CN116636235A

CN116636235A - Vibration sensor

Info

Publication number: CN116636235A
Application number: CN202180083432.1A
Authority: CN
Inventors: 袁永帅; 邓文俊; 周文兵; 黄雨佳; 廖风云; 齐心
Original assignee: Shenzhen Voxtech Co Ltd
Current assignee: Shenzhen Voxtech Co Ltd
Priority date: 2021-07-02
Filing date: 2021-08-19
Publication date: 2023-08-22
Also published as: US20230300519A1; TW202303112A

Abstract

A vibration sensor (100), comprising: a transducer (110) and a vibration assembly (120) connected to the transducer (110), the vibration assembly (120) being configured to transmit an external vibration signal to the transducer (110) to generate an electrical signal, the vibration assembly (120) comprising one or more plate-like structures (121) and one or more masses (122) physically connected to each plate-like structure (121) of the one or more plate-like structures (121); the vibration assembly (120) is configured to cause a sensitivity of the vibration sensor (100) to be greater than a sensitivity of the transducer (110) within one or more target frequency bands.

Description

Vibration sensor

Cross reference

The present application claims priority from China application number 202110751143.6 filed on 7/2 of 2021 and priority from PCT International application number PCT/CN2021/112017 filed on 8/11 of 2021, which are incorporated herein by reference in their entirety.

Technical Field

The present disclosure relates to the field of sensors, and more particularly to a vibration sensor including a vibration assembly.

Background

A vibration sensor is an energy conversion device that converts a vibration signal into an electrical signal, and its uses include as a microphone (e.g., air conduction microphone, bone conduction microphone, etc.) or monitoring device, etc. Vibration sensors can be used to obtain data such as the amplitude and direction of vibration and convert it into an electrical signal or other desired form for further analysis and processing.

The present specification provides a vibration sensor that increases the sensitivity of the vibration sensor without increasing the transducer.

Disclosure of Invention

One of the embodiments of the present specification provides a vibration sensor including: a transducer; a vibration assembly coupled to the transducer, the vibration assembly configured to transmit an external vibration signal to the transducer to generate an electrical signal, the vibration assembly comprising one or more plate-like structures and one or more masses physically coupled to each of the one or more plate-like structures; the vibration assembly is configured to cause the sensitivity of the vibration sensor to be greater than the sensitivity of the transducer in one or more target frequency bands.

In some embodiments, the frequency response curve of the vibration sensor under the action of the vibration component has a plurality of resonance peaks.

In some embodiments, the one or more masses connected to one of the one or more plate-like structures comprises at least two masses.

In some embodiments, at least one structural parameter of the at least two masses is different, the structural parameter including size, mass, density, and shape.

In some embodiments, the projection of the one or more masses is located in a plate shape within the projection of the plate-like structure in the vibration direction of the vibration assembly.

In some embodiments, the vibration assembly further comprises a support structure for supporting the plate-like structure, the support structure being physically connected to the transducer, the plate-like structure being connected to the support structure.

In some embodiments, the support structure is made of a gas impermeable material.

In some embodiments, the projected area of the mass does not overlap the projected area of the support structure in a direction perpendicular to the surface to which the one plate-like structure and the one or more masses are connected.

In some embodiments, the one plate-like structure and the at least two masses physically connected to the one plate-like structure correspond to a plurality of the target frequency bands such that the sensitivity of the vibration sensor is greater than the sensitivity of the transducer within the corresponding plurality of target frequency bands.

In some embodiments, the one plate-like structure and the at least two masses physically connected to the one plate-like structure have a plurality of resonant frequencies, at least one of the plurality of resonant frequencies being less than a resonant frequency of the transducer such that a sensitivity of the vibration sensor is greater than a sensitivity of the transducer at a plurality of target frequency bands of the one or more target frequency bands.

In some embodiments, the plurality of resonant frequencies of the one plate-like structure and the at least two masses physically connected to the one plate-like structure are the same or different.

In some embodiments, wherein a difference between at least one of the plurality of resonant frequencies of the one plate-like structure and at least two masses physically connected to the one plate-like structure and the resonant frequency of the transducer is within 1kHz to 10 kHz.

In some embodiments, the one plate-like structure and the at least two masses physically connected to the one plate-like structure have adjacent two of the plurality of resonant frequencies that differ by less than 2kHz.

In some embodiments, the one plate-like structure and the at least two masses physically connected to the one plate-like structure have adjacent two of the plurality of resonant frequencies that differ by no more than 1kHz.

In some embodiments, the one plate-like structure and the at least two masses physically connected to the one plate-like structure have the resonant frequency within 1kHz to 10 kHz.

In some embodiments, the plate-like structure and the plurality of masses physically connected to the plate-like structure have the resonant frequency within 1kHz to 5 kHz.

In some embodiments, the one plate-like structure and the at least two masses physically connected to the one plate-like structure have the plurality of resonant frequencies plate-like related to parameters of the plate-like structure and/or the masses including at least one of a modulus of the plate-like structure, a volume forming a cavity between the transducer and the plate-like structure, a radius of the masses, a height of the masses, and a density of the masses.

In some embodiments, at least one of the one or more masses connected to one of the one or more plate-like structures is disposed concentric with the one plate-like structure.

In some embodiments, the one or more plate-like structures include a diaphragm therein.

In some embodiments, the one or more masses connected to the diaphragm are disposed on a side of the diaphragm facing the transducer or on a side of the diaphragm facing away from the transducer.

In some embodiments, the diaphragm comprises at least one of polytetrafluoroethylene, expanded polytetrafluoroethylene, polyethersulfone, polyvinylidene fluoride, polypropylene, polyethylene terephthalate, nylon, nitrocellulose, or mixed cellulose.

In some embodiments, the projection area of the mass is located within the projection area of the diaphragm in the vibration direction of the diaphragm.

In some embodiments, the number of the one or more mass blocks connected with the diaphragm may be greater than 1, and the one or more mass blocks are respectively disposed on two sides of the diaphragm perpendicular to the vibration direction.

In some embodiments, the number of the one or more masses connected to the diaphragm may be greater than or equal to 3; the at least three masses are not arranged co-linearly.

In some embodiments, at least one of the one or more plate-like structures comprises a cantilever beam.

In some embodiments, the material of the cantilever includes at least one of copper, aluminum, tin, silicon oxide, silicon nitride, silicon carbide, aluminum nitride, zinc oxide, lead zirconate titanate, or an alloy.

In some embodiments, the one or more masses connected to the cantilever beam are disposed at a free end of the cantilever beam.

In some embodiments, the one or more masses connected to the cantilever beam are disposed with the cantilever Liang Gongxian.

In some embodiments, the transducer further comprises a conductive pathway; the vibration component is arranged in the conduction channel along the radial section of the pickup hole; or, is provided outside the conduction channel.

In some embodiments, the one or more connected to at least one of the one or more plate-like structures do not contact an inner wall of the conductive pathway.

In some embodiments, at least one of the one or more plate-like structures is perforated with a through hole.

In some embodiments, at least one of the one or more plate-like structures does not completely cover the conductive via.

In some embodiments, a plate-like structure of the one or more plate-like structures that is furthest from the transducer is configured to enclose the conductive channel.

One of the embodiments of the present specification provides a sound input device including any one of the vibration sensors described above.

One of the embodiments of the present specification provides a vibration system including: a plate-like structure; a vibrating member connected to the plate-like structure; and the projection of the balancing weight is positioned in the projection of the vibrating piece in the vibrating direction of the vibrating piece.

One of the embodiments of the present disclosure provides a headset comprising a vibration system as described above.

Drawings

The present specification will be further elucidated by way of example embodiments, which will be described in detail by means of the accompanying drawings. These embodiments are not limiting, and in these embodiments like numbers represent similar structures, wherein:

FIG. 1 is a schematic, modular construction of a vibration sensor according to some embodiments of the present disclosure;

FIG. 2 is a schematic diagram of a vibration sensor according to some embodiments of the present disclosure;

FIG. 3 is a schematic illustration of an exemplary vibration assembly shown according to some embodiments of the present description;

FIGS. 4A-4C are schematic illustrations of exemplary vibration assemblies shown according to some embodiments of the present description;

5A-5B are schematic illustrations of exemplary vibration assemblies shown according to some embodiments of the present description;

FIG. 6 is a schematic diagram of an exemplary vibration assembly shown according to some embodiments of the present description;

FIG. 7 is a schematic illustration of a frequency response curve for vibration assemblies having different numbers of masses in a vibration sensor according to some embodiments of the present disclosure;

8A-8C are schematic structural views of vibration assemblies of vibration sensors shown in accordance with some embodiments of the present description;

9A-9B are schematic structural views of vibration assemblies of vibration sensors according to some embodiments of the present disclosure;

FIG. 10 is a schematic structural view of a vibration assembly of a vibration sensor according to some embodiments of the present disclosure;

FIG. 11 is a schematic structural view of a vibration assembly of a vibration sensor according to some embodiments of the present disclosure;

FIG. 12 is a schematic illustration of a frequency response curve for vibration assemblies having different numbers of masses in a vibration sensor according to some embodiments of the present disclosure;

FIG. 13 is a schematic diagram of a vibration sensor according to some embodiments of the present disclosure; and

fig. 14 is a schematic diagram of a modular construction of headphones according to some embodiments of the present description.

Detailed Description

In order to more clearly illustrate the technical solutions of the embodiments of the present specification, the drawings used in the description of the embodiments will be briefly described below. It is apparent that the drawings in the following description are only some examples or embodiments of the present specification, and it is possible for those of ordinary skill in the art to apply the present specification to other similar situations according to the drawings without inventive effort. It should be understood that these exemplary embodiments are presented merely to enable those skilled in the relevant art to better understand and practice the invention and are not intended to limit the scope of the invention in any way. Unless otherwise apparent from the context of the language or otherwise specified, like reference numerals in the figures refer to like structures or operations.

As used in this specification and the claims, the terms "a," "an," "the," and/or "the" are not specific to a singular, but may include a plurality, unless the context clearly dictates otherwise. In general, the terms "comprises" and "comprising" merely indicate that the steps and elements are explicitly identified, and they do not constitute an exclusive list, as other steps or elements may be included in a method or apparatus. The term "based on" is based at least in part on. The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment". Related definitions of other terms will be given in the description below.

In some embodiments, the means for converting vibrations to electrical signals comprises a transducer. Typically a single transducer has only one resonant peak and the transducer has a higher sensitivity only around the frequency of the resonant peak. In some embodiments, in order to increase the sensitivity of the vibration sensor, the receiving frequency range and the sensitivity are increased by providing a plurality of transducers having different resonance peaks, but increasing the number of transducers results in an increase in the volume and manufacturing cost of the vibration sensor.

In view of this, the present specification relates to a vibration sensor that makes the sensitivity of the vibration sensor in a target frequency band greater than the sensitivity of the transducer by a vibration assembly connected to the transducer. The vibration sensor may be used to receive an external vibration signal, which may include a mechanical vibration signal or a signal, etc., and convert the vibration signal into an electrical signal capable of reflecting sound information. The vibration assembly may include a plate-like structure and one or more masses physically connected to the plate-like structure, the masses being disposed on one side of the plate-like structure. The vibration assembly is configured to cause the sensitivity of the vibration sensor to be greater than the sensitivity of the transducer in one or more target frequency bands.

FIG. 1 is a schematic diagram of a modular construction of a vibration sensor according to some embodiments of the present disclosure.

As shown in fig. 1, the vibration sensor 100 may include a transducer 110 and a vibration assembly 120. In some embodiments, the transducer 110 is coupled to the vibration assembly 120, and the vibration assembly 120 is configured to transmit an external vibration signal to the transducer to generate an electrical signal. When vibration occurs in the external environment, the vibration assembly 120 responds to the vibration of the external environment and transmits a vibration signal to the transducer 110, and the transducer 120 converts the vibration signal into an electrical signal. The vibration sensor 100 may be applied to a mobile device, a wearable device, a virtual reality device, an augmented reality device, etc., or any combination thereof.

In some embodiments, the transducer 110 may be an acoustic transducer, which may include a microphone. Specifically, the microphone may be a microphone in which bone conduction is one of the main modes of sound transmission or a microphone in which air conduction is one of the main modes of sound transmission. Taking a microphone with air-air conduction as one of the main transmission modes of sound as an example, the microphone can acquire the sound pressure change of a conduction channel (such as a pick-up hole) and convert the sound pressure change into an electric signal. In some embodiments, the transducer may be an accelerometer, which is a specific application of a spring-vibration system, that receives vibration signals through a sensing device to obtain an electrical signal, and processes the electrical signal to obtain acceleration. In some embodiments, the accelerometer operates at a lower frequency than the acoustic transducer.

In some embodiments, the mobile device may include a smart phone, a tablet, a Personal Digital Assistant (PDA), a gaming device, a navigation device, etc., or any combination thereof. In some embodiments, the wearable device may include a smart bracelet, an earphone, a hearing aid, a smart helmet, a smart watch, a smart garment, a smart backpack, a smart accessory, or the like, or any combination thereof. In some embodiments, the virtual reality device and/or the augmented reality device may include a virtual reality helmet, virtual reality glasses, virtual reality patches, augmented reality helmets, augmented reality glasses, augmented reality patches, and the like, or any combination thereof. For example, the virtual reality device and/or the augmented reality device may include Google Glass, oculus lift, hollens, gear VR, and the like.

As shown in fig. 1, the vibration assembly 120 includes one or more plate-like structures 121 and one or more masses 122. In some embodiments, each of the one or more plate-like structures 121 is connected to at least one of the one or more masses 122. The vibration assembly 120 is configured to cause the sensitivity of the vibration sensor 100 to be greater than the sensitivity of the transducer 110 in one or more target frequency bands. In some embodiments, a structure formed of a plate-like structure and a mass physically connected to the plate-like structure may also be referred to as a resonant structure. Plate-like structure 121 may refer to a structure made of a flexible or rigid material that can be used to carry one or more masses. The mass 122 is a relatively small and heavy object, and in some embodiments, the volume and the mass of the mass may be different according to the usage scenario and the target frequency of the vibration assembly 120, and reference may be made to the descriptions of fig. 2 and 8, where the descriptions of fig. 2 and 8 are merely one embodiment of the present solution, and are not intended to limit the scope of the present invention.

In some embodiments, the plate-like structure 121 may comprise a single plate-like structure (which may also be referred to as a plate-like member). In some embodiments, the plate-like structure 121 may include a plurality of plate-like members, e.g., 2, 3, 4, etc.

In some embodiments, at least one mass connected to each plate-like structure may comprise a single mass. In some embodiments, the at least one mass connected to each plate-like structure may comprise a plurality of masses, e.g., 2, 3, 4, etc.

In some embodiments, at least one of the plate-like structures 121 connects at least two masses 122.

In some embodiments, the vibration assembly 120 further comprises a support structure for supporting the plate-like structure 121, the support structure being physically connected to the transducer 110, the plate-like structure 121 being connected to the support structure.

In some embodiments, one or more masses 122 may be provided on either side of the plate-like structure in the direction of vibration, and in some embodiments, a plurality of masses may also be provided on either side of the plate-like structure in the direction of vibration, respectively. In some embodiments, the projected area of the mass to which it is connected is located within the projected area of the plate-like structure in the direction of vibration of the plate-like structure. In some embodiments, the sum of the cross-sectional areas of the one or more masses 122 on one side is less than the cross-sectional area of the plate-like structure in a direction parallel to the surface to which the plate-like structure and masses are connected (i.e., perpendicular to the vibration direction). In some embodiments, the mass is driven by the plate-shaped structure to vibrate in the same direction as the plate-shaped structure.

In some embodiments, the one or more plate-like structures 121 and the plurality of masses 122 physically coupled to the plate-like structures correspond to a plurality of target frequency bands such that the sensitivity of the vibration sensor 100 is greater than the sensitivity of the transducer 110 within the corresponding plurality of target frequency bands. In some embodiments, the combination of at least one plate-like structure and the mass is capable of producing a greater amplitude of the vibration signal near its resonant frequency when it receives the vibration signal, thereby increasing the sensitivity of the vibration sensor 100.

In some embodiments, the method of measuring the sensitivity of the vibration sensor 100 and transducer 110 may be: under the excitation of given acceleration (such as 1g and g as gravitational acceleration), the intensity of the electric signal (such as-30 dBV) of the acquisition device is the sensitivity (such as-30 dBV/g). For example, the strength of the electrical signals output by the vibration sensor 100 and the transducer 110 may be collected given the same acceleration (e.g., 1g, g for gravitational acceleration) excitation to obtain the sensitivity of the vibration sensor 100 and the transducer 110. In some embodiments, for example, when the transducer 110 is a microphone, the aforementioned excitation source may be replaced by sound pressure when measuring sensitivity, that is, the sound pressure in the specified frequency band (the input mode of the sound pressure may be bone conduction as the main transmission mode of sound or air conduction as the main transmission mode of sound) is input as excitation, and the electrical signal of the collecting device is measured.

In some embodiments, to accommodate multiple vibration modes, the formed vibration assembly of a plate-like structure and one or more masses 122 physically connected to the plate-like structure may have multiple resonant frequencies, which may be the same or different. At least one structural parameter of at least two of the plurality of masses may be different. The structural parameters of the mass may include size, mass, density, shape, etc. In particular, the size of the mass may be at least one of a length, a width, a height, a cross-sectional area, or a volumetric parameter of the mass.

In some embodiments, the frequency response curve of vibration sensor 100 under the action of vibration assembly 120 has a plurality of resonant peaks.

In some embodiments, the difference between at least one of the plurality of resonant frequencies of the resonant structure formed by the one plate-like structure and the plurality of masses physically coupled to the plate-like structure and the resonant frequency of the transducer 100 is within 1kHz to 10 kHz. In some embodiments, one plate-like structure 121 and the plurality of masses 122 physically connected to the plate-like structure 121 have adjacent two of the plurality of plate-like structure 121 resonant frequencies that differ by less than 2kHz. In some embodiments, one plate-like structure 121 and the plurality of masses 122 physically connected to the plate-like structure 121 have adjacent two of the plurality of plate-like structure 121 resonant frequencies that differ by no more than 1kHz.

In some embodiments, one plate-like structure 121 and a plurality of masses 122 physically connected to the plate-like structure 121 have a resonant frequency within 1kHz to 10 kHz. In some embodiments, one plate-like structure 121 and a plurality of masses 122 physically connected to the plate-like structure 121 have a resonant frequency within 1kHz to 5 kHz.

By providing at least one mass 122 in the vibration assembly 120, the vibration assembly 120 can be provided with multiple vibration modes, thereby providing a vibration sensor with a frequency response curve having two or more resonant peaks. Since the sensitivity of the vibration sensor increases in the frequency range in which the resonance peak is located, the frequency response curve has two or more resonance peaks, which can increase the frequency range in which the sensitivity of the vibration sensor is high. Wherein the vibration mode is a vibration state having a fixed frequency, damping ratio and vibration mode. Different vibration modes correspond to different deformation forms, for example, a plurality of mass blocks vibrate upwards synchronously; one mass vibrating upward, one mass vibrating downward, etc. The mode of vibration depends on the characteristics of the vibration assembly 120 itself, such as the stiffness and dimensions of the mass 122, the size, location, and density of the counterweight, etc. In some embodiments, one mass may produce one mode, two masses may produce two modes, three masses may produce three effective modes, or two effective modes. The effective mode refers to a mode capable of changing the volume of the air gap.

In some embodiments, at least one of the one or more plate-like structures 121 may be a diaphragm. The diaphragm may comprise a rigid membrane or a flexible membrane. May be a rigid film or a flexible film. Rigid film refers to a film body having a Young's modulus of the film body greater than a first modulus threshold (e.g., 50 GPa). A flexible film refers to a film having a young's modulus of the film body that is less than a second modulus threshold. In some embodiments, the first modulus threshold value and/or the second modulus threshold value may be set according to actual needs. In some embodiments, the first modulus threshold may be equal or unequal to the second modulus threshold. For example, the first modulus threshold may be 20GPa, 30GPa, 40GPa, 50GPa, etc., and the second modulus threshold may be 1MPa, 10MPa, 1GPa, 10GPa, etc. For a detailed description of the diaphragm reference may be made to the related description of the diaphragm as in fig. 2.

In some embodiments, at least one of the one or more plate-like structures 121 may be a cantilever beam. The cantilever beam may comprise a rigid plate. In some embodiments, a rigid plate refers to a plate in which the Young's modulus of the membrane is greater than a third modulus threshold (e.g., 50 GPa). In some embodiments, the third modulus threshold may be set according to actual needs, e.g., may be 20GPa, 30GPa, 40GPa, 50GPa, etc., and for a detailed description of the cantilever beam reference may be made to the related description of the cantilever beam as in FIG. 8 a.

In some embodiments, the one or more plate-like structures 121 may include at least one diaphragm and at least one cantilever beam, as will be described in connection with the description below.

Fig. 2 is a schematic diagram of a vibration sensor according to some embodiments of the present disclosure.

The vibration sensor 200 of fig. 2 may be one embodiment of the vibration sensor 100 of fig. 1. In some embodiments, vibration sensor 200 includes an acoustic transducer 210 and a vibration assembly 220. It should be noted that in some other embodiments, the transducer may be other than an acoustic transducer, such as an accelerometer; in addition, the acoustic transducer may be in other forms, such as a liquid microphone and a laser microphone.

Referring to fig. 2, in some embodiments, the air conduction microphone includes a pickup device 212, and in some embodiments, the pickup device 212 may include a transducer sensitive element in the form of a capacitor, a piezoelectric, or the like, according to a transduction principle, without limitation to the present description.

In some embodiments, the acoustic transducer 210 is also provided with a conductive path 211 for pickup. In some embodiments, the vibration assembly 220 is disposed within the conductive path 211 along a radial cross-section of the pickup hole or, as shown in fig. 2, outside of the conductive path 211. The conductive path 211 may also be referred to as a sound pick-up hole or a sound inlet hole.

As shown in fig. 2, the vibration assembly 220 includes a plate-like structure and a mass 222 physically connected thereto, and in some embodiments, the plate-like structure and the mass 222 may be connected by a snap fit, an adhesive, or an integral molding, and the connection manner is not limited in this specification. In some embodiments, the plate-like structure includes a diaphragm 221. In some embodiments, the diaphragm 221 may be configured to be air-permeable or air-impermeable, and in some embodiments, the diaphragm 221 may be air-impermeable, for example, for better sound pickup.

It should be noted that, for convenience of description, the illustration of one diaphragm and one plate structure is only for limiting the protection scope of the present invention, in some embodiments, the mass may include a plurality of masses, and the plurality of masses may be disposed on two sides of the diaphragm 221, and in some embodiments, the plurality of masses may be disposed on the same side of the diaphragm 221. For example, assuming that the vibration assembly comprises more than two masses, two masses may be arranged on both sides of the plate-like structure. In some embodiments, the plurality of mass blocks may be disposed on a surface of the diaphragm facing the transducer, or disposed on a surface of the diaphragm facing away from the transducer, so as to ensure uniformity of vibration. In some embodiments, one plate-like structure and a plurality of mass diaphragms 221 physically coupled to the plate-like structure correspond to a plurality of target frequency bands of one or more different target frequency bands such that the sensitivity of the vibration sensor 100 may be greater than the sensitivity of the transducer 210 within the corresponding target frequency bands. In some embodiments, the plurality of resonant frequencies of one plate-like structure and the plurality of masses 222 physically connected to the plate-like structure are the same or different. In some embodiments, the vibration sensor 100 with one or more additional sets of masses and diaphragms may have a sensitivity that is 3dB to 30dB higher than the sensitivity of the transducer 110 in the target frequency band. It should be noted that in some embodiments, the sensitivity of the vibration sensor 200 after the vibration component 220 is further improved by more than 30dB compared to that of the transducer 210, such as the plurality of masses 222 physically connected to the plate structure have the same resonance peak.

In some embodiments, the plurality of masses may be arranged co-linearly or non-co-linearly, and, for example, in some embodiments, if the masses include four, two or three of the four masses may be arranged co-linearly, and in addition, the four masses may be arranged in an array (e.g., a rectangular array and a circular array).

In some embodiments, when the vibration assembly 220 includes a plurality of diaphragms, the diaphragms other than the diaphragm furthest from the acoustic transducer 210 may be configured to be breathable to ensure that air vibrations (e.g., sound waves) may pass through the diaphragms as completely as possible to pick up the vibrations with the pickup device 221, which may be effective in improving pickup quality. By configuring the plate-like structure furthest from the acoustic transducer 210 to be airtight, the vibration sensor 200 has a better sound pickup effect by closing the conduction channel 211 so that air in the conduction channel 211 does not escape during vibration, and ensuring the air compression effect.

In some embodiments, the supporting structure 230 is made of an airtight material, and the airtight supporting structure 230 can enable the vibration signal in the air to cause the sound pressure in the supporting structure 230 to change (or air vibrate) during the transmission process, so that the vibration signal in the supporting structure 230 is transmitted into the acoustic transducer 220 through the conductive channel 211, and cannot escape outwards through the supporting structure 230 during the transmission process, thereby ensuring the sound pressure intensity and improving the sound transmission effect. In some embodiments, the support structure 230 may include, but is not limited to, one or more of a metal, an alloy material (e.g., aluminum alloy, chromium molybdenum steel, scandium alloy, magnesium alloy, titanium alloy, magnesium lithium alloy, nickel alloy, etc.), a rigid plastic, foam, and the like.

In some embodiments, the projected area of the mass does not overlap the projected area of the support structure in a direction perpendicular to the surface to which the diaphragm 221 and the mass 222 are attached (i.e., perpendicular to the vibration direction). This arrangement is to avoid that the vibration of the diaphragm 221 and the mass 222 is limited by the support structure 230. In some embodiments, the cross-sectional shape of the diaphragm in the thickness direction may include a circle, a rectangle, a triangle, an irregular pattern, etc., and in some embodiments, the shape of the diaphragm may be further configured according to the shape of the support structure 230, which is not limited in this specification. In some embodiments, to prevent the non-smooth curve from excessively causing excessive stress concentration at the corner points, the diaphragm 221 is selected to be circular in shape in accordance with embodiments of the present disclosure. In some embodiments, the shape of the mass may be a cylinder, a truncated cone, a cube, a triangle, etc., the size and material of which will be described later, and the shape is not limited in this specification.

In some embodiments, the mass 222 may be disposed concentric with the diaphragm 221. For example, when the mass block 222 or the diaphragm 221 has a circular outer contour, the kinetic energy of the concentrically disposed mass block 222 is uniformly dispersed on the diaphragm 221 during vibration, so that the diaphragm 221 can respond to the vibration better. In some other embodiments, the mass 222 may also be disposed at other locations of the diaphragm 211, such as an off-center location, which means that the mass is not disposed concentric with the diaphragm. In some embodiments, the distance between the center line of the mass 222 and the edge of the diaphragm 221 may vary. In some embodiments, the position of the mass 222 relative to the diaphragm 221 may be varied to adjust the resonant peak position of the vibration system 10. For example, when the mass 222 moves from the edge region of the diaphragm 221 toward the center of the diaphragm 221, the resonance peak may be shifted forward, i.e., toward the low frequency direction (resonance frequency decreases), and when the mass 222 moves from the center position of the diaphragm 221 toward the edge region of the diaphragm 221, the resonance peak may be shifted backward, i.e., toward the high frequency direction (resonance frequency increases).

In some embodiments, when the vibration sensor 200 is used for conducting air conduction pickup, when the external environment generates vibration (e.g. sound wave), the vibration membrane 221 and the mass block on the vibration membrane 221 generate vibration in response to the vibration of the external environment, and the vibration generated by the vibration membrane 221 and the mass block together with external vibration signals (e.g. sound wave) can cause the sound pressure change (or air vibration) in the conducting channel 211 to transmit the vibration signals to the pickup device 212 through the conducting channel 211 and convert the vibration signals into electrical signals, so as to realize the process that the vibration signals are converted into electrical signals after being reinforced in one or more target frequency bands. The target frequency band may be a frequency range where a resonance frequency (or a resonance frequency) corresponding to the plate-like structure and the mass 222 is located. Illustratively, when vibration sensor 200 is used as a microphone, the target frequency range may be 200 Hz-2 kHz, and in particular, in some embodiments, if the resonant frequency of the acoustic transducer is 2kHz, the resonant frequency of vibration assembly 220 may be configured to be 800Hz, 1kHz, 1.7kHz, or the like.

In some embodiments, the vibration assembly 210 may be applied to MEMS (micro-electro-mechanical systems) device designs, as well as to macro-device designs (e.g., microphones or speakers, etc.). In the MEMS device process, the diaphragm 221 may be a single layer material such as Si, siO2, siNx, siC, etc. along its thickness direction, or may be a double or multi-layer composite material such as Si/SiO2, siO2/Si, si/SiNx, siNx/Si/SiO2, etc. The mass 221 may be a single layer of material, such as Si, cu, etc., or a double or multi-layer composite material, such as Si/SiO2, siO2/Si, si/SiNx, siNx/Si/SiO2, etc. In some embodiments, the material of the diaphragm 221 in the MEMS device is Si or SiO2/SiNx, and the material of the mass 222 is Si. When the diaphragm 221 and the mass 222 are circular, the radius may be 500 μm to 1500 μm, and the thickness of the diaphragm 221 may be 0.5 μm to 5 μm; the radius of the mass 222 may be 100 μm to 1000 μm and the height of the mass 222 may be 50 μm to 5000 μm.

In the macro device, the material of the diaphragm 221 may be a polymer film, such as polyurethane, epoxy resin, acrylic ester, etc., or a metal film, such as copper, aluminum, tin or other alloys and composite films thereof, etc.; the mass 221 is generally required to have a certain mass in a volume as small as possible, and thus needs to be dense, and the material may be copper, tin or other alloys and composites thereof. In a macroscopic device, the radius of the diaphragm 221 can be 1 mm-10 cm, and the thickness of the diaphragm 210 can be 0.1 mm-5 mm; the radius of the mass block 221 may be 0.2mm to 5cm, and the height of the mass block 221 may be 0.1mm to 10mm. In some embodiments, the radius of the diaphragm 221 may be 1.5mm to 10mm, and the thickness of the diaphragm 221 may be 0.2mm to 0.7mm; the radius of the mass 221 may be 0.3mm to 5mm and the height of the mass 221 may be 0.3mm to 5mm.

In some embodiments, the diaphragm 221 may include a breathable film comprising at least one of polytetrafluoroethylene, expanded polytetrafluoroethylene, polyethersulfone, polyvinylidene fluoride, polypropylene, polyethylene terephthalate, nylon, nitrocellulose, or mixed cellulose, or a combination thereof. In some embodiments, when the diaphragm 221 is configured to be impermeable to air, the material of the diaphragm 221 may be a plate-like structure as described above or may be treated (e.g., to cover ventilation holes).

In some embodiments, the diaphragm 221 may be a plate-like structure having a through hole. In some embodiments, the through-holes have a pore size of 0.01 μm to 10 μm. Preferably, the pore diameter of the through-hole may be 0.1 μm to 5 μm, such as 0.2 μm, 0.5 μm, 0.8 μm, 1 μm, 2 μm, etc. The diameters of the through holes in the diaphragm 221 may be the same or different. In some embodiments, if the vibration assembly 230 includes a plurality of diaphragms, the diameters of the through holes on the plurality of diaphragms may be the same or different, and the diameters of the through holes on the same diaphragm may be the same or different. In some embodiments, the pore size of the through-holes may also be greater than 5 μm. When the diameter of the through hole is larger than 5 μm, other materials (such as silica gel) may be disposed on the diaphragm 221 to cover a part of the through hole or a part of the through hole without affecting ventilation.

In some embodiments, the vibration assembly 220 may further include a support structure 230, the support structure 230 for supporting one or more sets of diaphragms 221 and masses. The support structure 230 is physically connected to the acoustic transducer 230, and the diaphragm 221 and mass are connected to the support structure 230. In particular, the support structure 230 may be coupled to a housing of the acoustic transducer 210.

FIG. 3 is a schematic diagram of an exemplary vibration assembly shown according to some embodiments of the present description.

The vibration assembly 320 shown in fig. 3 may be an exemplary embodiment of the vibration assembly 120 of fig. 1. As can be seen in fig. 3, a mass 322 is arranged on the diaphragm 321.

In some embodiments, the plate-like structure may be embedded on an inner wall of the support structure 330 or embedded within the support structure 330. In some embodiments, the plate-like structure may vibrate within the space inside the support structure 230 while the plate-like structure may completely block the support structure opening, i.e., the area of the plate-like structure may be greater than or equal to the opening area of the support structure, which arrangement allows air vibrations (e.g., sound waves) in the external environment to pass through the plate-like structure as completely as possible and pick up the vibrations with the pick-up device, which may effectively improve the pick-up quality. In some embodiments, the plate-like structure may also not completely cover the opening of the support structure, as is the case when the plate-like structure is a cantilever beam, as will be described in detail below with respect to fig. 8A-8C.

Fig. 4A-4C are schematic illustrations of exemplary vibration assemblies shown according to some embodiments of the present description.

Fig. 4A is a schematic perspective view of the vibration assembly 420; FIG. 4B is a perspective view of the vibration assembly 420 shown in FIG. 4A in a vibration direction; fig. 4B is a projection view of the vibration assembly 420 shown in fig. 4A perpendicular to the vibration direction. The vibration assembly shown in fig. 4A-4C may be an exemplary embodiment of vibration assembly 120 of fig. 1.

As shown in fig. 4A, in some embodiments, the vibration assembly 420 includes a plate-like structure and two masses 422 disposed on the plate-like structure, which may be a diaphragm 421 disposed on a support structure 430, similar to the vibration assembly 420 of fig. 3. In some embodiments, the structural parameters of the two masses 422 may be the same or different. It should be noted that the number of the mass blocks connected to the diaphragm may not be limited to two, and may be three, four, or more than five, for example.

In some embodiments, two masses 422 are physically connected to diaphragm 421. In some embodiments, two masses 422 may be disposed on both sides of the diaphragm 421 in the vibration direction, respectively. Referring to both fig. 4B and 4C, in some embodiments, the two masses 422 may have the same outer contour in the vibration direction, e.g., both are circular; the two masses 422 may have different heights in the horizontal direction (the direction perpendicular to the vibration direction). Therefore, the two mass blocks 422 can make the vibration component have two different resonance frequencies in the target frequency band, so that two resonance peaks are generated, and the sensitivity of the vibration component 420 in a frequency interval (namely the target frequency band) near the two resonance frequencies is improved, so that the effects of widening the frequency band width and improving the sensitivity are achieved.

In some embodiments, by setting parameters of the diaphragm 421 and the mass 422, at least two resonance peaks can be formed on the frequency response curve of the vibration sensor having the vibration component 420, thereby forming a plurality of frequency intervals with high sensitivity and a wider frequency band. In some embodiments, the plate-like structure and the plurality of masses 422 physically connected to the plate-like structure have a plurality of resonant frequencies related to parameters of the diaphragm 421 and/or the masses 422, including at least one of a modulus of the plate-like structure, a volume of a cavity formed between the transducer and the plate-like structure, a radius of the masses 422, a height of the masses 422, and a density of the masses 422. In particular, the mathematical relationship between the resonant frequency and sensitivity and the above parameters can be found in the description of equation 1 below. It should be noted that the larger the mass or size parameter of the mass 422 is, the better, and if the parameter is set too large, deformation of the diaphragm 421 may be suppressed, or a new effective mode may be generated due to the excessive amplitude of the mass 422.

In some embodiments, the parameters of the two masses 422, such as the height in the vibration direction, may satisfy a predetermined ratio, such as in some embodiments the height ratio of the two masses 422 may be 3:2, 2:1, 3:4, 3:1, or the like.

Fig. 5A-5B are schematic illustrations of exemplary vibration assemblies shown according to some embodiments of the present description.

Fig. 5A is a schematic perspective view of a vibration assembly 520; FIG. 5B is a perspective view of the vibration assembly 520 shown in FIG. 5A in the vibration direction; in some embodiments, as shown in FIG. 5A, vibration assembly 520 is similar to vibration assembly 420, except that the number of masses 522 on diaphragm 521 is three.

In some embodiments, the three masses 522 may be non-collinear with the diaphragm 521. It will be appreciated that when the mass 522 includes three, the lines between two of the three masses do not coincide. Referring to fig. 5B, in the present embodiment, three masses 522 are distributed in a triangle shape, and the distances between the masses 522 are the same. In some embodiments, the three mass blocks 522 can improve the sensitivity of the vibration component 520 in the frequency range near at least two frequency points in the target frequency range, so as to achieve the effects of widening the frequency range bandwidth and improving the sensitivity.

FIG. 6 is a schematic diagram of an exemplary vibration assembly shown according to some embodiments of the present description.

As shown in fig. 6, in some embodiments, the number of masses 622 in the vibration assembly 620 may be 4, with the 4 masses 622 being arranged in an array (e.g., a circular array or a rectangular array). In some embodiments, at least two masses 622 of the 4 masses 622 have different resonant peaks. In some embodiments, when the mass 622 includes four or more, the lines of any two masses at the center point of the diaphragm do not coincide as a straight line.

In some embodiments, the frequency response curve of the vibration sensor under the action of the diaphragm and the mass has one or more resonance peaks.

Fig. 7 is a schematic diagram of a frequency response curve for vibration assemblies having different numbers of masses in a vibration sensor according to some embodiments of the present disclosure.

FIG. 7 includes two frequency response curves, frequency response curve 710 and frequency response curve 720, wherein frequency response curve 710 represents the frequency response curve of a vibration sensor when a mass is disposed on the diaphragm (as shown in FIG. 3); the frequency response curve 720 represents the frequency response curve of the vibration sensor when two masses (as shown in fig. 4A) are disposed on the diaphragm. As can be seen, the frequency response curve 710 has one resonance peak and the frequency response curve 720 has two resonance peaks.

In some embodiments, one mass may be arranged as described with reference to fig. 3, and two masses may be arranged as described with reference to fig. 4A. As can be seen from the figure, when a mass is provided on the diaphragm, the frequency of the resonance peak of the vibration sensor is around 2000 Hz. And on adding two diaphragms with the same diameter but different heights, the frequencies of the resonance peaks of the vibration sensor are respectively located near 1300Hz and 3500 Hz. It can be seen that in the case of adding two masses, the sensitivity at the two frequency points (near 1300Hz and 3500 Hz) is greater than the sensitivity of the transducer, and the effect of significantly improving the sensitivity of the vibration sensor at the target frequency (e.g., in the range of 500Hz to 5000 Hz) is achieved. Compared with the mode of increasing the receiving frequency range by adding a plurality of groups of transducers with different resonance peaks, the volume of the whole equipment is reduced, the cost is reduced, and the device has stronger performance on the basis of higher integration.

In some embodiments, the resonant frequency of the plate-like structure and one or more masses on the plate-like structure is related to a parameter of the plate-like structure and/or the masses, which may include at least one of an elastic modulus of the plate-like structure, a volume of a cavity formed between the transducer and the plate-like structure, a radius of the masses, a height of the masses, and a density of the masses. For example, in some embodiments, the resonant frequency of the diaphragm and mass versus sensitivity can be expressed as:

(S，f)＝g(K _film ，K _foam ，V _cavity ，R _m ，h _m ，ρ _m ) (1)。

wherein S is the sensitivity of the vibration sensor after the vibration component is arranged, f is the resonance frequency of the vibration component, and K _film For structural rigidity of plate-like shape, K _foam For supporting structural rigidity, V _cavity For the volume of the cavity, R _m Radius of mass, h _m For the mass height ρ _m Is the mass density. Volume of cavity V _cavity Is the volume of space formed between the sensitive element in the transducer (e.g., pickup 212 in fig. 2) and the diaphragm in its closest vibrating assembly (e.g., diaphragm 221 in fig. 2).

In particular, in some embodiments, the sensitivity S is a function of the plate-like structural stiffness K _film Increasing and decreasing with the stiffness K of the support structure _foam Increase and decrease with the cavity volume V _cavity Increase first and then decrease with mass radius R _m Increase and decrease with mass height h _m Increasing with increasing mass density ρ _m Increase and lift. Resonant frequency f of vibration assembly follows plate-like structural rigidity K _film Increasing with increasing support structure stiffness K _foam Increase with increasing mass radius R _m Is reduced and then increased with the height h of the mass block _m Increasing and decreasing with mass density ρ _m Increasing and decreasing. In some embodiments, the plate-like structure may be controlled byThe stiffness, the cavity volume and the material and the size of the mass block, the size of the sensitivity and the resonance frequency are adjusted. In some embodiments, when the plate-like structure has a low stiffness, it may be provided in the form of a diaphragm, as described in fig. 2. In some embodiments, the plate-like structure may be provided in the form of a cantilever beam when it has a higher stiffness or when the volume of the plate-like structure is desired to be smaller, as will be described in detail below with reference to fig. 8A-8C.

Fig. 8A-8C are schematic structural diagrams of vibration assemblies of vibration sensors according to some embodiments of the present disclosure.

Fig. 8A is a schematic perspective view of a vibration assembly 820; FIG. 8B is a perspective view of the vibration assembly 820 shown in FIG. 8A in a vibration direction; fig. 8B is a projection view of the vibration assembly 820 shown in fig. 8A perpendicular to the vibration direction. The vibration assembly shown in fig. 8A-8C may be an exemplary embodiment of vibration assembly 120 of fig. 1.

As shown in fig. 8A, the vibration assembly includes a support structure 830, a cantilever 821, and a mass 822. One end of the cantilever 821 is physically connected to one side of the support structure 830, and the other end is a free end, and the mass 822 is physically connected to the free end of the cantilever 821. Specifically, the physical connection between the cantilever beam 821 and the support structure 830 may include a connection such as welding, clamping, bonding, or integral molding, which is not limited herein. In some embodiments, the vibration assembly may also not include the support structure 830, and the cantilever 821 may be disposed within the conductive pathway along a radial cross-section of the conductive pathway or outside of the conductive pathway, with the cantilever 821 not entirely covering the conductive pathway.

In some embodiments, the material of the cantilever 821 includes at least one of copper, aluminum, tin, silicon oxide, silicon nitride, silicon carbide, aluminum nitride, zinc oxide, lead zirconate titanate, or an alloy. In some embodiments, the mass 822 may be disposed on either side of the cantilever 821 in the direction of vibration, and in this embodiment, the mass 822 is disposed on the side of the cantilever 821 away from the transducer (not shown in the figures) in the direction of vibration.

In some embodiments, the free end of the cantilever 821 is provided with at least one mass 822 on either side perpendicular to the direction of vibration. The dimensions of the individual masses 822 may be partially the same or all different. In some embodiments, the distance between adjacent masses 822 may be the same or different. In actual use, the design can be carried out according to the vibration mode.

Referring also to fig. 8A-8C, in some embodiments, three masses 822 are provided on the cantilever 821. The three masses 822 on the cantilever 821 are the same size and the three masses 822 are collinear at the center point of the cantilever 821. In some embodiments, because the cantilever 821 is narrower in width in the horizontal direction perpendicular to the vibration direction, it is preferable that one or more masses 822 be disposed in-line with the cantilever 821, so that a more stable sensitivity improvement is obtained.

In some embodiments, the cantilever beam 821 has a rectangular profile in radial cross-section, and in some other embodiments, the cantilever beam 821 may be rectangular, triangular, trapezoidal, diamond-shaped, and other curvilinear shapes in radial cross-section. In some embodiments, the multiple resonance peaks of the vibration sensor may be adjusted by changing the materials, shapes and sizes of the cantilever 821 and the mass 822, and the specific adjustment mode may be referred to as formula (1) above, since the principle of using the cantilever or the diaphragm as the plate-like structure is similar, and the diaphragm parameter in formula (1) may be directly replaced by the parameter of the cantilever 821.

In some embodiments, the vibration sensor may be applied to MEMS device designs. In some embodiments, the vibration sensor may be applied to macro device (e.g., microphone, speaker, etc.) designs. In the MEMS device process, the cantilever 821 may be a single layer of material such as Si, siO2, siNx, siC, etc. in the thickness direction, and may be a double or multi-layer composite material such as Si/SiO2, siO2/Si, si/SiNx, siNx/Si/SiO2, etc. The mass 822 may be a single layer of material, such as Si, cu, etc., or may be a double or multi-layer composite material, such as Si/SiO2, siO2/Si, si/SiNx, siNx/Si/SiO2, etc. The embodiments of the present disclosure select the cantilever 821 material in the MEMS device to be Si or SiO2/SiNx and the mass 822 material to be Si. In a MEMS device process, in some embodiments, the cantilever 821 may be 500 μm to 1500 μm in length; in some embodiments, the cantilever 821 may be 0.5 μm to 5 μm thick; in some embodiments, the mass 822 may have a side length of 50 μm to 1000 μm; in some embodiments, the mass 822 may have a height of 50 μm to 5000 μm. In some embodiments, the cantilever 821 may be 700 μm to 1200 μm in length and the cantilever 821 may be 0.8 μm to 2.5 μm in thickness; the side length of the mass 822 may be 200 μm to 600 μm and the height of the mass 822 may be 200 μm to 1000 μm.

In the macro device, the cantilever 821 material may be an inorganic nonmetallic material, such as aluminum nitride, zinc oxide, lead zirconate titanate, etc., or a metallic material, such as copper, aluminum, tin or other alloys, or a combination of the above materials, etc. The mass 822 is generally required to have a certain mass in a volume as small as possible, so that a high density is required, and the material may be copper, tin or other alloys, or may be a ceramic material. Preferably, the cantilever 821 is made of aluminum nitride or copper, and the mass 822 is made of tin or copper. In a macroscopic device, the length of the cantilever 821 can be 1 mm-20 cm, and the thickness of the cantilever 821 can be 0.1 mm-10 mm; in some embodiments, the side length of the mass 822 may be 0.2mm to 5cm and the height of the mass 822 may be 0.1mm to 10mm. In some embodiments, the cantilever 821 may be 1.5mm to 10mm in length and the cantilever 821 may be 0.2mm to 5mm in thickness; the side length of the mass block 822 can be 0.3 mm-5 cm, and the height of the mass block 822 can be 0.5 mm-5 cm.

Fig. 9A-9B are schematic structural diagrams of vibration assemblies of vibration sensors according to some embodiments of the present disclosure.

As shown in fig. 9A, in some embodiments, two masses 922 may be disposed on a cantilever 921 of the vibration assembly 920, with the two masses 922 having different heights in the direction of vibration. In some embodiments, the height of the mass 922 near the free end of the cantilever 921 may be lower than the height of the mass 922 away from the free end. In some embodiments, as shown in fig. 9B, the mass 922 near the free end of the cantilever 921 may be higher than the mass 922 away from the free end. It should be noted that, even though other structural parameters of the two masses 922 are the same, since the positions of the masses 922 are different in the two cases in fig. 9A and 9B, in some embodiments, the two cases may have two different forms of resonance peaks.

Fig. 10 is a schematic structural view of a vibration assembly of a vibration sensor according to some embodiments of the present description.

Fig. 11 is a schematic structural view of a vibration assembly of a vibration sensor according to some embodiments of the present description.

As shown in fig. 10 and 11, in some embodiments, the mass 1022 on the cantilever beam may also include one or four. The four masses 1022 disposed on the cantilever beam may have identical structural parameters, may be partially different, or may all be different.

Fig. 12 is a schematic diagram of a frequency response curve for vibration assemblies having different numbers of masses in a vibration sensor according to some embodiments of the present disclosure.

As shown in fig. 12, in some embodiments, the frequency response curve of the vibration sensor under the action of the cantilever beam and the mass has one or more resonance peaks. FIG. 12 includes three frequency response curves 1210, 1220 and 1230, where the frequency response curve 1210 represents the frequency response curve of the vibration sensor when a mass is disposed on the cantilever (as shown in FIG. 10); the frequency response curve 1220 represents the frequency response curve of the vibration sensor when two masses are provided on the cantilever (as shown in fig. 9A or 9B); the frequency response curve 1230 represents the frequency response curve of the vibration sensor when three masses are provided on the cantilever (as shown in fig. 8A). As can be seen, the frequency response curve 1210 has one resonance peak, the frequency response curve 1220 has two resonance peaks, and the frequency response curve 1230 has three resonance peaks.

In some embodiments, the arrangement of the mass on the cantilever beam may be referred to as above, for example, the arrangement of one mass may be referred to as fig. 10; the three masses can be arranged in a manner as described with reference to fig. 8a. As can be seen from the figure, when there is only one mass, the resonance peak of the vibration sensor is about 10kHz, and when there are two resonance peaks, the vibration sensor forms two resonance peaks at 3kHz and 13kHz, and by providing two masses, the sensitivity is significantly improved in the target frequency (e.g., in the range of 2kHz to 15 kHz) near the two frequency points. When three masses are placed on the same cantilever beam, the vibration sensor forms three resonance peaks, specifically, the vibration sensor forms three resonance peaks at 2250Hz, 7600Hz and 15700Hz, so that the sensitivity in a target frequency (such as 1 kHz-20 kHz) near the three frequency points is remarkably improved, and the frequency response curve is naturally divided into three different frequency band intervals, which is beneficial to subsequent signal processing. Further, as can be seen from the figure, as the number of the mass blocks increases, the sensitivity of the entire vibration sensor is also improved, for example, the sensitivity of the frequency response curve 1230 is still higher than that of the frequency response curve 1210 at a low frequency band (for example, below 1 kHz), and it can be seen that after the plate-shaped structure and the mass blocks are reasonably arranged, the frequency band width with higher sensitivity can be widened, and the sensitivity in the target frequency band can be improved.

In some embodiments of the present description, there is also provided an acoustic input device comprising the sensor of the previous embodiments, by which the vibration signal is converted into an electrical signal for further processing.

Fig. 13 is a schematic diagram of a vibration sensor according to some embodiments of the present disclosure.

As shown in fig. 13, vibration sensor 1300 may be one particular embodiment of vibration sensor 100 of fig. 1. In some embodiments, the vibration sensor 1300 includes an acoustic transducer 1310 and a vibration assembly. The vibrating assembly includes, in order, a cantilever beam 1321, a mass 1323, a diaphragm 1322, and a plurality of masses 1324 within a conductive path 1311 in a direction away from the acoustic transducer 1310. In some embodiments, the diaphragm 1322 may be a gas permeable membrane or a gas impermeable membrane, and, illustratively, the diaphragm 1322 is a gas impermeable membrane. In some embodiments, cantilever 1321 may also be provided on a side of diaphragm 1322 remote from acoustic transducer 1310, in which embodiment diaphragm 1322 may be a gas-permeable membrane.

In some embodiments, the cantilever beam 1321 and the mass 1323 may correspond to one resonant frequency; the diaphragm 1322 and the plurality of masses 1324 may correspond to one or two resonant frequencies. In some embodiments, the aforementioned three resonant frequencies may be set to be different, such that the frequency response curve of the vibration sensor under the action of the vibration assembly 1300 has three resonant peaks, thereby forming a plurality of frequency intervals of high sensitivity and a wider frequency band.

As shown in fig. 14, the headset 1 includes a vibration system 10 for receiving vibrations (e.g., sound pick-up) for further processing. Vibration system 10 may be a vibration assembly 120 in vibration sensor 100 of fig. 1.

Please refer to the general earphone 1 for the rest of the functional components in the earphone 1, and the rest of the functional components are not further described herein.

According to the scheme, at least two resonance peaks can be formed on the frequency response curve through reasonable vibrating pieces and design, so that a plurality of high-sensitivity frequency intervals and wider frequency bands are formed.

While the basic concepts have been described above, it will be apparent to those skilled in the art that the foregoing disclosure is by way of example only and is not intended to be limiting. Although not explicitly described herein, various modifications, improvements, and adaptations to the present disclosure may occur to one skilled in the art. Such modifications, improvements, and modifications are intended to be suggested within this specification, and therefore, such modifications, improvements, and modifications are intended to be included within the spirit and scope of the exemplary embodiments of the present invention.

Meanwhile, the specification uses specific words to describe the embodiments of the specification. Reference to "one embodiment," "an embodiment," and/or "some embodiments" means that a particular feature, structure, or characteristic is associated with at least one embodiment of the present description. Thus, it should be emphasized and should be appreciated that two or more references to "an embodiment" or "one embodiment" or "an alternative embodiment" in various positions in this specification are not necessarily referring to the same embodiment. Furthermore, certain features, structures, or characteristics of one or more embodiments of the present description may be combined as suitable.

Furthermore, those skilled in the art will appreciate that the various aspects of the specification can be illustrated and described in terms of several patentable categories or circumstances, including any novel and useful procedures, machines, products, or materials, or any novel and useful modifications thereof. Accordingly, aspects of the present description may be performed entirely by hardware, entirely by software (including firmware, resident software, micro-code, etc.), or by a combination of hardware and software. The above hardware or software may be referred to as a "data block," module, "" engine, "" unit, "" component, "or" system. Furthermore, aspects of the specification may take the form of a computer product, comprising computer-readable program code, embodied in one or more computer-readable media.

Furthermore, the order in which the elements and sequences are processed, the use of numerical letters, or other designations in the description are not intended to limit the order in which the processes and methods of the description are performed unless explicitly recited in the claims. While certain presently useful inventive embodiments have been discussed in the foregoing disclosure, by way of various examples, it is to be understood that such details are merely illustrative and that the appended claims are not limited to the disclosed embodiments, but, on the contrary, are intended to cover all modifications and equivalent arrangements included within the spirit and scope of the embodiments of the present disclosure. For example, while the system components described above may be implemented by hardware devices, they may also be implemented solely by software solutions, such as installing the described system on an existing server or mobile device.

Likewise, it should be noted that in order to simplify the presentation disclosed in this specification and thereby aid in understanding one or more inventive embodiments, various features are sometimes grouped together in a single embodiment, figure, or description thereof. This method of disclosure, however, is not intended to imply that more features than are presented in the claims are required for the present description. Indeed, less than all of the features of a single embodiment disclosed above.

In some embodiments, numbers describing the components, number of attributes are used, it being understood that such numbers being used in the description of embodiments, in some examples, are modified with the modifier "about," "approximately," or "substantially," etc. Unless otherwise indicated, "about," "approximately," or "substantially" indicate that the number allows for a 20% variation. Accordingly, in some embodiments, numerical data used in the specification and claims is approximations that may vary depending upon the desired properties sought to be obtained by the individual embodiments. In some embodiments, the numerical data should take into account the specified significant digits and employ a method for preserving the general number of digits. Although the numerical ranges and data used in some embodiments of the present disclosure are approximations, in particular embodiments, the settings of such numerical values are as precise as possible.

Finally, it should be understood that the embodiments described in this specification are merely illustrative of the principles of the embodiments of this specification. Other variations are possible within the scope of this description. Thus, by way of example, and not limitation, alternative configurations of embodiments of the present specification may be considered as consistent with the teachings of the present specification. Accordingly, the embodiments of the present specification are not limited to only the embodiments explicitly described and depicted in the present specification.

Claims

A vibration sensor, comprising:

a transducer;

a vibration assembly coupled to the transducer, the vibration assembly configured to transmit an external vibration signal to the transducer to generate an electrical signal, the vibration assembly comprising one or more plate-like structures and one or more masses physically coupled to each of the one or more plate-like structures;

the vibration assembly is configured to cause the sensitivity of the vibration sensor to be greater than the sensitivity of the transducer in one or more target frequency bands.
The vibration sensor of claim 1, wherein the frequency response curve of the vibration sensor under the action of the vibration assembly has a plurality of resonant peaks.
The vibration sensor of claim 1, wherein the one or more masses connected to one of the one or more plate-like structures comprises at least two masses.
A vibration sensor according to claim 3, wherein at least one structural parameter of the at least two masses is different, the structural parameter comprising size, mass, density and shape.
The vibration sensor of claim 1, wherein a projection of the one or more masses is located in a plate shape within a projection of the plate-like structure in a vibration direction of the vibration assembly.
The vibration sensor of claim 1, wherein the vibration assembly further comprises a support structure for supporting the plate-like structure, the support structure being physically connected to the transducer, the plate-like structure being connected to the support structure.
The vibration sensor of claim 6, wherein the support structure is made of a gas impermeable material.
The vibration sensor of claim 6, wherein,

in a direction perpendicular to the surface to which the one plate-like structure and the one or more masses are connected, the projected area of the mass does not overlap with the projected area of the support structure.
A vibration sensor according to claim 3, wherein the one plate-like structure and at least two masses physically connected to the one plate-like structure correspond to a plurality of the target frequency bands such that the sensitivity of the vibration sensor is greater than the sensitivity of the transducer within the corresponding plurality of target frequency bands.
The vibration sensor of claim 9 wherein the one plate-like structure and at least two masses physically connected to the one plate-like structure have a plurality of resonant frequencies, at least one of the plurality of resonant frequencies being less than a resonant frequency of the transducer such that a sensitivity of the vibration sensor is greater than a sensitivity of the transducer at a plurality of the one or more target frequency bands.
The vibration sensor of claim 9, wherein the plurality of resonant frequencies of the one plate-like structure and at least two masses physically connected to the one plate-like structure are the same or different.
The vibration sensor of claim 9, wherein a difference between at least one of the plurality of resonant frequencies of the one plate-like structure and at least two masses physically connected to the one plate-like structure and the resonant frequency of the transducer is within 1 kHz-10 kHz.
The vibration sensor of claim 12, wherein the one plate-like structure and at least two masses physically connected to the one plate-like structure have adjacent two of the plurality of resonant frequencies that differ by less than 2kHz.
The vibration sensor of claim 12, wherein the one plate-like structure and at least two masses physically connected to the one plate-like structure have adjacent two of the plurality of resonant frequencies that differ by no more than 1kHz.
The vibration sensor of claim 9, wherein the one plate-like structure and at least two masses physically connected to the one plate-like structure have a resonant frequency within 1kHz to 10 kHz.
The vibration sensor of claim 9, wherein the one plate-like structure and at least two masses physically connected to the one plate-like structure have a resonant frequency within 1kHz to 5 kHz.
The vibration sensor of claim 9, wherein the one plate-like structure and at least two masses physically connected to the one plate-like structure have the plurality of resonant frequencies related to parameters of the plate-like structure and/or the masses including at least one of a modulus of the plate-like structure, a volume forming a cavity between the transducer and the plate-like structure, a radius of the masses, a height of the masses, and a density of the masses.
The vibration sensor of claim 1, wherein at least one of the one or more masses connected to one of the one or more plate-like structures is disposed concentric with the one plate-like structure.
The vibration sensor of claim 1, wherein at least one of the one or more plate-like structures comprises a diaphragm.
The vibration sensor of claim 19, wherein the one or more masses connected to the diaphragm are disposed on a side of the diaphragm facing the transducer or on a side of the diaphragm facing away from the transducer.
The vibration sensor of claim 19, wherein the diaphragm comprises at least one of polytetrafluoroethylene, expanded polytetrafluoroethylene, polyethersulfone, polyvinylidene fluoride, polypropylene, polyethylene terephthalate, nylon, nitrocellulose, or mixed cellulose.
The vibration sensor of claim 19, wherein the projected area of the one or more masses is located within the projected area of the diaphragm in the direction of vibration of the diaphragm.
The vibration sensor of claim 19, wherein the number of the one or more mass blocks connected to the diaphragm may be greater than 1, and the one or more mass blocks are respectively disposed at two sides of the diaphragm perpendicular to the vibration direction.
The vibration sensor of claim 19, wherein the number of the one or more masses connected to the diaphragm may be greater than or equal to 3; the masses are not arranged co-linearly.
The vibration sensor of claim 1, wherein at least one of the one or more plate-like structures comprises a cantilever beam.
The vibration sensor of claim 25, wherein the material of the cantilever beam comprises at least one of copper, aluminum, tin, silicon oxide, silicon nitride, silicon carbide, aluminum nitride, zinc oxide, lead zirconate titanate, or an alloy.
The vibration sensor of claim 25 wherein the one or more masses connected to the cantilever beam are disposed at a free end of the cantilever beam.
The vibration sensor of claim 25 wherein the one or more masses connected to the cantilever beam are disposed with the cantilever Liang Gongxian.
The vibration sensor of claim 1, wherein the transducer further comprises a conductive channel;

the vibration component is arranged in the conduction channel along the radial section of the conduction channel; or alternatively, the first and second heat exchangers may be,

is arranged outside the conducting channel.
The vibration sensor of claim 29 wherein the one or more masses connected to at least one of the one or more plate-like structures are not in contact with the inner wall of the conductive channel.
The vibration sensor of claim 29 wherein at least one of the one or more plate-like structures has a through-hole formed therein.
The vibration sensor of claim 29 wherein at least one of the one or more plate-like structures does not completely cover the conductive channel.
The vibration sensor of claim 29 wherein a plate-like structure of the one or more plate-like structures that is furthest from the transducer is configured to close the conductive channel.
A sound input device comprising a vibration sensor according to any one of claims 1 to 34.
A vibration system, comprising:

a plate-like structure;

a vibrating member connected to the plate-like structure;

and the mass block is connected with the vibrating piece, and the projection of the mass block is positioned in the projection of the vibrating piece in the vibrating direction of the vibrating piece.
A headset comprising a vibration system according to claim 35.