WO2023272906A1 - Vibration sensor - Google Patents

Abstract

A vibration sensor (100), comprising: a transducer (110) and a vibration assembly (120) connected to the transducer (110). The vibration assembly (120) is configured to transmit an external vibration signal to the transducer (110) to generate an electrical signal; the vibration assembly (120) comprises one or more plate-like structures (121) and one or more mass blocks (122) physically connected to each of the one or more plate-like structures (121); the vibration assembly (120) is configured to make, in one or more target frequency bands, the sensitivity of the vibration sensor (100) greater than the sensitivity of the transducer (110).

Description

a vibration sensor

cross reference

This application claims the priority of the Chinese application number 202110751143.6 filed on July 2, 2021 and the PCT international application number PCT/CN2021/112017 filed on August 11, 2021, the entire contents of which are incorporated by reference method is included here.

technical field

This description relates to the field of sensors, in particular to a vibration sensor including a vibration component.

Background technique

A vibration sensor is an energy conversion device that converts vibration signals into electrical signals, and its uses include as microphones (such as air conduction microphones, bone conduction microphones, etc.) or monitoring equipment. Vibration sensors can obtain vibration amplitude and direction data and convert them into electrical signals or other required forms for further analysis and processing.

This specification provides a vibration sensor, which increases the sensitivity of the vibration sensor without adding transducers.

Contents of the invention

One of the embodiments of the present specification provides a vibration sensor, including: a transducer; a vibration component connected to the transducer, and the vibration component is configured to transmit an external vibration signal to the transducer to generate an electric current. signal, the vibration assembly includes one or more plate-like structures and one or more masses physically connected to each of the one or more plate-like structures; the vibration assembly is configured to be in a Make the sensitivity of the vibration sensor greater than the sensitivity of the transducer in one or more target frequency bands.

In some embodiments, the frequency response curve of the vibration sensor under the action of the vibration component has multiple resonance peaks.

In some embodiments, the one or more masses connected to one of the one or more plate-like structures comprises at least two masses.

In some embodiments, at least one structural parameter of the at least two proof masses is different, and the structural parameter includes size, mass, density and shape.

In some embodiments, in the vibration direction of the vibration assembly, the projection of the one or more mass blocks is located in a plate shape within the projection of the plate-shaped structure.

In some embodiments, the vibrating assembly further includes a support structure for supporting the plate structure, the support structure is physically connected to the transducer, and the plate structure is connected to the support structure.

In some embodiments, the support structure is made of an air impermeable material.

In some embodiments, in a direction perpendicular to the surface connected to the one plate structure and the one or more proof masses, the projected area of the proof mass does not overlap with the projected area of the supporting structure.

In some embodiments, the one plate-shaped structure and at least two mass blocks physically connected to the one plate-shaped structure correspond to multiple target frequency bands in the target frequency bands, so that in the corresponding multiple target frequency bands The sensitivity of the vibration sensor is greater than the sensitivity of the transducer.

In some embodiments, the one plate structure and the at least two masses physically connected to the one plate structure have multiple resonant frequencies, at least one of the multiple resonant frequencies is smaller than the transducer The resonant frequency is such that the sensitivity of the vibration sensor is greater than the sensitivity of the transducer in a plurality of target frequency bands of the one or more target frequency bands.

In some embodiments, the multiple resonance frequencies of the one plate-like structure and at least two masses physically connected to the one plate-like structure are the same or different.

In some embodiments, wherein, at least one of the multiple resonance frequencies of the one plate structure and at least two masses physically connected to the one plate structure is the same as all the resonance frequencies of the transducer The difference between the resonant frequencies is within 1 kHz to 10 kHz.

In some embodiments, the difference between two adjacent resonant frequencies among the plurality of resonant frequencies of the one plate structure and at least two masses physically connected to the one plate structure is less than 2 kHz.

In some embodiments, the difference between two adjacent resonance frequencies among the plurality of resonant frequencies of the one plate structure and at least two masses physically connected to the one plate structure is not greater than 1 kHz.

In some embodiments, the resonant frequency of the one plate structure and at least two masses physically connected to the one plate structure is within 1 kHz˜10 kHz.

In some embodiments, the resonant frequency of the one plate-shaped structure and the plurality of masses physically connected to the plate-shaped structure is within 1 kHz˜5 kHz.

In some embodiments, the multiple resonant frequencies of the one plate-like structure and at least two mass blocks physically connected to the one plate-like structure are related to the plate-like structure and/or the mass The parameter is related to the parameters of the block, and the parameters include the modulus of the plate-like structure, the volume of the cavity formed between the transducer and the plate-like structure, the radius of the mass block, and the height of the mass block and at least one of the density of the mass block.

In some embodiments, at least one of the one or more mass blocks connected to one of the one or more plate-like structures is arranged concentrically with the one of the plate-like structures.

In some embodiments, a diaphragm is included in the one or more plate structures.

In some embodiments, the one or more masses connected to the diaphragm are arranged on the side of the diaphragm facing the transducer, or on the side of the diaphragm facing away from the transducer one side.

In some embodiments, the diaphragm comprises polytetrafluoroethylene, expanded polytetrafluoroethylene, polyethersulfone, polyvinylidene fluoride, polypropylene, polyethylene terephthalate, nylon, nitrocellulose, or at least one of mixed cellulose.

In some embodiments, in the vibration direction of the diaphragm, the projected area of the proof mass is located within the projected area of the diaphragm.

In some embodiments, the number of the one or more mass blocks connected to the diaphragm may be greater than 1, and they are respectively arranged on two sides of the diaphragm perpendicular to the vibration direction.

In some embodiments, the number of the one or more mass blocks connected to the diaphragm may be greater than or equal to 3; the at least three mass blocks are not collinearly arranged.

In some embodiments, at least one of the one or more plate-like structures comprises a cantilever beam.

In some embodiments, the material of the cantilever beam includes at least one of copper, aluminum, tin, silicon, silicon oxide, silicon nitride, silicon carbide, aluminum nitride, zinc oxide, lead zirconate titanate or an alloy.

In some embodiments, the one or more mass blocks connected to the cantilever beam are arranged at the free end of the cantilever beam.

In some embodiments, the one or more masses connected to the cantilever beam are collinearly arranged with the cantilever beam.

In some embodiments, the transducer further includes a conduction channel; the vibrating component is disposed in the conduction channel along a radial section of the sound pickup hole; or, is disposed outside the conduction channel.

In some embodiments, the one or more connected to at least one of the one or more plate-like structures does not contact the inner wall of the conductive channel.

In some embodiments, at least one of the one or more plate-shaped structures is provided with a through hole.

In some embodiments, at least one of the one or more plate-like structures does not completely cover the conductive channel.

In some embodiments, a plate-like structure of the one or more plate-like structures that is farthest from the transducer is configured to enclose the conductive channel.

One of the embodiments of the present specification provides an audio input device, which includes any vibration sensor described above.

One of the embodiments of the present specification provides a vibrating system, including: a plate structure; a vibrating element connected to the plate structure; at least one counterweight connected to the vibrating element, and the vibration of the vibrating element direction, the projection of the counterweight is located within the projection of the vibrating element.

One of the embodiments of this specification provides an earphone, which includes the aforementioned vibration system.

Description of drawings

This specification will be further illustrated by way of exemplary embodiments, which will be described in detail with the accompanying drawings. These examples are not limiting, and in these examples, like numbers indicate similar structures, wherein:

FIG. 1 is a schematic diagram of a modular structure of a vibration sensor according to some embodiments of the present specification;

Fig. 2 is a schematic structural diagram of a vibration sensor according to some embodiments of the present specification;

Figure 3 is a schematic diagram of an exemplary vibrating assembly according to some embodiments of the present specification;

4A-4C are schematic diagrams of exemplary vibrating assemblies according to some embodiments of the present specification;

5A-5B are schematic diagrams of exemplary vibrating assemblies according to some embodiments of the present specification;

Fig. 6 is a schematic diagram of an exemplary vibration assembly according to some embodiments of the present specification;

Fig. 7 is a schematic diagram of the frequency response curves when the vibration components in the vibration sensor have different numbers of mass blocks according to some embodiments of the present specification;

8A-8C are structural schematic diagrams of vibration components of a vibration sensor according to some embodiments of the present specification;

9A-9B are structural schematic diagrams of a vibration component of a vibration sensor according to some embodiments of the present specification;

Fig. 10 is a schematic structural diagram of a vibration component of a vibration sensor according to some embodiments of the present specification;

Fig. 11 is a schematic structural diagram of a vibration component of a vibration sensor according to some embodiments of the present specification;

Fig. 12 is a schematic diagram of frequency response curves when the vibration components in the vibration sensor have different numbers of mass blocks according to some embodiments of the present specification;

Fig. 13 is a schematic structural diagram of a vibration sensor according to some embodiments of the present specification; and

Fig. 14 is a schematic diagram of a modular structure of an earphone according to some embodiments of the present specification.

detailed description

In order to more clearly illustrate the technical solutions of the embodiments of this specification, the following will briefly introduce the drawings that need to be used in the description of the embodiments. Apparently, the accompanying drawings in the following description are only some examples or embodiments of this specification, and those skilled in the art can also apply this specification to other similar scenarios. It should be understood that these exemplary embodiments are given only to enable those skilled in the relevant art to better understand and implement the present invention, but not to limit the scope of the present invention in any way. Unless otherwise apparent from context or otherwise indicated, like reference numerals in the figures represent like structures or operations.

As indicated in the specification and claims, the terms "a", "an", "an" and/or "the" are not specific to the singular and may include the plural unless the context clearly indicates an exception. Generally speaking, the terms "comprising" and "comprising" only suggest the inclusion of clearly identified steps and elements, and these steps and elements do not constitute an exclusive list, and the method or device may also contain other steps or elements. The term "based on" is "based at least in part on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one further embodiment". Relevant definitions of other terms will be given in the description below.

In some embodiments, the vibration sensor means for converting vibrations into electrical signals includes a transducer. Usually there is only one resonance peak in a single transducer, and the transducer only has high sensitivity near the frequency of the resonance peak. In some embodiments, in order to improve the sensitivity of the vibration sensor, a plurality of transducers with different resonance peaks are arranged to increase the receiving frequency range and sensitivity, but increasing the number of transducers will lead to the volume and manufacturing cost of the vibration sensor increase.

In view of this, this specification relates to a vibration sensor, which makes the sensitivity of the vibration sensor in the target frequency band greater than that of the transducer through a vibration component connected to the transducer. The vibration sensor may be used to receive external vibration signals and convert the vibration signals into electrical signals capable of reflecting sound information, wherein the external signals may include mechanical vibration signals or signals. The vibrating assembly may include a plate structure and one or more mass blocks physically connected to the plate structure, and the mass block is arranged on one side of the plate structure. The vibration assembly is configured such that the sensitivity of the vibration sensor is greater than the sensitivity of the transducer in one or more frequency bands of interest.

Fig. 1 is a schematic diagram of a modular structure of a vibration sensor according to some embodiments of the present specification.

As shown in FIG. 1 , the vibration sensor 100 may include a transducer 110 and a vibration component 120 . In some embodiments, the transducer 110 is connected to a vibration assembly 120 configured to transmit an external vibration signal to the transducer to generate an electrical signal. When vibration occurs in the external environment, the vibration component 120 responds to the vibration of the external environment and transmits the vibration signal to the transducer 110, and then the transducer 120 converts the vibration signal into an electrical signal. The vibration sensor 100 can be applied to mobile devices, wearable devices, virtual reality devices, augmented reality devices, etc., or any combination thereof.

In some embodiments, transducer 110 may be an acoustic transducer, which may include a microphone. Specifically, the microphone may be a microphone with bone conduction as one of the main modes of sound transmission or a microphone with air conduction as one of the main modes of sound transmission. Taking air-air conduction as one of the main modes of sound transmission as an example, the microphone can obtain the sound pressure change of the conduction channel (such as the sound pickup hole) and convert it into an electrical signal. In some embodiments, the transducer may be an accelerometer, and the accelerometer is a specific application of the spring-vibration system, which receives vibration signals through sensitive devices to obtain electrical signals, and then processes the electrical signals to obtain acceleration. In some embodiments, the accelerometer operates at a lower frequency than the acoustic transducer.

In some embodiments, a mobile device may include a smartphone, tablet computer, personal digital assistant (PDA), gaming device, navigation device, etc., or any combination thereof. In some embodiments, wearable devices may include smart bracelets, earphones, hearing aids, smart helmets, smart watches, smart clothing, smart backpacks, smart accessories, etc., or any combination thereof. In some embodiments, the virtual reality device and/or the augmented reality device may include a virtual reality helmet, virtual reality glasses, virtual reality patch, augmented reality helmet, augmented reality glasses, augmented reality patch, etc. or any combination thereof. For example, virtual reality devices and/or augmented reality devices may include Google Glass, Oculus Rift, Hololens, Gear VR, etc.

As shown in FIG. 1 , the vibration assembly 120 includes one or more plate structures 121 and one or more mass blocks 122 . In some embodiments, each of the one or more plate structures 121 is connected to at least one of the one or more masses 122 . Vibration assembly 120 is configured such that the sensitivity of vibration sensor 100 is greater than the sensitivity of transducer 110 in one or more frequency bands of interest. In some embodiments, a structure formed by a plate-shaped structure and a mass block physically connected to the plate-shaped structure may also be called a resonant structure. The plate-like structure 121 may refer to a structure made of flexible or rigid material capable of carrying one or more masses. The mass block 122 is a small and heavy object. In some embodiments, the volume and mass of the mass block are different according to the usage scenarios and target frequencies of the vibration assembly 120. For details, please refer to FIG. 2 and FIG. 8 It should be noted that the relevant descriptions in FIG. 2 and FIG. 8 are only an embodiment of the solution, and are not intended to limit the protection scope of the present invention.

In some embodiments, the plate structure 121 may include a single plate structure (also referred to as a plate). In some embodiments, the plate-shaped structure 121 may include a plurality of plate-shaped members, for example, 2, 3, 4, etc.

In some embodiments, at least one mass associated with each plate-like structure may comprise a single mass. In some embodiments, at least one mass connected to each plate-like structure may include multiple masses, eg, 2, 3, 4, etc.

In some embodiments, at least one of the plate structures 121 is connected to at least two masses 122 .

In some embodiments, the vibrating assembly 120 further includes a support structure for supporting the plate-like structure 121, the support structure is physically connected to the transducer 110, and the plate-like structure 121 is connected to the support structure.

In some embodiments, one or more mass blocks 122 can be arranged on either side of the plate-shaped structure in the vibration direction, and in some embodiments, multiple mass blocks can also be respectively arranged on the plate-shaped structure in the vibration direction on both sides. In some embodiments, in the vibration direction of the plate-shaped structure, the projected area of the mass block connected thereto is located within the projected area of the plate-shaped structure. In some embodiments, the sum of the cross-sectional areas of one or more mass blocks 122 on one side is smaller than the cross-sectional area of the plate-like structure in the direction parallel to the surface connected to the plate-like structure and the mass block (that is, perpendicular to the vibration direction). Sectional area. In some embodiments, driven by the plate structure, the mass block vibrates in the same direction as the plate structure.

In some embodiments, one or more plate structures 121 and a plurality of mass blocks 122 physically connected to the plate structure correspond to multiple target frequency bands in the target frequency bands, so that the vibration sensor 100 in the corresponding multiple target frequency bands The sensitivity is greater than that of the transducer 110 . In some embodiments, the combination of at least one plate-shaped structure and a mass block can generate a larger amplitude of the vibration signal near its resonance frequency when it receives the vibration signal, thereby improving the sensitivity of the vibration sensor 100 .

In some embodiments, the method for measuring the sensitivity of the vibration sensor 100 and the transducer 110 can be: under the excitation of a given acceleration (such as 1g, g is the acceleration of gravity), the strength of the electrical signal (such as -30dBV) of the acquisition device is Sensitivity (eg, -30dBV/g). For example, the intensity of electrical signals output by the vibration sensor 100 and the transducer 110 can be collected to obtain the sensitivity of the vibration sensor 100 and the transducer 110 under the excitation of the same acceleration (such as 1g, where g is the acceleration of gravity). In some embodiments, when the transducer 110 is a microphone, when measuring the sensitivity, the aforementioned excitation source can be replaced with sound pressure, that is, the sound pressure in the specified frequency band can be input (the sound pressure input method can be bone Conduction as the main transmission mode of sound or air conduction as the main transmission mode of sound) as the excitation to measure the electrical signal of the acquisition device.

In some embodiments, in order to adapt to multiple vibration modes, a plate-shaped structure and one or more masses 122 physically connected to the plate-shaped structure form a vibration assembly that has multiple resonant frequencies, and the multiple resonant frequencies can be the same or different. At least one structural parameter of at least two masses of the plurality of masses may be different. The structural parameters of the proof mass may include size, mass, density, shape, etc. Specifically, the size of the mass block may be at least one of the length, width, height, cross-sectional area or volume parameter of the mass block.

In some embodiments, the frequency response curve of the vibration sensor 100 under the action of the vibration component 120 has multiple resonance peaks.

In some embodiments, the difference between at least one resonance frequency of a resonant structure formed by a plate structure and a plurality of masses physically connected to the plate structure and the resonant frequency of the transducer 100 is within Within 1kHz～10kHz. In some embodiments, the difference between two adjacent resonant frequencies among the multiple plate-like structures 121 resonant frequencies of one plate-like structure 121 and the plurality of masses 122 physically connected with the plate-like structure 121 is less than 2 kHz. In some embodiments, a plate structure 121 and a plurality of masses 122 physically connected to the plate structure 121 have a difference of no more than 1 kHz between the resonance frequencies of the multiple plate structures 121 .

In some embodiments, a plate structure 121 and a plurality of masses 122 physically connected to the plate structure 121 have a resonant frequency within 1 kHz˜10 kHz. In some embodiments, a plate structure 121 and a plurality of masses 122 physically connected to the plate structure 121 have a resonant frequency within 1 kHz˜5 kHz.

By arranging at least one mass 122 in the vibration component 120, the vibration component 120 can have multiple vibration modes, so that the frequency response curve of the vibration sensor has two or more resonance peaks. Since the sensitivity of the vibration sensor increases in the frequency range where the resonance peak is located, the frequency response curve having two or more resonance peaks can increase the frequency range of high sensitivity of the vibration sensor. Among them, the vibration mode is the vibration state with fixed frequency, damping ratio and mode shape. Different vibration modes correspond to different deformation forms, for example, multiple masses vibrate upwards synchronously; one mass vibrates upwards, and one mass vibrates downwards, etc. The vibration mode depends on the characteristics of the vibration assembly 120, for example, the stiffness and size of the mass 122, the size, position and density of the counterweight, and the like. In some embodiments, one mass can produce one mode, two masses can produce two modes, three masses can produce three effective modes, or two effective modes. Among them, the effective mode refers to the mode that can cause the volume change of the air gap.

In some embodiments, at least one of the one or more plate structures 121 may be a diaphragm. The diaphragm may comprise a rigid membrane or a flexible membrane. Can be rigid or flexible membrane. A rigid membrane refers to a membrane body having a Young's modulus greater than a first modulus threshold (eg, 50 GPa). A flexible film refers to a film body whose Young's modulus is less than the second modulus threshold. In some embodiments, the first modulus threshold and/or the second modulus threshold can be set according to actual needs. In some embodiments, the first modulus threshold may or may not be equal to the second modulus threshold. For example, the first modulus threshold may be 20GPa, 30GPa, 40GPa, 50GPa, etc., and the second modulus threshold may be 1MPa, 10MPa, 1GPa, 10GPa, etc. , for a detailed description of the diaphragm, please refer to the related description of the diaphragm as shown in FIG. 2 .

In some embodiments, at least one of the one or more plate structures 121 may be a cantilever beam. The cantilever beam may comprise a rigid plate. In some embodiments, a rigid plate refers to a plate with a membrane body having a Young's modulus greater than a third modulus threshold (eg, 50 GPa). In some embodiments, the third modulus threshold can be set according to actual needs, for example, it can be 20GPa, 30GPa, 40GPa, 50GPa, etc. For a detailed description of the cantilever beam, please refer to the related description of the cantilever beam in Figure 8a.

In some embodiments, one or more plate-shaped structures 121 may include at least one diaphragm and at least one cantilever beam. For details about the diaphragm and the cantilever beam, please refer to the related description below.

Fig. 2 is a schematic structural diagram of a vibration sensor according to some embodiments of the present specification.

The vibration sensor 200 in FIG. 2 may be a specific implementation of the vibration sensor 100 in FIG. 1 . In some embodiments, the vibration sensor 200 includes an acoustic transducer 210 and a vibration assembly 220 . It should be noted that, in some other embodiments, the transducer may be other than the acoustic transducer, such as an accelerometer; in addition, the acoustic transducer may also be in other forms, such as a liquid microphone and a laser microphone .

Referring to Fig. 2, in some embodiments, the air conduction microphone includes a sound pickup device 212. In some embodiments, the sound pickup device 212 may include transducer sensitive elements in the form of capacitive, piezoelectric, etc. according to the principle of energy conversion, This specification does not limit.

In some embodiments, the acoustic transducer 210 is also provided with a conductive channel 211 for picking up sound. In some embodiments, the vibrating component 220 is disposed inside the conduction channel 211 or outside the conduction channel 211 as shown in FIG. 2 along the radial section of the sound pickup hole. The conduction channel 211 may also be called a sound pickup hole or a sound inlet hole.

As shown in FIG. 2 , the vibrating assembly 220 includes a plate-like structure and a mass 222 physically connected to it. In some embodiments, the plate-like structure and the mass 222 can be realized by clamping, bonding, or integral molding. connection, the connection method is not limited in this manual. In some embodiments, the plate-like structure includes a diaphragm 221 . In some embodiments, the diaphragm 221 can be set to be air-permeable or air-impermeable. Exemplarily, in order to have a better sound pickup effect, in some embodiments, the diaphragm 221 can be air-impermeable.

It should be noted that a diaphragm and a plate structure shown in the figure are only for convenience of description, but do not limit the protection scope of the present invention. In some embodiments, the mass block may include multiple, multiple mass blocks They can be respectively arranged on both sides of the diaphragm 221 , and in some embodiments, multiple masses can also be arranged on the same side of the diaphragm 221 . Exemplarily, assuming that the vibrating component includes more than two mass blocks, the two mass blocks may be arranged on both sides of the plate-like structure. In some embodiments, a plurality of mass blocks can all be arranged on the side of the diaphragm facing the transducer, or on the side of the diaphragm facing away from the transducer, so as to ensure uniform vibration. In some embodiments, a plate-shaped structure and multiple mass diaphragms 221 physically connected to the plate-shaped structure correspond to multiple target frequency bands in one or more different target frequency bands, so that the vibration sensor 100 in the corresponding target frequency band The sensitivity of can be greater than the sensitivity of transducer 210. In some embodiments, the resonant frequencies of a plate structure and the masses 222 physically connected to the plate structure are the same or different. In some embodiments, the sensitivity of the vibration sensor 100 after adding one or more sets of masses and diaphragms can be increased by 3dB-30dB compared with the transducer 110 in the target frequency band. It should be noted that, in some embodiments, the sensitivity of the vibration sensor 200 after the vibration component 220 can be increased by more than 30 dB compared with the transducer 210, such as multiple mass blocks 222 physically connected to the plate structure have the same resonance peak.

In some embodiments, a plurality of mass blocks can be arranged collinearly or not. Exemplarily, in some embodiments, if the mass blocks include four, two or three of the four mass blocks can be co-linear. In addition, the four mass blocks can also be arranged in arrays (such as rectangular arrays and circular arrays).

, in some embodiments, when the vibrating assembly 220 includes a plurality of diaphragms, except the diaphragm farthest from the acoustic transducer 210 can be constructed to be air-permeable, so as to ensure that air vibration (eg, sound waves) can be as completely as possible. The vibration is picked up by the diaphragm and then by the sound pickup device 221 , which can effectively improve the sound pickup quality. By making the plate-shaped structure farthest from the acoustic transducer 210 airtight, it is used to close the conduction channel 211 so that the air in the conduction channel 211 will not escape when it vibrates, and the effect of air compression is ensured, so that the vibration sensor 200 It has a better pickup effect.

In some embodiments, the support structure 230 is made of an air-impermeable material, and the air-impermeable support structure 230 can cause the vibration signal in the air to change during the transmission process, causing the sound pressure in the support structure 230 to change (or air vibration), so that The internal vibration signal of the support structure 230 is transmitted to the acoustic transducer 220 through the conduction channel 211, and will not escape outward through the support structure 230 during the transmission process, thereby ensuring the sound pressure intensity and improving the sound transmission effect. In some embodiments, the support structure 230 may include, but is not limited to, metals, alloy materials (such as aluminum alloys, chrome-molybdenum steels, scandium alloys, magnesium alloys, titanium alloys, magnesium-lithium alloys, nickel alloys, etc.), hard plastics, foam One or more of cotton etc.

In some embodiments, in the direction perpendicular to the surface connecting the diaphragm 221 and the proof mass 222 (ie, perpendicular to the vibration direction), the projected area of the proof mass does not overlap with the projected area of the supporting structure. This arrangement is to avoid the vibration of the diaphragm 221 and the mass 222 being restricted by the support structure 230. In some embodiments, the shape of the cross-section of the diaphragm in the thickness direction may include circular, rectangular, triangular or irregular figures, etc. In some embodiments, the shape of the diaphragm may also be set according to the shape of the support structure 230 , without limitation in this specification. In some embodiments, in order to prevent excessive concentration of stress at the corner due to excessive non-smooth curves, the embodiment of the present disclosure chooses the diaphragm 221 to be circular. In some embodiments, the shape of the proof mass can be a cylinder, a truncated cone, a cone, a cube, a triangle, etc., and its size and material will be described later, and the shape is not limited in this description.

In some embodiments, the proof mass 222 can be concentrically arranged with the diaphragm 221 . Exemplarily, when the mass block 222 or the diaphragm 221 has a circular outer contour, when the mass block 222 arranged concentrically vibrates, the kinetic energy is more evenly dispersed on the diaphragm 221, so that the diaphragm 221 can better respond to the vibration . In some other embodiments, the mass block 222 may also be arranged at other positions of the diaphragm 211, such as an eccentric position, and the eccentric position means that the mass block is not arranged concentrically with the diaphragm. In some embodiments, the distance between the centerline of proof mass 222 and the edge of diaphragm 221 may vary. In some embodiments, the positions of the mass block 222 relative to the diaphragm 221 are different, and the resonance peak position of the vibration system 10 can be adjusted. For example, when the mass 222 moves from the edge region of the diaphragm 221 to the center of the diaphragm 221, the resonance peak can be moved forward, that is, to move to the low frequency direction (resonant frequency is reduced). When moving to the edge region of the diaphragm 221 , the resonance peak can be moved backward, that is, to move toward the high frequency direction (the resonance frequency increases).

In some embodiments, when the vibration sensor 200 is used for air conduction sound pickup, when the external environment generates vibrations (for example, sound waves), the diaphragm 221 and the mass on the diaphragm 221 vibrate in response to the vibration of the external environment, The vibrations produced by the diaphragm 221 and the mass together with external vibration signals (for example, sound waves) can cause sound pressure changes (or air vibrations) in the conduction channel 211 so that the vibration signal is transmitted to the pickup device 212 through the conduction channel 211 and converted into Electrical signals, so as to realize the process of converting vibration signals into electrical signals after being strengthened in one or more target frequency bands. Wherein, the target frequency band may be a frequency range in which the resonant frequency (or resonant frequency) corresponding to the plate structure and the proof mass 222 is located. Exemplarily, when the vibration sensor 200 is used as a microphone, the range of the target frequency range may be 200Hz-2kHz. Specifically, in some embodiments, if the resonance frequency of the acoustic transducer is 2kHz, the resonance frequency of the vibration component 220 It can be configured as 800Hz, 1kHz or 1.7kHz etc.

In some embodiments, the vibrating component 210 can be applied to the design of MEMS (Micro Electro Mechanical System) devices, and can also be applied to the design of macroscopic devices (such as microphones or speakers, etc.). In the MEMS device process, the diaphragm 221 can be a single-layer material along its thickness direction, such as Si, SiO2, SiNx, SiC, etc., or it can be a double-layer or multi-layer composite material, such as Si/SiO2, SiO2/Si, Si /SiNx, SiNx/Si/SiO2, etc. The proof mass 221 can be a single-layer material, such as Si, Cu, etc., or a double-layer or multi-layer composite material, such as Si/SiO2, SiO2/Si, Si/SiNx, SiNx/Si/SiO2, etc. In some embodiments, the material of the diaphragm 221 in the MEMS device is Si or SiO2/SiNx, and the material of the mass block 222 is Si. When the diaphragm 221 and mass 222 are circular, the radius may be 500 μm to 1500 μm, the thickness of the diaphragm 221 may be 0.5 μm to 5 μm; the radius of the mass 222 may be 100 μm to 1000 μm, and the height of the mass 222 may be 50 μm ~5000μm.

In a macroscopic device, the material of the vibrating film 221 can be a polymer film, such as polyurethane, epoxy resin, acrylate, etc., or a metal film, such as copper, aluminum, tin or other alloys and their composite films; The mass block 221 is generally required to have a certain mass in a volume as small as possible, so it needs to have a high density, and its material can be copper, tin or other alloys and their composite materials. In a macroscopic device, the radius of the diaphragm 221 can be 1mm-10cm, the thickness of the diaphragm 210 can be 0.1mm-5mm; the radius of the mass block 221 can be 0.2mm-5cm, and the height of the mass block 221 can be 0.1mm-10mm. In some embodiments, the radius of the diaphragm 221 may be 1.5 mm to 10 mm, the thickness of the diaphragm 221 may be 0.2 mm to 0.7 mm; the radius of the mass block 221 may be 0.3 mm to 5 mm, and the height of the mass block 221 may be 0.3 mm ~5mm.

In some embodiments, the diaphragm 221 may include a gas-permeable film, and the gas-permeable film includes polytetrafluoroethylene, expanded polytetrafluoroethylene, polyethersulfone, polyvinylidene fluoride, polypropylene, polyethylene terephthalate, At least one or a combination of nylon, nitrocellulose or mixed cellulose. In some embodiments, when the diaphragm 221 is configured to be air-tight, the material of the diaphragm 221 may be the material of the aforementioned plate-like structure or may be obtained by processing the above-mentioned gas-permeable film (such as covering air holes).

In some embodiments, the diaphragm 221 may be a plate-like structure with through holes. In some embodiments, the diameter of the through hole is 0.01 μm˜10 μm. Preferably, the diameter of the through hole may be 0.1 μm˜5 μm, such as 0.2 μm, 0.5 μm, 0.8 μm, 1 μm, 2 μm and so on. The diameters of the through holes on the diaphragm 221 may be the same or different. In some embodiments, if the vibrating assembly 230 includes multiple diaphragms, the diameters of the through holes on the multiple diaphragms may be the same or different, and the diameters of the through holes on the same diaphragm may be the same or different. In some embodiments, the diameter of the through holes may also be greater than 5 μm. When the diameter of the through hole is greater than 5 μm, other materials (such as silica gel, etc.) can be placed on the diaphragm 221 to cover part of the through hole or a part of the area of the through hole without affecting the air permeability.

In some embodiments, the vibrating assembly 220 may further include a support structure 230 for supporting one or more sets of diaphragms 221 and masses. The supporting structure 230 is physically connected to the acoustic transducer 230 , and the diaphragm 221 and the mass are connected to the supporting structure 230 . Specifically, the support structure 230 may be connected to the housing of the acoustic transducer 210 .

FIG. 3 is a schematic diagram of an exemplary vibratory assembly according to some embodiments of the present specification.

The vibration assembly 320 shown in FIG. 3 may be an exemplary embodiment of the vibration assembly 120 in FIG. 1 . It can be seen from FIG. 3 that a mass 322 is arranged on the diaphragm 321 .

In some embodiments, the plate structure can be embedded on the inner wall of the support structure 330 or embedded in the support structure 330 . In some embodiments, the plate-shaped structure can vibrate in the space inside the support structure 230 while the plate-shaped structure can completely cover the opening of the support structure, that is, the area of the plate-shaped structure can be greater than or equal to the area of the opening of the support structure. The air vibration (for example, sound wave) in the external environment can pass through the plate structure as completely as possible, and then the vibration can be picked up by the sound pickup device, which can effectively improve the sound pickup quality. In some embodiments, the plate-like structure may not completely cover the opening of the supporting structure, for example, the plate-like structure is a cantilever beam. For details, please refer to the related description of FIGS. 8A-8C below.

4A-4C are schematic diagrams of exemplary vibratory assemblies according to some embodiments of the present description.

Fig. 4A is a three-dimensional schematic diagram of a vibrating assembly 420; Fig. 4B is a projection view of the vibrating assembly 420 shown in Fig. 4A in the direction of vibration; Fig. 4B is a projection of the vibrating assembly 420 shown in Fig. 4A perpendicular to the direction of vibration picture. The vibration assembly shown in FIGS. 4A-4C may be an exemplary embodiment of the vibration assembly 120 of FIG. 1 .

As shown in Figure 4A, in some embodiments, the vibrating assembly 420 includes a plate structure and two mass blocks 422 arranged on the plate structure, similar to the vibrating assembly 420 in Figure 3, the plate structure can be set on the supporting structure Diaphragm 421 on 430. In some embodiments, the structural parameters of the two masses 422 may be the same or different. It should be noted that the number of masses connected to the diaphragm may not be limited to two, for example, may be three, four or more than five.

In some embodiments, the two masses 422 are physically connected to the diaphragm 421 . In some embodiments, the two mass blocks 422 may be respectively disposed on both sides of the diaphragm 421 in the vibration direction. Referring to Fig. 4B and Fig. 4C simultaneously, in some embodiments, two mass blocks 422 can have the same outer contour on the vibration direction, for example, all are circular; ) can have different heights. Thus, the two mass blocks 422 can make the vibrating component have two different resonant frequencies in the target frequency band, thereby producing two resonant peaks, and then make the vibrating component 420 vibrate in the frequency range near the two resonant frequencies (i.e. the target frequency band). The sensitivity is improved, achieving the effect of widening the bandwidth of the frequency band and improving the sensitivity.

In some embodiments, by setting the parameters of the diaphragm 421 and the mass 422, at least two resonance peaks can be formed on the frequency response curve of the vibration sensor with the vibration component 420, thereby forming multiple high-sensitivity frequency intervals and more wide frequency band. In some embodiments, the multiple resonant frequencies of the plate-like structure and the plurality of mass blocks 422 physically connected to the plate-like structure are related to the parameters of the diaphragm 421 and/or the mass blocks 422, and the parameters include the modulus of the plate-like structure , at least one of the volume of the cavity formed between the transducer and the plate structure, the radius of the mass block 422 , the height of the mass block 422 and the density of the mass block 422 . Specifically, the mathematical relationship between the resonant frequency and sensitivity and the above parameters can refer to the related description of formula 1 below. It should be noted that the quality or size parameter of the mass block 422 is not as large as possible. If the parameter is set too large, it may suppress the deformation of the diaphragm 421, or may generate new effective modes due to the large amplitude of the mass block 422. .

In some embodiments, the parameters of the two mass blocks 422, such as the height in the vibration direction, can meet a preset ratio, such as in some embodiments, the height ratio of the two mass blocks 422 can be 3:2, 2:1 , 3:4 or 3:1 etc.

5A-5B are schematic diagrams of exemplary vibratory assemblies according to some embodiments of the present specification.

Fig. 5A is a three-dimensional schematic diagram of a vibrating assembly 520; Fig. 5B is a projection view of the vibrating assembly 520 shown in Fig. 5A in the vibration direction; in some embodiments, as shown in Fig. Similar, the difference here is that the number of mass blocks 522 on the diaphragm 521 is three.

In some embodiments, the three masses 522 may not be collinearly arranged on the diaphragm 521 . It can be understood that when there are three mass blocks 522 , the connecting lines between two of the three mass blocks do not overlap. Referring to FIG. 5B at the same time, in this embodiment, three mass blocks 522 are distributed in a triangle shape, and the distances between any two mass blocks 522 are the same. In some embodiments, the three masses 522 can improve the sensitivity of the vibrating component 520 in frequency ranges near at least two frequency points in the target frequency band, thereby achieving the effect of widening the bandwidth of the frequency band and improving the sensitivity.

FIG. 6 is a schematic diagram of an exemplary vibratory assembly according to some embodiments of the present specification.

As shown in FIG. 6 , in some embodiments, the number of mass blocks 622 in the vibrating assembly 620 may still be four, and the four mass blocks 622 are arranged in an array (such as a circular array or a rectangular array). In some embodiments, at least two masses 622 among the four masses 622 have different resonance peaks. In some embodiments, when there are four or more mass blocks 622 , the line connecting the center points of any two mass blocks on the diaphragm will not overlap into a straight line.

In some embodiments, the frequency response curve of the vibration sensor under the action of the diaphragm and the mass has one or more resonance peaks.

Fig. 7 is a schematic diagram of frequency response curves when the vibration components in the vibration sensor have different numbers of mass blocks according to some embodiments of the present specification.

Fig. 7 comprises two frequency response curves of frequency response curve 710 and frequency response curve 720, wherein, frequency response curve 710 represents the frequency response curve of the vibration sensor (as shown in Figure 3) when a mass block is arranged on the diaphragm; Curve 720 represents the frequency response curve of the vibration sensor when two mass blocks are arranged on the diaphragm (as shown in FIG. 4A ). It can be seen from the figure that the frequency response curve 710 has one resonance peak, and the frequency response curve 720 has two resonance peaks.

In some embodiments, the arrangement of one mass may refer to the arrangement in FIG. 3 , and the arrangement of two masses may refer to the arrangement in FIG. 4A . It can be seen from the figure that when a mass block is arranged on the diaphragm, the frequency of the resonance peak of the vibration sensor is around 2000 Hz. When adding two diaphragms with the same diameter but different heights, the frequencies of the resonance peaks of the vibration sensor are located around 1300Hz and 3500Hz respectively. It can be seen that in the scenario where two mass blocks are added, the sensitivity at these two frequency points (near 1300Hz and 3500Hz) is greater than that of the transducer, achieving a significant increase in vibration at the target frequency (such as in the range of 500Hz to 5000Hz). The effect of sensor sensitivity. Compared with the method of increasing the receiving frequency range by adding multiple sets of transducers with different resonance peaks, the overall volume of the device is reduced, the cost is reduced, and it has stronger performance on the basis of higher integration .

In some embodiments, the resonant frequency of the plate structure and one or more mass blocks on the plate structure is related to the parameters of the plate structure and/or the mass blocks, the parameters may include the elastic modulus of the plate structure, the energy conversion At least one of the volume of the cavity formed between the device and the plate-like structure, the radius of the mass block, the height of the mass block and the density of the mass block. Exemplarily, in some embodiments, the relationship between the resonance frequency and the sensitivity of the diaphragm and the mass can be expressed as:

(S, f)=g(K _film , K _foam , V _cavity , R _m , h _m , ρ _m ) (1).

Among them, S is the sensitivity of the vibration sensor after the vibration component is installed, f is the resonance frequency of the vibration component, K _film is the stiffness of the plate structure, K _foam is the stiffness of the supporting structure, V _cavity is the volume of the cavity, and R _m is the radius of the mass block , h _m is the mass block height, ρ _m is the mass block density. The cavity volume V _cavity is the space volume formed between the sensitive element in the transducer (such as the sound pickup device 212 in Figure 2) and the diaphragm in the closest vibrating assembly (such as the diaphragm 221 in Figure 2) .

Specifically, in some embodiments, the sensitivity S decreases with the increase of the plate structure stiffness K _film , decreases with the increase of the support structure stiffness K _foam , increases first and then decreases with the increase of the cavity volume V _cavity , As the mass block radius R _m first increases and then decreases, it increases as the mass block height h _m increases, and it increases as the mass block density ρ _m increases. The resonant frequency f of the vibrating assembly increases with the increase of the plate structure stiffness K _film , increases with the increase of the supporting structure stiffness K _foam , decreases first and then increases with the increase of the radius R m of the mass block, and increases with the increase of the mass block radius R _m The height h _m increases and decreases, and decreases with the increase of mass density ρ _m . In some embodiments, the sensitivity and resonance frequency can be adjusted by controlling the stiffness of the plate structure, the volume of the cavity, and the material and size of the proof mass. In some embodiments, when the plate structure has low rigidity, it can be set in the form of a diaphragm, as described in FIG. 2 . In some embodiments, when the plate structure has high rigidity or the volume of the plate structure is expected to be small, it can be set in the form of a cantilever beam. For details, please refer to the description of FIGS. 8A-8C below.

8A-8C are structural schematic diagrams of a vibration component of a vibration sensor according to some embodiments of the present specification.

Fig. 8A is a three-dimensional schematic diagram of a vibrating assembly 820; Fig. 8B is a projection of the vibrating assembly 820 shown in Fig. 8A in the direction of vibration; Fig. 8B is a projection of the vibrating assembly 820 shown in Fig. 8A perpendicular to the direction of vibration picture. The vibration assembly shown in FIGS. 8A-8C may be an exemplary embodiment of the vibration assembly 120 of FIG. 1 .

As shown in FIG. 8A , the vibration assembly includes a support structure 830 , a cantilever beam 821 and a mass 822 . One end of the cantilever beam 821 is physically connected to one side of the support structure 830 , and the other end is a free end, and the mass block 822 is physically connected to the free end of the cantilever beam 821 . Specifically, the physical connection manner between the cantilever beam 821 and the supporting structure 830 may include connection manners such as welding, clamping, bonding, or integral molding, and the connection manner is not limited here. In some embodiments, the vibrating component may not include the support structure 830, the cantilever beam 821 may be disposed inside or outside the conduction channel along the radial section of the conduction channel, and the cantilever beam 821 may not completely cover the conduction channel.

In some embodiments, the material of the cantilever beam 821 includes at least one of copper, aluminum, tin, silicon, silicon oxide, silicon nitride, silicon carbide, aluminum nitride, zinc oxide, lead zirconate titanate or alloys. In some embodiments, the mass block 822 can be arranged on any side of the cantilever beam 821 in the vibration direction. Out) side for explanation.

In some embodiments, at least one mass block 822 is disposed on either side of the free end of the cantilever beam 821 perpendicular to the vibration direction. The sizes of the masses 822 may be partly or all the same, or all different. In some embodiments, the distances between adjacent masses 822 may be the same or different. In actual use, it can be designed according to the vibration mode.

Referring to FIG. 8A to FIG. 8C at the same time, in some embodiments, three mass blocks 822 are arranged on the cantilever beam 821 . The three mass blocks 822 on the cantilever beam 821 have the same size and the three mass blocks 822 are collinear at the center point of the cantilever beam 821 . In some embodiments, since the width of the cantilever beam 821 is relatively narrow in the horizontal direction perpendicular to the vibration direction, preferably, one or more mass blocks 822 are arranged collinearly with the cantilever beam 821 to obtain a more stable sensitivity improvement.

In some embodiments, the cantilever beam 821 has a rectangular profile in the radial section. In some other embodiments, the cantilever beam 821 can have a rectangular, triangular, trapezoidal, rhombus and other curved shapes in the radial section. In some embodiments, multiple resonance peaks of the vibration sensor can be adjusted by changing the material, shape and size of the cantilever beam 821 and the mass block 822. Since the principle of using a cantilever beam or a diaphragm as a plate-like structure is similar, therefore For the specific adjustment method, please refer to the formula (1) above, and the diaphragm parameters in the formula (1) can be directly replaced by the parameters of the cantilever beam 821 .

In some embodiments, vibration sensors can be applied to MEMS device designs. In some embodiments, the vibration sensor can be applied to the design of macroscopic devices (such as microphones, speakers, etc.). In the MEMS device process, the cantilever beam 821 can be a single-layer material along the thickness direction, such as Si, SiO2, SiNx, SiC, etc., or can be a double-layer or multi-layer composite material, such as Si/SiO2, SiO2/Si, Si/SiNx , SiNx/Si/SiO2, etc. The mass 822 can be a single-layer material, such as Si, Cu, etc., or a double-layer or multi-layer composite material, such as Si/SiO2, SiO2/Si, Si/SiNx, SiNx/Si/SiO2, etc. In the embodiment of the present disclosure, the material of the cantilever beam 821 in the MEMS device is Si or SiO2/SiNx, and the material of the mass block 822 is Si. In the MEMS device process, in some embodiments, the length of the cantilever beam 821 can be 500 μm to 1500 μm; in some embodiments, the thickness of the cantilever beam 821 can be 0.5 μm to 5 μm; in some embodiments, the side length of the proof mass 822 It may be 50 μm˜1000 μm; in some embodiments, the height of the proof mass 822 may be 50 μm˜5000 μm. In some embodiments, the length of the cantilever beam 821 can be 700 μm-1200 μm, the thickness of the cantilever beam 821 can be 0.8 μm-2.5 μm; the side length of the mass block 822 can be 200 μm-600 μm, and the height of the mass block 822 can be 200 μm-1000 μm.

In a macroscopic device, the material of the cantilever beam 821 can be an inorganic non-metallic material, such as aluminum nitride, zinc oxide, lead zirconate titanate, etc., or a metal material, such as copper, aluminum, tin or other alloys, or a combination of the above materials Wait. The mass block 822 is generally required to have a certain mass in a volume as small as possible, so it needs to have a high density, and its material can be copper, tin or other alloys, or ceramic materials. Preferably, the material of the cantilever beam 821 is aluminum nitride or copper, and the material of the mass block 822 is a tin block or a copper block. In a macro device, the length of the cantilever beam 821 can be 1 mm to 20 cm, and the thickness of the cantilever beam 821 can be 0.1 mm to 10 mm; in some embodiments, the side length of the mass block 822 can be 0.2 mm to 5 cm, and the height of the mass block 822 can be 0.1mm～10mm. In some embodiments, the length of the cantilever beam 821 can be 1.5 mm to 10 mm, the thickness of the cantilever beam 821 can be 0.2 mm to 5 mm; the side length of the mass block 822 can be 0.3 mm to 5 cm, and the height of the mass block 822 can be 0.5 mm to 5 cm. .

9A-9B are structural schematic diagrams of a vibration component of a vibration sensor according to some embodiments of the present specification.

As shown in FIG. 9A , in some embodiments, two mass blocks 922 may be disposed on the cantilever beam 921 of the vibrating assembly 920 , and the two mass blocks 922 have different heights in the vibration direction. In some embodiments, the height of the mass block 922 near the free end of the cantilever beam 921 may be lower than the height of the mass block 922 away from the free end. In some embodiments, as shown in FIG. 9B , the mass 922 close to the free end of the cantilever beam 921 may be higher than the mass 922 far from the free end. It should be noted that even though other structural parameters of the two mass blocks 922 are the same, since the positions of the mass blocks 922 in the two cases in Fig. 9A and Fig. 9B are different, in some embodiments, the two cases may have two different form of harmonic peaks.

Fig. 10 is a schematic structural diagram of a vibration component of a vibration sensor according to some embodiments of the present specification.

Fig. 11 is a schematic structural diagram of a vibration component of a vibration sensor according to some embodiments of the present specification.

As shown in FIG. 10 and FIG. 11 , in some embodiments, the mass blocks 1022 on the cantilever beam may also include one or four. The structural parameters of the four mass blocks 1022 arranged on the cantilever beam may be the same, some of them may be different, or all of them may be different.

Fig. 12 is a schematic diagram of frequency response curves when the vibration components in the vibration sensor have different numbers of mass blocks according to some embodiments of the present specification.

As shown in FIG. 12 , in some embodiments, the frequency response curve of the vibration sensor under the action of the cantilever beam and the proof mass has one or more resonance peaks. Fig. 12 comprises three frequency response curves of frequency response curve 1210, frequency response curve 1220 and frequency response curve 1230, wherein, frequency response curve 1210 represents when a quality block is arranged on the cantilever beam (as shown in Figure 10), the frequency of the vibration sensor Response curve; frequency response curve 1220 represents that when two mass blocks are arranged on the cantilever beam (as shown in Figure 9A or 9B), the frequency response curve of the vibration sensor; frequency response curve 1230 represents that when three mass blocks are arranged on the cantilever beam, The frequency response curve of the vibration sensor (as shown in Figure 8A). It can be seen from the figure that the frequency response curve 1210 has one resonance peak, the frequency response curve 1220 has two resonance peaks, and the frequency response curve 1230 has three resonance peaks.

In some embodiments, the configuration of the mass blocks on the cantilever beam can refer to the previous methods, for example, the configuration of one mass block can refer to Figure 10; the configuration of three mass blocks can refer to Figure 8a. It can be seen from the figure that when there is only one mass, the resonance peak of the vibration sensor is around 10kHz, and when there are two resonance peaks, the vibration sensor forms two resonance peaks at 3kHz and 13kHz. By setting two The quality block makes the sensitivity significantly improved within the target frequency (for example, within the range of 2kHz-15kHz) near these two frequency points. When three mass blocks are placed on the same cantilever beam, the vibration sensor forms three resonance peaks. Specifically, three resonance peaks are formed at 2250Hz, 7600Hz and 15700Hz of the vibration sensor, so that the target frequency near these three frequency points ( For example, the sensitivity of 1kHz to 20kHz has been significantly improved, and the frequency response curve is naturally divided into three different frequency band intervals, which is beneficial to subsequent signal processing. Further, it can be seen from the figure that with the increase of the number of mass blocks, the overall sensitivity of the vibration sensor is also improved. For example, when the frequency response curve 1230 is in the low frequency band (such as below 1kHz), its sensitivity is still higher than that of the frequency response curve 1230. From the curve 1210, it can be seen that after setting the plate structure and the mass block reasonably, the bandwidth of the frequency band with higher sensitivity can be widened, and the sensitivity in the target frequency band can be improved.

In some embodiments of the present specification, there is also provided a sound input device, which includes the sensor in the foregoing embodiments, through which the vibration signal is converted into an electrical signal for further processing.

Fig. 13 is a schematic structural diagram of a vibration sensor according to some embodiments of the present specification.

As shown in FIG. 13 , the vibration sensor 1300 may be a specific implementation of the vibration sensor 100 in FIG. 1 . In some embodiments, vibration sensor 1300 includes an acoustic transducer 1310 and a vibration assembly. The vibrating assembly includes a cantilever beam 1321 , a mass block 1323 , a diaphragm 1322 and a plurality of mass blocks 1324 in sequence in a direction away from the acoustic transducer 1310 in the conduction channel 1311 . In some embodiments, the vibrating membrane 1322 may be a gas-permeable membrane or an air-impermeable membrane. Exemplarily, the vibrating membrane 1322 is an air-impermeable membrane. In some embodiments, the cantilever beam 1321 can also be arranged on the side of the diaphragm 1322 away from the acoustic transducer 1310 , and in this embodiment, the diaphragm 1322 can be a gas-permeable membrane.

In some embodiments, the cantilever beam 1321 and the mass block 1323 may correspond to one resonance frequency; the diaphragm 1322 and the plurality of mass blocks 1324 may correspond to one or two resonance frequencies. In some embodiments, the aforementioned three resonance frequencies can be set to be different, so that the frequency response curve of the vibration sensor under the action of the vibration component 1300 has three resonance peaks, thereby forming multiple high-sensitivity frequency intervals and wider frequency band.

Fig. 14 is a schematic diagram of a modular structure of an earphone according to some embodiments of the present specification.

As shown in FIG. 14 , the earphone 1 includes a vibration system 10 for receiving vibrations (such as picking up sound) for further processing. The vibration system 10 can be the vibration component 120 in the vibration sensor 100 in FIG. 1 .

Wherein, for other functional components in the earphone 1, please refer to the general earphone 1, and further description of the remaining functional components will not be given here.

In the above scheme, at least two resonant peaks can be formed on the frequency response curve through reasonable vibrating parts and design, thereby forming multiple high-sensitivity frequency intervals and wider frequency bands.

The basic concepts have been described above, and obviously, for those skilled in the art, the above disclosure of the invention is only an example, and does not constitute a limitation to this specification. Although not expressly stated here, those skilled in the art may make various modifications, improvements and corrections to this description. Such modifications, improvements and corrections are suggested in this specification, so such modifications, improvements and corrections still belong to the spirit and scope of the exemplary embodiments of this specification.

Meanwhile, this specification uses specific words to describe the embodiments of this specification. For example, "one embodiment", "an embodiment" and/or "some embodiments" refer to a certain feature, structure or characteristic related to at least one embodiment of this specification. Therefore, it should be emphasized and noted that two or more references to "an embodiment" or "an embodiment" or "an alternative embodiment" in different places in this specification do not necessarily refer to the same embodiment . In addition, certain features, structures or characteristics in one or more embodiments of this specification may be properly combined.

In addition, those skilled in the art will understand that various aspects of this specification can be illustrated and described by several patentable categories or situations, including any new and useful process, machine, product or combination of substances or their combination Any new and useful improvements. Correspondingly, various aspects of this specification may be entirely executed by hardware, may be entirely executed by software (including firmware, resident software, microcode, etc.), or may be executed by a combination of hardware and software. The above hardware or software may be referred to as "block", "module", "engine", "unit", "component" or "system". Additionally, aspects of this specification may be embodied as a computer product comprising computer readable program code on one or more computer readable media.

In addition, unless explicitly stated in the claims, the sequence of processing elements and sequences described in this specification, the use of numbers and letters, or the use of other names are not used to limit the sequence of processes and methods in this specification. While the foregoing disclosure has discussed by way of various examples some embodiments of the invention that are presently believed to be useful, it should be understood that such detail is for illustrative purposes only and that the appended claims are not limited to the disclosed embodiments, but rather, the claims The claims are intended to cover all modifications and equivalent combinations that fall within the spirit and scope of the embodiments of this specification. For example, although the system components described above may be implemented by hardware devices, they may also be implemented by a software-only solution, such as installing the described system on an existing server or mobile device.

In the same way, it should be noted that in order to simplify the expression disclosed in this specification and help the understanding of one or more embodiments of the invention, in the foregoing description of the embodiments of this specification, sometimes multiple features are combined into one embodiment, drawings or descriptions thereof. This method of disclosure does not, however, imply that the subject matter of the specification requires more features than are recited in the claims. Indeed, embodiment features are less than all features of a single foregoing disclosed embodiment.

In some embodiments, numbers describing the quantity of components and attributes are used. It should be understood that such numbers used in the description of the embodiments use modifiers such as "about", "approximately" or "substantially" in some examples. to modify. Unless otherwise stated, "about", "approximately" or "substantially" indicates that the stated figure allows for a variation of ±20%. Accordingly, in some embodiments, the numerical data used in the specification and claims are approximations that can vary depending upon the desired characteristics of individual embodiments. In some embodiments, numerical data should take into account the specified significant digits and adopt the general digit reservation method. Although the numerical ranges and data used in certain embodiments of this specification to confirm the breadth of the ranges are approximations, in specific embodiments, such numerical values are set as precisely as practicable.

Finally, it should be understood that the embodiments described in this specification are only used to illustrate the principles of the embodiments of this specification. Other modifications are also possible within the scope of this specification. Therefore, by way of example and not limitation, alternative configurations of the embodiments of this specification may be considered consistent with the teachings of this specification. Accordingly, the embodiments of this specification are not limited to the embodiments explicitly introduced and described in this specification.

Claims (36)

1. A vibration sensor comprising:

   transducer;

   a vibration component connected to the transducer, the vibration component is configured to transmit an external vibration signal to the transducer to generate an electrical signal, the vibration component includes one or more plate-like structures and the one or more masses physically connected to each of the one or more plate-like structures;

   The vibration assembly is configured such that the sensitivity of the vibration sensor is greater than the sensitivity of the transducer in one or more frequency bands of interest.
2. The vibration sensor according to claim 1, wherein the frequency response curve of the vibration sensor under the action of the vibration component has a plurality of resonance peaks.
3. The vibration sensor of claim 1, wherein said one or more masses coupled to one of said one or more plate-like structures comprises at least two masses.
4. The vibration sensor according to claim 3, wherein said at least two masses are different in at least one structural parameter, said structural parameter including size, mass, density and shape.
5. The vibration sensor according to claim 1, wherein, in the vibration direction of the vibration assembly, the projection of the one or more mass blocks is located in a plate shape within the projection of the plate structure.
6. The vibration sensor according to claim 1, wherein the vibration assembly further comprises a support structure for supporting the plate structure, the support structure is physically connected to the transducer, and the plate structure is connected to the support structure.
7. 6. The vibration sensor of claim 6, wherein the support structure is made of an air impermeable material.
8. The vibration sensor according to claim 6, wherein,

   In a direction perpendicular to a surface connected to the one plate structure and the one or more masses, the projected area of the proof mass does not overlap with the projected area of the supporting structure.
9. The vibration sensor according to claim 3, wherein said one plate structure and at least two masses physically connected to said one plate structure correspond to a plurality of target frequency bands in said target frequency band, so that in said The sensitivity of the vibration sensor in the corresponding multiple target frequency bands is greater than the sensitivity of the transducer.
10. The vibration sensor according to claim 9, wherein said one plate-like structure and at least two masses physically connected to said one plate-like structure have multiple resonance frequencies, at least one of said multiple resonance frequencies is less than The resonant frequency of the transducer is such that the sensitivity of the vibration sensor is greater than the sensitivity of the transducer in a plurality of the one or more target frequency bands.
11. The vibration sensor according to claim 9, wherein the plurality of resonant frequencies of the one plate structure and at least two masses physically connected to the one plate structure are the same or different.
12. The vibration sensor according to claim 9, wherein at least one of the resonance frequencies of the plurality of resonant frequencies of the one plate-like structure and at least two masses physically connected to the one plate-like structure is the same as that of the transducer The difference between the resonant frequencies of the transducers is within 1kHz˜10kHz.
13. The vibration sensor according to claim 12, wherein, among the plurality of resonant frequencies of the one plate-shaped structure and at least two mass blocks physically connected to the one plate-shaped structure, the difference between two adjacent resonant frequencies is different Less than 2kHz.
14. The vibration sensor according to claim 12, wherein, among the plurality of resonant frequencies of the one plate-shaped structure and at least two mass blocks physically connected to the one plate-shaped structure, the difference between two adjacent resonant frequencies is different Not greater than 1kHz.
15. The vibration sensor according to claim 9, wherein the resonance frequency of the one plate structure and at least two masses physically connected to the one plate structure is within 1 kHz˜10 kHz.
16. The vibration sensor according to claim 9, wherein the resonance frequency of the one plate structure and at least two masses physically connected to the one plate structure is within 1kHz˜5kHz.
17. The vibration sensor according to claim 9, wherein the plurality of resonant frequencies of the one plate-like structure and at least two masses physically connected to the one plate-like structure are the same as those of the plate-like structure and/or or the parameters of the mass block, the parameters include the modulus of the plate-like structure, the volume of the cavity formed between the transducer and the plate-like structure, the radius of the mass block, the At least one of the height of the proof mass and the density of the proof proof mass.
18. The vibration sensor according to claim 1, wherein at least one of the one or more masses connected to one of the one or more plate structures is connected to the one plate structure Concentric setting.
19. The vibration sensor of claim 1, wherein at least one of the one or more plate-like structures comprises a diaphragm.
20. The vibration sensor according to claim 19, wherein the one or more masses connected to the diaphragm are arranged on the side of the diaphragm facing the transducer, or arranged on the side facing away from the diaphragm side of the transducer.
21. The vibration sensor according to claim 19, wherein the diaphragm comprises polytetrafluoroethylene, expanded polytetrafluoroethylene, polyethersulfone, polyvinylidene fluoride, polypropylene, polyethylene terephthalate, At least one of nylon, nitrocellulose or mixed cellulose.
22. The vibration sensor according to claim 19, wherein, in the vibration direction of the diaphragm, the projection area of the one or more masses is located within the projection area of the diaphragm.
23. The vibration sensor according to claim 19, wherein the number of the one or more masses connected to the diaphragm can be greater than 1, and they are respectively arranged on both sides of the diaphragm perpendicular to the vibration direction .
24. The vibration sensor according to claim 19, wherein the number of the one or more mass blocks connected to the diaphragm can be greater than or equal to 3; the mass blocks are not collinearly arranged.
25. The vibration sensor of claim 1, wherein at least one of the one or more plate-like structures comprises a cantilever beam.
26. The vibration sensor according to claim 25, wherein the material of the cantilever beam comprises copper, aluminum, tin, silicon, silicon oxide, silicon nitride, silicon carbide, aluminum nitride, zinc oxide, lead zirconate titanate or an alloy at least one of the
27. The vibration sensor according to claim 25, wherein the one or more masses connected to the cantilever beam are arranged at the free end of the cantilever beam.
28. The vibration sensor according to claim 25, wherein the one or more masses connected to the cantilever beam are arranged in-line with the cantilever beam.
29. The vibration sensor of claim 1, wherein the transducer further comprises a conductive channel;

    The vibration component is arranged in the conduction channel along the radial section of the conduction channel; or,

    It is arranged on the outside of the conduction channel.
30. 29. The vibration sensor of claim 29, wherein the one or more masses connected to at least one of the one or more plate-like structures are not in contact with an inner wall of the conductive channel.
31. The vibration sensor according to claim 29, wherein at least one of the one or more plate structures is provided with a through hole.
32. The vibration sensor of claim 29, wherein at least one of the one or more plate-like structures does not completely cover the conductive channel.
33. 29. The vibration sensor of claim 29, wherein a plate-like structure of the one or more plate-like structures that is farthest from the transducer is configured to close the conductive path.
34. A sound input device comprising the vibration sensor described in any one of claims 1-34 above.
35. A vibration system comprising:

    plate structure;

    a vibrating element connected to the plate structure;

    At least one mass is connected to the vibrating element, and in the vibration direction of the vibrating element, the projection of the mass is located within the projection of the vibrating element.
36. An earphone comprising the vibration system as claimed in claim 35.

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