TW202303112A - Vibration sensor - Google Patents

Abstract

The embodiments of the present disclosure may disclose a vibration sensor, including: a transducer and a vibration element connected to the transducer. The vibration element may be configured to transmit enternal signals to the transducer to generate electrical signals. The vibration element may include one or more plate structures and one or more quality blocks connected to each of the plate structure; the vibration element may be configured to make the vibration sensor more sensitive than the transducer in the one or more target frequency bands.

Description

vibration sensor

This specification relates to the field of sensors, in particular to a vibration sensor including a vibration component. Cross References to Related Applications

This application claims the priority of the Chinese patent application with application number 202110751143.6 filed on July 2, 2021, and the priority of the international patent application with application number PCT/CN2021/113419 filed on August 19, 2021 rights, and the priority of the International Patent Application No. PCT/CN2021/112017 filed on August 11, 2021, the entire contents of which are incorporated herein by reference.

A vibration sensor is an energy conversion device that converts vibration signals into electrical signals. Its uses include microphones (such as air conduction microphones, bone conduction microphones, etc.) or monitoring equipment. Vibration sensors can obtain data such as vibration amplitude and direction, and convert them into electrical signals or other required forms for further analysis and processing.

This specification provides a vibration sensor, which increases the sensitivity of the vibration sensor without adding a converter.

One of the embodiments of the present disclosure provides a vibration sensor, including: a converter; a vibration component connected to the converter, and the vibration component is configured to transmit an external vibration signal to the converter to generate an electric current. signal, the vibration assembly includes one or more plate-like structures and one or more masses physically connected to each of the one or more plate-like structures; the vibration assembly is configured to be in a Make the sensitivity of the vibration sensor greater than the sensitivity of the converter in one or more target frequency bands.

In some embodiments, the frequency response curve of the vibration sensor under the action of the vibration component has a plurality of resonance peaks.

In some embodiments, the one or more masses connected to one of the one or more plate-like structures comprises at least two masses.

In some embodiments, at least one structural parameter of the at least two proof masses is different, and the structural parameter includes size, mass, density and shape.

In some embodiments, in the vibration direction of the vibration assembly, the projection of the one or more mass blocks is located in a plate shape within the projection of the plate-shaped structure.

In some embodiments, the vibration assembly further includes a support structure for supporting the plate-like structure, the support structure is physically connected to the converter, and the plate-like structure is connected to the support structure.

In some embodiments, the support structure is made of an air impermeable material.

In some embodiments, in a direction perpendicular to the surface connected to the one plate structure and the one or more proof masses, the projected area of the proof mass does not overlap with the projected area of the support structure.

In some embodiments, the one plate-shaped structure and at least two mass blocks physically connected to the one plate-shaped structure correspond to multiple target frequency bands in the target frequency bands, so that in the corresponding multiple target frequency bands The sensitivity of the vibration sensor is greater than the sensitivity of the converter.

In some embodiments, the one plate-like structure and at least two masses physically connected to the one plate-like structure have multiple resonant frequencies, at least one of the multiple resonant frequencies is lower than that of the transducer The resonant frequency is such that the sensitivity of the vibration sensor is greater than the sensitivity of the transducer in a plurality of target frequency bands of the one or more target frequency bands.

In some embodiments, the multiple resonance frequencies of the one plate-like structure and at least two masses physically connected to the one plate-like structure are the same or different.

In some embodiments, at least one of the multiple resonance frequencies of the one plate-like structure and at least two masses physically connected to the one plate-like structure is the same as the resonant frequency of the converter The difference between the resonant frequencies is within 1 kHz to 10 kHz.

In some embodiments, the difference between two adjacent resonant frequencies among the plurality of resonant frequencies of the one plate structure and at least two masses physically connected to the one plate structure is less than 2 kHz.

In some embodiments, the difference between two adjacent resonance frequencies among the plurality of resonant frequencies of the one plate structure and at least two masses physically connected to the one plate structure is not greater than 1 kHz.

In some embodiments, the resonant frequency of the one plate structure and at least two masses physically connected to the one plate structure is within 1 kHz to 10 kHz.

In some embodiments, the resonant frequency of the one plate-like structure and the plurality of masses physically connected to the plate-like structure is within 1 kHz to 5 kHz.

In some embodiments, the multiple resonant frequencies of the one plate-like structure and at least two mass blocks physically connected to the one plate-like structure are related to the plate-like structure and/or the mass The parameter is related to the parameters of the block, the parameters include the modulus of the plate structure, the volume of the cavity formed between the converter and the plate structure, the radius of the mass block, the height of the mass block and At least one of the densities of the mass.

In some embodiments, at least one of the one or more mass blocks connected to one of the one or more plate-like structures is arranged concentrically with the one of the plate-like structures.

In some embodiments, a diaphragm is included in the one or more plate structures.

In some embodiments, the one or more masses connected to the diaphragm are disposed on a side of the diaphragm facing the transducer, or disposed on a side of the diaphragm facing away from the transducer.

In some embodiments, the diaphragm comprises polytetrafluoroethylene, expanded polytetrafluoroethylene, polyether fluoride, polyvinylidene fluoride, polypropylene, polyethylene terephthalate, nylon, nitrocellulose, or At least one of mixed cellulose.

In some embodiments, in the vibration direction of the diaphragm, the projected area of the proof mass is located within the projected area of the diaphragm.

In some embodiments, the number of the one or more mass blocks connected to the diaphragm may be greater than 1, and they are respectively arranged on two sides of the diaphragm perpendicular to the vibration direction.

In some embodiments, the number of the one or more mass blocks connected to the diaphragm may be greater than or equal to 3; the at least three mass blocks are not collinearly arranged.

In some embodiments, at least one of the one or more plate-like structures comprises a cantilever beam.

In some embodiments, the material of the cantilever includes at least one of copper, aluminum, tin, silicon, silicon oxide, silicon nitride, silicon carbide, aluminum nitride, zinc oxide, lead zirconate titanate or alloys.

In some embodiments, the one or more mass blocks connected to the cantilever beam are arranged at the free end of the cantilever beam.

In some embodiments, the one or more masses connected to the cantilever beam are collinearly arranged with the cantilever beam.

In some embodiments, the converter further includes a conduction channel; the vibration component is arranged in the conduction channel along the radial section of the sound pickup hole; or, the vibration component is arranged in the conduction channel outside.

In some embodiments, the one or more connected to at least one of the one or more plate-like structures does not contact the inner wall of the conductive channel.

In some embodiments, at least one of the one or more plate-shaped structures is provided with a through hole.

In some embodiments, at least one of the one or more plate-like structures does not completely cover the conductive channel.

In some embodiments, a plate-like structure of the one or more plate-like structures that is furthest from the transducer is configured to enclose the conductive channel.

One of the embodiments of the present disclosure provides an audio input device, which includes any one of the vibration sensors described above.

One of the embodiments of the present disclosure provides a vibrating system, including: a plate-like structure; a vibrating element connected to the plate-shaped structure; at least one counterweight connected to the vibrating element, and on the vibrating element In the vibration direction, the projection of the counterweight is located within the projection of the vibrating element.

One of the embodiments of the present disclosure provides an earphone, which includes the aforementioned vibration system.

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings that need to be used in the description of the embodiments. Apparently, the accompanying drawings in the following description are only some examples or embodiments of the present invention, and for those skilled in the art, the present invention can also be translated according to these drawings without making progressive efforts. The invention applies to other similar scenarios. Unless otherwise apparent from context or otherwise indicated, like reference symbols in the drawings represent like structures or operations.

As shown in this specification and claims, words such as "a", "an", "an" and/or "the" do not refer to the singular, and may also include the plural, unless the context clearly indicates an exception. Generally speaking, the terms "comprising" and "comprising" only suggest the inclusion of clearly identified steps and elements, and these steps and elements do not constitute an exclusive list, and the method or device may also contain other steps or elements. The term "based on" is "based at least in part on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one further embodiment". Relevant definitions of other terms will be given in the description below.

In some embodiments, the vibration sensor means for converting vibrations into electrical signals includes a converter. Usually there is only one resonant peak in a single converter, and the converter has high sensitivity only around the frequency of the resonant peak. In some embodiments, in order to improve the sensitivity of the vibration sensor, a plurality of converters with different resonance peaks are arranged to increase the receiving frequency range and sensitivity, but increasing the number of converters will lead to the volume and Increased manufacturing costs.

In view of this, this specification relates to a vibration sensor, which makes the sensitivity of the vibration sensor in the target frequency band greater than that of the converter through a vibration component connected to the converter. The vibration sensor can be used to receive external vibration signals and convert the vibration signals into electrical signals capable of reflecting sound information, wherein the external signals can include mechanical vibration signals or signals. The vibrating assembly may include a plate structure and one or more mass blocks physically connected to the plate structure, and the mass block is arranged on one side of the plate structure. The vibratory assembly is configured such that the sensitivity of the vibration sensor is greater than the sensitivity of the transducer in one or more frequency bands of interest.

FIG. 1 is a schematic diagram of a modular structure of a vibration sensor according to some embodiments of the present disclosure.

As shown in FIG. 1 , the vibration sensor 100 may include a transducer 110 and a vibration component 120 . In some embodiments, the transducer 110 is connected with a vibration component 120 configured to transmit an external vibration signal to the transducer to generate an electrical signal. When vibration occurs in the external environment, the vibration component 120 responds to the vibration of the external environment and transmits the vibration signal to the converter 110, and then the converter 120 converts the vibration signal into an electrical signal. The vibration sensor 100 can be applied to mobile devices, wearable devices, virtual reality devices, augmented reality devices, etc., or any combination thereof.

In some embodiments, transducer 110 may be an acoustic transducer, which may include a microphone. Specifically, the microphone may be a microphone with bone conduction as one of the main modes of sound transmission or a microphone with air conduction as one of the main modes of sound transmission. Taking air-air conduction as one of the main transmission modes of sound as an example, the microphone can obtain the sound pressure change of the conduction channel (such as the sound pickup hole) and convert it into an electrical signal. In some embodiments, the converter can be an accelerometer, which is a specific application of a spring-to-vibration system, which receives vibration signals through sensitive devices to obtain electrical signals, and then processes the electrical signals to obtain acceleration. In some embodiments, the accelerometer operates at a lower frequency than the acoustic transducer.

In some embodiments, mobile devices may include smartphones, tablet computers, personal digital assistants (PDAs), gaming devices, navigation devices, etc., or any combination thereof. In some embodiments, wearable devices may include smart bracelets, earphones, hearing aids, smart helmets, smart watches, smart clothing, smart backpacks, smart accessories, etc., or any combination thereof. In some embodiments, the virtual reality device and/or the augmented reality device may include a virtual reality helmet, virtual reality glasses, a virtual reality patch, an augmented reality helmet, an augmented reality glasses, an augmented reality environment patches, etc. or any combination thereof. For example, virtual reality devices and/or augmented reality devices may include Google Glass, Oculus Rift, Hololens, Gear VR, and the like.

As shown in FIG. 1 , the vibration assembly 120 includes one or more plate structures 121 and one or more mass blocks 122 . In some embodiments, each of the one or more plate structures 121 is connected to at least one of the one or more masses 122 . Vibration assembly 120 is configured such that the sensitivity of vibration sensor 100 is greater than the sensitivity of transducer 110 within one or more target frequency bands. In some embodiments, a structure formed by a plate-shaped structure and a mass block physically connected to the plate-shaped structure may also be called a resonant structure. The plate-like structure 121 may refer to a structure made of flexible or rigid material capable of carrying one or more masses. The mass block 122 is a small and heavy object. In some embodiments, the volume and mass of the mass block are different according to the usage scenarios and target frequencies of the vibration assembly 120. For details, please refer to FIG. 2 and FIG. 8 It should be noted that the relevant descriptions in FIG. 2 and FIG. 8 are only an embodiment of the solution, and are not intended to limit the protection scope of the present invention.

In some embodiments, the plate structure 121 may include a single plate structure (also referred to as a plate). In some embodiments, the plate-shaped structure 121 may include a plurality of plate-shaped members, for example, 2, 3, 4, etc.

In some embodiments, at least one mass associated with each plate-like structure may comprise a single mass. In some embodiments, at least one mass connected to each plate-like structure may include multiple masses, eg, 2, 3, 4, etc.

In some embodiments, at least one of the plate structures 121 is connected to at least two masses 122 .

In some embodiments, the vibrating assembly 120 further includes a supporting structure for supporting the plate-shaped structure 121, the supporting structure is physically connected to the converter 110, and the plate-shaped structure 121 is connected to the supporting structure.

In some embodiments, one or more mass blocks 122 can be arranged on either side of the plate-shaped structure in the vibration direction, and in some embodiments, multiple mass blocks can also be respectively arranged on the plate-shaped structure in the vibration direction on both sides. In some embodiments, in the vibration direction of the plate-shaped structure, the projected area of the mass block connected thereto is located within the projected area of the plate-shaped structure. In some embodiments, in the direction parallel to the surface connecting the plate-like structure and the mass block (that is, perpendicular to the vibration direction), the sum of the cross-sectional areas of one or more mass blocks 122 on one side is smaller than the cross-sectional area of the plate-like structure. Sectional area. In some embodiments, driven by the plate structure, the mass block vibrates in the same direction as the plate structure.

In some embodiments, one or more plate-like structures 121 and a plurality of mass blocks 122 physically connected to the plate-like structures correspond to multiple target frequency bands in the target frequency bands, so that the vibration sensor in the corresponding multiple target frequency bands The sensitivity of 100 is greater than the sensitivity of converter 110. In some embodiments, the combination of at least one plate-shaped structure and a proof mass can produce a larger amplitude vibration signal near its resonance frequency when the vibration signal it receives, thereby improving the sensitivity of the vibration sensor 100 .

In some embodiments, the method for measuring the sensitivity of the vibration sensor 100 and the converter 110 may be: under the excitation of a given acceleration (such as 1g, g is the acceleration of gravity), the strength of the electrical signal (such as to 30 dBV) of the acquisition device This is the sensitivity (eg, to 30 dBV/g). For example, the intensity of the electrical signals output by the vibration sensor 100 and the converter 110 can be collected to obtain the sensitivity of the vibration sensor 100 and the converter 110 under the excitation of the same acceleration (such as 1g, where g is the acceleration of gravity). . In some embodiments, if the converter 110 is a microphone, when measuring the sensitivity, the aforementioned excitation source can be replaced by sound pressure, that is, the sound pressure in the specified frequency band can be input (the input method of sound pressure can be bone conduction As the main transmission mode of sound or air conduction as the main transmission mode of sound) as the excitation, measure the electrical signal of the acquisition device.

In some embodiments, in order to adapt to multiple vibration modes, a plate-shaped structure and one or more masses 122 physically connected to the plate-shaped structure form a vibration assembly that has multiple resonant frequencies, and the multiple resonant frequencies can be the same or different. At least one structural parameter of at least two masses of the plurality of masses may be different. The structural parameters of the proof mass may include size, mass, density, shape, etc. Specifically, the size of the mass block may be at least one of the length, width, height, cross-sectional area or volume parameter of the mass block.

In some embodiments, the frequency response curve of the vibration sensor 100 under the action of the vibration component 120 has multiple resonance peaks.

In some embodiments, the difference between the resonant frequency of at least one of the resonant frequencies of the resonant structure formed by a plate-shaped structure and a plurality of masses physically connected to the plate-shaped structure and the resonant frequency of the converter 100 is within 1 kHz to within 10 kHz. In some embodiments, the difference between two adjacent resonant frequencies among the multiple plate-like structures 121 resonant frequencies of one plate-shaped structure 121 and the plurality of masses 122 physically connected with the plate-shaped structure 121 is less than 2 kHz. In some embodiments, a plate structure 121 and a plurality of masses 122 physically connected to the plate structure 121 have a difference of no more than 1 kHz between the resonance frequencies of the multiple plate structures 121 .

In some embodiments, a plate structure 121 and a plurality of masses 122 physically connected to the plate structure 121 have a resonant frequency within 1 kHz to 10 kHz. In some embodiments, a plate structure 121 and a plurality of masses 122 physically connected to the plate structure 121 have a resonant frequency within 1 kHz to 5 kHz.

By arranging at least one mass 122 in the vibration component 120, the vibration component 120 can have multiple vibration modes, so that the frequency response curve of the vibration sensor has two or more resonance peaks. Since the sensitivity of the vibration sensor increases in the frequency range where the resonance peaks are located, the frequency response curve having two or more resonance peaks can increase the frequency range of high sensitivity of the vibration sensor. Among them, the vibration mode is the vibration state with fixed frequency, damping ratio and mode shape. Different vibration modes correspond to different deformation forms, for example, multiple masses vibrate upwards synchronously; one mass vibrates upwards, and one mass vibrates downwards, etc. The vibration mode depends on the characteristics of the vibration assembly 120, for example, the stiffness and size of the mass 122, the size, position and density of the counterweight, and the like. In some embodiments, one mass can produce one mode, two masses can produce two modes, three masses can produce three effective modes, or two effective modes. Among them, the effective mode refers to the mode that can cause the volume change of the air gap.

In some embodiments, at least one of the one or more plate structures 121 may be a diaphragm. The diaphragm may comprise a rigid membrane or a flexible membrane. Can be rigid or flexible membrane. A rigid membrane refers to a membrane body having a Young's modulus greater than a first modulus threshold (eg, 50 GPa). A flexible film refers to a film body whose Young's modulus is less than the second modulus threshold. In some embodiments, the first modulus threshold and/or the second modulus threshold can be set according to actual needs. In some embodiments, the first modulus threshold may or may not be equal to the second modulus threshold. For example, the first modulus threshold may be 20 GPa, 30 GPa, 40 GPa, 50 GPa, etc., and the second modulus threshold may be 1 MPa, 10 MPa, 1 GPa, 10 GPa, etc. For a detailed description of the diaphragm, reference may be made to the related description of the diaphragm as shown in FIG. 2 .

In some embodiments, at least one of the one or more plate structures 121 may be a cantilever beam. The cantilever beam may comprise a rigid plate. In some embodiments, a rigid plate refers to a plate whose Young's modulus of the film body is greater than a third modulus threshold (eg, 50 GPa). In some embodiments, the third modulus threshold can be set according to actual needs, for example, it can be 20 GPa, 30 GPa, 40 GPa, 50 GPa, etc. For a detailed description of the cantilever beam, please refer to the cantilever beam in Figure 8a related description.

In some embodiments, one or more plate-shaped structures 121 may include at least one diaphragm and at least one cantilever beam. For details about the diaphragm and the cantilever beam, please refer to the related description below.

Fig. 2 is a schematic structural diagram of a vibration sensor according to some embodiments of the present disclosure.

The vibration sensor 200 in FIG. 2 may be a specific implementation of the vibration sensor 100 in FIG. 1 . In some embodiments, the vibration sensor 200 includes an acoustic transducer 210 and a vibration component 220 . It should be noted that, in some other embodiments, the transducer may be other than the acoustic transducer, such as an accelerometer; in addition, the acoustic transducer may also be in other forms, such as a liquid microphone and a laser microphone.

Referring to Fig. 2, in some embodiments, the air conduction microphone includes a sound pickup device 212. In some embodiments, the sound pickup device 212 may include capacitive, piezoelectric and other transducer sensitive elements according to the principle of energy conversion. The specification does not limit.

In some embodiments, the acoustic transducer 210 is also provided with a conduction channel 211 for picking up sound. In some embodiments, the vibrating component 220 is disposed inside the conduction channel 211 or outside the conduction channel 211 as shown in FIG. 2 along the radial section of the sound pickup hole. The conduction channel 211 may also be called a sound pickup hole or a sound inlet hole.

As shown in FIG. 2 , the vibration assembly 220 includes a plate-shaped structure and a mass block 222 physically connected thereto. In some embodiments, the plate-shaped structure and the mass block 222 can be realized by clamping, bonding, or integral molding. connection, the connection method is not limited in this manual. In some embodiments, the plate-like structure includes a diaphragm 221 . In some embodiments, the diaphragm 221 can be set to be air-permeable or air-impermeable. Exemplarily, in order to have a better sound pickup effect, in some embodiments, the diaphragm 221 can be air-impermeable.

It should be noted that a diaphragm and a plate-shaped structure are shown in the figure only for convenience of description, but do not limit the protection scope of the present invention. In some embodiments, the mass block may include multiple, multiple mass blocks They can be respectively arranged on both sides of the diaphragm 221 , and in some embodiments, multiple masses can also be arranged on the same side of the diaphragm 221 . Exemplarily, assuming that the vibrating component includes more than two mass blocks, the two mass blocks may be arranged on both sides of the plate-shaped structure. In some embodiments, a plurality of mass blocks can be all arranged on the side of the diaphragm facing the transducer, or on the side of the diaphragm facing away from the transducer, so as to ensure uniform vibration. In some embodiments, a plate-shaped structure and a plurality of mass block diaphragms 221 physically connected to the plate-shaped structure correspond to multiple target frequency bands in one or more different target frequency bands, so that vibration sensing in the corresponding target frequency bands The sensitivity of the converter 100 may be greater than the sensitivity of the converter 210. In some embodiments, the resonant frequencies of a plate structure and the masses 222 physically connected to the plate structure are the same or different. In some embodiments, the sensitivity of the vibration sensor 100 after adding one or more sets of masses and diaphragms can be increased by 3 dB to 30 dB compared with the converter 110 in the target frequency band. It should be noted that, in some embodiments, the sensitivity of the vibration sensor 200 after the additional vibration component 220 can be increased by more than 30 dB compared with the converter 210, such as a plurality of mass blocks 222 physically connected with the plate structure have same harmonic peak.

In some embodiments, a plurality of mass blocks can be arranged collinearly or not. Exemplarily, in some embodiments, if the mass blocks include four, two or three of the four mass blocks can be co-linear. In addition, the four masses can also be arranged in arrays (such as rectangular arrays and circular arrays).

, in some embodiments, when the vibrating assembly 220 includes a plurality of diaphragms, except the diaphragm farthest from the acoustic transducer 210 can be constructed to be air-permeable, so as to ensure that air vibrations (eg, sound waves) can pass through as completely as possible. The diaphragm further uses the sound pickup device 221 to pick up the vibration, which can effectively improve the sound pickup quality. The farthest plate structure from the acoustic converter 210 is configured to be airtight to seal the conduction channel 211 so that the air in the conduction channel 211 will not escape when it vibrates, ensuring the effect of air compression, so that the vibration sensor 200 has a better pickup effect.

In some embodiments, the support structure 230 is made of an air-impermeable material, and the air-impermeable support structure 230 can cause the vibration signal in the air to change during the transmission process, causing the sound pressure in the support structure 230 to change (or air vibration), so that The internal vibration signal of the support structure 230 is transmitted to the acoustic converter 220 through the conduction channel 211, and will not escape outward through the support structure 230 during the transmission process, thereby ensuring the sound pressure intensity and improving the sound transmission effect. In some embodiments, the support structure 230 may include, but not limited to, metals, alloy materials (such as aluminum alloys, chrome-molybdenum steels, scandium alloys, magnesium alloys, titanium alloys, magnesium-lithium alloys, nickel alloys, etc.), hard plastic, foam one or more of these.

In some embodiments, in the direction perpendicular to the surface connecting the diaphragm 221 and the proof mass 222 (ie, perpendicular to the vibration direction), the projected area of the proof mass does not overlap with the projected area of the supporting structure. This arrangement is to prevent the vibration of the diaphragm 221 and the mass 222 from being restricted by the support structure 230 . In some embodiments, the shape of the cross-section of the diaphragm in the thickness direction may include circular, rectangular, triangular or irregular figures, etc. In some embodiments, the shape of the diaphragm may also be set according to the shape of the support structure 230 , without limitation in this specification. In some embodiments, in order to prevent excessive concentration of stress at corners due to excessively non-smooth curves, the embodiment of the present disclosure selects the diaphragm 221 as a circular shape. In some embodiments, the shape of the proof mass can be a cylinder, a truncated cone, a cone, a cube, a triangle, etc., and its size and material will be described later, and the shape is not limited in this description.

In some embodiments, the proof mass 222 can be concentrically arranged with the diaphragm 221 . Exemplarily, when the mass block 222 or the diaphragm 221 has a circular outer contour, when the mass block 222 arranged concentrically vibrates, the kinetic energy is more evenly dispersed on the diaphragm 221, so that the diaphragm 221 can better respond to the vibration . In some other embodiments, the mass block 222 may also be arranged at other positions of the diaphragm 211, such as an eccentric position, and the eccentric position means that the mass block is not arranged concentrically with the diaphragm. In some embodiments, the distance between the centerline of proof mass 222 and the edge of diaphragm 221 may vary. In some embodiments, the positions of the mass block 222 relative to the diaphragm 221 are different, and the resonance peak position of the vibration system 10 can be adjusted. For example, when the mass 222 moves from the edge area of the diaphragm 221 to the center of the diaphragm 221, the resonance peak can be moved forward, that is, to move toward the low frequency direction (resonant frequency is reduced). When moving to the edge region of the vibrating membrane 221 , the resonance peak can be moved back, that is, to move toward the high frequency direction (the resonance frequency increases).

In some embodiments, when the vibration sensor 200 is used for air conduction pickup, when the external environment generates vibrations (such as sound waves), the diaphragm 221 and the mass on the diaphragm 221 respond to the vibration of the external environment to generate Vibration, the vibration generated by the diaphragm 221 and the mass block, together with the external vibration signal (for example, sound wave), can cause the sound pressure change in the conduction channel 211 (or air vibration), so that the vibration signal is transmitted to the sound pickup device 212 through the conduction channel 211 and Converted into electrical signals, so as to realize the process of converting vibration signals into electrical signals after being strengthened in one or more target frequency bands. Wherein, the target frequency band may be the frequency range where the resonant frequency (or resonant frequency) corresponding to the plate structure and the proof mass 222 is located. Exemplarily, when the vibration sensor 200 is used as a microphone, the target frequency range may be 200 Hz to 2 kHz. Specifically, in some embodiments, if the resonance frequency of the acoustic transducer is 2 kHz, the vibration component The resonant frequency of 220 can be configured as 800 Hz, 1 kHz or 1.7 kHz etc.

In some embodiments, the vibrating component 210 can be applied to the design of MEMS (Micro Electro Mechanical System) devices, and can also be applied to the design of macroscopic devices (such as microphones or speakers, etc.). In the MEMS device manufacturing process, the diaphragm 221 can be a single-layer material along its thickness direction, such as Si, SiO2, SiNx, SiC, etc., or it can be a double-layer or multi-layer composite material, such as Si/SiO2, SiO2/Si, Si/ SiNx, SiNx/Si/SiO2, etc. The proof mass 221 can be a single-layer material, such as Si, Cu, etc., or a double-layer or multi-layer composite material, such as Si/SiO2, SiO2/Si, Si/SiNx, SiNx/Si/SiO2, etc. In some embodiments, the material of the diaphragm 221 in the MEMS device is Si or SiO2/SiNx, and the material of the mass block 222 is Si. When the diaphragm 221 and the mass block 222 are circular, the radius can be 500 μm to 1500 μm, the thickness of the diaphragm 221 can be 0.5 μm to 5 μm; the radius of the mass block 222 can be 100 μm to 1000 μm, and the mass block 222 The height can be from 50 μm to 5000 μm.

In the macroscopic device, the material of the diaphragm 221 can be a polymer film, such as polyurethane, epoxy resin, acrylate, etc., or a metal film, such as copper, aluminum, tin or other alloys and their composite films; The mass block 221 is generally required to have a certain mass in a volume as small as possible, so it needs to have a high density, and its material can be copper, tin or other alloys and their composite materials. In a macroscopic device, the radius of the diaphragm 221 can be 1 mm to 10 cm, the thickness of the diaphragm 210 can be 0.1 mm to 5 mm; the radius of the mass block 221 can be 0.2 mm to 5 cm, and the height of the mass block 221 can be 0.1 mm to 5 cm. 10 mm. In some embodiments, the radius of the diaphragm 221 can be 1.5 mm to 10 mm, and the thickness of the diaphragm 221 can be 0.2 mm to 0.7 mm; the radius of the mass block 221 can be 0.3 mm to 5 mm, and the height of the mass block 221 can be 0.3mm to 5mm.

In some embodiments, the diaphragm 221 may include a gas-permeable film, and the gas-permeable film includes polytetrafluoroethylene, expanded polytetrafluoroethylene, polyether fluoride, polyvinylidene fluoride, polypropylene, polyethylene terephthalate, At least one or a combination of nylon, nitrocellulose or mixed cellulose. In some embodiments, when the vibrating membrane 221 is configured to be airtight, the material of the vibrating membrane 221 may be the material of the aforementioned plate-shaped structure or may be obtained by processing the above-mentioned gas-permeable film (such as covering air holes).

In some embodiments, the diaphragm 221 may be a plate-like structure with through holes. In some embodiments, the diameter of the through hole is 0.01 μm to 10 μm. Preferably, the diameter of the through hole may be 0.1 μm to 5 μm, such as 0.2 μm, 0.5 μm, 0.8 μm, 1 μm, 2 μm and so on. The diameters of the through holes on the diaphragm 221 may be the same or different. In some embodiments, if the vibrating assembly 230 includes multiple diaphragms, the diameters of the through holes on the multiple diaphragms may be the same or different, and the diameters of the through holes on the same diaphragm may be the same or different. In some embodiments, the diameter of the through holes may also be larger than 5 μm. When the diameter of the through hole is greater than 5 μm, other materials (such as silicon gel, etc.) can be arranged on the diaphragm 221 to cover part of the through hole or a part of the area of the through hole without affecting the air permeability.

In some embodiments, the vibrating assembly 220 may further include a support structure 230 for supporting one or more sets of diaphragms 221 and masses. The supporting structure 230 is physically connected to the acoustic transducer 230 , and the diaphragm 221 and the mass are connected to the supporting structure 230 . Specifically, the support structure 230 may be connected to the casing of the acoustic transducer 210 .

3 is a schematic diagram of an exemplary vibratory assembly, according to some embodiments of the present disclosure.

The vibration assembly 320 shown in FIG. 3 may be an exemplary embodiment of the vibration assembly 120 in FIG. 1 . It can be seen from FIG. 3 that a mass 322 is arranged on the diaphragm 321 .

In some embodiments, the plate structure can be embedded on the inner wall of the support structure 330 or embedded in the support structure 330 . In some embodiments, the plate-shaped structure can vibrate in the space inside the support structure 230 while the plate-shaped structure can completely cover the opening of the support structure, that is, the area of the plate-shaped structure can be greater than or equal to the area of the opening of the support structure. The air vibration (for example, sound wave) in the external environment can pass through the plate structure as completely as possible, and then the vibration can be picked up by the sound pickup device, which can effectively improve the sound pickup quality. In some embodiments, the plate-like structure may not completely cover the opening of the support structure, for example, the plate-like structure is a cantilever beam. For details, please refer to the related description of FIGS. 8A to 8C below.

4A-4C are schematic diagrams of exemplary vibratory assemblies according to some embodiments of the present disclosure.

Fig. 4A is a three-dimensional schematic diagram of a vibrating assembly 420; Fig. 4B is a projection view of the vibrating assembly 420 shown in Fig. 4A in the direction of vibration; Fig. 4B is a projection of the vibrating assembly 420 shown in Fig. 4A perpendicular to the direction of vibration picture. The vibration assembly shown in FIGS. 4A to 4C may be an exemplary embodiment of the vibration assembly 120 in FIG. 1 .

As shown in FIG. 4A , in some embodiments, the vibrating assembly 420 includes a plate-shaped structure and two masses 422 arranged on the plate-shaped structure, similar to the vibrating assembly 420 in FIG. 3 , the plate-shaped structure can be arranged on a supporting structure Diaphragm 421 on 430. In some embodiments, the structural parameters of the two masses 422 may be the same or different. It should be noted that the number of masses connected to the diaphragm may not be limited to two, for example, may be three, four or more than five.

In some embodiments, the two masses 422 are physically connected to the diaphragm 421 . In some embodiments, the two mass blocks 422 may be respectively disposed on both sides of the diaphragm 421 in the vibration direction. Referring to Fig. 4B and Fig. 4C at the same time, in some embodiments, the two mass blocks 422 can have the same outer contour in the vibration direction, for example, both are circular; ) can have different heights. Thus, the two mass blocks 422 can make the vibrating component have two different resonant frequencies in the target frequency band, thereby generating two resonant peaks, and then make the vibrating component 420 in the frequency range near the two resonant frequencies (that is, the target frequency band) The sensitivity is improved, achieving the effect of widening the bandwidth of the frequency band and improving the sensitivity.

In some embodiments, by setting the parameters of the diaphragm 421 and the mass 422, at least two resonance peaks can be formed on the frequency response curve of the vibration sensor with the vibration component 420, thereby forming multiple high-sensitivity frequency intervals and a wider frequency band. In some embodiments, the multiple resonant frequencies of the plate-like structure and the plurality of mass blocks 422 physically connected to the plate-like structure are related to the parameters of the diaphragm 421 and/or the mass blocks 422, and the parameters include the modulus of the plate-like structure , at least one of the volume of the cavity formed between the converter and the plate structure, the radius of the mass block 422 , the height of the mass block 422 and the density of the mass block 422 . Specifically, the mathematical relationship between the resonant frequency and sensitivity and the above parameters can refer to the related description of formula 1 below. It should be noted that the mass or size parameter of the mass block 422 is not as large as possible. If the parameter is set too large, it may suppress the deformation of the diaphragm 421, or may generate new effective modes due to the large amplitude of the mass block 422 .

In some embodiments, the parameters of the two mass blocks 422, such as the height in the vibration direction, can meet a preset ratio, such as in some embodiments, the height ratio of the two mass blocks 422 can be 3:2, 2:1 , 3:4 or 3:1 etc.

5A-5B are schematic diagrams of exemplary vibratory assemblies according to some embodiments of the present disclosure.

Fig. 5A is a three-dimensional schematic diagram of a vibrating assembly 520; Fig. 5B is a projection view of the vibrating assembly 520 shown in Fig. 5A in the vibration direction; in some embodiments, as shown in Fig. Similar, the difference here is that the number of mass blocks 522 on the diaphragm 521 is three.

In some embodiments, the three masses 522 may not be collinearly arranged on the diaphragm 521 . It can be understood that when there are three mass blocks 522 , the connecting lines between two of the three mass blocks do not overlap. Referring to FIG. 5B at the same time, in this embodiment, three mass blocks 522 are distributed in a triangle shape, and the distances between any two mass blocks 522 are the same. In some embodiments, the three mass blocks 522 can improve the sensitivity of the vibrating component 520 in the frequency range near at least two frequency points in the target frequency band, thereby achieving the effect of widening the frequency band width and improving the sensitivity.

6 is a schematic diagram of an exemplary vibratory assembly, according to some embodiments of the present disclosure.

As shown in FIG. 6 , in some embodiments, the number of mass blocks 622 in the vibrating assembly 620 may still be four, and the four mass blocks 622 are arranged in an array (such as a circular array or a rectangular array). In some embodiments, at least two masses 622 among the four masses 622 have different resonance peaks. In some embodiments, when there are four or more mass blocks 622 , the line connecting the center points of any two mass blocks on the diaphragm will not overlap into a straight line.

In some embodiments, the frequency response curve of the vibration sensor under the action of the diaphragm and the mass has one or more resonance peaks.

Fig. 7 is a schematic diagram of frequency response curves of vibration components in a vibration sensor with different numbers of masses according to some embodiments of the present disclosure.

The frequency response curve diagram 700 in FIG. 7 includes two frequency response curves, a frequency response curve 710 and a frequency response curve 720, wherein the frequency response curve 710 represents the vibration feeling when a mass is arranged on the diaphragm (as shown in FIG. 3 ). The frequency response curve of the sensor; the frequency response curve 720 represents the frequency response curve of the vibration sensor when two masses (as shown in FIG. 4A ) are arranged on the diaphragm. It can be seen from the figure that the frequency response curve 710 has one resonance peak, and the frequency response curve 720 has two resonance peaks.

In some embodiments, the arrangement of one mass may refer to the arrangement in FIG. 3 , and the arrangement of two masses may refer to the arrangement in FIG. 4A . It can be seen from the figure that when a mass is set on the diaphragm, the frequency of the resonance peak of the vibration sensor is around 2000 Hz. On the other hand, adding two diaphragms with the same diameter but different heights, the frequencies of the resonance peaks of the vibration sensor are located around 1300 Hz and 3500 Hz, respectively. It can be seen that in the scenario of adding two mass blocks, the sensitivity at these two frequency points (near 1300 Hz and 3500 Hz) is greater than the sensitivity of the converter, reaching the target frequency (such as within the range of 500 Hz to 5000 Hz) Significantly improves the sensitivity of the vibration sensor. Compared with the method of increasing the receiving frequency range by adding multiple sets of converters with different resonance peaks, the overall volume of the device is reduced, the cost is reduced, and it has stronger performance on the basis of higher integration.

In some embodiments, the resonant frequency of the plate-like structure and one or more masses on the plate-like structure is related to parameters of the plate-like structure and/or the proof-mass, the parameters may include elastic modulus of the plate-like structure, transducer At least one of the volume of the cavity, the radius of the mass block, the height of the mass block and the density of the mass block is formed between the plate-like structure. Exemplarily, in some embodiments, the relationship between the resonance frequency of the diaphragm and the mass and the sensitivity can be expressed as: (S,f)=g(K _film ,K _foam ,V _cavity ,R _m ,h _m ,ρ _m ) (1).

Among them, S is the sensitivity of the vibration sensor after the vibration component is set, f is the resonance frequency of the vibration component, K _film is the stiffness of the plate structure, K _foam is the stiffness of the supporting structure, V _cavity is the volume of the cavity, and R _m is the mass block radius, h _m is the mass block height, ρ _m is the mass block density. The cavity volume V _cavity is the volume of space formed between the sensitive element in the converter (such as the pickup device 212 in FIG. 2 ) and the diaphragm in the closest vibrating component (such as the diaphragm 221 in FIG. 2 ).

Specifically, in some embodiments, the sensitivity S decreases with the increase of the plate structure stiffness K _film , decreases with the increase of the support structure stiffness K _foam , increases first and then decreases with the increase of the cavity volume V _cavity , As the mass block radius R _m first increases and then decreases, it increases as the mass block height h _m increases, and it increases as the mass block density ρ _m increases. The resonant frequency f of the vibrating assembly increases with the increase of the plate structure stiffness K _film , increases with the increase of the supporting structure stiffness K _foam , decreases first and then increases with the increase of the radius R _m of the mass block, and increases with the increase of the mass block radius R m The height h _m increases and decreases, and decreases with the increase of mass block density ρ _m . In some embodiments, the sensitivity and resonance frequency can be adjusted by controlling the stiffness of the plate structure, the volume of the cavity, and the material and size of the proof mass. In some embodiments, when the plate structure has low rigidity, it can be set in the form of a diaphragm, as described in FIG. 2 . In some embodiments, when the plate-like structure has high rigidity or the volume of the plate-like structure is expected to be small, it can be set in the form of a cantilever beam. For details, please refer to the description of FIGS. 8A to 8C below.

8A to 8C are structural schematic diagrams of vibration components of a vibration sensor according to some embodiments of the present disclosure.

Fig. 8A is a three-dimensional schematic diagram of a vibrating assembly 820; Fig. 8B is a projection of the vibrating assembly 820 shown in Fig. 8A in the direction of vibration; Fig. 8B is a projection of the vibrating assembly 820 shown in Fig. 8A perpendicular to the direction of vibration picture. The vibration assembly shown in FIGS. 8A to 8C may be an exemplary embodiment of the vibration assembly 120 in FIG. 1 .

As shown in FIG. 8A , the vibration assembly includes a support structure 830 , a cantilever beam 821 and a mass 822 . One end of the cantilever beam 821 is physically connected to one side of the support structure 830 , and the other end is a free end, and the mass block 822 is physically connected to the free end of the cantilever beam 821 . Specifically, the physical connection manner between the cantilever beam 821 and the supporting structure 830 may include connection manners such as welding, clamping, bonding, or integral molding, and the connection manner is not limited here. In some embodiments, the vibrating component may not include the support structure 830, the cantilever beam 821 may be disposed inside or outside the conduction channel along the radial section of the conduction channel, and the cantilever beam 821 may not completely cover the conduction channel.

In some embodiments, the material of the cantilever beam 821 includes at least one of copper, aluminum, tin, silicon, silicon oxide, silicon nitride, silicon carbide, aluminum nitride, zinc oxide, lead zirconate titanate or an alloy. In some embodiments, the mass block 822 can be arranged on any side of the cantilever beam 821 in the vibration direction. ) side for explanation.

In some embodiments, at least one mass block 822 is disposed on either side of the free end of the cantilever beam 821 perpendicular to the vibration direction. The sizes of the masses 822 may be partly or all the same, or all different. In some embodiments, the distances between adjacent masses 822 may be the same or different. In actual use, it can be designed according to the vibration mode.

Referring to FIG. 8A to FIG. 8C at the same time, in some embodiments, three mass blocks 822 are disposed on the cantilever beam 821 . The three mass blocks 822 on the cantilever beam 821 have the same size and the three mass blocks 822 are collinear at the center point of the cantilever beam 821 . In some embodiments, since the width of the cantilever beam 821 in the horizontal direction perpendicular to the vibration direction is relatively narrow, preferably, one or more mass blocks 822 are arranged in line with the cantilever beam 821 to obtain a more stable sensitivity improvement .

In some embodiments, the cantilever beam 821 has a rectangular profile in the radial section. In some other embodiments, the cantilever beam 821 can have a rectangular, triangular, trapezoidal, rhombus and other curved shapes in the radial section. In some embodiments, multiple resonance peaks of the vibration sensor can be adjusted by changing the material, shape and size of the cantilever beam 821 and the mass block 822, because the principle of using a cantilever beam or a diaphragm as a plate structure is similar , so the specific adjustment method can refer to the previous formula (1), and the diaphragm parameters in the formula (1) can be directly replaced by the parameters of the cantilever beam 821 .

In some embodiments, vibration sensors can be applied to MEMS device designs. In some embodiments, the vibration sensor can be applied to the design of macroscopic devices (such as microphones, speakers, etc.). In the MEMS device manufacturing process, the cantilever beam 821 can be a single-layer material along the thickness direction, such as Si, SiO2, SiNx, SiC, etc., or can be a double-layer or multi-layer composite material, such as Si/SiO2, SiO2/Si, Si/SiNx, SiNx/Si/SiO2 etc. The mass 822 can be a single-layer material, such as Si, Cu, etc., or a double-layer or multi-layer composite material, such as Si/SiO2, SiO2/Si, Si/SiNx, SiNx/Si/SiO2, etc. In the embodiment of the present disclosure, the material of the cantilever beam 821 in the MEMS device is Si or SiO2/SiNx, and the material of the mass block 822 is Si. In the manufacturing process of MEMS devices, in some embodiments, the length of the cantilever beam 821 can be 500 μm to 1500 μm; in some embodiments, the thickness of the cantilever beam 821 can be 0.5 μm to 5 μm; in some embodiments, the mass The side length of 822 may be 50 μm to 1000 μm; in some embodiments, the height of proof mass 822 may be 50 μm to 5000 μm. In some embodiments, the length of the cantilever beam 821 can be 700 μm to 1200 μm, the thickness of the cantilever beam 821 can be 0.8 μm to 2.5 μm; the side length of the mass block 822 can be 200 μm to 600 μm, and the height of the mass block 822 can be 200 μm. μm to 1000 μm.

In a macro device, the material of the cantilever beam 821 can be an inorganic non-metallic material, such as aluminum nitride, zinc oxide, lead zirconate titanate, etc., or a metal material, such as copper, aluminum, tin or other alloys, or a combination of the above materials wait. The mass block 822 is generally required to have a certain mass in a volume as small as possible, so it needs to have a high density, and its material can be copper, tin or other alloys, or ceramic materials. Preferably, the material of the cantilever beam 821 is aluminum nitride or copper, and the material of the mass block 822 is a tin block or a copper block. In a macroscopic device, the length of the cantilever beam 821 can be 1 mm to 20 cm, and the thickness of the cantilever beam 821 can be 0.1 mm to 10 mm; in some embodiments, the side length of the mass block 822 can be 0.2 mm to 5 cm. The 822 height can be from 0.1 mm to 10 mm. In some embodiments, the length of the cantilever beam 821 can be 1.5 mm to 10 mm, the thickness of the cantilever beam 821 can be 0.2 mm to 5 mm; the side length of the mass block 822 can be 0.3 mm to 5 cm, and the height of the mass block 822 can be 0.5 mm. mm to 5 cm.

9A to 9B are structural schematic diagrams of vibration components of a vibration sensor according to some embodiments of the present disclosure.

As shown in FIG. 9A , in some embodiments, two mass blocks 922 may be disposed on the cantilever beam 921 of the vibrating assembly 920 , and the two mass blocks 922 have different heights in the vibration direction. In some embodiments, the height of the mass block 922 near the free end of the cantilever beam 921 may be lower than the height of the mass block 922 away from the free end. In some embodiments, as shown in FIG. 9B , the mass 922 close to the free end of the cantilever beam 921 may be higher than the mass 922 far from the free end. It should be noted that even though other structural parameters of the two mass blocks 922 are the same, since the positions of the mass blocks 922 in the two cases in Fig. 9A and Fig. 9B are different, in some embodiments, the two cases may have two different form of harmonic peaks.

Fig. 10 is a schematic structural diagram of a vibration component of a vibration sensor according to some embodiments of the present disclosure.

Fig. 11 is a schematic structural diagram of a vibration component of a vibration sensor according to some embodiments of the present disclosure.

As shown in FIG. 10 and FIG. 11 , in some embodiments, the mass blocks 1022 on the cantilever beam may also include one or four. The structural parameters of the four mass blocks 1022 arranged on the cantilever beam may be the same, some of them may be different, or all of them may be different.

Fig. 12 is a schematic diagram of frequency response curves of vibration components in a vibration sensor with different numbers of masses according to some embodiments of the present disclosure.

As shown in FIG. 12 , in some embodiments, the frequency response curve of the vibration sensor under the action of the cantilever beam and the proof mass has one or more resonance peaks. The frequency response curve diagram 1200 in Fig. 12 comprises frequency response curve 1210, frequency response curve 1220 and frequency response curve 1230 three frequency response curves, wherein, frequency response curve 1210 represents when a quality block is arranged on the cantilever beam (as shown in Figure 10 shown), the frequency response curve of the vibration sensor; the frequency response curve 1220 represents the frequency response curve of the vibration sensor when two mass blocks are arranged on the cantilever beam (as shown in Figure 9A or 9B); the frequency response curve 1230 represents the frequency response curve of the vibration sensor when three mass blocks are arranged on the cantilever beam (as shown in FIG. 8A ). It can be seen from the figure that the frequency response curve 1210 has one resonance peak, the frequency response curve 1220 has two resonance peaks, and the frequency response curve 1230 has three resonance peaks.

In some embodiments, the configuration of the mass blocks on the cantilever beam can refer to the previous methods, for example, the configuration of one mass block can refer to Figure 10; the configuration of three mass blocks can refer to Figure 8a. It can be seen from the figure that when there is only one mass, the resonance peak of the vibration sensor is around 10 kHz, and when there are two resonance peaks, the vibration sensor forms two resonance peaks at 3 kHz and 13 kHz. For the resonance peak, by setting two mass blocks, the sensitivity is significantly improved within the target frequency (such as within the range of 2 kHz to 15 kHz) near these two frequency points. When three mass blocks are placed on the same cantilever beam, the vibration sensor forms three resonance peaks. Specifically, the vibration sensor forms three resonance peaks at 2250 Hz, 7600 Hz and 15700 Hz, making the three frequencies The sensitivity within the target frequency (such as 1 kHz to 20 kHz) near the point is significantly improved, and the frequency response curve is naturally divided into three different frequency bands, which is beneficial to subsequent signal processing. Further, it can be seen from the figure that with the increase in the number of mass blocks, the overall sensitivity of the vibration sensor is also improved. For example, when the frequency response curve 1230 is in the low frequency band (such as below 1 kHz), its sensitivity is still high From the frequency response curve 1210 , it can be seen that after setting the plate structure and mass block reasonably, the bandwidth of the frequency band with higher sensitivity can be widened, and the sensitivity in the target frequency band can be improved.

In some embodiments of the present specification, there is also provided a sound input device, which includes the sensor in the foregoing embodiments, and the vibration signal is converted into an electrical signal by the sensor for further processing.

Fig. 13 is a schematic structural diagram of a vibration sensor according to some embodiments of the present disclosure.

As shown in FIG. 13 , the vibration sensor 1300 may be a specific implementation of the vibration sensor 100 in FIG. 1 . In some embodiments, the vibration sensor 1300 includes an acoustic transducer 1310 and a vibration component. The vibrating assembly includes a cantilever beam 1321 , a mass block 1323 , a diaphragm 1322 and a plurality of mass blocks 1324 in sequence in a direction away from the acoustic transducer 1310 in the conduction channel 1311 . In some embodiments, the vibrating membrane 1322 may be a gas-permeable membrane or an air-impermeable membrane. Exemplarily, the vibrating membrane 1322 is an air-impermeable membrane. In some embodiments, the cantilever beam 1321 can also be arranged on the side of the diaphragm 1322 away from the acoustic transducer 1310 , and in this embodiment, the diaphragm 1322 can be a gas-permeable membrane.

In some embodiments, the cantilever beam 1321 and the mass block 1323 may correspond to one resonance frequency; the diaphragm 1322 and the plurality of mass blocks 1324 may correspond to one or two resonance frequencies. In some embodiments, the above-mentioned three resonant frequencies can be set to be different, so that the frequency response curve of the vibration sensor under the action of the vibration component 1300 has three resonant peaks, thereby forming multiple high-sensitivity frequency intervals and Wider frequency band.

Fig. 14 is a schematic diagram of a modular structure of an earphone according to some embodiments of the present disclosure.

As shown in FIG. 14 , the earphone 1 includes a vibration system 10 for receiving vibration (such as picking up sound) for further processing. The vibration system 10 can be the vibration component 120 in the vibration sensor 100 in FIG. 1 .

Wherein, for other functional components in the earphone 1, please refer to the general earphone 1, and further description of the other functional components will not be given here.

In the above scheme, at least two resonant peaks can be formed on the frequency response curve through a reasonable vibrating element and design, thereby forming multiple high-sensitivity frequency ranges and wider frequency bands.

The basic concept has been described above, obviously, for those with ordinary knowledge in the field, the above invention disclosure is only used as an example, and does not constitute a limitation to this description. Although not expressly stated herein, various modifications, improvements and amendments to this specification may be made by those having ordinary skill in the art. Such modifications, improvements and corrections are suggested in this specification, so such modifications, improvements and corrections still belong to the spirit and scope of the exemplary embodiments of this specification.

Meanwhile, this specification uses specific words to describe the embodiments of this specification. For example, "one embodiment", "an embodiment" and/or "some embodiments" refer to a certain feature, structure or characteristic related to at least one embodiment of this specification. Therefore, it should be emphasized and noted that two or more references to "an embodiment" or "an embodiment" or "an alternative embodiment" in different places in this specification do not necessarily refer to the same embodiment . In addition, certain features, structures or characteristics in one or more embodiments of this specification may be properly combined.

In addition, those skilled in the art will appreciate that various aspects of this specification may be illustrated and described in several patentable categories or situations, including any new and useful process, machine, product or combination of substances or Any new and useful improvements to them. Correspondingly, various aspects of this specification may be entirely executed by hardware, may be entirely executed by software (including firmware, resident software, microcode, etc.), or may be executed by a combination of hardware and software. The above hardware or software may be referred to as "data block", "module", "engine", "unit", "component" or "system". Additionally, aspects of this specification may be embodied as a computer product comprising computer readable program code on one or more computer readable media.

In addition, unless it is clearly stated in the scope of patent application, the order of processing elements and sequences, the use of numbers and letters or the use of other names in this specification are not used to limit the sequence of processes and methods in this specification. While the foregoing disclosure discusses, by way of various examples, some embodiments of the invention that are presently believed to be useful, it should be understood that such details are for illustrative purposes only and that the scope of the appended claims is not limited to the disclosed embodiments. The scope of the patent is intended to cover all modifications and equivalent combinations consistent with the spirit and scope of the embodiments of the present disclosure. For example, although the above-described system components can be implemented by hardware devices, they can also be implemented by only software solutions, such as installing the described system on an existing server or mobile device.

In the same way, it should be noted that in order to simplify the expression disclosed in this specification so as to facilitate the understanding of one or more embodiments of the invention, in the foregoing description of the embodiments of the disclosure, sometimes multiple features are combined into one implementation examples, drawings or descriptions thereof. However, this method of disclosure does not imply that the subject matter of this specification requires more features than those mentioned in the claims. Indeed, embodiment features are less than all features of a single foregoing disclosed embodiment.

In some embodiments, numbers describing the quantity of components and attributes are used. It should be understood that such numbers used in the description of the embodiments use modifiers such as "about", "approximately" or "substantially" in some examples. to modify. Unless otherwise stated, "about", "approximately" or "substantially" indicates that the stated figure allows for a variation of ±20%. Accordingly, in some embodiments, the numerical data used in the specification and claims are approximations that may vary depending upon the desired characteristics of individual embodiments. In some embodiments, numerical data should take into account the specified number of significant digits and use the usual method of digit reservation. Although the numerical ranges and data used in some examples of the present disclosure to confirm the breadth of the scope thereof are approximations, in specific examples, such numerical values are set as precisely as practicable.

Finally, it should be understood that the embodiments described in the present invention are only used to illustrate the principles of the embodiments of the present invention. Other modifications are also possible within the scope of the present invention. Accordingly, by way of illustration and not limitation, alternative configurations of the embodiments of the present invention may be considered consistent with the teachings of the present invention. Accordingly, the embodiments of the present invention are not limited to the embodiments of the present invention explicitly shown and described.

1: Headphones 10: Vibration system 100: Vibration sensor 110: Converter 120: Vibration component 121: plate structure 122: mass block 200: vibration sensor 210: Acoustic Converter 220: Vibration components 221: Diaphragm 222: mass block 230: Support structure 320: Vibration components 321: Diaphragm 332: mass block 330: Support structure 420: Vibration components 421: Diaphragm 422: mass block 430: Support structure 520: vibration components 521: Diaphragm 522: mass block 620: Vibration components 622: mass block 700: Frequency Response Curve 710: Frequency response curve 720: Frequency response curve 820: Vibration components 821:Cantilever Beam 822: mass block 830:Support structure 920: Vibration components 921: cantilever beam 922: mass block 1022: mass block 1200: Frequency Response Curve 1210: Frequency response curve 1220: frequency response curve 1230: Frequency response curve 1300: Vibration sensor 1310: Acoustic Converter 1311: Inside the conduction channel 1321: cantilever beam 1322: Diaphragm 1323: mass block 1324: mass block

The invention will be further illustrated by way of exemplary embodiments which will be described in detail by means of the accompanying drawings. These examples are non-limiting, and in these examples, the same number indicates the same structure, wherein:

[ FIG. 1 ] is a schematic diagram of a modular structure of a vibration sensor according to some embodiments of the present disclosure;

[ FIG. 2 ] is a schematic structural diagram of a vibration sensor according to some embodiments of the present disclosure;

[ FIG. 3 ] is a schematic diagram of an exemplary vibrating assembly according to some embodiments of the present disclosure;

[FIG. 4A] to [FIG. 4C] are schematic diagrams of exemplary vibrating assemblies according to some embodiments of the present disclosure;

[FIG. 5A] to [FIG. 5B] are schematic diagrams of exemplary vibration assemblies according to some embodiments of the present disclosure;

[ FIG. 6 ] is a schematic diagram of an exemplary vibration assembly according to some embodiments of the present disclosure;

[ FIG. 7 ] is a schematic diagram of the frequency response curves of the vibration components in the vibration sensor with different numbers of mass blocks according to some embodiments of the present disclosure;

[FIG. 8A] to [FIG. 8C] are structural schematic diagrams of the vibration components of the vibration sensor according to some embodiments of the present disclosure;

[FIG. 9A] to [FIG. 9B] are structural schematic diagrams of vibration components of vibration sensors according to some embodiments of the present disclosure;

[ Fig. 10 ] is a schematic structural diagram of a vibration component of a vibration sensor according to some embodiments of the present disclosure;

[ Fig. 11 ] is a schematic structural diagram of a vibration component of a vibration sensor according to some embodiments of the present disclosure;

[ FIG. 12 ] is a schematic diagram of the frequency response curves of the vibration components in the vibration sensor with different numbers of mass blocks according to some embodiments of the present disclosure;

[ Fig. 13 ] is a schematic structural diagram of a vibration sensor according to some embodiments of the present disclosure; and

[ FIG. 14 ] is a schematic diagram of a modular structure of an earphone according to some embodiments of the present disclosure.

100: Vibration sensor

120: Vibration component

121: plate structure

122: mass block

110: Converter

Claims (13)

A vibration sensor comprising: converter; a vibrating component connected to the converter, the vibrating component is configured to transmit an external vibrating signal to the converter to generate an electrical signal, the vibrating component includes one or more plate structures and the one or more one or more masses physically connected to each of the plurality of plate-like structures; The vibration assembly is configured such that the sensitivity of the vibration sensor is greater than the sensitivity of the transducer in one or more target frequency bands. The vibration sensor according to claim 1, wherein the frequency response curve of the vibration sensor under the action of the vibration component has a plurality of resonance peaks. The vibration sensor according to claim 1, wherein said one or more masses connected to one of said one or more planar structures comprises at least two masses; and said at least two The proof masses differ in at least one structural parameter including size, mass, density and shape. The vibration sensor according to claim 1, wherein the vibration component further includes a support structure for supporting the plate structure, the support structure is physically connected to the converter, and the plate structure is connected to the the supporting structure. The vibration sensor according to claim 3, wherein the one plate structure and at least two mass blocks physically connected to the one plate structure correspond to multiple target frequency bands in the target frequency band, so that in the The sensitivity of the vibration sensor in the corresponding multiple target frequency bands is greater than the sensitivity of the converter. The vibration sensor according to claim 5, wherein the one plate structure and at least two masses physically connected to the one plate structure have multiple resonance frequencies, at least one of the multiple resonance frequencies is less than The resonant frequency of the transducer is such that the sensitivity of the vibration sensor is greater than the sensitivity of the transducer in a plurality of the one or more target frequency bands. The vibration sensor according to claim 1, wherein at least one of the one or more plate structures includes a diaphragm; and in the vibration direction of the diaphragm, the projection area of the one or more masses is located at within the projected area of the diaphragm. The vibration sensor according to claim 1, wherein at least one of said one or more plate-like structures comprises a cantilever beam; and The one or more mass blocks connected with the cantilever beam are arranged at the free end of the cantilever beam. The vibration sensor according to claim 8, wherein the one or more masses connected to the cantilever beam are collinearly arranged with the cantilever beam. As the vibration sensor of claim 1, wherein: The converter also includes a conductive channel; and The vibration component is arranged in the conduction channel along the radial section of the conduction channel; or, The vibrating component is arranged on the outside of the conduction channel. The vibration sensor according to claim 10, wherein at least one of the one or more plate-like structures has a through hole; or, at least one of the one or more plate-like structures The conduction channel is not completely covered. The vibration sensor according to claim 10, wherein the plate-shaped structure of the one or more plate-shaped structures which is farthest from the converter is configured to close the conduction channel. An audio input device, comprising the vibration sensor described in any one of claims 1 to 12 above.

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