CN114697823A

CN114697823A - Vibration sensor

Info

Publication number: CN114697823A
Application number: CN202111309102.8A
Authority: CN
Inventors: 邓文俊; 袁永帅; 黄雨佳; 周文兵; 廖风云; 齐心
Original assignee: Shenzhen Voxtech Co Ltd
Current assignee: Shenzhen Voxtech Co Ltd
Priority date: 2020-12-28
Filing date: 2021-11-05
Publication date: 2022-07-01
Also published as: CN114697839A; CN216391413U

Abstract

The present specification provides a vibration sensor comprising: the vibration receiver comprises a shell and a vibration unit, wherein the vibration unit is positioned in the acoustic cavity and divides the acoustic cavity into a first acoustic cavity and a second acoustic cavity; and an acoustic transducer in acoustic communication with the first acoustic cavity, wherein: the housing is configured to generate vibration based on an external vibration signal, and the vibration unit changes sound pressure in the first acoustic cavity in response to the vibration of the housing so that the acoustic transducer generates an electrical signal; the vibrating unit comprises a mass element and an elastic element, wherein the area of one side of the mass element, which is far away from the acoustic transducer, is smaller than that of one side of the mass element, which is close to the acoustic transducer, and the elastic element is connected to the side wall of the mass element in a surrounding mode. The connection strength between the elastic element and the mass element is improved and the structural stability of the vibration sensor is improved by increasing the contact area between the mass element and the elastic element.

Description

Vibration sensor

PRIORITY INFORMATION

This specification claims international specification No. PCT/CN2020/140180 filed on 28.12.2020 and international specification No. PCT/CN2021/107978 filed on 22.7.2021, which are incorporated herein by reference in their entirety.

Technical Field

The present disclosure relates to the field of acoustic technology, and more particularly, to a vibration sensor.

Background

A vibration sensor is an energy conversion device that converts a vibration signal into an electrical signal. At present, the vibration sensor can be used as a bone conduction microphone, and can detect vibration signals transmitted through skin when a person speaks so as to detect voice signals without being interfered by external noise. The structure of the vibration component in the existing vibration sensor is unstable, so that the problems that the product yield of the vibration sensor in the production process is not high and the sensitivity of the vibration sensor in the working process is low are caused.

It is therefore desirable to provide a vibration sensor having greater structural stability and greater sensitivity.

Disclosure of Invention

One of the embodiments of the present specification provides a vibration sensor including: the vibration receiver comprises a shell and a vibration unit, wherein the shell forms an acoustic cavity, and the vibration unit is positioned in the acoustic cavity and divides the acoustic cavity into a first acoustic cavity and a second acoustic cavity; and an acoustic transducer in acoustic communication with the first acoustic cavity, wherein: the housing is configured to generate vibration based on an external vibration signal, and the vibration unit changes sound pressure in the first acoustic cavity in response to the vibration of the housing so that the acoustic transducer generates an electrical signal; the vibrating unit comprises a mass element and an elastic element, wherein the area of one side of the mass element, which is far away from the acoustic transducer, is smaller than that of one side of the mass element, which is close to the acoustic transducer, and the elastic element is connected to the side wall of the mass element in a surrounding mode.

One of the embodiments of the present specification further provides a vibration sensor, including a vibration receiver, including a housing and a vibration unit, where the housing forms an acoustic cavity, and the vibration unit is located in the acoustic cavity and divides the acoustic cavity into a first acoustic cavity and a second acoustic cavity; and an acoustic transducer in acoustic communication with the first acoustic cavity, wherein: the housing is configured to generate vibrations based on an external vibration signal, the vibration unit changing a sound pressure within the first acoustic cavity in response to the vibrations of the housing such that the acoustic transducer generates an electrical signal; the vibration unit includes a mass member including a groove located at a side of the mass member in a vibration direction thereof, and an elastic member.

Compared with the prior art, the beneficial effects of this specification are as follows:

(1) in the embodiment of the present specification, the area of the side of the mass element away from the acoustic transducer is smaller than the area of the side of the mass element close to the acoustic transducer, and under the condition that the thickness of the mass element in the vibration direction is the same, the contact area between the mass element and the elastic element is increased relative to the contact area between the columnar (e.g., cylindrical or prismatic) mass element and the elastic element, and the connection area between the elastic element and the mass element is increased, so that the connection strength between the elastic element and the mass element can be improved, the structural stability of the vibration sensor can be improved, and the yield of products can be improved; (2) through the joint strength who improves between elastic element and the mass element, can improve the leakproofness of first acoustics cavity, can prevent effectively that elastic element and mass element junction from appearing the gap, avoid the gas of first acoustics cavity to take place to leak, make the acoustic pressure change of the first acoustics cavity that responds to the casing vibration more sensitive to improve vibration sensor's sensitivity.

Drawings

The present description will be further explained by way of exemplary embodiments, which will be described in detail by way of the accompanying drawings. These embodiments are not intended to be limiting, and in these embodiments like numerals are used to indicate like structures, wherein:

FIG. 1 is an exemplary block diagram of a vibration sensor according to some embodiments herein;

FIG. 2A is an exemplary block diagram of a vibration sensor according to some embodiments of the present description;

FIG. 2B is a schematic diagram of a mass element shown in accordance with some embodiments herein;

FIG. 3 is a schematic diagram of a configuration of a vibration unit shown in accordance with some embodiments herein;

FIG. 4 is a schematic diagram of a configuration of a vibration unit shown in accordance with some embodiments herein;

FIG. 5 is a schematic diagram of a mass element according to some embodiments of the present description;

FIG. 6A is a schematic diagram of a vibration unit according to some embodiments of the present description;

FIG. 6B is a schematic diagram of a vibration unit according to some embodiments of the present description;

FIG. 6C is a schematic diagram of a vibration unit according to some embodiments of the present description;

FIG. 6D illustrates a schematic diagram of a vibration unit, according to some embodiments herein.

Detailed Description

In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings used in the description of the embodiments will be briefly described below. It is obvious that the drawings in the following description are only examples or embodiments of the present description, and that for a person skilled in the art, the present description can also be applied to other similar scenarios on the basis of these drawings without inventive effort. Unless otherwise apparent from the context, or otherwise indicated, like reference numbers in the figures refer to the same structure or operation.

It should be understood that "system", "apparatus", "unit" and/or "module" as used herein is a method for distinguishing different components, elements, parts, portions or assemblies at different levels. However, other words may be substituted by other expressions if they accomplish the same purpose.

As used in this specification and the appended claims, the terms "first," "second," and the like do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. Also, the use of the terms "a" or "an" and the like do not denote a limitation of quantity, but rather denote the presence of at least one. Unless otherwise indicated, "front," "back," "lower," and/or "upper," and the like are for convenience of description, and are not limited to one position or one spatial orientation. In general, the terms "comprises" and "comprising" merely indicate that steps and elements are included which are explicitly identified, that the steps and elements do not form an exclusive list, and that a method or apparatus may include other steps or elements.

The embodiment of the specification describes a vibration sensor. In some embodiments, the vibration sensor may include a vibration receiver and an acoustic transducer. In some embodiments, the vibration receiver may include a housing that may form an acoustic cavity and a vibration unit that may be located in the acoustic cavity and that separates the acoustic cavity into a first acoustic cavity and a second acoustic cavity. The acoustic transducer may be in acoustic communication with the first acoustic cavity. The housing may be configured to generate vibrations based on an external vibration signal (e.g., a signal generated by vibration of the bone, skin, etc. of the user while speaking). The vibration unit may change a sound pressure of the first acoustic cavity in response to vibration of the housing such that the acoustic transducer generates an electrical signal.

In some embodiments, the vibration unit may include a mass element and an elastic element. Wherein the area of the side of the mass element facing away from the acoustic transducer is smaller than the area of the side of the mass element close to the acoustic transducer. Under the condition of the same thickness, the contact area between the mass element and the elastic element in the embodiment of the present specification is increased relative to the contact area between the columnar (for example, cylindrical or prismatic) mass element and the elastic element, and when the elastic element is connected to the mass element in a surrounding manner, the connection area between the elastic element and the mass element is increased, so that the connection strength between the elastic element and the mass element is improved, the stability of the structure of the vibration assembly is improved, and the product yield is improved. Furthermore, through improving the joint strength between the elastic element and the mass element, the sealing performance of the first acoustic cavity is improved, and the gap at the joint of the elastic element and the mass element can be effectively prevented, so that the gas leakage of the first acoustic cavity to the second acoustic cavity occurs, and the sound pressure change of the first acoustic cavity responding to the shell vibration is more sensitive, and the sensitivity of the vibration sensor is improved.

FIG. 1 is an exemplary block diagram of a vibration sensor 100 shown in accordance with some embodiments of the present description. As shown in fig. 1, the vibration sensor 100 may include a vibration receiver 110 and an acoustic transducer 120. In some embodiments, the vibration receiver 110 and the acoustic transducer 120 may be physically connected. The physical connection in this specification may include welding, clamping, gluing, or integral molding, or any combination thereof.

In some embodiments, the vibration sensor 100 may be used as a bone conduction microphone. When used as a bone conduction microphone, the vibration sensor 100 may receive vibration signals of bone, skin, and other tissues generated when a user speaks and convert the vibration signals into electrical signals containing voice information. Since the sound (or vibration) in the air is hardly collected, the vibration sensor 100 can be protected from the surrounding environment noise (e.g., the sound of other people speaking around, the noise generated when the vehicle runs over) to some extent, and is suitable for use in a noisy environment to collect the speech signal when the user speaks. By way of example only, a noisy environment may include a noisy restaurant, meeting place, street, near road, fire scene, etc. In some embodiments, the vibration sensor 100 may be applied to headphones (e.g., air-conduction headphones and bone-conduction headphones), hearing aids, co-hearing devices, glasses, helmets, Augmented Reality (AR) devices, Virtual Reality (VR) devices, and the like, or any combination thereof. For example, the vibration sensor 100 may be applied to a headset as a bone conduction microphone.

The vibration receiver 110 may be configured to receive and transmit vibration signals. In some embodiments, the vibration receiver 110 includes a housing and a vibration unit. The housing may be a hollow structure inside, and part of the components (e.g., the vibration unit) of the vibration sensor 100 may be located inside the housing. For example, the housing may form an acoustic cavity and the vibration unit may be located within the acoustic cavity. In some embodiments, the vibration unit may be located in the acoustic cavity and divide the acoustic cavity formed by the housing into a first acoustic cavity and a second acoustic cavity. The acoustic cavity may be in acoustic communication with the acoustic transducer 120. The acoustic communication may be a communication means capable of transmitting a sound pressure, sound wave or vibration signal.

The acoustic transducer 120 may generate an electrical signal containing acoustic information based on the acoustic pressure changes of the first acoustic chamber. In some embodiments, a vibration signal may be received via the vibration receiver 110 and cause a change in air pressure inside the first acoustic cavity, and the acoustic transducer 120 may generate an electrical signal based on the air pressure change inside the first acoustic cavity. In some embodiments, when the vibration sensor 100 is in operation, the housing may generate vibrations based on an external vibration signal (e.g., a signal generated by the vibration of the bone, skin, etc. of a user speaking). The vibration unit may vibrate in response to vibration of the housing and transmit the vibration to the acoustic transducer 120 through the first acoustic cavity. For example, the vibration of the vibration unit may cause a volume change of the first acoustic cavity, thereby causing a change in air pressure inside the first acoustic cavity, and converting the change in air pressure inside the cavity into a change in sound pressure inside the cavity. The acoustic transducer 120 may detect a change in acoustic pressure of the first acoustic cavity and generate an electrical signal based thereon. For example, the acoustic transducer 120 may include a diaphragm, and the sound pressure in the first acoustic cavity changes and acts on the diaphragm to vibrate (or deform) the diaphragm, and the acoustic transducer 120 converts the vibration of the diaphragm into an electrical signal. For a detailed description of the vibration sensor 100, reference may be made to the detailed description of fig. 2A-6D.

It should be noted that the above description of the vibration sensor 100 and its components is for illustration and description only and is not intended to limit the scope of applicability of the present description. Various modifications and alterations to vibration sensor 100 will become apparent to those skilled in the art in light of the present description. In some embodiments, the vibration sensor 100 may also include other components, such as a power source, to provide electrical power to the acoustic transducer 120, and the like. Such modifications and variations are intended to be within the scope of the present disclosure.

FIG. 2A is an exemplary block diagram of a vibration sensor 200 according to some embodiments herein. As shown in fig. 2A, the vibration sensor 200 may include a vibration receiver 210 and an acoustic transducer 220, wherein the vibration receiver 210 may include a housing 211 and a vibration unit 212.

The housing 211 may be a hollow structure inside, and in some embodiments, the housing 211 may be coupled to the acoustic transducer 220 to enclose a structure having an acoustic cavity. The housing 211 and the acoustic transducer 220 may be physically connected. In some embodiments, the vibration unit 212 may be located within an acoustic cavity, and the vibration unit 212 may divide the acoustic cavity into a first acoustic cavity 213 and a second acoustic cavity 214. In some embodiments, the vibration unit 212 may form a first acoustic cavity 213 with the acoustic transducer 220 and the vibration unit 212 may form a second acoustic cavity 214 with the housing 211.

The vibration sensor 200 may convert an external vibration signal into an electrical signal. By way of example only, the external vibration signal may include a vibration signal generated when a person speaks, a vibration signal generated as a result of skin movement with the person or working with other devices (e.g., speakers) near the skin, a vibration signal generated by an object or air in contact with the vibration sensor 200, and the like, or any combination thereof. When the vibration sensor 200 is operated, an external vibration signal may be transmitted to the vibration unit 212 through the housing 211, and the mass element 2121 of the vibration unit 212 vibrates in response to the vibration of the housing 211 under the driving of the elastic element 2122. The vibration of the mass element 2121 may cause a change in the volume of the first acoustic cavity 213, which in turn causes a change in the air pressure within the first acoustic cavity 213 and converts the change in the air pressure within the cavity into a change in the acoustic pressure within the cavity. The acoustic transducer 220 may detect the acoustic pressure changes of the first acoustic cavity 213 and convert them into an electrical signal. For example, the acoustic transducer 220 may include a sound pickup hole 2221, and a sound pressure change in the first acoustic cavity 213 may act on the diaphragm of the acoustic transducer 220 through the sound pickup hole 2221 to vibrate (or deform) the diaphragm to generate an electrical signal. Further, the electrical signal generated by the acoustic transducer 220 may be communicated to external electronics. For example only, the acoustic transducer 220 may include an interface 223. The interface may be wired (e.g., electrically connected) or wirelessly connected with an internal element (e.g., processor) of the external electronic device. The electrical signal generated by the acoustic transducer 220 may be communicated to an external electronic device through an interface in a wired or wireless manner. In some embodiments, the external electronic device may include a mobile device, a wearable device, a virtual reality device, an augmented reality device, or the like, or any combination thereof. In some embodiments, the mobile device may include a smartphone, a tablet, a Personal Digital Assistant (PDA), a gaming device, a navigation device, and the like, or any combination thereof. In some embodiments, the wearable device may include a smart bracelet, an earpiece, a hearing aid, a smart helmet, a smart watch, a smart garment, a smart backpack, a smart accessory, or the like, or any combination thereof. In some embodiments, the virtual reality device and/or the augmented reality device may include a virtual reality helmet, virtual reality glasses, a virtual reality patch, an augmented reality helmet, augmented reality glasses, an augmented reality patch, and the like, or any combination thereof. For example, the virtual reality device and/or augmented reality device may include Google Glass, Oculus Rift, Hololens, Gear VR, and the like.

In some embodiments, the shape of the housing 211 may be a regular or irregular solid structure such as a rectangular parallelepiped, a cylinder, a circular truncated cone, and the like. In some embodiments, the material of the housing may include metal (e.g., copper, stainless steel), alloys, plastic, and the like, or any combination thereof. In some embodiments, the housing may have a thickness to ensure sufficient strength to better protect components of the vibration sensor 100 (e.g., the vibration unit 212) disposed within the housing. In some embodiments, the first acoustic cavity 213 may be in acoustic communication with the acoustic transducer 220. For example only, the acoustic transducer 220 may include a sound pickup aperture 2221, and the acoustic transducer 220 may be in acoustic communication with the first acoustic cavity 213 through the sound pickup aperture 2221. It should be noted that the description of the single pickup aperture 2221 as shown in fig. 2A is for illustration only and is not intended to limit the scope of the present invention. It should be understood that the vibration transducer 200 may include more than one pick-up hole 2221. For example, the vibration sensor 200 may include a plurality of pickup holes arranged in an array, wherein the pickup holes may be located anywhere on the acoustic transducer 220 corresponding to the first acoustic cavity 213.

In some embodiments, the vibration unit 212 may include a mass element 2121 and an elastic element 2122. In some embodiments, the mass element 2121 and the elastic element 2122 can be physically connected, e.g., glued. For example only, the elastic member 2122 may be a material having a certain viscosity, and is directly adhered to the mass member 2121.

In some embodiments, resilient element 2122 may be a high temperature resistant material such that resilient element 2122 maintains performance during manufacturing of vibration sensor 200. In some embodiments, the elastic element 2122 has a young's modulus that is indicative of the ability of the elastic element 2122 to deform when under tension or compression and a shear modulus that is indicative of the ability of the elastic element 2122 to deform when under shear, with little or no change (e.g., within 5%) in the young's modulus and the shear modulus when in an environment of 200 ℃ to 300 ℃. In some embodiments, the elastic element 2122 may be a material having good elasticity (i.e., easily elastically deformed) so that the vibration unit 212 may vibrate in response to the vibration of the housing 211. By way of example only, the material of the resilient element 2122 may include silicone rubber, silicone gel, silicone sealant, or the like, or any combination thereof. To provide greater resiliency to the resilient element 2122, in some embodiments, the resilient element 2122 may have a shore hardness of less than 50 HA. Preferably, the shore hardness of the elastic element 2122 may be less than 45 HA. More preferably, the shore hardness of the elastic element 2122 may be less than 40 HA. More preferably, the elastic element 2122 may have a shore hardness of less than 35 HA. More preferably, the elastic element 2122 may have a shore hardness of less than 30 HA. More preferably, the elastic element 2122 may have a shore hardness of less than 25 HA. More preferably, the elastic element 2122 may have a shore hardness of less than 20 HA. More preferably, the elastic element 2122 may have a shore hardness of less than 15 HA. More preferably, the elastic element 2122 may have a shore hardness of less than 10 HA. More preferably, the elastic element 2122 may have a shore hardness of less than 5 HA.

In some embodiments, the material of the mass element 2121 can be a density greater than a density threshold (e.g., 6 g/cm)³) For example, a metal. For example only, the material of the mass element 2121 may include a metal or alloy of lead, copper, silver, tin, stainless steel, stainless iron, or any combination thereof. The higher the density and smaller the size of the material of the mass element 2121 at the same mass, so that making the mass element 2121 of a material with a density greater than a certain density threshold may reduce the size of the vibration sensor 200 to some extent. In some embodiments, the material density of the mass element 2121 has a greater effect on the resonance peak and sensitivity of the frequency response curve of the vibration sensor 200. At the same volume, the greater the density of the mass elements 2121, the greater the mass, the higher the resonance peak of the vibration sensor 200 shifts to lower frequencies, and by increasing the mass of the mass elements 2121, the sensitivity of the vibration sensor 200 at lower frequency bands (e.g., 20Hz-6000Hz) can be improved due to the lower frequency of the vibration signal (e.g., bone conduction sound). In some embodimentsThe mass element 2121 has a material density of greater than 6g/cm³. In some embodiments, the material density of the mass element 2121 is greater than 7g/cm³. In some embodiments, the mass element 2121 has a material density of 7-20 g/cm³. Preferably, the mass element 2121 has a material density of 7-15 g/cm³. More preferably, the mass element 2121 has a material density of 7-10 g/cm³. More preferably, the mass element 2121 has a material density of 7-8 g/cm³. In some embodiments, the mass element 2121 and the elastic element 2122 can be made of different materials, and then assembled (e.g., glued) together to form the vibration unit 212. In some embodiments, the mass element 2121 and the elastic element 2122 may also be made of the same material, and the vibration unit 212 may be formed by integral molding.

In order to ensure that the connection area of the mass element 2121 and the elastic element 2122 is large and the structural stability is improved, the thickness of the mass element 2121 along the vibration direction (as shown in fig. 2A) is not too thin, and in some embodiments, the thickness of the mass element 2121 along the vibration direction may be greater than 60 um. When the thickness of the mass element 2121 is large, the mass element may contact with the substrate or the housing 211 of the acoustic transducer 220 during vibration to affect the acoustic conversion effect of the vibration sensor 20, so that the thickness of the mass element 2121 along the vibration direction thereof is not too thick, and in some embodiments, the thickness of the mass element 2121 along the vibration direction thereof may be less than 1150 um. In some embodiments, in order to improve structural stability of the vibration sensor 200 and ensure an acoustic conversion effect, the mass element 2121 may have a thickness of 70um to 900um in a vibration direction thereof. In some embodiments, to further improve the contact area of the mass element 2121 and the elastic element 2122, the thickness of the mass element 2121 in the vibration direction thereof may be 90um to 700 um. In some embodiments, to further facilitate fabrication of the mass element 2121, the thickness of the mass element 2121 along its direction of vibration may be 100 um-150 um.

In some embodiments, the resilient element 2122 can be circumferentially attached to the peripheral side surface of the mass element 2121. For example, when the mass element 2121 is a columnar structure (a cylinder or a prism), the circumferential side surface of the mass element 2121 is a side surface of the columnar structure. For another example, when the mass element 2121 is two columnar structures (e.g., a first mass element 21211 and a second mass element 21212) of different sizes, the circumferential side surface of the mass element 2121 includes, in addition to the side surfaces of the first mass element 21211 and the second mass element 21212, a region where the second mass element 21212 is not covered by the first mass element 21211 in the direction perpendicular to the vibration direction of the mass element 2121, so that the connection area where the mass element 2121 of the two columnar structures of different sizes can be connected to the elastic element 2122 is larger than the connection area where the mass element 2121 of the single columnar structure is connected to the elastic element 2122. A side of the mass element 2121 facing away from the acoustic transducer 220 and a side of the mass element 2121 adjacent to the acoustic transducer 220 are approximately perpendicular to the direction of vibration and serve to define the second acoustic cavity 214 and the first acoustic cavity 213, respectively. Since the elastic element 2122 is circumferentially attached to the circumferential side surface of the mass element 2121, the momentum of the mass element 2121 is converted into a force to the elastic element 2122 during the vibration of the vibration unit 212 in the vibration direction, causing the elastic element 2122 to undergo shear deformation. The shear deformation reduces the spring coefficient of the elastic element 2122 compared to the tension and compression deformation, which reduces the resonance frequency of the vibration sensor 200, thereby increasing the vibration amplitude of the mass element 2121 in a lower frequency range (e.g., 20Hz-6000Hz) during vibration of the vibration unit 212, improving the sensitivity of the vibration sensor 200. In some embodiments, the elastic element 2122 is closely attached to the circumferential surface of the mass element 2121, so that the sealing performance of the first acoustic cavity 213 can be ensured, and the air pressure change of the first acoustic cavity 213 is only related to the vibration amplitude of the vibration unit 212, so that the sound pressure change of the first acoustic cavity 213 can be more effectively and significantly.

In some embodiments, the resilient element 2122 may be a tubular structure. Accordingly, the shape of the inner wall of the elastic member 2122 having a tubular structure can be adapted to the shape of the circumferential side surface of the mass member 2121. It is understood here that the inner wall of the elastic element 2122 has the same sectional shape as the mass element 2121 along different heights in the vibration direction. The inner wall of the resilient element 2122 refers to the side wall of the tube structure that abuts the mass element 2121. For example, the mass element 2121 is stepped, and the connection between the elastic element 2122 and the mass element 2121 is stepped to match the mass element 2121. In some embodiments, the shape of a cross section of the mass element 2121 perpendicular to its vibration direction may be a regular or irregular shape such as a triangle, a quadrangle, a circle, an ellipse, a fan, a rounded rectangle, or the like. The shape of the outer wall of the tubular structure of the resilient element 2122 is not limited in this specification, and the outer wall of the resilient element 2122 can be a side wall facing away from the inner wall where the resilient element 2122 is connected to the mass element 2121. For example, the shape of the outer wall of the tubular structure of the resilient element 2122 may include a cylinder, an elliptical cylinder, a cone, a rounded rectangular cylinder, a polygonal cylinder, an irregular cylinder, or the like, or any combination thereof.

In some embodiments, the elastic element 2122 may extend toward and connect to the acoustic transducer 220. For example, as shown in fig. 2A, the end of the elastic element 2122 extending toward the acoustic transducer 220 may be connected to the acoustic transducer 220. The elastic element 2122 and the acoustic transducer 220 may be physically connected, for example, glued or welded. In some embodiments, the elastic element 2122 may also be coupled to the acoustic transducer 220 via a coupling (not shown in fig. 2A), wherein one end of the coupling is coupled to the elastic element 2122 and the other end of the coupling is coupled to the acoustic transducer 220. In some embodiments, the resilient element 2122 may be in direct contact with or spaced from the housing 211. For example, as shown in fig. 2A, there may be a space between the resilient element 2122 and the housing 211. The size of the space between the elastic member 2122 and the housing 211 may be adjusted by a designer according to the size of the vibration sensor 200. The presence of the space between the elastic element 2122 and the housing 211 may reduce the equivalent stiffness of the elastic element 2122 and increase the elasticity of the elastic element 2122, compared to when the elastic element 2122 is in direct contact with the housing 211, thereby increasing the vibration amplitude of the mass element 2121 in a lower frequency range (e.g., 20Hz-6000Hz) during the vibration of the vibration unit 212, and improving the sensitivity of the vibration sensor 200.

In some embodiments, the area of the side of the mass element 2121 facing away from the acoustic transducer 220 is less than the area of the side of the mass element 2121 adjacent to the acoustic transducer 220. In some embodiments, the mass element 2121 may have different cross-sectional areas perpendicular to the vibration direction, for example, the mass element 2121 has a stepped structure. In order to increase the coupling area of the elastic element 2122 and the circumferential side surface of the mass element 2121, and thus increase the coupling strength between the elastic element 2122 and the mass element 2121, in some embodiments, the areas of a plurality of cross sections of the mass element 2121 perpendicular to the vibration direction gradually increase from the side of the mass element 2121 away from the acoustic transducer 220 to the side of the mass element 2121 close to the acoustic transducer 220. In some embodiments, the areas of the plurality of cross sections of the mass element 2121 perpendicular to the vibration direction may be partially the same, for example, the circumferential side of the mass element 2121 may have a stepped structure. Under the condition that the thickness of the mass element 2121 in the vibration direction is constant, the areas of a plurality of cross sections perpendicular to the vibration direction on the mass element 2121 are different, so that the circumferential surface area of the mass element 2121 can be increased, the connection area between the elastic element 2122 and the mass element 2121 is increased, the connection strength between the elastic element 2122 and the mass element 2121 is improved, the structural stability is improved, the sealing performance of the first acoustic cavity is enhanced, the sound pressure change of the first acoustic cavity responding to the shell vibration is more remarkable, and the sensitivity of the vibration sensor is improved.

In some embodiments, the peripheral side surface of the mass element 2121 can be at least one step-like structure. Fig. 2B is a schematic diagram of a structure of a mass element 2121 shown in accordance with some embodiments herein. Referring to fig. 2A and 2B, the mass element 2121 may include a first mass element 21211 and a second mass element 21212, the second mass element 21212 is close to the acoustic transducer 220, the first mass element 21211 is located on a side of the second mass element 21212 facing away from the second mass element 21212, and a cross-sectional area of the first mass element 21211 perpendicular to a vibration direction of the mass element 2121 is smaller than a cross-sectional area of the second mass element 21212 perpendicular to the vibration direction of the mass element 2121, so that an entire outer edge of the first mass element 21211 and the second mass element 21212 forms a stepped structure. By way of example only, the peripheral side surface of the mass element 2121 may include a sidewall a of the first mass element 21211, a region b and a sidewall c of the second mass element 21212, the sidewall a, region b and sidewall c forming a stepped structure. The stepped structure can increase the area of the circumferential surface of the mass element 2121, and accordingly, the connection area between the elastic element 2122 and the sidewall of the mass element 2121 is larger, which is beneficial to the close fitting between the mass element 2121 and the elastic element 2122, so that the elastic element 2122 and the mass element 2121 have better sealing performance, which is beneficial to ensuring the sealing performance of the first acoustic cavity 213, and the air pressure change of the first acoustic cavity 213 is not affected by the sealing performance. In some embodiments, the first mass element 21211 and the second mass element 21212 can be fixed by physical connection, such as gluing (using adhesive glue such as epoxy glue, silicon sealant, etc.), or can be integrally formed. In some embodiments, the side of the first mass element 21211 proximal to the acoustic transducer 220 and the side of the second mass element 21212 distal to the acoustic transducer 220 may be secured by a physical connection.

In some embodiments, the side of the first mass element 21211 away from the acoustic transducer 220 is perpendicular to its direction of vibration, and the side of the second mass element 2121 close to the acoustic transducer 220 is perpendicular to its direction of vibration. In some embodiments, the area of the cross-section of the first mass element 21211 perpendicular to its direction of vibration is larger closer to the second mass element 2121, and the area of the cross-section of the second mass element 21212 perpendicular to its direction of vibration is larger closer to the acoustic transducer 220. In some embodiments, the first mass element 21211 may be disposed concentrically with the second mass element 21212, or may be disposed non-concentrically with the second mass element 21212. In some embodiments, the sidewall shape (i.e., a cross-section perpendicular to the direction of vibration) of the first mass element 21211 and/or the second mass element 21212 can include a cylinder, an elliptical cylinder, a truncated cone, a rounded rectangular cylinder (as shown in fig. 2B), a rectangular cylinder, a polygonal cylinder, an irregular cylinder (e.g., a cylinder with a multi-step face), and the like, or any combination thereof. In some embodiments, the sidewalls of the first mass element 21211 and the second mass element 21212 can be the same shape, e.g., as shown in fig. 2B, the first mass element 21211 and the second mass element 21212The side walls of element 21212 are each shaped as a rounded rectangular post. In some embodiments, the sidewall shape of the first mass element 21211 and the second mass element 21212 may not be the same, e.g., the sidewall shape of the first mass element 21211 is formed as a cylinder and the sidewall shape of the second mass element 21212 is formed as a rounded rectangular cylinder. In some embodiments, the material of the first mass element 21211 and the material of the second mass element 21212 may be the same or different, and for example only, the materials of the first mass element 21211 and the second mass element 21212 may include metals or alloys such as lead, copper, silver, tin, stainless steel, stainless iron, or any combination thereof. In some embodiments, the material density of the first mass element 21211 and the second mass element 21212 can be greater than 6g/cm³. In some embodiments, the material density of the first mass element 21211 and the second mass element 21212 can be greater than 7g/cm³。

In some embodiments, the first mass element 21211 is located in a middle region of the second mass element 21212 such that a sidewall of the first mass element 21211 and a sidewall of the second mass element 21212 can have a certain spacing d (e.g., 10um to 1000 um) therebetween, i.e., a certain spacing d between a side edge of the first mass element 21211 near the acoustic transducer 220 and a side edge of the second mass element 21212 away from the acoustic transducer 220. In some embodiments, the distance d between the sidewall of the first mass element 21211 and the sidewall of the second mass element 21212 may be equal everywhere, for example, when the first mass element 21211 and the second mass element 21212 are concentrically arranged, the shape of the sidewall of the first mass element 21211 and the shape of the sidewall of the second mass element 21212 are both cylindrical structures, and the distance d between the sidewall of the first mass element 21211 and the sidewall of the second mass element 21212 is equal everywhere. In some embodiments, the spacing d between the side walls of the first mass element 21211 and the side walls of the second mass element 21212 may not be equal everywhere, e.g., the side walls of the first mass element 21211 are shaped as cylindrical structures, the side walls of the second mass element 21212 are shaped as rectangular cylinders, and the spacing between the edges on the side walls of the second mass element 21212 and the side walls of the first mass element 21211 is not equal to the spacing between the edges on the side walls of the second mass element 21212 and the side walls of the first mass element 21211. In some embodiments, in order to secure a connection area of the elastic member with the region b of the second mass member 21212, and improve structural stability, the specific distance d may be greater than 10 um. In some embodiments, to make the mass of the first mass element 21211 large, ensuring the sensitivity of the vibration sensor 200, the specific spacing may be less than 500 um. In some embodiments, in order to secure a connection area of the elastic member with the region b of the second mass element 21212 while preventing the first mass element 21211 from having too small a mass to degrade the sensitivity of the vibration sensor 200, the specific spacing d may be 20um to 450 um. More preferably, the specific interval d may be 30um to 400 um. More preferably, the specific interval d may be 40um to 350 um. More preferably, the specific interval d may be 50um to 300 um. More preferably, the specific interval d may be 60um to 250 um. More preferably, the specific interval d may be 70um to 200 um. More preferably, the specific interval d may be 80um to 150 um. More preferably, the specific interval d may be 90um to 100 um.

In some embodiments, the thickness of the first mass element 21211 in its direction of vibration may be greater than the thickness of the second mass element 21212 in its direction of vibration. By increasing the thickness of the first mass element 21211, not only the mass of the entire mass element 2121 can be increased, but also the connection area between the elastic element 2122 and the side wall a of the first mass element 21211 can be increased, thereby improving the connection strength between the elastic element 2122 and the mass element 2121. In some embodiments, the thickness of the first mass element 21211 in the vibration direction thereof may be 50um to 1000um, and the thickness of the second mass element 21212 in the vibration direction thereof may be 10um to 150 um. More preferably, the thickness of the first mass element 21211 in the vibration direction thereof may be 200 to 400um, and the thickness of the second mass element 21212 in the vibration direction thereof may be 60 to 90 um.

It is to be noted that the mass element 2122 is not limited to the structure including the first mass element 21211 and the second mass element 21212 shown in fig. 2A and 2B, and may include a third mass element, a fourth mass element, or more mass elements. When the mass element 2122 includes more than two mass elements, a stepped structure may be formed between the sidewalls of each two mass elements.

In some embodiments, the resilient element 2122 can include a first resilient portion 21221 and a second resilient portion 21222, the first resilient portion 21221 can be circumferentially attached to a sidewall of the first mass element 21211, the second resilient portion 21222 can be circumferentially attached to a sidewall of the second mass element 21212, and the first resilient portion 21221 and the second resilient portion 21222 can be physically attached, e.g., bonded, welded. In some embodiments, the first resilient portion 21221 and the second resilient portion 21222 can be a unitary, molded structure. In some embodiments, the first resilient portion 21221 abuts a sidewall of the first mass 21211, the second resilient portion 21222 abuts a sidewall of the second mass 21212, and the first resilient portion 21221 is sealingly coupled to the second resilient portion 21222. In some embodiments, both ends of the first elastic part 21221 may be connected to the side wall of the first mass element 21211 and the second elastic part 21222, respectively. In some embodiments, both ends of the first elastic part 21221 may be hermetically connected to the side wall of the first mass element 21211 and the second elastic part 21222, respectively. The first resilient portion 21221 may include a first side 21221a and a second side 21221b, the first side 21221a being connected to a sidewall of the first mass 21211, and the second side 21221b being connected to a surface of the second mass 21212 exposed to the second acoustic cavity 214. The second side 21221b of the first elastic part 21221 may be connected to a stepped surface (i.e., an area b) of the second mass element 21212, the stepped surface of the second mass element 21212 has a supporting function to face the first elastic part 21221, and the supporting function of the stepped surface of the second mass element 21212 and the first elastic part 21221 may make the first elastic part 21221 and the second mass element 21212 connected more closely, which may increase the connection strength of the first elastic part 21221 and the second mass element 21212. The second side 21221b of the first elastic portion 21221 can be connected to the second elastic portion 21222. The side wall of the second mass element 21212 is connected to the second elastic portion 21222. In some embodiments, the second resilient portion 21222 extends toward the acoustic transducer 220 and is coupled to the acoustic transducer 220 (e.g., the substrate 222). In some embodiments, both ends of the second elastic part 21222 may be connected to the sidewall of the second mass element 21212 and the acoustic transducer 220, respectively, and one end of the second elastic part 21222 connected to the sidewall of the second mass element 21212 may be further connected to the first elastic part 21221. In some embodiments, the shape of the first side face 21221a of the first elastic part 21221 is adapted to the shape of the side wall of the first mass element 21211, for example, the cross-sectional shape of the first mass element 21211 perpendicular to the vibration direction thereof may be a triangular shape, a quadrangular shape, a circular shape, an elliptical shape, a fan shape, a rounded rectangular shape, or the like, which is regular or irregular, and the cross-sectional shape of the first side face 21221a perpendicular to the vibration direction of the first mass element 21211 is the same as the cross-sectional shape of the first mass element 21211 at each height along the vibration direction of the first mass element 21211. In some embodiments, the shape of the side of the second elastic portion 21222 close to the side wall of the second mass element 21212 is adapted to the shape of the side wall of the second mass element 21212, for example, the cross-sectional shape of the second mass element 21212 perpendicular to the vibration direction thereof may be a regular or irregular shape such as a triangle, a quadrangle, a circle, an ellipse, a fan, a rounded rectangle, or the like, and the cross-sectional shape of the side of the second elastic portion 21222 close to the side wall of the second mass element 21212 perpendicular to the vibration direction is the same as the cross-sectional shape of the side wall of the second mass element 21212 perpendicular to the vibration direction at each height in the vibration direction. The present specification does not limit the shape of the side of the first elastic part 21221 away from the side wall of the first mass element 21211 and the shape of the side of the second elastic part 21222 away from the side wall of the second mass element 21212, and for example, the shapes of the sides thereof may include a cylinder, an elliptic cylinder, a cone, a rounded rectangular cylinder, a polygonal cylinder, an irregular cylinder, and the like, or any combination thereof. In some embodiments, the materials of the first and second

elastic portions

21221, 21222 may be the same or different, and by way of example only, the material of the first or second

elastic portions

21221, 21222 may include silicone rubber, silicone gel, silicone sealant, or the like, or any combination thereof.

In some embodiments, the mass element 2121 may further include a first bore portion 21213, the first bore portion 21213 communicating the first acoustic cavity 213 and the second acoustic cavity 214. The first hole portion 21213 may penetrate through the mass element 2121, and the first hole portion 21213 may allow the gas in the first acoustic cavity 213 and the gas in the second acoustic cavity 214 to flow therethrough, so as to balance the gas pressure change inside the first acoustic cavity 213 and the second acoustic cavity 214 caused by the temperature change during the manufacturing process (e.g., during the reflow soldering process) of the vibration sensor 200, and reduce or prevent the damage, such as cracking, deformation, and the like, of the components of the vibration sensor 200 caused by the gas pressure change.

In some embodiments, the first hole portion 21213 may have a single-hole structure. To reduce the damping generated by the gas inside the second acoustic cavity 214, and to reduce the resistance when the vibration unit 212 vibrates, in some embodiments, the diameter of the single hole may be greater than 1 um. In order to prevent the first hole part 21213 from being oversized and affecting the air pressure variations inside the first acoustic cavity 213 and the second acoustic cavity 214, so as to affect the sensitivity of the vibration sensor 200, the diameter of the single hole may be less than 50um in some embodiments. In reducing the damping generated by the gas inside the second acoustic cavity 214, reducing the resistance when the vibration unit 212 vibrates, while ensuring the sensitivity of the vibration sensor 200, the single hole may have a diameter of 2-45um in some embodiments. In some embodiments, the single hole may be 3-40um in diameter for further ease of machining. More preferably, the diameter of the single hole may be 7-10 um. In some embodiments, the first aperture portion 21213 may be an array of a number of micro-holes. For example only, the number of microwells may be 2-10. In order to reduce the damping generated by the gas inside the second acoustic cavity 214, and reduce the resistance when the vibration unit 212 vibrates, in some embodiments, the diameter of each micro-hole may be greater than 0.1 um. In order to prevent the first hole part 21213 from being oversized, affecting the air pressure variations inside the first acoustic cavity 213 and the second acoustic cavity 214, and thus affecting the sensitivity of the vibration sensor 200, in some embodiments, the diameter of each micro-hole may be less than 25 um. In reducing the damping generated by the gas inside the second acoustic cavity 214, reducing the resistance when the vibration unit 212 vibrates, while ensuring the sensitivity of the vibration sensor 200, in some embodiments, the diameter of each micro-hole may be 0.5-20 um. In some embodiments, each pore may have a diameter of 0.5-15um to further facilitate processing.

In some embodiments, the mass element 2121 may not be provided with the first hole portion 21213. In some embodiments, when the mass element 2121 is not provided with the first hole portion 21213, it is possible to prevent the components of the vibration sensor 200 from being damaged due to the change in air pressure inside the first acoustic cavity 213 by improving the coupling strength between the mass element 2121 and the elastic element 2122 (e.g., enhancing the adhesive strength of the glue between the mass element 2121 and the elastic element 2122).

In some embodiments, at least one third bore portion 2111 may be provided in the housing 211, the third bore portion 2111 extending through the housing 211. The structure of the third hole portion 2111 is the same as or similar to that of the first hole portion 21213, and reference may be made to the description of the first hole portion 21213 for details, which are not described herein again. The third hole 2111 may allow the second acoustic cavity 214 to communicate with the outside air, so as to balance the change in the gas pressure inside the second acoustic cavity 214 caused by the temperature change during the manufacturing process (e.g., during reflow soldering) of the vibration sensor 200, and reduce or prevent the damage, such as cracking, deformation, and the like, of the components of the vibration sensor 200 caused by the change in the gas pressure. Further, the third hole portion 2111 may serve to reduce damping generated by gas inside the second acoustic chamber 214 when the mass element 2121 vibrates.

In some embodiments, the air conduction sound in the environment may affect the performance of the vibration sensor 200. To reduce the effects of air conduction sound in the environment, the third hole portion 2111 on the housing may be sealed with a sealing material after the preparation of the vibration sensor 200 is completed, for example, after reflow soldering. By way of example only, the sealing material may comprise an epoxy glue, a silicon sealant, the like, or any combination thereof. In some embodiments, the housing 211 may also be provided without the third bore portion 2111.

In some embodiments, the acoustic transducer 220 may include a substrate 222. The substrate 222 may be used to secure and/or support the vibration receiver 210. In some embodiments, the substrate 222 may be disposed on the acoustic transducer 220, and the housing 211 and the substrate 222 are physically connected to enclose an acoustic cavity. In some embodiments, the end of the elastic element 2122 extending towards the acoustic transducer 220 may be connected to a substrate 222, and the substrate 222 may be used to fix and support the vibration unit 212. The provision of the substrate 222 allows the vibration receiver 210 to be manufactured, manufactured and sold as a separate component. The vibration receiver 210 with the substrate 222 may be physically connected (e.g., glued) directly to the acoustic transducer 220 to obtain the vibration sensor 200, which simplifies the manufacturing process of the vibration sensor 200 and increases the process flexibility of manufacturing the vibration sensor 200. In some embodiments, the thickness of the substrate 222 may be 10um to 300 um. Preferably, the thickness of the substrate 222 may be 20um to 280 um. More preferably, the thickness of the substrate 222 may be 30um to 270 um. More preferably, the thickness of the substrate 222 may be 40um to 250 um. More preferably, the thickness of the substrate 222 may be 80um to 90 um. In some embodiments, the material of the substrate 222 may include a metal (e.g., iron, copper, stainless steel, etc.), an alloy, a non-metal (plastic, rubber, resin), etc., or any combination thereof.

In some embodiments, the sound hole 2221 may be located on the substrate 222, and the sound hole 2221 penetrates through the substrate 222 along the vibration direction. Acoustic pressure changes within the first acoustic cavity 213 may act on the acoustic transducer 220 through the pickup aperture 2221 to produce an electrical signal.

It should be noted that the above description of the vibration sensor 200 and its components is for illustration and description only and is not intended to limit the scope of applicability of the present description. Various modifications and alterations of vibration sensor 200 will be apparent to those skilled in the art in light of this disclosure, for example, vibration sensor 200 may include at least one first bore portion 21213, and first bore portion 21213 may be disposed through resilient element 2122. Such modifications and variations are intended to be within the scope of the present disclosure.

In order to ensure that the elastic element and the mass element have larger connecting areas and further improve the connecting strength between the elastic element and the mass element, the mass element which meets the requirement that the area of one side of the mass element, which is far away from the acoustic transducer, is smaller than the area of one side of the mass element, which is close to the acoustic transducer, can also be in other structures. Fig. 3 is a schematic diagram of a structure of a vibration unit 312 according to some embodiments herein. As shown in fig. 3, the area of the side of the mass element 3121 facing away from the acoustic transducer is smaller than the area of the side of the mass element 3121 close to the acoustic transducer, and in the cross section of the mass element 312 along the vibration direction (as shown in fig. 3), the side surface between the edge of the side of the mass element 312 facing away from the acoustic transducer and the edge of the side of the mass element 312 close to the acoustic transducer is an inclined surface, and the elastic element 3122 is connected to the inclined surface between the side of the mass element 312 facing away from the acoustic transducer and the side of the mass element 312 close to the acoustic transducer, so that the elastic element 3122 and the mass 3121 have a larger connection area, and the connection strength between the elastic element 3122 and the mass 3121 is further improved.

In some embodiments, the side surface of the mass element 3121 that joins the side of the mass element 3121 facing away from the acoustic transducer to the side of the mass element 3121 adjacent to the acoustic transducer may be a smooth-surfaced inclined surface, and the inclined peripheral side surface may have a greater area of connection with the elastic element 3122 than the peripheral side surface that is perpendicular (close to perpendicular) to the direction of vibration of the mass element 3121, and the inclined peripheral side surface may provide support for the elastic element 3122, which also provides a tighter and stronger connection between the mass element 3121 and the elastic element 3122. In some embodiments, the side surface of the mass element 3121 that is connected to the side of the mass element 3121 that faces away from the acoustic transducer may be an inclined surface with a plurality of protrusions and depressions, for example, the surface of the inclined surface may have a wavy or saw-tooth structure, and the inclined surface with a plurality of protrusions and depressions has a larger connection area with the elastic element 3122 and a larger supporting function than an inclined surface with a smooth surface at the same thickness of the mass element 3121. In some embodiments, in a cross section of the mass element 3121 along the vibration direction of the mass element 3121, a line between an edge of the side of the mass element 3121 facing away from the acoustic transducer and an edge of the side of the mass element 3121 close to the acoustic transducer forms an included angle with the vibration direction of the mass element 3121, the included angle c may be 10 ° to 80 °, and a value range of the included angle c is set, so that when the included angle c is too small, an optimization effect of the connection strength between the elastic element 3122 and the mass element 3121 is not obvious, and when the included angle c is too large, an area of the side of the mass element 3121 facing away from the acoustic transducer is too small, which may result in too small mass of the mass element 3121. Preferably, the included angle c may be 20 ° to 70 °. More preferably, the included angle c may be 30 ° to 60 °. More preferably, the included angle c may be 40 ° to 50 °.

In some embodiments, the resilient element 3122 is attached around the side that interfaces between the side of the mass element 3121 that faces away from the acoustic transducer and the side of the mass element 3121 that is adjacent to the acoustic transducer. In some embodiments, one end of the elastic element 3122 is connected to the inclined surface of the mass element 3121 and the other end of the elastic element 3122 is connected to an acoustic transducer. A side of the mass element 3121 proximate to the acoustic transducer, the elastic element 3122, and the acoustic transducer form a first acoustic cavity 313. In some embodiments, the shape of the end surface of the elastic element 3122 that connects to the inclined surface of the mass element 3121 is adapted to the shape of the inclined surface of the mass element 3121, for example, the edge of the abutting side surface is a wavy or jagged curve, and the outer edge of the end surface of the elastic element 3122 that connects to the abutting side surface is also a wavy or jagged curve. The present specification does not limit the shape of a side of the elastic element 3122 exposed to the second acoustic cavity, and for example, in a cross section of the mass element 3121 along the vibration direction thereof, the edge of the side of the elastic element 3122 exposed to the second acoustic cavity may have an irregular curve having a plurality of irregularities.

In some embodiments, the mass element 3121 may further include a first aperture 31213, the first aperture 31213 extending through the mass element 3121 to place the first acoustic cavity 313 in gas communication with the second acoustic cavity. In some embodiments, the first hole portion 31213 may be a single hole structure. In some embodiments, the first aperture portion 31213 can be an array of a number of micro-wells. For example only, the number of microwells may be 2-10.

In some embodiments, the substrate 322 may be used to secure and/or support the vibration unit 312. In some embodiments, the end of the elastic element 3122 connected to the acoustic transducer may be connected to the substrate 322 such that the substrate 322 may be used to secure and support the vibration unit 312. In some embodiments, the substrate 322 may include a pickup aperture 2221 for placing the first acoustic cavity 313 in acoustic communication with the acoustic transducer.

It should be noted that the above description of the vibration unit 312 and its components is for illustration and description only and does not limit the scope of applicability of the present description. It will be apparent to those skilled in the art having the benefit of this disclosure that various modifications and variations can be made to the vibration unit 312. for example, the vibration sensor 200 can include at least two elastic elements, an elastic element coupled to the elastic element, an elastic element coupled to the mass element adjacent to the mass element, and a mass element coupled to the acoustic transducer adjacent to the acoustic transducer. Such modifications and variations are intended to be within the scope of the present disclosure.

In order to prevent damage to the acoustic transducer caused by the opening of the first aperture portion, which may damage a part of the element (e.g. the substrate) of the acoustic transducer during the opening of the first aperture portion in the mass element, the mass element may in some embodiments comprise one or more second aperture portions (also referred to as recesses), the first aperture portion communicating with the second aperture portion. Fig. 4 is a schematic diagram of a structure of a vibration unit 412 according to some embodiments described herein. As shown in fig. 4, two ends of the elastic element 4122 are respectively connected to the sidewall of the mass element 4121 and the acoustic transducer by physical means, such as adhesive bonding, and a side surface of the mass element 4121 close to the acoustic transducer, the elastic element 4122 and the acoustic transducer form a first acoustic cavity 413 therebetween.

In the case where the mass member 4121 needs to be provided with the first hole portion 41213, it is inconvenient to machine the first hole portion 41213 because the overall thickness of the mass member 4121 in the vibration direction thereof is large. In some embodiments, the mass member 4121 may be provided with a second hole portion 41214, and the first hole portion 41213 communicates with the second hole portion 41214. In some embodiments, the mass element 4121 may include one or more second hole portions 41214. The provision of the second hole portion 41214 thins the partial structure of the mass member 4121 to facilitate opening of the first hole portion 41213 at the thinned partial structure, and at the same time facilitates control of the processing strength of the first hole portion 41213 without causing damage to other components of the vibration sensor (e.g., the substrate 422, the acoustic transducer) during the processing of the first hole portion 41213. In some embodiments, the second hole portion 41214 is located at a side portion of the mass element 4121 in the vibration direction thereof. For example, the second hole portion 41214 may be located at a side of the mass member 4121 close to or far from the substrate 422. In some embodiments, the first and

second hole portions

41213 and 41214 are disposed along the vibration direction of the mass element 4121, wherein the first and

second hole portions

41213 and 41214 penetrate the mass element 4121. In some embodiments, the second hole portion 41214 may or may not be disposed concentrically with the mass member 4121. In some embodiments, the first hole portion 41213 may or may not be concentrically disposed with the second hole portion 41214.

In some embodiments, the second hole portion 41214 and/or the first hole portion 41213 may be a square hole, a polygonal hole, a circular hole, an irregular hole, or the like, or any combination thereof, and the hole shapes of the second hole portion 41214 and the first hole portion 41213 are not limited by the present specification. In some embodiments, the first hole portion 41213 may or may not have the same hole shape as the second hole portion 41214. In some embodiments, the first and

second hole portions

41213 and 41214 may each have a single hole structure. In some embodiments, the second hole portion 41214 may have a single hole structure, and the first hole portion 31213 may have an array of a number of micro holes.

In some embodiments, the size of the second hole portion 41214 is larger than the size of the first hole portion 41213 to facilitate machining the first hole portion 41213 within the second hole portion 41214. In some embodiments, the cross-sectional area of the second hole portion 41214 perpendicular to the vibration direction of the mass member 4121 is larger than the cross-sectional area of the first hole portion 41213 perpendicular to the vibration direction of the mass member 4121. When the second hole portion 41214 and the first hole portion 41213 are both circular holes, the aperture of the second hole portion 41214 may be 100um to 1600um, and the aperture of the first hole portion 41213 may be 1um to 50 um. In order to facilitate the opening of the first and

second hole portions

41213 and 41214, the second hole portion 41214 may have an aperture of 140 to 800um, more preferably, the second hole portion 41214 may have an aperture of 200 to 400um, and the first hole portion 41213 may have an aperture of 10 to 15 um.

Fig. 5 is a structural schematic diagram of the mass element 4121 shown in fig. 4, the second hole portion 41214 is provided on a side of the mass element 4121 close to the acoustic transducer, the first hole portion 41213 is provided on a side of the mass element 4121 away from the acoustic transducer, and the second hole portion 41214, the first hole portion 41213 are provided through the mass element 4121.

Fig. 6A is a schematic diagram of a structure of a vibration unit 412 shown in accordance with some embodiments herein. As shown in fig. 6A, the second hole portion 41214 may also be located on a side of the mass element 4121 facing away from the acoustic transducer, the first hole portion 41213 being disposed on a side of the mass element 4121 adjacent to the acoustic transducer, the second hole portion 41214 and the first hole portion 41213 penetrating the mass element 4121. In some embodiments, the depth of the first hole portion 41213 in the vibration direction of the mass element 4121 may be greater than, less than, or equal to the depth of the second hole portion 41214 in the vibration direction of the mass element 4121, and fig. 6B is a schematic structural view of the vibration unit 412 according to some embodiments herein, by way of example only. As shown in fig. 6B, the second hole portion 41214 is located on the side of the mass element 4121 facing away from the acoustic transducer, the first hole portion 41213 is located on the side of the mass element 4121 closer to the acoustic transducer, the second hole portion 41214 and the first hole portion 41213 penetrate the mass element 4121, and the depth of the first hole portion 41213 in the vibration direction of the mass element 4121 is larger than the depth of the second hole portion 41214 in the vibration direction of the mass element 4121. Fig. 6C is a schematic diagram of a structure of the vibration unit 412 according to some embodiments herein. As shown in fig. 6C, in some embodiments, both sides of the mass element 4121 near and away from the acoustic transducer are provided with second hole portions 41214, and the second hole portions 41214 of both sides of the mass element 4121 communicate through the first hole portion 41213. In some embodiments, the vibration unit 412 may include a plurality of stacked mass elements 4121, the material of the plurality of stacked mass elements 4121 may or may not be identical, the first hole portion 41213 may be disposed through a portion of the mass element 4121, the second hole portion 41214 may be disposed through a portion of the mass element 4121, the first hole portion 41213 may be in communication with the second hole portion 41214, as an example only, and fig. 6D is a schematic diagram of the structure of the vibration unit 412 according to some embodiments described herein. As shown in fig. 6D, the vibration unit 412 may include two stacked layers of mass elements 4121, the materials of the two layers of mass elements 4121 being different, the first hole portion 41213 being provided through the mass element 4121 facing away from the acoustic transducer, the second hole portion 41214 being provided through the mass element 4121 adjacent, the first hole portion 41213 being in communication with the second hole portion 41214.

It should be noted that the above description of the vibration unit 412 and its components is for illustration and description only and is not intended to limit the scope of applicability of the present description. It will be apparent to those skilled in the art having the benefit of this disclosure that various modifications and changes may be made to the vibration unit 412, for example, the second and

first hole portions

41214 and 41213 may be provided through the sidewall of the mass member 4121. Such modifications and variations are intended to be within the scope of the present disclosure. It should be noted that the second hole portion 41214 shown in fig. 4 to 6D can also be applied to the vibration sensor 200 shown in fig. 2A. In addition, the mass element 4121 in fig. 4-6D is only used as an exemplary illustration, and the specific shape and structure thereof can refer to the contents in fig. 2A and 2B, which are not further described herein.

Having thus described the basic concept, it will be apparent to those skilled in the art that the foregoing detailed disclosure is to be regarded as illustrative only and not as limiting the present specification. Various modifications, improvements and adaptations to the present description may occur to those skilled in the art, although not explicitly described herein. Such modifications, improvements and adaptations are proposed in the present specification and thus fall within the spirit and scope of the exemplary embodiments of the present specification.

Also, the description uses specific words to describe embodiments of the description. Reference throughout this specification to "one embodiment," "an embodiment," and/or "some embodiments" means that a particular feature, structure, or characteristic described in connection with at least one embodiment of the specification is included. Therefore, it is emphasized and should be appreciated that two or more references to "an embodiment" or "one embodiment" or "an alternative embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, some features, structures, or characteristics of one or more embodiments of the specification may be combined as appropriate.

Moreover, those skilled in the art will appreciate that aspects of the present description may be illustrated and described in terms of several patentable species or situations, including any new and useful combination of processes, machines, manufacture, or materials, or any new and useful improvement thereof. Accordingly, aspects of this description may be performed entirely by hardware, entirely by software (including firmware, resident software, micro-code, etc.) or by a combination of hardware and software. The above hardware or software may be referred to as "data block," module, "" engine, "" unit, "" component, "or" system. Furthermore, aspects of the present description may be represented as a computer product, including computer readable program code, embodied in one or more computer readable media.

The computer storage medium may comprise a propagated data signal with the computer program code embodied therewith, for example, on a baseband or as part of a carrier wave. The propagated signal may take any of a variety of forms, including electromagnetic, optical, etc., or any suitable combination. A computer storage medium may be any computer-readable medium that can communicate, propagate, or transport a program for use by or in connection with an instruction execution system, apparatus, or device. Program code located on a computer storage medium may be propagated over any suitable medium, including radio, cable, fiber optic cable, RF, or the like, or any combination of the preceding.

Computer program code required for the operation of various portions of this specification may be written in any one or more programming languages, including an object oriented programming language such as Java, Scala, Smalltalk, Eiffel, JADE, Emerald, C + +, C #, VB.NET, Python, and the like, a conventional programming language such as C, Visual Basic, Fortran 2003, Perl, COBOL 2002, PHP, ABAP, a dynamic programming language such as Python, Ruby, and Groovy, or other programming languages. The program code may execute entirely on the user's computer, partly on the user's computer, as a stand-alone software package, partly on the user's computer and partly on a remote computer or entirely on the remote computer or server. In the latter scenario, the remote computer may be connected to the user's computer through any network format, such as a Local Area Network (LAN) or a Wide Area Network (WAN), or the connection may be made to an external computer (for example, through the Internet), or in a cloud computing environment, or as a service, such as a software as a service (SaaS).

Additionally, the order in which the elements and sequences of the process are recited in the specification, the use of alphanumeric characters, or other designations, is not intended to limit the order in which the processes and methods of the specification occur, unless otherwise specified in the claims. While various presently contemplated embodiments of the invention have been discussed in the foregoing disclosure by way of example, it is to be understood that such detail is solely for that purpose and that the appended claims are not limited to the disclosed embodiments, but, on the contrary, are intended to cover all modifications and equivalent arrangements that are within the spirit and scope of the embodiments herein. For example, although the system components described above may be implemented by hardware devices, they may also be implemented by software-only solutions, such as installing the described system on an existing server or mobile device.

Similarly, it should be noted that in the preceding description of embodiments of the present specification, various features are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure aiding in the understanding of one or more of the embodiments. This method of disclosure, however, is not intended to imply that more features than are expressly recited in a claim. Indeed, the embodiments may be characterized as having less than all of the features of a single embodiment disclosed above.

Numerals describing the number of components, attributes, etc. are used in some embodiments, it being understood that such numerals used in the description of the embodiments are modified in some instances by the use of the modifier "about", "approximately" or "substantially". Unless otherwise indicated, "about", "approximately" or "substantially" indicates that the number allows a variation of ± 20%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximations that may vary depending upon the desired properties of the individual embodiments. In some embodiments, the numerical parameter should take into account the specified significant digits and employ a general digit preserving approach. Notwithstanding that the numerical ranges and parameters setting forth the broad scope of the range in some embodiments of the specification are approximations, in specific embodiments, such numerical values are set forth as precisely as possible within the practical range.

For each patent, patent specification disclosure, and other materials cited in this specification, such as articles, books, specifications, publications, documents, etc., the entire contents of which are hereby incorporated by reference into this specification. Except for documents in which the history of the specification does not correspond or conflict with the contents of the specification, or documents which are currently or later come to be limited to the broadest scope of the claims of the specification (i.e., documents that are currently or later come to be appended to the specification). It is to be understood that the descriptions, definitions and/or uses of terms in the accompanying materials of this specification shall control if they are inconsistent or contrary to the descriptions and/or uses of terms in this specification.

Finally, it should be understood that the embodiments described herein are merely illustrative of the principles of the embodiments of the present disclosure. Other variations are also possible within the scope of the present description. Thus, by way of example, and not limitation, alternative configurations of the embodiments of the present specification can be seen as consistent with the teachings of the present specification. Accordingly, the embodiments of the present description are not limited to only those embodiments explicitly described and depicted herein.

Claims

1. A vibration sensor, comprising:

the vibration receiver comprises a shell and a vibration unit, wherein the shell forms an acoustic cavity, and the vibration unit is positioned in the acoustic cavity and divides the acoustic cavity into a first acoustic cavity and a second acoustic cavity; and

an acoustic transducer in acoustic communication with the first acoustic cavity, wherein:

the housing is configured to generate vibrations based on an external vibration signal, the vibration unit changing a sound pressure within the first acoustic cavity in response to the vibrations of the housing such that the acoustic transducer generates an electrical signal;

the vibration unit comprises a mass element and an elastic element, the area of one side of the mass element, which is far away from the acoustic transducer, is smaller than the area of one side of the mass element, which is close to the acoustic transducer, and the elastic element is connected to the side wall of the mass element in a surrounding mode.

2. The vibration sensor of claim 1, wherein the mass element comprises a first mass element and a second mass element, the second mass element being proximate to the acoustic transducer, the first mass element being located on a side of the second mass element facing away from the acoustic transducer, a cross-sectional area of the first mass element perpendicular to a direction of vibration of the mass element being smaller than a cross-sectional area of the second mass element perpendicular to a direction of vibration of the mass element.

3. The vibration sensor according to claim 2, wherein the first mass element is located in a middle region of the second mass element with a certain distance between a side wall of the first mass element and a side wall of the second mass element.

4. The vibration sensor according to claim 3, wherein the specific pitch ranges from 10um to 500 um.

5. The vibration sensor according to claim 3, wherein the elastic element includes a first elastic portion and a second elastic portion, both ends of the first elastic portion are connected to the side wall of the first mass element and the second elastic portion, respectively, and the second elastic portion extends toward and is connected to the acoustic transducer.

6. The vibration sensor according to claim 5, wherein the first elastic portion includes a first side surface connected to a side wall of the first mass element and a second side surface connected to a surface of the second mass element exposed to the second acoustic cavity.

7. The vibration sensor according to claim 6, wherein a side wall of the second mass element is connected to the second elastic portion.

8. The vibration sensor of claim 5, wherein the acoustic transducer comprises a substrate, the second elastic element extending towards and connected with the substrate, the second mass element and the second elastic element forming the first acoustic cavity.

9. The vibration sensor according to claim 2, wherein the first mass element has a thickness of 50 to 1000um and the second mass element has a thickness of 10 to 150um in a vibration direction of the mass elements.

10. The vibration sensor according to claim 9, wherein a thickness of the first mass element is larger than a thickness of the second mass element in a vibration direction of the mass element.

11. A vibration sensor as claimed in claim 1, wherein, in a cross-section of the mass element taken along its direction of vibration, a line between an edge of the mass element on a side facing away from the acoustic transducer and an edge of the mass element on a side facing towards the acoustic transducer forms an angle with the direction of vibration of the mass element, said angle being in the range 10 ° -80 °.

12. The vibration sensor of claim 1, wherein the mass element includes a first aperture portion that communicates the first acoustic cavity and the second acoustic cavity.

13. The vibration sensor according to claim 12, wherein the radius of the first hole portion is 1um to 50 um.

14. The vibration sensor according to claim 1, said case including a third hole portion thereon, said second acoustic chamber communicating with the outside through said third hole portion.

15. A vibration sensor, comprising:

the vibration unit comprises a mass element and an elastic element, wherein the elastic element is connected to the side wall of the mass element in a surrounding mode, the mass element comprises a groove, and the groove is located on the side portion of the mass element along the vibration direction of the mass element.

16. The vibration sensor of claim 15, wherein the mass element includes a first aperture portion communicating the first acoustic cavity and the second acoustic cavity, the first aperture portion being located at the recess.

17. The vibration sensor according to claim 16, wherein the radius of the first hole portion is 1um to 50 um.

18. The vibration sensor of claim 17, wherein the size of the groove is larger than the size of the first hole portion.