 may further include a bounding structure (not shown in the figure) that is configured to ensure that the distance between adjacent vibration diaphragms in the vibration assembly is not less than the maximum amplitude of two adjacent vibration diaphragms. In some embodiments, the implementation of the bounding structure can be connected to the edge of one of the two adjacent vibrating diaphragms, and by controlling the damping of the limiting structure, the restricting structure will not interfere with the vibration of the diaphragm.

In some embodiments, a plurality of weight blocks may be included in a plurality of groups of vibration assemblies 230, and a plurality of weight blocks may be located on both sides of the vibration diaphragm. For example, assuming a group of vibrating assemblies includes two weight blocks, two weight blocks can be arranged symmetrically on both sides of the vibrating diaphragm. In some embodiments, the implementation of the weight blocks in multiple groups of vibrating nodes 230 may be located on the same side of the vibrating diaphragms. The weight blocks may be located on the outer sides or inner sides of the vibrating diaphragms, with the side of the vibrating diaphragm close to the acoustic transducer 220 being the inner side and the side away from the acoustic transducer 220 being the outer side. It should be noted that in some embodiments, the weight blocks in the plurality of vibration assembly groups may be located on opposite sides of the vibration diaphragm, for example, the first weight block 1321 and the second weight block 2322 may be located on the outside of the respective vibration diaphragm, while the third weight block 2323 can be located on the inside of a suitable vibrating diaphragm.

In some embodiments, the implementation of the vibrating diaphragm may be made in the form of a thin structure, similar to the diaphragm, which allows air to pass through. In some embodiments, the vibration diaphragm may be a breathable diaphragm. The vibration diaphragm may be air-permeable, so the vibration signals may cause the vibration assembly 230 to vibrate, and the vibration signals may further penetrate the air-permeable diaphragm and be received by the acoustic transducer, thereby increasing the degree of sensitivity in the target frequency range. In some embodiments, the vibratory diaphragm material may be a material capable of generating elastic deformation within a certain range. In particular, the diaphragm may be made from at least one or more of the following materials: polytetrafluoroethylene (PTFE), expanded polytetrafluoroethylene (EPTFE), polyethersulfone (PES), polyvinylidene fluoride (PVDF), polypropylene (PP), polyethylene terephthalate (PETE), nylon , nitrocellulose (NC) and mixed cellulose (MCE), etc. or their combination. In some embodiments, the vibratory diaphragm and the weight block may be connected by clamping, gluing, or integrated formation, etc., and no limitation is made herein. In some embodiments, the thickness of the vibrating diaphragm may range from 0.05 µm to 100 µm. In particular, the thickness of the vibration diaphragm may be related to the material of the vibration. For example, if the vibration diaphragm includes expanded polytetrafluoroethylene (EPTFE), the thickness of the vibration diaphragm may be in the range of 0.5 µm to 100 µm. Preferably, the thickness of the EPTFE diaphragm may be in the range of 1 µm to 10 µm, such as 2 µm, 5 µm, 7 µm, etc. In some embodiments, the minimum permeability of the EPTFE diaphragm may preferably be no less than 10 L/h to ensure good breathability. At the same time, the EPTFE diaphragm additionally provides a certain degree of water tightness to protect the internal components. In some embodiments, other breathable materials may also be selected whose modulus of elasticity is 1 GPa~10 GPa, or 1/10 or 1% of the modulus of elasticity of the sensing element 222 in the acoustic transducer 220, which are not listed here. The sensing element refers to a device used to receive vibration signals in the acoustic transducer 220. In some embodiments, the materials and dimensions of the plurality of vibration diaphragms in the vibration assembly 230 may be different or the same. For example, the first vibrating diaphragm 2311 may be made of nylon and the second vibrating diaphragm 2312 may be made of EPTFE materials. The radius of the third vibration diaphragm 2313 may be greater than the radius of the first vibration diaphragm 2311 and the radius of the second vibration diaphragm 2312.

In some embodiments, when the vibration diaphragm is designed to be airtight, the vibration diaphragm may be a polymeric film such as a film of polyurethanes, epoxies, acrylics, etc., or the vibration diaphragm may be a metal film such as a film copper, aluminium, tin or other alloys and composite film. In some embodiments, the implementation of the vibrating diaphragm can be further obtained by processing the aforementioned breathable diaphragm (for example, closing the breathing holes).

In some embodiments, the implementation of the vibrating diaphragm may be a thin film with through holes. In particular, the aperture of the through holes may be in the range of 0.01 µm to 10 µm. Preferably, the opening of the through holes may be in the range of 0.1 µm to 5 µm, such as 0.2 µm, 0.5 µm, 0.8 µm, 1 µm, 2 µm, etc. In some embodiments, the diameters of the through holes in the plurality of vibrating diaphragms of the vibrating assembly 230 may be the same or different, and the diameters of the through holes in a single vibrating diaphragm may also be the same or different. In some embodiments, the aperture of the through holes may be greater than 5 microns. When the aperture is larger than 5 µm, other materials (such as silicone, etc.) may be applied to the vibrating diaphragm to cover the through hole part or the through hole part, as long as the air permeability is not affected.

In some embodiments, the material of the weight blocks may be one or more alloys of copper, tin, or other alloys and their composite materials. In some embodiments, the vibration sensor 200 may be used in the construction of a MEMS device. In the MEMS device process, the vibrating diaphragm may be made of a single layer material along the thickness direction of the vibrating diaphragm, such as Si, SiO ₂ , SiN _x , SiC, etc., or may be made of a two-layer material or a more multilayer composite material, such as Si/SiO ₂ , SiO ₂ /Si, Si/SiN _x , SiN _x /Si/SiO ₂ etc. The weight block may be made of a single layer material such as Si, Cu, etc., or the weight block may be made of a two layer or multilayer composite material such as Si/SiO ₂ , SiO ₂ /Si, Si/SiN _x , SiN _x /Si/SiO ₂ etc.

In some embodiments, vibratory assembly 230 may further include a support structure 233 that is used to support one or more sets of vibrating diaphragms and weight blocks. Support structure 233 may be physically coupled to acoustic transducer 220 (e.g., shell structure 210), and one or more sets of vibrating diaphragms and weight blocks may be coupled to support structure 233. In particular, support structure 233 and shell structure 210 may be physically connected. The physical connection method may include clamping, gluing or integral molding, etc. In some embodiments, the support structure 233 and the shell structure 210 may preferably be bonded together, and the bonding material may include, but is not limited to, epoxy and silica gel.

In some embodiments, the support structure may be further connected to the support structure 233 to provide a fixed support to control the distances between adjacent vibration diaphragms, thereby providing a vibration signaling effect.

In FIG. 4 is a schematic diagram illustrating a vibration assembly according to some embodiments of the present disclosure.

Referring to FIG. 2 and FIG. 4, in some embodiments, one or more groups of vibration diaphragms and weight blocks of the vibration assembly may be located in the space surrounded by the support structure 233 and physically connected to the support structure 233. In particular, the physical connection method may include clamping, gluing, and etc. Preferably, the physical bonding method may include bonding, and the bonding material may include, but is not limited to, epoxy adhesive and silica gel. In some embodiments, the support structure 233 may be a hollow tubular structure with holes at both ends, and the cross section of the tubular structure may be rectangular, triangular, circular, or other shape. In some embodiments, the cross-sectional areas of the tubular structure at different locations may be the same or may be different. For example, the end of the tubular structure near the acoustic transducer 220 may have a large cross-sectional area. In some embodiments, one set of vibrating diaphragms and weight blocks in vibrating assembly 230 may be installed in an opening in support structure 233.

In some embodiments, the vibratory diaphragm may be located on the inner wall of the support structure 233 or embedded in the support structure 233. In some embodiments, the vibratory diaphragm may vibrate in space within the support structure 233 and may completely block the open end of the support structure, i.e., the area of the vibrating diaphragm may be greater than or equal to the opening area of the support structure, so that the air vibration (for example, sound waves) in the external environment is able to pass through the vibration diaphragm as completely as possible, and then the sound pickup device 221 can pick up vibrations, thereby effectively improving the quality of sound perception.

In some embodiments, the implementation of the support structure 233 may be made of airtight material. In the process of transmitting vibration signals in air, the support structure 233 made of airtight material may cause changes in sound pressure (or air vibration) inside the support structure 233, so the internal vibration signals of the support structure 233 can be transmitted to the acoustic transducer 220 through the sound receiving hole 211 and not out through the support structure 233, thereby providing the sound pressure force and enhancing the transmission effect. In some embodiments, support structure 233 may include, without limitation, one or more metals, alloys (such as aluminum alloy, chromium molybdenum steel, cashmere alloy, magnesium alloy, titanium alloy, magnesium lithium alloy, nickel alloy, etc. .), thermoset plastic, bubble wrap, foam, etc.

Referring to FIG. 4, in some embodiments, in the direction of vibration of the vibration diaphragm, the projection area of the weight block may be located within the projection area of the vibration diaphragm, that is, in a parallel direction to the surface of the weight block connected to the vibration diaphragm (i.e., perpendicular to the direction of vibration), the cross-sectional area of the weight block may be smaller than the cross-sectional area of the vibrating diaphragm. Together with reference to FIG. 2, for example, the first weight block 2321 may be located within the projection area of the first vibration diaphragm 2311; the second weight block 2322 may be located within the projection area of the second vibration diaphragm 2312, and the third weight block 2323 may be located within the projection area of the third vibration diaphragm 2313. Provided that the cross-sectional area of the weight block is less than the cross-sectional area of the vibration diaphragm , the weight block cannot interfere with the vibration of the vibrating diaphragm.

In some embodiments, in a direction perpendicular to the surface of the weight block coupled to the vibration diaphragm (i.e., perpendicular to the direction of vibration), the projection area of the weight block and the projection area of the support structure may not overlap, thereby avoiding the vibration of the vibration diaphragm and the weight block being constrained by the support structure. 233.

In some embodiments, the shape of the vibrating diaphragm may include a circle, rectangle, triangle, or irregular shape, etc. In some embodiments, the implementation of the vibrating diaphragm may be shaped to match the shapes of the support structure or tube, which is not limited to the present disclosure. In some embodiments, the weight block may be in the form of a cylinder, truncated cone, round cone, cube, triangle, etc., and the size and material of the weight block can be found elsewhere in this disclosure, which is not limited to this disclosure.

In some embodiments, when the weight block or vibrating diaphragm has a circular outer contour, the weight block may be placed to be centered on the vibrating diaphragm. When the weight block having a common center with the vibration diaphragm vibrates, the kinetic energy can be evenly dissipated on the vibration diaphragm, so the vibration diaphragm can better respond to the vibration. In some embodiments, the implementation of the weight block can be performed in other positions of the vibrating diaphragm, such as an eccentric position. An eccentric position means that the weight block is located so that its center does not coincide with the center of the vibrating diaphragm. Preferably, the eccentric distance between the weight block and the vibrating diaphragm should not exceed 50 µm. In some embodiments, the resonant frequencies of one or more groups of vibrating diaphragms and weight blocks may be less than the resonant frequency of the acoustic transducer, so the degree of sensitivity of the vibration sensor in one or more target frequency bands may be greater than the degree of sensitivity of the acoustic transducer. In some embodiments, the dependence of the resonant frequency on the degree of sensitivity of the vibrating diaphragm and the weight block and the acoustic transducer can be plotted on the frequency resonance curve of the vibration sensor in FIG. 5.

In particular, in some embodiments, the resonant frequencies of a plurality of groups of weight blocks and vibrating diaphragms may be at 1 kHz ~ 10 kHz, such as at 2 kHz, 3 kHz, 5 kHz, or 7.5 kHz, etc. lower than the resonant frequency of the acoustic transducer so that the overall sensitivity of the vibration sensor can be increased. In some embodiments, when the acoustic transducer is an air conduction microphone in the above embodiments, the plurality of weight block groups and vibration diaphragms may be configured such that the degree of sensitivity of the vibration sensor is greater than the degree of sensitivity of the acoustic transducer in one or more target ranges. frequencies. The resonant frequencies of one or more target frequency bands can be tuned 1-10 kHz lower than the resonant frequency of the air conduction microphone. In particular, the resonant frequencies of the plurality of groups of weight blocks and vibrating diaphragms may be at 1.5 kHz, 2 kHz, 3 kHz, or 5 kHz, etc. lower than the resonant frequency of an air conduction microphone.

In FIG. 5 shows the frequency response of a vibration sensor according to some embodiments of the present disclosure.

As shown in FIG. 5, in some embodiments, the frequency response of a vibration sensor when exposed to one or more groups of vibrating diaphragms and weight blocks may have multiple resonant peaks. On the figure f ₁ , f ₂ and f ₃ are the resonant peaks of groups of weight blocks and vibrating diaphragms, f ₀ is the resonant peak of the acoustic transducer. In some embodiments, each of one or more groups of vibrating diaphragms and weight blocks corresponds to a target frequency range from one or more different target frequency ranges, such that the sensitivity of the vibration sensor in the corresponding target frequency band becomes greater than the sensitivity of the acoustic transducer. In the figure, the solid line represents the frequency response 500 of the vibration sensor after the weight block groups and vibration diaphragms have been added. After adding one or more groups of vibrating diaphragms and weight blocks whose resonant frequencies are less than the resonant frequency of the acoustic transducer, one or more resonant peaks of the vibration sensor can be added, respectively.

It can be seen from the figure that the frequency response of the vibration sensor 500 has 4 resonant peaks, and the degree of sensitivity of the vibration sensor has at least increased by ΔS compared to the acoustic transducer. At the same time, the frequency response of the acoustic transducer (that is, the curve on which the resonant peak is located) additionally shows that the vibration sensor has a higher degree of sensitivity in the frequency band f ₁ ~f ₃ and the bandwidth of the high sensitivity vibration sensor is increased by vibration diaphragms and weight blocks, which allows the vibration sensor to more sensitively receive vibration signals over a larger frequency range. Compared with the method of adding multiple groups of acoustic transducers with different resonant peaks to increase the received frequency range, the method of adding vibrating diaphragms and weight blocks can reduce the overall volume of the device, reduce the cost, and make it more powerful based on higher integration.

For example, the 3 groups of vibrating diaphragms and weight blocks in FIG. 4 can be taken as an example. The respective resonant frequencies of the resonant peaks of the 3 groups of vibrating diaphragms f ₁ , f ₂ and f ₃ can be 1.5 kHz, 2 kHz and 2.5 kHz. In some embodiments, with this setting, the vibration sensor can achieve a better ability to pick up sound, in particular, can better receive audio information in the corresponding frequency range of voices.

In some embodiments, the implementation of the resonant frequencies of one or more groups of vibrating diaphragms and weight blocks can be associated with the parameters of the vibrating diaphragms and/or weight blocks. The parameters may include modulus of elasticity of the vibratory diaphragm, the volume of the cavity formed between the vibratory diaphragm and the weight block, the radius of the weight block, at least one of the height or density of the weight block. In some embodiments, the relationship between the resonant frequency and the degree of sensitivity of a plurality of groups of vibrating diaphragms and weight blocks can be expressed as:

(S,f) = g(K _film , K _foam , V _cavity , R _m , h _m , ρ _m ) …(1)

where S is the degree of sensitivity of the vibration sensor after tuning the vibration unit, f is the resonant frequency of the vibration unit, K _film is the rigidity of the vibration diaphragm, K _foam is the rigidity of the support structure, V _cavity is the volume of the cavity, R _m is the radius of the weight block, h _m is the height of the weight block, and ρ _m is the density of the weight block. The cavity volume is the volume of space formed between the sensing element 222 on the sound receiver 221 and the vibrating diaphragm of the vibrating assembly 230 closest to the sensing element 222 (such as the first vibrating diaphragm 2311 in FIG. 2).

In particular, in some embodiments, the implementation of the degree of sensitivity S decreases with increasing rigidity K _film of the diaphragm and decreases with increasing rigidity of the support structure. With an increase in the volume V _cavity of the cavity, S first increases and then decreases; with increasing radius R _m of the weight blocks, S first increases and then decreases; in addition, S decreases with an increase in the height of the weight block h _m and an increase in the density ρ _m of the weight block. In some embodiments, the value of the degree of sensitivity and resonant frequency can be adjusted by adjusting the stiffness of the vibrating diaphragm, the volume of the cavity, and the material and size of the weight block.

In FIG. 6 is a schematic representation of a vibration sensor according to some embodiments of the present disclosure.

In some embodiments, one or more groups of vibration diaphragms and weight blocks of the vibration sensor 600 may be located parallel to the radial section (ie, perpendicular to the direction of vibration) in the sound opening. As shown in FIG. 6, in some embodiments, tube 611 may be installed in the sound receiving opening. The vibrating diaphragm and weight block may include a first vibrating diaphragm 6311, a second vibrating diaphragm 6212, a first weight block 6321, and a second weight block 6322 disposed parallel to a radial portion of the sound receiving hole in the sound receiving hole. In some embodiments, the tube 611 may be made of an airtight material, and the role of the tube 611 may be similar to the support structure 233 in the vibration sensor 200. When calculating the degree of sensitivity and resonant frequency of the vibration assembly, the stiffness of the material of the tube 611 may be taken as the stiffness of the K _{foam of} the support structures. In some embodiments, to allow the weight block to oscillate freely, the weight block does not contact the inner wall of the sound opening or tube 611. It should be noted that the configuration of tube 611 is only a specific embodiment, and does not limit the scope of the present disclosure. For example, tube 611 may not be provided in some embodiments. One or more sets of vibrating diaphragms and weight blocks may be directly connected to the sound receiver, or a support structure may be provided in the sound receiving opening and support one or more sets of vibrating diaphragms and weight blocks.

In some embodiments, the implementation of the first weight block 6321 and the second weight block 6322 can vibrate in response to the vibration of the external environment and simultaneously create resonance. The resonance created by the first vibrating diaphragm 6311, the second vibrating diaphragm 6312 and the first weight block 6321, the second weight block 6322, together with external vibration signals, can be transmitted to the acoustic sensor 620 through the tube 611, thereby allowing the process of converting the vibration signals after they are amplified in one or multiple target frequency ranges in electrical signals. It should be noted that the two groups of vibrating diaphragms and weight blocks shown in FIG. 6 are for illustration only and do not limit the protection scope of the present disclosure. For example, there may be one group, three groups, or another number of groups of vibrating diaphragms and weight blocks.

In some embodiments of the present disclosure, an audio input device may be further provided, which in the above embodiments includes a vibration sensor. Sound can be picked up by a vibration sensor and converted into electrical signals for further processing.

Thus, after describing the basic concepts to those skilled in the art upon reading this detailed disclosure, it may be apparent that the foregoing detailed disclosure is intended to be by way of example only and is not limiting. There are various changes, improvements and modifications intended for those skilled in the art, although this is not expressly stated in this document. These changes, improvements and modifications are intended to be contemplated by the present disclosure and are within the spirit and scope of the illustrative embodiments of the present disclosure.

Moreover, certain terminology has been used to describe embodiments of the present disclosure. For example, the terms "one embodiment", "an embodiment", and/or "some embodiments" mean that a particular feature, structure, or characteristic described in connection with an embodiment is included in at least one embodiment of the present disclosure. Thus, it should be emphasized and appreciated that two or more references to "an embodiment", "one embodiment" or "alternative embodiment" in various parts of this specification do not necessarily all refer to the same embodiment. In addition, specific features, structures, or characteristics may be combined in accordance with one or more embodiments of the present disclosure.

In addition, those skilled in the art will appreciate that aspects of the present disclosure may be illustrated and described herein in any of a number of patentable classes or contexts, including any new and useful process, machine, manufacture, or composition of matter, or any new and useful their improvement. Accordingly, aspects of the present disclosure may be implemented entirely in hardware, entirely in software (including firmware, resident software, microcode, etc.), or a combination of software and hardware implementations, which may be collectively referred to herein as "unit", "module", "mechanism", "unit", "component", or "system". In addition, aspects of the present disclosure may take the form of a computer program product embodied in one or more computer-readable storage media embodied in computer-readable program code.

In addition, the order in which elements and sequences are processed, or the use of numbers, letters, or other designations, is therefore not intended to limit the claimed processes and methods in any order other than that which may be indicated in the claims. While the above disclosure discusses, by various examples, what is currently considered to be a variety of useful embodiments of the present disclosure, it should be understood that such details are for that purpose only, and that the appended claims are not limited to the disclosed embodiments, but rather, are intended to cover modifications and equivalent devices that are within the spirit and scope of the disclosed embodiments. For example, while the implementation of the various components described above may be implemented in a hardware device, it may also be implemented as a pure software solution, such as installation on an existing server or mobile device.

Likewise, it should be understood that in the above description of embodiments of the present disclosure, various features are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of simplifying the disclosure to aid in understanding one or more of the various embodiments. However, this mode of disclosure should not be interpreted as reflecting the intent that the claimed subject matter requires more features than is expressly stated in each claim. Rather, the claimed subject matter may consist of more than just all of the features of one embodiment disclosed above.

In some embodiments, numbers expressing amounts or properties used to describe and approve certain embodiments of the present application should be understood to be modified in some instances by the term "about", "approximately", or "substantially". For example, "approximately", "approximately", or "substantially" may mean a deviation of ±1%, ±5%, ±10%, or ±20% of the described value, unless otherwise indicated. Accordingly, in some embodiments, the numerical parameters specified in the written description and the accompanying claims are approximate values that may vary depending on the desired properties to be obtained in a particular embodiment. In some embodiments, numerical parameters should be interpreted in terms of the number of significant digits reported and by applying normal rounding techniques. Although the numerical ranges and parameters that define the broad scope of some embodiments of the present application are approximate, the numerical values given in the specific examples are presented as accurately as practicable.

In conclusion, it should be understood that the embodiments of the present application disclosed herein illustrate the principles of the embodiments of the present application. Other modifications that may be used may be within the scope of the application. Thus, by way of example, and not limitation, alternative configurations of embodiments of the present application may be used in accordance with the ideas set forth herein. Accordingly, the embodiments of the present application are not limited to what is shown and described.

Claims (14)

1. Vibration sensor, containing: acoustic transducer; a vibration assembly coupled to the acoustic transducer, the vibration assembly being configured to transmit an external vibration signal to the acoustic transducer to generate an electrical signal, the vibration assembly including one or more groups of vibration diaphragms and weight blocks, and the weight blocks being physically coupled to the vibration diaphragms; the vibration unit is designed so that the degree of sensitivity of the vibration sensor is greater than the degree of sensitivity of the acoustic transducer in one or more target frequency ranges, wherein each group of the specified one or more groups of vibration diaphragms and weight blocks corresponds to one of the specified one or more different target frequency ranges, so that the degree of sensitivity of the vibration sensor is greater than the degree of sensitivity of the acoustic transducer in the corresponding target range, and the resonant frequencies of at least two groups of said one or more groups of vibrating diaphragms and weight blocks are different. 2. The vibration sensor according to claim. 1, in which the specified one or more groups of vibrating diaphragms and weight blocks are arranged in order in the direction of vibration of the vibrating diaphragms; moreover, the distance between adjacent vibration diaphragms in the vibration assembly is not less than the maximum amplitude of neighboring vibration diaphragms. 3. The vibration sensor according to claim. 1, in which the resonant frequencies of the specified one or more groups of vibrating diaphragms and weight blocks is less than the resonant frequency of the vibration sensor, so that the degree of sensitivity of the vibration sensor is greater than the degree of sensitivity of the acoustic transducer in the specified one or more target frequency ranges. 4. The vibration sensor according to claim. 1, in which among the resonant frequencies of the groups of vibrating diaphragms and weight blocks, the difference between two adjacent resonant frequencies is less than 2 kHz or not more than 1 kHz. 5. The vibration sensor according to claim 1, in which the vibration assembly further includes a support structure configured to support said one or more groups of vibrating diaphragms and weight blocks, wherein the support structure is physically connected to the acoustic transducer, and said one or more groups vibration diaphragms and weight blocks are connected to the support structure, while in the direction perpendicular to the surface of the vibration diaphragm connected to the weight block, the projection area of the weight block does not overlap with the projection area of the support structure. 6. The vibration sensor according to claim 2, in which the vibration node further includes a limiting structure; moreover, the limiting structure is designed so that the distance between adjacent vibration diaphragms in the vibration assembly is not less than the maximum amplitude of the neighboring vibration diaphragms. 7. The vibration sensor according to claim 1, in which the acoustic transducer is an air conduction microphone, and the air conduction microphone includes a sound receiving hole, and the specified one or more groups of vibration diaphragms and weight blocks are located in the sound receiving hole parallel to the radial section of the sound receiving hole; or outside the sound hole. 8. A device for inputting sound, containing a vibration sensor according to any one of paragraphs. 1-7.