WO2023232033A1 - Bone voiceprint sensor and electronic device - Google Patents

Abstract

A bone voiceprint sensor and an electronic device. The bone voiceprint sensor comprises a microphone assembly, the microphone assembly being provided with a back cavity; a base plate, the microphone assembly being provided on the base plate, a mounting cavity being provided in the base plate, and the mounting cavity being communicated with the back cavity of the microphone; a vibration assembly, which is provided in the mounting cavity of the base plate; and a housing, the housing being provided on the base plate, the housing and the base plate defining an accommodating cavity, and the microphone assembly being located in the accommodating cavity. When the vibration assembly picks up external vibration information to generate vibration, the microphone assembly forms an electrical signal.

Description

A bone voiceprint sensor and electronic device

This application claims priority to the Chinese patent application with application number 202210600657.6 and the application name "A bone voiceprint sensor and electronic device" submitted to the China Patent Office on May 30, 2022, the entire content of which is incorporated herein by reference. Public.

Technical field

The present disclosure belongs to the field of sensor technology, and specifically relates to a bone voiceprint sensor and electronic equipment.

Background technique

The bone voiceprint sensor is a sensor that uses the vibration of the diaphragm to stimulate air flow and detect the flow signal. Bone voiceprint sensors usually include vibration components and acoustic-electric conversion components. The vibration component can sense external vibration information and stimulate air flow. The acoustic-electric conversion component can convert the airflow changes generated when the vibrating component vibrates into electrical signals to express the vibration information.

In existing bone voiceprint sensors, the vibration component is usually glued to the circuit board, and then a metal platform is bonded to the vibration component for pasting the acoustic-to-electrical conversion component. This kind of product structure has high requirements on the process and glue selection. If the product falls, the vibration component or the acoustic-electric conversion component will easily fall off and cause failure.

Application content

The present disclosure aims to provide a bone voiceprint sensor and electronic equipment to solve the problem that existing bone voiceprint sensors are prone to failure when dropped.

In a first aspect, the present disclosure provides a bone voiceprint sensor, including:

A microphone assembly, the microphone assembly has a back cavity;

A base plate, the microphone assembly is arranged on the base plate, the base plate has an installation cavity inside, and the installation cavity is connected with the back cavity of the microphone;

A vibration component, the vibration component is arranged in the mounting cavity of the substrate;

A housing, the housing is arranged on the base plate, the housing and the base plate surround to form an accommodation cavity, and the microphone assembly is located in the accommodation cavity;

When the vibration component picks up external vibration information and generates vibration, the microphone component forms an electrical signal.

Optionally, the substrate includes:

A mainboard, a microphone is provided on one side of the mainboard, a mounting slot is provided on the side facing away from the microphone, and the vibration component is arranged in the mounting slot;

A sound-insulating component is provided on the side of the base plate away from the microphone, and the sound-insulating component and the mounting groove on the base plate surround the mounting cavity.

Optionally, the main board includes a first board and a second board, and the vibration component includes:

A diaphragm, the diaphragm is sandwiched between the first plate and the second plate, and the diaphragm located in the installation groove is suspended in the air;

A mass block is arranged in the middle of the diaphragm located in the installation groove.

Optionally, along the circumferential direction of the installation groove, there is an installation step in the installation groove, and the edge of the vibration component is arranged on the installation step.

Optionally, the vibration component includes:

A support part, which is a closed annular structure;

A diaphragm, the edge of which is disposed on the outer surface of the opening side of the support part;

A mass block, the mass block is arranged in the middle of the diaphragm;

Wherein, the diaphragm is connected to the installation step.

Optionally, the vibration component includes:

A support part, which is a closed annular structure;

A diaphragm, the edge of which is disposed on the outer surface of the opening side of the support part;

A mass block, the mass block is arranged in the middle of the diaphragm;

Wherein, the support part is connected with the installation step.

Optionally, the installation step is arranged with one side of the vibration component facing away from the microphone component.

Optionally, the support part and the mass block are located on the same side of the diaphragm.

Optionally, the sound insulation component has a convex portion on a side close to the main panel, and the convex portion is connected to the The vibration components are offset.

In a second aspect, the present disclosure provides an electronic device, including the above-mentioned bone voiceprint sensor.

One technical effect of the present disclosure is to set the vibration component in the base plate, and set the microphone component on the base plate, so that the vibration component and the microphone assembly are respectively set on the base plate, avoiding overlapping arrangement between the two, and solving the problem of bone. If the voiceprint sensor falls, the vibration component or microphone component may fall off and cause failure.

Other features and advantages of the present disclosure will become apparent from the following detailed description of exemplary embodiments of the present disclosure with reference to the accompanying drawings.

Description of the drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the disclosure and together with the description, serve to explain the principles of the disclosure.

Figure 1 is a cross-sectional view of a first embodiment of a bone voiceprint sensor provided by the present disclosure;

Figure 2 is a cross-sectional view of a second embodiment of a bone voiceprint sensor provided by the present disclosure;

Figure 3 is a cross-sectional view of a third embodiment of a bone voiceprint sensor provided by the present disclosure.

Reference signs:
1. Microphone assembly; 2. Back cavity; 3. Substrate; 301. Main board; 302. Sound insulation components; 4.
Installation cavity; 5. Vibration component; 501. Diaphragm; 502. Mass block; 503. Support part; 6. Shell; 7. First plate; 8. Second plate; 9. Installation step; 10. Projection.

Detailed ways

Various exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement of components and steps, numerical expressions, and numerical values set forth in these examples do not limit the scope of the disclosure unless otherwise specifically stated.

The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the disclosure, its application or uses.

Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered a part of the specification.

In all examples shown and discussed herein, any specific values are to be construed as illustrative only and not as limiting. Accordingly, other examples of the exemplary embodiments may have different values.

It should be noted that similar reference numerals and letters refer to similar items in the following figures, so that once an item is defined in one figure, it does not need further discussion in subsequent figures.

In a first aspect, an embodiment of the present disclosure provides a bone voiceprint sensor, as shown in FIGS. 1 to 3 , including a microphone assembly 1 having a back cavity 2 . The microphone assembly 1 is disposed on the base plate 3. There is an installation cavity 4 inside the base plate 3, and the installation cavity 4 is connected with the back cavity 2 of the microphone. Vibration component 5 is provided in the mounting cavity 4 of the base plate 3 . The housing 6 is provided on the base plate 3 . The outer shell 6 and the base plate 3 form an accommodating cavity, and the microphone assembly 1 is located in the accommodating cavity. When the vibration component 5 picks up external vibration information and generates vibration, the microphone component 1 forms an electrical signal.

The vibration component 5 is used to pick up external vibration information and instigate air flow according to the external vibration information. For example, the bone voiceprint sensor is attached to the user's body close to the vocal cords. When the user speaks, the vibration generated by the vocal cords will be transmitted to the bone voiceprint sensor, and then the vibration component 5 provided on the bone voiceprint sensor will vibrate and vibrate the component. 5 will instigate air flow around the vibrating component 5 while vibrating.

The microphone assembly 1 is used to convert the flow changes of the air formed by the vibration assembly 5 into electrical signals to achieve acoustic-electrical conversion of the bone voiceprint sensor.

In a specific implementation, the microphone assembly 1 includes a MEMS chip and an ASIC chip, and the MEMS chip and the ASIC chip are electrically connected. The MEMS chip has a vibrating diaphragm, which vibrates when impacted by airflow to form a capacitance signal. The ASIC chip receives the capacitance signal and processes it.

The microphone assembly 1 has a back cavity 2, which is beneficial to improving the acoustic-to-electrical conversion quality of the microphone assembly 1 and improving the performance of the bone voiceprint sensor.

In a specific implementation, the microphone assembly 1 includes a MEMS chip, and the MEMS chip includes a base and a diaphragm disposed on the base. A back cavity 2 is provided on the base so that the vibrating membrane is suspended Empty setting. The diaphragm is suspended in the air to facilitate the vibration of the diaphragm, and the larger the volume of the back cavity 2 opened on the base, the better the performance of the microphone assembly 1.

The base plate 3 serves to carry the microphone assembly 1 . The microphone assembly 1 is disposed on the base plate 3. The base plate 3 has an installation cavity 4 inside, and the installation cavity 4 is connected with the back cavity 2 of the microphone. The back cavity 2 of the microphone assembly 1 can be enlarged, further improving the performance of the microphone assembly 1 . The substrate 3 may be a PCB board, and a mounting cavity 4 is formed in the PCB board.

In a specific implementation, as shown in Figures 1 to 3, the bone voiceprint sensor includes a base plate 3, and a mounting cavity 4 is formed in the base plate 3. The microphone assembly 1 includes a MEMS chip. The MEMS chip is fixedly arranged on a substrate 3 . The MEMS chip has a back cavity 2 facing toward the substrate 3 . A communication hole is provided on the inner wall of the mounting cavity 4 of the substrate 3, and the mounting cavity 4 communicates with the back cavity 2 of the MEMS chip through the communication hole.

As shown in FIGS. 1 to 3 , the vibration component 5 is disposed in the mounting cavity 4 of the base plate 3 . That is to say, the vibration component 5 is integrated into the base plate 3 to avoid a structure in which the microphone component 1 and the vibration component 5 are bonded together.

The housing 6 plays a role in sealing the bone voiceprint sensor, so that the microphone assembly 1 located in the bone voiceprint sensor can only contact the airflow formed by the air instigated by the vibration assembly 5, thereby preventing the external environment from interfering with the operation of the microphone assembly 1 , improve the performance of bone voiceprint sensor. As shown in FIGS. 1 to 3 , the housing 6 is disposed on the base plate 3 , and the outer shell 6 and the base plate 3 form an accommodating cavity, and the microphone assembly 1 is located in the accommodating cavity. That is to say, the base plate 3 and the outer shell 6 are sealed and connected, so that they are surrounded together to form a cavity, and the microphone assembly 1 and the vibration assembly 5 are located in a sealed position between the base plate 3 and the outer shell 6. within the cavity formed by the connection.

Among them, the shell 6 plays a role in sealing the bone voiceprint sensor, which means that the cavity formed by the shell 6 and the substrate 3 is in a relatively sealed state with the outside world. That is to say, when the shell 6 There is a vent hole with a smaller diameter connected to the outside world on the top or other inner wall of the cavity, which is used to deflate the bone voiceprint sensor to ensure that the bone voiceprint sensor can work normally.

In the embodiment of the present disclosure, the vibration component 5 is disposed in the base plate 3, and the microphone component 1 is disposed on the base plate 3, so that the vibration component 5 and the microphone component 1 are respectively disposed on the base plate 3, thus avoiding The stacked arrangement of the two solves the problem that if the bone voiceprint sensor falls, the vibration component 5 or the microphone component 1 will easily fall off and cause failure.

At the same time, the vibration component 5 is integrated on the base plate 3 and the microphone component 1 is arranged on the base plate 3, which reduces the distance between the microphone component 1 and the vibration component 5, thereby reducing the space between them. The size can avoid the loss of air flow instigated by the vibration component 5, and improve the efficiency of the acoustic-to-electrical conversion of the bone voiceprint sensor. In addition, integrating the vibration component 5 on the base plate 3 effectively reduces the overall height of the bone voiceprint sensor, which is conducive to the miniaturization development of the bone voiceprint sensor. At the same time, the bone voiceprint sensor of the embodiment of the present disclosure avoids the structure of bonding the microphone component 1 and the vibration component 5 together, and only needs to dispose the vibration component 5 and the microphone component 1 respectively on the substrate 3, which reduces the manufacturing process. Assembly difficulty.

Optionally, the base plate 3 includes a main board 301 and a sound insulation component 302 . A microphone is provided on one side of the main board 301, and a mounting groove is provided on the side of the main board 301 facing away from the microphone. The vibration component 5 is disposed in the mounting groove. The sound insulation component 302 is disposed on the side of the base plate 3 away from the microphone. The sound insulation component 302 and the mounting groove on the base plate 3 surround the mounting cavity 4 .

The main board 301 is the main part of the installation slot. A microphone is fixedly mounted on the main board 301 and an installation slot is provided. The sound insulation component 302 is disposed on the main board 301 and is mainly used to block the opening of the installation groove on the side of the main board 301 where the installation groove is provided. This structural arrangement facilitates the installation of the vibration component 5 in the installation cavity 4 and enables the bone voiceprint sensor to have better sealing performance.

The main board 301 may be a PCB board. The sound insulation component 302 may be the plate-shaped structure. For example, the sound insulation component 302 may be a PCB board, or the sound insulation component 302 may also be a sound insulation component such as a sound insulation film.

In a specific implementation, as shown in FIGS. 1 to 3 , the substrate 3 includes the main board 301 and the sound insulation component 302 . The main board 301 and the sound insulation component 302 are both PCB boards, and the thickness of the main board 301 is much greater than the thickness of the sound insulation component 302 . A mounting slot is provided on the side of the main board 301 away from the microphone assembly 1 . The sound insulation component 302 is disposed on the side of the main board 301 away from the microphone assembly 1 so that the sound insulation component 302 can block the opening of the installation groove.

Optionally, the main plate 301 includes a first plate 7 and a second plate 8 , and the vibration component 5 includes a diaphragm 501 and a mass 502 . The diaphragm 501 is sandwiched between the first plate 7 and the second plate 8 , and the diaphragm 501 located in the installation groove is suspended in the air. The mass 502 is disposed in the middle of the diaphragm 501 located in the installation groove.

That is to say, the first plate 7 and the second plate 8 are fit together to form an installation groove. The diaphragm 501 is sandwiched between the first plate 7 and the second plate 8 so that part of the diaphragm 501 is suspended in the installation groove. The mass 502 is disposed in the middle of the suspended diaphragm 501 .

Wherein, the first board 7 and the second board 8 may be PCB boards. The diaphragm 501 may be a PI film or other film materials. During production, corresponding groove structures can be made on the first plate 7 and the second plate 8 first, and then the first plate 7 and the second plate 8 are bonded and pressed together after the diaphragm 501 is tightened. As one body. The mass block 502 can be made of non-magnetic or weakly magnetic materials such as silver-nickel copper, copper, stainless steel, etc. After the mass block 502 is placed on the diaphragm 501, vent holes can be drilled in the mass block 502 and the diaphragm 501 to avoid damage during the later reflow process, and at the same time improve the performance of the bone voiceprint sensor. performance.

In a specific implementation, as shown in FIG. 1 , a first hole is provided on one side of the first plate 7 facing the second plate 8 , and a first hole is provided on the side of the second plate 8 facing the first plate 7 . A second hole is provided on the side. After the first plate 7 and the second plate 8 are assembled, the first hole and the second hole enclose the corresponding installation slot. The diaphragm 501 is arranged between the two, and the diaphragm 501 between the first hole and the second hole is the diaphragm 501 suspended in the installation groove.

Optionally, along the circumferential direction of the installation groove, there is an installation step 9 in the installation groove, and the edge of the vibration component 5 is provided on the installation step 9 . The vibration component 5 can be reliably fixed in the installation groove to prevent the vibration component 5 from falling off, thus ensuring the performance of the bone voiceprint sensor.

In a specific embodiment, the outer surface of one side of the mounting step 9 that fixes the vibration component 5 is a closed annular outer surface, such as a circular ring, a square ring, etc. The edge of the vibration component 5 is continuously connected to the closed ring-enclosed outer surface of the installation step 9, dividing one installation slot into two slots.

Optionally, the vibration component 5 includes a support part 503 , a diaphragm 501 and a mass 502 . The support part 503 is a closed annular structure. The edge of the diaphragm 501 is disposed on the outer surface of the opening side of the support portion 503 . The mass 502 is disposed in the middle of the diaphragm 501 . Wherein, the diaphragm 501 is connected to the installation step 9 .

That is to say, as shown in FIG. 3 , a support portion 503 and a mass 502 are provided on the diaphragm 501 . The support portion 503 can support the diaphragm 501 so that the diaphragm 501 is tightened under the action of the support portion 503 . The mass 502 plays a role in detecting external vibration information. When the bone voiceprint sensor vibrates, the mass 502 can drive the diaphragm 501 to vibrate under the action of its own inertia, causing the diaphragm 501 to instigate the surrounding air to flow.

The support part 503 is provided at the edge of the diaphragm 501 , and the suspended diaphragm 501 located in the middle of the support part 503 can vibrate driven by the mass block 502 . The other edge of the diaphragm 501 corresponding to the support portion 503 is fixedly connected to the mounting step 9 . The distance between the vibration component 5 and the microphone component 1 can be further reduced and the performance of the bone voiceprint sensor can be improved.

Optionally, the vibration component 5 includes a support part 503 , a diaphragm 501 and a mass 502 . The support part 503 is a closed annular structure. The edge of the diaphragm 501 is disposed on the outer surface of the opening side of the support portion 503 . The mass 502 is disposed in the middle of the diaphragm 501 . Wherein, the support part 503 is connected to the installation step 9 .

That is to say, as shown in FIG. 3 , a support portion 503 and a mass 502 are provided on the diaphragm 501 . The support portion 503 can support the diaphragm 501 so that the diaphragm 501 is tightened under the action of the support portion 503 . The mass 502 plays a role in detecting external vibration information. When the bone voiceprint sensor vibrates, the mass 502 can drive the diaphragm 501 to vibrate under the action of its own inertia, causing the diaphragm 501 to instigate the surrounding air to flow. The support part 503 is provided at the edge of the diaphragm 501 , and the suspended diaphragm 501 located in the middle of the support part 503 can vibrate driven by the mass block 502 .

The support part 503 is connected to the installation step 9 . That is to say, the side of the support portion 503 away from the diaphragm 501 is connected to the support step, which reduces the contact between the diaphragm 501 and other components and avoids the diaphragm 501 from being affected by other components. The vibration performance is reduced due to the influence of components, ensuring the reliability of the diaphragm 501 .

Optionally, the installation step 9 is arranged so that one side of the vibration component 5 faces away from the microphone component. 1. That is to say, the installation step 9 faces the opening side of the installation groove on the main board 301 to facilitate the installation of the vibration component 5 . Specifically, the vibration component 5 is put into the installation groove from the opening of the installation groove, and then the vibration component 5 is pasted on the installation step 9 .

Optionally, the support part 503 and the mass block 502 are located on the same side of the diaphragm 501 . It is convenient to manufacture the vibration component 5. For example, when the vibration component 5 is manufactured by etching, only one side of the vibration component 5 can be patterned and etched, instead of having to be provided on both sides of the vibration component 5. The patterns are then etched separately.

Optionally, as shown in FIG. 2 or FIG. 3 , the sound insulation component 302 has a protrusion 10 on a side close to the main board 301 , and the protrusion 10 offsets the vibration component 5 . This further ensures the position reliability of the vibration component 5 in the installation cavity 4 and prevents the vibration component 5 from falling off and affecting the performance of the bone voiceprint sensor.

In a second aspect, the present disclosure provides an electronic device, including the above-mentioned bone voiceprint sensor.

Although some specific embodiments of the present disclosure have been described in detail through examples, those skilled in the art will understand that the above examples are for illustration only and are not intended to limit the scope of the disclosure. It should be understood by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present disclosure. The scope of the disclosure is defined by the appended claims.

Claims (10)

1. A bone voiceprint sensor, which is characterized by including:

   A microphone assembly, the microphone assembly has a back cavity;

   A base plate, the microphone assembly is arranged on the base plate, the base plate has an installation cavity inside, and the installation cavity is connected with the back cavity of the microphone;

   A vibration component, the vibration component is arranged in the mounting cavity of the substrate;

   A housing, the housing is arranged on the base plate, the housing and the base plate surround to form an accommodation cavity, and the microphone assembly is located in the accommodation cavity;

   When the vibration component picks up external vibration information and generates vibration, the microphone component forms an electrical signal.
2. The bone voiceprint sensor according to claim 1, wherein the substrate includes:

   A mainboard, a microphone is provided on one side of the mainboard, a mounting slot is provided on the side facing away from the microphone, and the vibration component is arranged in the mounting slot;

   A sound-insulating component is provided on the side of the base plate away from the microphone, and the sound-insulating component and the mounting groove on the base plate surround the mounting cavity.
3. The bone voiceprint sensor according to claim 2, wherein the main board includes a first board and a second board, and the vibration component includes:

   A diaphragm, the diaphragm is sandwiched between the first plate and the second plate, and the diaphragm located in the installation groove is suspended in the air;

   A mass block is arranged in the middle of the diaphragm located in the installation groove.
4. The bone voiceprint sensor according to claim 2, characterized in that, along the circumferential direction of the installation groove, there is an installation step in the installation groove, and the edge of the vibration component is arranged on the installation step.
5. The bone voiceprint sensor according to claim 4, wherein the vibration component include:

   A support part, which is a closed annular structure;

   A diaphragm, the edge of which is disposed on the outer surface of the opening side of the support part;

   A mass block, the mass block is arranged in the middle of the diaphragm;

   Wherein, the diaphragm is connected to the installation step.
6. The bone voiceprint sensor according to claim 4, wherein the vibration component includes:

   A support part, which is a closed annular structure;

   A diaphragm, the edge of which is disposed on the outer surface of the opening side of the support part;

   A mass block, the mass block is arranged in the middle of the diaphragm;

   Wherein, the support part is connected with the installation step.
7. The bone voiceprint sensor according to claim 4, wherein the side of the vibration assembly on the installation step is away from the microphone assembly.
8. The bone voiceprint sensor according to claim 5 or 6, characterized in that the support part and the mass block are located on the same side of the diaphragm.
9. The bone voiceprint sensor according to claim 2, wherein the sound insulation component has a convex portion on a side close to the main board, and the convex portion offsets the vibration component.
10. An electronic device, characterized by comprising the bone voiceprint sensor according to any one of claims 1-9.