RU2809948C1 - Vibration sensor - Google Patents

Abstract

FIELD: measuring instrumentation.

SUBSTANCE: vibration sensor contains a vibration receiver and an acoustic transducer. The vibration receiver contains a housing, a limiter, and a vibration block. The housing and the acoustic transducer form an acoustic cavity. The vibration block is located in the acoustic cavity to divide the acoustic cavity into the first acoustic cavity and the second acoustic cavity, the acoustic transducer is acoustically connected to the first acoustic cavity. The housing is made with the ability to generate vibration based on an external vibration signal. The vibration unit is configured to change the sound pressure in the first acoustic cavity in response to vibration of the housing so that the acoustic transducer generates an electrical signal. The vibration unit contains a mass element and an elastic element. The first side of the elastic element is attached around the side wall of the mass element, and the second side of the elastic element is connected to the limiter, and the first side and the second side of the elastic element are located along a direction perpendicular to the vibration direction of the vibration unit.

EFFECT: improved sensitivity.

10 cl, 9 dwg

Description

Field of technology to which the invention relates

The present disclosure relates to the field of acoustics engineering and relates in more detail to a vibration sensor.

State of the art

A vibration sensor is an energy conversion device that converts a vibration signal into an electrical signal. When a vibration sensor is used as a bone conduction microphone, it can detect the vibration signal transmitted through bones, skin or muscles when a person speaks to detect the speech signal without interference from external noise. Being limited by the processing technology, the size or shape of the elastic element in the existing vibration sensor is difficult to control, resulting in a large volume occupied by the elastic element in the acoustic cavity, and makes the volume of the mass element relatively small, resulting in low sensitivity of the vibration sensor.

Therefore, it is desirable to provide a vibration sensor capable of limiting the size of the elastic member to improve the sensitivity of the vibration sensor.

Disclosure of the invention

Some embodiments of the present disclosure may provide a vibration sensor. The vibration sensor may comprise a vibration receiver and an acoustic transducer. The vibration receiver may comprise a housing, a limiter and a vibration unit. The housing and the acoustic transducer can form an acoustic cavity. The vibration unit may be located in the acoustic cavity to divide the acoustic cavity into a first acoustic cavity and a second acoustic cavity. The acoustic transducer may be acoustically coupled to the first acoustic cavity. The housing may be configured to generate vibration based on an external vibration signal. The vibration unit may vary the sound pressure in the first acoustic cavity in response to vibration of the housing such that the acoustic transducer generates an electrical signal. The vibration unit may contain a mass element and an elastic element. The first side of the elastic element may be attached around the side wall of the mass element. The second side of the elastic element may be connected to the limiter.

In some embodiments, the limiter may be located between the housing and the acoustic transducer. The housing, limiter and acoustic transducer can form an acoustic cavity.

In some embodiments, the acoustic transducer may include a substrate. The stopper may be connected to the substrate. The limiter, vibration block, and substrate may form a first acoustic cavity.

In some embodiments, an elastic element may be attached between the limiter and the mass element. The elastic element and the substrate can be spaced some distance apart in the direction of vibration of the vibration unit.

In some embodiments, the thickness of the stopper along the vibration direction of the vibration unit may be greater than the thickness of the mass element along the vibration direction of the vibration unit. The side of the limiter facing away from the acoustic transducer may be flush with the side of the mass element facing away from the acoustic transducer.

In some embodiments, the width of the stopper along a direction perpendicular to the vibration direction of the vibration unit may be in the range of 100 μm to 500 μm.

In some embodiments, the limiter may comprise a first limiter and a second limiter. The first limiter and the second limiter may be arranged sequentially along the vibration direction of the vibration unit. The first limiter may be connected to the housing. The second limiter may be connected to an acoustic transducer.

In some embodiments, the second side of the elastic element may be connected to the first stop.

In some embodiments, the thickness of the first stop along the vibration direction of the vibration unit may be equal to the thickness of the mass element along the vibration direction of the vibration unit.

In some embodiments, the width of the first stop along a direction perpendicular to the vibration direction of the vibration unit may be less than the width of the second stop along a direction perpendicular to the vibration direction of the vibration unit.

In some embodiments, the ratio of the width of the first stop along a direction perpendicular to the vibration direction of the vibration unit to the width of the second stop along a direction perpendicular to the vibration direction of the vibration unit may be greater than 0.5.

In some embodiments, the material of the first stopper may be different from the material of the second stopper.

In some embodiments, the first stopper may be made from at least one of an alloy, a metal, or a rigid plastic. The second stopper can be made from solder paste or glue.

In some embodiments, the thickness of the second stop along the vibration direction of the vibration unit may be in the range of 50 μm - 500 μm.

In some embodiments, the vibration unit may include a second resilient element. The second elastic element may be located in the first acoustic cavity. The second elastic element can be connected, respectively, to the second limiter and to the acoustic transducer.

In some embodiments, the area of the side of the second elastic element closest to the acoustic transducer may be greater than the area of the side of the second elastic element farthest from the acoustic transducer.

In some embodiments, the elastic element may extend to the substrate and connect to the substrate. The elastic element, the mass element and the substrate may form the first acoustic cavity.

In some embodiments, the thickness of the stopper along the vibration direction of the vibration unit may be equal to the thickness of the mass element along the vibration direction of the vibration unit. The area of the first side of the elastic element may be greater than the area of the second side of the elastic element.

In some embodiments, the thickness of the stopper along the vibration direction of the vibration unit may be equal to the thickness of the mass element along the vibration direction of the vibration unit. The side of the mass element facing away from the substrate may be further away from the substrate than the side of the stop facing away from the substrate.

In some embodiments, the mass element may comprise a portion of the first opening. The first opening portion may be connected to the first acoustic cavity and to the second acoustic cavity.

In some embodiments, the housing may include a second opening portion. The second acoustic cavity may be connected to the outside through a portion of the second opening.

In some embodiments, the stopper may be located between the resilient member and the housing.

In some embodiments, the elastic element may extend up to the acoustic transducer and may be connected to the acoustic transducer. The elastic element, the mass element and the acoustic transducer may form a first acoustic cavity.

In some embodiments, the thickness of the stopper along the vibration direction of the vibration unit may be in the range of 100 µm - 1000 µm.

Some embodiments of the present disclosure may also provide a vibration sensor. The vibration sensor may comprise a vibration receiver and an acoustic transducer. The vibration receiver may comprise a housing and a vibration unit. The housing and the acoustic transducer can form an acoustic cavity. The vibration unit may be located in the acoustic cavity so as to divide the acoustic cavity into a first acoustic cavity and a second acoustic cavity. The acoustic transducer may be acoustically coupled to the first acoustic cavity. The housing may be configured to generate vibration based on an external vibration signal. The vibration unit may vary the sound pressure in the first acoustic cavity in response to vibration of the housing such that the acoustic transducer generates an electrical signal. The vibration unit may contain a mass element and an elastic element. The resilient element may be attached around the side wall of the mass element and extend towards the housing.

In some embodiments, the thickness of the elastic element along the vibration direction of the vibration unit may be greater than the thickness of the mass element along the vibration direction of the vibration unit.

The present disclosure is further described in terms of exemplary embodiments. These exemplary embodiments are described in detail with reference to the drawings. These embodiments do not limit exemplary embodiments in which like reference numerals represent like structures, and in which:

Fig. 1 is an exemplary block diagram of a vibration sensor corresponding to some embodiments of the present disclosure;

Fig. 2 is an exemplary block diagram of a vibration sensor corresponding to some embodiments of the present disclosure;

Fig. 3 is an exemplary block diagram of a vibration sensor corresponding to some embodiments of the present disclosure;

Fig. 4 is an exemplary block diagram of a vibration sensor corresponding to some embodiments of the present disclosure;

Fig. 5 is an exemplary block diagram of a vibration sensor corresponding to some embodiments of the present disclosure;

Fig. 6 is an exemplary block diagram of a vibration sensor corresponding to some embodiments of the present disclosure;

Fig. 7 is an exemplary block diagram of a vibration sensor corresponding to some embodiments of the present disclosure;

Fig. 8 is an exemplary block diagram of a vibration sensor corresponding to some embodiments of the present disclosure;

Fig. 9 is an exemplary block diagram of a vibration sensor corresponding to some embodiments of the present disclosure.

Carrying out the invention

In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following briefly introduces the drawings to be used in describing the embodiments. Obviously, the drawings in the following descriptions are only some examples or embodiments of the disclosure. Without creative effort, the present disclosure can be applied to other similar scenarios consistent with these drawings by those skilled in the art. Unless clearly indicated by written description or otherwise, like reference numerals in the drawings represent like structures or operations.

It should be understood that the terms "system", "device", "unit" and/or "module" as used herein are one way of distinguishing various components, elements, parts, sections or assemblies at different levels. However, terms may be replaced by other expressions if they achieve the same purpose.

The terms "first", "second" and similar words used in the present disclosure and claims are used only to distinguish the various components and do not indicate order, quantity or importance. Likewise, singular terms do not denote a limitation of quantity, but indicate that at least one item exists. Unless otherwise indicated, terms such as "front", "rear", "bottom" and/or "top" are used for convenience of description only and are not intended to be limited to any location or spatial orientation. Generally speaking, the terms “comprises” and “includes” identify only the presence of the stated operations and elements, but these operations and elements do not constitute an exclusive list and the method or apparatus may also contain other operations or elements.

Embodiments of the present disclosure describe a vibration sensor. In some embodiments, the vibration sensor may comprise a vibration receiver and an acoustic transducer. In some embodiments, the vibration receiver may include a housing, a limiter, and a vibration unit. The housing may be connected to a limiter to form an acoustic cavity. The vibration unit may be located in the acoustic cavity to divide the acoustic cavity into a first acoustic cavity and a second acoustic cavity. The acoustic transducer may be acoustically coupled to the first acoustic cavity. In some embodiments, the housing may generate vibration based on an external vibration signal (e.g., a signal generated by vibration of bone, skin, etc. when the user speaks) and the vibration unit may change the sound pressure in the first acoustic cavity in response to vibration of the housing , so that the acoustic transducer creates an electrical signal.

In some embodiments, the vibration unit may comprise a mass element and an elastic element. A first side of the resilient member may be coupled around a side wall of the mass element, and a second side of the resilient member may be coupled to the stop so that the resilient member can be coupled between the mass element and the stop. The first side of the elastic element may be a side of the elastic element extending towards the mass element. The second side of the resilient member may be a side opposite the first side of the resilient member, and the second side of the resilient member may extend toward the stopper. In some embodiments, the limiter may be located between the housing and the acoustic transducer. In some embodiments, the stopper may be located between the resilient member and the housing. In some embodiments of the present disclosure, by positioning a limiter in the vibration receiver of a vibration sensor, the limiter may be configured to restrain the resilient member to control the flow of the resilient member during manufacture of the vibration receiver, thereby facilitating control of the size and/or shape of the resilient member, to adjust (eg, increase) the size or volume of the mass element and increase the sensitivity of the vibration sensor.

In some embodiments, the vibration receiver may include a housing and a vibration unit. The vibration unit may contain a mass element and an elastic element. The resilient element may be attached around a side wall of the mass element and may extend toward the housing.

In fig. 1 is an exemplary block diagram of a vibration sensor in accordance with some embodiments of the present disclosure.

As shown in FIG. 1, vibration sensor 100 may include vibration receiver 110 and acoustic transducer 120. In some embodiments, vibration receiver 110 and acoustic transducer 120 may be connected through a physical connection. The physical connection in the present disclosure may comprise a welded connection, a clamped connection, an adhesive connection, integral compression, etc., or any combination thereof.

In some embodiments, vibration sensor 100 may be configured as a bone conduction microphone. When the vibration sensor is configured as a bone conduction microphone, the vibration sensor 100 can receive a vibration signal of tissues such as bone and skin generated when the user speaks, and convert the vibration signal into an electrical signal containing audio information. Since little sound (or vibration) is collected through air, vibration sensor 100 may be somewhat immune to the influence of environmental noise (e.g., noise generated by other people, noise generated by vehicles in the environment), and vibration sensor 100 may be suitable for use in noisy environments to receive an audio signal when the user speaks. In some embodiments, vibration sensor 100 may be applicable to an earphone (for example, an air conduction earphone and a bone conduction earphone), a hearing aid, an assistive hearing aid, eyeglasses, a helmet, an augmented reality (AR) device, a virtual reality device ( VR), etc. or any combination thereof. For example, vibration sensor 100 may be applied to an earphone as a bone conduction microphone.

The vibration receiver 110 may be configured to receive and transmit a vibration signal. In some embodiments, vibration receiver 110 may include a housing and a vibration unit. In some embodiments, vibration receiver 110 may further include a limiter. In some embodiments, a limiter may be located between the housing and the acoustic transducer 120. The vibration receiver 110 may be coupled to the acoustic transducer 120 through the limiter. In some embodiments, the housing may have a hollow structure. The housing, limiter, and acoustic transducer 120 may be connected to each other to form an acoustic cavity. Some components (eg, a vibration unit) of the vibration sensor 100 may be located in the acoustic cavity. In some embodiments, the vibration unit may be located in the acoustic cavity. A vibration unit (eg, an elastic element and a mass element) may be coupled to a limiter to divide the acoustic cavity into a first acoustic cavity and a second acoustic cavity. The first acoustic cavity may be acoustically coupled to the acoustic transducer 120. The acoustic coupling may be a link through which sound pressure, a sound wave, or a vibration signal can be transmitted.

In some embodiments, the limiter may be located between the vibration unit (eg, a resilient member) and the housing. The elastic element may extend to the acoustic transducer and may be coupled to the acoustic transducer 120. The vibration unit (eg, the elastic element and the mass element) and the acoustic transducer 120 may form a first acoustic cavity.

Acoustic transducer 120 may generate an electrical signal containing audio information based on changes in sound pressure in the first acoustic cavity. In some embodiments, the vibration signal may be received by vibration receiver 110 and the internal air pressure in the first acoustic cavity may be changed. Acoustic transducer 120 may generate an electrical signal based on changes in internal air pressure in the first acoustic cavity. In some embodiments, when vibration sensor 100 operates, the housing may vibrate based on an external vibration signal (eg, a signal generated by vibration of bone, skin, etc. when the user speaks). The vibration unit may vibrate in response to vibration of the housing through the limiter and transmit the vibration to the acoustic transducer 120 through the first acoustic cavity. In some embodiments, the acoustic transducer 120 may generate vibration based on an external vibration signal and transmit the vibration signal to the vibration unit. In some embodiments, the acoustic transducer 120 may generate vibration based on an external vibration signal. The vibration unit may vibrate in response to vibration of the acoustic transducer 120 through a limiter or housing coupled to the acoustic transducer 120. For example, vibration of the vibration unit may cause a change in the volume of the first acoustic cavity, thereby creating a change in air pressure in the first acoustic cavity. The change in air pressure in the first acoustic cavity can be converted into a change in sound pressure. Acoustic transducer 120 may detect a change in sound pressure in the first acoustic cavity and generate an electrical signal based on the change in sound pressure in the first acoustic cavity. For example, acoustic transducer 120 may include a diaphragm. The sound pressure in the first acoustic cavity may change and affect the diaphragm, which may cause the diaphragm to vibrate (or deform). Acoustic transducer 120 may convert vibration of the diaphragm into an electrical signal. Additional descriptions of vibration sensor 100 can be found in FIG. 2-9 and in their descriptions.

It should be noted that the above descriptions of vibration sensor 100 and its components are for purposes of illustration and description only, and do not limit the scope of the present disclosure. Various modifications and changes can be made to vibration sensor 100 by those skilled in the art based on the present disclosure. In some embodiments, vibration sensor 100 may further include other components. For example, the power supply may be configured to provide electrical power to the acoustic transducer 120, etc. These modifications and changes all remain within the scope of the present disclosure.

In fig. 2 is a block diagram of a vibration sensor in accordance with some embodiments of the present disclosure.

As shown in FIG. 2, vibration sensor 200 may include a vibration receiver 210 and an acoustic transducer 220. In some embodiments, vibration receiver 210 may include a housing 211, a limiter 212, and a vibration unit 213. A limiter 212 may be located between the housing 211 and the acoustic transducer 220. The vibration receiver 210 may be coupled to the acoustic transducer 220 through the limiter 212.

In some embodiments, the housing 211 may have a hollow structure. Housing 211 may be coupled to acoustic transducer 220 via limiter 212 to form an acoustic cavity. In some embodiments, the vibration unit 213 may be located in the acoustic cavity. The vibration block 213 may be coupled to the limiter 212 to divide the acoustic cavity into a first acoustic cavity 214 and a second acoustic cavity 215. In some embodiments, the limiter 212 may be coupled to the substrate 221 of the acoustic transducer 220 such that the vibration unit 213, the limiter 212, and the substrate 221 may define a first acoustic cavity 214. The stopper 212 may be coupled to the housing 211 such that the vibration unit 213, the stopper 212, and the housing 211 can define a second acoustic cavity 215. In some embodiments, the shape of the housing 211 may have a regular or irregular three-dimensional design, for example, a cuboid, cylinder or circular truncated cone. In some embodiments, the material of housing 211 may comprise a metal (eg, copper, iron, aluminum), alloy (eg, stainless steel), plastic, or the like. or any combination thereof. In some embodiments, the housing 211 may be of a certain thickness to provide sufficient strength to protect the components (e.g., vibration assembly 213) of the vibration sensor 100 located in the housing 211.

The vibration sensor 200 can convert an external vibration signal into an electrical signal. Just by way of example, the external vibration signal may include a vibration signal when a person speaks, a vibration signal generated by the skin when the person's body moves or when other devices operate in the vicinity of the skin, and a vibration signal generated by an object or air contacting vibration sensor 200, etc. etc., or any combination thereof. When vibration sensor 200 operates, housing 211 may vibrate in response to an external vibration signal. Vibration of the housing 211 may be transmitted to the vibration unit 213 through a limiter 212. The vibration unit 213 may vibrate in response to vibration of the housing 211. The vibration of the vibration unit 213 may cause the volume of the first acoustic cavity 214 to change, thereby causing a change in air pressure in the first acoustic cavity 214. Change The air pressure in the cavity can be converted to a change in sound pressure in the cavity. The acoustic transducer 220 may be acoustically coupled to the first acoustic cavity 214 to detect a change in sound pressure in the first acoustic cavity 214 and convert the change in sound pressure into an electrical signal. For example, acoustic transducer 220 may include a sound sensor opening 2211. A change in sound pressure in the first acoustic cavity 214 may act on the diaphragm of the acoustic transducer 220 through the sound sensor opening 2211 so that the diaphragm can vibrate (or deform) creating an electrical signal. In some embodiments, the sound sensor hole 2211 may be located on the substrate 221 of the acoustic transducer 220. The sound sensor hole 2211 may extend through the substrate 221 along the vibration direction of the vibration unit 213. Additionally, the electrical signal generated by the acoustic transducer 220 may be transmitted to an external electronic device. Just by way of example, acoustic transducer 220 may include an interface (not shown in the drawings). The interface may be coupled to an internal element (eg, a processor) of an external electronic device through a wired connection (eg, an electrical connection) or a wireless connection. The electrical signal generated by the acoustic transducer 220 may be transmitted to an external electronic device through an interface through a wired connection or a wireless connection. In some embodiments, the external electronic device may comprise a mobile device, a wearable device, a virtual reality device, an augmented reality device, or the like. or any combination thereof. In some embodiments, the mobile device may include a smartphone, a tablet computer, a personal digital assistant (PDA), a gaming device, a navigation device, or the like. or any combination thereof. In some embodiments, the wearable device may comprise a smart bracelet, earpiece, hearing aid, smart helmet, smart watch, smart clothing, smart backpack, smart accessory, etc., or any combination thereof. In some embodiments, the virtual reality device and/or augmented reality device may comprise a virtual reality headset, virtual reality glasses, a virtual reality patch, an augmented reality headset, augmented reality glasses, an augmented reality patch, and the like. or any combination thereof. For example, a virtual reality device and/or an augmented reality device may include Google Glass, Oculus Rift, Hololen, Gear VR, etc.

In some embodiments, the acoustic transducer 220 may include a substrate 221. The substrate 221 may be configured to mount and/or support a vibration receiver 210. In some embodiments, substrate 221 may be located on acoustic transducer 220. Housing 211 may be coupled to substrate 221 via stopper 212 to form an acoustic cavity. In some embodiments, the substrate material 221 may comprise a metal (eg, iron, copper), alloy (eg, stainless steel), non-metal (plastic, rubber, resin), etc., or any combination thereof. In some embodiments, by organizing the substrate 221, the vibration receiver 210 can be processed, manufactured and sold as an independent component. The acoustic transducer 220 with the substrate 221 may be directly coupled to the vibration receiver 210 through a physical connection (e.g., an adhesive connection) to obtain a vibration sensor 200, which can simplify the manufacturing process of the vibration sensor 200 and increase the flexibility of the manufacturing process of the vibration sensor 200. In some embodiments, the thickness of the substrate 221 may be in the range of 10 μm - 300 μm. For example, the thickness of the substrate 221 may be in the range of 80 μm - 90 μm.

In some embodiments, the vibration unit 213 may include a mass element 2131 and a resilient member 2132. A first side of the resilient member 2132 may be attached around a side wall of the mass member 2131. A second side of the resilient member 2132 may be attached to the stop 212. A first side of the resilient member 2132 may be the side of the resilient member 2132 proximal to the mass member 2131. The second side of the resilient member 2132 may be the side opposite the first side of the resilient member 2132. That is, the second side of the resilient member 2132 may be the side of the resilient member 2132 closest to the stopper 212. For example, the resilient member 2132 may have a ring structure. The first side of the elastic element 2132 may be an inner annular side of the annular structure. The second side of the elastic member 2132 may be an outer annular side of the annular structure. The first side and the second side of the elastic member 2132 may be located along a direction perpendicular to the vibration direction of the vibration unit 213. In some embodiments, the elastic element 2132 may be attached to the mass element 2131 and/or to the stopper 212 through a physical connection, such as an adhesive connection. Just by way of example, resilient member 2132 may be made of a material (e.g., adhesive) with good viscosity such that resilient member 2132 can be directly bonded to mass member 2131 and/or stopper 212.

In some embodiments, the resilient member 2132 may be made from a high temperature resistant material such that the resilient member 2132 can maintain its characteristics during the manufacturing process of the vibration sensor 200. In some embodiments, when the elastic element 2132 is in an environment with a temperature of 200°C - 300°C, the Young's modulus and the shear modulus of the elastic element 2132 may not change or change little (for example, the change may be 5%). Young's modulus may be used to characterize the deformability of the elastic element 2132 when it is stretched or compressed. The shear modulus can be used to characterize the deformability of the elastic element 2132 when it is sheared. In some embodiments, the resilient member 2132 may be made of a material that is resilient (i.e., resiliently deformable) such that the vibration unit 213 may vibrate in response to vibration of the housing 211. Just by way of example, the material of the resilient member 2132 may comprise silicon rubber, silica gel, silicone glue, silicone sealant, etc. or any combination thereof. To provide a resilient member 2132 with good resiliency, in some embodiments, the Shore hardness of the resilient member 2132 may be less than 50 HA. For example, the Shore hardness of the elastic element 2132 can be in the range of 5 HA - 50 HA.

In some embodiments, the material density of the mass element 2131 may be greater than a certain density threshold (eg, 6 g/cm ³ ). For example, the material of the mass element 2131 may comprise a metal or alloy such as lead, copper, silver, tin, stainless steel, stainless iron, and the like. or any combination thereof. In the case of the same mass, the higher the material density of the mass element 2131, the smaller the size of the mass element 2131. Therefore, the mass element 2131 can be made of a material with a density greater than a certain density threshold, which can reduce the size of the vibration sensor 200 to some extent. In some embodiments, the material density of the mass element 2131 may have a large impact on the resonant peak and frequency response sensitivity of the vibration sensor 200. In the case of the same volume, the greater the density of the mass element 2131, the greater the mass of the mass element 2131 and the resonant peak of the vibration sensor 200 may move to a lower frequency. By increasing the mass of the mass element 2131, it is possible to increase the sensitivity of the vibration sensor 200 in a relatively low frequency band (eg, 20 Hz - 6000 Hz). In some embodiments, the material density of the mass element 2131 may be greater than 6 g/cm ³ . For example, the material density of the mass element 2131 may be in the range of 7-20 g/cm ³ . In some embodiments, the mass element 2131 and the elastic element 2132 may be made of different materials. The mass element 2131 and the elastic element 2132 may be assembled (eg, glued) together to form a vibration unit 213. In some embodiments, the mass element 2131 and the elastic element 2132 may be made of the same material. The vibration unit 213 may be manufactured by integral molding. In some embodiments, the thickness of the mass element 2131 along the vibration direction of the mass element 2131 may be in the range of 60 μm - 1150 μm. For example, the thickness of the mass element 2131 along the vibration direction of the mass element 2131 may be in the range of 140 μm - 200 μm.

In some embodiments, the elastic element 2132 and the substrate 221 of the acoustic transducer 220 may be spaced apart from each other by a certain distance in the vibration direction of the vibration unit 213. By positioning the elastic member 2132 so that it does not contact the substrate 221, the manufacturing process of the vibration sensor 200 can be simplified. In some embodiments, vibration sensor 200 may be prepared by a separate manufacturing method. For example, the vibration receiver 210 and the acoustic transducer 220 may be prepared separately. The vibration receiver 210 and the acoustic transducer 220 may then be physically connected (eg, welded, glued) to form a vibration sensor 200. In some embodiments, the distance between the elastic member 2132 and the substrate 221 in the vibration direction of the vibration unit 213 may be determined based on the requirements of the vibration sensor 200, such as, but not limited to, the height of the first acoustic cavity 214 along the vibration direction of the vibration unit 213.

In some embodiments, the mass element 2131 may further comprise a first opening portion 21311. The first opening portion 21311 may be coupled to the first acoustic cavity 214 and the second acoustic cavity 215. The first opening portion 21311 may extend through the mass element 2131. The first opening portion 21311 may allow the passage of gas in the first acoustic cavity 214 and in the second acoustic cavity 215 to balance the change in air pressure in the first acoustic cavity 214 and in the second acoustic cavity 215 caused by temperature changes during the manufacturing process (for example, during welding in the reverse flow) of the vibration sensor 200 and reduce or prevent damage to components of the vibration sensor 200 caused by changes in air pressure, such as cracking, deformation, etc.

In some embodiments, the first hole portion 21311 may have a single hole structure. In some embodiments, the diameter of a single hole may be in the range of 1 μm - 50 μm. For example, the diameter of a single hole can be in the range of 7 µm - 10 µm. In some embodiments, the first hole region 21311 may be an array containing a certain number of micropores. Just as an example, the number of micropores can be in the range of 2 - 10. In some embodiments, the diameter of each micropore can be in the range of 0.1 μm - 25 μm. For example, the diameter of each micropore may be 20 μm.

In some embodiments, the mass element 2131 may not have a first opening portion 21311. In some embodiments, when the mass element 2131 does not have a first opening portion 21311, components of the vibration sensor 200 may be protected from damage due to changes in air pressure in the first acoustic cavity 214, increasing the strength of the connection between the mass element 2131 and the elastic element 2132 (e.g. , by increasing the adhesive strength of the adhesive between the mass element 2131 and the elastic element 2132).

In some embodiments, at least one second opening portion 2111 may be located on the housing 211. The second opening portion 2111 may extend through the housing 211. The design of the second opening portion 2111 may be the same or similar to the design of the first opening portion 21311. The second opening portion 2111 may be the same as or similar to the design of the first opening portion 21311. may allow the second acoustic cavity 215 to communicate with the external environment to balance the change in air pressure in the second acoustic cavity 215 caused by a change in temperature during the manufacturing process of the vibration sensor 200, and reduce or prevent damage to components of the vibration sensor 200 caused by the change in air pressure, e.g. cracking, deformation, etc. In addition, when the mass element 2131 vibrates, the second opening portion 2111 may be configured to reduce the absorption generated by the gas inside the second acoustic cavity 215.

In some embodiments, air conduction sound in the environment may adversely affect the performance of vibration sensor 200. To reduce the influence of air conduction sound in the environment, after the vibration sensor 200 is prepared, for example, after reverse flow soldering, a sealing material may be used to seal the second hole portion 2111 on the body 211 to seal the second hole portion 2111. Just by way of example, the sealing material may include epoxy adhesive, silicone sealant, or the like. or any combination thereof. In some embodiments, the housing 211 cannot provide a second opening portion 2111.

In some embodiments, the first side of the elastic element 2132 may be attached around the peripheral side surface of the mass element 2131. For example, when the mass element 2131 has a columnar structure (cylinder or prism), the peripheral side surface of the mass element 2131 may be a side surface of the columnar structure. In some embodiments, the second side of the elastic element 2132 may be attached around the inner wall of the limiter 212 such that the projections of the mass element 2131, the elastic element 2132 and the limiter 212 along the direction of vibration of the vibration block 213 are sequentially from the inside to the outside. In some embodiments, the projection of the mass element 2131 along the vibration direction of the vibration block 213 may be in the shape of a regular and/or irregular polygon, such as a circle, rectangle, pentagon, hexagon, etc. Projections of the elastic element 2132 and limiter 212 along the vibration direction of the block 213 vibrations may have a regular and/or irregular annular polygonal shape, such as a ring, a rectangular ring, a pentagonal ring, a hexagonal ring, etc., corresponding to a regular and/or irregular polygonal shape, such as a circle, rectangle, pentagon, hexagon, etc. .P. In some embodiments, the elastic element 2132 may be in close contact with the surrounding surfaces of the mass element 2131 and/or the limiter 212, which may seal the first acoustic cavity 214 so that the change in air pressure in the first acoustic cavity 214 can be related only to the amplitude of vibration vibration unit 213, thereby making the change in sound pressure in the first acoustic cavity 214 obvious and effective.

In some embodiments, the structure of the elastic element 2132 may be a single-layer structure, a two-layer structure, a multi-layer structure, or the like. The size and material of each layer of the two-layer structure or multi-layer structure of the elastic element 2132 may be the same or different. The design of the elastic member 2132 can be reasonably determined based on the manufacturing process of the vibration sensor 200, which is not limited in the present disclosure.

In some embodiments, due to the influence of the type of material of the elastic element 2132, such as an adhesive material, during the manufacturing process of vibration sensor 200, the elastic element 2132 may be in a semi-fluid state or the elastic element 2132 may be easily deformed during a high temperature process, making it difficult to control the size and shape elastic element 2132. Therefore, if no stop is provided, the size of the mass element 2131 may need to be reduced to ensure that the elastic element 2132 does not flow beyond the body 211, thereby avoiding affecting the connection between the body 211 and the substrate 211 in the subsequent process. By positioning the limiter 212 on the vibration sensor 200, the size of the elastic element 2132 can be controlled. For example, during the manufacturing of the vibration sensor 200, the limiter 212 and the mass element 2131 can be secured and then the elastic element 2132 can fill the gap between the limiter 212 and the mass element 2131. Therefore, the size of the elastic member 2132 can be controlled, expansion of the elastic member 2132 along a direction perpendicular to the vibration direction of the vibration unit 213 can be avoided, a tolerance margin for increasing the size of the mass member 2131 can be provided, and the performance of the vibration sensor 200 can be improved. For example, the sensitivity of vibration sensor 200 may be improved.

In some embodiments, limiter 212 may be located between housing 211 and acoustic transducer 220. Housing 211 may be coupled to acoustic transducer 220 via limiter 212. When the overall size of vibration sensor 200 and the size of limiter 212 are fixed, compared to the location of limiter 212 within the housing 211, positioning the limiter 212 between the housing 211 and the acoustic transducer 220 may reduce the volume of the acoustic cavity occupied by the limiter 212, thereby increasing the volume for the mass element 2131 (e.g., increasing the width 2131 of the mass element along a direction perpendicular to the vibration direction of the vibration unit 213) . The sensitivity of vibration sensor 200 can be increased.

In some embodiments, the stopper 212 may be made of a rigid material to ensure that the stopper 212 has sufficient strength. In some embodiments, the rigid material may be, but is not limited to, a metal (eg, copper, iron, aluminum), an alloy (eg, stainless steel), a rigid plastic, or the like. For example, copper may be used in making the stopper 212 to facilitate welding between the stopper 212 and the substrate 221. As another example, stainless steel can be used to make the stopper 212 to ensure that the stopper 212 has relatively high strength. Therefore, the reliability of the structure of the limiter 212 can be ensured. In some embodiments, limiter 212 may be made of a non-magnetic conductive metal.

In some embodiments, when other parameters (e.g., material) of the stopper 212 are constant, the width of the stopper 212 along a direction perpendicular to the vibration direction of the vibration unit 213 may influence the strength of the stopper 212. For example, when other parameters (e.g., material) of the stopper 212 are constant The smaller the width of the stopper 212 along the direction perpendicular to the vibration direction of the vibration unit 213 (width “d” of the stopper 212 as shown in FIG. 2), the lower the strength of the stopper 212. Therefore, it may be necessary that the width “d” of the stopper 212 along the direction , perpendicular to the vibration direction of the vibration block 213 was larger than the first width threshold (eg, 100 μm) to ensure that the limiter 212 has sufficient strength. In some embodiments, the width “d” of the limiter 212 along a direction perpendicular to the vibration direction of the vibration unit 213 may be greater than 100 μm.

In some embodiments, when the overall size of the vibration sensor 200 is constant, the width “d” of the limiter 212 along a direction perpendicular to the vibration direction of the vibration unit 213 may influence the width of the mass element 2131 along a direction perpendicular to the vibration direction of the vibration unit 213. For example, when the overall size of the vibration sensor 200 is constant, the larger the width “d” of the limiter 212 along the direction perpendicular to the vibration direction of the vibration unit 213, the smaller the width of the mass element 2131 along the direction perpendicular to the vibration direction of the vibration unit 213, and the lower the sensitivity of the vibration sensor 200 . Therefore, the width “d” of the limiter 212 along the direction perpendicular to the vibration direction of the vibration unit 213 may need to be less than the second width threshold (for example, 500 μm) to ensure that the mass element 2131 is of an appropriate size, thereby ensuring that that the vibration sensor 200 has high sensitivity. In some embodiments, the width “d” of the limiter 212 along a direction perpendicular to the vibration direction of the vibration unit 213 may be less than 500 μm. For example, the width “d” of the limiter 212 along the direction perpendicular to the vibration direction of the vibration unit 213 may be less than 300 μm. As another example, the width “d” of the limiter 212 along a direction perpendicular to the vibration direction of the vibration unit 213 may be less than 200 μm.

In some embodiments, the first width threshold and/or the second width threshold may be determined based on the material strength of the limiter 212, the overall size requirement of the vibration sensor 200, and/or the performance requirement of the vibration sensor 200. In some embodiments, the width “d” of the limiter 212 along a direction perpendicular to the vibration direction of the vibration unit 213 may be in the range of 100 μm to 500 μm. For example, the width “d” of the limiter 212 along the direction perpendicular to the vibration direction of the vibration unit 213 may be in the range of 100 μm to 200 μm.

In some embodiments, during the manufacturing process of the vibration sensor 200, the height of the first acoustic cavity 214 along the vibration direction of the vibration unit 213 can be controlled by setting the thickness of the limiter 212 and the thickness of the mass element 2131 along the vibration direction of the vibration unit 213. In some embodiments, the thickness of the limiter 212 along the vibration direction of the vibration unit 213 may be greater than the thickness of the mass element 2131 along the vibration direction of the vibration unit 213. The side of the mass element 2131 facing away from the substrate 221 may be flush with the side of the stopper 212 facing away from the substrate 221. The difference between the thickness of the stopper 212 along the vibration direction of the vibration block 213 and the thickness of the mass element 2131 along the vibration direction of the vibration block 213 can be equal to the height of the first acoustic cavity 214 along the vibration direction of the vibration unit 213. Therefore, when manufacturing the vibration sensor 200, the height of the first acoustic cavity 214 along the vibration direction of the vibration unit 213 can be limited by setting the thickness of the limiter 212 along the vibration direction of the vibration unit 213 and the thickness of the mass element 2131 along the vibration direction of the vibration unit 213, so that the height of the first acoustic cavity is controlled 214 along the vibration direction of the vibration block 213 could be accurate.

It should be noted that the above descriptions of the vibration sensor 200 and its components are for illustration and description only and do not limit the scope of the present disclosure. Those skilled in the art can make various modifications and changes to vibration sensor 200 based on the present disclosure. For example, the first hole portion 21311 extends through the resilient member 2132. These modifications and changes all remain within the scope of the present disclosure.

In fig. 3 is an exemplary block diagram of a vibration sensor in accordance with some embodiments of the present disclosure.

The structure of the vibration sensor 300 shown in FIG. 3 may be similar in design to vibration sensor 200 shown in FIG. 2, and the difference lies in the difference in the design of the limiter. As shown in FIG. 3, the limiter 312 of the vibration sensor 300 may include a first limiter 3121 and a second limiter 3122. The first limiter 3121 and the second limiter 3122 may be sequentially located along the vibration direction of the vibration unit 213. A first stopper 3121 may be coupled to the housing 211. A second stopper 3122 may be coupled to an acoustic transducer 220 (eg, a substrate 221). That is, the housing 211, the first stopper 3121, the second stopper 3122, and the acoustic transducer 220 (eg, the substrate 221) may be connected in series along the vibration direction of the vibration unit 213. In some embodiments, the first side of the elastic element 2132 may be attached to the peripheral side of the mass element 2131. A second side of the elastic member 2132 may be coupled to the first stop 3121. That is, the resilient member 2132 may be coupled between the mass member 2131 and the first stop 3121. The resilient member 2132 and the substrate 221 may be spaced apart in the vibration direction of the block. 213 vibrations.

In some embodiments, the thickness of the first stop 3121 along the vibration direction of the vibration unit 213 may be equal to the thickness of the mass element 2131 along the vibration direction of the vibration unit 213. In some embodiments, the first stop 3121 and the mass element 2131 may be made of the same material. In this case, the first limiter 3121 and the mass element 2131 can be processed simultaneously, thereby reducing the process flow and making the manufacturing process of the vibration sensor 300 faster and simpler.

In some embodiments, the thickness of the second stopper 3122 along the vibration direction of the vibration unit 213 may be equal to the height of the first acoustic cavity 214 along the vibration direction of the vibration unit 213. With this construction, when manufacturing the vibration receiver 210, the thickness of the second limiter 3122 along the vibration direction of the vibration unit 213 can be set in accordance with the height requirement of the first acoustic cavity 214 along the vibration direction of the vibration unit 213, so that the height of the first acoustic cavity 214 along the vibration direction is controlled vibration block 213 could be more accurate. In some embodiments, the thickness of the second stopper 3122 along the vibration direction of the vibration unit 213 may be in the range of 50 μm - 500 μm. For example, the thickness of the second stopper 3122 along the vibration direction of the vibration unit 213 may be in the range of 150 μm to 400 μm. As another example, the thickness of the second stopper 3122 along the vibration direction of the vibration unit 213 may be in the range of 250 μm to 300 μm.

In some embodiments, the width of the first stopper 3121 along a direction perpendicular to the vibration direction of the vibration unit 213 and the width of the second stopper 3122 along a direction perpendicular to the vibration direction of the vibration unit 213 may be the same or different. In some embodiments, the width of the first stopper 3121 along a direction perpendicular to the vibration direction of the vibration unit 213 may be less than the width of the second stopper 3122 along a direction perpendicular to the vibration direction of the vibration unit 213, so that the elastic element 2132 can be located between the stopper 3121 and the element 2131 mass. For example, by setting the width of the first stopper 3121 along a direction perpendicular to the vibration direction of the vibration unit 213 to be smaller than the width of the second stopper 3122 along a direction perpendicular to the vibration direction of the vibration unit 213, the elastic member 2132 can be more conveniently attached between the first limiter 3121 and mass element 2131. In some embodiments, the ratio of the width of the first stopper 3121 along a direction perpendicular to the vibration direction of the vibration unit 213 to the width of the second stopper 3122 along a direction perpendicular to the vibration direction of the vibration unit 213 may be greater than 0.5. When the overall size of the vibration sensor 300 is constant, the smaller the width of the first limiter 3121 along the direction perpendicular to the vibration direction of the vibration unit 213, the larger the width of the mass element 2131 along the direction perpendicular to the vibration direction of the vibration unit 213, and the sensitivity of the vibration sensor 300 can be increased . On the other hand, by setting a larger width of the first stopper 3121 along a direction perpendicular to the vibration direction of the vibration unit 213, the overall strength of the stopper 312 can be increased to some extent.

In some embodiments, the width of the first stopper 3121 and/or the second stopper 3122 along a direction perpendicular to the vibration direction of the vibration unit 213 may be in the range of 100 μm to 500 μm. For example, the width of the first limiter 3121 along a direction perpendicular to the vibration direction of the vibration unit 213 may be in the range of 100 μm to 250 μm. The width of the second limiter 3122 along a direction perpendicular to the vibration direction of the vibration unit 213 may be in the range of 200 μm to 500 μm.

In some embodiments, the width of the first stopper 3121 along a direction perpendicular to the vibration direction of the vibration unit 213 may be smaller than the width of the second stopper 3122 along a direction perpendicular to the vibration direction of the vibration unit 213.

In some embodiments, the material of the first stopper 3121 and the material of the second stopper 3122 may be the same. In some embodiments, the material of the first stopper 3121 and the material of the second stopper 3122 may be a rigid material. For example, the material of the first stopper 3121 and the material of the second stopper 3122 may be a metal (eg, copper), an alloy (eg, stainless steel), a rigid plastic, or the like. The first stopper 3121 and the second stopper 3122 may be made of the same material to simplify the manufacturing process of the vibration sensor 300.

In some embodiments, the material of the first stopper 3121 and the material of the second stopper 3122 may be different. For example, the first stop 3121 may be made of a rigid material (eg, metal, alloy, rigid plastic). The second stopper 3122 can be made from solder paste or adhesive. In the process of manufacturing the vibration sensor 300, first the housing 211 may be attached to the first stop 3121. Then, the housing 211 and the first stop 3121 can be directly attached (for example, glued) to the substrate 221 through the second stop 3122, so that the manufacturing process of the vibration sensor 300 can be more convenient. In addition, by attaching the first stopper 3121 to the substrate 221 directly through the second stopper 3122, the bonding strength between the vibration receiver 210 and the substrate 221 can be improved and the structural reliability of the vibration sensor 300 can be improved.

It should be noted that the above descriptions of vibration sensor 300 and its components are for illustration purposes only and do not limit the scope of the present disclosure. Those skilled in the art may make various modifications and changes to the vibration sensor 300 based on the present disclosure, and these modifications and changes will also be within the scope of the present disclosure. For example, limiter 312 of vibration sensor 300 may include multiple limiters (eg, four limiters, five limiters). The material of each stopper, the width of each stopper along a direction perpendicular to the vibration direction of the vibration unit 213, and the thickness of each stopper along the vibration direction of the vibration unit 213 may be the same or different.

In fig. 4 is an exemplary block diagram of a vibration sensor in accordance with some embodiments of the present disclosure.

The structure of the vibration sensor 400 shown in FIG. 4 may be similar to the design of vibration sensor 300 shown in FIG. 3, with the difference that the design of the vibration unit is different. As shown in FIG. 4, the vibration assembly 213 of the vibration sensor 400 may further include a second elastic element 4133. The second elastic element 4133 may be located in the first acoustic cavity 214. The second elastic element 4133 may be coupled to the second limiter 3122 and the substrate 221 of the acoustic transducer 220, respectively. By positioning the second elastic element 4133 in the first acoustic cavity 214, the volume of the first acoustic cavity 214 can be reduced, thereby improving the performance (eg, sensitivity) of the vibration sensor 400. For example, by reducing the volume of the first acoustic cavity 214, the rate of change in the volume of the first acoustic cavity 214 caused by the same displacement of the vibration unit 213 can be higher, and the change in air pressure in the first acoustic cavity 214 can be greater, thereby increasing the sensitivity of the vibration sensor 400 .

In some embodiments, the second resilient member 4133 may be in contact with the resilient member 2132. In some embodiments, the second resilient member 4133 may not be in contact with the resilient member 2132, that is, the second resilient member 4133 may be separated from the resilient member 2132 by a certain distance. In some embodiments, the material of the second elastic element 4133 and the material of the elastic element 2132 may be the same or different. In some embodiments, the material of the elastic element 2132 and/or the material of the second elastic element 4133 may comprise an elastic colloid, such as silicon rubber, silica gel, silicone sealant, silicone adhesive, or the like.

In some embodiments, the second elastic element 4133 may not contact the mass element 2131, thereby avoiding functional damage to the vibration sensor 400 caused by the influence of the second elastic element 4133 on the mass element 2131 during the vibration process of the mass element 2131. For example, there may be a certain distance between the second elastic member 4133 and the mass member 2131 along the vibration direction of the vibration unit 213. The distance may be greater than the maximum amplitude of vibrations occurring when the mass element 2131 vibrates along the vibration direction of the mass element 2131.

In some embodiments, the area of the second elastic element 4133 proximal to the acoustic transducer 220 may be equal to the area of the second elastic element 4133 furthest from the acoustic transducer 220. The area of the second elastic element 4133 proximal to the acoustic transducer 220 may be related to the cross-sectional area of the second an elastic member 4133 perpendicular to the vibration direction of the vibration unit 213. For example, the projection shape of the second elastic member 4133 onto a plane parallel to the vibration direction of the vibration unit 213 may be a rectangle. In some embodiments, when the second resilient member 4133 contacts the resilient member 2132, the width of the second resilient member 4133 along a direction perpendicular to the vibration direction of the vibration unit 213 may be less than the width of the elastic member 2132 along a direction perpendicular to the vibration direction of the vibration unit 213. thereby avoiding contact between the second elastic element 4133 and the mass element 2131.

In some embodiments, the area of the second elastic element 4133 proximal to the acoustic transducer 220 may be greater than the area of the second elastic element 4133 furthest from the acoustic transducer 220. For example, the shape of the projection of the second elastic element 4133 onto a plane parallel to the vibration direction of the vibration unit 213 , can be a trapezoid or a triangle. The side of the second elastic member 4133 farthest from the second stopper 3122 in a direction perpendicular to the vibration direction of the vibration unit 213 may be set as an inclined plane or an arcuate plane. By taking the area of the second elastic element 4133 proximal to the acoustic transducer 220 to be larger than the area of the second elastic element 4133 furthest from the acoustic transducer 220, the volume of the first acoustic cavity 214 can also be reduced while preventing contact between the second elastic element 4133 and the mass element 2131, thereby further improving the sensitivity of vibration sensor 400.

It should be noted that the above descriptions of vibration sensor 400 and its components are for illustration and description purposes only and do not limit the scope of the present disclosure. Those skilled in the art may make various modifications and changes to the vibration sensor 300 based on the present disclosure, and these modifications and changes will also be within the scope of the present disclosure. For example, limiter 312 of vibration sensor 300 may be a single-layer limiter (eg, limiter 212 shown in FIG. 2).

In fig. 5 is an exemplary block diagram of a vibration sensor in accordance with some embodiments of the present disclosure.

The structure of the vibration sensor 500 shown in FIG. 5 may be similar in design to vibration sensor 200 shown in FIG. 2, with the difference that the design of the elastic element is different.

In some embodiments, as shown in FIG. 5, resilient member 5132 of vibration sensor 500 may extend to acoustic transducer 220 and may be coupled to acoustic transducer 220. For example, resilient member 5132 may extend to substrate 221 and may be coupled to substrate 221. Resilient member 5132, substrate 221, and block 213 vibrations may form a first acoustic cavity 214. By coupling the elastic element 5132 to the substrate 221 of the acoustic transducer 220, the volume of the first acoustic cavity 214 can be further reduced, thereby improving the sensitivity of the vibration sensor 500.

In some embodiments, a change in the temperature of the vibration receiver 210 210 during the manufacturing process may cause the resilient member 5132 to flow, causing the resilient member 5132 to penetrate the surface (also referred to as the “bottom surface”) of the mass member 2131 proximal to the substrate 221, thereby affecting on the vibration of the mass element 2131 and affecting the sensitivity of the vibration sensor 500. In some embodiments, the amount of penetration of the resilient member 5132 onto the bottom surface of the mass member 2131 may be controlled by controlling the total volume of materials used in the resilient member 5132 (eg, the amount of adhesive). The penetration amount may refer to the overlap area of the projection area of the elastic member 5132 along the vibration direction of the vibration unit 213 and the projection area of the mass element 2131 along the vibration direction of the vibration unit 213. In some embodiments, the penetration volume of the elastic element 5132 may not exceed 25% of the projection area of the mass element 2131 along the vibration direction of the vibration unit 213. For example, the penetration volume of the elastic element 5132 may not exceed 10% of the projection area of the mass element 2131 along the vibration direction of the vibration unit 213.

It should be noted that the above descriptions of the vibration sensor 500 and its components are for illustration and description only and do not limit the scope of the present disclosure. Those skilled in the art may make various modifications and changes to the vibration sensor 500 based on the present disclosure, and these modifications and changes will also be within the scope of the present disclosure. In some embodiments, the limiter 512 of the vibration sensor 500 may have a two-layer design or a multi-layer design (see limiter 312 shown in FIG. 3). For example, limiter 212 of vibration sensor 500 may include a first limiter (not shown in FIG. 5) and a second limiter (not shown in FIG. 5). When the width of the first stopper and the width of the second stopper along a direction perpendicular to the vibration direction of the vibration unit 213 are different, the side of the elastic member 5132 closest to the stopper 212 can be implemented as a stepped structure so that the elastic member 5132 can be closely coupled with the first stopper and the second limiter, respectively.

In fig. 6 is an exemplary block diagram of a vibration sensor in accordance with some embodiments of the present disclosure.

The structure of the vibration sensor 600 shown in FIG. 6 may be similar in design to vibration sensor 500 shown in FIG. 5, and the difference may be that the designs of the elastic element and the stopper are different.

In some embodiments, as shown in FIG. 6, the thickness of the limiter 212 along the vibration direction of the vibration unit 213 may be equal to the thickness of the mass element 2131 along the vibration direction of the vibration unit 213. In this situation, the limiter 212 and the mass element 2131 can be processed simultaneously, thereby simplifying the manufacturing process of the limiter 212 and the mass element 2131. In some embodiments, when manufacturing the vibration sensor 600, first the limiter 212 and the mass element 2131 can be located in one and the same horizontal plane (ie, the side of the stop 212 farthest from the substrate 221 may be flush with the side of the mass element 2131 farthest from the substrate 221). Then, the elastic element 6132 can be attached between the limiter 212 and the mass element 2131. The air in the sonic pickup loading port 2211 may be thermally expanded by increasing the temperature to enlarge the mass element 2131 so that the side of the mass element 2131 facing away from the substrate 221 may be further away from the substrate 221 than the side of the stopper 212 facing away from the substrate 221 , and the first acoustic cavity 214 may be formed.

In some embodiments, because the resilient member 6132 has a certain deformability, the resilient member 6132 may be stretched and deformed during the manufacturing process of the vibration sensor 600 (e.g., during the enlargement process of the mass member 2131), such that the area of the first side of the resilient member 6132 (the side near to the mass element 2131) may be greater than the area of the second side of the elastic element 6132 (the side farthest from the mass element 2131).

It should be noted that the above descriptions of the vibration sensor 600 and its components are for illustration and description only and do not limit the scope of the present disclosure. Those skilled in the art may make various modifications and changes to the vibration sensor 500 based on the present disclosure, and these modifications and changes will also be within the scope of the present disclosure. In some embodiments, the limiter 512 of the vibration sensor 500 may have a two-layer design or a multi-layer design (see limiter 312 shown in FIG. 3).

In fig. 7 is an exemplary block diagram of a vibration sensor in accordance with some embodiments of the present disclosure.

The structure of the vibration sensor 700 shown in FIG. 7 may be similar in design to vibration sensor 500 shown in FIG. 5, and the difference may be that the design of the limiter is different.

In some embodiments, as shown in FIG. 7, restrictor 712 may be located between resilient member 2132 and housing 211. In some embodiments, restrictor 712 may be located around resilient member 2132. The side of resilient member 2132 closest to mass member 2131 may be physically attached to mass member 2131. The side of elastic member 2132 closest to stopper 712 may be physically attached to stopper 712. In some embodiments, stopper 712 may be physically attached to substrate 221. In some embodiments, stopper 712 may not be in contact with housing 211. For example, stopper 712 may be located at a certain distance from the housing 211. In some embodiments, the stopper 712 may contact the housing 211. In some embodiments, the elastic element 2132 may extend to the substrate 221 of the acoustic transducer 220 and may be physically coupled to the substrate 221 such that the substrate 221 is resilient element 2132 and element 2131 mass could form the first acoustic cavity 214.

In some embodiments, the thickness of the stopper 712 along the vibration direction of the vibration unit 213 may be in the range of 100 µm - 1000 µm. For example, the thickness of the limiter 712 along the vibration direction of the vibration unit 213 may be in the range of 200 μm to 500 μm. In some embodiments, the thickness of the limiter 712 along the vibration direction of the vibration unit 213 may be equal to the thickness of the mass element 2131 along the vibration direction of the vibration unit 213. In this situation, the limiter 712 and the mass element 2131 can be processed simultaneously, thereby simplifying the manufacturing processes of the limiter 712 and the mass element 2131.

It should be noted that the above descriptions of the vibration sensor 700 and its components are for illustration and description only and do not limit the scope of the present disclosure. Various modifications and changes can be made to vibration sensor 500 by those skilled in the art based on the present disclosure. For example, the thickness of the stopper 712 along the vibration direction of the vibration unit 213 may be greater than or equal to the thickness of the elastic member 2132 along the vibration direction of the vibration unit 213.

In fig. 8 is an exemplary block diagram of a vibration sensor in accordance with some embodiments of the present disclosure.

As shown in FIG. 8, vibration sensor 800 may not include a limiter. In some embodiments, as shown in FIG. 8, the elastic element 8132 may be located around the mass element 2131. The inner side of the elastic element 8132 may be physically attached to the mass element 2131. The outer side of the resilient member 8132 may be physically attached to the housing 211. In some embodiments, the resilient member 8132 and the substrate 221 may be spaced apart in the vibration direction of the vibration unit 213. The resilient member 8132, the mass member 2131, the housing 211, and the substrate 221 may define a first acoustic cavity 214. The resilient member 8132, the mass member 2131, and the housing 211 may define a second acoustic cavity 215.

In some embodiments, when forming the first acoustic cavity 214 and the second acoustic cavity 215, the distance (i.e., the height of the first acoustic cavity 214) between the mass element 2131 and the substrate 211 may be controlled by a clamping device (not shown in FIG. 8). For example, the mass element 2131 may be placed in the jig and the mass element 2131 may be raised using the height of the jig. The mass element 2131 can then be coupled to the housing 211 via the elastic element 8132, and the height of the first acoustic cavity 214 and the second acoustic cavity 215 can be controlled. By connecting the mass member 2131 to the body 211 through the elastic member 8132 and adjusting the distances between the mass member 2131 and the substrate 211 by using a jig, the height of the first acoustic cavity 214 and the height of the second acoustic cavity can be controlled more stably and accurately, which can simplify the manufacturing process of the sensor 800 vibrations. In addition, the design of the mass element 2131 (eg, whether the mass element 2131 has an opening) may not affect the above-mentioned manufacturing process.

In some embodiments, the thickness of the elastic element 8132 along the vibration direction of the vibration unit 213 may be less than, equal to, or greater than the thickness of the mass element 2131 along the vibration direction of the vibration unit 213.

In fig. 9 illustrates an exemplary vibration sensor structure corresponding to some embodiments of the present disclosure.

As shown in FIG. 9, in some embodiments, the thickness of the elastic element 8132 along the vibration direction of the vibration unit 213 may be greater than the thickness of the mass element 8132 along the vibration direction of the vibration unit 213. For example, two sides of the elastic element 8132 along the vibration direction of the vibration unit 213 may protrude relative to two sides of the mass element 2131 along the vibration direction of the vibration unit 213. That is, the side of the elastic member 8132 closest to the substrate 211 may be closer to the substrate 211 than the side of the mass member 2131 closest to the substrate 211, and the side of the elastic member 8132 farthest from the substrate 211 may be further away from the substrate 21. than the side of the mass element 2131 farthest from the substrate 211. Such an arrangement may increase the bonding area between the resilient member 8132 and the mass member 2131, thereby increasing the strength of the bond between the resilient member 8132 and the mass member 2131.

It should be noted that the above descriptions of the vibration sensor 800 and its components are for illustration and description only and do not limit the scope of the present disclosure. Various modifications and changes can be made to vibration sensor 800 by those skilled in the art based on the present disclosure. For example, the side of the elastic element 8132 closest to the substrate 211 may be closer to the substrate 211 than the side of the mass element 2131 closest to the substrate 211, and the side of the elastic element 8132 farthest from the substrate 211 may be flush with the side of the mass element 2131, farthest from the substrate 211. As another example, the side of the elastic element 8132 closest to the substrate 211 may be flush with the side of the mass element 2131 closest to the substrate 211, and the side of the elastic element 8132 farthest from the substrate 211 may be more distant from the substrate 21 than the side of the element 2131 of the mass 2131 farthest from the substrate 211.

Having thus discussed the basic concepts, it will be readily apparent to those skilled in the art that the foregoing detailed disclosure is intended to be exemplary only and not limiting. Various changes, improvements and modifications may occur and are intended for those skilled in the art although not stated herein. These changes, improvements, and modifications are intended to be suggested by this disclosure and are consistent with the spirit and scope of exemplary embodiments of this disclosure.

In addition, certain terminology has been used to describe embodiments of the present disclosure. For example, the terms “one embodiment,” “an embodiment,” and/or “certain embodiments” mean that the particular feature, structure, or characteristic described in connection with the embodiment is contained in at least one embodiment of the present disclosure. It is therefore emphasized and understood that two or more references to “an embodiment,” “one embodiment,” or “alternative embodiment” in different parts of this disclosure do not necessarily all refer to the same embodiment. Additionally, specific features, structures, or characteristics may be combined as appropriate in one or more embodiments of the present disclosure.

In addition, those skilled in the art will understand that the approaches of the present disclosure may be illustrated and described herein in any of many patentable classes or contexts containing any new and useful process, machine, manufacture or composition of matter or any new and useful thereof improvement. Accordingly, the various approaches of the present disclosure may be implemented entirely in hardware, entirely in software (including firmware, resident software, microcode, etc.), or a combined software and hardware implementation, all of which may generally be referred to herein as a “block.” ”, “module”, “mechanism”, “device”, “component” or “system”. In addition, the approaches of the present disclosure may take the form of a computer program product implemented on one or more computer-readable media containing computer-readable control program thereon.

The computer readable signal medium may comprise a propagating data signal having computer readable control program contained therein, for example, in a baseband or as part of a carrier wave. Such a propagating signal can take any number of forms, including electromagnetic, optical, etc. or any suitable combination thereof. A computer readable signal medium may be any computer readable medium that is not a computer readable storage medium and that can transmit, distribute, or transport a program for use or in connection with an instruction execution system, equipment, or device. The control program implemented on a computer readable signal medium may be transmitted via any suitable medium, including wireless communication, wireline, fiber optic cable, radio frequency, and the like. or any suitable combination of the above.

The control computer program for performing operations implementing the approaches of the present disclosure may be written in any combination of one or more programming languages, including an object-oriented programming language such as Java, Scala, Smalltalk, Eiffel, JADE, Emerald, C++, C#, VB .NET, Python, etc., standard procedural programming languages such as C, Visual Basic, Fortran 2003, Perl, COBOL 2002, PHP, ABAP, dynamic programming languages such as Python, Ruby and Groovy or other programming languages. The control program can be executed entirely on the user's computer, as a stand-alone software package, partially on the user's computer and partially on the remote computer, or entirely on the remote computer or server. In the latter scenario, the remote computer can be connected to the user's computer through any type of network, including a local area network (LAN) or wide area network (WAN), or the connection can be established with an external computer (for example, over the Internet using an Internet service provider) or in cloud computing environment or offered as a service such as Software as a Service (SaaS).

Additionally, the stated order of processing of elements or sequences or the use of numbers, letters or other designations are therefore not intended to limit the claimed processes and methods to any order other than what may be claimed in the claims. While the foregoing disclosure is discussed through various examples, which are now considered to be many useful embodiments of the disclosure, it should be understood that such details are for this purpose only and that the appended claims are not limited to the disclosed embodiments, but rather are intended to cover modifications and equivalent constructions that are within the spirit and scope of the disclosed embodiments. For example, although the implementation of the various components described above may be implemented in a device, it may also be implemented only as a software solution, such as installation on an existing server or mobile device.

Likewise, it should be understood that in the foregoing description of embodiments of the present disclosure, various features are sometimes grouped into a single embodiment, drawing, or description thereof in order to streamline the disclosure to assist in understanding one or more different embodiments. This manner of disclosure should not, however, be interpreted as reflecting an intention that the claimed invention have more features than are expressly set forth in each claim. Rather, the claimed essence of the invention lies in less than all the features of the single above-mentioned disclosed embodiment.

In some embodiments, numbers expressing quantities or properties used to describe and claim certain embodiments of the application should be understood to be modified in some cases by the term “about,” “approximately,” or “substantially.” For example, “about,” “approximately,” or “substantially” may indicate a ±20 percent change in value, which is described unless otherwise noted. Accordingly, in some embodiments, the numerical parameters given in the written description and appended claims are approximations that may vary depending on the desired properties to be obtained by a particular embodiment. In some embodiments, numerical parameters must be interpreted in terms of the number of significant digits reported and the application of conventional rounding techniques. Although the numerical ranges and parameters defining the broad scope of some embodiments of the application are approximations, the numerical values given in the specific examples are reported as accurately as possible.

Each of the patents, patent applications, publications of patent applications and other materials such as articles, books, descriptions, publications, documents, works and/or the like referenced herein are hereby incorporated herein by reference for all purposes and in their entirety. , except for any forensic material relating thereto or any of them that is inconsistent or inconsistent with these documents or any of them that may have a limiting effect on the broadest scope of the claims now or later associated herewith. For example, to the extent there is any inconsistency or conflict between the descriptions, definitions and/or use of terms associated with any contained material and those associated with this disclosure, the description, definition, and/or use of terms used in this disclosure shall control.

In conclusion, it should be understood that the embodiments of the application disclosed herein illustrate the principles of the embodiments of the application. Other modifications that may be used may be within the scope of the application. Thus, by way of example, and not by way of limitation, alternative configurations of embodiments of the application may be used in accordance with the principles set forth herein. Accordingly, embodiments of the present application are not limited to what is exactly shown and described.

Claims (45)

1. Vibration sensor containing: vibration receiver and acoustic transducer, while the vibration receiver contains a housing, a limiter and a vibration block, the housing and the acoustic transducer form an acoustic cavity, a vibration unit is located in the acoustic cavity to divide the acoustic cavity into a first acoustic cavity and a second acoustic cavity, the acoustic transducer is acoustically connected to the first acoustic cavity, the housing is configured to generate vibration based on an external vibration signal, the vibration unit is configured to change the sound pressure in the first acoustic cavity in response to vibration of the housing, so that the acoustic transducer generates an electrical signal, the vibration unit contains a mass element and an elastic element, a first side of the elastic element is connected around a side wall of the mass element, and a second side of the elastic element is connected to a stop, the first side and the second side of the elastic element being located along a direction perpendicular to the vibration direction of the vibration block. 2. Vibration sensor according to claim 1, in which: the limiter is located between the housing and the acoustic transducer, and the housing, limiter and acoustic transducer form an acoustic cavity. 3. Vibration sensor according to claim 2, in which: the acoustic transducer contains a substrate, the limiter is connected to the substrate, the limiter, the vibration block and the substrate form the first acoustic cavity, an elastic element is connected between the limiter and the mass element, and the elastic element and the substrate are located at a certain distance from each other in the direction of vibration of the vibration unit. 4. Vibration sensor according to claim 2 or 3, in which: the thickness of the limiter along the vibration direction of the vibration unit is greater than the thickness of the mass element along the vibration direction of the vibration unit, and the side of the limiter facing away from the acoustic transducer is flush with the side of the mass element facing away from the acoustic transducer. 5. Vibration sensor according to claim 2, in which: the limiter contains a first limiter and a second limiter, the first limiter and the second limiter are located sequentially along the vibration direction of the vibration unit, the first stop is connected to the housing, and the second limiter is connected to the acoustic transducer. 6. The vibration sensor according to claim 5, in which the material of the first limiter is different from the material of the second limiter. 7. Vibration sensor according to claim 5 or 6, in which: the vibration block contains a second elastic element, the second elastic element is located in the first acoustic cavity, and the second elastic element is connected, respectively, to the second limiter and the acoustic transducer. 8. Vibration sensor according to claim 3, in which: the elastic element extends to the substrate and is connected to the substrate, and the elastic element, the mass element and the substrate form the first acoustic cavity. 9. Vibration sensor according to claim 8, in which: the thickness of the limiter along the vibration direction of the vibration unit is equal to the thickness of the mass element along the vibration direction of the vibration unit, and the area of the first side of the elastic element is greater than the area of the second side of the elastic element. 10. Vibration sensor containing: vibration receiver and acoustic transducer, while The vibration receiver contains a housing and a vibration unit, the housing and the acoustic transducer form an acoustic cavity, a vibration unit is located in the acoustic cavity to divide the acoustic cavity into a first acoustic cavity and a second acoustic cavity, the acoustic transducer is acoustically connected to the first acoustic cavity, the housing is configured to generate vibration based on an external vibration signal, the vibration unit is configured to change the sound pressure in the first acoustic cavity in response to vibration of the housing, so that the acoustic transducer generates an electrical signal, the vibration unit contains a mass element and an elastic element, and an elastic member is attached around a side wall of the mass element and extends toward the housing, wherein the thickness of the elastic member along the vibration direction of the vibration unit is greater than the thickness of the mass element along the vibration direction of the vibration unit.