RU2793293C1 - Microphone - Google Patents

Abstract

FIELD: acoustics; microphones.

SUBSTANCE: microphone may include: a shell and a vibration sensing portion, wherein the vibration sensing portion may vibrate in response to vibration of the shell; the vibration transmission portion may be configured to transmit vibration from the vibration receiving portion; and an electroacoustic conversion component configured to receive the vibration transmitted by the vibration transmission portion to generate an electrical signal, wherein the vibration transmission portion and at least a portion of the vibration receiving portion may form a vacuum cavity, and the electroacoustic conversion component may be disposed in the vacuum cavity.

EFFECT: reduced effect of air on microphone sensitivity, reduced noise.

10 cl, 22 dwg

Description

The technical field to which the invention belongs

The present invention relates to the field of sound transmission devices and, in particular, to a microphone.

State of the art

A microphone is a transducer that converts audio signals into electrical signals. Taking an air conduction microphone as an example, an external audio signal enters the acoustic cavity of the air conduction microphone through a hole portion on the shell structure and is transmitted to the electroacoustic conversion component. The electro-acoustic conversion component generates a vibration based on the audio signal and converts the vibration signal into an electrical output signal. The acoustic cavity of the microphone contains a gas (eg, air) under a certain pressure, which may cause a relatively loud noise in the process of transmitting an audio signal to the electro-acoustic conversion component through the acoustic cavity of the microphone, and degrade the quality of the sound output from the microphone. On the other hand, when the electro-acoustic conversion component of the microphone receives an audio signal and generates vibration, the electro-acoustic conversion component may be subjected to friction with the gas contained in the acoustic cavity, thereby increasing the air damping in the acoustic cavity of the microphone and decreasing the Q value (quality factor) of the microphone.

Therefore, it is desirable to provide a microphone with low background noise and a high Q value.

The essence of the invention

An embodiment of the present invention may be a microphone. The microphone may include a sheath and a vibration sensing portion configured to vibrate in response to vibration of the sheath; the vibration transmission portion may be configured to transmit vibration from said vibration receiving portion; and an electro-acoustic conversion component configured to receive the vibration transmitted by the vibration transmission portion to generate an electric signal, where the vibration transmission portion and at least part of the vibration receiving portion can form a vacuum cavity, and the electro-acoustic conversion component can be located in the vacuum cavity.

In some embodiments of the invention, the degree of vacuum (pressure) in the vacuum cavity may be less than 100 Pa.

In some embodiments of the invention, the degree of vacuum in the vacuum cavity may be 10 ^-6 Pa - 100 Pa.

In some embodiments of the invention, the area of perception of vibration and the shell may form at least one acoustic cavity and at least one acoustic cavity may contain the first acoustic cavity; the shell may contain at least one hole and at least one hole may be located on the side wall of the shell corresponding to the first acoustic cavity, and at least one hole may connect the first acoustic cavity with the external environment; wherein the vibration sensing portion may vibrate in response to an external sound signal transmitted through the at least one aperture, and the electro-acoustic conversion component may receive the vibration of the vibration sensing portion to generate an electrical signal.

In some embodiments, the vibration sensing portion may comprise a first vibration sensing portion and a second vibration sensing portion arranged from top to bottom, the vibration transmission portion may be tubular and positioned between the first vibration sensing portion and the second vibration sensing portion; and the vibration transmission portion, the first vibration sensing portion and the second vibration sensing portion may form a vacuum cavity, wherein the first vibration sensing portion and the second vibration sensing portion may be attached to the shell through their peripheral sides, wherein at least a portion of the first vibration sensing portion vibrations and a portion of the second vibration sensing region may vibrate in response to an external audio signal.

In some embodiments, the first vibration sensing portion or the second vibration sensing portion may comprise an elastic portion and a fixed portion; wherein the fixed portion of the first vibration sensing portion, the fixed portion of the second vibration sensing portion, and the vibration transmission portion may form a vacuum cavity; and the elastic section can be attached between the stationary section and the inner wall of the shell, while the elastic section can vibrate in response to an external sound signal.

In some embodiments of the invention, the rigidity of the fixed section may be greater than the rigidity of the elastic section.

In some embodiments of the invention, the Young's modulus of the fixed section may be greater than 50 GPa.

In some embodiments of the invention, the microphone may further comprise a reinforcement located on the upper surface or on the lower surface of the first vibration sensing region and the second vibration sensing region corresponding to the vacuum cavity.

In some embodiments, the vibration sensing portion may comprise a first vibration sensing portion, a second vibration sensing portion, and a third vibration sensing portion, wherein the first vibration sensing portion and the second vibration sensing portion may be arranged opposite each other in a top-down direction, the vibration transmission portion may be in the form of a tube and located between the first vibration sensing portion and the second vibration sensing portion, and the vibration transmission portion, the first vibration sensing portion, and the second vibration sensing portion may form a vacuum cavity; and a third vibration sensing portion may be connected between the vibration transmission portion and the inner wall of the shell, wherein the third vibration sensing portion may vibrate in response to an external sound signal.

In some embodiments, the stiffness of the first vibration sensing region and the stiffness of the second vibration sensing region may be greater than the stiffness of the third vibration sensing region.

In some embodiments, the Young's modulus of the first vibration sensing region and the Young's modulus of the second vibration sensing region may be greater than 50 GPa.

In some embodiments of the invention, the electroacoustic conversion component may comprise a cantilever beam, where one end of the cantilever beam can be attached to the inner wall of the vibration transmission site, and the other end of the cantilever beam can be suspended in a vacuum cavity, where the cantilever beam can be deformed based on the vibration signal, to convert the vibration signal into an electrical signal.

In some embodiments of the invention, the cantilever beam may include a first electrode layer, a piezoelectric layer, a second electrode layer, an elastic layer, and a substrate layer; wherein the first electrode layer, the piezoelectric layer, and the second electrode layer may be arranged in a downward direction; the elastic layer may be located on the upper surface of the first electrode layer or on the lower surface of the second electrode layer, and the substrate layer may be located on the upper surface or on the lower surface of the elastic layer.

In some embodiments of the invention, the cantilever beam may include at least one elastic layer, an electrode layer, and a piezoelectric layer; moreover, at least one elastic layer may be located on the surface of the electrode layer; the electrode layer may include a first electrode and a second electrode, where the first electrode may be in the form of a comb, forming the first comb; the second electrode may be in the form of a comb, forming a second comb; the first comb and the second comb may together form an electrode layer; the electrode layer may be located on the upper surface or on the lower surface of the piezoelectric layer; and the first comb and the second comb may extend in the length direction of the cantilever beam.

In some embodiments of the invention, the electroacoustic conversion component may comprise a first cantilever beam and a second cantilever beam, wherein the first cantilever beam and the second cantilever beam may be located opposite each other and there may be a first gap between the first cantilever beam and the second cantilever beam, wherein the first gap between the first cantilever beam and the second cantilever beam may vary depending on the vibration signal to convert the vibration signal into an electrical signal.

In some embodiments of the invention, one end of the first cantilever beam and the second cantilever beam, corresponding to the electroacoustic conversion component, can be attached to the inner wall on the peripheral side of the vibration transmission section, and the other end of the first cantilever beam and the second cantilever beam can be freely suspended in the vacuum cavity .

In some embodiments of the invention, the stiffness of the first cantilever beam may be different from the stiffness of the second cantilever beam.

In some embodiments of the invention, the microphone may include at least one film structure and at least one film structure may be located on the top surface and/or on the bottom surface of the electro-acoustic conversion component.

In some embodiments of the invention, at least one film structure may completely or partially cover the top surface and/or bottom surface of the electroacoustic conversion component.

In some embodiments of the invention, the microphone may comprise at least one support element, wherein one end of at least one support element can be connected to the first vibration sensing site of the specified vibration sensing site, the other end of at least one support element can be connected to the second a vibration receiving portion of said vibration receiving portion, and there may be a second gap between the free end of the electroacoustic conversion component and the support member.

Brief description of the drawings

The present invention is further illustrated in terms of exemplary embodiments. These exemplary embodiments of the invention are described in detail with reference to the drawings. These embodiments of the invention are not restrictive, in these embodiments the same reference numeral represents the same structural element, while:

fig. 1 is a construction of a microphone in accordance with some embodiments of the present invention;

fig. 2 is another design of a microphone in accordance with some embodiments of the present invention;

fig. 3 is a spring-mass-damper system of an electro-acoustic conversion component according to some embodiments of the present invention;

fig. 4 is a normalization of the displacement resonance curve of a spring-mass-damper system according to some embodiments of the present invention;

fig. 5 is a construction of a microphone in accordance with some embodiments of the present invention;

fig. 6 is a construction of a microphone in accordance with some embodiments of the present invention;

fig. 7 is a construction of a microphone in accordance with some embodiments of the present invention;

fig. 8A is a cross-sectional view along the line A-A of the microphone shown in FIG. 5;

fig. 8B is a cross-sectional view, taken along a line perpendicular to the line A-A, of the microphone shown in FIG. 5;

fig. 9A shows a cantilever beam distribution in accordance with some embodiments of the present invention;

fig. 9B is a cantilever beam distribution in accordance with some embodiments of the present invention;

fig. 10 is a construction of a microphone in accordance with some embodiments of the present invention;

fig. 11 is a frequency response of a microphone in accordance with some embodiments of the present invention;

fig. 12 is a construction of a microphone in accordance with some embodiments of the present invention;

fig. 13 is a construction of a microphone in accordance with some embodiments of the present invention;

fig. 14 is a construction of a microphone in accordance with some embodiments of the present invention;

fig. 15 is a construction of a microphone in accordance with some embodiments of the present invention;

fig. 16 is a construction of a microphone in accordance with some embodiments of the present invention;

fig. 17 is a construction of a microphone in accordance with some embodiments of the present invention;

fig. 18A is a cross-sectional view of a microphone in accordance with some embodiments of the present invention;

fig. 18B is a cross-sectional view of a microphone in accordance with some embodiments of the present invention;

fig. 19A is a cross-sectional view of a microphone in accordance with some embodiments of the present invention;

fig. 19B is a cross-sectional view of a microphone in accordance with some embodiments of the present invention;

fig. 20 is a microphone design in accordance with some embodiments of the present invention;

fig. 21 is a construction of a microphone in accordance with some embodiments of the present invention; And

fig. 22 is a construction of a microphone in accordance with some embodiments of the present invention.

Detailed description of the invention

In order to illustrate the technical solutions associated with the embodiments of the present invention, the following is a brief explanation of the drawings referred to in the description of the embodiments of the invention. Obviously, the drawings described below are only some examples or embodiments of the present invention. Those skilled in the art can apply the present invention to other similar scenarios in accordance with these drawings without further creative effort. Unless otherwise apparent or indicated from herein or elsewhere, reference numerals represent like structural elements or operations throughout the drawings.

It should be understood that the term "system", "device", "unit" and/or "module" as used herein is one way of distinguishing different components, elements, parts or assemblies of different levels. However, if the same goal can be achieved with other words, these expressions can be replaced by other expressions.

As used in the disclosure and in the appended claims, the singular forms include the plural unless the content clearly indicates otherwise. Generally speaking, the terms "comprise" and "include" merely serve to suggest the need for the presence of explicitly identified steps and elements, and these steps and elements do not constitute an exclusive list. The methods or devices may also contain other steps or elements.

The flowcharts used in the present disclosure demonstrate the operations that systems implement in accordance with some embodiments of the present invention. It should be clearly understood that the previous operation or subsequent operation is not necessarily performed in exactly the same order. Instead, the operations may be carried out in reverse order or simultaneously. In addition, one or more other steps may be added to these flowcharts. Also, one or more steps may be removed from these flowcharts.

The flowcharts used in the present disclosure illustrate the operations that systems implement in accordance with some embodiments of the present invention. It should be clearly understood that the preceding or subsequent operations are not necessarily performed in exactly the same order. On the other hand, the operations can be carried out in reverse order or simultaneously. In addition, one or more other operations may be added to the flowchart. Also, one or more steps may be removed from the flowcharts.

The present invention characterizes a microphone. The microphone may be a transducer that converts an audio signal into an electrical signal. In some embodiments, the microphone may be a moving coil microphone, a ribbon microphone, a capacitive microphone, a piezoelectric microphone, an electret microphone, an electromagnetic microphone, a carbon microphone, and the like. or any combination of them. In some embodiments of the invention, differing in the means of obtaining sound, the microphone may include a bone conduction microphone and an air conduction microphone. The microphone described in the embodiments of the present invention may include a shell, a vibration receiving portion, a vibration transmission portion, and an electro-acoustic conversion component. The shell may be configured to accommodate a vibration receiving portion, a vibration transmission portion, and an electro-acoustic conversion component. In some embodiments, the shell may be hollow inside. The shell itself can form an acoustic cavity. The vibration sensing portion, the vibration transmission portion, and the electro-acoustic conversion component may be located in the acoustic cavity of the shell. In some embodiments of the invention, the area of perception of vibration may be attached to the side wall of the shell. The vibration sensing region may vibrate in response to an external audio signal transmitted to the shell. In some embodiments, the vibration transmission portion may be coupled to the vibration sensing portion. The vibration transmission portion may receive the vibration of the vibration sensing portion and transmit the vibration signal to the electro-acoustic conversion component. The electroacoustic conversion component can convert the vibration signal into an electrical signal. In some embodiments, the vibration transmission portion and at least a portion of the vibration receiving portion (eg, the fixed portion) may form a vacuum cavity. The electroacoustic conversion component may be located in the vacuum cavity. The electro-acoustic conversion component in the microphone provided in embodiments of the present invention may be located in a vacuum cavity, and the vacuum cavity may be formed by a vibration receiving portion and a vibration transmission portion. An external sound signal can be introduced into the acoustic cavity of the shell through a hole, causing the air in the acoustic cavity to vibrate. The vibration sensing portion and the vibration transmission portion can transmit vibration to the electro-acoustic conversion component located in the vacuum cavity, avoiding contact of the electro-acoustic conversion component with air in the acoustic cavity, and further solving the problem of the impact of air vibration in the acoustic cavity during operation of the electro-acoustic conversion component, that is, the problem relatively high level of microphone background noise. On the other hand, the electroacoustic conversion component may be located in the vacuum cavity to help avoid friction of the electroacoustic conversion component with the gas during the vibration process, thus reducing air damping in the vacuum cavity of the microphone and improving the Q value of the microphone.

In FIG. 1 is a schematic representation of the construction of a microphone in accordance with some embodiments of the present invention. As shown in FIG. 1, microphone 100 may include a shell 110, an electro-acoustic conversion component 120, and a processor 130. Microphone 100 may create deformation and/or displacement based on an external signal such as an acoustic signal (e.g., a sound wave), a mechanical vibration signal, or the like. The deformation and/or displacement may be further converted into an electrical signal by the electro-acoustic conversion component 120 of the microphone 100. In some embodiments, the microphone 100 may be an air conduction microphone, a bone conduction microphone, or the like. An air conduction microphone may refer to a microphone in which the sound wave is transmitted through air. A bone conduction microphone may refer to a microphone in which a sound wave is transmitted in the body (eg through a bone) through mechanical vibration.

The shell 110 may be hollow inside. Shell 110 may itself form acoustic cavity 140. Electroacoustic conversion component 120 and processor 130 may be located within acoustic cavity 140. In some embodiments, shell 110 material may comprise, but is not limited to, one or more metals, alloys, polymers. (for example, acrylonitrile butadiene styrene copolymer, polyvinyl chloride, polycarbonate, polypropylene, etc.). In some embodiments, one or more openings 111 may be present on the side wall of the enclosure 110. One or more openings 111 may introduce an external audio signal into the acoustic cavity 140. In some embodiments, an external audio signal may be introduced into the acoustic cavity 140 of the microphone 100 of holes 111 and cause the air in the acoustic cavity 140 to vibrate. The electro-acoustic conversion component 120 can receive the vibration signal and convert the vibration signal into an electrical output signal.

The electro-acoustic conversion component 120 may be used to convert an external signal into a target signal. In some embodiments, the electroacoustic conversion component 120 may have a layered structure. In some embodiments of the invention, at least a portion of the layered structure may be physically connected to the shell. The word “join” as used in this disclosure can be understood as a connection between different parts of the same structure or, after preparation of various parts or structures, the individual parts or structures are rigidly connected by welding, riveting, clamping, bolting, adhesive bonding and etc. or during the preparation process, the first component or structure is placed on the second component or structure by physical deposition (eg, physical vapor deposition) or chemical deposition (eg, chemical vapor deposition). In some embodiments, at least a portion of the laminate may be attached to the side wall of the shell. For example, the layered structure may be a cantilever beam. The cantilever beam may be in the form of a plate. One end of the cantilever beam can be attached to the side wall where the shell cavity is located, and the other end of the cantilever beam is not connected or in contact with the base, so the other end of the cantilever beam is freely suspended in the shell cavity. As another example, a microphone may include a vibrating diaphragm layer (also referred to as a vibration sensing region). The vibration receiving portion may be rigidly attached to the shell. The layered structure may be located on the top surface or on the bottom surface of the vibration receiving portion. It should be noted that the words "located in the cavity" or "freely suspended in the cavity" referred to in the present disclosure of the invention, may mean freely suspended in the internal volume, below or above the cavity. In some embodiments, the electroacoustic conversion component 120 may also be coupled to the shell 110 via other components (eg, a vibration receiving portion, a vibration transmitting portion).

In some embodiments of the invention, the layered structure may include a vibration unit and an acoustic transducer unit. The vibration block can be a section of a layered structure that is subjected to deformation under the influence of an external force. The vibration block can be used to transfer the deformation caused by an external force to the acoustic transducer block. The acoustic transducer block may be a portion that, in a layered structure, converts the deformation of the vibration block into an electrical signal. Namely, an external sound signal may be introduced into the acoustic cavity 140 through the openings 111, causing the air in the acoustic cavity 140 to vibrate. . It should be noted that the description of the vibration unit and the acoustic transducer unit is presented here only for the purpose of presenting the principle of operation of the layered structure and does not limit the actual composition and configuration of the layered structure. In fact, the vibration unit may not be needed and its function can be fully realized by the acoustic transducer unit. For example, after making a certain change in the design of the acoustic transducer block, the acoustic transducer block can directly respond to the vibration of the base to generate an electrical signal.

In some embodiments of the invention, the vibration block and the acoustic transducer block may be superimposed on each other, forming a layered structure. The acoustic transducer block may be located on the top layer of the vibration block. The acoustic transducer block may also be located on the bottom layer of the vibration block.

In some embodiments of the invention, the acoustic transducer block may comprise at least two electrode layers (eg, a first electrode layer and a second electrode layer) and a piezoelectric layer. The piezoelectric layer may be located between the first electrode layer and the second electrode layer. A piezoelectric layer can refer to a structure that creates a voltage at the ends of its two surfaces when they are subjected to an external force. In some embodiments, the piezoelectric layer may generate a voltage under the strain stress of the vibration block, and the first electrode layer and the second electrode layer may remove the voltage (ie, electrical signal).

The processor 130 may receive an electrical signal from the electro-acoustic conversion component 120 and perform signal processing. In some embodiments, processor 130 may be directly connected to electroacoustic conversion component 120 by wire 150 (eg, gold wire, copper wire, aluminum wire, etc.). In some embodiments, signal processing may include a frequency control process, an amplitude control process, a filtering process, a noise cancellation process, and the like. In some embodiments, the processor 130 may include, but is not limited to, a microcontroller, a microprocessor, an application-specific integrated circuit (ASIC), an application-specific instruction-set processor (ASIP), a central processing unit (central processing unit, CPU), physical processor unit (PPU), digital signal processor (digital signal processor, DSP), field-programmable gate array (FPGA), advanced RISC machine (advanced RISC machine, ARM), programmable logic device (PLD), etc. or other types of processing devices or processors.

In some embodiments, when microphone 100 is used as an air conduction microphone (e.g., air conduction microphone), acoustic cavity 140 may be acoustically coupled to the outside of microphone 100 through openings 111 such that acoustic cavity 140 contains a gas (e.g., air). ) under a certain pressure. When the sound signal is transmitted from the holes 111 through the acoustic cavity 140 to the electro-acoustic conversion component 120, the air in the acoustic cavity 140 creates a vibration. When this vibration is applied to the electroacoustic conversion component 120 to cause vibration, it may result in a high level of background noise of the microphone 100. cavity 140, which increases the air damping within the acoustic cavity 140, thus reducing the Q value of the microphone 100. In order to solve the above problems, embodiments of the present invention may provide a microphone, and the specific contents of the microphone will be discussed next.

In FIG. 2 shows the construction of a microphone in accordance with some embodiments of the present invention. As shown in FIG. 2, the microphone 200 may include a shell 210, an electro-acoustic conversion component 220, and a processor 230. The microphone 200 shown in FIG. 2 may be the same or similar to the microphone 100 shown in FIG. 1. For example, the shell 210 of the microphone 200 may be the same or similar as the shell 110 of the microphone 100. As another example, the electro-acoustic conversion component 220 of the microphone 200 may be the same or similar to the electro-acoustic conversion component 120 of the microphone 100. For other components of the microphone 200 (for example, processor 230, conductor 270, etc.) may be referred to in FIG. 1 and to its corresponding description.

In some embodiments, the difference between the microphone 200 and the microphone 100 may be that the microphone 200 may also include a vibration sensing portion 260. The vibration sensing portion 260 may be located within the acoustic cavity of the shell 210. The peripheral side of the vibration sensing portion 260 may be attached to the sidewall of the shell 210, thereby dividing the acoustic cavity into a first acoustic cavity 240 and a second acoustic cavity 250. In some embodiments, the microphone 200 may include one or more holes 211. The holes 211 may be located on the side wall of the shell 210 corresponding to the first acoustic cavity 240. The holes 211 may connect the first acoustic cavity 240 to the external environment of the microphone 200. An external audio signal may enter the first acoustic cavity 240 through the holes 211 and cause the air in the first acoustic cavity 240 to vibrate. The vibration sensing portion 260 can sense the air vibration in the first acoustic cavity 240 and transmit the vibration signal to the electro-acoustic conversion component 220. The electro-acoustic conversion component 220 may receive the vibration signal from the vibration sensing portion 260 and convert the vibration signal into an electrical signal.

In some embodiments, the material of the vibration receiving portion 260 may include, but is not limited to, one or more semiconductor materials, metals, metal alloys, organic materials, and the like. In some embodiments, the semiconductor materials may include, but are not limited to, silicon, silicon dioxide, silicon nitride, silicon carbide, and the like. In some embodiments, the metals may include, but are not limited to, copper, aluminum, chromium, titanium, gold, and the like. In some embodiments, metal alloys may include, but are not limited to, copper-aluminum alloy, copper-gold alloy, titanium alloy, aluminum alloy, and the like. In some embodiments, the implementation of organic materials may contain, but are not limited to, polyimide, perylene, polydimethylsiloxane (polydimethylsiloxane, PDMS), silica gel, quartz, and the like. In some embodiments, the design of the vibration receiving portion 260 may be in the form of a plate, a columnar form, or the like.

In some embodiments, electroacoustic conversion component 220 and processor 230 may be located in second acoustic cavity 250. Second acoustic cavity 250 may be a vacuum cavity. In some embodiments, the electroacoustic transducer component 220 may be located in the second acoustic cavity 250, which avoids the electroacoustic transducer component 220 from contacting the air in the second acoustic cavity 250, thereby solving the problem of the effect of air vibration in the second acoustic cavity 250 during the electroacoustic process. conversion of the electro-acoustic conversion component 220, that is, solving the problem of increased background noise of the microphone 200. On the other hand, the electro-acoustic conversion component 220 may be located in the second acoustic cavity 250, which can help avoid friction between the electro-acoustic conversion component 220 and the air in the second acoustic cavity 250 during vibration, thereby reducing air damping in the second acoustic cavity 250 and improving the Q value of the microphone 200. In some embodiments, the degree of vacuum (pressure) in the second acoustic cavity 250 may be below 100 Pa. In some embodiments, the degree of vacuum in the second acoustic cavity 250 may be from 10 ^-6 Pa to 100 Pa. In some embodiments, the degree of vacuum in the second acoustic cavity 250 may be in the range of 10 ^-7 Pa - 100 Pa.

To facilitate understanding of the operation of the electro-acoustic transducer component, in some embodiments, the electro-acoustic transducer component of a microphone may be roughly represented by a spring-mass-damper equivalent. During operation of the microphone, the spring-mass-damper system may vibrate under the influence of an excitation source (for example, vibration of the vibration sensing area). In FIG. 3 is a schematic representation of a spring-mass-damper system of an electroacoustic transducer component in accordance with some embodiments of the present invention. As shown in FIG. 3, the spring-mass-damper system can move according to the differential equation (1):

where M is the mass of the spring-mass-damper system, x is the displacement of the spring-mass-damper system, R is the damping coefficient of the spring-mass-damper system, K is the coefficient of elasticity of the spring-mass-damper system, F is the amplitude of the exciting force and ω is the circular frequency of the external force.

The differential equation (1) can be solved to obtain the steady state bias (2):

x = x _a cos(ωt - θ) … (2)

- выходное смещение, Z - механический импеданс и θ - фаза колебаний. where x is the deformation of the spring-mass-damping system, which is equal to the output value of the electrical signal during microphone operation, x _a in the expression

is the output offset, Z is the mechanical impedance, and θ is the oscillation phase.

The normalization of the relationship A between offset and amplitude can be described as Equation (3):

where x_a0 = F/K - displacement amplitude at steady state (or displacement amplitude when ω = 0), f/f₀= ω/ω₀ - the ratio of the frequency of the external force to the frequency of natural oscillations, ω₀ = K/M - circular frequency of oscillations, Q_m = ω₀M/R - mechanical quality factor.

In FIG. 4 is a schematic representation of an exemplary normalization of resonant displacement curves of a spring-mass-damper system in accordance with some embodiments of the present invention. The horizontal axis indicates the ratio of the actual oscillation frequency of the spring-mass-damper system to the natural frequency of the spring-mass-damper system, while the vertical axis indicates the normalized displacement of the spring-mass-damper system. It should be understood that each of the curves in FIG. 4 respectively denotes the displacement resonance curve of the spring-mass-damper system with different parameters. In some embodiments, the microphone may generate an electrical signal based on the relative displacement between the electroacoustic transducer element and the sheath. For example, an electret microphone can generate an electrical signal in response to a change in the distance between the deformed diaphragm and the substrate. As another example, a cantilevered bone conduction microphone can generate an electrical signal based on an inverse piezoelectric effect caused by a deformable cantilever. In some embodiments, the greater the displacement resulting from deformation of the cantilever beam, the greater the electrical signal generated by the microphone may be. As shown in FIG. 4, when the actual vibration frequency of the spring-mass-damper system is the same or approximately the same as the natural frequency of the spring-mass-damper system (i.e., when the ratio (ω/ω ₀ ) between the actual vibration frequency of the spring-mass system -damper and the natural frequency of the spring-mass-damper system is equal to or approximately equal to 1), then the greater the normalized displacement of the spring-mass-damper system, the narrower the bandwidth at the level of -3 dB (which is understood here as the resonant frequency range) can be resonant peak on the resonant displacement characteristic. In accordance with the above equation (3), the larger the normalized displacement of the spring-mass-damper system, the larger the Q value of the microphone.

In FIG. 5 is a schematic representation of a microphone in accordance with some embodiments of the present invention. As shown in FIG. 5, the microphone 500 may include a shell 510, an electro-acoustic conversion component 520, a vibration sensing portion 522, and a vibration transmission portion 523, wherein the shell 510 may be configured to include a vibration sensing portion 522, a vibration transmission portion 523, and an electro-acoustic conversion component 520. In some embodiments, shell 510 may have a regular shape (eg, cube, cylinder, frustocone, etc.) or other irregular shape. In some embodiments, the shell 510 may be a hollow member. The shell 510 itself forms an acoustic cavity. The vibration sensing portion 522, the vibration transmission portion 523, and the electro-acoustic conversion component 520 may be located in the acoustic cavity. In some embodiments, sheath material 510 may include, but is not limited to, one or more metals, alloys, and polymers (eg, styrene butadiene acrylonitrile copolymer, polyvinyl chloride, polycarbonate, polypropylene, etc.). In some embodiments, the peripheral side of the vibration receiving portion 522 may be connected to the side wall of the shell 510, thereby dividing the acoustic cavity formed by the shell 510 into multiple cavities, which may include a first acoustic cavity 530 and a second acoustic cavity 540.

In some embodiments of the invention, holes 511 may be provided on the side wall of the shell 510 corresponding to the first acoustic cavity 530. The holes 511 may be located in the first acoustic cavity 530 and direct an external sound signal into the first acoustic cavity 530. the signal may enter the first acoustic cavity 530 of the microphone 500 through the openings 511 and cause the air in the first acoustic cavity 530 to vibrate. Section 522 of the perception of vibration can capture the vibration signal of the air and transmit the vibration signal to the component 520 electro-acoustic conversion. The electro-acoustic conversion component 520 can receive an air vibration signal and convert the vibration signal into an electrical output signal.

In some embodiments, the vibration sensing portion 522 may comprise a first vibration sensing portion 5221 and a second vibration sensing portion 5222 arranged in series from top to bottom. The first vibration sensing portion 5221 and the second vibration sensing portion 5222 may be attached to the shell structure through their peripheral sides. At least a portion of the first vibration sensing portion 5221 and the second vibration sensing portion 5222 may vibrate in response to an audio signal input by the microphone 500 through openings 511. In some embodiments, the material of the vibration sensing portion 522 may include, but is not limited to, one or several semiconductor materials, metal materials, metal alloys, organic materials, etc. In some embodiments, the semiconductor materials may include, but are not limited to, silicon, silicon dioxide, silicon nitride, silicon carbide, and the like. In some embodiments, the metallic materials may include, but are not limited to, copper, aluminium, chromium, titanium, gold, etc. In some embodiments, metal alloys may include, but are not limited to, copper-aluminum alloy, copper-gold alloy, titanium alloy, aluminum alloy, and so on. In some embodiments, the organic materials may include, but are not limited to, polyimide, perylene, PDMS, silicone gel, silicone, etc. In some embodiments, the vibration receiving portion 522 may be a flat structure, a columnar structure, and so on.

In some embodiments, the vibration sensing portion 522 may comprise a resilient portion and a fixed portion. For example, in FIG. 6 schematically shows the construction of a microphone in accordance with some embodiments of the present invention. As shown in FIG. 6, the first vibration receiving section 5221 may include a first elastic section 52211 and a first fixed section 52212. so that the first elastic section 52211 can be attached between the first fixed section 52212 and the inner wall of the shell 510. The second section 5222 vibration perception may include a second elastic section 52221 and a second fixed section 52222. One end of the second elastic section 52221 can be attached to the side wall of the shell 510, and the other end of the second elastic section 52221 can be attached to the second fixed section 52222, so that the second elastic section 52221 can be attached between the second fixed section 52222 and the inner wall of the shell 510.

In some embodiments, the vibration transmission portion 523 may be located between the first vibration perception portion 5221 and the second vibration perception portion 5222. The top surface of the vibration transmission section 523 may be connected to the bottom surface of the first vibration perception section 5221. The bottom surface of the vibration transmission section 523 may be connected to the top surface of the second vibration perception section 5222. Namely, the vacuum cavity 550 may be formed between the vibration transmission portion 523, the first fixed portion 52212 of the first vibration sensing portion 5221, and the second fixed portion 52222 of the second vibration sensing portion 5222. The electro-acoustic conversion component 520 may be disposed in the vacuum cavity 550. Namely, one end of the electro-acoustic conversion component 520 may be connected to the inner side wall of the vibration transmission portion 523, and the other end of the electro-acoustic conversion component 520 may be freely suspended in the vacuum cavity 550. In some embodiments, the vibration sensed by the vibration sensing portion 522 (e.g., the first elastic portion 52211 of the first vibration sensing portion 5221 and the second elastic portion 52221 of the second vibration sensing portion 5222) may be transmitted to the electroacoustic conversion component 520 via the vibration transmission portion 523. In some embodiments, the material of vibration transmission portion 523 may include, but is not limited to, one or more semiconductor materials, metallic materials, metal alloys, organic materials, and the like. In some embodiments, the materials of the vibration transmission portion 523 and the material of the vibration receiving portion 522 may be the same or different. In some embodiments, the vibration transmission portion 523 and the vibration receiving portion 522 may be a single structure. In some embodiments, the vibration transmission portion 523 and the vibration receiving portion 522 may be relatively independent structures. In some embodiments, the vibration transmission portion 523 may be a structure of regular shape (eg, tube, ring, quadrilateral, pentagon, etc.) and/or irregular polygonal shape.

The electro-acoustic conversion component 520 may be located in the vacuum cavity 550 so that contact between the electro-acoustic conversion component 520 and the air in the vacuum cavity 550 can be avoided, thereby solving the problem of the effect of air vibration in the vacuum cavity 550 during the vibration process of the electro-acoustic conversion component 520, and further the problem of high background noise of the microphone 500 is solved. On the other hand, the electroacoustic conversion component 520 can be located in the vacuum cavity 550, which can help to avoid friction between the electroacoustic conversion component 520 and the air in the vacuum cavity 550 to reduce air damping in the vacuum cavity 550 and improving the Q value of the microphone 500. To improve the output effect of the microphone 500, in some embodiments, the degree of vacuum in the vacuum cavity 550 may be less than 100 Pa. In some embodiments, the degree of vacuum in vacuum cavity 550 may be in the range of 10 ^-6 Pa - 100 Pa. In some embodiments, the degree of vacuum in vacuum cavity 550 may be in the range of 10 ^-7 Pa - 100 Pa.

In some embodiments, the material of the first fixed portion 52212 and the material of the second fixed portion 52222 may be different from the material of the first elastic portion 52211 and the material of the second elastic portion 52221. For example, in some embodiments, the stiffness of the fixed portion for the vibration receiving portion 522 may be greater than the stiffness of the elastic section, that is, the stiffness of the first fixed section 52212 may be greater than the stiffness of the first elastic section 52211 and/or the stiffness of the second fixed section 52222 may be greater than the stiffness of the second elastic section 52221. The first elastic section 52211 and/or the second elastic section 52221 may vibrate in response to an external audio signal and transmit the vibration signal to electro-acoustic conversion component 520. The first fixed portion 52212 and the second fixed portion 52222 may have relatively high rigidity to ensure that the vacuum cavity 550 formed between the first fixed portion 52212, the second fixed portion 52222, and the vibration transmission portion 523 is not subjected to external air pressure. In some embodiments, to ensure that the vacuum cavity 550 is not affected by external air pressure, the Young's modulus of the fixed portion (e.g., first fixed portion 52212 and second fixed portion 52222) of the vibration receiving portion 522 may be greater than 60 GPa. In some embodiments, the Young's modulus of the fixed portion (eg, first fixed portion 52212, second fixed portion 52222) of the vibration receiving portion 522 may be greater than 50 GPa. In some embodiments, the Young's modulus of the fixed portion (eg, first fixed portion 52212, second fixed portion 52222) of the vibration receiving portion 522 may be greater than 40 GPa.

In some embodiments of the invention, to make sure that the vacuum cavity is not subjected to atmospheric air pressure, the microphone may also contain a reinforcement. The hardener may be disposed on the upper surface or on the lower surface of the vibration receiving portion corresponding to the vacuum cavity, thereby improving the rigidity of the vibration receiving portion corresponding to the vacuum cavity. Just for example, in Fig. 7 shows the construction of a microphone in accordance with some embodiments of the present invention. As shown in FIG. 7, the microphone 500 may also include a reinforcement 560. The reinforcement 560 may be located on the upper surface or on the lower surface of the vibration receiving portion 522 corresponding to the vacuum cavity 550. Namely, the reinforcement 560 may be located on the lower surface of the first vibration receiving portion 5211 and on the upper surface of the second section 5222 vibration perception, respectively, and the peripheral side of the component 560 reinforcement can be connected to the inner wall of the section 523 vibration transmission. In some embodiments, reinforcement 560 may be a plate, post, or the like. The hardener 560 can be adaptively adjusted according to the shape and structure of the vibration transmission portion 523. It should be noted that the position of the hardener 560 cannot be limited to the interior of the vacuum cavity 550 shown in FIG. 7, it can also be located in other places. For example, the reinforcement 560 may also be located outside the vacuum cavity 550. Namely, the reinforcement 560 may be located on the upper surface of the first vibration sensing portion 5221 and on the lower surface of the second vibration sensing portion 5222. As another example, the hardener 560 may also be located inside and outside the vacuum cavity 550 at the same time. Namely, the hardener 560 may be located on the upper surface of the first vibration sensing portion 5221 and on the upper surface of the second vibration sensing portion 5222, or the hardener 560 may be located on the upper surface of the first vibration sensing portion 5221 and on the lower surface of the second vibration sensing portion 5222, or a reinforcement 560 may be located on the lower surface of the first vibration sensing portion 5221 and on the lower surface of the second vibration sensing portion 5222, or the reinforcement 560 may be located on the lower surface of the first vibration sensing portion 5221 and on the upper surface of the second vibration sensing portion 5222, or the reinforcement 560 may be located on the top surface and on the bottom surface of the first section 5221 vibration perception and on the top surface and on the bottom surface of the second section 5222 vibration perception. The location of the reinforcement 560 cannot be limited to the above description, and any configuration of the reinforcement 560 that can render the vacuum cavity unpressurized by atmospheric air falls within the protection scope of the present invention.

In some embodiments of the invention, to ensure that the vacuum cavity 550 is not affected by the pressure of atmospheric air, the stiffness of the hardener 560 may be greater than the stiffness of the section 522 vibration perception. In some embodiments, the Young's modulus of hardener 560 may be greater than 60 GPa. In some embodiments, the Young's modulus of hardener 560 may be greater than 50 GPa. In some embodiments, the Young's modulus of the hardener 560 may be greater than 40 GPa. In some embodiments, the reinforcement material 560 may include, but is not limited to, one or more semiconductor materials, metallic materials, metal alloys, organic materials, and the like. In some embodiments, the semiconductor materials may include, but are not limited to, silicon, silicon dioxide, silicon nitride, silicon carbide, and the like. In some embodiments, metallic materials may include, but are not limited to, copper, aluminum, chromium, titanium, gold, and the like. In some embodiments, metal alloys may include, but are not limited to, copper-aluminum alloys, copper-gold alloys, titanium alloys, aluminum alloys, and the like. In some embodiments, organic materials may include, but are not limited to, polyimide, perylene, polydimethylsiloxane (PDMS), silica gel, quartz, and the like.

The air pressure inside the vacuum cavity 550 can be much lower than the air pressure outside the vacuum cavity 550. By installing the hardener 560 in the first vibration receiving portion 5221 and/or in the second vibration receiving portion 5222 corresponding to the vacuum cavity 550, it can be ensured that the vacuum cavity 550 will not be affected by the pressure of the air outside. It should also be understood that the rigidity of the first vibration receiving portion 5221 and the second vibration receiving portion 5222 corresponding to the vacuum cavity 550 can be improved by installing a hardener 560 to avoid deformation of the vibration receiving portion 522 corresponding to the vacuum cavity 550 due to the difference between air pressure outside and air pressure inside the vacuum cavity 550, ensuring that the volume of the vacuum cavity 550 remains substantially constant during operation of the microphone 500. Thus, the normal operation of the electro-acoustic conversion component 520 in the vacuum cavity 550 can be ensured. 523 vibration transmission and electro-acoustic conversion component 520 520) requires a sealing device so that the degree of vacuum in the vacuum cavity 550 is in the required range.

It should be noted that in an alternative embodiment, the vibration sensing portion 522 may comprise only the first vibration sensing portion 5221, and the first vibration sensing portion 5221 may be attached to the shell 510 through its peripheral side. Component 520 electro-acoustic conversion can be directly or indirectly attached to the first section 5221 perception of vibration. For example, the electro-acoustic conversion component 520 may be located on the top surface or on the bottom surface of the first vibration perception portion 5221. As another example, electroacoustic conversion component 520 may be coupled to first vibration sensing component 5221 via other structures (eg, via vibration transmission portion 523). The first vibration sensing portion 5221 may vibrate in response to an audio signal input to the microphone 500 through the openings 511. The electro-acoustic conversion component 520 may convert the vibration of the first vibration sensing portion 5221 or the vibration transmitting portion 523 into an electrical signal.

In some embodiments of the invention, one or more electroacoustic conversion components may be present. In some embodiments, a plurality of electroacoustic conversion components 520 may be spaced apart along the inner wall of the vibration transmission portion 523. It should be noted that the distribution of the gaps here may be such that they run along a horizontal direction (perpendicular to the A-A direction shown in Fig. 5) or a vertical direction (A-A direction shown in Fig. 5). For example, when the vibration transmission portion 523 is in the form of a ring, the plurality of electro-acoustic conversion components 520 may be distributed from top to bottom in the vertical direction at intervals. In FIG. 8A is a sectional view taken along the line A-A of the microphone shown in FIG. 5. As shown in FIG. 8A, multiple electroacoustic conversion components 520 may be distributed sequentially along the inner wall of the vibration transmission portion 523 at intervals and arranged in the same plane or approximately parallel in the horizontal direction. In FIG. 8B is a schematic cross-sectional view of the microphone shown in FIG. 5 in a direction perpendicular to line A-A. As shown in FIG. 8B, in the horizontal direction, the fixed ends of each electro-acoustic conversion component 520 may be distributed along the annular inner wall of the vibration transmission portion 523 at intervals. The stationary end of the electroacoustic conversion component 520 and the vibration transmission portion 523 may be approximately vertical. The other end of the electroacoustic conversion component 520 (also referred to as the free end) extends to the center of the vibration transmission portion 523 and can be freely suspended in the vacuum cavity 550 so that the electroacoustic conversion components 520 can be distributed in a circle in the horizontal direction. In some embodiments, when the vibration transmission portion 523 is in the form of a polygonal tube (e.g., triangular, pentagonal, hexagonal, etc.), the fixed ends of a plurality of electroacoustic conversion components 520 may also be spaced apart on each side wall of the transmission portion 523 vibrations in the horizontal direction. In FIG. 9A shows the distribution of electro-acoustic conversion components along the horizontal direction in accordance with some embodiments of the present invention. As shown in FIG. 9A, the vibration transmission portion 523 may be rectangular in shape, and a plurality of electro-acoustic conversion component components 520 may be alternately distributed on the four side walls of the vibration transmission portion 523. In FIG. 9B shows the distribution of electro-acoustic conversion components in accordance with some embodiments of the present invention. As shown in FIG. 9B, the vibration transmission portion 523 may be shaped like a hexagon, and a plurality of electro-acoustic conversion components 520 may be alternately distributed on the six side walls of the vibration transmission portion 523. In some embodiments, a plurality of electroacoustic conversion components 520 may be spaced apart along the inner wall of the vibration transmission portion 523 to improve space utilization of the vacuum cavity 550, thereby reducing the overall volume of the microphone 500.

It should be noted that in the horizontal direction or in the vertical direction, the distribution of the electro-acoustic conversion components 520 is not limited to distribution at intervals along all the inner walls of the vibration transmission portion 523. A plurality of electroacoustic conversion components 520 may also be located along a single sidewall or sidewall portion of vibration transmission portion 523, or a plurality of electroacoustic conversion components 520 may be located in the same horizontal plane. For example, the vibration transmission portion 523 may be cube-shaped and the array of electro-acoustic conversion components 520 may be simultaneously located on one side wall, on two opposite or adjacent side walls, or on any three side walls of the cubic structure. The distribution of the plurality of electroacoustic conversion components 520 can be adaptively adjusted according to the number or size of the vacuum cavity 550, and is not further limited here.

In some embodiments, the electroacoustic conversion component 520 may comprise a cantilever beam. One end of the cantilever beam may be attached to the inner wall of the vibration transmission section 523, and the other end of the cantilever beam may be freely suspended in the vacuum cavity 550.

In some embodiments, the cantilever beam may include a first electrode layer, a piezoelectric layer, a second electrode layer, an elastic layer, and a substrate layer. The first electrode layer, the piezoelectric layer, and the second electrode layer may be arranged in a downward direction. The elastic layer may be located on the upper surface of the first electrode layer or on the lower surface of the second electrode layer. The backing layer may be located on the upper surface or on the lower surface of the elastic layer. In some embodiments of the invention, an external audio signal may be introduced into the first acoustic cavity 530 of the microphone 500 through the openings 511 and cause the air in the first acoustic cavity 530 to vibrate. electroacoustic transformation component 520 (for example, a cantilever beam) through the vibration transmission section 523 so that the elastic layer in the cantilever beam is deformed by the vibration signal. In some embodiments of the invention, the piezoelectric layer may generate an electrical signal based on the deformation of the elastic layer. The first electrode layer and the second electrode layer can pick up an electrical signal. In some embodiments, the piezoelectric layer may generate a voltage (potential difference) based on the piezoelectric effect in response to the strain stress of the elastic layer, and the first electrode layer and the second electrode layer may ultimately receive a voltage (electrical signal).

In some embodiments of the invention, the cantilever beam may also contain at least one elastic layer, an electrode layer, and a piezoelectric layer. At least one elastic layer may be located on the surface of the electrode layer, and the electrode layer may be located on the upper surface or on the lower surface of the piezoelectric layer. In some embodiments, the electrode layer may comprise a first electrode and a second electrode. The first electrode and the second electrode may be in the form of a comb, forming a first comb and a second comb, respectively. The first comb and the second comb may include a combination of comb teeth. There may be a certain distance between adjacent teeth of the first comb and there may be a certain distance between adjacent teeth of the second comb, respectively, and the distances may be the same or different. The first comb and the second comb may together form an electrode layer. Additionally, the teeth of the first comb may extend into the gaps of the second comb to collectively form the electrode layer. The first comb and the second comb can cooperate with each other so that the first electrode and the second electrode can be arranged compactly but do not overlap. In some embodiments of the invention, the first comb and the second comb may extend in the direction of the length of the cantilever beam (for example, in the direction from the fixed end to the free end).

In some embodiments, the elastic layer may be a film-like structure or a block-like structure supported by one or more semiconductor materials. In some embodiments, the semiconductor material(s) may include, but are not limited to, silicon, silicon dioxide, silicon nitride, gallium nitride, zinc oxide, silicon carbide, and the like. In some embodiments, the piezoelectric layer material may comprise a piezoelectric crystalline material and a piezoelectric ceramic material. Piezoelectric crystal material refers to a piezoelectric single crystal. In some embodiments, the piezoelectric crystalline material may comprise rock crystal, sphalerite, boracite, tourmaline, zincite, gallium arsenide, barium titanate and its derivative structural crystal, KH ₂ PO ₄ (potassium dihydrogen phosphate crystal), NaKC ₄ H ₄ O ₆ 4H ₂ O (Rochelle salt), etc. or any combination of them. Piezoelectric ceramic material refers to a kind of piezoelectric polycrystal, which is formed by an irregular set of fine-grained powders obtained by solid-state reaction and powder sintering of various materials. In some embodiments, the piezoelectric ceramic material may contain barium titanate (BT), lead zirconate titanate (PZT), lead barium lithium niobate (PBLN), modified lead titanate PT), aluminum nitride (AIN), zinc oxide (zinc oxide, ZnO), etc. or any combination thereof.In some embodiments, the material of the piezoelectric layer may also be a piezoelectric polymer material, such as polyvinylidene fluoride (fluoride polyvinylidene, PVDF).In some embodiments, the first electrode layer and the second electrode layer may be of conductive material construction.Exemplary conductive material may be metal, metal alloy, metal oxide, graphene, etc., or any combination thereof.In some embodiments, implementation of metal materials and alloys may contain nickel, iron, lead, platinum, titanium, copper, molybdenum, zinc, or any combination thereof. In some embodiments, the metal alloys may comprise a copper-zinc alloy, a copper-tin alloy, a copper-nickel-silicon alloy, a copper-chromium alloy, a copper-silver alloy, and the like. or any combination of them. In some embodiments, the metal oxides may comprise ruthenium(IV) oxide (RuO ₂ ), manganese dioxide (MnO ₂ ), lead dioxide (PbO ₂ ), nickel (II) oxide (NIO), and the like. or any combination of them.

In some embodiments of the invention, the cantilever beam may also contain a layer that connects the electrode to the outlet (for example, a pad layer). The layer connecting the electrode to the tap may be located on the first electrode layer and the second electrode layer, and connect the first electrode layer and the second electrode layer to the external circuit by connecting with an external conductor (for example, gold wire, aluminum wire, etc.) to output the voltage signal between the first and second electrode layers to the remote data processing device. In some embodiments, the material of the layer connecting the electrode to the tap may comprise copper foil, titanium, copper, and the like. In some embodiments of the invention, the material of the layer connecting the electrode to the tap and the material of the first electrode layer (or the second electrode layer) may be the same. In some embodiments of the invention, the material of the layer connecting the electrode to the tap and the material of the first electrode layer (or the second electrode layer) may be different.

In some embodiments of the invention, by setting the parameter of the cantilever beam (e.g., length, width, height, material, etc. of the cantilever beam), different cantilever beams can have different resonant frequencies, respectively, thus generating different frequency responses for vibration signals section 523 vibration transmission. For example, by setting different cantilever beam lengths, cantilever beams with different lengths can have different resonant frequencies. A plurality of resonant frequencies corresponding to cantilever beams of various lengths may be in the range of 100 Hz - 12000 Hz. Since the cantilever beam is sensitive to vibration near its resonant frequency, the cantilever beam can be considered to have a frequency selective response to the vibration signal, i.e. the cantilever beam can mainly convert a vibration signal in a subband around its resonant frequency into an electrical signal. Therefore, in some embodiments of the invention, different cantilever beams can have different resonant frequencies by setting different lengths so that subbands are formed near each resonant frequency. For example, in the human speech frequency band, 11 subbands can be set using a plurality of cantilever beams. The resonant frequencies of the cantilever beams corresponding to these 11 subbands can be 500 Hz - 700 Hz, 700 Hz - 1000 Hz, 1000 Hz - 1300 Hz, 1300 Hz - 1700 Hz, 1700 Hz - 2200 Hz, 2200 Hz - 3000 Hz, 3000 Hz - 3800 Hz, 3800 Hz - 4700 Hz, 4700 Hz - 5700 Hz, 5700 Hz - 7000 Hz and 7000 Hz - 12000 Hz, respectively. It should be noted that the number of subbands set in the human speech frequency range by the cantilever beam can be adjusted in the application scenario of the microphone 500, which is not further limited here.

In FIG. 10 shows the construction of a microphone in accordance with some embodiments of the present invention. As shown in FIG. 10, the microphone 1000 may include a shell 1010, an electro-acoustic conversion component 1020, a vibration sensing portion 1022, and a vibration transmission portion 1023. Microphone 1000 shown in FIG. 10 may be the same or similar to the microphone 500 shown in FIG. 5 and 6. For example, the shell 1010 of the microphone 1000 may be the same or similar to the shell 510 of the microphone 500. As another example, the first acoustic cavity 1030, the second acoustic cavity 1040, and the vacuum cavity 1050 of the microphone 1000 may be the same or similar to the first acoustic cavity 530. , the second acoustic cavity 540, and the vacuum cavity 550 of the microphone 500, respectively. As a further example, the vibration sensing portion 1022 (e.g., the first vibration sensing portion 10221, such as the first elastic portion 102211, the first fixed portion 102212, and the second vibration sensing portion 10222, such as the second elastic portion 102221, the second fixed portion 102222) of the microphone 1000 may be the same or similar to the vibration receiving portion 522 (e.g., the first vibration receiving portion 5221, such as the first elastic portion 52211, the first fixed portion 52212, and the second vibration receiving portion 5222, such as the second elastic portion 52221, the second fixed portion 52222) microphone 500. Additional components of the microphone 1000 (eg, openings 1011, vibration transmission portion 1023, etc.) are shown in FIG. 5 and 6 and their accompanying descriptions.

In some embodiments of the invention, the main difference between the microphone 1000 shown in FIG. 10 and microphone 500 shown in FIG. 5 may be that the electro-acoustic transformation component 1020 of the microphone 1000 may comprise a first cantilever beam 10211 and a second cantilever beam 10212. The first cantilever beam 10211 and the second cantilever beam 10212 can here be considered as two electrode plates. The fixed ends of the first cantilever beam 10211 and the second cantilever beam 10212 corresponding to the electroacoustic conversion component 1020 can be attached to the inner wall of the vibration transmission portion 1023, and the other ends (also called free ends) of the first cantilever beam 10211 and the second cantilever beam 10212 can be freely suspended in vacuum cavity 1050. In some embodiments of the invention, the first cantilever beam 10211 and the second cantilever beam 10212 may be located opposite each other and the first cantilever beam 10211 and the second cantilever beam 10212 may have areas facing each other. In some embodiments of the invention, the first cantilever beam 10211 and the second cantilever beam 10212 may be located vertically. In this case, the areas facing each other can be understood as areas in which the bottom surface of the first cantilever beam 10211 is opposite the top surface of the second cantilever beam 10212. In some embodiments of the invention, the first cantilever beam 10211 and the second cantilever beam 10212 may have a first gap d1 . After receiving the vibration signal from the vibration transmission section 1023, the first cantilever beam 10211 and the second cantilever beam 10212 can form different degrees of deformation in their vibration direction (i.e., in the direction of the first gap d1), so that the first gap d1 changes. The first cantilever beam 10211 and the second cantilever beam 10212 can convert the received vibration signal of the vibration transmission portion 1023 into an electrical signal based on the change in the first gap d1.

In order to cause the first cantilever beam 10211 and the second cantilever beam 10212 to form a deformation of varying degrees in the direction of vibration, in some embodiments, the stiffness of the first cantilever beam 10211 and the stiffness of the second cantilever beam 10212 may be different. Under the action of the vibration signal of the vibration transmission section 1023, the cantilever beam with less rigidity may deform to a certain extent, and the cantilever beam with higher rigidity, as can be approximately assumed, does not deform or deforms to a lesser extent than the cantilever beam with less rigidity. In some embodiments, during operation of the microphone 1000, a lower stiffness cantilever (e.g., second cantilever 10212) may deform in response to vibration from the vibration transmission portion 1023, and a more stiff cantilever (e.g., first cantilever 10211) may vibrate with by the vibration transmission unit 1023 without being deformed, so that the first gap d1 is changed.

In some embodiments, the resonant frequency of the lower stiffness cantilever beam in electroacoustic conversion component 1020 may be in the human ear frequency range (eg, within 12,000 Hz). In some embodiments, the resonant frequency of the stiffer cantilever beam in electroacoustic conversion component 1020 may be in a frequency range that is insensitive to the human ear (eg, above 12,000 Hz). In some embodiments, the stiffness of the first cantilever 10211 (or second cantilever 10212) in electroacoustic conversion component 1020 can be achieved by adjusting the material, length, width, or thickness of the first cantilever 10211 (or second cantilever 10212). In some embodiments of the invention, different frequency responses corresponding to different resonant frequencies can be obtained by adjusting the parameters of each group of cantilever beams corresponding to the electro-acoustic conversion component 1020 (eg, material, thickness, length, width, etc. of the cantilever beam).

In FIG. 11 shows frequency response curves of a microphone in accordance with some embodiments of the present invention. As shown in FIG. 11, the horizontal axis indicates the frequency expressed in Hz, and the vertical axis indicates the frequency response data of the microphone audio output signal expressed in dB. The microphone here may be microphone 500, microphone 1000, microphone 1200, microphone 1300, microphone 1500, microphone 1600, microphone 1700, microphone 2000, microphone 2100, microphone 2200, etc. The dotted lines in Fig. 11 may refer to the respective frequency response curves of each electro-acoustic conversion component of the microphone. According to the frequency response curves in FIG. 11, each electro-acoustic conversion component may have its own resonant frequency (eg, the resonant frequency of the frequency response curve 1120 is approximately 350 Hz, and the resonant frequency of the frequency response curve 1130 is approximately 1500 Hz). When an external audio signal is transmitted to a microphone, the various electroacoustic transducer components may be differently sensitive to the vibration signal near their own resonant frequencies. Therefore, the electrical signal generated at the output of each electro-acoustic transducer component may mainly contain a subband signal corresponding to its resonant frequency. In some embodiments of the invention, the output signal at the resonant peak of each electroacoustic transducer component may be much larger than the output signal in the flat region of its characteristic. By selecting a frequency band near the resonant peak on the frequency response curve of each electro-acoustic conversion component, a division of the frequencies of the entire signal band corresponding to the audio signal into subbands can be realized. In some embodiments, a flatter microphone frequency response curve 1110 with a higher signal-to-noise ratio may be obtained by combining the frequency response curves in FIG. 11. In addition, resonant peaks in different frequency ranges can be added to a microphone system by installing various electro-acoustic conversion components (e.g., cantilever beams), which improves microphone sensitivity near multiple resonant peaks and further improves microphone sensitivity over the entire wide band.

Filtering and decomposing vibration signals into frequency bands can be achieved by installing a plurality of electroacoustic transducer components in a microphone and using the characteristics of electroacoustic transducer components (e.g., cantilever beams) with different resonant frequencies, avoiding the problems of signal distortion and noise addition caused by the complexity of the filtering circuit in the microphone and high utilization of computing resources of software algorithms and achieving further reduction in the complexity and cost of manufacturing a microphone.

In FIG. 12 shows a microphone in accordance with some embodiments of the present invention. As shown in FIG. 12, the microphone 1200 may include a shell 1210, an electro-acoustic conversion component 1220, a vibration transmission portion 1223, and a vibration sensing portion 1222. Microphone 1200 shown in FIG. 12 may be the same or similar to the microphone 500 shown in FIG. 5 and 6. For example, the shell 1210 of the microphone 1200 may be the same or similar as the shell 510 of the microphone 500. As another example, the first acoustic cavity 1230, the second acoustic cavity 1240, and the vacuum cavity 1250 of the microphone 1200 may be the same or similar to the first acoustic cavity. 530, second acoustic cavity 540, and vacuum cavity 550 of microphone 500, respectively. As another example, the vibration sensing portion 1222 (e.g., the first vibration sensing portion 12221, such as the first elastic portion 122211, the first fixed portion 122212, and the second vibration sensing portion 12222, such as the second elastic portion 122221, the second fixed portion 122222) of the microphone 1200 may be the same or similar to the vibration sensing portion 522 (e.g., the first vibration sensing portion 5221, such as the first elastic portion 52211, the first fixed portion 52212, and the second vibration sensing portion 5222, such as the second elastic portion 52221, the second fixed portion 52222) of the microphone 500 See FIG. 5 and 6 and their respective descriptions.

In some embodiments of the invention, the main difference between the microphone 1200 shown in FIG. 12 and the microphone 500 shown in FIG. 5 may be that the microphone 1200 may also include one or more films 1260. In some embodiments, the film 1260 may be located on the top surface and/or on the bottom surface of the electro-acoustic conversion component 1220. For example, film 1260 may be a single layer film and film 1260 may be located on the top surface or on the bottom surface of electroacoustic conversion component 1220. As another example, film 1260 may have a two layer structure. The film 1260 may include a first film located on the top surface of the electroacoustic conversion component 1220 and a second film located on the bottom surface of the electroacoustic conversion component 1220. The resonant frequency of the electro-acoustic conversion component 1220 can be adjusted by placing the film 1260 on the surface of the electro-acoustic conversion component 1220. In some embodiments, the resonant frequency of electroacoustic conversion component 1220 can be influenced by adjusting the material, size (such as length, width), thickness, etc., of film 1260. On the one hand, parameter information (such as material, size , thickness, etc.) of the film 1260 and the electroacoustic transducer component 1220 (eg, cantilever beam) can be adjusted so that each electroacoustic transducer component 1220 can generate a resonance in the desired frequency range. On the other hand, the film 1260 can be positioned on the surface of the electroacoustic conversion component 1220, thus avoiding damage to the electroacoustic conversion component 1220 caused by the overload mode of the microphone 1200, thus improving the reliability of the microphone 1200.

In some embodiments, the film 1260 may fully or partially cover the top surface and/or bottom surface of the electroacoustic conversion component 1220. For example, the top surface or bottom surface of each electro-acoustic conversion component 1220 may be covered by a respective film 1260, where the film 1260 may completely cover the top surface or bottom surface of the respective electro-acoustic conversion component 1220, or the film 1260 may partially cover the top surface or bottom surface of the respective acoustic conversion component 1220. electroacoustic conversion. As another example, in the horizontal direction, when the plurality of acoustic transducer components 1220 are simultaneously located in the same horizontal plane, one film 1260 may cover all the top surfaces or lower surfaces of the plurality of acoustic transducer components 1220 in the same horizontal plane at the same time. For example, the film 1260 here may be attached to the inner wall of the vibration transmission portion 1223 through its peripheral side, thereby dividing the vacuum cavity 1250 into two mutually independent vacuum cavities. As another example, the shape of the film 1260 may be the same as the cross-sectional shape of the vibration transmission portion 1223. The film 1260 may be attached to the inner wall of the vibration transmission portion 1223 through its peripheral side, and the middle of the film 1260 may contain an opening (not shown in FIG. 12). The film 1260 may partially cover the top surface or the bottom surface of the electroacoustic conversion component assembly 1220 in the same horizontal plane at the same time, so that the vacuum cavity 1250 can be divided into two vacuum cavities connected at the top and bottom by the film 1260.

In some embodiments, the film material 1260 may include, but is not limited to, one or more semiconductor materials, metallic materials, metal alloys, organic materials, and the like. In some embodiments, the semiconductor materials may include, but are not limited to, silicon, silicon dioxide, silicon nitride, silicon carbide, and the like. In some embodiments, the metallic materials may include, but are not limited to, copper, aluminum, chromium, titanium, gold, and the like. In some embodiments, the metal alloy may include, but is not limited to, copper-aluminum alloy, copper alloy, titanium alloy, aluminum alloy, and the like. In some embodiments, the organic material may include, but is not limited to, polyimide, perylene, polydimethylsiloxane (PDMS), silica gel, quartz, and the like.

In FIG. 13 shows the construction of a microphone in accordance with some embodiments of the present invention. Microphone 1300 shown in FIG. 13 may be the same or similar to the microphone 1000 shown in FIG. 10. For example, first acoustic cavity 1330, second acoustic cavity 1340, and vacuum cavity 1350 of microphone 1300 may be the same or similar to first acoustic cavity 1030, second acoustic cavity 1040, and vacuum cavity 1050 of microphone 1000, respectively. As another example, the vibration sensing portion 1322 (e.g., the first vibration sensing portion 13221, such as the first elastic portion 132211, the first fixed portion 132212, and the second vibration sensing portion 13222, such as the second elastic portion 132221, the second fixed portion 132222) of the microphone 1300, may be the same or similar to the vibration sensing portion 1022 (e.g., the first vibration sensing portion 10221, such as the first elastic portion 102211, the first fixed portion 102212, and the second vibration sensing portion 10222, such as the second elastic portion 102221, the second fixed portion 102222) of the microphone See FIG. 10 and in the corresponding parts of the description.

In some embodiments of the invention, the main difference between the microphone 1300 shown in FIG. 13 and the microphone 1200 shown in FIG. 10 is that the microphone 1300 may also include one or more film structures 1360. In some embodiments, the film structure(s) 1360 may be located on the top surface and/or bottom surface of a cantilever beam (e.g. beam 13212) having a lower rigidity electro-acoustic conversion component 1320. For example, the film structure(s) 1360 may be a single layer and the film structure(s) 1360 may be located on the top surface or on the bottom surface of the second cantilever beam 13212. As another example, the film structure(s) 1360 may be two-layer and contain the first film structure on the upper surface of the second structure 13212 cantilever conductor and the second film structure on the bottom surface of the second structure 13212 cantilever conductor. In some embodiments, the film structure(s) 1360 may fully or partially cover the top surface and/or bottom surface of the second cantilever beam 13212. For example, the top surface or bottom surface of each second cantilever beam 13212 may be covered with a corresponding film structure 1360, which may completely cover the top surface or bottom surface of the respective second cantilever beam 13212, or the film structure 1360 may partially cover the top surface or bottom surface of the corresponding second cantilever beam 13212. bottom surface of second cantilever conductor structure 13212, see FIG. 12 and in its corresponding description.

In some embodiments of the invention, the film structure(s) 1360 may also be located on the top surface and/or on the bottom surface of the cantilever beam (eg, the first cantilever beam 13211) with greater rigidity of the electroacoustic conversion component 1320. The manner in which the film structure 1360 is located on the top surface and/or the bottom surface of the first cantilever beam 13211 may be similar to the way in which the film structure 1360 is located on the top surface and/or bottom surface of the second cantilever beam structure 13212, and here its description is not repeated.

In some embodiments of the invention, the film structure(s) 1360 may also simultaneously be located on the top surface and/or on the bottom surface of a cantilever beam (for example, the second cantilever beam 13212) with less rigidity and a cantilever beam (for example, the first cantilever beam 13211) with greater rigidity component 1320 electro-acoustic conversion 1320. For example, in FIG. 14 shows the construction of a microphone in accordance with some embodiments of the present invention. As shown in FIG. 14, film structure(s) 1360 may be located on the top surface of the first cantilever 13211 and on the bottom surface of the second cantilever 13212 at the same time. In some embodiments, the film structure(s) 1360 may be provided on the top surface and/or bottom surface of the high stiffness cantilever (e.g., first cantilever 13211) so that the high stiffness cantilever cannot deform relative to portion 1323 vibration transmission, and the sensitivity of the 1300 microphone could be improved.

It should be noted that the respective vibration sensing regions in the microphone 1000 shown in FIG. 10, microphone 1200 shown in FIG. 12 and microphone 1300 shown in FIG. 13 and FIG. 14 cannot be limited in ensuring the stability of the vacuum cavity by setting fixed sections and elastic sections with different stiffness. In some embodiments of the invention, the stability of the vacuum cavity can also be ensured by installing a reinforcement in the vibration receiving area corresponding to the vacuum cavity, and the reinforcement is described in FIG. 7 and in its corresponding description, which is not repeated here.

In FIG. 15 shows an exemplary construction of a microphone in accordance with some embodiments of the present invention. As shown in FIG. 15, the microphone 1500 may include a shell 1510, an electro-acoustic conversion component 1520, a vibration sensing portion 1522, and a vibration transmission portion 1523. Microphone 1500 shown in FIG. 15 may be the same or similar to the microphone 500 shown in FIG. 5. For example, first acoustic cavity 1530, second acoustic cavity 1540, and vacuum cavity 1550 of microphone 1500 may be the same or similar to first acoustic cavity 530, second acoustic cavity 540, and vacuum cavity 550 of microphone 500, respectively. See FIG. 5 and in its corresponding description.

In some embodiments of the invention, the main difference between the microphone 1500 shown in FIG. 15 and microphone 500 shown in FIG. 5 is in the vibration sensing portion 1522. In some embodiments, the vibration perception portion 1522 may comprise a first vibration perception portion 15221, a second vibration perception portion 15222, and a third vibration perception portion 15223. In some embodiments, the first vibration sensing portion 15221 and the second vibration sensing portion 15222 may be located opposite each other relative to the vibration transmission portion 1523, such that the vibration transmission portion 1523 may be located between the first vibration sensing portion 15221 and the second vibration sensing portion 15222. Namely, the bottom surface of the first section 15221 vibration transmission can be attached to the upper surface of the section 1523 vibration transmission and the upper surface of the second section 15222 perception of vibration can be attached to the bottom surface of the section 1523 vibration transmission. In some embodiments, the first vibration sensing portion 15221, the second vibration sensing portion 15222, and the vibration transmission portion 1523 may form a vacuum cavity 1550, and the electroacoustic conversion component 1520 may be located in the vacuum cavity 1550. In some embodiments, the third vibration sensing portion 15223 may be attached between the vibration transmission portion 1523 and the inner wall of the shell 1510. When the microphone 1500 is operated, an audio signal may be introduced into the first acoustic cavity 1530 through the openings 1511 and act on the vibration sensing portion 1522, causing the third vibration sensing portion 15223 to vibrate. The third section 15223 vibration perception can transmit vibration component 1520 electroacoustic conversion through section 1523 transmission of vibration.

In some embodiments of the invention, the third section 15223 vibration perception may contain one or more film structures. The film structures may adapt to the vibration transmission portion 1523 and to the shell 1510. For example, when the shell 1510 and vibration transmission portion 1523 are both cylindrical, the third vibration receiving portion 15223 may be an annular film structure. The outer wall on the peripheral side of the annular film structure may be attached to the shell 1510. The inner wall on the peripheral side of the annular film structure may be attached to the vibration transmission portion 1523. As another example, when the shell 1510 is cylindrical and the vibration transmission portion 1523 is cubic in shape, the third vibration receiving portion 15223 may be a circular film structure with a rectangular hole in the center. The outer wall of the film structure may be attached to the shell 1510. The inner wall of the film structure may be attached to the vibration transmission portion 1523. It should be noted that the shape of the third vibration receiving portion 15223 may not be limited to the aforementioned ring and rectangle, but may also be a film structure with other shapes such as regular shape (eg, pentagon, hexagon) and/or irregular shape. The shape and configuration of the third section 15223 vibration perception can be adaptively adjusted in accordance with the shape of the shell 1510 and section 1523 vibration transmission.

In some embodiments, the material of the third vibration perception portion 15223 may include, but is not limited to, one or more semiconductor materials, metallic materials, metal alloys, organic materials, and the like. In some embodiments, the semiconductor materials may be, but are not limited to, silicon, silicon dioxide, silicon nitride, silicon carbide, and the like. In some embodiments, the metallic materials may be, but are not limited to, copper, aluminum, chromium, titanium, gold, and the like. In some embodiments, metal alloys can be, but are not limited to, copper-aluminum alloy, copper-gold alloy, titanium alloy, aluminum alloy, and the like. In some embodiments, organic materials can be, but are not limited to, polyimide, perylene, polymethylsiloxane (PDMS), silica gel, quartz, and the like.

In some embodiments of the invention, the materials of the first section 15221 of the perception of vibration and the second section 15222 of the perception of vibration may differ from the material of the third section 15223 of the perception of vibration. For example, in some embodiments, the stiffness of the first section 15221 vibration perception and the rigidity of the second section 15222 vibration perception may be greater than the rigidity of the third section 15223 vibration perception. In some embodiments, the third vibration sensing portion 15223 may vibrate in response to an external audio signal and transmit the vibration signal to the electro-acoustic conversion component 1520. The first vibration sensing portion 15221 and the second vibration sensing portion 15222 may be more rigid to ensure that the vacuum cavity 1550 formed by the first vibration sensing portion 15221, the second vibration sensing portion 15222, and the vibration transmission portion 1523 will not be affected by outside air pressure. In some embodiments, to ensure that the vacuum cavity 1550 is not affected by outside air pressure, the Young's modulus of the first vibration sensing portion 15221 and the Young's modulus of the second vibration sensing portion 15222 may be greater than 60 GPa. In some embodiments of the invention, Young's modulus of the first vibration perception section 15221 and Young's modulus of the second vibration perception section 15222 may be greater than 50 GPa. In some embodiments of the invention, Young's modulus of the first vibration perception section 15221 and Young's modulus of the second vibration perception section 15222 may be greater than 40 GPa.

In some embodiments of the invention, to ensure that the vacuum cavity 1550 will not be affected by the pressure of the outside air, the microphone 1500 may also contain a hardener (not shown in the drawings), and the hardener can be located on the upper surface or on the lower surface of the area 1522 of perception vibration (for example, the first section 15221 of the perception of vibration and the second section 15222 of the perception of vibration) corresponding to the vacuum cavity 1550. Specifically, the hardener may be located on the lower surface of the first section 15221 of the perception of vibration and on the upper surface of the second section 15222 of the perception of vibration, respectively. The peripheral side of the hardener may be attached to the inner wall of the vibration transmission section 1523. For specific design content, position, material, etc. hardener, see fig. 7 and its corresponding description. In addition, the reinforcement may also be used in other embodiments of the present invention, such as the microphone 1600 shown in FIG. 16, microphone 1700 shown in FIG. 17, microphone 2000 shown in FIG. 20, microphone 2100 shown in FIG. 21 and the microphone 2200 shown in FIG. 22.

In some embodiments of the invention, the microphone 1500 may also include at least one film structure (not shown) located on the upper surface and/or on the lower surface of the electroacoustic conversion component 1520. See FIG. 1 for details of at least one film structure. 12 and in its corresponding description, which is not repeated here.

In FIG. 16 shows the construction of a microphone in accordance with some embodiments of the present invention. As shown in FIG. 16, the microphone 1600 may include a shell 1610, an electro-acoustic conversion component 1620, a vibration sensing portion 1622, and a vibration transmission portion 1623. Microphone 1600 shown in FIG. 16 may be the same or similar to the microphone 1000 shown in FIG. 10. For example, first acoustic cavity 1630, second acoustic cavity 1640, and vacuum cavity 1650 of microphone 1600 may be the same or similar to first acoustic cavity 1030, second acoustic cavity 1040, and vacuum cavity 1050 of microphone 1000, respectively. For additional microphone components 1600 (eg, shell 1610, opening 1611, vibration transmission portion 1623, electro-acoustic conversion component 1620, etc.), see FIG. 10 and in its corresponding description.

In some embodiments of the invention, the main difference between the microphone 1600 shown in FIG. 16 and the microphone 1000 shown in FIG. 10 may be in a vibration sensing portion 1622. In some embodiments, the implementation section 1622 of the perception of vibration may contain the first section 16221 of the perception of vibration, the second section 16222 of the perception of vibration and the third section 16223 of the perception of vibration. In some embodiments of the invention, the first section 16221 of the perception of vibration and the second section 16222 of the perception of vibration can be located opposite each other relative to the section 1623 of the transmission of vibration, so that the section 1623 of the transmission of vibration was located between the first section 16221 of the perception of vibration and the second section 16222 of the perception of vibration. Namely, the lower surface of the first section 16221 vibration perception can be attached to the upper surface of the section 1623 vibration transmission. The upper surface of the second section 16222 vibration perception can be attached to the bottom surface of the section 1623 transmission of vibration. In some embodiments, the first vibration sensing portion 16221, the second vibration sensing portion 16222, and the vibration transmission portion 1623 may form a vacuum cavity 1650. 1650.

In some embodiments, a third vibration perception portion 16223 may be connected between the vibration transmission portion 1623 and the inner wall of the shell 1610. When the microphone 1600 is in operation, an audio signal may be introduced into the first acoustic cavity 1630 through openings 1611 and act on the third vibration perception portion 16223, causing them to vibrate. The third section 16223 vibration perception can transmit vibration component 1620 electroacoustic conversion through section 1623 transmission of vibration. See FIG. 15 and in related descriptions, which are not repeated here.

In some embodiments of the invention, the microphone 1600 may also include at least one film structure (not shown) located on the upper surface and/or on the lower surface of the electroacoustic conversion component 1620. For more information on at least one film structure, see FIG. 12-14 and their respective description, which is not repeated here.

In FIG. 17 shows the construction of a microphone in accordance with some embodiments of the present invention. As shown in FIG. 17, the microphone 1700 may include a shell 1710, an electro-acoustic conversion component 1720, a vibration sensing portion 1722, and a vibration transmission portion 1723. Microphone 1700 shown in FIG. 17 may be the same or similar to the microphone 1500 shown in FIG. 15. For example, first acoustic cavity 1730, second acoustic cavity 1740, and vacuum cavity 1750 of microphone 1700 may be the same or similar to first acoustic cavity 1530, second acoustic cavity 1540, and cavity 1550 of microphone 1500, respectively. As another example, the vibration sensing portion 1722 (e.g., the first vibration sensing portion 17221, the second vibration sensing portion 17222, and the third vibration sensing portion 17223) of the microphone 1700 may be the same or similar to the vibration sensing portion 1522 (e.g., the first vibration sensing portion 15221, second vibration sensing portion 15222 and third vibration sensing portion 15223) of the microphone 1500. Additional components of the microphone 1700 (eg, shell 1710, apertures 1711, vibration transmission portion 1723, electro-acoustic conversion component 1720, etc.) are shown in FIG. 15 and in its corresponding description.

In some embodiments of the invention, the main difference between the microphone 1700 shown in FIG. 17 and microphone 1500 shown in FIG. 15 may be that the microphone 1700 may also include one or more support elements 1760. In some embodiments of the invention, the support element(s) 1760 may be in the vacuum cavity 1750. The upper surface of the support element(s) 1760 may be attached to the bottom surface of the first section 17221 vibration perception. The lower surface of the support element(s) 1760 can be attached to the upper surface of the second section 17222 vibration perception. On the one hand, by installing the support element(s) 1760 in the vacuum cavity 1750 and connecting it to the first section 17221 of the perception of vibration and the second section of the perception of vibration, respectively, the rigidity of the first section 17221 of the perception of vibration and the rigidity of the second section 17222 of the vibration perception can be further increased . Therefore, the first vibration sensing portion 17221 and the second vibration sensing portion 17222 cannot be deformed due to the influence of air vibration in the first acoustic cavity 1730. Additionally, the vibration modes of the internal devices (for example, the first vibration sensing portion 17221 and the second vibration sensing portion 17222) of the microphone 1700 may be reduced. At the same time, the support member(s) 1760 can increase the stiffness of the first vibration receiving portion 17221 and the stiffness of the second vibration receiving portion 17222, and can further ensure that the volume of the vacuum cavity 1750 remains substantially constant so that the degree of vacuum in the vacuum cavity 1750 can be in the desired range (e.g., less than 100 Pa), thereby reducing the effect of air damping in the vacuum cavity 1750 on the electro-acoustic conversion component 1729 and improving the Q value of the microphone 1700. Alternatively, support member(s) 1760 may be attached to the first section 17221 of the perception of vibration and the second section 17222 of the perception of vibration, respectively, which can also improve the reliability of the microphone 1700 when overloaded.

In some embodiments, the shape of the support member 1760 may be regular (eg, plate, cylinder, frustocone, cube, hexagon, etc.) and/or irregular. In some embodiments, the material of the support member(s) 1760 may include, but is not limited to, one or more semiconductor materials, metallic materials, metal alloys, organic materials, and the like. In some embodiments, the semiconductor materials may include, but are not limited to, silicon, silicon dioxide, silicon nitride, silicon carbide, and the like. In some embodiments, the metallic materials may include, but are not limited to, copper, aluminum, chromium, titanium, gold, and the like. In some embodiments, metal alloys may include, but are not limited to, copper-aluminum alloy, copper-gold alloy, titanium alloy, aluminum alloy, and the like. In some embodiments, organic materials may include, but are not limited to, polyimide, perylene, polydimethylsiloxane (PDMS), silica gel, quartz, and the like.

As shown in FIG. 17, in some embodiments of the invention, the second gap d2 between the free end (i.e., the end freely suspended in the vacuum cavity 1750) of the electroacoustic conversion component 1720 and the support member(s) 1760 may be at least 2 µm to prevent collision component 1720 electroacoustic conversion with reference element(s) 1760 during vibration. At the same time, when the second gap d2 is small (for example, the second gap d2 is not larger than 20 μm), the overall volume of the microphone 1700 can be effectively reduced. In some embodiments, the second gap d2 between the free end in the various electroacoustic conversion components 1720 (eg, cantilever beams with different lengths) and the support member(s) 1760 may vary. In some embodiments, by designing the support member(s) 1760 in various shapes and sizes and by adjusting the position of the support member(s) 1760, a plurality of electroacoustic conversion components 1720 (e.g., cantilever beams) can fit closely within the vacuum cavity 1750 such that so that the 1700 microphone can have a smaller overall size. In FIG. 18A and FIG. 18B are schematic cross-sectional views of microphones in various directions, in accordance with some embodiments of the present invention. As shown in FIG. 18A and FIG. 18B, when the support member 1760 is an elliptical cylinder, the support member 1760, the vibration transmission portion 1723, and the vibration receiving portion 1722 may form an annular or annular cavity in the vacuum cavity 1750. A plurality of electroacoustic transducer components 1720 may be spaced within the cavity, distributing along a circumferential length. support element(s) 1760.

In some embodiments, support member(s) 1760 may be located in the center of vacuum cavity 1750. For example, in FIG. 19A is a schematic cross-sectional view of a microphone in accordance with some embodiments of the present invention. As shown in FIG. 19A, the support member(s) 1760 may be located at the center of the vacuum cavity 1750. The center may be the geometric center of the vacuum cavity 1750. In some embodiments, the support member(s) 1760 may also be in the vacuum cavity 1750 near either end of the region. 1723 vibration transmission. For example, in FIG. 19B is a schematic cross-sectional view of a microphone in accordance with some embodiments of the present invention. As shown in FIG. 19B, the support member 1760 may be located in the vacuum cavity 1750 proximate the side wall L of the vibration transmission portion 1723. It should be noted that the shape, arrangement, location, material, etc. support member 1750 can be adaptively adjusted according to length, quantity, distribution mode, and the like. components 1720 electro-acoustic conversion and can not be further limited here.

In some embodiments, the implementation of the microphone 1700 may also contain at least one film structure (not shown)located on the upper surface and/or on the surface of the lower surface of the component 1720 electroacoustic conversion. In some embodiments, there may be an opening in the middle of the film structure for insertion of the support member 1760 therein. In some embodiments of the invention, the peripheral side wall of the support element(s) 1760 may or may not be connected to the peripheral opening(s) in the film structure. For a more detailed description of the shape, material, and construction of the film structure, refer to FIG. 12 and to its corresponding description.

It should be noted that the support element(s) may also be applied to the microphone in other embodiments. For example, it may be applicable to the microphone 500 shown in FIG. 5 to the microphone 1000 shown in FIG. 10 to the microphone 1200 shown in FIG. 12 to the microphone 1300 shown in FIG. 13 and to the microphone 1200 shown in FIG. 14. When the support element is applied to other microphones, the shape, position and material of the support element(s) can be adaptively adjusted according to specific circumstances.

In FIG. 20 schematically shows the construction of a microphone in accordance with some embodiments of the present invention. As shown in FIG. 20, the microphone 2000 may include a shell 2010, an electro-acoustic conversion component 2020, a vibration sensing portion 2022, and a vibration transmission portion 2023. Microphone 2000 shown in FIG. 20 may be the same or similar to the microphone 1600 shown in FIG. 16. For example, first acoustic cavity 2030, second acoustic cavity 2040, and vacuum cavity 2050 of microphone 2000 may be the same or similar to first acoustic cavity 1630, second acoustic cavity 1640, and vacuum cavity 1650 of microphone 1600, respectively. As another example, the vibration sensing portion 2022 (e.g., the first vibration sensing portion 20221, the second vibration sensing portion 20222, and the third vibration sensing portion 20223) of the microphone 2000 may be the same or similar to the vibration sensing portion 1622 (e.g., the first vibration sensing portion 16221, second section 16222 vibration perception and third section 16223 vibration perception) of the microphone 1600. Additional components of the microphone 2000 (for example, shell 2010, hole(s) 2011, section 2023 transmission of vibration, component 2020 electro-acoustic conversion, etc.) see fig. 16 and related description.

In some embodiments of the invention, the main difference between the microphone 2000 shown in FIG. 20 and the microphone 1600 shown in FIG. 16 may be that the microphone 2000 may also include a support member 2060. In some embodiments, the top surface of the support structure 2060 may be coupled to the bottom surface of the first vibration receiving portion 20221, and the bottom surface of the support structure 2060 may be coupled to the top surface of the second portion. 20222 vibration perception. In some embodiments, the free end (i.e., the end freely suspended in the vacuum cavity 2050) of the electroacoustic conversion component 2020 (e.g., the first cantilever beam 20211, the second cantilever beam 20212) and the support member 2060 may have a second gap d2 between them. For additional descriptions of support member 2060, see FIG. 17 and in its corresponding description.

In some embodiments of the invention, the microphone 2000 may also contain at least one film structure (not shown in the drawings). Refer to FIG. 13, fig. 14, fig. 17 and in related descriptions.

In FIG. 21 is a schematic representation of a microphone construction in accordance with some embodiments of the present invention. In some embodiments, the microphone may be a bone conduction microphone. As shown in FIG. 21, the bone conduction microphone 2100 may include a shell 2110, an electro-acoustic conversion component 2120, a vibration sensing portion 2122, and a vibration transmission portion 2123. The components of the bone conduction microphone 2100 shown in FIG. 21 may be the same or similar to the components of the microphone 1700 shown in FIG. 17, for example, electroacoustic conversion component 2120, first acoustic cavity 2130, second acoustic cavity 2140, vacuum cavity 2150, vibration sensing portion 2122 (e.g., first vibration sensing portion 21221, second vibration sensing portion 21222), vibration transmission portion 2123, support member 2160 etc.

In some embodiments, the main difference between the bone conduction microphone 2100 and the microphone 1700 shown in FIG. 17 may be in a vibration sensing mode of operation. The vibration sensing portion 1722 (eg, the third vibration sensing portion 17223) of the microphone 1700 can sense an air vibration signal transmitted to the first acoustic cavity 1730 through the openings 1711. However, the bone conduction microphone shell 2110 does not include an opening. The bone conduction microphone 2100 may generate a vibration signal in response to vibration of the shell 2110 through the vibration sensing portion 2122 (eg, through the third vibration sensing portion 21223). Namely, the shell 2110 may vibrate based on an external audio signal. The third section 21223 vibration perception can generate a vibration signal in response to the vibration of the shell 2110 and transmit the vibration signal component 2120 electroacoustic conversion through section 2123 transmission of vibration. The electro-acoustic conversion component 2120 can convert the vibration signal into an electrical signal and output it.

In FIG. 22 is a schematic representation of the construction of a microphone in accordance with some embodiments of the present invention. As shown in FIG. 22, the bone conduction microphone 2200 may include a sheath 2210, an electro-acoustic conversion component 2220, a vibration sensing portion 2222, and a vibration transmission portion 2223. The components of the bone conduction microphone 2200 shown in FIG. 22 may be the same or similar to the components of the microphone 2000 shown in FIG. 20, such as, for example, electroacoustic conversion component 2220, first acoustic cavity 2230, second acoustic cavity 2240, vacuum cavity 2250, vibration sensing portion 2222 (e.g., first vibration sensing portion 22221, second vibration sensing portion 22222), vibration transmission portion 2223 , support member 2260, and the like.

In some embodiments of the invention, the difference between the bone conduction microphone 2200 and the microphone 2000 shown in FIG. 20 may be different in the vibration sensing mode. The vibration sensing portion 2022 (eg, the third vibration sensing portion 20223) of the microphone 2000 can sense an air vibration signal transmitted to the first acoustic cavity 2030 through the openings 2011. However, the shell 2210 of the bone conduction microphone 2200 does not include an opening. The bone conduction microphone 2200 may generate a vibration signal in response to vibration of the shell 2210 via a vibration sensing portion 2222 (eg, a third vibration sensing portion 22223). In some embodiments, the shell 2210 may vibrate based on an external audio signal. The third section 22223 of the perception of vibration can generate a vibration signal in response to the vibration of the shell 2210 and transmit the vibration signal to the component 2220 electroacoustic conversion (for example, the first cantilever beam 22211 and the second cantilever beam 22212) through the section 2223 vibration transmission. The electro-acoustic conversion component 2220 can convert the vibration signal into an electrical signal and output it.

It should be noted that the microphone 500 shown in FIG. 5, the microphone 1000 shown in FIG. 10, the microphone 1200 shown in FIG. 12 and microphone 1300 shown in FIG. 13 can also be used as bone conduction microphones. For example, the microphone may not have a hole and the shell may vibrate depending on the external audio signal. The first vibration sensing region or the second vibration sensing region may generate a vibration signal in response to shell vibration. The vibration may be transmitted to the electroacoustic conversion component via the vibration transmission portion. The electro-acoustic conversion component can convert the vibration signal into an electrical signal and output it.

The basic concepts have been described above. Those skilled in the art will appreciate that the above invention is only an example and does not constitute a limitation of the present invention. Although not explicitly stated here, various modifications, improvements, and amendments may be made to the present invention by those skilled in the art. It is intended that these changes, improvements and modifications be permitted by the present invention and are within the spirit and scope of the embodiments of the present invention.

In addition, certain terminology has been used to describe embodiments of the present invention. For example, the term “one embodiment”, “one embodiment”, and/or “some embodiments of the invention” means a feature, design, or feature associated with the present invention in at least one embodiment of the present invention. Therefore, it is emphasized and should be understood that two or more references to “an embodiment” or “one of the embodiments” or “alternative embodiment” in various parts of this specification do not necessarily all refer to the same embodiment. In addition, certain features, structures, or functions of one or more embodiments of the present invention may be appropriately combined.

In addition, those skilled in the art should understand that the various approaches of the present invention may be illustrated and described herein in several patentable categories or situations, including any new and useful process, machine, product, or combination of materials, or any new and useful improvement thereof. . Accordingly, all approaches of the present invention may be performed entirely in hardware, may be performed entirely in software (including firmware, resident software, microcode, etc.), or may be performed by a combination of hardware and software. The above hardware or software may be referred to as a “data block”, “module”, “machine”, “unit”, “component”, or “system”. In addition, approaches of the present invention may appear as a computer product on one or more computer-readable media, the product containing a computer-readable control program.

The computer medium may comprise a data signal containing a control computer program and be, for example, a baseband signal or a portion of a carrier. The transmitted signal may take many forms of expression, including electromagnetic form, optical form, or any suitable combination thereof. Computer media can be any computer-readable media other than computer-readable storage media that can be connected to a system, device, or equipment to execute instructions and communicate, distribute, or transfer programs for use. The control program residing on a computer medium may be transmitted over any suitable medium, including radio, cable, fiber optic cable, radio frequency, or similar media, or any combination thereof.

The control computer program required to operate each part of the present invention may be written in any one or more programming languages, including object-oriented programming languages such as Java, Scala, Smalltalk, Eiffel, JADE, Emerald, C++, C#, VB. NET, Python, etc., standard procedural programming languages such as the “C” programming language, Visual Basic, Fortran 2003, Perl, COBOL 2002, PHP, ABAP, dynamic programming languages such as Python, Ruby and Groovy or others programming languages. The control program may run entirely on the user's computer, partially on the user's computer, or as a separate software package on the user's computer, or partially on the user's computer, partially on a remote computer, or entirely on a remote computer or server. In the latter case, the remote computer may connect to the user's computer through any network, such as a local area network (LAN) or a wide area network (WAN), or connect to an external computer (for example, over the Internet), or in a cloud computing environment, or be used as a service. such as software as a service (SaaS).

In addition, the order in which elements or sequences are processed or the use of numeric characters, letters, or other names is not intended to limit the performance of the claimed processes and methods in any order other than that specified in the claims. While the above invention has been discussed in various examples, which are now considered to be many useful embodiments of the invention, it should be understood that such details are for this purpose only and that the appended claims are not limited to the disclosed embodiments, but rather are intended to cover modifications and equivalent constructions that are within the spirit and scope of the disclosed embodiments. For example, while the implementation of the various components described above may be implemented in a hardware device, it may also be implemented only as a software solution, such as installation on an existing server or on a mobile device.

Likewise, it should be understood that in the foregoing description of embodiments of the present invention, various features are sometimes grouped together in a single embodiment, drawing, or description thereof for the purpose of streamlining the invention and assisting in understanding one or more of the various embodiments. However, the present invention does not mean that the subject matter of the present invention requires more features than those mentioned in the claims. In fact, the claimed technical solution may not have all the features of a particular embodiment disclosed above.

In some embodiments, numbers expressing amounts of constituents, properties, etc. used to describe and claim certain embodiments of the invention are to be understood as being replaced in some instances by the terms “about”, “approximately”, or “substantially”, etc. .d. Unless otherwise indicated, “about”, “approximately”, or “substantially” may indicate a change within ±20% of the value being described. Accordingly, in some embodiments, the numerical parameters given in the description and the appended claims are approximations that may vary depending on the properties that are desired to be obtained through a particular embodiment. In some embodiments, the numeric data must take into account the reported number of significant digits and use the algorithm used for normal rounding. Although the ranges of numbers and parameters used to illustrate the broad scope of use of some embodiments of the present invention are approximations, the numerical values in specific examples can be as accurate as possible within practical application.

For each patent, patent application, patent application specification and other materials cited in this specification, such as articles, books, descriptions, publications, documents, etc., all of their contents are hereby incorporated into this disclosure by reference. Archival documents for applications that are inconsistent or conflict with the content of this disclosure as documents (now or later attached to this application) that may limit the broadest scope of the claims of the present disclosure are excluded from the present disclosure. It should be noted that in the event of incompatibility or conflict between the description, definitions and/or use of terms used in the materials appended to this disclosure and the content described in this disclosure, the description, definitions and/or terms used in this disclosure , should prevail.

Finally, it should be understood that the embodiments described in the disclosure are only used to illustrate the principles of the embodiments of the present invention. Other modifications that may be applied may be within the scope of the present invention. Thus, by way of example, and not limitation, alternative configurations of embodiments of the present invention may be used in accordance with the principles set forth herein. Accordingly, embodiments of the present invention are not limited exactly to what is shown and described.

Claims (28)

1. Microphone, containing: shell; a vibration receiving portion configured to vibrate in response to vibration of the shell; a vibration transmission portion configured to transmit vibration from said vibration receiving portion; And an electro-acoustic conversion component configured to receive the vibration transmitted by the vibration transmission portion to generate an electrical signal, wherein the vibration transmission portion and at least part of the vibration receiving portion form a vacuum cavity; And the electroacoustic conversion component is located in the vacuum cavity. 2. Microphone according to claim. 1, in which the pressure in the vacuum cavity is less than 100 Pa. 3. The microphone according to claim. 1, in which the area of perception of vibration and the shell form at least one acoustic cavity, and said at least one acoustic cavity includes a first acoustic cavity; And the shell contains at least one hole, and the specified at least one hole is located on the side wall of the shell corresponding to the first acoustic cavity, and the specified at least one hole connects the first acoustic cavity with the external environment, wherein the site of the perception of vibration is configured to vibrate in response to an external sound signal transmitted through the specified at least one hole; And the electroacoustic conversion component is configured to receive the vibration of said vibration sensing portion to generate an electrical signal. 4. The microphone according to claim 1, in which the vibration sensing section comprises a first vibration sensing section and a second vibration sensing section arranged in a top-down direction, the vibration transmission section having the form of a tube and located between the first vibration sensing section and the second vibration sensing section; And the vibration transmission section, the first vibration receiving section and the second vibration receiving section form a vacuum cavity, wherein the first vibration receiving section and the second vibration receiving section are connected to the shell through their peripheral sides, wherein at least a portion of the first vibration sensing portion and the second vibration sensing portion are configured to vibrate in response to an external sound signal. 5. Microphone according to claim 4, in which the first vibration sensing portion or the second vibration sensing portion comprises an elastic portion and a fixed portion; the fixed portion of the first vibration receiving portion, the fixed portion of the second vibration receiving portion, and the vibration transmission portion form a vacuum cavity; And the elastic section is attached between the fixed section and the inner wall of the shell, wherein the elastic section is configured to vibrate in response to an external sound signal. 6. The microphone according to claim 5, in which the rigidity of the fixed section is greater than the rigidity of the elastic section. 7. The microphone of claim. 6, which further comprises a hardener located on the upper surface or on the lower surface corresponding to the vacuum cavity, the first area of the perception of vibration and the second area of the vibration perception. 8. The microphone according to claim 1, wherein the vibration sensing portion comprises a first vibration sensing portion, a second vibration sensing portion, and a third vibration sensing portion, wherein the first vibration sensing portion and the second vibration sensing portion are arranged opposite each other from top to bottom, the transmission portion a tube-shaped vibration is disposed between the first vibration sensing portion and the second vibration sensing portion, and the vibration transmission portion, the first vibration sensing portion, and the second vibration sensing portion form a vacuum cavity; And the third vibration receiving section is connected between the vibration transmission section and the inner wall of the shell, wherein the third vibration sensing portion is configured to vibrate in response to an external sound signal. 9. The microphone of claim 8, wherein the stiffness of the first vibration sensing portion and the stiffness of the second vibration sensing portion are greater than the stiffness of the third vibration sensing portion. 10. The microphone according to claim 1, in which the electroacoustic conversion component comprises a cantilever beam, wherein one end of the cantilever beam is attached to the inner wall of the vibration transmission section, and the other end of the cantilever beam is freely suspended in the vacuum cavity, while the cantilever beam is deformable depending on the vibration signal to convert the vibration signal into an electrical signal.

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